PIC12F609-I/MS - Microchip Technology

PIC12F609/615/12HV609/615

The PIC12F609/615/12HV609/615 parts you have

received conform functionally to the Device Data Sheet

(DS41302A), except for the anomalies described

below.

None.

Clarifications/Corrections to the Data

Sheet:

In the Device Data Sheet (DS41302A), the following

clarifications and corrections should be noted.

1. Module: 8-Pin Diagram,

PIC12F609/HV609 (PDIP, SOIC,

TSSOP, DFN)

Diagram title – replace TSSOP package with

MSOP package as shown.

(PDIP, SOIC, MSOP, DFN)

2. Module: Table 2: PIC12F615/HV615 Pin

Summary (PDIP, SOIC, TSSOP,

DFN)

Table title – replace TSSOP package with MSOP

package as shown.

(PDIP, SOIC, MSOP, DFN)

PIC12F609/615/12HV609/615 Rev. A Silicon/Data Sheet Errata

PIC12F609/615/12HV609/615

3. Module: REGISTER 6-1: T1CON: TIMER1

CONTROL REGISTER

Bit 1 should read as shown in bold.

4. Module: REGISTER 8-1: CMCON0:

COMPARATOR CONTROL

Bit 0 should read as shown in bold.

5. Module: Comparator Voltage Reference

Under “Section 8.10.3 Output Clamped to VSS”:

Change from:

• VREN = 0

• VRR = 1

•VR<3:0> = 0000

To: • FVREN = 0

6. Module: 17.0 PACKAGING INFORMATION

Replace TSSOP package with MSOP package as

shown.

bit 1 TMR1CS: Timer1 Clock Sourc e Sele ct bit

1 = External clock from T1CKI pin (on the rising edge)

0 = If T1ACS = 1 system clock (FOSC)

= 0 internal cloc k (FOSC/4)

bit 0 CMCH: Comparator C1 Channel Select bit

0 = CMVIN- pin of the Comparator connects to CIN0-

1 = CMVIN- pin of the Comparator connects to CIN1-

8-Lead MSOP

XXXXXX

YWWNNN

Example

602/MS

610017

PIC12F609/615/12HV609/615

8-Lead Plastic Micro Small Outline Package (MS) [MSOP]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM MAX

Number of Pins N 8

Pitch e 0.65 BSC

Overall Height A – – 1.10

Molded Package Thickness A2 0.75 0.85 0.95

Standoff A1 0.00 – 0.15

Overall Width E 4.90 BSC

Molded Package Width E1 3.00 BSC

Overall Length D 3.00 BSC

Foot Length L 0.40 0.60 0.80

Footprint L1 0.95 REF

Foot Angle φ0° – 8°

Lead Thickness c 0.08 – 0.23

Lead Width b 0.22 – 0.40

NOTE 1

L1 L

Microchip Technology Drawing C04-111

PIC12F609/615/12HV609/615

7. Module: 8-Pin Diagram,

PIC12F615/HV615 (PDIP, SOIC,

TSSOP, DFN)

Diagram title – replace TSSOP package with

MSOP package as shown.

(PDIP, SOIC, MSOP, DFN)

8. Module: Table 1: PIC12F609/HV609 Pin

Summary (PDIP, SOIC, TSSOP,

DFN)

Table title – replace TSSOP package with MSOP

package as shown.

(PDIP, SOIC, MSOP, DFN)

9. Module: Figure 2-1: Program Memory

Map and Stack for the

PIC12F609/615/12HV609/615

Wraps to 0000h-07FFh should be:

Wraps to 0000h-03FFh

10. Module: Section 10.4.3 Enha nced PWM

Auto-Shutdown Mode

Last paragraph before Figure 10-10, the part has

no P1C or P1D. The paragraph should read:

The enabled PWM pins are asynchronously

placed in their shutdown states. The state of each

PWM output pin is determined by the PSSAC and

PSSBD bits of the ECCP AS register . Each pin may

be placed into one of three states:

11. Module: Register 10-2: ECCPAS:

Enhanced

Capture/Compare/PWM

Auto-Shutdown Control Re gister

Unimp le me nted bit s are R ead abl e/Writabl e bit s .

U-0 should be R/W-0 for bits 6 and 7.

CONTROL REGISTER

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

ECCPASE ECCPAS2 ECCPAS1 ECCPAS0 PSSAC1 PSSAC0 PSSBD1 PSSBD0

bit 7 bit 0

PIC12F609/615/12HV609/615

REVISION HISTORY

Rev A Document (10/2006)

First revision of this document.

Clarifications/Corrections to the Data Sheet:

Added Modules 1 through 6.

Rev B Document (03/2007)

Clarifications/Corrections to the Data Sheet:

Added Modules 7 through 11; Module 6: Replaced

MSOP Package Drawing.

PIC12F609/615/12HV609/615

NOTES:

Information contained in this publication regarding device

applications a nd t he lik e is provided only for your con ve nience

and may be su perseded by u pda t es . It is y our responsibil ity to

ensure that your application meets with your specifications.

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Trademarks

The Microchip name and logo, the Microchip logo, Accuron,

dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmic ro, PI C START, PRO MATE, PowerSma rt , rfP IC , and

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and The Embedded Control Solutions Company are

registered trademarks of Microchip Technology Incorporated

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Analog-for-the-Digital Age, Application Maestro, CodeGuard,

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In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,

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All other trademarks mentioned herein are property of their

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Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that it s family of products is one of the most secure families of its kind on the market t oday, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data

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• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

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Code protection is c onstantly evolving. We a t Microchip are committed to continuously improving the code protection features of our

products. Attempts to break Microchip’ s code protection f eature may be a violati on of t he Digit al Millennium Copyright Act. If such act s

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Microchip received ISO/TS-16949:2002 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

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Company’s quality system processes and procedures are for its PIC®

MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial

EEPROMs, microperipherals, nonvolatile memory and analog

products. In addition, Microchip’s quality system for the design and

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