Mono 2.9 W Class-D Audio Amplifier
with Digital Current and Voltage Output
Data Sheet SSM4321
Rev. 0 Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2012 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Filterless Class-D amplifier with spread-spectrum
Σ-Δ modulation
Digitized output of output voltage, output current,
and PVDD supply voltage
72 dB signal-to-noise ratio (SNR) on output current sensing
and 77 dB SNR on output voltage sensing
TDM or multichip I2S slave output interface
Up to 4 chips supported on a single bus
8 kHz to 48 kHz operation
I2S/left justified slave output interface
1 or 2 chips supported on a single bus
8 kHz to 48 kHz operation
PDM output interface operates from 1 MHz to 6.144 MHz
2.2 W into 4 Ω load and 1.4 W into 8 Ω load at 5.0 V supply
with <1% total harmonic distortion plus noise (THD + N)
89% efficiency at 5.0 V, 1.4 W into 8 Ω + 0.2 Ω RSENSE speaker
>100 dB signal-to-noise ratio (SNR)
High PSRR at 217 Hz: 86 dB
Amplifier supply operation from 2.5 V to 5.5 V
Input/output supply operation from 1.42 V to 3.6 V
Flexible gain adjustment pin: 0 dB to 12 dB in 3 dB steps
with fixed input impedance of 80 kΩ
<1 μA shutdown current
Smart power-down with loss of BCLK
Short-circuit and thermal protection with autorecovery
Available in a 16-ball, 0.4 mm pitch, 1.74 mm × 1.74 mm WLCSP
Pop-and-click suppression
APPLICATIONS
Mobile phones
MP3 players
Portable electronics
GENERAL DESCRIPTION
The SSM4321 is a fully integrated, high efficiency, Class-D
audio amplifier with digitized output of output voltage, output
current, and the PVDD supply voltage. It is designed to maximize
performance for mobile phone applications. The application circuit
requires a minimum of external components and operates from
a 2.5 V to 5.5 V supply for the amplifier and a 1.42 V to 3.6 V
supply for input/output. The SSM4321 is capable of delivering
2.2 W of continuous output power with <1% THD + N driving
a 4 Ω load from a 5.0 V supply with a 0.1 Ω V/I sense resistor.
The SSM4321 features a high efficiency, low noise modulation
scheme that requires no external LC output filters. The modulation
scheme provides high efficiency even at low output power. The
SSM4321 operates with 89% efficiency at 1.4 W into 8 Ω from
a 5.0 V supply with an SNR of >100 dB.
The SSM4321 includes circuitry to sense output current, output
voltage, and the PVDD supply voltage. Current sense is performed
using an external sense resistor that is connected between an
output pin and the load. The output current and voltage are sent
to ADCs with 16-bit resolution; the PVDD supply voltage is sent
to an ADC with 8-bit resolution.
The outputs of these ADCs are available on the TDM or I2S
output serial port. The SLOT pin is used to determine which of
four possible output slots is used on the TDM interface. A stereo
I2S interface can be selected by reversing the pin connections for
BCLK and FSYNC. Also, a direct PDM bit stream of voltage and
current data can be selected via the SLOT pin.
Spread-spectrum pulse density modulation (PDM) is used to
provide lower EMI-radiated emissions compared with other
Class-D architectures. The inherent randomized nature of
spread-spectrum PDM eliminates the clock intermodulation
(beating effect) of several amplifiers in close proximity.
The SSM4321 produces ultralow EMI emissions that significantly
reduce the radiated emissions at the Class-D outputs, particularly
above 100 MHz. The ultralow EMI emissions of the SSM4321 are
also helpful for antenna and RF sensitivity problems.
The device includes a highly flexible gain select pin that requires
only one series resistor to select a gain setting of 0 dB, 3 dB, 6 dB,
9 dB, or 12 dB. Input impedance is fixed at 80 kΩ, independent
of the selected gain.
The SSM4321 has a shutdown mode with a typical shutdown
current of <1 μA. Shutdown is enabled by removing the BCLK
input. A clock must be present on the BCLK pin for the part
to operate.
The device also includes pop-and-click suppression circuitry,
which minimizes voltage glitches at the output during turn-on
and turn-off, reducing audible noise on activation and deactivation.
