Datasheet Low Consumption Power Class D Amplifier 9W+9W Analog Input Class D Speaker Amplifier BD28411MUV General Description Key Specifications BD28411MUV is 9W+9W stereo class D amplifier which does not require an external heat sink. This IC is incorporated with a precise oscillator to generate multiple switching frequencies that can avoid the AM radio interference. In addition, 2.1Ch audio system can be realized by master and slave operation without beat noise caused by interference between two ICs. Furthermore, this IC realizes lower power consumption during small power output, so this product is most suitable for battery equipped speaker systems such as wireless speakers. Features Analog Differential Input Low Standby Current Output Feedback Circuitry prevents sound quality degradation caused by power supply voltage fluctuation, achieves low noise and low distortion, eliminates the need of large electrolytic-capacitors for decoupling. Power limit function (Linearly-programmable) Selectable switching frequency (AM avoidance function) Synchronization control is supported (Selectable Master and Slave operation) Parallel BTL (PBTL) is supported Wide voltage range (VCC=4.5V to 13V) High efficiency and low-heat-generation make the system smaller, thinner, and more power-saving Pop noise prevention during power supply ON/OFF High reliability design by built-in protection circuits - Overheat protection - Under voltage protection - Output short protection - Output DC voltage protection Small package (VQFN032V5050) achieves mount area reduction Supply Voltage Range: 4.5V to 13V Speaker Output Power: 9W+9W (Typ) (VCC=12V, RL=8, PLIMIT=0V) Total Harmonic Distortion Ratio: 0.03% (Typ) @Po=1W (VCC=11V, RL=8, PLIMIT=0V) Crosstalk: 100dB (Typ) PSRR: 55dB (Typ) Output Noise Voltage: -80dBV (Typ) Standby Current: 0.1A (Typ) Operating Current: 16mA (Typ) (No load or filter, No signal) Operating Temperature Range: -25C to +85C W(Typ) x D(Typ) x H(Max) Package VQFN032V5050 5.00mm x 5.00mm x 1.00mm Typical Application Circuit SP ch1 (Lch) SP ch2 (Rch) Audio Source TEST OUT2N GAIN_ BSP2N MS_SEL MUTE PDX OUT2P SYNC FSEL<2:0> BSP2P BSP1N IN2N IN2P IN1N IN1P OUT1P ERROR BSP1P MUTE PLIMIT Wireless speaker, Small active speaker, Portable audio equipment, etc. PDX OUT1N Applications Other device Figure 1. Typical Application Circuit Product structure : Silicon monolithic integrated circuit www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 This product has no designed protection against radioactive rays 1/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Pin Configuration ERROR PDX TEST NC NC VCCA VCCP1 BSP1P (TOP VIEW) 32 31 30 29 28 27 26 25 GNDP1 PLIMIT 3 22 OUT1N GNDA 4 21 BSP1N REGG 5 20 BSP2P GAIN_MS_SEL 6 19 OUT2P IN2P 7 18 GNDP2 IN2N 8 17 OUT2N 10 11 12 13 14 15 16 BSP2N 9 VCCP2 23 NC 2 MUTEX IN1N FSEL2 OUT1P FSEL1 24 FSEL0 1 SYNC IN1P Figure 2. Pin Configuration www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Pin Description Pin No. Pin Name IO 1 IN1P I Positive input pin for Ch1 2 IN1N I Negative input pin for Ch1 3 PLIMIT I Power limit level setting pin 4 GNDA - GND pin for Analog signal Function Internal Equivalent Circuit Internal power supply pin for Gate driver Please connect a capacitor. 5 REGG O *The REGG terminal of BD28411MUV should not be used as external supply. Therefore, do not connect anything except the capacitor for stabilization and the resistors for setting of GAIN_MS_SEL and PLIMIT. 6 GAIN_MS_SEL I Gain and Master/Slave mode Setting pin 7 IN2P I Positive input pin for Ch2 8 IN2N I Negative input pin for Ch2 9 SYNC I/O www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Clock input/output pin to synchronize multiple class D amplifiers 3/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Pin Description - continued 10 10 FSEL0 I 100k PWM frequency setting pin 4 11 FSEL1 I PWM frequency setting pin 12 FSEL2 I PWM frequency setting pin 13 MUTEX I Speaker output mute control pin H: Mute OFF L: Mute ON 14 NC - Non connection 15 VCCP2 - 16 BSP2N O 17 OUT2N O 18 GNDP2 - 19 OUT2P O 20 BSP2P O 21 BSP1N O 22 OUT1N O 23 GNDP1 - 24 OUT1P O 25 BSP1P O 26 VCCP1 - 27 VCCA - 28 NC - Output pin of Ch1 positive PWM signal Please connect to output LPF. Boot-strap pin of Ch1 positive PWM signal Please connect a capacitor. Power supply pin for Ch1 PWM signal Please connect a capacitor. Power supply pin for Analog signal Please connect a capacitor. Non connection 29 NC - Non connection 30 TEST I Test pin Please connect to GND. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Power supply pin for Ch2 PWM signal Please connect a capacitor. Boot-strap pin of Ch2 negative PWM signal Please connect a capacitor. Output pin of Ch2 negative PWM signal Please connect to output LPF. GND pin for Ch2 PWM signal Output pin of Ch2 positive PWM signal Please connect to output LPF. Boot-strap pin of Ch2 positive PWM signal Please connect a capacitor. Boot-strap pin of Ch1 negative PWM signal Please connect a capacitor. Output pin of Ch1 negative PWM signal Please connect to output LPF. GND pin for Ch1 PWM signal 4/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Pin Description - continued Power down setting pin 31 PDX I H: Active L: Standby Error flag pin Please connect to pull-up resistor. 