DP8420A,DP8421A,DP8422A DP8420A DP8421A DP8422A microCMOS Programmable 256k/1M/4M Dynamic RAM Controller/Drivers Literature Number: SNOSBX7A DP8420A/21A/22A microCMOS Programmable 256k/1M/4M Dynamic RAM Controller/Drivers General Description Features The DP8420A/21A/22A dynamic RAM controllers provide a low cost, single chip interface between dynamic RAM and all 8-, 16- and 32-bit systems. The DP8420A/21A/22A generate all the required access control signal timing for DRAMs. An on-chip refresh request clock is used to automatically refresh the DRAM array. Refreshes and accesses are arbitrated on chip. If necessary, a WAIT or DTACK output inserts wait states into system access cycles, including burst mode accesses. RAS low time during refreshes and RAS precharge time after refreshes and back to back accesses are guaranteed through the insertion of wait states. Separate on-chip precharge counters for each RAS output can be used for memory interleaving to avoid delayed back to back accesses because of precharge. An additional feature of the DP8422A is two access ports to simplify dual accessing. Arbitration among these ports and refresh is done on chip. Y Y of Pins Y of Address (PLCC) Outputs 68 9 DP8421A 68 10 DP8422A 84 11 Y Y Y Y Y e Y Largest DRAM Possible Direct Drive Memory Capacity Access Ports Available 256 kbit 4 Mbytes Single Access Port 1 Mbit 16 Mbytes Single Access Port 4 Mbit 64 Mbytes Dual Access Ports (A and B) bs ol DP8420A Y et Control Y On chip high precision delay line to guarantee critical DRAM access timing parameters microCMOS process for low power High capacitance drivers for RAS, CAS, WE and DRAM address on chip On chip support for nibble, page and static column DRAMs Byte enable signals on chip allow byte writing in a word size up to 32 bits with no external logic Selection of controller speeds: 20 MHz and 25 MHz On board Port A/Port B (DP8422A only)/refresh arbitration logic Direct interface to all major microprocessors (application notes available) 4 RAS and 4 CAS drivers (the RAS and CAS configuration is programmable) Block Diagram O DP8420A/21A/22A DRAM Controller TL/F/8588 - 5 FIGURE 1 TRI-STATEE is a registered trademark of National Semiconductor Corporation. Staggered RefreshTM is a trademark of National Semiconductor Corporation. C1995 National Semiconductor Corporation TL/F/8588 RRD-B30M105/Printed in U. S. A. DP8420A/21A/22A microCMOS Programmable 256k/1M/4M Dynamic RAM Controller/Drivers July 1992 Table of Contents 1.0 INTRODUCTION 6.0 PORT A WAIT STATE SUPPORT 6.1 WAIT Type Output 2.0 SIGNAL DESCRIPTIONS 2.1 Address, R/W and Programming Signals 6.2 DTACK Type Output 2.2 DRAM Control Signals 6.3 Dynamically Increasing the Number of Wait States 2.3 Refresh Signals 6.4 Guaranteeing RAS Low Time and RAS Precharge Time 2.4 Port A Access Signals 7.0 RAS AND CAS CONFIGURATION MODES 2.5 Port B Access Signals (DP8422A) 2.6 Common Dual Port Signals (DP8422A) 7.1 Byte Writing 2.7 Power Signals and Capacitor Input 7.2 Memory Interleaving 2.8 Clock Inputs 7.3 Address Pipelining 7.4 Error Scrubbing 3.0 PROGRAMMING AND RESETTING 7.5 Page/Burst Mode 3.1 External Reset 8.0 TEST MODE 3.2 Programming Methods 9.0 DRAM CRITICAL TIMING PARAMETERS e 3.2.1 Mode Load Only Programming 9.1 Programmable Values of tRAH and tASC 3.2.2 Chip Selected Access Programming 9.2 Calculation of tRAH and tASC 3.3 Internal Programming Modes 10.0 DUAL ACCESSING (DP8422A) 4.1 Access Mode 0 4.2 Access Mode 1 4.3 Extending CAS with Either Access Mode 4.4 Read-Modify-Write Cycles with Either Access Mode 10.1 Port B Access Mode 10.2 Port B Wait State Support 10.3 Common Port A and Port B Dual Port Functions 10.3.1 GRANTB Output 10.3.2 LOCK Input bs ol 4.5 Additional Access Support Features et 4.0 PORT A ACCESS MODES 4.5.1 Address Latches and Column Increment 4.5.2 Address Pipelining 4.5.3 Delay CAS During Write Accesses 11.0 ABSOLUTE MAXIMUM RATINGS 12.0 DC ELECTRICAL CHARACTERISTICS 13.0 AC TIMING PARAMETERS 5.0 REFRESH OPTIONS 14.0 FUNCTIONAL DIFFERENCES BETWEEN THE DP8420A/21A/22A AND THE DP8420/21/22 5.1 Refresh Control Modes 5.1.1 Automatic Internal Refresh 5.1.2 Externally Controlled/Burst Refresh 5.1.3 Refresh Request/Acknowledge 15.0 DP8420A/21A/22A USER HINTS 5.2 Refresh Cycle Types 5.2.1 Conventional Refresh 5.2.2 Staggered RefreshTM 5.2.3 Error Scrubbing Refresh O 5.3 Extending Refresh 5.4 Clearing the Refresh Address Counter 5.5 Clearing the Refresh Request Clock 2 1.0 Introduction The DP8420A/21A/22A are CMOS Dynamic RAM controllers that incorporate many advanced features which include address latches, refresh counter, refresh clock, row, column and refresh address multiplexer, delay line, refresh/access arbitration logic and high capacitive drivers. The programmable system interface allows any manufacturer's microprocessor or bus to directly interface via the DP8420A/21A/22A to DRAM arrays up to 64 Mbytes in size. After power up, the user must first reset and program the DP8420A/21A/22A before accessing the DRAM. The chip is programmed through the address bus. Reset: Due to the differences in power supplies, the internal reset circuit may not always reset correctly; therefore, an External (hardware) Reset must be performed before programming the chip. Programming: After resetting the chip, the user can program the controller by either one of two methods: Mode Load Only Programming or Chip Select Access Programming. Initialization Period: Once the DP8420A/21A/22A has been programmed for the first time, a 60 ms initialization period is entered. During this time the DRC performs refreshes to the DRAM array so further warm up cycles are unnecessary. The initialization period is entered only after the first programming after a reset. Accessing Modes: After resetting and programming the chip, the DP8420A/21A/22A is ready to access the DRAM. There are two modes of accessing with these controllers. Mode 0, which indicates RAS synchronously and Mode 1, which indicates RAS asynchronously. Refresh Modes: The DP8420A/21A/22A have expanded refresh capabilities compared to previous DRAM controllers. There are three modes of refreshing available: Internal Automatic Refreshing, Externally Controlled/Burst Refreshing and Refresh Request/Acknowledge Refreshing. Any of these modes can be used together or separately to achieve the desired results. Refresh Types: These controllers have three types of refreshing available: Conventional, Staggered and Error Scrubbing. Any refresh control mode can be used with any type of refresh. Wait Support: The DP8420A/21A/22A have wait support available as DTACK or WAIT. Both are programmable. DTACK, Data Transfer ACKnowledge, is useful for processors whose wait signal is active high. WAIT is useful for those processors whose wait signal is active low. The user can choose either at programming. These signals are used by the on chip arbiter to insert wait states to guarantee the arbitration between accesses, refreshes and precharge. Both signals are independent of the access mode chosen and both signals can be dynamically delayed further through the WAITIN signal to the DP8420A/21A/22A. Sequential Accesses (Static Column/Page Mode): The DP8420A/21A/22A have address latches, used to latch the bank, row and column address inputs. Once the address is latched, a COLumn INCrement (COLINC) feature can be used to increment the column address. The address latches can also be programmed to be fall through. COLINC can be used for Sequential Accesses of Static Column DRAMs. Also, COLINC in conjunction with ECAS inputs can be used for Sequential Accesses to Page Mode DRAMs. RAS and CAS Configuration (Byte Writing): O bs ol et e The RAS and CAS drivers can be configured to drive a one, two or four bank memory array up to 32 bits in width. The ECAS signals can then be used to select one of four CAS drivers for Byte Writing with no extra logic. Memory Interleaving: When configuring the DP820A/21A/22A for more than one bank, Memory Interleaving can be used. By tying the low order address bits to the bank select lines B0 and B1, sequential back to back accesses will not be delayed since these controllers have separate precharge counters per bank. Address Pipelining: The DP8420A/21A/22A are capable of performing Address Pipelining. In address pipelining, the DRC will guarantee the column address hold time and switch the internal multiplexor to place the row address on the address bus. At this time, another memory access to another bank can be initiated. Dual Accessing: Finally, the DP8422A has all the features previously mentioned and unlike the DP8420A/21A, the DP8422A has a second port to allow a second CPU to access the same memory array. The DP8422A has four signals to support Dual Accessing, these signals are AREQB, ATACKB, LOCK and GRANTB. All arbitration for the two ports and refresh is done on chip by the controller through the insertion of wait states. Since the DP8422A has only one input address bus, the address lines must be multiplexed externally. The signal GRANTB can be used for this purpose. Terminology: The following explains the terminology used in this data sheet. The terms negated and asserted are used. Asserted refers to a ``true'' signal. Thus, ``ECAS0 asserted'' means the ECAS0 input is at a logic 0. The term ``COLINC asserted'' means the COLINC input is at a logic 1. The term negated refers to a ``false'' signal. Thus, ``ECAS0 negated'' means the ECAS0 input is at a logic 1. The term ``COLINC negated'' means the input COLINC is at a logic 0. The table shown below clarifies this terminology. 3 Signal Action Logic Level Active High Asserted High Active High Negated Low Active Low Asserted Low Active Low Negated High e Connection Diagrams TL/F/8588-4 TL/F/8588 - 3 Top View FIGURE 2 et Top View FIGURE 3 Order Number DP8421AV-20 or DP8421AV-25 See NS Package Number V68A O bs ol Order Number DP8420AV-20 or DP8420AV-25 See NS Package Number V68A TL/F/8588 - 2 Top View FIGURE 4 Order Number DP8422AV-20 or DP8422AV-25 See NS Package Number V84A 4 2.0 Signal Descriptions Pin Name Device (If not Applicable to All) Input/ Output Description 2.1 ADDRESS, R/W AND PROGRAMMING SIGNALS DP8422A DP8420A/21A I I ROW ADDRESS: These inputs are used to specify the row address during an access to the DRAM. They are also used to program the chip when ML is asserted (except R10). C0 - 10 C0 - 9 DP8422A DP8420A/21A I I COLUMN ADDRESS: These inputs are used to specify the column address during an access to the DRAM. They are also used to program the chip when ML is asserted (except C10). B0, B1 I BANK SELECT: Depending on programming, these inputs are used to select a group of RAS and CAS outputs to assert during an access. They are also used to program the chip when ML is asserted. ECAS0 - 3 I ENABLE CAS: These inputs are used to enable a single or group of CAS outputs when asserted. In combination with the B0, B1 and the programming bits, these inputs select which CAS output or CAS outputs will assert during an access. The ECAS signals can also be used to toggle a group of CAS outputs for page/nibble mode accesses. They also can be used for byte write operations. If ECAS0 is negated during programming, continuing to assert the ECAS0 while negating AREQ or AREQB during an access, will cause the CAS outputs to be extended while the RAS outputs are negated (the ECASn inputs have no effect during scrubbing refreshes). WIN I WRITE ENABLE IN: This input is used to signify a write operation to the DRAM. If ECAS0 is asserted during programming, the WE output will follow this input. This input asserted will also cause CAS to delay to the next positive clock edge if address bit C9 is asserted during programming. COLINC (EXTNDRF) I I COLUMN INCREMENT: When the address latches are used, and RFIP is negated, this input functions as COLINC. Asserting this signal causes the column address to be incremented by one. When RFIP is asserted, this signal is used to extend the refresh cycle by any number of periods of CLK until it is negated. et bs ol ML e R0 - 10 R0 - 9 I MODE LOAD: This input signal, when low, enables the internal programming register that stores the programming information. O O O DRAM ADDRESS: These outputs are the multiplexed output of the R0 - 9, 10 and C0-9, 10 and form the DRAM address bus. These outputs contain the refresh address whenever RFIP is asserted. They contain high capacitive drivers with 20X series damping resistors. O ROW ADDRESS STROBES: These outputs are asserted to latch the row address contained on the outputs Q0 - 8, 9, 10 into the DRAM. When RFIP is asserted, the RAS outputs are used to latch the refresh row address contained on the Q0 - 8, 9, 10 outputs in the DRAM. These outputs contain high capacitive drivers with 20X series damping resistors. O COLUMN ADDRESS STROBES: These outputs are asserted to latch the column address contained on the outputs Q0 - 8, 9, 10 into the DRAM. These outputs have high capacitive drivers with 20X series damping resistors. O O WRITE ENABLE or REFRESH REQUEST: This output asserted specifies a write operation to the DRAM. When negated, this output specifies a read operation to the DRAM. When the DP8420A/21A/22A is programmed in address pipelining mode or when ECAS0 is negated during programming, this output will function as RFRQ. When asserted, this pin specifies that 13 ms or 15 ms have passed. If DISRFSH is negated, the DP8420A/21A/22A will perform an internal refresh as soon as possible. If DISRFRSH is asserted, RFRQ can be used to externally request a refresh through the input RFSH. This output has a high capacitive driver and a 20X series damping resistor. 