The SSM4321 is specified over the industrial temperature range
of −40C to +85C. It has built-in thermal shutdown and output
short-circuit protection. It is available in a halide-free, 16-ball,
0.4 mm pitch, 1.74 mm × 1.74 mm wafer level chip scale package
(WLCSP).
SSM4321 Data Sheet
Rev. 0 | Page 2 of 24
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Functional Block Diagram .............................................................. 3
Specifications ..................................................................................... 4
Digital Input/Output Specifications........................................... 5
Absolute Maximum Ratings ............................................................ 6
Thermal Resistance ...................................................................... 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Theory of Operation ...................................................................... 14
Overview ...................................................................................... 14
Power-Down Operation ............................................................ 14
Gain Selection ............................................................................. 14
Pop-and-Click Suppression ....................................................... 14
Output Modulation Description .............................................. 14
EMI Noise .................................................................................... 15
Output Current Sensing ............................................................ 15
Output Voltage Sensing ............................................................. 15
PVDD Sensing ............................................................................ 15
Serial Data Input/Output............................................................... 16
TDM Operating Mode .............................................................. 16
I2S and Left Justified Operating Mode .................................... 16
Multichip I2S Operating Mode ................................................. 17
PDM Output Mode .................................................................... 17
Timing Diagrams, TDM Mode ................................................ 18
Timing Diagrams, I2S and Left Justified Modes ..................... 18
Timing Diagrams, Multichip I2S Mode ................................... 19
Timing Diagrams, PDM Mode ................................................. 20
Applications Information .............................................................. 21
Layout .......................................................................................... 21
Input Capacitor Selection .......................................................... 21
Power Supply Decoupling ......................................................... 21
Outline Dimensions ....................................................................... 22
Ordering Guide .......................................................................... 22
REVISION HISTORY
10/12—Revision 0: Initial Version
Data Sheet SSM4321
Rev. 0 | Page 3 of 24
FUNCTIONAL BLOCK DIAGRAM
SENSE–
OUT+
OUT–
SENSE+
VREG IOVDD GND
GAIN
PVDD
IN+
IN–
SLOT
BCLK_TDM/PDM_CLK/LRCLK_I2S
FSYNC_TDM/BCLK_I2S
SDATAO/PDM_DATA
TDM
OUTPUT
PVDD
ADC
Σ-Δ
ADC
Σ-Δ
ADC
Σ-Δ
CLASS-D
MODULATOR
FULL-BRIDGE
POWER
STAGE
VOLTAGE
SENSE
CURRENT
SENSE
DIGITAL
DECIMATION
FILTERING
1.42V TO 3.6V 2.5V TO 5.5V
SSM4321
10752-001
Figure 1.
SSM4321 Data Sheet
Rev. 0 | Page 4 of 24
SPECIFICATIONS
PVDD = 5.0 V, IOVDD = 1.8 V, f S = 24 kHz with I2S output, TA = 25°C, RL = 8 Ω +33 µH, unless otherwise noted. For RL = 8 Ω, use a
200 mΩ V/I sense resistor; for RL = 4 Ω, use a 100 mΩ V/I sense resistor; for RL = 3 Ω, use a 75 mΩ V/I sense resistor.