32 ERROR O H: Normal L: Error detected *An error flag is outputted when Output Short Protection, DC Voltage Protection, and High Temperature Protection are operated. This flag shows IC condition during operation. The numerical value of internal equivalent circuit is typical value, not guaranteed value. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 5/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV NC NC 29 28 BSP1P 30 VCCP1 31 VCCA 32 TEST PDX ERROR Block Diagram 27 26 25 PROTECT 24 OUT1P 23 GNDP1 22 OUT1N REGG CONTROL I/F 1 21 BSP1N REGG IN1P 20 BSP2P 19 OUT2P 18 GNDP2 17 OUT2N REGG IN1N 2 DRIVER FET PWM PLIMIT 3 GNDA 4 DRIVER FET PLIMIT GAIN REGG GAIN_MS_SEL 5 DRIVER FET LDO DRIVER FET 6 PWM IN2P 7 IN2N 8 REGG OSC 14 15 16 BSP2N FSEL1 13 VCCP2 FSEL0 12 NC 11 MUTEX 10 FSEL2 9 SYNC CONTROL I/F Figure 3. Block Diagram www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 6/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Absolute Maximum Ratings (Ta = 25C) Parameter Supply Voltage Symbol Rating Unit VCCMAX -0.3 to +15.5 V (Note 1) (Note 3) W (Note 4) W 3.26 Applied pins and Conditions VCCA,VCCP1,VCCP2 Power Dissipation(Note 2) Pd Input Voltage1(Note 1) VIN -0.3 to +VREGG V IN1P, IN1N, IN2P, IN2N, PLIMIT, GAIN_MS_SEL, PLIMIT, SYNC(Note 5), FSEL0, FSEL1, FSEL2, PDX, MUTEX Input Voltage2(Note 1) VERR -0.3 to +7 V ERROR Pin Voltage1 VPIN1 -0.3 to +VCCMAX V OUT1P, OUT1N, OUT2P, OUT2N Operating Temperature Topr -25 to +85 C Storage Temperature Tstg -55 to +150 C Junction Temperature Tjmax +150 C (Note 1) (Note 6) (Note 1) (Note 2) (Note 3) (Note 4) (Note 5) (Note 6) 4.56 Please refer to Power Dissipation for details. The voltage that can be applied reference to GND (Pin4, 18, 23). Do not exceed Pd and Tjmax=150C. Derate by 26.1mW/ for operating above Ta=25C when mounted on 74.2mm x 74.2mm x 1.6mm, FR4, 4-layer glass epoxy board (Top and bottom layer back copper foil size: 20.2mm2, 2nd and 3rd layer back copper foil size: 5505mm2). There are thermal vias on the board. Derate by 36.5mW/ for operating above Ta=25C when mounted on 74.2mm x 74.2mm x 1.6mm, FR4, 4-layer glass epoxy board (Copper area: 5505mm2). There are thermal vias on the board. SYNC pin is I/O pin. It is specified for input mode. Please use under this rating including the AC peak waveform (overshoot) for all conditions. Only undershoot is allowed at condition of 15.5V by the VCC reference and 10nsec (cf. Figure 4) VCC Overshoot from GND 15.5V (Max) Undershoot from VCC 15.5V (Max) GND 10nsec Figure 4. Overshoot and Undershoot Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta= -25C to +85C) Parameter Symbol Min Typ Max Unit VIN 4.5 - 13 V VCCA, VCCP1, VCCP2 RL1 5.4 - - BTL RL2 3.2 - - High Level Input Voltage VIH 2.0 - - V Low Level Input Voltage VIL 0 - 0.8 V Low Level Output Voltage VOL - - 0.8 V PBTL FSEL0, FSEL1, FSEL2, MUTEX, PDX FSEL0, FSEL1, FSEL2, MUTEX, PDX ERROR, IOL=0.5mA Supply Voltage Minimum Load Impedance(Note 7) (Note 7) Applied pins and Conditions Pd should not be exceeded. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 7/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Electrical Characteristics (Unless otherwise specified, Ta=25C, VCC=11V, fPWM=600kHz, fIN=1kHz, RL=8, PDX=3.3V, MUTEX=3.3V, PLIMT=0V, Gain=26dB, Output LC filter: L=15H, C=1F when VCC>11V, snubber circuit is added: C=680pF, R=5.6) Parameter Symbol Min Typ Max Unit Quiescent Standby Current ICC1 - 0.1 25 A Quiescent Mute Current ICC2 - 10 20 mA Quiescent Operating Current ICC3 - 16 32 mA VREGG 4.45 5.55 6.05 V Input Pull Down Impedance 1 RIN1 70 100 130 k Input Pull Down Impedance 2 RIN2 140 200 260 k Regulator Output Voltage (Note 8) Output Power Applied pins and Conditions No load or filter, PDX=L, MUTEX=L No load or filter, PDX=H, MUTEX=L No load or filter, No signal, PDX=H, MUTEX=H PDX=H, MUTEX=H MUTEX, PDX, FSEL0, FSEL1, FSEL2, SYNC(Slave mode only), PLIMIT PO1 - 9 - W (Note 8) Gain 1 GV1 19 20 21 dB Gain 2(Note 8) GV2 25 26 27 dB Gain 3(Note 8) GV3 31 32 33 dB Gain 4(Note 8) GV4 35 36 37 dB Total Harmonic Distortion(Note 8) THD - 0.03 - % CT 60 100 - dB VCC=12V, THD+N=10% Po=1W, GAIN_MS_SEL= 0V PO=1W , GAIN_MS_SEL= 2/9 x VREGG PO=1W, GAIN_MS_SEL= 3/9 x VREGG PO=1W, GAIN_MS_SEL= 4/9 x VREGG Po=1W, BW=20 to 20kHz (AES17) Po=1W, 1kHz BPF PSRR - 55 - dB Vripple=0.2 VP-P, f=1kHz VNO - -80 -70 dBV fPWM1 564 600 636 kHz fPWM2 470 500 530 kHz fPWM3 376 400 424 kHz Crosstalk (Note 8) (Note 8) PSRR (Note 8) Output Noise Level PWM (Pulse Width Modulation) Frequency (Note 8) Po=0W, BW=IHF-A FSEL2=H, FSEL1=L, FSEL0=H FSEL2=H, FSEL1=L, FSEL0=L FSEL2=L, FSEL1=H, FSEL0=H The value is specified as typical application. Actual value depends on PCB layout and external components. