BP 104 FAS
1Version 1.4 | 2018-08-22
Produktdatenblatt | Version 1.1
www.osram-os.com
BP 104 FAS
DIL SMT
Silicon PIN Photodiode with Daylight Blocking Filter
Applications
—LIDAR, Pre-Crash, ACC —Rain Sensors
Features:
—Package: black epoxy
—Quali󰘰cations: The product quali󰘰cation test plan is based on the guidelines of AEC-Q101-REV-C,
Stress Test Quali󰘰cation for Automotive Grade Discrete Semiconductors.
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
—Especially suitable for applications from 730 nm to 1100 nm
—Short switching time (typ. 20 ns)
—Suitable for SMT
Ordering Information
Type Photocurrent Photocurrent Ordering Code
typ.
Ee = 1 mW/cm²;
λ
= 870 nm; VR = 5 V Ee = 1 mW/cm²;
λ
= 870 nm; VR = 5 V
IPIP
BP 104 FAS-Z ≥ 25 µA 34 µA Q65110A2672
BP 104 FAS
2Version 1.4 | 2018-08-22
Maximum Ratings
TA = 25 °C
Parameter Symbol Values
Operating Temperature Top min.
max.
-40 °C
100 °C
Storage temperature Tstg min.
max.
-40 °C
100 °C
Reverse voltage VRmax. 20 V
Total power dissipation Ptot max. 150 mW
ESD withstand voltage
acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM
VESD max. 2 kV
BP 104 FAS
3Version 1.4 | 2018-08-22
Characteristics
TA = 25 °C
Parameter Symbol Values
Wavelength of max sensitivity
λ
S max typ. 880 nm
Spectral range of sensitivity
λ
10% typ. 730 ... 1100
nm
Radiant sensitive area A typ. 4.84 mm²
Dimensions of active chip area L x W typ. 2.2 x 2.2
mm x mm
Half angle
φ
typ. 60 °
Dark current
VR = 10 V
IRtyp.
max.
2 nA
30 nA
Spectral sensitivity of the chip
λ
= 870 nm
S
λ
typ. 0.63 A / W
Quantum yield of the chip
λ
= 870 nm
η
typ. 0.90 Electrons
/ Photon
Open-circuit voltage
Ee = 0.5 mW/cm²;
λ
= 870 nm
VOmin.
typ.
250 mV
330 mV
Short-circuit current
Ee = 0.5 mW/cm²;
λ
= 870 nm
ISC typ. 16 µA
Rise time
VR = 5 V; RL = 50 Ω;
λ
= 850 nm
trtyp. 0.02 µs
Fall time
VR = 5 V; RL = 50 Ω;
λ
= 850 nm
tftyp. 0.02 µs
Forward voltage
IF = 100 mA; E = 0
VFtyp. 1.3 V
Capacitance
VR = 0 V; f = 1 MHz; E = 0
C0typ. 48 pF
Temperature coe󰘲cient of voltage TCVtyp. -2.6 mV / K
Temperature coe󰘲cient of short-circuit current
λ
= 870 nm
TCItyp. 0.03 % / K
Noise equivalent power
VR = 10 V;
λ
= 870 nm
NEP typ. 0.040 pW /
Hz1/2
Detection limit D* typ. 5.5e12 cm x
Hz1/2 / W
BP 104 FAS
4Version 1.4 | 2018-08-22
λ
OHF01430
400
rel
S
0600 800 1000 nm 1200
10
20
30
40
50
60
70
80
%
100
Relative Spectral Sensitivity 1), 2)
Srel = f (
λ
)
OHF01402
90
80
70
60
50
40 30 20 10
20 40 60 80 100 1200.40.60.81.0
ϕ
0.2
0.4
0.6
0.8
1.0
100 0
0
0
Directional Characteristics 1), 2)
Srel = f (
φ
)
BP 104 FAS
5Version 1.4 | 2018-08-22
0
OHF00080
Ι
R
R
V
0 5 10 15 V 20
1000
2000
3000
4000
pA
Dark Current 1), 2)
IR = f (VR); E = 0
E
OHF01056
e
0
10
P
Ι
-1
10
10 110 210 4
10 0
10 1
10 2
10
34
10
3
10
2
10
1
10
10 0
VO
µ
Am
V
Ι
P
VO
2
W/cmµ
Photocurrent/Open-Circuit Voltage 1), 2)
IP (VR = 5 V) / VO = f (Ee)
OHF02284
V
R
Ι
R
0
10
-1
10
0
10
1
10
2
nA
2 4 6 8 10 12 14 16 V 20
Dark Current 1), 2)
IR = f (VR); E = 0
BP 104 FAS
6Version 1.4 | 2018-08-22
V
OHF01778
R
-2
10
C
10 -1 10 010 110 2
V
0
10
20
30
40
50
pF
60
Capacitance 1), 2)
C = f (VR); f = 1 MHz; E = 0;
OHF05717
A
T
10-1
˚C020406080 100
R
I
nA
100
101
102
103
104
Dark Current 2)
IR = f (TA); E = 0; VR = 10 V
BP 104 FAS
7Version 1.4 | 2018-08-22
T
OHF00394
A
0
tot
P
020 40 60 80 ˚C 100
mW
20
40
60
80
100
120
140
160
Power Consumption
Ptot = f (TA)
BP 104 FAS
8Version 1.4 | 2018-08-22
Dimensional Drawing 3)
4.5 (0.177)
4.3 (0.169)
4.0 (0.157)
3.7 (0.146)
1.5 (0.059)
1.7 (0.067)
0.9 (0.035)
0.7 (0.028)
Photosensitive area Cathode lead
GEOY6861
0.3 (0.012)
6.7 (0.264)
6.2 (0.244)
1.2 (0.047)
1.1 (0.043)
Chip position