2.2 DRAM CONTROL SIGNALS Q0 - 10 Q0 - 9 Q0 - 8 RAS0 - 3 O CAS0 - 3 DP8422A DP8421A DP8421A WE (RFRQ) 5 2.0 Signal Descriptions (Continued) Pin Name Device (If not Applicable to All) Input/ Output Description 2.3 REFRESH SIGNALS RFIP O REFRESH IN PROGRESS: This output is asserted prior to a refresh cycle and is negated when all the RAS outputs are negated for that refresh. RFSH I REFRESH: This input asserted with DISRFRSH already asserted will request a refresh. If this input is continually asserted, the DP8420A/21A/22A will perform refresh cycles in a burst refresh fashion until the input is negated. If RFSH is asserted with DISRFSH negated, the internal refresh address counter is cleared (useful for burst refreshes). DISRFSH I DISABLE REFRESH: This input is used to disable internal refreshes and must be asserted when using RFSH for externally requested refreshes. ADS (ALE) I I ADDRESS STROBE or ADDRESS LATCH ENABLE: Depending on programming, this input can function as ADS or ALE. In mode 0, the input functions as ALE and when asserted along with CS causes an internal latch to be set. Once this latch is set an access will start from the positive clock edge of CLK as soon as possible. In Mode 1, the input functions as ADS and when asserted along with CS, causes the access RAS to assert if no other event is taking place. If an event is taking place, RAS will be asserted from the positive edge of CLK as soon as possible. In both cases, the low going edge of this signal latches the bank, row and column address if programmed to do so. CS I CHIP SELECT: This input signal must be asserted to enable a Port A access. AREQ I ACCESS REQUEST: This input signal in Mode 0 must be asserted some time after the first positive clock edge after ALE has been asserted. When this signal is negated, RAS is negated for the access. In Mode 1, this signal must be asserted before ADS can be negated. When this signal is negated, RAS is negated for the access. O O WAIT or DTACK: This output can be programmed to insert wait states into a CPU access cycle. With R7 negated during programming, the output will function as a WAIT type output. In this case, the output will be active low to signal a wait condition. With R7 asserted during programming, the output will function as DTACK. In this case, the output will be negated to signify a wait condition and will be asserted to signify the access has taken place. Each of these signals can be delayed by a number of positive clock edges or negative clock levels of CLK to increase the microprocessor's access cycle through the insertion of wait states. I WAIT INCREASE: This input can be used to dynamically increase the number of positive clock edges of CLK until DTACK will be asserted or WAIT will be negated during a DRAM access. O WAITIN bs ol WAIT (DTACK) et e 2.4 PORT A ACCESS SIGNALS 6 2.0 Signal Descriptions (Continued) Pin Name Device (If not Applicable to All) Input/ Output Description 2.5 PORT B ACCESS SIGNALS AREQB DP8422A only I PORT B ACCESS REQUEST: This input asserted will latch the row, column and bank address if programmed, and requests an access to take place for Port B. If the access can take place, RAS will assert immediately. If the access has to be delayed, RAS will assert as soon as possible from a positive edge of CLK. ATACKB DP8422A only O ADVANCED TRANSFER ACKNOWLEDGE PORT B: This output is asserted when the access RAS is asserted for a Port B access. This signal can be used to generate the appropriate DTACK or WAIT type signal for Port B's CPU or bus. 2.6 COMMON DUAL PORT SIGNALS DP8422A only O GRANT B: This output indicates which port is currently granted access to the DRAM array. When GRANTB is asserted, Port B has access to the array. When GRANTB is negated, Port A has access to the DRAM array. This signal is used to multiplex the signals R0 - 8, 9, 10; C0 - 8, 9, 10; B0 - 1; WIN; LOCK and ECAS0 - 3 to the DP8422A when using dual accessing. LOCK DP8422A only I LOCK: This input can be used by the currently granted port to ``lock out'' the other port from the DRAM array by inserting wait states into the locked out port's access cycle until LOCK is negated. 2.7 POWER SIGNALS AND CAPACITOR INPUT e GRANTB I POWER: Supply Voltage. GND I GROUND: Supply Voltage Reference. CAP I CAPACITOR: This input is used by the internal PLL for stabilization. The value of the ceramic capacitor should be 0.1 mF and should be connected between this input and ground. et VCC CLK bs ol 2.8 CLOCK INPUTS There are two clock inputs to the DP8420A/21A/22A, CLK and DELCLK. These two clocks may both be tied to the same clock input, or they may be two separate clocks, running at different frequencies, asynchronous to each other. O DELCLK I SYSTEM CLOCK: This input may be in the range of 0 Hz up to 25 MHz. This input is generally a constant frequency but it may be controlled externally to change frequencies or perhaps be stopped for some arbitrary period of time. This input provides the clock to the internal state machine that arbitrates between accesses and refreshes. This clock's positive edges and negative levels are used to extend the WAIT (DTACK) signals. Ths clock is also used as the reference for the RAS precharge time and RAS low time during refresh. All Port A and Port B accesses are assumed to be synchronous to the system clock CLK. I DELAY LINE CLOCK: The clock input DELCLK, may be in the range of 6 MHz to 20 MHz and should be a multiple of 2 (i.e., 6, 8, 10, 12, 14, 16, 18, 20 MHz) to have the DP8420A/21A/22A switching characteristics hold. If DELCLK is not one of the above frequencies the accuracy of the internal delay line will suffer. This is because the phase locked loop that generates the delay line assumes an input clock frequency of a multiple of 2 MHz. For example, if the DELCLK input is at 7 MHz and we choose a divide by 3 (program bits C0- 2) this will produce 2.333 MHz which is 16.667% off of 2 MHz. Therefore, the DP8420A/21A/22A delay line would produce delays that are shorter (faster delays) than what is intended. If divide by 4 was chosen the delay line would be longer (slower delays) than intended (1.75 MHz instead of 2 MHz). (See Section 10 for more information.) This clock is also divided to create the internal refresh clock. 7 3.0 Programming and Resetting Due to the variety in power supplies power-up times, the internal power up reset circuit may not work in every design; therefore, an EXTERNAL RESET must be performed before the DRAM controller can be programmed and used. After going through the reset procedure, the DP8420A/21A/22A can be programmed by either of two methods; Mode Load Only Programming or Chip Select Access Programming. After programming the DRC for the first time after reset, the chip enters a 60 ms initialization period, during this period the controller performs refreshes every 13 ms or 15 ms, this makes further DRAM warm up cycles unnecessary. After this stage the chip can be reprogrammed as many times as the user wishes and the 60 ms period will not be entered into unless the chip is reset and programmed again. During the 60 ms initialization period, RFIP is asserted low and RAS toggles every 13 ms or 15 ms depending on the programming bit for refresh (C3). CAS will be inactive (logic 1) and the ``Q'' outputs will count from 0 to 2047 refreshing the entire DRAM array. The actual initialization time period is given by the following formula. T e 4096* (Clock Divisor Select)* (Refresh Clock Fine Tune)/(DELCLK Frq.) 3.1 EXTERNAL RESET bs ol et e At power up, if the internal power up reset worked, all internal latches and flip-flops are cleared and the part is ready to be programmed. The power up state can also be achieved by performing an External Reset, which is required to insure proper operation. External Reset is achieved by asserting ML and DISRFSH for at least 16 positive clock edges. In order to perform simply a Reset, the ML signal must be negated before DISRFSH is negated as shown in Figure 5a . This procedure will only reset the controller which now is ready for programming. While performing an External Reset, if the user negates DISRFSH at least one clock period before negating ML, as shown in Figure 5b , ML negated will program the DP8420A/21A/22A with the values in R0 - 9, C0 - 9, B0 - 1 and ECAS0. The 60 ms initialization period will be entered since it is the first programming after reset. This is a good way of resetting and programming the part at the same time. Make sure the right programming bits are on the address lines before ML is negated. The DRC may be Reset and programmed any time on the fly, but the user must make sure that No Access or Refresh is in progress. TL/F/8588 - E1 FIGURE 5a. Chip Reset but Not Programmed O FIGURE 5b. Chip Reset and Programmed 8 TL/F/8588 - E2 3.0 Programming and Resetting (Continued) 3.2 PROGRAMMING METHODS 3.2.2 Chip Selected Access Programming To use this method the user asserts ML enabling the internal programming register. After ML is asserted, a valid programming selection is placed on the address bus, B0, B1 and ECAS0 inputs, then ML is negated. When ML is negated the programming bits are latched into the internal programming register and the DP8420A/21A/22A is programmed, see Figure 6 . When programming the chip, the controller must not be refreshing, RFIP must be high (1) to have a successful programming. The chip can also be programmed by performing a chip selected access. To program the chip using this method, ML is asserted, then CS is asserted and a valid programming selection is placed on the address bus. When AREQ is asserted, the programming bits affecting the wait logic become effective immediately, then DTACK is asserted allowing the access to terminate. After the access, ML is negated and the rest of the programming bits take effect. e 3.2.1 Mode Load Only Programming TL/F/8588 - G3 bs ol et FIGURE 6. ML Only Programming O FIGURE 7. CS Access Programming 9 TL/F/8588 - G4 3.0 Programming and Resetting (Continued) 3.3 PROGRAMMING BIT DEFINITIONS Symbol Description Extend CAS/Refresh Request Select 0 The CASn outputs will be negated with the RASn outputs when AREQ (or AREQB, DP8422A only) is negated. The WE output pin will function as write enable. 1 The CASn outputs will be negated, during an acccess (Port A (or Port B, DP8422A only)) when their corresponding ECASn inputs are negated. This feature allows the CAS outputs to be extended beyond the RAS outputs negating. Scrubbing refreshes are NOT affected. During scrubbing refreshes the CAS outputs will negate along with the RAS outputs regardless of the state of the ECAS inputs. The WE output will function as ReFresh ReQuest (RFRQ) when this mode is programmed. B1 Access Mode Select 0 ACCESS MODE 0: ALE pulsing high sets an internal latch. On the next positive edge of CLK, the access (RAS) will start. AREQ will terminate the access. 