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 8/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Typical Performance Curves (Unless otherwise specified, Ta=25C, VCC=11V, fPWM=600kHz, fIN=1kHz, RL=8, PDX=3.3V, MUTEX=3.3V, PLIMT=0V, Gain=26dB, Output LC filter: L=15H, C=1F when VCC>11V, snubber circuit is added: C=680pF, R=5.6) 10 45 Current Consumption : I CC1 [A] 9 8 Current Consumption : ICC2, ICC3 [mA] No load or filter No signal "PD" 7 6 5 4 3 2 1 0 No load or filter No signal "MUTE" "ACTIVE" 40 35 30 25 ACTIVE without snubber 20 15 10 MUTE 5 0 4 6 8 10 12 Supply Voltage : VCC [V] 4 14 Figure 5. Circuit Current vs Supply Voltage (PD) 6 8 10 12 Supply Voltage : VCC [V] 14 Figure 6. Circuit Current vs Supply Voltage (MUTE, ACTIVE) 100 100 VCC=5V 90 VCC=9V VCC=12V VCC=5V 90 80 VCC=9V VCC=12V 80 70 70 RL=8 60 Efficiency [%] Efficiency [%] ACTIVE with snubber 50 40 30 60 50 40 30 20 20 10 10 0 0 0 2 4 6 8 10 12 14 0 2 4 6 8 10 12 14 Output Power [W/Ch] Output Power [W/Ch] Figure 7. Efficiency vs Output Power (RL=8) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 RL=6 Figure 8. Efficiency vs Output Power (RL=6) 9/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Typical Performance Curves (Unless otherwise specified, Ta=25C, VCC=11V, fPWM=600kHz, fIN=1kHz, RL=8, PDX=3.3V, MUTEX=3.3V, PLIMT=0V, Gain=26dB, Output LC filter: L=15H, C=1F when VCC>11V, snubber circuit is added: C=680pF, R=5.6) 100 16 VCC=5V 90 VCC=9V VCC=12V 14 RL=8 80 Efficiency [%] Output Power [W/Ch] 12 70 PBTL RL=4 Output LC filter: L=10H, C=2.2F 60 50 40 30 10 THD+N=10% 8 6 THD+N=1% 4 20 2 10 0 0 0 2 4 6 8 10 12 14 16 4 18 20 8 10 12 Output Power [W/Ch] Supply Voltage : V CC [V] Figure 9. Efficiency vs Output Power (PBTL, RL=4) Figure 10. Output Power vs Supply Voltage (RL=8) 16 14 24 PBTL RL=4 Output LC filter: L=10H, C=2.2F 22 14 RL=6 20 12 18 10 Output Power [W/Ch] Output Power [W/Ch] 6 THD+N=10% 8 6 THD+N=1% 4 16 14 THD+N=10% 12 10 8 THD+N=1% 6 4 2 2 0 0 4 6 8 10 12 14 4 6 8 10 12 Supply Voltage : V CC [V] Supply Voltage : V CC [V] Figure 11. Output Power vs Supply Voltage (RL=6) Figure 12. Output Power vs Supply Voltage (PBTL, RL=4) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 10/37 14 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Typical Performance Curves (Unless otherwise specified, Ta=25C, VCC=11V, fPWM=600kHz, fIN=1kHz, RL=8, PDX=3.3V, MUTEX=3.3V, PLIMT=0V, Gain=26dB, Output LC filter: L=15H, C=1F when VCC>11V, snubber circuit is added: C=680pF, R=5.6) 2.5 2.5 RL=6 2 VCC=12V Current Comsumption : I CC [A] Current Consumption : I CC [A] RL=8 VCC=9V 1.5 1 VCC=5V 0.5 0 2 VCC=9V VCC=12V 1.5 VCC=5V 1 0.5 0 0 2 4 6 8 10 12 14 0 Output Power [W/Ch] 2 4 6 8 10 12 14 Output Power [W/Ch] Figure 13. Circuit Current vs Output Power (RL=8) Figure 14. Circuit Current vs Output Power (RL=6) Current Consumption : I CC [A] 2.5 PBTL RL=4 Output LC filter: L=10H, C=2.2F 2 VCC=12V VCC=9V 1.5 1 VCC=5V 0.5 0 0 2 4 6 8 10 12 14 16 18 20 Output Power [W/Ch] Figure 15. Circuit Current vs Output Power (PBTL, RL=4) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 11/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Typical Performance Curves (Unless otherwise specified, Ta=25C, VCC=11V, fPWM=600kHz, fIN=1kHz, RL=8, PDX=3.3V, MUTEX=3.3V, PLIMT=0V, Gain=26dB, Output LC filter: L=15H, C=1F when VCC>11V, snubber circuit is added: C=680pF, R=5.6) 0 36 OUT1 OUT2 -20 No Signal RL=8 OUT1 OUT2 31 Voltage Gain [dB] -40 Noise FFT [dBV] PO=1W RL=8 -60 -80 -100 26 21 -120 16 -140 10 100 1k 10k 10 100k 100 10k 100k Freq [Hz] Freq [Hz] Figure 17. Voltage Gain vs Freq. (RL=8) Figure 16. FFT of Output Noise Voltage (RL=8) 10 10 1 0.1 OUT1 OUT2 fIN=6kHz PO=1W BW=20 to 20kHz AES17 RL=8 1 THD+N [%] fIN=1kHz fIN=100Hz fIN=6kHz THD+N [%] 1k fIN=1kHz 0.01 0.1 0.01 fIN=100Hz BW=20 to 20kHz AES17 RL=8 0.001 0.01 0.001 0.1 1 10 100 Po [W] 100 1k 10k 100k Freq [Hz] Figure 19. THD+N vs Freq. (RL=8) Figure 18. THD+N vs Output Power (RL=8) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 10 12/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Typical Performance Curves (Unless otherwise specified, Ta=25C, VCC=11V, fPWM=600kHz, fIN=1kHz, RL=8, PDX=3.3V, MUTEX=3.3V, PLIMT=0V, Gain=26dB, Output LC filter: L=15H, C=1F when VCC>11V, snubber circuit is added: C=680pF, R=5.6) 0 0 OUT1 to OUT2 OUT2 to OUT1 -20 -20 -40 -60 -80 -100 -60 -80 -100 -120 -120 0.01 0.1 1 10 100 10 100 Po [W] 1k 10k 100k Freq [Hz] Figure 20. Crosstalk vs Output Power (RL=8) Figure 21. Crosstalk vs Freq. (RL=8) 36 0 OUT1 OUT2 -20 No Signal RL=6 OUT1 OUT2 PO=1W RL=6 31 Voltage Gain [dB] -40 Noise FFT [dBV] PO=1W RL=8 -40 Crosstalk [dB] Crosstalk [dB] OUT1 to OUT2 OUT2 to OUT1 RL=8 -60 -80 -100 26 21 -120 -140 16 10 100 1k 10k 100k Freq [Hz] 100 1k 10k 100k Freq [Hz] Figure 22. FFT of Output Noise Voltage (RL=6) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 10 Figure 23. Voltage Gain vs Freq. (RL=6) 13/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Typical Performance Curves (Unless otherwise specified, Ta=25C, VCC=11V, fPWM=600kHz, fIN=1kHz, RL=8, PDX=3.3V, MUTEX=3.3V, PLIMT=0V, Gain=26dB, Output LC filter: L=15H, C=1F when VCC>11V, snubber circuit is added: C=680pF, R=5.6) 10 10 THD+N [%] 1 fIN=6kHz PO=1W BW=20 to 20kHz AES17 RL=6 1 fIN=1kHz 0.1 0.01 OUT1 OUT2 THD+N [%] fIN=1kHz fIN=100Hz fIN=6kHz 0.1 0.01 fIN=100Hz BW=20 to 20kHz AES17 RL=6 0.001 0.001 0.01 0.1 1 10 10 100 100 0 0 OUT1 to OUT2 OUT2 to OUT1 OUT1 to OUT2 OUT2 to OUT1 RL=6 -20 -40 PO=1W RL=6 -40 Crosstalk [dB] Crosstalk [dB] 100k Figure 25. THD+N vs Freq. (RL=6) Figure 24. THD+N vs Output Power (RL=6) -60 -80 -60 -80 -100 -100 -120 -120 0.01 10k Freq [Hz] Po [W] -20 1k 0.1 1 10 100 Po [W] 100 1k 10k 100k Freq [Hz] Figure 27. Crosstalk vs Freq. (RL=6) Figure 26. Crosstalk vs Output Power (RL=6) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 10 14/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Typical Performance Curves (Unless otherwise