Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge
POWER AMPLIFIER FOR BluetoothTM Class 1
GaAs HBT INTEGRATED CIRCUIT
PG2301T5L
Document No. PG10559EJ01V0DS (1st edition)
Date Published April 2005 CP(K)
NEC Compound Semiconductor Devices, Ltd. 2005
DESCRIPTION
The
PG2301T5L is GaAs HBT MMIC for power amplifier which were developed for Bluetooth Class 1.
This device realizes high efficiency, high gain and high output power by using InGaP HBT. This device is housed
in a 12-pin plastic TSQFN package. And this package is able to high-density surface mounting.
FEATURES
• Operation frequency : fopt = 2 400 to 2 500 MHz (2 450 MHz TYP.)
• Supply voltage : VCC1, 2 = Vbias = 2.7 to 3.6 V (3.3 V TYP.)
• Control voltage : Vcont = 0 to 3.6 V (2.5 V TYP.)
: Venable = 0 to 3.1 V (2.9 V TYP.)
• Circuit current : ICC = 120 mA TYP. @ VCC1, 2 = Vbias = 3.3 V, Vcont = 2.5 V, Venable = 2.9 V,
Pin = +4 dBm
• Maximum power : Pout (MAX.) = +23 dBm TYP. @ VCC1, 2 = Vbias = 3.3 V, Vcont = 2.5 V, Venable = 2.9
V,
Pin = +4 dBm
• Gain Control Range : GCR = 23 dB TYP. @ VCC1, 2 = Vbias = 3.3 V, Vcont = 0 to 2.5 V, Venable = 2.9 V,
Pin = +4 dBm
• Power gain : GP = 23 dB TYP. (Reference value)
• High efficiency : PAE = 50% TYP. (Reference value)
• Shut down function
• High-density surface mounting : 12-pin plastic TSQFN package (2.0 2.0 0.37 mm)
APPLICATIONS
• Power Amplifier for Bluetooth Class 1 etc.
ORDERING INFORMATION
Part Number
Order Number
Package
Marking
Supplying Form
PG2301T5L-E2
PG2301T5L-E2-A
12-pin plastic TSQFN
(Pb-Free) Note
2301
Embossed tape 8 mm wide
Pin 10, 11, 12 face the perforation side of the tape
Qty 3 kpcs/reel
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
PG2301T5L-A
Data Sheet PG10559EJ01V0DS
2
PG2301T5L
PIN CONNECTIONS
Pin No.
Pin Name
1
GND (NC)
2
GND
3
OUT/VCC2
4
GND (NC)
5
Venable
6
Vbias
7
VCC1
8
GND
9
IN
10
GND (NC)
11
Vcont
12
GND (NC)
ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Supply Voltage
VCC1, 2
5.5
V
Vbias
Control Voltage
Vcont
3.6
V
Venable
Circuit Current
ICC
400
mA
Control Current
Icont
0.5
mA
Ienable
Power Dissipation
PD
700 Note
mW
Operating Ambient Temperature
TA
40 to +85
C
Storage Temperature
Tstg
55 to +150
C
Input Power
Pin
+10
dBm
Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB, TA = +85C
RECOMMENDED OPERATING RANGE (TA = +25C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Operating Frequency
fopt
2 400
2 450
2 500
MHz
Supply Voltage
VCC1, 2
2.7
3.3
3.6
V
Vbias
Control Voltage
Vcont
0
2.5
3.6
V
Venable
0
2.9
3.1
ELECTRICAL CHARACTERISTICS
Data Sheet PG10559EJ01V0DS
3
PG2301T5L
(TA = +25C, VCC1, 2 = Vbias = 3.3 V, f = 2 450 MHz, External input and output matching, unless
otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current
ICC
Vcont = 2.5 V, Venable = 2.9 V,
Pin = +4 dBm
110
120
130
mA
Shut Down Current
Ishut down
Vcont = 2.5 V, Venable = 0 V,
Pin = +4 dBm
0.1
1.0
A
Output Power 1
Pout1
Vcont = 2.5 V, Venable = 2.9 V,
Pin = +4 dBm
+21
+23
+24.5
dBm
Output Power 2
Pout2
Vcont = 0 V, Venable = 2.9 V,
Pin = +4 dBm
0
+1
dBm
Gain Control Range
GCR
Vcont = 0 to 2.5 V, Venable = 2.9 V,
Pin = +4 dBm
20
23
dB
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25C, VCC1, 2 = Vbias = 3.3 V, f = 2 450 MHz, External input and output matching, unless
otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Efficiency
PAE
Vcont = 2.5 V, Venable = 2.9 V,
Pin = +4 dBm
50
%
Power Gain1
GP1
Vcont = 2.5 V, Venable = 2.9 V,
Pin = 5 dBm
23
dB
Power Gain2
GP2
Vcont = 2.5 V, Venable = 2.9 V,
Pin = +4 dBm
19
dB
Data Sheet PG10559EJ01V0DS
4
PG2301T5L
EVALUATION CIRCUIT (VCC1, 2 = Vbias = 3.3 V, f = 2 450 MHz)
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PG10559EJ01V0DS
5
PG2301T5L
PACKAGE DIMENSIONS
12-PIN PLASTIC TSQFN (UNIT: mm)
Remark ( ) : Reference value
Data Sheet PG10559EJ01V0DS
6
PG2301T5L
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220C or higher : 60 seconds or less
Preheating time at 120 to 180C : 12030 seconds
Maximum number of reflow processes : 3 times
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
IR260
Wave Soldering
Peak temperature (molten solder temperature) : 260C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of flow processes : 1 time
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (terminal temperature) : 350C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10559EJ01V0DS 7
PG2301T5L
Caution GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the
following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
Mouser Electronics
Authorized Distributor
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