1 ACCESS MODE 1: ADS asserted starts the access (RAS) immediately. AREQ will terminate the access. B0 Address Latch Mode 0 1 ADS or ALE asserted for Port A or AREQB asserted for Port B with the appropriate GRANT latch the input row, column and bank address. The row, column and bank latches are fall through. C9 Delay CAS during WRITE Accesses 0 1 CAS is treated the same for both READ and WRITE accesses. During WRITE accesses, CAS will be asserted by the event that occurs last: CAS asserted by the internal delay line or CAS asserted on the positive edge of CLK after RAS is asserted. C8 Row Address Hold Time 0 1 Row Address Hold Time e 25 ns minimum Row Address Hold Time e 15 ns minimum C7 Column Address Setup Time 0 1 Column Address Setup Time e 10 ns miniumum Column Address Setup Time e 0 ns minimum C6, C5, C4 RAS and CAS Configuration Modes/Error Scrubbing during Refresh 0, 0, 0 RAS0-3 and CAS0-3 are all selected during an access. ECASn must be asserted for CASn to be asserted. B0 and B1 are not used during an access. Error scrubbing during refresh. RAS and CAS pairs are selected during an access by B1. ECASn must be asserted for CASn to be asserted. B1 e 0 during an access selects RAS0-1 and CAS0 -1. B1 e 1 during an access selects RAS2-3 and CAS2 -3. B0 is not used during an Access. Error scrubbing during refresh. RAS and CAS singles are selected during an access by B0 - 1. ECASn must be asserted for CASn to be asserted. B1 e 0, B0 e 0 during an access selects RAS0 and CAS0. B1 e 0, B0 e 1 during an access selects RAS1 and CAS1. B1 e 1, B0 e 0 during an access selects RAS2 and CAS2. B1 e 1, B0 e 1 during an access selects RAS3 and CAS3. Error scrubbing during refresh. RAS0-3 and CAS0-3 are all selected during an access. ECASn must be asserted for CASn to be asserted. B1, B0 are not used during an access. No error scrubbing. (RAS only refreshing) RAS pairs are selected by B1. CAS0-3 are all selected. ECASn must be asserted for CASn to be asserted. B1 e 0 during an access selects RAS0-1 and CAS0 -3. B1 e 1 during an access selects RAS2-3 and CAS0 -3. B0 is not used during an access. No error scrubbing. et O 0, 1, 0 bs ol 0, 0, 1 e ECAS0 0, 1, 1 1, 0, 0 10 3.0 Programming and Resetting (Continued) 3.3 PROGRAMMING BIT DEFINITIONS (Continued) Symbol Description C6, C5, C4 RAS and CAS Configuration Modes (Continued) 1, 0, 1 RAS and CAS pairs are selected by B1. ECASn must be asserted for CASn to be asserted. B1 e 0 during an access selects RAS0 - 1 and CAS0 -1. B1 e 1 during an access selects RAS2 - 3 and CAS2 -3. B0 is not used during an access. No error scrubbing. RAS singles are selected by B0-1. CAS0 - 3 are all selected. ECASn must be asserted for CASn to be asserted. B1 e 0, B0 e 0 during an access selects RAS0 and CAS0 -3. B1 e 0, B0 e 1 during an access selects RAS1 and CAS0 -3. B1 e 1, B0 e 0 during an access selects RAS2 and CAS0 -3. B1 e 1, B0 e 1 during an access selects RAS3 and CAS0 -3. No error scrubbing. 1, 1, 0 RAS and CAS singles are selected by B0, 1. ECASn must be asserted for CASn to be asserted. B1 e 0, B0 e 0 during an access selects RAS0 and CAS0. B1 e 0, B0 e 1 during an access selects RAS1 and CAS1. B1 e 1, B0 e 0 during an access selects RAS2 and CAS2. B1 e 1, B0 e 1 during an access selects RAS3 and CAS3. No error scrubbing. C3 Refresh Clock Fine Tune Divisor 0 Divide delay line/refresh clock further by 30 (If DELCLK/Refresh Clock Clock Divisor e 2 MHz e 15 ms refresh period). Divide delay line/refresh clock further by 26 (If DELCLK/Refresh Clock Clock Divisor e 2 MHz e 13 ms refresh period). 1 0, 0, 0 0, 0, 1 0, 1, 0 0, 1, 1 1, 0, 0 1, 0, 1 1, 1, 0 1, 1, 1 R9 0 1 R8 Divide DELCLK by 10 to get as close to 2 MHz as possible. Divide DELCLK by 9 to get as close to 2 MHz as possible. Divide DELCLK by 8 to get as close to 2 MHz as possible. Divide DELCLK by 7 to get as close to 2 MHz as possible. Divide DELCLK by 6 to get as close to 2 MHz as possible. Divide DELCLK by 5 to get as close to 2 MHz as possible. Divide DELCLK by 4 to get as close to 2 MHz as possible. Divide DELCLK by 3 to get as close to 2 MHz as possible. Refresh Mode Select RAS0-3 will all assert and negate at the same time during a refresh. Staggered Refresh. RAS outputs during refresh are separated by one positive clock edge. Depending on the configuration mode chosen, either one or two RASs will be asserted. Address Pipelining Select Address pipelining is selected. The DRAM controller will switch the DRAM column address back to the row address after guaranteeing the column address hold time. Non-address pipelining is selected. The DRAM controller will hold the column address on the DRAM address bus until the access RASs are negated. O 0 Delay Line/Refresh Clock Divisor Select bs ol C2, C1, C0 et e 1, 1, 1 1 R7 WAIT or DTACK Select 0 1 WAIT type output is selected. DTACK (Data Transfer ACKnowledge) type output is selected. R6 Add Wait States to the Current Access if WAITIN is Low 0 1 WAIT or DTACK will be delayed by one additional positive edge of CLK. WAIT or DTACK will be delayed by two additional positive edges of CLK. 11 3.0 Programming and Resetting (Continued) 3.3 PROGRAMMING BIT DEFINITIONS (Continued) Symbol Description WAIT/DTACK during Burst (See Section 5.1.2 or 5.2.2) 0, 0 NO WAIT STATES; If R7 e 0 during programming, WAIT will remain negated during burst portion of access. If R7 e 1 programming, DTACK will remain asserted during burst portion of access. 0, 1 1T; If R7 e 0 during programming, WAIT will assert when the ECAS inputs are negated with AREQ asserted. WAIT will negate from the positive edge of CLK after the ECASs have been asserted. If R7 e 1 during programming, DTACK will negate when the ECAS inputs are negated with AREQ asserted. DTACK will assert from the positive edge of CLK after the ECASs have been asserted. (/2T; If R7 e 0 during programming, WAIT will assert when the ECAS inputs are negated with AREQ asserted. WAIT will negate on the negative level of CLK after the ECASs have been asserted. If R7 e 1 during programming, DTACK will negate when the ECAS inputs are negated with AREQ asserted. DTACK will assert from the negative level of CLK after the ECASs have been asserted. 0T; If R7 e 0 during programming, WAIT will assert when the ECAS inputs are negated. WAIT will negate when the ECAS inputs are asserted. If R7 e 1 during programming, DTACK will negate when the ECAS inputs are negated. DTACK will assert when the ECAS inputs are asserted. 1, 0 1, 1 e R5, R4 WAIT/DTACK Delay Times (See Section 5.1.1 or 5.2.1) 0, 0 NO WAIT STATES; If R7 e 0 during programming, WAIT will remain high during non-delayed accesses. WAIT will negate when RAS is negated during delayed accesses. NO WAIT STATES; If R7 e 1 during programming, DTACK will be asserted when RAS is asserted. 0, 1 (/2T; If R7 e 0 during programming, WAIT will negate on the negative level of CLK, after the access RAS. 1T; If R7 e 1 during programming, DTACK will be asserted on the positive edge of CLK after the access RAS. NO WAIT STATES, (/2T; If R7 e 0 during programming, WAIT will remain high during non-delayed accesses. WAIT will negate on the negative level of CLK, after the access RAS, during delayed accesses. (/2T; If R7 e 1 during programming, DTACK will be asserted on the negative level of CLK after the access RAS. 1T; If R7 e 0 during programming, WAIT will negate on the positive edge of CLK after the access RAS. 1(/2T; If R7 e 1 during programming, DTACK will be asserted on the negative level of CLK after the positive edge of CLK after the access RAS. 1, 1 bs ol 1, 0 et R3, R2 RAS Low and RAS Precharge Time 0, 0 RAS asserted during refresh e 2 positive edges of CLK. RAS precharge time e 1 positive edge of CLK. RAS will start from the first positive edge of CLK after GRANTB transitions (DP8422A). 0, 1 RAS asserted during refresh e 3 positive edges of CLK. RAS precharge time e 2 positive edges of CLK. RAS will start from the second positive edge of CLK after GRANTB transitions (DP8422A). 1, 0 RAS asserted during refresh e 2 positive edges of CLK. RAS precharge time e 2 positive edges of CLK. RAS will start from the first positive edge of CLK after GRANTB transitions (DP8422A). 1, 1 RAS asserted during refresh e 4 positive edges of CLK. RAS precharge time e 3 positive edges of CLK. RAS will start from the second positive edge of CLK after GRANTB transitions (DP8422A). O R1, R0 12 4.0 Port A Access Modes first rising edge of clock. If a refresh or a Port B access is in progress or precharge time is required, the controller will wait until these events have taken place and assert RAS (RASs) on the next positive edge of clock. Sometime after the first positive edge of clock after ALE and CS have been asserted, the input AREQ must be asserted. In single port applications, once AREQ is asserted, CS can be negated. On the other hand, ALE can stay asserted several periods of clock; however, ALE must be negated before or during the period of CLK in which AREQ is negated. The controller samples AREQ on the every rising edge of clock after DTACK is asserted. The access will end when AREQ is sampled negated. The DP8420A/21A/22A have two general purpose access modes. Mode 0 RAS synchronous and Mode 1 RAS asynchronous. One of these modes is selected at programming through the B1 input. A Port A access to DRAM is initiated by two input signals: ADS (ALE) and CS. The access is always terminated by one signal: AREQ. These input signals should be synchronous to the input clock. bs ol et e 4.1 ACCESS MODE 0 Mode 0, synchronous access, is selected by negating the input B1 during programming (B1 e 0). To initiate a Mode 0 access, ALE is pulse high and CS is asserted. If precharge time was met, a refresh of DRAM or a Port B access was not in progress, the RAS (RASs) would be asserted on the O FIGURE 8a. Access Mode 0 13 TL/F/8588 - 60 4.0 Port A Access Modes (Continued) en place and assert RAS (RASs) from the next rising edge of clock. When ADS is asserted or sometime after, AREQ must be asserted. At this time, ADS can be negated and AREQ will continue the access. Also, ADS can continue to be asserted after AREQ has been asserted and negated; however, a new access will not start until ADS is negated and asserted again. When address pipelining is not implemented, ADS and AREQ can be tied together. The access will end when AREQ is negated. bs ol et e 4.2 ACCESS MODE 1 Mode 1, asynchronous access, is selected by asserting the input B1 during programming (B1 e 1). This mode allows accesses to start immediately from the access request input, ADS. To initiate a Mode 1 access, CS is asserted followed by ADS asserted. If precharge time was met, a refresh of the DRAM or a Port B access was not in progress, the RAS (RASs) would be asserted from ADS being asserted. If a refresh or Port B access is in progress or precharge time is required, the controller will wait until these events have tak- O FIGURE 8b. Access Mode 1 14 TL/F/8588 - 62 4.0 Port A Access Modes (Continued) with AREQ. If ECAS0 was negated (1) during programming, CAS (CASs) will continue to be asserted after RAS has been negated, given that the appropriate ECAS inputs are asserted. This allows a DRAM to have data present on the data out bus while gaining RAS precharge time. et e 4.3 EXTENDING CAS WITH EITHER ACCESS MODE In both access modes, once AREQ is negated, RAS and DTACK if programmed will be negated. If ECAS0 was asserted (0) during programming, CAS (CASs) will be negated TL/F/8588 - 61 O bs ol FIGURE 9a. Access Mode 0 Extending CAS TL/F/8588 - 63 FIGURE 9b. Access Mode 1 Extending CAS 15 4.0 Port A Access Modes (Continued) 4.4 READ-MODIFY-WRITE CYCLES WITH EITHER ACCESS MODE WIN from negated to asserted in a late write access beThere are 2 methods by which this chip can be used to do read-modify-write access cycles. The first method involves cause here a problem may arise with DATA IN and DATA doing a late write access where the WIN input is asserted OUT being valid at the same time. This may result in a data line trying to drive two different levels simultaneously. The some delay after CAS is asserted. The second method inpage mode method of a read-modify-write access allows volves doing a page mode read access followed by a page the user to have transceivers in the system because the mode write access with RAS held low (see Figure 9c ). data in (read data) is guaranteed to be high impedance durCASn must be toggled using the ECASn inputs and WIN has ing the time the data out (write data) is valid. to be changed from negated to asserted (read to write) bs ol et e while CAS is negated. This method is better than changing *There may be idle states inserted here by the CPU. O FIGURE 9c. Read-Modify-Write Access Cycle 16 TL/F/8588 - G2 4.0 Port A Access Modes (Continued) In Mode 1, the address latches are in fall through mode until ADS is asserted. ADS asserted latches the address. 