specified, Ta=25C, VCC=11V, fPWM=600kHz, fIN=1kHz, RL=8, PDX=3.3V, MUTEX=3.3V, PLIMT=0V, Gain=26dB, Output LC filter: L=15H, C=1F when VCC>11V, snubber circuit is added: C=680pF, R=5.6) 0 36 No Signal PBTL RL=4 Output LC filter: L=10H, C=2.2F -20 31 Voltage Gain [dB] Noise FFT [dBV] -40 PO=1W PBTL RL=4 Output LC filter: L=10H, C=2.2F -60 -80 -100 26 21 -120 16 -140 10 100 1k 10k 10 100k 100 10 10 fIN=1kHz fIN=100Hz fIN=6kHz 1 PO=1W BW=20 to 20kHz AES17 PBTL RL=4 Output LC filter: L=10H, C=2.2F fIN=6kHz 1 THD+N [%] THD+N [%] 100k Figure 29. Voltage Gain vs Freq. (PBTL, RL=4) Figure 28. FFT of Output Noise Voltage (PBTL, RL=4) fIN=1kHz 0.1 fIN=100Hz 0.001 0.01 10k Freq [Hz] Freq [Hz] 0.01 1k 0.1 BW=20 to 20kHz AES17 PBTL RL=4 Output LC filter: L=10H, C=2.2F 1 10 0.01 0.001 100 Po [W] 10 100 1k 10k 100k Freq [Hz] Figure 31. THD+N vs Freq. (PBTL, RL=4) Figure 30. THD+N vs Output Power (PBTL, RL=4) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 0.1 15/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Typical Performance Curves (Unless otherwise specified, Ta=25C, VCC=11V, fPWM=600kHz, fIN=1kHz, RL=8, PDX=3.3V, MUTEX=3.3V, PLIMT=0V, Gain=26dB, Output LC filter: L=15H, C=1F when VCC>11V, snubber circuit is added: C=680pF, R=5.6) 10 10 fIN=1kHz fIN=100Hz fIN=6kHz 0.1 0.01 1 fIN=6kHz fIN=1kHz THD+N [%] THD+N [%] 1 OUT1 OUT2 fIN=100Hz OUT2 0.1 0.01 OUT1 fPWM=400kHz BW=20 to 20kHz AES17 RL=8 0.001 0.01 fPWM=400kHz PO=1W BW=20 to 20kHz AES17 RL=8 0.001 0.1 1 10 100 Po [W] 100 1k 10k 100k Freq [Hz] Figure 33. THD+N vs Freq. (fPWM=400kHz, RL=8) Figure 32. THD+N vs Output Power (fPWM=400kHz, RL=8) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 10 16/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Power up / down sequence Power up VCCP1, VCCP2, VCCA simultaneously. Power down VCCP1, VCCP2, VCCA simultaneously. VCCP1 VCCP2 VCCA t After VCC rises, please set PDX to High. Set PDX to Low. PDX t REGG t Input audio signal. Stop audio signal. IN1P IN1N IN2P IN2N MUTEX t More than 50msec After input rises, please set MUTEX to High. After input signal stops, please set MUTEX to Low. t OUT1P OUT1N OUT2P OUT2N t Speaker BTL output (After LC filter) t Figure 34. Power Up / Down Sequence www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 17/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Function Description (1) Power down and Mute setting PDX MUTEX L L/H H L H H Normal PWM output (Note 10) ERROR OUT1P, 1N, 2P, 2N (Note 9) High-Z_Low H (Power down) (Note 9) High-Z_Low H (MUTE_ON) Active H (MUTE_OFF) ERROR Detection PWM output (Note 10) ERROR OUT1P, 1N, 2P, 2N (Note 9) High-Z_Low H (Power down) (Note 9) High-Z_Low L (MUTE_ON) (Note 9) High-Z_Low L (MUTE_ON) (Note 9) All power transistors are OFF and output terminals are pulled down by 40k (Typ). (Note 10) ERROR pin is pulled up by 10k resistor. (2) Gain and Master/Slave setting Master/slave and gain are set by GAIN_MS_SEL pin voltage. (Note 11) REGG R1 REGG GAIN_MS_SEL R2 R1 (to REGG) R2(Note 11) (to GND) Master/Slave Gain Input Impedance 18k 18k 33k 51k 68k 68k 68k open Open 68k 68k 68k 51k 33k 18k 18k Slave Slave Slave Slave Master Master Master Master 36dB 32dB 26dB 20dB 36dB 32dB 26dB 20dB 30k 45.1k 79.3k 127.9k 30k 45.1k 79.3k 127.9k (Note 11) Please use 1% tolerance resistor. Figure 35. GAIN_MS_SEL Pin Setting Setting cannot be changed when IC is active, but it can be set by rebooting (PDX=H to L to H). Master/Slave Function This IC has master and slave mode, and it can be synchronized by PWM frequency between two ICs. In master mode, SYNC pin becomes output pin for synchronization and in slave mode it becomes input pin, so please connect each SYNC pins. Please set FSEL2/FSEL1/FSEL0 pins to be same each other. (3) Parallel BTL Function Parallel BTL mode can be set by connecting IN2P and IN2N pins to GND. Please short OUT1P - OUT2P, OUT1N - OUT2N near the IC as much as possible. Parallel BTL mode cannot be set by connecting IN1P and IN1N pins to GND. Stereo BTL mode Parallel BTL mode Figure 36. Parallel BTL mode www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 18/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV (4) Power Limit Function It is possible to limit the maximum output voltage by PLIMIT pin. 12 Po [W] 10 8 6 4 2 0 0 2 4 6 PLIMIT pin voltage [V] Figure 37. Power Limit Figure 38. Power Limit Function [VCC=12V, RL=8 ] (Typ) Ex.) If PLIMIT is set by R3A=12k and R3B=20k in "Application Information", output power is limited to about 6.4W. If power limit function is not needed, connect PLIMIT pin to GND. (5) FSEL2 / FSEL1 / FSEL0 (AM avoidance function) FSEL2 / FSEL1 / FSEL0 pins are used for PWM frequency setting. PWM frequency is near to AM radio frequency band therefore this makes interference during AM radio is used, and may negatively affects reception of AM radio wave. This interference can be reduced by shift of PWM frequency. Below are the recommended settings. For example, receiving AM radio wave of 1269kHz in Asia / Europe please set PWM frequency to 500kHz. AM frequency [kHz] Recommended PWM frequency setting Americas Asia / Europe fPWM=400kHz FSEL2=L FSEL1=H FSEL0=H 540 - 917 917 - 1125 1125 - 1375 1375 - 1547 1547 - 1700 522 - 540 540 - 914 914 - 1122 1122 - 1373 1373 - 1548 1548 - 1701 fPWM=500kHz FSEL2=H FSEL1=L FSEL0=L fPWM=600kHz