LBWA1ZZVK7-539 - MURATA MANUFACTURING

Preliminary Specification Number : SP-ZZVK-F

Preliminary & Confidential

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W-LAN Module Data Sheet

802.11b/g module

Product Part Number: LBWA1ZZVK7-539

Preliminary Specification Number: SP-ZZVK-F

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Revision History

Revision

Code Date Description Comments

- 2011/11/29 First Issue

A 2012/03/02

Updated: 6. Operating Condition

- Operating Temperature Range

- Specification Temperature Range

- Supply Voltage Range

B 2012/03/30 Update: 6. Operating Condition

Remove Specification Temperature Range

D 2012/05/08

Updated: 6. Operating Condition

- Operating Temperature Range

- Specification Temperature Range

E 2012/06/21 Updated: 12. Reference Circuit

- Antenna matching circuit

F 2012/10/31

Updated: 4. Terminal Configuration

Updated: 12. Reference Circuit

Preliminary Specification Number: SP-ZZVK-F

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Notice for Murata Wireless Modules.

Please read the specification including NOTICE (Page20), PRECONDITION TO USE OUR

PRODUCTS (Page23) and Disclaimer (Page24) in this datasheet before using the Murata Wireless

Modules.

TABLE OF CONTENTS

Module Features ............................................................................................................................... 3

1. Scope............................................................................................................................................. 4

2. Part Number .................................................................................................................................. 4

3. Block Diagram ............................................................................................................................... 4

4. Dimensions and Terminal Configurations...................................................................................... 5

5. Rating ............................................................................................................................................ 8

6. Operating Condition ...................................................................................................................... 8

7. Input/Output Terminal Characteristic............................................................................................. 8

8. WLAN Power Up/Down Sequence................................................................................................ 9

8.1 Power Up Sequence .............................................................................................................. 9

9. HOST Interface............................................................................................................................ 10

9.1 Host interface: SPI ............................................................................................................... 10

9.2.1 SPI Clock Switching Characteristic .............................................................................. 10

9.2.2 SPI Data Switching Characteristic.................................................................................11

10. Electrical Characteristics ......................................................................................................... 12

10.1 DC/RF Characteristics for IEEE802.11b.............................................................................. 12

10.2 DC/RF Characteristics for IEEE802.11g.............................................................................. 13

11. Land pattern............................................................................................................................. 14

12. Reference Circuit ..................................................................................................................... 15

13. Evaluation board of LBWA1ZZVK7-TEMP.............................................................................. 17

14. Tape and Reel Packing............................................................................................................ 18

NOTICE........................................................................................................................................... 21

PRECONDITION TO USE OUR PRODUCTS................................................................................ 24

Disclaimer........................................................................................................................................ 25

Please be aware that an important notice concerning availability, standard warranty, and use in critical

applications of Murata products and disclaimers thereto appears at the end of this specification sheet.

Preliminary Specification Number: SP-ZZVK-F

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Module Features

Murata LBWA1ZZVK7 module integrates WLAN function.

WLAN: IEEE 802.11 b, g, compliant.

Typical WLAN Transmit Power (typical):

+19.5dBm at 11Mbps, CCK (11b)

+15.0dBm at 54Mbps, OFDM (11g)

Typical WLAN Sensitivity (typical):

-88dBm at 8% PER, 11Mbps

-74dBm at 10% PER, 54Mbps

Module size: 16.5x11.5mm typical.

Module height: 2.2mm max.

FCC (USA) and IC (Canada) Certification will be supported with mono-pole type antenna.

Murata LBWA1ZZVK7 module consists of the following components

- Texas Instruments CC3000 SoC – WLAN baseband and RF converter

- Clock sources – Both Fast Clock and Slow Clock are integrated.

- Front End Module – A combination of PA and a switch

- Band Pass Filter – Filtering out of band noise and interference

- EEPROM – A non volatile memory

- Power FET switch – minimizing leakage current in shutdown mode. The switching mode power

source provides 3.3V supply for the CC3000 from either battery or MCU the board.

- Level Shifter – Supporting 1.8V and 3.3V Host Interface.

Seamless integration with several Texas Instruments MSP430 and Stellaris processors

SPI host interface for WLAN

RoHS: This module is compliant with the RoHS directive.

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1. Scope

This specification is applied to the IEEE802.11 b/g WLAN module.

Host Interface

- W-LAN : SPI

IC/Firmware

- W-LAN BB/MAC : CC3000

- FEM for CC3000 : TriQuint TQM679002A (E2.6)

Reference Clock : 26MHz Reference Clock is integrated.