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
DEVICE CHARACTERISTICS
Output Power, RMS P
OUT
f = 1 kHz, 20 kHz bandwidth
R
L
= 8 Ω, THD = 1%, PVDD = 5.0 V 1.35 W
R
L
= 8 Ω, THD = 1%, PVDD = 3.6 V 0.70 W
R
L
= 8 Ω, THD = 1%, PVDD = 2.5 V 0.32 W
RL = 8 Ω, THD = 10%, PVDD = 5.0 V
1.70
W
R
L
= 8 Ω, THD = 10%, PVDD = 3.6 V 0.86 W
R
L
= 8 Ω, THD = 10%, PVDD = 2.5 V 0.4 W
R
L
= 4 Ω, THD = 1%, PVDD = 5.0 V 2.22 W
R
L
= 4 Ω, THD = 1%, PVDD = 3.6 V 1.12 W
R
L
= 4 Ω, THD = 1%, PVDD = 2.5 V 0.51 W
R
L
= 4 Ω, THD = 10%, PVDD = 5.0 V 2.8 W
R
L
= 4 Ω, THD = 10%, PVDD = 3.6 V 1.42 W
R
L
= 4 Ω, THD = 10%, PVDD = 2.5 V 0.64 W
R
L
= 3 Ω, THD = 1%, PVDD = 5.0 V 3.00 W
R
L
= 3 Ω, THD = 1%, PVDD = 3.6 V 1.51 W
R
L
= 3 Ω, THD = 1%, PVDD = 2.5 V 0.68 W
R
L
= 3 Ω, THD = 10%, PVDD = 5.0 V 3.77 W
R
L
= 3 Ω, THD = 10%, PVDD = 3.6 V 1.90 W
R
L
= 3 Ω, THD = 10%, PVDD = 2.5 V 0.86 W
Efficiency η P
OUT
= 1.4 W into 8 Ω, PVDD = 5.0 V 89 %
P
OUT
= 2.8 W into 3 Ω, PVDD = 5.0 V 82 %
Total Harmonic Distortion
Plus Noise
THD + N
P
OUT
= 1 W into 8 Ω, f = 1 kHz,
PVDD = 5.0 V
0.01
%
POUT = 0.5 W into 8 Ω, f = 1 kHz,
PVDD = 3.6 V
0.01 %
Input Common-Mode Voltage
Range
VCM 1.0 PVDD − 1 V
Common-Mode Rejection Ratio CMRR
GSM
V
CM
= 100 mV rms at 1 kHz 50 dB
Average Switching Frequency f
SW
256 kHz
Clock Frequency f
OSC
6.2 MHz
Differential Output Offset Voltage V
OOS
Gain = 6 dB 0.3 5.0 mV
POWER SUPPLY
Supply Voltage Range PVDD Guaranteed from PSRR test 2.5 5.5 V
IOVDD 1.42 3.6 V
Power Supply Rejection Ratio PSRRGSM VRIPPLE = 100 mV at 217 Hz, inputs are
ac-grounded, C
IN
= 0.1 µF
86 dB
Supply Current, PVDD I
SYPVDD
V
IN
= 0 V
No load, PVDD = 5.0 V 3.7 mA
No load, PVDD = 3.6 V 3.1 mA
No load, PVDD = 2.5 V 2.9 mA
R
L
= 8 Ω, PVDD = 5.0 V 3.8 mA
RL = 8 Ω, PVDD = 3.6 V
3.2
mA
R
L
= 8 Ω, PVDD = 2.5 V 2.9 mA
Supply Current, IOVDD I
SYIOVDD
IOVDD = 1.8 V 0.41 mA
Shutdown Current, PVDD I
SDPVDD
No BCLK, PVDD = 5.0 V 0.1 µA
Shutdown Current, IOVDD I
SDIOVDD
No BCLK, IOVDD = 1.8 V 0.77 µA
Data Sheet SSM4321
Rev. 0 | Page 5 of 24
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
GAIN CONTROL
Closed-Loop Gain Gain 0 12 dB
Input Impedance ZIN BCLK enabled, fixed input impedance
(0 dB to 12 dB)
80 kΩ
SHUTDOWN CONTROL
Turn-On Time t
WU
From BCLK start 12.5 ms
Turn-Off Time t
SD
From BCLK removal 5 µs
Output Impedance
ZOUT
No BCLK
>100
kΩ
AMPLIFIER NOISE PERFORMANCE
Output Voltage Noise en f = 20 Hz to 20 kHz, inputs are
ac-grounded, gain = 6 dB, A-weighted
PVDD = 5.0 V 30 µV
PVDD = 3.6 V 30 µV
Signal-to-Noise Ratio SNR P
OUT
= 1.3 W, R
L
= 8 Ω, A-weighted 101 dB
OUTPUT SENSING
Output Sampling Rate, TDM f
S
LRCLK/FSYNC pulse rate 8 48 kHz
BCLK Frequency, TDM f
BCLK
1 to 4 slots used 0.512 6.144 MHz
Voltage Sense Signal-to-Noise
Ratio
SNRV A-weighted 77 dB
Voltage Sense Full-Scale Output
Voltage
VFS Amplifier voltage with 0 dBFS ADC
output
6 VP
Voltage Sense Absolute Accuracy 1.5 %
Voltage Sense Gain Drift T
A
= 10°C to 60°C 1 %
Current Sense Signal-to-Noise
Ratio
SNRI A-weighted 72 dB