FSEL2=H FSEL1=L FSEL0=H - Do not set following conditions: FSEL2=FSEL1=FSEL0=H FSEL2=H, FSEL1=H, FSEL0=L FSEL2=L, FSEL1=H, FSEL0=L FSEL2=L, FSEL1=L, FSEL0=H FSEL2=FSEL1=FSEL0=L www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 19/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Application Information (1) Application Circuit Example 1 (Stereo BTL, VCC=4.5 to 11V) Overshoot of output PWM differs according to the board, and etc. Please check to ensure that it is lower than absolute maximum ratings. If it exceeds the absolute maximum ratings, snubber circuit need to be added, the circuit example is shown on the next page. VCC 3.3V R32 10k REGG R6A GAIN_MS_SEL R6B C7 1F IN2P IN2N BSP1P VCCP1 NC VCCA NC 24 REGG 23 DRIVER FET 3 GAIN DRIVER FET LDO DRIVER FET 6 21 19 7 18 REGG OSC 12 13 FSEL2 11 FSEL1 FSEL0 10 SYNC 9 C24A 1F RL=8/6 C22A 1F L22A C21 0.68F 15H C20 0.68F L19A 15H OUT2P C19A 1F GNDP2 RL=8/6 C17A 1F 17 OUT2N CONTROL I/F C8 1F BSP1N 20 BSP2P PWM 8 OUT1P GNDP1 22 OUT1N DRIVER FET PLIMIT 5 C25 0.68F 25 L24A 15H 2 4 26 CONTROL I/F 1 REGG 27 REGG REGG C5 1F 28 L17A 15H 14 VCC 15 C15A 0.1F C16 0.68F 16 BSP2N REGG 29 VCCP2 PLIMIT GNDA Source PROTECT 30 PWM R3B Audio 31 NC C2 1F C26B 10F MUTEX R3A IN1N TEST PDX ERROR REGG IN1P C26A 0.1F C27B 4.7F 32 C1 1F VCC C27A 0.1F C15B 10F Figure 39. Application Circuit 1 BOM 1 (Stereo BTL, VCC=4.5 to 11V) Parts Qty. Parts No. 1 R3A 1 R3B Resistor 1 R6A 1 R6B 1 R32 4 C1, C2, C7, C8 1 C5(Note 12) 3 C15A, C26A, C27A(Note 12) Capacitor 2 C15B, C26B(Note 12) 4 C16, C20, C21, C25(Note 12) 4 C17A, C19A, C22A, C24A 1 C27B(Note 12) Inductor 4 L17A, L19A, L22A, L24A (Note 12) Description Ref. Function Description (4)Power Limit Function Ref. Function Description (2)Gain and Master/Slave setting 100k, 1/16W, J(5%) 1F, 16V, B(10%) 1F, 16V, B(10%) 0.1F, 25V, B(10%) 10F, 25V, B(10%) 0.68F, 16V, B(10%) 1F, 25V, B(10%) 4.7F, 25V, B(10%) 15H, 2.1A, 20% Please place it near pin as much as possible. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 20/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV (2) Application Circuit Example 2 (Stereo BTL, VCC=11 to 13V) Please add the snubber circuit at OUT pin when VCC=11 to 13V. VCC R32 10k R6A GAIN_MS_SEL R6B C7 1F IN2P IN2N BSP1P VCCP1 NC C25 0.68F 25 OUT1P 24 REGG 2 23 DRIVER FET 3 22 DRIVER FET PLIMIT GAIN 5 26 CONTROL I/F 1 4 27 REGG REGG REGG C5 REGG 1F VCCA NC 28 DRIVER FET LDO DRIVER FET 6 7 18 REGG OSC 12 13 FSEL2 FSEL0 11 FSEL1 10 SYNC 9 17 CONTROL I/F C8 1F 680pF 5.6 R22 C22C OUT1N 5.6 680pF BSP2P OUT2P 19 PWM 8 C24C R24 GNDP1 21 BSP1N 20 L24A 15H C24A 1F RL=8/6 C22A 1F L22A C21 0.68F 15H Snubber circuit C20 0.68F L19A 15H C19C R19 GNDP2 680pF 5.6 C19A 1F R17 C17C OUT2N 5.6 680pF C17A 1F RL=8/6 L17A 15H 14 15 VCC C16 0.68F 16 BSP2N REGG 29 VCCP2 PLIMIT GNDA Source PROTECT 30 PWM R3B Audio 31 NC C2 1F C26B 10F MUTEX R3A IN1N TEST PDX ERROR REGG IN1P C26A 0.1F C27B 4.7F 32 C1 1F VCC C27A 0.1F 3.3V C15A 0.1F Figure 40. Application Circuit 2 BOM 2 (Stereo BTL, VCC=11to 13V) Parts Qty. Parts No. 1 R3A 1 R3B 1 R6A Resistor 1 R6B 1 R32 4 R17, R19, R22, R24 4 C1, C2, C7, C8 1 C5(Note 13) 3 C15A, C26A, C27A(Note 13) 2 C15B, C26B(Note 13) Capacitor 4 C16, C20, C21, C25(Note 13) 4 C17A, C19A, C22A, C24A C17C, C19C, C22C, 4 C24C(Note 13) 1 C27B(Note 13) Inductor 4 L17A, L19A, L22A, L24A (Note 13) Description Ref. Function Description (4)Power Limit Function Ref. Function Description (2)Gain and Master/Slave setting 100k, 1/16W, J(5%) 5.6, 1/10W, J(5%) 1F, 16V, B(10%) 1F, 16V, B(10%) 0.1F, 25V, B(10%) 10F, 25V, B(10%) 0.68F, 16V, B(10%) 1F, 25V, B(10%) 680pF, 25V, B(10%) 4.7F, 25V, B(10%) 15H, 2.1A, 20% Please place it near pin as much as possible. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 21/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV (3) Application Circuit Example 3 (Monaural PBTL, VCC=4.5 to 11V) Overshoot of output PWM differs according to the board, and etc. Please check to ensure that it is lower than absolute maximum ratings. If it exceeds the absolute maximum ratings, snubber circuit need to be added, the circuit example is shown on the next page. VCC R32 10k 6 IN2P 7 IN2N 8 VCCP1 NC VCCA NC BSP1P C24B 2.2F REGG 23 DRIVER FET 3 R6A GAIN_MS_SEL R6B L24B 10H OUT1P 24 2 GAIN DRIVER FET LDO DRIVER FET GNDP1 RL=4 C22B 2.2F 22 OUT1N C21 0.68F 21 BSP1N REGG REGG DRIVER FET PLIMIT 5 C25 0.68F 25 L22B 10H 20 BSP2P C20 0.68F 19 PWM OUT2P 18 GNDP2 REGG OSC FSEL0 10 SYNC 9 11 17 OUT2N CONTROL I/F 12 13 14 VCC 15 C16 0.68F 16 BSP2N REGG REGG 26 CONTROL I/F 1 4 27 VCCP2 REGG 28 NC Source 29 MUTEX PLIMIT GNDA C5 1F C26B 10F PWM R3B Audio PROTECT 30 FSEL2 C2 1F 31 FSEL1 R3A IN1N TEST PDX ERROR REGG IN1P C26A 0.1F C27B 4.7F 32 C1 1F VCC C27A 0.1F 3.3V C15A 0.1F C15B 10F Figure 41. Application Circuit 3 BOM 3 (Monaural PBTL, VCC=4.5 to 11V) Parts Qty. Parts No. 1 R3A 1 R3B Resistor 1 R6A 1 R6B 1 R32 4 C1, C2, C7, C8 1 C5(Note 14) 3 C15A, C26A, C27A(Note 14) Capacitor 2 C15B, C26B(Note 14) 4 C16, C20, C21, C25 2 C22B, C24B(Note 14) 1 C27B Inductor 2 L22B, L24B (Note 14) Description Ref. Function Description (4)Power Limit Function Ref. Function Description (2)Gain and Master/Slave setting 100k, 1/16W, J(5%) 1F, 16V, B(10%) 1F, 16V, B(10%) 0.1F, 25V, B(10%) 10F, 25V, B(10%) 0.68F, 16V, B(10%) 2.2F, 25V, B(10%) 4.7F, 25V, B(10%) 10H, 2.6A, 20% Please place it near pin as much as possible. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 22/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV (4) Application Circuit Example 4 (Monaural PBTL, VCC=11 to 13V) Please add the snubber circuit at OUT pin when VCC=11 to 13V. VCC R32 10k 4 R6A GAIN_MS_SEL R6B 6 IN2P 7 IN2N 8 BSP1P REGG OUT1P 23 DRIVER FET 22 DRIVER FET PLIMIT GAIN 5 VCCP1 NC L24B 10H DRIVER FET LDO DRIVER FET GNDP1 OUT1N C24C 680pF R24 5.6 C24B 2.2F 5.6 680pF C22B 2.2F R22 C22C RL=4 L22B 10H C21 0.68F 21 BSP1N 20 BSP2P C20 0.68F 19 PWM OUT2P 18 GNDP2 REGG OSC 11 12 13 14 VCC 15 C15A 0.1F C16 0.68F 16 BSP2N 10 VCCP2 SYNC 9 17 OUT2N CONTROL I/F NC REGG REGG C25 0.68F 25 REGG REGG GNDA 26 24 2 3 27 CONTROL I/F 1 PLIMIT VCCA NC 28 MUTEX REGG C5 1F 29 FSEL2 Audio C26B 10F PWM R3B Source PROTECT 30 FSEL1 C2 1F 31 FSEL0 R3A IN1N TEST PDX ERROR REGG IN1P C26A 0.1F C27B 4.7F 32 C1 1F VCC C27A 0.1F 3.3V C15B 10F Figure 42. Application Circuit 4 BOM 4 (Monaural PBTL, VCC=11 to 13V) Parts Qty. Parts No. 1 R3A 1 R3B 1 R6A Resistor 1 R6B 1 R32 2 R22, R24(Note 15) 4 C1, C2, C7, C8 1 C5(Note 15) 3 C15A, C26A, C27A(Note 15) 2 C15B, C26B(Note 15) Capacitor 4 C16, C20, C21, C25(Note 15) 2 C22B, C24B 2 C22C, C24C(Note 15) 1 C27B(Note 15) Inductor 2 L22B, L24B (Note 15) Description Ref. Function Description (4)Power Limit Function Ref. Function Description (2)Gain and Master/Slave setting 100k, 1/16W, J(5%) 5.6, 1/10W, J(5%) 1F, 16V, B(10%) 1F, 16V, B(10%) 0.1F, 25V, B(10%) 10F, 25V, B(10%) 0.68F, 16V, B(10%) 2.2F, 25V, B(10%) 680pF, 25V, B(10%) 4.7F, 25V, B(10%) 10H, 2.6A, 20% Please place it near pin as much as possible. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 23/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV This GAIN_MS_SEL setting is one example, so another Gain setting can be used. (5) Application Example 5 (MASTER/SLAVE mode, VCC=4.5 to 11V) VCC C27Am 0.1F 3.3V VCC C26Am 0.1F C27Bm 4.7F R32m 10k C26Bm 10F Master 32 C1m 1F IN1P IN1N REGG1 R3Am C2m 1F PLIMIT GNDA Source REGG1 REGG1 C5m REGG 1F 68k R6Am 18k R6Bm GAIN_MS_SEL C7m 1F PROTECT 30 29 28 C25m 0.68F 25 L24Am 15H REGG 23 DRIVER FET 3 21 BSP1N GAIN DRIVER FET 20 BSP2P LDO DRIVER FET 6 19 PWM IN2P IN2N 7 18 REGG 8 OSC CONTROL I/F C8m 1F 9 OUT1P 10 11 12 13 C24Am 1F GNDP1 RL=8/6 C22Am 1F 22 OUT1N DRIVER FET PLIMIT 5 26 24 2 4 27 CONTROL I/F 1 PWM R3Bm Audio 31 L22Am C21m 0.68F 15H C20m 0.68F L19Am 15H OUT2P C19Am 1F GNDP2 C17Am 1F 17 OUT2N RL=8/6 L17Am 15H 14 15 C16m 0.68F 16 VCC C15Am 0.1F VCC C27As 0.1F 3.3V C15Bm 10F VCC C26As 0.1F C27Bs 4.7F R32s 10k C26Bs 10F Slave 32 C1s 1F IN1P IN1N REGG2 R3As C2s 1F PLIMIT GNDA Source REGG2 33k 68k REGG2 C5s REGG 1F R6As PROTECT 30 29 28 GAIN_MS_SEL R6Bs C25s 0.68F 25 L24Bs 10H 23 DRIVER FET GAIN DRIVER FET DRIVER FET 19 PWM IN2P 7 IN2N 8 RL=4 C22Bs 2.2F L22Bs 10H 20 BSP2P C20s 0.68F LDO 6 GNDP1 22 OUT1N C21s 0.68F BSP1N 21 DRIVER FET PLIMIT C24Bs 2.2F OUT1P REGG 3 5 26 24 2 4 27 CONTROL I/F 1 PWM R3Bs Audio 31 OUT2P 18 GNDP2 REGG OSC 9 10 11 CONTROL I/F 12 13 14 15 17 OUT2N C16s 0.68F 16 VCC C15As 0.1F C15Bs 10F Figure 43. Application Circuit 5 www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 24/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV About the Protection Function Protection Function Detecting & Releasing Condition PWM Output OUT1P, 1N, 2P, 2N ERROR(Note 16) Output short protection Detecting condition Detecting current = 8A (Typ) High-Z_Low (Latch)(Note17) L (Latch) (Note17) DC voltage protection Detecting condition DC voltage is over 3.5V for a period of 0.33sec to 0.66sec at speaker output High-Z_Low (Note17) (Latch) L (Latch) (Note17) Detecting condition Chip temperature to be over 150C (Typ) High-Z_Low Releasing condition Chip temperature to be below 120C (Typ) Detecting condition Power supply voltage to be below 4.0V (Typ) High-Z_Low Power supply voltage to be above 4.1V (Typ) Normal operation Overheat protection Under voltage protection Releasing condition Normal operation L H (Note 16) ERROR pin is pulled up by 10k resistor. (Note 17) Once an IC is latched, the circuit is not released automatically even after an abnormal status is gone. The following procedures or is available for recovery. After turning MUTEX terminal to Low (holding time to Low = 10msec (Min)) turn back to High again. Restore power supply after dropping to power supply voltage VCC < 3V (10msec (Min) holding) which internal power on reset circuit activates. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 25/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV (1) Output Short Protection (short to the power supply) This IC has the PWM output short protection circuit that stops the PWM output when the output speaker (after LC-filter) is short-circuited to the power supply due to abnormality. Detecting condition - Releasing method - It will detect when MUTEX pin is set High and the current that flows into the PWM output pin becomes 8A(Typ) or more. If detected, the PWM output instantaneously goes to the state of High-Z_Low and IC is latch. After turning MUTEX terminal to Low(holding time to Low = 10msec(Min)) turn back to High again. Restore power supply after the voltage dropped to internal power on reset circuit activating power supply voltage VCC3V (hold for 10msec (Min)). Short to VCC Release