4.5 ADDITIONAL ACCESS SUPPORT FEATURES To support the different modes of accessing, the DP8420A/21A/22A offer other access features. These additional features include: Address Latches and Column Increment (for page/burst mode support), Address Pipelining, and Delay CAS (to allow the user with a multiplexed bus to ensure valid data is present before CAS is asserted). Once the address is latched, the column address can be incremented with the input COLINC. COLINC can be used for sequential accesses of static column DRAMs. COLINC can also be used with the ECAS inputs to support sequential accesses to page mode DRAMs as shown in Figure 10 . COLINC should only be asserted when the signal RFIP is negated during an access since this input functions as extended refresh when RFIP is asserted. COLINC must be negated (0) when the address is being latched (ADS falling edge in Mode 1). If COLINC is asserted with all of the bits of the column address asserted (ones), the column address will return to zero. bs ol et e 4.5.1 Address Latches and Column Increment The Address Latches can be programmed, through programming bit B0. They can be programmed to either latch the address or remain in a fall-through mode. If the address latches are used to latch the address, the controller will function as follows: In Mode 0, the rising edge of ALE places the latches in fallthrough, once ALE is negated, the address present in the row, column and bank input is latched. TL/F/8588 - C4 FIGURE 10. Column Increment For Port B, if GRANTB is asserted, the address will be latched with AREQB asserted. If GRANTB is negated, the address will latch on the first or second positive edge of CLK after GRANTB is asserted depending on the programming bits R0, R1. O The address latches function differently with the DP8422A. The DP8422A will latch the address of the currently granted port. If Port A is currently granted, the address will be latched as described in Section 4.5.1. If Port A is not granted, and requests an access, the address will be latched on the first or second positive edge of CLK after GRANTB has been negated depending on the programming bits R0, R1. 17 4.0 Port A Access Modes (Continued) During address pipelining in Mode 0, shown in Figure 11c , ALE cannot be pulsed high to start another access until AREQ has been asserted for the previous access for at least one period of CLK. DTACK, if programmed, will be negated once AREQ is negated. WAIT, if programmed to insert wait states, will be asserted once ALE and CS are asserted. In Mode 1, shown in Figure 11d , ADS can be negated once AREQ is asserted. After meeting the minimum negated pulse width for ADS, ADS can again be asserted to start a new access. DTACK, if programmed, will be negated once AREQ is negated. WAIT, if programmed, will be asserted once ADS is asserted. In either mode with either type of wait programmed, the DP8420A/21A/22A will still delay the access for precharge if sequential accesses are to the same bank or if a refresh takes place. et e 4.5.2 Address Pipelining Address pipelining is the overlapping of accesses to different banks of DRAM. If the majority of successive accesses are to a different bank, the accesses can be overlapped. Because of this overlapping, the cycle time of the DRAM accesses are greatly reduced. The DP8420A/21A/22A can be programmed to allow a new row address to be placed on the DRAM address bus after the column address hold time has been met. At this time, a new access can be initiated with ADS or ALE, depending on the access mode, while AREQ is used to sustain the current access. The DP8422A supports address pipelining for Port A only. This mode cannot be used with page, static column or nibble modes of operations because the DRAM column address is switched back to the row address after CAS is asserted. This mode is programmed through address bit R8 (see Figures 11a and 11b ). In this mode, the output WE always functions as RFRQ. TL/F/8588 - G0 bs ol FIGURE 11a. Non-Address Pipelined Mode O FIGURE 11b. Address Pipelined Mode 18 TL/F/8588 - G1 19 FIGURE 11d. Mode 1 Address Pipelining (DTACK 1(/2T Programmed, DTACK is Sampled at the ``T3'' Falling Clock Edge) e et FIGURE 11c. Mode 0 Address Pipelining (WAIT of 0, (/2T Has Been Programmed. WAIT is Sampled at the ``T3'' Falling Clock Edge) bs ol O TL/F/8588 - C6 TL/F/8588 - C5 4.0 Port A Access Modes (Continued) 4.0 Port A Access Modes (Continued) 4.5.3 Delay CAS during Write Accesses 12a and 12b. If the possibility exists that data still may not be present after the first positive edge of CLK, CAS can be delayed further with the ECAS inputs. If address bit C9 is negated during programming, read and write accesses will be treated the same (with regard to CAS). et e Address bit C9 asserted during programming will cause CAS to be delayed until the first positive edge of CLK after RAS is asserted when the input WIN is asserted. Delaying CAS during write accesses ensures that the data to be written to DRAM will be setup to CAS asserting as shown in Figures TL/F/8588 - C7 O bs ol FIGURE 12a. Mode 0 Delay CAS TL/F/8588 - C8 FIGURE 12b. Mode 1 Delay CAS 20 5.0 Refresh Options In every combination of refresh control mode and refresh type, the DP8420A/21A/22A is programmed to keep RAS asserted a number of CLK periods. The time values of RAS low during refresh are programmed through programming bits R0 and R1. The DP8420A/21A/22A support three refresh control mode options: 1. Automatic Internally Controlled Refresh. 2. Externally Controlled/Burst Refresh. 3. Refresh Request/Acknowledge. With each of the control modes above, three types of refresh can be performed. 1. All RAS Refresh. 5.1 REFRESH CONTROL MODES 5.1.1. Automatic Internal Refresh The DP8420A/21A/22A have an internal refresh clock. The period of the refresh clock is generated from the programming bits C0 - 3. Every period of the refresh clock, an internal refresh request is generated. As long as a DRAM access is not currently in progress and precharge time has been met, the internal refresh request will generate an automatic internal refresh. If a DRAM access is in progress, the DP8420A/21A/22A on-chip arbitration logic will wait until the access is finished before performing the refresh. The refresh/access arbitration logic can insert a refresh cycle between two address pipelined accesses. However, the refresh arbitration logic can not interrupt an access cycle to perform a refresh. To enable automatic internally controlled refreshes, the input DISRFSH must be negated. bs ol et e 2. Staggered Refresh. 3. Error Scrubbing During All RAS Refresh. There are three inputs, EXTNDRF, RFSH and DISRFSH, and two outputs, RFIP and RFRQ, associated with refresh. There are also ten programming bits: R0-1, R9, C0 - 6 and ECAS0 used to program the various types of refreshing. Asserting the input EXTNDRF, extends the refresh cycle for a single or multiple integral periods of CLK. The output RFIP is asserted one period of CLK before the first refresh RAS is asserted. If an access is currently in progress, RFIP will be asserted up to one period of CLK before the first refresh RAS, after AREQ or AREQB is negated for the access (see Figure 13 ). The DP8420A/21A/22A will increment the refresh address counter automatically, independent of the refresh mode used. The refresh address counter will be incremented once all the refresh RASs have been negated. TL/F/8588 - F8 Explanation of Terms RFRQ e ReFresh ReQuest internal to the DP8420A/21A/22A. RFRQ has the ability to hold off a pending access. RFSH e Externally requested ReFreSH RFIP e ACIP e ReFresh in Progress Port A or Port B (DP8422A only) ACcess in Progress. This means that either RAS is low for an access or is in the process of transitioning low for an access. O FIGURE 13. DP8420A/21A/22A Access/Refresh Arbitration State Program 21 5.0 Refresh Options (Continued) take place on the next positive edge of CLK as shown in Figure 14a . If an access to DRAM is in progress or precharge time for the last access has not been met, the refresh will be delayed. Since pulsing RFSH low sets a latch, the user does not have to keep RFSH low until the refresh starts. When the last refresh RAS negates, the internal refresh request latch is cleared. e 5.1.2 Externally Controlled/Burst Refresh To use externally controlled/burst refresh, the user must disable the automatic internally controlled refreshes by asserting the input DISRFSH. The user is responsible for generating the refresh request by asserting the input RFSH. Pulsing RFSH low, sets an internal latch, that is used to produce the internal refresh request. The refresh cycle will TL/F/8588 - 64 If the user desires to burst refresh the entire DRAM (all row addresses) he could generate an end of count signal (burst refresh finished) by looking at one of the DP8420A/21A/22A high address outputs (Q7, Q8, Q9 or Q10) and the RFIP output. The Qn outputs function as a decode of how many row addresses have been refreshed (Q7 e 128 refreshes, Q8 e 256 refreshes, Q9 e 512 refreshes, Q10 e 1024 refreshes). bs ol By keeping RFSH asserted past the positive edge of CLK which ends the refresh cycle as shown in Figure 14b , the user will perform another refresh cycle. Using this technique, the user can perform a burst refresh consisting of any number of refresh cycles. Each refresh cycle during a burst refresh will meet the refresh RAS low time and the RAS precharge time (programming bits R0-1). et FIGURE 14a. Single External Refreshes (2 Periods of RAS Low during Refresh Programmed) O FIGURE 14b. External Burst Refresh (2 Periods of RAS Precharge, 2 Periods of Refresh RAS Low during Refresh Programmed) 22 TL/F/8588 - 65 5.0 Refresh Options (Continued) 5.1.3 Refresh Request/Acknowledge The DP8420A/21A/22A can be programmed to output internal refresh requests. When the user programs ECAS0 negated (1) and/or address pipelining mode is selected, the WE output functions as RFRQ. RFRQ (WE) will be asserted by one of two events: First, when the external circuitry pulses low the input RFSH which will request an external refresh. Second, when the internal refresh clock has expired, which signals that another refresh is needed. An example of the first case, where an external refresh is requested while RFRQ is negated (1), is shown in Figure 15a . Notice that RFRQ will be asserted from a positive edge of clock. On the second case, when the RFRQ is asserted from the expiration of the internal refresh clock, the user has two options: First, if DISRFSH is negated, an automatic internal refresh will take place. See Figure 15b . Second, with DISRFSH asserted, RFRQ will stay asserted until RFSH is pulsed low . This option will cause an externally requested/burst refresh to take place. See Figure 15c . bs ol et e RFRQ will go high and then assert (toggle) if additional periods of the internal refresh clock have expired and neither an externally controlled refresh nor an automatically controlled internal refresh have taken place, see Figure 15d . If a time critical event, or long accesses like page/static column mode can not be interrupted, RFRQ pulsing high can be used to increment a counter. This counter can be used to perform a burst refresh of the number of refreshes missed (through the RFSH input). TL/F/8588 - 66 FIGURE 15a. Externally Controlled Single and Burst Refresh with Refresh Request (RFRQ) Output (2 Periods of RAS Low during Refresh Programmed) TL/F/8588 - 67 O FIGURE 15b. Automatic Internal Refresh with Refresh Request (3T of RAS Low during Refresh Programmed) 23 24 e et FIGURE 15d. Refresh Request Timing FIGURE 15c. External Burst Refresh (2 Periods of RAS Precharge, 2 Periods of Refresh RAS Low during Refresh Programmed) bs ol O TL/F/8588 - 68 TL/F/8588 - 65 5.0 Refresh Options (Continued) 5.0 Refresh Options (Continued) 5.2 REFRESH CYCLE TYPES Three different types of refresh cycles are available for use. The three different types are mutually exclusive and can be used with any of the three modes of refresh control. The three different refresh cycle types are: all RAS refresh, staggered RAS refresh and error scrubbing during all RAS refresh. In all refresh cycle types, the RAS precharge time is guaranteed: between the previous access RAS ending and the refresh RAS0 starting; between refresh RAS3 ending and access RAS beginning; between burst refresh RASs. et e 5.2.1 Conventional RAS Refresh A conventional refresh cycle causes RAS0 - 3 to all assert from the first positive edge of CLK after RFIP is asserted as shown in Figure 16 . RAS0 - 3 will stay asserted until the number of positive edges of CLK programmed have passed. On the last positive edge, RAS0 - 3, and RFIP will be negated. This type of refresh cycle is programmed by negating address bit R9 during programming. TL/F/8588 - 69 FIGURE 16. Conventional RAS Refresh bs ol 5.2.2 Staggered RAS Refresh A staggered refresh staggers each RAS or group of RASs by a positive edge of CLK as shown in Figure 17 . The number of RASs, which will be asserted on each positive edge of CLK, is determined by the RAS, CAS configuration mode programming bits C4-C6. If single RAS outputs are selected during programming, then each RAS will assert on successive positive edges of CLK. If two RAS outputs are selected during programming then RAS0 and RAS1 will assert O on the first positive edge of CLK after RFIP is asserted. RAS2 and RAS3 will assert on the second positive edge of CLK after RFIP is asserted. If all RAS outputs were selected during programming, all RAS outputs would assert on the first positive edge of CLK after RFIP is asserted. Each RAS or group of RASs will meet the programmed RAS low time and then negate. TL/F/8588 - 70 FIGURE 17. Staggered RAS Refresh 25 5.0 Refresh Options (Continued) 5.2.3 Error Scrubbing during Refresh The DP8420A/21A/22A