Sleep Clock : 32.768kHz oscillator is integrated.

Weight : T.B.D (mg)

MSL : Level3

RoHS : This module is compliant with the RoHS directive.

2. Part Number

Part Number LBWA1ZZVK7-539

3. Block Diagram

2.4GHz

RF Front End

CC3000

(RF/BB/MAC)

BPF

DC-DC

Converter

EEPROM

LDO

FET

Level

Shifter

VBAT

SPI

Sleep CLK

X’tal Osc. (26MHz)

ENABLE

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4. Dimensions and Terminal Configurations

b4 e3

b6 e4

b3 e2

(unit: mm)

Mark Dimensions Mark Dimensions Mark Dimensions

L 16.5 +/- 0.2 W 11.5 +/- 0.2 T 2.20 Max

a1 0.6 +/- 0.1 a2 0.6 +/- 0.1 a3 0.6 +/- 0.1

b1 0.3 +/- 0.2 b2 0.45 +/- 0.200 b3 3.15 +/- 0.200

b4 0.3 +/- 0.2 b5 1.95 +/- 0.20 b6 3.0 +/- 0.2

c1 1.0 +/- 0.1 c2 1.0 +/- 0.1 c3 1.0 +/- 0.1

e1 1.0 +/- 0.1 e2 1.6 +/- 0.1 e3 1.0 +/- 0.1

e4 1.5 +/- 0.1 - - - -

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Terminal configuration

No. Terminal Name Type Power System Connection to

IC Terminal Description

1 GND - - - - - Ground

2 ENABLE I - - FET FET Module Enable Power Supply

Input

3 GND - - - Ground

4 VBAT I - -

FET

LDO

Level

Shift

FET

LDO

Level Shifter

Power Supply Input

5 GND - - - - - Ground

6 GND - - - - - Ground

7 GND - - - - - Ground

8 GND - - - - - Ground

9 WL_RS232_RX I/O WLAN 3000 RS232_Rx Need to connect to FUNC2

10 WL_RS232_TX I/O WLAN 3000 RS232_Tx RS232_Tx

11 WL_EN1 - - - 3000 WL_EN Connect to WL_EN2

12 UART_DBG - - WLAN 3000 WL_UART_DBG Logger

13 WL_EN2 I - WLAN 3000 BT_EN Connect to WL_EN1

14 GND - - - - - Ground

15 GND - - - - - Ground

16 GND - - - - - Ground

17 GND - - - - - Ground

18 SPI_CLK IO - WLAN 3000 SPI_CLK SPI Clock from the host

19 SPI_DI IO - WLAN 3000 SPI_DIN SPI Data-in from the host

20 GND - - - - - Ground

21 SPI_CS IO - WLAN 3000 SPI_CS SPI Chip select

22 SPI_DO IO - WLAN 3000 SPI_DOUT SPI Data-out from the host

23 SPI_IRQ IO - WLAN 3000 SPI_IRQ SPI Interrupt Request

24 GND - - - - - Ground

25 GND - - - - - Ground

26 GND - - - - - Ground

27 FUNC5/NC IO - - 3000 NC NC

28 SCL - - 3000 SCL I2C to EEPROM

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Connect to SCL_EEPROM

29 SDA - - 3000 SDA

I2C to EEPROM

Connect to SDA_EEPROM

30 NS_URAT_DBG

31 FUNC4 IO - - 3000 NS_UARTD Networking subsystem UART

Debug line

32 FUNC2 IO - - 3000 FUNC2 Need to connect to

WL_RS232_RX pin

33 GND - - - - - Ground

34 GND - - - - - Ground

35 SDA_EEPROM - - - Mem

ory EEPROM Connect to SDA pin

36 SCL_EEPROM - - - Mem

ory EEPROM Connect to SCL pin

37 GND 3000 NC (D) NC

38 GND - - - - - Ground

39 GND - - - - - Ground

40 GND Ground

41 GND Ground

42 GND - - - - - Ground

43 GND - - - - - Ground

44 2.4G_ANT I/O - WLAN - - RF transmitter output and RF

receiver input

45 GND - - - - - Ground

46 GND - - - - - Ground

47 GND - - - - - Ground

48 GND - - - - - Ground

GND - - - - - Ground

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5. Rating

Parameter min. max unit

Storage Temperature -40 85 deg.C

Supply Voltage VBAT -0.5 4.5 V

ENABLE -0.5 4.5 V

6. Operating Condition

Parameter min. typ. max unit

Operating Temperature Range -40 -+85 deg.C

Specification Temperature Range -20 +25 +70 deg.C

Supply

Voltage

VBAT 2.7 3.3 3.6 V

ENABLE(ON State) 1.5 3.3 VBAT V

ENABLE (OFF State) 0 -0.3 V

[Note] All RF characteristics in this datasheet are defined by Specification Temperature Range