from short to VCC OUT1P OUT1N OUT2P OUT2N t PWM out Over-Current IC latches with High-Z_Low Released from latch state 8A(Typ) t ERROR t 250nsec(Typ) MUTEX Latch release t 10msec(Min) Figure 44. Output Short Protection Sequence (Short to Power Supply) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 26/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV (2) Output Short Protection (Short to GND) This IC has the PWM output short protection circuit that stops the PWM output when the output speaker (after LC-filter) is short-circuited to GND due to abnormality. Detecting condition - Releasing method - It will detect when MUTEX pin is set High and the current that flows into the PWM output terminal becomes 8A(Typ) or more. If detected, the PWM output instantaneously goes to the state of High-Z_Low and IC is latched. After turning MUTEX terminal to Low(holding time to Low = 10msec(Min)) turn back to High again. Restore power supply after the voltage dropped to internal power on reset circuit activating power supply voltage VCC3V (hold for 10msec (Min)). Short to GND Release from short to GND OUT1P OUT1N OUT2P OUT2N t Released from latch state PWM out IC latches with High-Z_Low Over-Current 8A(Typ) t ERROR t 250nsec(Typ) MUTEX Latch release t 10msec(Min) Figure 45. Sequence of the Output short protection (Short to GND) www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 27/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV (3) DC Voltage Protection This IC is integrated with DC voltage protection circuit. When DC voltage is input to the speaker due to abnormality, speaker output will MUTE, and this protection will prevent the speaker from destruction. Detecting condition - Releasing method - It will detect when MUTEX pin is set High and speaker output is more than 3.5V(Typ) over 0.33sec to 0.66sec. Once detected, The PWM output instantaneously goes to the state of High-Z_Low, and IC will latch. After turning MUTEX terminal to Low(holding time to Low = 10msec(Min)) turn back to High again. Restore power supply after the voltage dropped to internal power on reset circuit activating power supply voltage VCC3V (hold for 10msec (Min)). Abnormal condition Impress DC voltage to speaker output over 3.5V OUT1P OUT1N OUT2P OUT2N Release abnormal condition PWM out : IC latches with High-Z_Low t Released from latch state 3.5V Speaker Output t -3.5V Output stops by being inputted DC voltage twice. Detection time is 0.33sec to 0.66sec. 0.33sec 0.33sec 0.33sec 0.33sec 0.33sec 0.33sec 0.33sec 0.33sec Output is monitored in the interval of 0.33sec ERROR t MUTEX Latch is released t 10msec(Min) Figure 46. DC Voltage Protection Sequence www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 28/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV (4) Overheat Protection This IC has the overheat protection circuit that prevents thermal runaway under an abnormal state for the chip temperature exceeded Tjmax=150C. Detecting condition - It will detect when MUTEX pin is set High and the temperature of the chip becomes 150C (Typ) or more. Speaker output turns MUTE immediately, when High temperature protection is detected. Releasing condition - It will release when MUTEX pin is set High and the temperature of the chip becomes 120C (Typ) or less. The speaker output is outputted immediately when released. (Auto recovery) Tj 150C 120C t OUT1P OUT1N OUT2P OUT2N High-Z_Low t Speaker Output t ERROR t Figure 47. Overheat Protection Sequence www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 29/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV (5) Under Voltage Protection This IC has the under voltage protection circuit that mutes the output speaker once extreme drop in the power supply voltage is detected. Detecting condition - It will detect when MUTEX pin is set High and the power supply voltage becomes lower than 4V(Typ).Speaker output turn MUTE immediately when under voltage protection is detected. Releasing condition - It will release when MUTEX pin is set High and the power supply voltage becomes more than 4.1V(Typ).The speaker output is outputted immediately when released. (Auto recovery) Figure 48. Under Voltage Protection Sequence www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 30/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Selecting External Components (1) Output LC Filter Circuit An output filter is required to eliminate radio-frequency components exceeding the audio-frequency region supplied to a load (speaker). Because this IC uses output PWM frequencies any of 400kHz, 500kHz, or 600kHz, the high-frequency components must be appropriately removed. This section takes an example of an LC type LPF shown below, in which coil L and capacitor C compose a differential filter with an attenuation property of -12dB/oct. A large part of switching currents flow to capacitor C, and only a small part of the currents flow to speaker RL. This filter reduces unwanted emission this way. In addition, coil L and capacitor C compose a filter against in-phase components, reducing unwanted emission further. L OUT*P The following shows output LC filter constants and cutoff frequencies fC with typical load impedances. C RL C OUT*N 4 6, 8 RL L 10H 15H C 2.2F 1F fC 34kHz 41kHz L Figure 49. Output LC Filter Use inductors with low ESR