support error scrubbing during all RAS DRAM refreshes. Error scrubbing during refresh is selected through bits C4-C6 with bit R9 negated during programming. Error scrubbing can not be used with staggered refresh (see Section 8.0). Error scrubbing during refresh allows a CAS or group of CASs to assert during the all RAS refresh as shown in Figure 18 . This allows data to be read from the DRAM array and passed through an Error Detection And Correction Chip, EDAC. If the EDAC determines that the data contains a single bit error and corrects that error, the refresh cycle can be extended with the input ex- O bs ol et e tend refresh, EXTNDRF, and a read-modify-write operation can be performed by asserting WE. It is the responsibility of the designer to ensure that WE is negated. The DP8422A has a 24-bit internal refresh address counter that contains the 11 row, 11 column and 2 bank addresses. The DP8420A/21A have a 22-bit internal refresh address counter that contains the 10 row, 10 column and 2 bank addresses. These counters are configured as bank, column, row with the row address as the least significant bits. The bank counter bits are then used with the programming selection to determine which CAS or group of CASs will assert during a refresh. TL/F/8588 - 46 FIGURE 18. Error Scrubbing during Refresh 26 5.0 Refresh Options (Continued) 5.4 CLEARING THE REFRESH ADDRESS COUNTER The refresh address counter can be cleared by asserting RFSH while DISRFSH is negated as shown in Figure 20a . This can be used prior to a burst refresh of the entire memory array. By asserting RFSH one period of CLK before DISRFSH is asserted and then keeping both inputs asserted, the DP8420A/21A/22A will clear the refresh address counter and then perform refresh cycles separated by the programmed value of precharge as shown in Figure 20b . An end-of-count signal can be generated from the Q DRAM address outputs of the DP8420A/21A/22A and used to negate RFSH. et e 5.3 EXTENDING REFRESH The programmed number of periods of CLK that refresh RASs are asserted can be extended by one or multiple periods of CLK. Only the all RAS (with or without error scrubbing) type of refresh can be extended. To extend a refresh cycle, the input extend refresh, EXTNDRF, must be asserted before the positive edge of CLK that would have negated all the RAS outputs during the refresh cycle and after the positive edge of CLK which starts all RAS outputs during the refresh as shown in Figure 19 . This will extend the refresh to the next positive edge of CLK and EXTNDRF will be sampled again. The refresh cycle will continue until EXTNDRF is sampled low on a positive edge of CLK. TL/F/8588 - 71 bs ol FIGURE 19. Extending Refresh with the Extend Refresh (EXTNDRF) Input TL/F/8588 - 72 O FIGURE 20a. Clearing the Refresh Address Counter TL/F/8588 - 73 FIGURE 20b. Clearing the Refresh Counter during Burst 27 5.0 Refresh Options (Continued) refresh request clock, the user is guaranteed that an internal refresh request will not be generated for approximately 15 ms, one refresh clock period, from the time RFSH is negated. This action will also clear the refresh address counter. 5.5 CLEARING THE REFRESH REQUEST CLOCK The refresh request clock can be cleared by negating DISRFSH and asserting RFSH for 500 ns, one period of the internal 2 MHz clock as shown in Figure 21 . By clearing the TL/F/8588 - 75 FIGURE 21. Clearing the Refresh Request Clock Counter 6.0 Port A Wait State Support e length of the CPU's access. Once the event has been completed, the DP8420A/21A/22A will allow the access to take place and stop inserting wait states. There are six programming bits, R2 - R7; an input, WAITIN; and an output that functions as WAIT or DTACK. 6.1 WAIT TYPE OUTPUT et With the R7 address bit negated during programming, the user selects the WAIT output. As long as WAIT is sampled asserted by the CPU, wait states (extra clock periods) are inserted into the current access cycle as shown in Figure 22 . Once WAIT is sampled negated, the access cycle is completed by the CPU. WAIT is asserted at the beginning of a chip selected access and is programmed to negate a number of positive edges and/or negative levels of CLK from the event that starts the access. WAIT can also be programmed to function in page/burst mode applications. Once WAIT is negated during an access, and the ECAS inputs are negated with AREQ asserted, WAIT can be programmed to toggle, following the ECAS inputs. Once AREQ is negated, ending the access, WAIT will stay negated until the next chip selected access. For more details about WAIT Type Output, see Application Note AN-773. O bs ol Wait states allow a CPU's access cycle to be increased by one or multiple CPU clock periods. The wait or ready input is named differently by CPU manufacturers. However, any CPU's wait or ready input is compatible with either the WAIT or DTACK output of the DP8420A/21A/22A. The user determines whether to program WAIT or DTACK (R7) and which value to select for WAIT or DTACK (R2, R3) depending upon the CPU used and where the CPU samples its wait input during an access cycle. The decision to terminate the CPU access cycle is directly affected by the speed of the DRAMs used. The system designer must ensure that the data from the DRAMs will be present for the CPU to sample or that the data has been written to the DRAM before allowing the CPU access cycle to terminate. The insertion of wait states also allows a CPU's access cycle to be extended until the DRAM access has taken place. The DP8420A/21A/22A insert wait states into CPU access cycles due to; guaranteeing precharge time, refresh currently in progress, user programmed wait states, the WAITIN signal being asserted and GRANTB not being valid (DP8422A only). If one of these events is taking place and the CPU starts an access, the DP8420A/21A/22A will insert wait states into the access cycle, thereby increasing the TL/F/8588 - 76 FIGURE 22. WAIT Type Output 28 6.0 Port A Wait State Support (Continued) 6.3 DYNAMICALLY INCREASING THE NUMBER OF WAIT STATES 6.2 DTACK TYPE OUTPUT With the R7 address bit asserted during programming, the user selects the DTACK type output. As long as DTACK is sampled negated by the CPU, wait states are inserted into the current access cycle as shown in Figure 23. Once DTACK is sampled asserted, the access cycle is completed by the CPU. DTACK, which is normally negated, is programmed to assert a number of positive edges and/or negative levels from the event that starts RAS for the access. DTACK can also be programmed to function during page/ burst mode accesses. Once DTACK is asserted and the ECAS inputs are negated with AREQ asserted, DTACK can be programmed to negate and assert from the ECAS inputs toggling to perform a page/burst mode operation. Once AREQ is negated, ending the access, DTACK will be negated and stays negated until the next chip selected access. For more details about DTACK type output see Application Note AN-773. bs ol et e The user can increase the number of positive edges of CLK before DTACK is asserted or WAIT is negated. With the input WAITIN asserted, the user can delay DTACK asserting or WAIT negating either one or two more positive edges of CLK. The number of edges is programmed through address bit R6. If the user is increasing the number of positive edges in a delay that contains a negative level, the positive edges will be met before the negative level. For example if the user programmed DTACK of (/2T, asserting WAITIN, programmed as 2T, would increase the number of positive edges resulting in DTACK of 2(/2T as shown in Figure 24a . Similarly, WAITIN can increase the number of positive edges in a page/burst access. WAITIN can be permanently asserted in systems requiring an increased number of wait states. WAITIN can also be asserted and negated, depending on the type of access. As an example, a user could invert the WRITE line from the CPU and connect the output to WAITIN. This could be used to perform write accesses with 1 wait state and read accesses with 2 wait states as shown in Figure 24b . TL/F/8588 - 97 O FIGURE 23. DTACK Type Output TL/F/8588 - C1 FIGURE 24a. WAITIN Example (DTACK is Sampled at the ``T3'' Falling Clock Edge) 29 e 6.0 Port A Wait State Support (Continued) TL/F/8588 - C2 tive edge of CLK counter. AREQ is negated setup to a positive edge of CLK to terminate the access. That positive edge is 1T. The next positive edge is 2T. RAS will not be asserted until the programmed number of positive edges of CLK have passed as shown in Figure 25 . Once the programmed precharge time has been met, RAS will be asserted from the positive edge of CLK. However, since there is a precharge counter per RAS, an access using another RAS will not be delayed. Precharge time before a refresh is always referenced from the access RAS negating before RAS0 for the refresh asserting. After a refresh, precharge time is referenced from RAS3 negating, for the refresh, to the access RAS asserting. O bs ol 6.4 GUARANTEEING RAS LOW TIME AND RAS PRECHARGE TIME The DP8420A/21A/22A will guarantee RAS precharge time between accesses; between refreshes; and between access and refreshes. The programming bits R0 and R1 are used to program combinations of RAS precharge time and RAS low time referenced by positive edges of CLK. RAS low time is programmed for refreshes only. During an access, the system designer guarantees the time RAS is asserted through the DP8420A/21A/22A wait logic. Since inserting wait states into an access increases the length of the CPU signals which are used to create ADS or ALE and AREQ, the time that RAS is asserted can be guaranteed. The precharge time is also guaranteed by the DP8420A/21A/22A. Each RAS output has a separate posi- et FIGURE 24b. WAITIN Example (WAIT is Sampled at the End of ``T2''). TL/F/8588 - C3 FIGURE 25. Guaranteeing RAS Precharge (DTACK is Sampled at the ``T2'' Falling Clock Edge) 30 7.0 RAS and CAS Configuration Modes The DP8420A/21A/22A allow the user to configure the DRAM array to contain one, two or four banks of DRAM. Depending on the functions used, certain considerations must be used when determining how to set up the DRAM array. Programming address bits C4, C5 and C6 along with bank selects, B0-1, and CAS enables, ECAS0-3, determine which RAS or group of RASs and which CAS or group of CASs will be asserted during an access. Different memory schemes are described. The DP8420A/21A/22A is specified driving a heavy load of 72 DRAMs, representing four banks of DRAM with 16-bit words and 2 parity bits. The DP8420A/21A/22A can drive more than 72 DRAMs, but the AC timing must be increased. Since the RAS and CAS outputs are configurable, all RAS and CAS outputs should be used for the maximum amount of drive. 7.1 BYTE WRITING bs ol et e By selecting a configuration in which all CAS outputs are selected during an access, the ECAS inputs enable a single or group of CAS outputs to select a byte (or bytes) in a word size of up to 32 bits. In this case, the RAS outputs are used to select which of up to 4 banks is to be used as shown in Figures 26a and 26b . In systems with a word size of 16 bits, the byte enables can be gated with a high order address bit to produce four byte enables which gives an equivalent to 8 banks of 16-bit words as shown in Figure 26d . If less memory is required, each CAS should be used to drive each nibble in the 16-bit word as shown in Figure 26c . TL/F/8588 - C9 O FIGURE 26a. DRAM Array Setup for 32-Bit System (C6, C5, C4 e 1, 1, 0 during Programming) TL/F/8588 - D0 FIGURE 26b. DRAM Array Setup for 32-Bit, 1 Bank System (C6, C5, C4 e 0, 0, 0 Allowing Error Scrubbing or C6, C5, C4 e 0, 1, 1 No Error Scrubbing during Programming) 31 7.0 RAS and CAS Configuration Modes (Continued) e TL/F/8588 - D1 bs ol et FIGURE 26c. DRAM Array Setup for 16-Bit System (C6, C5, C4 e 1, 1, 0 during Programming) O FIGURE 26d. 8 Bank DRAM Array for 16-Bit System (C6, C5, C4 e 1, 1, 0 during Programming) 32 TL/F/8588 - D2 7.0 RAS and CAS Configuration Modes (Continued) 7.3 ADDRESS PIPELINING Memory interleaving allows the cycle time of DRAMs to be reduced by having sequential accesses to different memory banks. Since the DP8420A/21A/22A have separate precharge counters per bank, sequential accesses will not be delayed if the accessed banks use different RAS outputs. To ensure different RAS outputs will be used, a mode is selected where either one or two RAS outputs will be asserted during an access. The bank select or selects, B0 and B1, are then tied to the least significant address bits, causing a different group of RASs to assert during each sequential access as shown in Figure 27 . In this figure there should be at least one clock period of all RAS's negated between different RAS's being asserted to avoid