7. Input/Output Terminal Characteristic

min. max unit

VIH：High-level input voltage 2.0 - V

VIL：Low-level input voltage - 0.8 V

VOH：High-level output voltage VBAT - V

VOL：Low-level output voltage 0 VBAT V

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8. WLAN Power Up/Down Sequence

8.1 Power Up Sequence

The following sequence describes device powerup from shutdown. ENABLE starts the initialization

sequence, and subsequent events are automatic.

Power up requirements:

1. No signals are allowed on the IO pins if no IO power supplied, because the IOs are not 'failsafe'.

Exceptions are SLOWCLK, XTALP and which are failsafe and can tolerate external voltages with no

VDDS and DC2DC.

2. VBAT , VIO, and SLOWCLK must be stable before releasing EN.

The LBWA1ZZVK7 module should activate the power on with only one control enable line from the

MCU. Below is the wake up sequence.

8.2 Power Down Sequence

WL_EN1/WL_EN2

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9. HOST Interface

9.1 Host interface: SPI

9.2 SPI Interface timing

9.2.1 SPI Clock Switching Characteristic

PARAMETER MIN MAX UNIT

fclock Clock frequency,CLK CL ≦10pF 0 48 MHｚ

DC Low/High duty cycle CL ≦10pF 40 60 %

tWL Pulse duration, CLK low CL ≦10pF 5 ns

tWH Pulse duration, CLK high CL ≦10pF 5 ns

tTLH Rise time, CLK CL ≦10pF 4.3 ns

tTHL Fall time, CLK CL ≦10pF 3.5 ns

tISU Setup time, input valid before CLK↑ CL ≦10pF 5 ns

tIH Hold time, input valid after CLK↑ CL ≦10pF 5 ns

tODLY1 Delay time, CLK↓ to output valid CL ≦10pF 4 15 ns

tODLY2 Delay time, CLK↓ to output invalid CL ≦10pF 5 15 ns

SPI Timing

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9.2.2 SPI Data Switching Characteristic

SPI Inter face read

SPI Inter face write

Parameter MIN MAX Unit

tCS Delay time,CS↓to DIN read/write command valid 016 Clock Cycle

tCR Delay time, DIN read command invalid to DOUT/DIN card reponse valid 116 Clock Cycle

tbusy Fixed busy delay till DOUT data valid 1 7 32 Clock Cycle

tEC Delay time, DOUT data invalid to CS↑016 Clock Cycle

tDB Data Block Size 132 Clock Cycle

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10.Electrical Characteristics

10.1 DC/RF Characteristics for IEEE802.11b

11Mbps mode unless otherwise specified. 25deg.C, VBAT=3.6V, ENABLE=1.8V

Items Contents

Specification IEEE802.11b

Mode DSSS / CCK

Frequency 2400 - 2500MHz

Data rate 1, 2, 5.5, 11Mbps

- DC Characteristics - min. typ. max. unit

1. DC current

1) Tx mode - 292 mA

2) Rx mode - 92 mA

- Tx Characteristics - min. typ. max. unit

2. Power Levels +19.5 dBm

3. Spectrum Mask

1) 1st side lobes - - -30 dBr

2) 2nd side lobes - - -50 dBr

4. Power-on and Power-down ramp - - 2 μsec

5. RF Carrier Suppression 15 - dB

6. Modulation Accuracy (EVM) - - 35 %

- Rx Characteristics - min. typ. max. unit

7. Minimum Input Level Sensitivity

1) 11Mbps (FER < 8%) - - -76 dBm

8. Maximum Input Level (FER < 8%) -10 0 - dBm

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10.2 DC/RF Characteristics for IEEE802.11g