and with sufficient margin of allowable currents. Power loss will increase if inductors with high ESR are used. Select a closed magnetic circuit type product in normal cases to prevent emission noise. Use capacitors with low equivalent series resistance, and good impedance characteristics at high frequency ranges (100kHz or higher). Also, select an item with sufficient voltage rating because massive amount of high-frequency current flow is expected. (2) Snubber circuit constant When overshoot / undershoot of PWM Output exceeds absolute maximum rating, or when overshoot / undershoot of PWM output negatively affects EMC, snubber circuit is used as shown below. And if VCC>11V, the snubber circuit must be added. VCCP Snubber circuit LC filter circuit The following table shows ROHM recommended value of "Snubber filter constants" when using ROHM 4 layer board. PWM RL 4 6 8 OUT C R GNDP C 680pF, 25V B(10%) 680pF, 25V B(10%) 680pF, 25V B(10%) R 5.6, 1/10W J(5%) 5.6, 1/10W J(5%) 5.6, 1/10W J(5%) Figure 50. Snubber circuit Caution1: If the impedance characteristics of the speakers at high-frequency range increase rapidly, the IC might not have stable operation in the resonance frequency range of the LC filter. Therefore, consider adding damping-circuit, etc., depending on the impedance of the speaker. Caution2: Though this IC has a short protection function, when short to VCC or GND after the LC filter, over current occurs during short protection function operation. Be careful about over/undershoot which exceeds the maximum standard ratings because back electromotive force of the inductor will occur which sometimes leads to IC destruction. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 31/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Power Dissipation 5 PCB 4.56W 4.5 Package: VQFN032V5050 4 3.5 PCB 3.26W Pd [W] 3 2.5 2 1.5 1 0.5 0 0 25 50 75 100 125 150 Ta [] Figure 51. Power Dissipation vs Temperature Measuring instrument : TH-156(Kuwano Electrical Instruments Co, Ltd.) Measuring conditions : Installation on ROHM's board Board size : 74.2mm x 74.2mm x 1.6mm(with thermal via on board) Material : FR4 The board on exposed heat sink on the back of package are connected by soldering. 2 PCB1 : 4- layer board (Top and bottom layer back copper foil size: 20.2mm , 2nd and 3rd layer 2 ja = 38.3C/W back copper foil size: 5505mm ) , PCB2 : 4-layer board(back copper foil size: 5505mm2), ja = 27.4C /W Use a thermal design that allows for a sufficient margin in consideration of power dissipation (Pd) under actual operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed to use after providing heat dissipation treatment to improve heat dissipation efficiency. Try to occupy as wide as possible with heat dissipation pattern not only on the board surface but also the backside. Class D speaker amplifier has a high efficiency and low heat generation by comparison with conventional Analog power amplifier. However, In case it is operated continuously by maximum output power, Power dissipation (Pdiss) may exceed package dissipation. Please consider about heat design that Power dissipation (Pdiss) does not exceed Package dissipation (Pd) in average power (Poav). Package dissipation : Pd(W) = (Tjmax - Ta) / ja Power dissipation : Pdiss(W) = Poav x (1/ - 1) Where: Tjmax is the maximum junction temperature=150C, Ta is the peripheral temperature [C] ja is the thermal resistance of package [C /W] Poav is the average power [W] is the efficiency www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 32/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to the power supply or ground line. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 33/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Operational Notes - continued 12. Regarding Input Pins of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 52. Example of Monolithic IC Structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Thermal Shutdown Circuit (TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Over Current Protection Circuit (OCP) This IC has a built-in overcurrent protection circuit that activates when the output is accidentally shorted. However, it is strongly advised not to subject the IC to prolonged shorting of the output. www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 34/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Ordering Information B D 2 8 1 4 Part Number 1 M U V - Package MUV: VQFN032V5050 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagram VQFN032V5050 (TOP VIEW) Part Number Marking D28411 LOT Number 1PIN MARK www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 35/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Physical Dimension, Tape and Reel Information Package Name VQFN032V5050 <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 ) Order quantity needs to be multiple of the minimum quantity. 36/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Datasheet BD28411MUV Revision History Date Revision 29.Oct.2014 001 Changes First version www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 37/37 TSZ02201-0C1C0E900220-1-2 29.Oct.2014 Rev.001 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-GE (c) 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-GE (c) 2013 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001