Current Sense Full-Scale Input
Voltage
VIS ISENSE converter voltage with 0 dBFS ADC
output
0.150 VP
Current Sense Absolute Accuracy 3 %
Current Sense Gain Drift T
A
= 10°C to 60°C, ideal R
SENSE
1 %
PVDD Sense Full-Scale Range PV
FS
PVDD with full-scale ADC output 2 6 V
PVDD Sense Absolute Accuracy 3 %
Current and Voltage Sense
Linearity
From 80 dBr to 0 dBr 1 dB
ADC −3 dB Corner Frequency f
C
Digital high-pass filter
Output f
S
= 48 kHz 3.75 Hz
Output fS = 24 kHz
1.875
Hz
DIGITAL INPUT/OUTPUT SPECIFICATIONS
Table 2.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
BCLK, FSYNC PINS Ball D2 and Ball D3
Input Voltage High
0.7 × IOVDD
3.6
V
Input Voltage Low V
0.3 0.3 × IOVDD V
Input Leakage Current High I
1 µA
Input Leakage Current Low I
1 µA
Input Capacitance C
5 pF
SDATAO/PDM_DATA PIN Ball D1
Output Drive Strength IOVDD = 1.5 V 3.5 mA
IOVDD = 1.8 V 4.5 mA
SSM4321 Data Sheet
Rev. 0 | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at 25°C, unless otherwise noted.
Table 3.
Parameter Rating
PVDD Supply Voltage 6 V
IOVDD Supply Voltage 3.6 V
Input Voltage PVDD
Common-Mode Input Voltage PVDD
Storage Temperature Range 65°C to +150°C
Operating Temperature Range −40°C to +85°C
Junction Temperature Range
−65°C to +165°C
Lead Temperature (Soldering, 60 sec) 300°C
ESD Susceptibility 4 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Junction-to-air thermal resistance (θJA) is specified for the
worst-case conditions, that is, a device soldered in a printed
circuit board (PCB) for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
1
Unit
16-Ball, 1.74 mm × 1.74 mm WLCSP 665 °C/W
1 The θJA specification is measured on a JEDEC standard 4-layer PCB.
ESD CAUTION
Data Sheet SSM4321
Rev. 0 | Page 7 of 24
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
TOP VI EW
(BAL L SI DE DOW N)
Not t o Scal e
1
A
B
C
D
2 3 4
BALL A1
INDICATOR
OUT+
SENSE+
SENSE–
SDATAO/
PDM_DATA
PVDD
GND
IOVDD
BCLK_TDM/
PDM_CLK/
LRCLK_I2S
VREG
GND
IN+
IN–
OUT–
GAIN
SLOT
FSYNC_TDM/
BCLK_I2S
10752-002
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
A1 OUT+ Noninverting Output.
A2 OUT Inverting Output.
A3 PVDD Amplifier Power Supply.
A4 VREG Internal LDO Regulator Output.
B1 SENSE+ Current Sense Positive Input.
B2 GAIN Gain Control Pin.
B3, B4 GND Ground.
C1 SENSE− Current Sense Negative Input.
C2 SLOT TDM Slot Selection Input.
C3 IOVDD Input/Output Digital Power Supply.
C4 IN+ Noninverting Input.
D1
SDATAO/PDM_DATA
TDM Serial Data Output/PDM Data Output.
D2 FSYNC_TDM/BCLK_I2S TDM Frame Synchronization Input/I
2
S Bit Clock Input.
D3 BCLK_TDM/PDM_CLK/
LRCLK_I2S
TDM Bit Clock Input/PDM Clock Input/I
2
S LRCLK Input.
D4 IN Inverting Input.
SSM4321 Data Sheet
Rev. 0 | Page 8 of 24
TYPICAL PERFORMANCE CHARACTERISTICS
PVDD = 5.0 V, IOVDD = 1.8 V, fS = 24 kHz with I2S output, gain = 6 dB, TA = 25°C, unless otherwise noted. For RL = 8 Ω, use a 200 mΩ
V/I sense resistor; for RL = 4 Ω, use a 100 mΩ V/I sense resistor; for RL = 3 Ω, use a 75 mΩ V/I sense resistor.