0...5˚
0.2 (0.008)
0.1 (0.004)
1.1 (0.043)
0.9 (0.035)
2.20 (0.087) x 2.20 (0.087)
1.6 (0.063)
(0...0.004)
±0.2 (0.008)
0...0.1
Approximate Weight: 44.0 mg
Package marking: Cathode
BP 104 FAS
9Version 1.4 | 2018-08-22
Recommended Solder Pad 3)
Reflow Soldering Profile
Product complies to MSL Level 4 acc. to JEDEC J-STD-020E
0
0s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
BP 104 FAS
10 Version 1.4 | 2018-08-22
Pro󰘰le Feature Symbol Pb-Free (SnAgCu) Assembly Unit
Minimum Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
23 K/s
Time tS
TSmin to TSmax
tS60 100 120 s
Ramp-up rate to peak*)
TSmax to TP
23 K/s
Liquidus temperature TL217 °C
Time above liquidus temperature tL80 100 s
Peak temperature TP245 260 °C
Time within 5 °C of the speci󰘰ed peak
temperature TP - 5 K
tP10 20 30 s
Ramp-down rate*
TP to 100 °C
36K/s
Time
25 °C to TP
480 s
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; ful󰘰llment for the whole T-range
Taping 3)
OHAY2287
1.5 (0.059)
4 (0.157)
0.8 (0.031)
2 (0.079)
4.1 (0.161)
1.75 (0.069)
5.5 (0.217)
12 (0.472)
6.9 (0.272)
Cathode/Collector Side
BP 104 FAS
11 Version 1.4 | 2018-08-22
Tape and Reel 4)
D
0
2
P
P
0
1
P
W
FE
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Reel dimensions [mm]
A W Nmin W1W2 max Pieces per PU
180 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 1500
BP 104 FAS
12 Version 1.4 | 2018-08-22
Barcode-Product-Label (BPL)
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
Dry Packing Process and Materials 3)
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
BP 104 FAS
13 Version 1.4 | 2018-08-22
Transportation Packing and Materials 3)
OHA02044
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
02
4 5
(Q)QTY:2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
PACKVAR:
R077
Additional TEXT
P-1+Q-1
Multi TOPLED
Muster
OSRAM Opto
Semiconductors
(6P) BATCH NO:
(X) PROD NO:
1
0
(9D) D/C:
11
(1T) LOT NO:
210021998
123GH1234
024 5
(Q)QTY:
2000
0144
(G) GROUP:
260 C RT
240 C R
3
220 C R
ML
Bin3:
Bin2: Q-1-20
Bin1: P-1-20
LSY T676
2
2a
Temp ST
R18
DEMY
OSRAM
Packing
Sealing label
Barcode label
Moisture Level 3 Floor time 168 Hours Moisture Level 6Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label
Barcode label
Dimensions of transportation box in mm
Width Length Height
195 ± 5 mm 195 ± 5 mm 30 ± 5 mm
BP 104 FAS
14 Version 1.4 | 2018-08-22
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device speci󰘰ed in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding e󰘯ect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal 󰘰lled materials including silver.
Metal 󰘰lled materials can be a󰘯ected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
BP 104 FAS
15 Version 1.4 | 2018-08-22
Disclaimer
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language word-
ings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please 󰘰nd the latest version in the OSRAM OS Webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales o󰘲ce.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-
nate the customer-speci󰘰c request between OSRAM OS and Buyer and/or Customer.
BP 104 FAS
16 Version 1.4 | 2018-08-22
Glossary
1) Testing temperature: TA = 25°C
2) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only re󰘱ect statistical 󰘰gures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
3) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are speci󰘰ed with ±0.1 and
dimensions are speci󰘰ed in mm.
4) Tape and Reel: All dimensions and tolerances are speci󰘰ed acc. IEC 60286-3 and speci󰘰ed in mm.
BP 104 FAS
17 Version 1.4 | 2018-08-22
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.