the condition of a CAS before RAS refresh cycle. Address pipelining allows several access RASs to be asserted at once. Because RASs can overlap, each bank requires either a mode where one RAS and one CAS are used per bank as shown in Figure 28a or where two RASs and two CASs are used per bank as shown in Figure 28b . Byte writing can be accomplished in a 16-bit word system if two RASs and two CASs are used per bank. In other systems, WEs (or external gating on the CAS outputs) must be used to perform byte writing. If WEs are used separate data in and data out buffers must be used. If the array is not layed out this way, a CAS to a bank can be low before RAS, which will cause a refresh of the DRAM, not an access. To take full advantage of address pipelining, memory interleaving is used. To memory interleave, the least significant address bits should be tied to the bank select inputs to ensure that all ``back to back'' sequential accesses are not delayed, since different memory banks are accessed. bs ol et e 7.2 MEMORY INTERLEAVING O FIGURE 27. Memory Interleaving (C6, C5, C4 e 1, 1, 0 during Programming) 33 TL/F/8588 - D3 7.0 RAS and CAS Configuration Modes (Continued) TL/F/8588 - D4 et e FIGURE 28a. DRAM Array Setup for 4 Banks Using Address Pipelining (C6, C5, C4 e 1, 1, 1 or C6, C5, C4 e 0, 1, 0 (Also Allowing Error Scrubbing) during Programming) TL/F/8588 - D5 FIGURE 28b. DRAM Array Setup for Address Pipelining with 2 Banks (C6, C5, C4 e 1, 0, 1 or C6, C5, C4 e 0, 0, 1 (Also Allowing Error Scrubbing) during Programming) as words. Since the CAS signals are not used to select individual bytes, the ECAS inputs can be tied low as shown in Figures 29a and 29b . bs ol 7.4 ERROR SCRUBBING In error scrubbing during refresh, the user selects one, two or four RAS and CAS outputs per bank. When performing error detection and correction, memory is always accessed TL/F/8588 - D6 O FIGURE 29a. DRAM Array Setup for 4 Banks Using Error Scrubbing (C6, C5, C4 e 0, 1, 0 during Programming) TL/F/8588 - D7 FIGURE 29b. DRAM Array Setup for Error Scrubbing with 2 Banks (C6, C5, C4 e 0, 0, 1 during Programming) 34 7.0 RAS and CAS Configuration Modes (Continued) 7.5 PAGE/BURST MODE In a static column, page or burst mode system, the least significant bits must be tied to the column address in order to ensure that the page/burst accesses are to sequential memory addresses, as shown in Figure 30. In a nibble mode system, the least significant bits must be tied to the highest column and row address bits in order to ensure that sequential address bits are the ``nibble'' bits for nibble mode accesses (Figure 30) . The ECAS inputs may then be tog- et e gled with the DP8420A/21A/22A's address latches in fallthrough mode, while AREQ is asserted. The ECAS inputs can also be used to select individual bytes. When using nibble mode DRAMS, the third and fourth address bits can be tied to the bank select inputs to perform memory interleaving. In page or static column modes, the two address bits after the page size can be tied to the bank select inputs to select a new bank if the page size is exceeded. TL/F/8588 - D8 bs ol *See table below for row, column & bank address bit map. A0, A1 are used for byte addressing in this example. Addresses Page Mode/Static Column Mode Page Size Nibble Mode* 256 Bits/Page 512 Bits/Page 1024 Bits/Page 2048 Bits/Page Column Address C9,R9 e A2,A3 C0 - 8 e X C0 - 7 e A2- 9 C8 - 10 e X C0- 8 e A2- 10 C9,10 e X C0- 9 e A2- 11 C10 e X C0- 10 e A2- 12 Row Address X X X X X B0 B1 A4 A5 A10 A11 A11 A12 A12 A13 A13 A14 Assume that the least significant address bits are used for byte addressing. Given a 32-bit system A0,A1 would be used for byte addressing. X e DON'T CARE, the user can do as he pleases. *Nibble mode values for R and C assume a system using 1 Mbit DRAMs. O FIGURE 30. Page, Static Column, Nibble Mode System 35 8.0 Test Mode Staggered refresh in combination with the error scrubbing mode places the DP8420A/21A/22A in test mode. In this mode, the 24-bit refresh counter is divided into a 13-bit and 11-bit counter. During refreshes both counters are incremented to reduce test time. 9.2 CALCULATION OF tRAH AND tASC There are two clock inputs to the DP8420A/21A/22A. These two clocks, DELCLK and CLK can either be tied together to the same clock or be tied to different clocks running asynchronously at different frequencies. The clock input, DELCLK, controls the internal delay line and refresh request clock. DELCLK should be a multiple of 2 MHz. If DELCLK is not a multiple of 2 MHz, tRAH and tASC will change. The new values of tRAH and tASC can be calculated by the following formulas: If tRAH was programmed to equal 15 ns then tRAH e 30*(((DELCLK Divisor)* 2 MHz/(DELCLK Frequency))b1) a 15 ns. If tRAH was programmed to equal 25 ns then tRAH e 30*(((DELCLK Divisor)* 2 MHz/(DELCLK Frequency))b1) a 25 ns. If tASC was programmed to equal 0 ns then tASC e 15* ((DELCLK Divisor)* 2 MHz/(DELCLK Frequency)) b 15 ns. If tASC was programmed to equal 10 ns then tASC e 25* ((DELCLK Divisor)* 2 MHz/(DELCLK Frequency)) b 15 ns. Since the values of tRAH and tASC are increased or decreased, the time to CAS asserted will also increase or decrease. These parameters can be adjusted by the following formula: Delay to CAS e Actual Spec. a Actual tRAH b Programmed tRAH a Actual tASC b Programmed tASC. 9.0 DRAM Critical Timing Parameters et bs ol 9.1 PROGRAMMABLE VALUES OF tRAH AND tASC The DP8420A/21A/22A allow the values of tRAH and tASC to be selected at programming time. For each parameter, two choices can be selected. tRAH, the row address hold time, is measured from RAS asserted to the row address starting to change to the column address. The two choices for tRAH are 15 ns and 25 ns, programmable through address bit C8. tASC, the column address setup time, is measured from the column address valid to CAS asserted. The two choices for tASC are 0 ns and 10 ns, programmable through address bit C7. e The two critical timing parameters, shown in Figure 31 , that must be met when controlling the access timing to a DRAM are the row address hold time, tRAH, and the column address setup time, tASC. Since the DP8420A/21A/22A contain a precise internal delay line, the values of these parameters can be selected at programming time. These values will also increase and decrease if DELCLK varies from 2 MHz. O FIGURE 31. tRAH and tASC 36 TL/F/8588 - E3 10.0 Dual Accessing (DP8422A) 10.1 PORT B ACCESS MODE Port B accesses are initiated from a single input, AREQB. When AREQB is asserted, an access request is generated. If GRANTB is asserted and a refresh is not taking place or precharge time is not required, RAS will be asserted when AREQB is asserted. Once AREQB is asserted, it must stay asserted until the access is over. AREQB negated, negates RAS as shown in Figure 32b . Note that if ECAS0 e 1 during programming the CAS outputs may be held asserted (beyond RASn negating) by continuing to assert the appropriate ECASn inputs (the same as Port A accesses). If Port B is not granted, the access will begin on the first or second positive edge of CLK after GRANTB is asserted (See R0, R1 programming bit definitions) as shown in Figure 32c , assuming that Port A is not accessing the DRAM (CS, ADS/ ALE and AREQ) and RAS precharge for the particular bank e has completed. It is important to note that for GRANTB to transition to Port B, Port A must not be requesting an access at a rising clock edge (or locked) and Port B must be requesting an access at that rising clock edge. Port A can request an access through CS and ADS/ALE or CS and AREQ. Therefore during an interleaved access where CS and ADS/ALE become asserted before AREQ from the previous access is negated, Port A will retain GRANTB e 0 whether AREQB is asserted or not. Since there is no chip select for Port B, AREQB must incorporate this signal. This mode of accessing is similar to Mode 1 accessing for Port A. The DP8422A has all the functions previously described. In addition to those features, the DP8422A also has the capabilities to arbitrate among refresh, Port A and a second port, Port B. This allows two CPUs to access a common DRAM array. DRAM refresh has the highest priority followed by the currently granted port. The ungranted port has the lowest priority. The last granted port will continue to stay granted even after the access has terminated, until an access request is received from the ungranted port (see Figure 32a ). The dual access configuration assumes that both Port A and Port B are synchronous to the system clock. If they are not synchronous to the system clock they should be externally synchronized (Ex. By running the access requests through several Flip-Flops, see Figure 34a ). TL/F/8588 - F9 Explanation of Terms AREQA e Chip Selected access request from Port A Chip Selected access request from Port B LOCK e Externally controlled LOCKing of the Port that is currently GRANTed. et AREQB e bs ol FIGURE 32a. DP8422A Port A/Port B Arbitration State Diagram. This arbitration may take place during the ``ACCESS'' or ``REFRESH'' state (see Figure 13a ). TL/F/8588 - E4 O FIGURE 32b. Access Request for Port B TL/F/8588 - E5 FIGURE 32c. Delayed Port B Access 37 10.0 Dual Accessing (DP8422A) (Continued) Port A or Port B to lock out the other port from the DRAM. When a Port is locked out of the DRAM, wait states will be inserted into its access cycle until it is allowed to access memory. GRANTB is used to multiplex the input control signals and addresses to the DP8422A. 10.2 PORT B WAIT STATE SUPPORT Advanced transfer acknowledge for Port B, ATACKB, is used for wait state support for Port B. This output will be asserted when RAS for the Port B access is asserted, as shown in Figures 33a and 33b . Once asserted, this output will stay asserted until AREQB is negated. With external logic, ATACKB can be made to interface to any CPU's wait input as shown in Figure 33c . 10.3.1 GRANTB Output The output GRANTB determines which port has current access to the DRAM array. GRANTB asserted signifies Port B has access. GRANTB negated signifies Port A has access to the DRAM array. et e 10.3 COMMON PORT A AND PORT B DUAL PORT FUNCTIONS An input, LOCK, and an output, GRANTB, add additional functionality to the dual port arbitration logic. LOCK allows TL/F/8588 - E6 bs ol FIGURE 33a. Non-Delayed Port B Access TL/F/8588 - E7 O FIGURE 33b. Delayed Port B Access B. Extend ATACK to 1T after RAS goes low. TL/F/8588-30 A. Extend ATACK to (/2T ((/2 Clock) after RAS goes low. TL/F/8588 - 32 C. Synchronize ATACKB to CPU B Clock. This is useful if CPU B runs asynchronous to the DP8422. FIGURE 33c. Modifying Wait Logic for Port B 38 TL/F/8588 - 31 10.0 Dual Accessing (DP8422A) (Continued) the DRAM array, the GRANTB output will transition from a rising clock edge from AREQ or AREQB negating and will precede the RAS for the access by one or two clock periods. GRANTB will then stay in this state until the other port requests an access and the currently granted port is not accessing the DRAM as shown in Figure 34b . bs ol et e Since the DP8422A has only one set of address inputs, the signal is used, with the addition of buffers, to allow the currently granted port's addresses to reach the DP8422A. The signals which need to be bufferred are R0-10, C0 - 10, B0 - 1, ECAS0 - 3, WE, and LOCK. All other inputs are not common and do not have to be buffered as shown in Figure 34a. If a Port, which is not currently granted, tries to access *If Port B is synchronous the Request Synchronizing logic will not be required. O FIGURE 34a. Dual Accessing with the DP8422A (System Block Diagram) 39 TL/F/8588 - 55 bs ol et e 10.0 Dual Accessing (DP8422A) (Continued) TL/F/8588 - 29 FIGURE 34b. Wait States during a Port B Access 10.3.2 LOCK Input refreshes, it only keeps GRANTB in the same state even if the other port requests an access, as shown in Figure 35a . LOCK can be used by either port. O When the LOCK input is asserted, the currently granted port can ``lock out'' the other port through the insertion of wait states to that port's access cycle. LOCK does not disable TL/F/8588 - E8 FIGURE 35. LOCK Function 40 11.0 Absolute Maximum Ratings (Note 1) All Input or Output Voltage If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/Distributors for availability and specifications. with Respect to GNDAAAAAAAAAAAAAAAAAAAb0.5V to a 7V Power Dissipation @ 20 MHzAAAAAAAAAAAAAAAAAAAAAAA0.5W ESD Rating to be determined. Temperature under Bias AAAAAAAAAAAAAAAAAAA0 C to a 70 C Storage Temperature AAAAAAAAAAAAAAAAAb65 C to a 150 C 12.0 DC Electrical Characteristics TA e 0 C to a 70 C, VCC e 5V g 10%, GND e 0V Symbol Parameter Conditions Min VIH Logical 1 Input Voltage Tested with a Limited Functional Pattern VIL Logical 0 Input Voltage Tested with a Limited Functional Pattern VOH1 Q and WE Outputs IOH e b10 mA VOL1 Q and WE Outputs IOL e 10 mA VOH2 All Outputs except Qs, WE IOH e b3 mA VOL2 All Outputs except Qs, WE IOL e 3 mA IIN Input Leakage Current VIN e VCC or GND IIL ML ML Input Current (Low) VIN e GND ICC1 Standby Current CLK at 8 MHz (VIN e VCC or GND) ICC1 Standby Current ICC1 ICC2 ICC2 CIN* Max Units 2.0 VCC a 0.5 V b 0.5 0.8 V VCC b 1.0 V 0.5 VCC b 1.0 V V 0.5 V 10 mA e b 10 mA 6 15 mA CLK at 20 MHz (VIN e VCC or GND) 8 17 mA Standby Current CLK at 25 MHz (VIN e VCC or GND) 10 20 mA Supply Current CLK at 8 MHz (Inputs Active) (ILOAD e 0) (VIN e VCC or GND) 20 40 mA Supply Current CLK at 20 MHz (Inputs Active) (ILOAD e 0) (VIN e VCC or GND) 40 75 mA Supply Current CLK at 25 MHz (Inputs Active) (ILOAD e 0) (VIN e VCC or GND) 50 95 mA Input Capacitance fIN at 1 MHz 10 pF et 200 bs ol ICC2 Typ O *CIN is not 100% tested. 