100
10
1
0.1
0.01
0.001
0.001 1010.10.01
THD + N ( %)
OUTPUT POW ER (W)
PVDD = 2.5V
PVDD = 3.6V
RL = 8Ω + 33µH
PVDD = 5.0V
10752-103
Figure 3. THD + N vs. Output Power into 8
100
10
1
0.1
0.01
0.001
0.001 1010.10.01
THD + N ( %)
OUTPUT POW ER (W)
PVDD = 2.5V
PVDD = 3.6V
RL = 4Ω + 15µH
PVDD = 5.0V
10752-104
Figure 4. THD + N vs. Output Power into 4
100
10
1
0.1
0.01
0.001
0.001 1010.10.01
THD + N ( %)
OUTPUT POW ER (W)
PVDD = 2.5V
PVDD = 3.6V
RL = 3Ω + 7.5µH
PVDD = 5.0V
10752-105
Figure 5. THD + N vs. Output Power into 3 Ω
100
10
1
0.1
0.01
0.00110 100k10k1k100
THD + N ( %)
FRE QUENCY ( Hz )
RL = 8Ω + 33µH
250mW
500mW
1W
10752-106
Figure 6. THD + N vs. Frequency, PVDD = 5 V, RL = 8 Ω
100
10
1
0.1
0.01
0.00110 100k10k1k100
THD + N ( %)
FRE QUENCY ( Hz )
R
L
= 4Ω + 15µH
500mW
2W
1W
10752-107
Figure 7. THD + N vs. Frequency, PVDD = 5 V, RL = 4 Ω
100
10
1
0.1
0.01
0.00110 100k10k1k100
THD + N ( %)
FRE QUENCY ( Hz )
R
L
= 3Ω + 7.5µH
2.5W
2W
1W
10752-108
Figure 8. THD + N vs. Frequency, PVDD = 5 V, RL = 3 Ω
Data Sheet SSM4321
Rev. 0 | Page 9 of 24
100
10
1
0.1
0.01
0.00110 100k10k1k100
THD + N ( %)
FRE QUENCY ( Hz )
R
L
= 8Ω + 33µH
125mW
250mW 500mW
10752-109
Figure 9. THD + N vs. Frequency, PVDD = 3.6 V, RL = 8 Ω
100
10
1
0.1
0.01
0.00110 100k10k1k100
THD + N ( %)
FRE QUENCY ( Hz )
R
L
= 4Ω + 15µH
1W
250mW
500mW
10752-110
Figure 10. THD + N vs. Frequency, PVDD = 3.6 V, RL = 4 Ω
100
10
1
0.1
0.01
0.00110 100k10k1k100
THD + N ( %)
FRE QUENCY ( Hz )
R
L
= 3Ω + 7.5µH
1.2W
375mW 750mW
10752-111
Figure 11. THD + N vs. Frequency, PVDD = 3.6 V, RL = 3 Ω
100
10
1
0.1
0.01
0.00110 100k10k1k100
THD + N ( %)
FRE QUENCY ( Hz )
R
L
= 8Ω + 33µH
62.5mW
125mW 250mW
10752-112
Figure 12. THD + N vs. Frequency, PVDD = 2.5 V, RL = 8 Ω
100
10
1
0.1
0.01
0.00110 100k10k1k100
THD + N ( %)
FRE QUENCY ( Hz )
R
L
= 4Ω + 15µH
500mW
125mW
250mW
10752-113
Figure 13. THD + N vs. Frequency, PVDD = 2.5 V, RL = 4 Ω
100
10
1
0.1
0.01
0.00110 100k10k1k100
THD + N ( %)
FRE QUENCY ( Hz )
R
L
= 3Ω + 7.5µH
500mW
125mW
250mW
10752-114
Figure 14. THD + N vs. Frequency, PVDD = 2.5 V, RL = 3 Ω
SSM4321 Data Sheet
Rev. 0 | Page 10 of 24
5.0
4.8
4.6
4.4
4.2
4.0
3.8
3.6
3.4
3.2
3.02.5 5.04.0
4.53.53.0
QUIESCE NT CURRENT (mA)
SUPPLY VOLT AGE (V)
NO LOAD
RL = 4Ω
RL = 8Ω
10752-115
Figure 15. Quiescent Current vs. PVDD Supply Voltage, ADC Sense Enabled
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.02.5 5.04.0
4.53.53.0
QUIESCE NT CURRENT (mA)
SUPPLY VOLT AGE (V)
NO LOAD
RL = 4Ω
RL = 8Ω
10752-116