54Mbps mode unless otherwise specified. 25deg.C, VBAT=3.6V, ENABLE =1.8V

Items Contents

Specification IEEE802.11g

Mode OFDM

Frequency 2400 - 2483.5MHz

Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps

- DC Characteristics - min. typ. max. unit

1. DC current

1) Tx mode - 180 mA

2) Rx mode - 92 mA

- Tx Characteristics - min. typ. max. unit

2. Power Levels +15 dBm

3. Spectrum Mask

1) at fc +/- 11MHz - -20 dBr

1) at fc +/- 20MHz - -28 dBr

1) at fc +/- 30MHz - -40 dBr

4. Spurious Emissions

1) 30MHz to 1GHz - -36 dBm

2) 1GHz to 12.75GHz - -30 dBm

3) 1.8GHz to 1.9GHz - -47 dBm

4) 5.15GHz to 5.3GHz -47 dBm

5. Constellation Error (EVM) - -25 dB

- Rx Characteristics - min. typ. max. unit

6. Minimum Input Level Sensitivity

1) 54Mbps (PER < 10%) - -65 dBm

7. Maximum Input Level (PER < 10%) -20 - dBm

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11.Land pattern

0.3

1.3

2.9

3.5

4.5

5.1

6.95

8.25

1.9

0.25

1.25

1.75

2.75

4.45

0.2

0.8

1.2

1.8

2.2

2.8

3.2

3.8

4.2

4.8

5.2

5.8

6.2

6.8

7.2

7.8

0.2

0.8

1.2

1.8

2.2

2.8

3.2

(unit : mm)

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12.Reference Circuit

[NOTE

]

In our schematic, pull-up resistors for EEPROM_SCL

and EEPROM_SDA are unnecessary.

However, you can add pull-up resistor for them if

necessary. Our recommend is 10k ohm.

[NOTE 2]

Please DO NOT place 2k ohm resistor between

RS232_RX and FUNC2 as shown in EM board

schematic . EM board has an old version module

which requires 2kOhm while new module does not. If

you place 2kohm, it won’t work.

Please refer [NOTE

]

Please refer [NOTE

]

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13.Evaluation board of LBWA1ZZVK7-TEMP

LBWA1ZZVK7-TEMP Evaluation Module board (EM board) enables a pre-defined interface and form

factor solution for compatibility with other TI microcontroller development boards such as MSP430

Experimenter’s board and Stellaris LM3S9B96-DK. The LBWA1ZZVK7 Module and EM board will

communicate over the SPI interface through the 20pin connector.

Evaluation Module board (EM board ) Part Number LBWA1ZZVK7-TEMP-D

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14.Tape and Reel Packing

(1) Dimensions of Tape (Plastic tape)

(unit : mm)

(2) Dimensions of Reel

R80

R135

120

330

0.2

Label

Reel inside width W1: 25.5±1.0

Reel outside width W2: 29.5±1.0

Unit: mm

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(3) Taping Diagrams

[1] Feeding Hole : As specified in (1)

[2] Hole for chip : As specified in (1)

[3] Cover tape : 62μm in thickness

[4] Base tape : As specified in (1)

(4) Leader and Tail tape

[2]

[3]

[4]

[3]

[1]

Feeding Hole

Chip

Feeding Direction

Tail tape

(No components)

40 to 200mm

Components No components

150mm min.

Leader tape

(Cover tape alone)

250mm min.

Feeding direction

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(5) The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled

toward the user.

(6) The cover tape and base tape are not adhered at no components area for 250mm min.

(7) Tear off strength against pulling of cover tape : 5N min.

(8) Packaging unit : 500pcs./ reel

(9) material : Base tape : Plastic

Real : Plastic

Cover tape, cavity tape and reel are made the anti-static processing.

(10) Peeling of force : 0.7N max. in the direction of peeling as shown below.

(11) Packaging (Humidity proof Packing)

Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant

and the humidity indicator.

165 to 180 °

0.7 N max.

Base tape

Cover tape

湿度

インジケ－タ

乾燥剤

表示ラべル

防湿梱包袋

表示ラベル

Label

Desiccant

Humidity

Indicator

Anti-humidity

Plastic Bag

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NOTICE

Storage Conditions:

Please use this product within 6month after receipt.

- The product shall be stored without opening the packing under the ambient temperature from 5

to 35deg.C and humidity from 20 to 70%RH.

(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)

- The product left more than 6months after reception, it needs to be confirmed the solderbility

before used.

- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).

- Any excess mechanical shock including, but not limited to, sticking the packing materials by

sharp object and dropping the product, shall not be applied in order not to damage the packing

materials.

This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)

- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product

shall be used within 168hours.

- When the color of the indicator in the packing changed, the product shall be baked before

soldering.