41 13.0 AC Timing Parameters 300 - 315 Mode 0 access parameters used in both single and dual access applications Two speed selections are given, the DP8420A/21A/22A-20 and the DP8420A/21A/22A-25. The differences between the two parts are the maximum operating frequencies of the input CLKs and the maximum delay specifications. Low frequency applications may use the ``b25'' part to gain improved timing. The AC timing parameters are grouped into sectional numbers as shown below. These numbers also refer to the timing diagrams. 1 - 36 Common parameters to all modes of operation 50 - 56 Difference parameters used to calculate; RAS low time, RAS precharge time, CAS high time and CAS low time 100 - 121 Common dual access parameters used for Port B accesses and inputs and outputs used only in dual accessing 200 - 212 Refresh parameters 400 - 416 Mode 1 access parameters used in both single and dual access applications 450 - 455 Special Mode 1 access parameters which supersede the 400 - 416 parameters when dual accessing 500 - 506 Programming parameters Unless otherwise stated VCC e 5.0V g 10%, 0 k TA k 70 C, the output load capacitance is typical for 4 banks of 18 DRAMs per bank, including trace capacitance (see Note 2). Two different loads are specified: CL e 50 pF loads on all outputs except 150 pF loads on Q0 - 8, 9, 10 and WE; or 50 pF loads on all outputs except 125 pF loads on RAS0 - 3 and CAS0 -3 and 380 pF loads on Q0 - 8, 9, 10 and WE. e CL e CH e CH e CH e Note 1: ``Absolute Maximum Ratings'' are the values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The table of ``Electrical Characteristics'' provides conditions for actual device operation. bs ol Note 3: AC Production testing is done at 50 pF. et Note 2: Input pulse 0V to 3V; tR e tF e 2.5 ns. Input reference point on AC measurements is 1.5V. Output reference points are 2.4V for High and 0.8V for Low. TL/F/8588 - E9 O FIGURE 36. Clock, DELCLK Timing 42 13.0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5.0V g 10%, 0 C k TA k 70 C, the output load capacitance is typical for 4 banks of 18 DRAMs per bank, including trace capacitance (Note 2). Two different loads are specified: CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8, 9, 10 and WE; or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8, 9, 10 and WE. 8420A/21A/22A-20 Number Symbol Common Parameter Description CL 8420A/21A/22A-25 CH CL CH Min Max Min Max Min Max Min Max 20 0 20 0 25 0 25 1 fCLK CLK Frequency 0 2 tCLKP CLK Period 50 50 40 3, 4 tCLKPW CLK Pulse Width 15 15 12 5 fDCLK DELCLK Frequency 5 20 5 20 5 20 5 20 6 tDCLKP DELCLK Period 50 200 50 200 50 200 50 200 7, 8 tDCLKPW DELCLK Pulse Width 15 9a tPRASCAS0 RAS Asserted to CAS Asserted (tRAH e 15 ns, tASC e 0 ns) 30 9b tPRASCAS1 RAS Asserted to CAS Asserted (tRAH e 15 ns, tASC e 10 ns) 40 9c tPRASCAS2 (RAS Asserted to CAS Asserted (tRAH e 25 ns, tASC e 0 ns) 40 40 40 40 9d tPRASCAS3 (RAS Asserted to CAS Asserted (tRAH e 25 ns, tASC e 10 ns) 50 50 50 50 10a tRAH Row Address Hold Time (tRAH e 15) 15 15 15 15 10b tRAH Row Address Hold Time (tRAH e 25) 25 25 25 25 tASC Column Address Setup Time (tASC e 0) 0 0 0 0 tASC Column Address Setup Time (tASC e 10) 10 10 10 10 tPCKRAS CLK High to RAS Asserted following Precharge 27 32 22 26 tPARQRAS AREQ Negated to RAS Negated 38 43 31 35 tPENCL ECAS0-3 Asserted to CAS Asserted 23 31 20 27 tPENCH ECAS0-3 Negated to CAS Negated 25 33 20 27 tPARQCAS AREQ Negated to CAS Negated 60 68 47 54 tPCLKWH CLK to WAIT Negated 39 39 31 31 tPCLKDL0 CLK to DTACK Asserted (Programmed as DTACK of 1/2, 1, 1(/2 or if WAITIN is Asserted) 33 33 28 28 44 44 36 36 11b 12 13 14 15 16 17 e 12 30 30 30 40 40 40 et O 18 12 12 bs ol 11a 15 40 19 tPEWL ECAS Negated to WAIT Asserted during a Burst Access 20 tSECK ECAS Asserted Setup to CLK High to Recognize the Rising Edge of CLK during a Burst Access 24 43 24 19 19 13.0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5.0V g 10%, 0 C k TA k 70 C, the output load capacitance is typical for 4 banks of 18 DRAMs per bank, including trace capacitance (Note 2). Two different loads are specified: CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8, 9, 10 and WE; or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8, 9, 10 and WE. 8420A/21A/22A-20 Number Symbol Common Parameter Description CL Min 21 tPEDL 8420A/21A/22A-25 CH Max Min CL Max Min CH Max Min Max ECAS Asserted to DTACK Asserted during a Burst Access (Programmed as DTACK0) 48 48 38 38 ECAS Negated to DTACK Negated during a Burst Access 49 49 38 38 22 tPEDH 23 tSWCK WAITIN Asserted Setup to CLK 24 tPWINWEH WIN Asserted to WE Asserted 34 25 tPWINWEL WIN Negated to WE Negated 34 26 tPAQ Row, Column Address Valid to Q0-8, 9, 10 Valid 29 27 tPCINCQ COLINC Asserted to Q0-8, 9, 10 Incremented 28 tSCINEN COLINC Asserted Setup to ECAS Asserted to Ensure tASC e 0 ns 29a tSARQCK1 AREQ, AREQB Negated Setup to CLK High with 1 Period of Precharge 29b tSARQCK2 AREQ, AREQB Negated Setup to CLK High with l1 Period of Precharge Programmed 30 tPAREQDH AREQ Negated to DTACK Negated 31 tPCKCAS CLK High to CAS Asserted when Delayed by WIN 32 tSCADEN Column Address Setup to ECAS Asserted to Guarantee tASC e 0 14 15 14 16 33 tWCINC COLINC Pulse Width 20 20 20 20 34a tPCKCL0 CLK High to CAS Asserted following Precharge (tRAH e 15 ns, tASC e 0 ns) 81 89 72 79 34b tPCKCL1 CLK High to CAS Asserted following Precharge (tRAH e 15 ns, tASC e 10 ns) 91 99 82 89 34c tPCKCL2 CLK High to CAS Asserted following Precharge (tRAH e 25 ns, tASC e 0 ns) 91 99 82 89 34d tPCKCL3 CLK High to CAS Asserted following Precharge (tRAH e 25 ns, tASC e 10 ns) 101 109 92 99 35 tCAH Column Address Hold Time (Interleave Mode Only) 36 tPCQR CAS Asserted to Row Address Valid (Interleave Mode Only) 5 5 5 27 37 e 44 44 27 37 38 26 35 et 5 34 43 30 19 17 19 46 46 37 37 O bs ol 18 19 19 15 34 34 27 27 31 39 25 32 32 32 90 44 15 39 32 90 32 90 90 13.0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5.0V g 10%, 0 C k TA k 70 C, the output load capacitance is typical for 4 banks of 18 DRAMs per bank, including trace capacitance (Note 2). Two different loads are specified: CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8, 9, 10 and WE; or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8, 9, 10 and WE. 8420A/21A/22A-20 Number Symbol Difference Parameter Description CL Min 50 tD1 8420A/21A/22A-25 CH Max Min CL Max Min CH Max Min Max (AREQ or AREQB Negated to RAS Negated) Minus (CLK High to RAS Asserted) 16 16 14 14 tD2 (CLK High to Refresh RAS Negated) Minus (CLK High to RAS Asserted) 13 13 11 11 52 tD3a (ADS Asserted to RAS Asserted (Mode 1)) Minus (AREQ Negated to RAS Negated) 4 4 4 4 4 53 tD3b (CLK High to RAS Asserted (Mode 0)) Minus (AREQ Negated to RAS Negated) 54 tD4 (ECAS Asserted to CAS Asserted) Minus (ECAS Negated to CAS Negated) e 51 7 55 tD5 (CLK to Refresh RAS Asserted) Minus (CLK to Refresh RAS Negated) 6 6 6 6 56 tD6 (AREQ Negated to RAS Negated) Minus (ADS Asserted to RAS Asserted (Mode 1)) 12 12 10 10 7 b7 7 4 b7 7 O bs ol et b7 4 45 b7 4 13.0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5.0V g 10%, 0 C k TA k 70 C, the output load capacitance is typical for 4 banks of 18 DRAMs per bank, including trace capacitance (Note 2). Two different loads are specified: CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8, 9, 10 and WE; or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8, 9, 10 and WE. 8420A/21A/22A-20 Number Symbol Common Dual Access Parameter Description CL Min 8420A/21A/22A-25 CH Max Min CL Max 3 Min CH Max 3 Min Max 100 tHCKARQB AREQB Negated Held from CLK High 3 101 tSARQBCK AREQB Asserted Setup to CLK High 8 102 tPAQBRASL AREQB Asserted to RAS Asserted 43 48 37 41 103 tPAQBRASH AREQB Negated to RAS Negated 41 46 32 36 105 tPCKRASG CLK High to RAS Asserted for Pending Port B Access 55 60 44 48 106 tPAQBATKBL AREQB Asserted to ATACKB Asserted 57 57 45 45 107 tPCKATKB CLK High to ATACKB Asserted for Pending Access 67 67 51 51 108 tPCKGH CLK High to GRANTB Asserted 40 40 32 32 109 tPCKGL CLK High to GRANTB Negated 35 35 29 29 110 tSADDCKG Row Address Setup to CLK High That Asserts RAS following a GRANTB Change to Ensure tASR e 0 ns for Port B 11 15 11 16 5 5 5 5 7 7 et e 8 3 111 tSLOCKCK LOCK Asserted Setup to CLK Low to Lock Current Port 112 tPAQATKBH AREQ Negated to ATACKB Negated 113 tPAQBCASH AREQB Negated to CAS Negated 114 tSADAQB 116 117 118a tPAQBCAS0 AREQB Asserted to CAS Asserted (tRAH e 15 ns, tASC e 0 ns) 103 111 87 94 118b tPAQBCAS1 AREQB Asserted to CAS Asserted (tRAH e 15 ns, tASC e 10 ns) 113 121 97 104 118c tPAQBCAS2 AREQB Asserted to CAS Asserted (tRAH e 25 ns, tASC e 0 ns) 113 121 97 104 118d tPAQBCAS3 AREQB Asserted to CAS Asserted (tRAH e 25 ns, tASC e 10 ns) 123 131 107 114 120a tPCKCASG0 CLK High to CAS Asserted for Pending Port B Access (tRAH e 15 ns, tASC e 0 ns) 113 121 96 103 CLK High to CAS Asserted for Pending Port B Access (tRAH e 15 ns, tASC e 10 ns) 123 131 106 113 CLK High to CAS Asserted for Pending Port B Access (tRAH e 25 ns, tASC e 0 ns) 123 131 106 113 CLK High to CAS Asserted for Pending Port B Access (tRAH e 25 ns, tASC e 10 ns) 133 141 116 123 120c 120d 121 21 21 67 47 54 bs ol 26 59 Address Valid Setup to AREQB Asserted 7 11 7 12 tHCKARQG AREQ Negated Held from CLK High 5 5 5 5 tWAQB AREQB High Pulse Width to Guarantee tASR e 0 ns 31 35 26 31 O 120b 26 tPCKCASG1 tPCKCASG2 tPCKCASG3 tSBADDCKG Bank Address Valid Setup to CLK High That Starts RAS for Pending Port B Access 10 46 10 10 10 et e 13.0 AC Timing Parameters (Continued) TL/F/8588 - F0 O bs ol FIGURE 37. 100: Dual Access Port B TL/F/8588 - F1 FIGURE 38. 100: Port A and Port B Dual Access 47 13.0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5.0V g 10%, 0 C k TA k 70 C, the output load capacitance is typical for 4 banks of 18 DRAMs per bank, including trace capacitance (Note 2). Two different loads are specified: CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8, 9, 10 and WE; or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8, 9, 10 and WE. 8420A/21A/22A-20 Number Symbol Refresh Parameter Description CL Min 8420A/21A/22A-25 CH Max Min CL Max Min CH Max Min Max 200 tSRFCK RFSH Asserted Setup to CLK High 27 27 22 22 201 tSDRFCK DISRFSH Asserted Setup to CLK High 28 28 22 22 202 tSXRFCK EXTENDRF Setup to CLK High 15 15 12 204 tPCKRFL CLK High to RFIP Asserted 39 39 31 205 tPARQRF AREQ Negated to RFIP Asserted 62 62 50 50 206 tPCKRFH CLK High to RFIP Negated 65 65 51 51 207 tPCKRFRASH CLK High to Refresh RAS Negated 35 40 29 33 208 tPCKRFRASL CLK High to Refresh RAS Asserted 28 209a tPCKCL0 CLK High to CAS Asserted during Error Scrubbing (tRAH e 15 ns, tASC e 0 ns) 82 209d tPCKCL2 CLK High to CAS Asserted during Error Scrubbing (tRAH e 15 ns, tASC e 10 ns) CLK High to CAS Asserted during Error Scrubbing (tRAH e 25 ns, tASC e 0 ns) e 23 27 90 73 80 et 209c tPCKCL1 tPCKCL3 31 33 92 100 83 90 92 100 83 90 93 100 bs ol 209b 12 CLK High to CAS Asserted during Error Scrubbing (tRAH e 25 ns, tASC e 10 ns) 102 210 tWRFSH RFSH Pulse Width 211 tPCKRQL CLK High to RFRQ Asserted 46 15 46 15 40 15 40 212 tPCKRQH CLK High to RFRQ Negated 50 50 40 40 O 15 110 TL/F/8588 - F2 FIGURE 39. 200: Refresh Timing 48 13.0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5.0V g 10%, 0 C k TA k 70 C, the output load capacitance is typical for 4 banks of 18 DRAMs per bank, including trace capacitance (Note 2). Two different loads are specified: CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8, 9, 10 and WE; or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8, 9, 10 and WE. 8420A/21A/22A-20 Number Symbol Mode 0 Access Parameter Description CL Min 8420A/21A/22A-25 CH Max Min CL Max Min CH Max Min tSCSCK CS Asserted to CLK High 14 14 13 13 301a tSALECKNL ALE Asserted Setup to CLK High Not Using On-Chip Latches or if Using On-Chip Latches and B0, B1, Are Constant, Only 1 Bank 16 16 15 15 ALE Asserted Setup to CLK High, if Using On-Chip Latches if B0, B1 Can Change, More Than One Bank 29 29 29 29 18 13 13 20 18 18 15 11 16 301b tSALECKL tWALE ALE Pulse Width 18 303 tSBADDCK Bank Address Valid Setup to CLK High 20 304 tSADDCK Row, Column Valid Setup to CLK High to Guarantee tASR e 0 ns 11 306 307 308a 308b 308c 308d 309 310 311 tSRCBAS Row, Column, Bank Address Held from ALE Negated (Using On-Chip Latches) Row, Column, Bank Address Setup to ALE Negated (Using On-Chip Latches) 10 10 8 8 3 3 2 2 tPCKRL CLK High to RAS Asserted 27 32 22 26 tPCKCL0 CLK High to CAS Asserted (tRAH e 15 ns, tASC e 0 ns) 81 89 72 79 tPCKCL1 CLK High to CAS Asserted (tRAH e 15 ns, tASC e 10 ns) 91 99 82 89 tPCKCL2 CLK High to CAS Asserted (tRAH e 25 ns, tASC e 0 ns) 91 99 82 89 tPCKCL3 CLK High to CAS Asserted (tRAH e 25 ns, tASC e 10 ns) 101 109 92 99 tHCKALE ALE Negated Hold from CLK High 0 0 0 0 tSWINCK WIN Asserted Setup to CLK High to Guarantee CAS is Delayed b 21 b 21 b 16 b 16 tPCSWL CS Asserted to WAIT Asserted 26 26 22 22 tPCSWH CS Negated to WAIT Negated 30 30 25 25 O 312 tHASRCB bs ol 305 et 302 Max e 300 313 tPCLKDL1 CLK High to DTACK Asserted (Programmed as DTACK0) 40 40 32 32 314 tPALEWL ALE Asserted to WAIT Asserted (CS is Already Asserted) 35 35 29 29 315 316 AREQ Negated to CLK High That Starts Access RAS to Guarantee tASR e 0 ns (Non-Interleaved Mode Only) tPCKCV0 CLK High to Column Address Valid (tRAH e 15 ns, tASC e 0 ns) 41 45 78 49 34 87 39 66 75 bs ol et e 13.0 AC Timing Parameters (Continued) O FIGURE 40. 300: Mode 0 Timing 50 TL/F/8588 - F3 bs ol et e 13.0 AC Timing Parameters (Continued) (Programmed as C4 e 1, C5 e 1, C6 e 1) O FIGURE 41. 300: Mode 0 Interleaving 51 TL/F/8588 - F4 13.0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5.0V g 10%, 0 C k TA k 70 C, the output load capacitance is typical for 4 banks of 18 DRAMs per bank, including trace capacitance (Note 2). Two different loads are specified: CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8, 9, 10 and WE; or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8, 9, 10 and WE. 8420A/21A/22A-20 Number Symbol Mode 1 Access Parameter Description CL Min 8420A/21A/22A-25 CH Max Min CL Max Min CH Max Min 400a tSADSCK1 ADS Asserted Setup to CLK High 15 15 13 13 400b tSADSCKW ADS Asserted Setup to CLK (to Guarantee Correct WAIT or DTACK Output; Doesn't Apply for DTACK0) 31 31 25 25 6 401 tSCSADS CS Setup to ADS Asserted 402 tPADSRL ADS Asserted to RAS Asserted 30 35 5 25 5 29 403a tPADSCL0 ADS Asserted to CAS Asserted (tRAH e 15 ns, tASC e 0 ns) 86 94 75 82 403b tPADSCL1 ADS Asserted to CAS Asserted (tRAH e 15 ns, tASC e 10 ns) 96 403c tPADSCL2 ADS Asserted to CAS Asserted (tRAH e 25 ns, tASC e 0 ns) 96 403d tPADSCL3 ADS Asserted to CAS Asserted (tRAH e 25 ns, tASC e 10 ns) 404 tSADDADS Row Address Valid Setup to ADS Asserted to Guarantee tASR e 0 ns 405 tHCKADS ADS Negated Held from CLK High 406 tSWADS WAITIN Asserted Setup to ADS Asserted to Guarantee DTACK0 Is Delayed e 6 Max 85 92 104 85 92 et 104 106 114 95 13 9 14 0 0 0 0 bs ol 9 0 0 0 0 407 tSBADAS Bank Address Setup to ADS Asserted 11 11 11 11 408 tHASRCB Row, Column, Bank Address Held from ADS Asserted (Using On-Chip Latches) 10 10 10 10 409 tSRCBAS Row, Column, Bank Address Setup to ADS Asserted (Using On-Chip Latches) 3 3 2 2 410 tWADSH ADS Negated Pulse Width 12 16 12 17 411 tPADSD ADS Asserted to DTACK Asserted (Programmed as DTACK0) 412 tSWINADS WIN Asserted Setup to ADS Asserted (to Guarantee CAS Delayed during Writes Accesses) 43 O b 10 43 b 10 35 b 10 102 35 b 10 413 tPADSWL0 ADS Asserted to WAIT Asserted (Programmed as WAIT0, Delayed Access) 35 35 29 29 414 tPADSWL1 ADS Asserted to WAIT Asserted (Programmed WAIT 1/2 or 1) 35 35 29 29 415 tPCLKDL1 CLK High to DTACK Asserted (Programmed as DTACK0, Delayed Access) 40 40 32 32 416 417 AREQ Negated to ADS Asserted to Guarantee tASR e 0 ns (Non Interleaved Mode Only) tPADSCV0 38 ADS Asserted to Column Address Valid (tRAH e 15 ns, tASC e 0 ns) 42 83 52 31 92 36 69 78 bs ol et e 13.0 AC Timing Parameters (Continued) O FIGURE 42. 400: Mode 1 Timing 53 TL/F/8588 - F5 bs ol et e 13.0 AC Timing Parameters (Continued) O FIGURE 43. 400: COLINC Page/Static Column Access Timing 54 TL/F/8588 - F6 13.0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5.0V g 10%, 0 C k TA k 70 C, the output load capacitance is typical for 4 banks of 18 DRAMs per bank, including trace capacitance (Note 2). Two different loads are specified: CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8, 9, 10 and WE; or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8, 9, 10 and WE. 8420A/21A/22A-20 Number Symbol Mode 1 Dual Access Parameter Description CL Min 450 tSADDCKG Row Address Setup to CLK High That Asserts RAS following a GRANTB Port Change to Ensure tASR e 0 ns 8420A/21A/22A-25 CH Max 11 Min CL Max 15 Min CH Max 11 Min Max 16 tPCKRASG CLK High to RAS Asserted for Pending Access 48 53 38 42 452 tPCLKDL2 CLK to DTACK Asserted for Delayed Accesses (Programmed as DTACK0) 53 53 43 43 453a tPCKCASG0 CLK High to CAS Asserted for Pending Access (tRAH e 15 ns, tASC e 0 ns) 453d 454 tPCKCASG3 86 93 111 119 96 103 CLK High to CAS Asserted for Pending Access (tRAH e 25 ns, tASC e 0 ns) 111 119 96 103 CLK High to CAS Asserted for Pending Access (tRAH e 25 ns, tASC e 10 ns) 121 129 106 113 CLK High to CAS Asserted for Pending Access (tRAH e 15 ns, tASC e 10 ns) tSBADDCKG Bank Address Valid Setup to CLK High that Asserts RAS for Pending Access 5 5 4 4 tSADSCK0 ADS Asserted Setup to CLK High 12 12 11 11 O 455 tPCKCASG2 109 et 453c tPCKCASG1 101 bs ol 453b e 451 55 13.0 AC Timing Parameters (Continued) Unless otherwise stated VCC e 5.0V g 10%, 0 C k TA k 70 C, the output load capacitance is typical for 4 banks of 18 DRAMs per bank, including trace capacitance (Note 2). Two different loads are specified: CL e 50 pF loads on all outputs except CL e 150 pF loads on Q0-8, 9, 10 and WE; or CH e 50 pF loads on all outputs except CH e 125 pF loads on RAS0 - 3 and CAS0 -3 and CH e 380 pF loads on Q0 - 8, 9, 10 and WE. 8420A/21A/22A-20 Number Symbol Programming Parameter Description CL Min 8420A/21A/22A-25 CH Max 8 Min Max 8 CL Min 7 CH Max Min 500 tHMLADD Mode Address Held from ML Negated 501 tSADDML Mode Address Setup to ML Negated 6 6 6 6 502 tWML ML Pulse Width 15 15 15 15 503 tSADAQML Mode Address Setup to AREQ Asserted 504 tHADAQML Mode Address Held from AREQ Asserted 505 tSCSARQ 506 tSMLARQ Max 7 0 0 0 51 38 38 CS Asserted Setup to AREQ Asserted 6 6 6 6 ML Asserted Setup to AREQ Asserted 10 e 0 51 10 10 bs ol et 10 O FIGURE 44. 500: Programming 56 TL/F/8588 - F7 wrap board) because they may be needed. The value of these damping resistors (if needed) will vary depending upon the output, the capacitance of the load, and the characteristics of the trace as well as the routing of the trace. The value of the damping resistor also may vary between the wire-wrap board and the printed circuit board. To determine the value of the series damping resistor it is recommended to use an oscilloscope and look at the furthest DRAM from the DP8420A/21A/22A. The undershoot of RAS, CAS, WE and the addresses should be kept to less than 0.5V below ground by varying the value of the damping resistor. The damping resistors should be placed as close as possible with short leads to the driver outputs of the DP8420A/21A/22A. 5. The circuit board must have a good VCC and ground plane connection. If the board is wire-wrapped, the VCC and ground pins of the DP8420A/21A/22A, the DRAM associated logic and buffer circuitry must be soldered to the VCC and ground planes. 6. The traces from the DP8420A/21A/22A to the DRAM should be as short as possible. 7. ECAS0 should be held low during programming if the user wishes that the DP8420A/21A/22A be compatible with a DP8420/21/22 design. 8. Parameter Changes due to Loading All A.C. parameters are specified with the equivalent load capacitances, including traces, of 64 DRAMs organized as 4 banks of 18 DRAMs each. Maximums are based on worst-case conditions. If an output load changes then the A.C. timing parameters associated with that particular output must be changed. For example, if we changed our output load to C e 250 pF loads on RAS0 - 3 and CAS0 -3 C e 760 pF loads on Q0 - 9 and WE we would have to modify some parameters (not all calculated here) $308a clock to CAS asserted (tRAH e 15 ns, tASC e 0 ns) A ratio can be used to figure out the timing change per change in capacitance for a particular parameter by using the specifications and capacitances from heavy and light load timing. 14.0 Functional Differences between the DP8420A/21A/22A and the DP8420/21/22 e 1. Extending the Column Address Strobe (CAS) after AREQ Transitions High The DP8420A/21A/22A allows CAS to be asserted for an indefinite period of time beyond AREQ (or AREQB, DP8422A only. Scrubbing refreshes are not affected.) being negated by continuing to assert the appropriate ECAS inputs. This feature is allowed as long as the ECAS0 input was negated during programming. The DP8420/21/22 does not allow this feature. 2. Dual Accessing The DP8420A/21A/22A asserts RAS either one or two clock periods after GRANTB has been asserted or negated depending upon how the R0 bit was programmed during the mode load operation. The DP8420/21/22 will always start RAS one clock period after GRANTB is asserted or negated. The above statements assume that RAS precharge has been completed by the time GRANTB is asserted or negated. 3. Refresh Request Output (RFRQ) bs ol et The DP8420A/21A/22A allows RFRQ (refresh request) to be output on the WE output pin given that ECAS0 was negated during programming or the controller was programmed to function in the address pipelining (memory interleaving) mode. The DP8420/21/22 only allows RFRQ to be output during the address pipelining mode. 4. Clearing the Refresh Request Clock Counter The DP8420A/21A/22A allows the internal refresh request clock counter to be cleared by negating DISRFSH and asserting RFSH for at least 500 ns. The DP8420/21/22 clears the internal refresh request clock counter if DISRFSH remains low for at least 500 ns. Once the internal refresh request clock counter is cleared the user is guaranteed that an internally generated RFRQ will not be generated for at least 13 ms - 15 ms (depending upon how programming bits C0, 1, 2, 3 were programmed). 15.0 DP8420A/21A/22A User Hints 1. All inputs to the DP8420A/21A/22A should be tied high, low or the output of some other device. Ratio e $308a w/Heavy Load b $308a w/Light Load CH(CAS) b CL(CAS) 79 ns b 72 ns 7 ns e 125 pF b 50 pF 75 pF $308a (actual) e (capacitance difference c ratio) a $308a (specified) 7 ns e (250 pF b 125 pF) a 79 ns 75 pF e 11.7 ns a 79 ns e 90.7 ns @ 250 pF load 9. It is required that the user perform a hardware reset of the DP8420A/21A/22A before programming and using the chip. A hardware reset consists of asserting both ML and DISRFSH for a minimum of 16 positive edges of CLK, see Section 3.1. Note: One signal is active high. COLINC (EXTNDRF) should be tied low to disable. e O 2. Each ground on the DP8420A/21A/22A must be decoupled to the closest on-chip supply (VCC) with 0.1 mF ceramic capacitor. This is necessary because these grounds are kept separate inside the DP8420A/21A/22A. The decoupling capacitors should be placed as close as possible with short leads to the ground and supply pins of the DP8420A/21A/22A. 3. The output called ``CAP'' should have a 0.1 mF capacitor to ground. 4. The DP8420A/21A/22A has 20X series damping resistors built into the output drivers of RAS, CAS, address and WE/RFRQ. Space should be provided for external damping resistors on the printed circuit board (or wire- 57 Lit. Y 103064 bs ol et e Plastic Chip Carrier (V) Order Number DP8420AV-20, DP8420AV-25, DP8421AV-20 or DP8421AV-25 NS Package Number V68A Plastic Chip Carrier (V) Order Number DP8422AV-20 or DP8422AV-25 NS Package Number V84A LIFE SUPPORT POLICY NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: O DP8420A/21A/22A microCMOS Programmable 256k/1M/4M Dynamic RAM Controller/Drivers Physical Dimensions inches (millimeters) 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. National Semiconductor Corporation 1111 West Bardin Road Arlington, TX 76017 Tel: 1(800) 272-9959 Fax: 1(800) 737-7018 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. National Semiconductor Europe Fax: (a49) 0-180-530 85 86 Email: cnjwge @ tevm2.nsc.com Deutsch Tel: (a49) 0-180-530 85 85 English Tel: (a49) 0-180-532 78 32 Fran3ais Tel: (a49) 0-180-532 93 58 Italiano Tel: (a49) 0-180-534 16 80 National Semiconductor Hong Kong Ltd. 13th Floor, Straight Block, Ocean Centre, 5 Canton Rd. Tsimshatsui, Kowloon Hong Kong Tel: (852) 2737-1600 Fax: (852) 2736-9960 National Semiconductor Japan Ltd. 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