Baking condition : 125 +5/-0deg.C, 24hours, 1time

The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape

and Cover Tape) are not heat-resistant.

Handling Conditions :

Be careful in handling or transporting products because excessive stress or mechanical shock may

break products.

Handle with care if products may have cracks or damages on their terminals, the characteristics of

products may change. Do not touch products with bear hands that may result in poor solderability

and destroy by static electrical charge.

Standard PCB Design (Land Pattern and Dimensions) :

All the ground terminals should be connected to the ground patterns. Furthermore, the ground

pattern should be provided between IN and OUT terminals. Please refer to the specifications for the

standard land dimensions.

The recommended land pattern and dimensions is as Murata's standard. The characteristics of

products may vary depending on the pattern drawing method, grounding method, land dimensions,

land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to

verify the characteristics in the actual set. When using non-standard lands, contact Murata

beforehand.

Notice for Chip Placer :

When placing products on the PCB, products may be stressed and broken by uneven forces from a

worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to

follow the specifications for the maintenance of the chip placer being used. For the positioning of

products on the PCB, be aware that mechanical chucking may damage products.

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Soldering Conditions :

The recommendation conditions of soldering are as in the following figure.

When products are immersed in solvent after mounting, pay special attention to maintain the temperature

difference within 100 °C. Soldering must be carried out by the above mentioned conditions to prevent

products from damage. Set up the highest temperature of reflow within 260 ℃.

Contact Murata before use if concerning other soldering conditions.

Reflow soldering standard conditions(Example)

Please use the reflow within 2 times.

Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

Cleaning:

Since this Product is Moisture Sensitive, any cleaning is not permitted.

Within 120s

Pre-heating

time(s)

220 deg.C

Within 60s

Cooling down

Slowly

180 deg.C

150 deg.C

240 to 250 deg.C

Within 3s

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Operational Environment Conditions:

Products are designed to work for electronic products under normal environmental conditions

(ambient temperature, humidity and pressure). Therefore, products have no problems to be used

under the similar conditions to the above-mentioned. However, if products are used under the

following circumstances, it may damage products and leakage of electricity and abnormal

temperature may occur.

- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOxetc.).

- In an atmosphere containing combustible and volatile gases.

- Dusty place.

- Direct sunlight place.

- Water splashing place.

- Humid place where water condenses.

- Freezing place.

If there are possibilities for products to be used under the preceding clause, consult with Murata

before actual use.

As it might be a cause of degradation or destruction to apply static electricity to products, do not

apply static electricity or excessive voltage while assembling and measuring.

Input Power Capacity:

Products shall be used in the input power capacity as specified in this specifications.

Inform Murata beforehand, in case that the components are used beyond such input power capacity

range.

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PRECONDITION TO USE OUR PRODUCTS

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.

Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the

specifications of our product when our product is mounted to your product.

All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that

our product is used for the purpose, under the condition and in the environment specified in this specification. You are

requested not to use our product deviating from the condition and the environment specified in this specification.

Please note that the only warranty that we provide regarding the products is its conformance to the specifications

provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such

products, which are caused under the conditions other than those specified in this specification.

WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,

INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY

ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.

The product shall not be used in any application listed below which requires especially high reliability for the prevention

of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that,

if you use our products in such applications, we will not be responsible for any failure to meet such requirements.

Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,

DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY

FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.

- Aircraft equipment. - Aerospace equipment - Undersea equipment.

- Power plant control equipment - Medical equipment.

- Transportation equipment (vehicles, trains, ships, elevator, etc.).

- Traffic signal equipment. - Disaster prevention / crime prevention equipment.

-Burning / explosion control equipment

- Application of similar complexity and/ or reliability requirements to the applications listed in the above.

We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our

product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by

the regulations and laws in the world.

We do not warrant or represent that any license, either express or implied, is granted under any our patent right,

which our products or services are used. Information provided by us regarding third-party products or services does not

constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such

information may require a license from a third party under the patents or other intellectual property of the third party, or

a license from us under our patents or other intellectual property.

Please do not use our products, our technical information and other data provided by us for the purpose of developing

of mass-destruction weapons and the purpose of military use.

Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",

etc.

Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of

materials and/or components from our suppliers.

By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your

company and that you understand and accept the validity of the contents herein. When you are not able to return the

signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or

approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer

acknowledges that engineering samples may deviate from specifications and may contain defects due to their

development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability

for damages caused by

- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in

the product to be sold by you,

-deviation or lapse in function of engineering sample,

-improper use of engineering samples.

We disclaim any liability for consequential and incidental damages.

If you can’t agree the above contents, you should inquire our sales.

Preliminary Specification Number: SP-ZZVK-D

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Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

Disclaimer

Please read this notice before using the Murata Wireless Modules.

Please note that the only warranty that Murata Manufacturing Co., Ltd. (“MURATA”) provides regarding

our products including but not limited to hardware, software and other materials provided by

MURATA (“PRODUCTS”) is its conformance to the specifications provided herein. Accordingly,

MURATA shall not be responsible for any defects in the PRODUCTS or equipment incorporating

the PRODUCTS, which are caused under the conditions other than those speciﬁed in this

speciﬁcation.

MURATA HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS,

EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS

FOR A PARTICULAR PURPOSE, THAT the PRODUCTS ARE DEFECT-FREE, OR AGAINST

INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.

YOU AGREE TO INDEMNIFY AND DEFEND MURATA AND ITS AFFILIATES AGAINST ALL

CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING

WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF THE

PRODUCTS.

The PRODUCTS is designed and manufactured for general consumer applications, and not for any

particular application, so testing and use of the PRODUCTS shall be conducted at your own risk

and responsibility. Specifically, please observe the following:

i) Please conduct validation and verification of the PRODUCTS in actual condition of mounting

and operating environment before commercial shipment of the equipment.

ii) Please pay attention to minimize any mechanical vibration or shock, not to drop the

PRODUCTS or a substrate that contains the PRODUCTS during transportation.

iii) Since the application of static electricity or overvoltage may cause defect in the PRODUCTS

or deterioration of its reliability, caution must be taken against exposure to any static

electricity generated by electrified items such as work benches, soldering irons, tools,

carrying containers, etc.

iv) Caution shall be taken to avoid overstress to the PRODUCTS during and after the soldering

process.

v) Since the applied soldering method may deteriorate the reliability, thorough evaluation is

recommended.

vi) In case the PRODUCTS is to be used in equipment or electric circuit that requires high safety

or reliability function or performances, sufficient reliability evaluation check for safety shall be

performed before commercial shipment and moreover, due consideration to install a

protective circuit is strongly recommended at customer's design stage. Please provide and

appropriate fail-safe function on your product to prevent any damages that may be caused by

the abnormal function or the failure of the PRODUCTS.

Notwithstanding the foregoing, the PRODUCTS shall not be used in any application listed below

which requires especially high reliability for the prevention of such defect as may directly cause

damage to the third party's life, body or property.

- Aircraft equipment.

- Aerospace equipment

- Undersea equipment.

- Power plant control equipment

- Medical equipment.

- Transportation equipment (vehicles, trains, ships, etc.).

- Traffic signal equipment.

- Disaster prevention / crime prevention equipment.

- Data-processing equipment

- Application of similar complexity and/ or reliability requirements to the applications listed in the

above.

Preliminary Specification Number: SP-ZZVK-D

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Preliminary & Confidential

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

MURATA’s warranty as provided in Clause 1 above that the PRODUCTS comply with descriptions

expressly specified in the specifications shall be effective for a period of six (6) months from the

date of delivery.

MURATA shall not be liable for any defects that occur in dry packed products that are installed more

than six (6) months after shipment.

MURATA’s liability under this warranty shall be limited to the PRODUCTS that are returned during

the warranty period to the address designated by MURATA and that are determined by MURATA

not to conform to such warranty. If MURATA elects to repair or replace the PRODUCTS, MURATA

shall have reasonable time to repair the PRODUCTS or provide replacements. Repaired

PRODUCTS shall be warranted for the remainder of the original warranty period. Replaced

PRODUCTS shall be warranted for a new full warranty period.

For avoidance of doubt, MURATA shall not be liable for any defects that are caused by neglect,

misuse or mistreatment by an entity other than MURATA including improper installation or testing,

or for any PRODUCTS that have been altered or modified in any way by an entity other than

MURATA. Moreover, MURATA shall not be liable for any defects that result from your or third party’s

design, specifications or instructions for the PRODUCTS.

Testing and other quality control techniques are used to the extent MURATA deems necessary. Unless

mandated by government requirements, MURATA does not necessarily test all parameters of

each of the PRODUCTS.

EOL

Please note that we may discontinue the manufacture of the PRODUCTS, due to reasons

such as end of supply of materials and/or components from our suppliers.