Figure 16. Quiescent Current vs. PVDD Supply Voltage, ADC Sense Disabled
2.0
1.5
1.0
0.5
0
2.5 5.04.0 4.53.53.0
OUTPUT POW ER (W)
SUPPLY VOLT AGE (V)
THD + N = 1%
THD + N = 10%
RL = 8Ω + 33µH
10752-117
Figure 17. Maximum Output Power vs. PVDD Supply Voltage, RL = 8 Ω
3.0
2.5
2.0
1.0
1.5
0.5
0
2.5 5.04.0 4.53.53.0
OUTPUT POW ER (W)
SUPPLY VOLT AGE (V)
THD + N = 1%
THD + N = 10%
RL = 4Ω + 15µH
10752-118
Figure 18. Maximum Output Power vs. PVDD Supply Voltage, RL = 4 Ω
4.0
3.5
3.0
2.5
2.0
1.0
1.5
0.5
0
2.5 5.04.0 4.53.53.0
OUTPUT POW ER (W)
SUPPLY VOLT AGE (V)
THD + N = 1%
THD + N = 10%
RL = 3Ω + 7.5µH
10752-119
Figure 19. Maximum Output Power vs. PVDD Supply Voltage, RL = 3 Ω
0.7
0.6
0.5
0.4
0.3
0.2
0.1
003.01.5 2.0 2.51.00.5
SUPP LY CURRENT (A)
OUTPUT POW ER (W)
RL = 8Ω + 33µH
PVDD = 2.5V
PVDD = 3.6V
PVDD = 5.0V
10752-120
Figure 20. Supply Current vs. Output Power into 8 Ω
Data Sheet SSM4321
Rev. 0 | Page 11 of 24
0.7
0.6
0.5
0.4
0.3
0.2
0.1
003.01.5 2.0 2.51.00.5
SUPP LY CURRENT (A)
OUTPUT POW ER (W)
R
L
= 4Ω + 15µH
PVDD = 2.5V
PVDD = 3.6V
PVDD = 5.0V
10752-121
Figure 21. Supply Current vs. Output Power into 4 Ω
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
003.53.01.5 2.0 2.51.00.5
SUPP LY CURRENT (A)
OUTPUT POW ER (W)
R
L
= 3Ω + 7.5µH
PVDD = 2.5V
PVDD = 3.6V
PVDD = 5.0V
10752-122
Figure 22. Supply Current vs. Output Power into 3 Ω
100
80
60
40
20
001.50.9 1.20.60.3
EF FICIENCY ( %)
OUTPUT POW ER (W)
R
L
= 8Ω + 33µH
PVDD = 2.5V PVDD = 3.6V PVDD = 5.0V
10752-123
Figure 23. Efficiency vs. Output Power into 8 Ω
100
80
60
40
20
002.82.42.01.2 1.60.80.4
EF FICIENCY ( %)
OUTPUT POW ER (W)
R
L
= 4Ω + 15µH
PVDD = 2.5V PV DD = 3.6V PVDD = 5.0V
10752-124
Figure 24. Efficiency vs. Output Power into 4 Ω
100
80
60
40
20
002.82.42.01.2 1.60.80.4
EF FICIENCY ( %)
OUTPUT POW ER (W)
R
L
= 3Ω + 7.5µH
PVDD = 2.5V PVDD = 3.6V P V DD = 5.0V
10752-125
Figure 25. Efficiency vs. Output Power into 3 Ω
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
10 100k10k1k100
CMRR (dB)
FRE QUENCY ( Hz )
R
L
= 8Ω + 33µH
10752-126
Figure 26. Common-Mode Rejection Ratio (CMRR) vs. Frequency,
PVDD = 5 V, RL = 8 Ω
SSM4321 Data Sheet
Rev. 0 | Page 12 of 24
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
20 20k2k200
PSRR ( dB)
FRE QUENCY ( Hz )
10752-127
R
L
= 8Ω + 33µH
Figure 27. Power Supply Rejection Ratio (PSRR) vs. Frequency,
PVDD = 5 V, RL = 8 Ω
0
–160
–140
–120
–100
–80
–60
–40
–20
10 100k10k1k100
SPECTRUM (dBV)
FRE QUENCY ( Hz )
PVDD = 2.5V
PVDD = 5.0V
PVDD = 3.6V
RL = 8Ω +33µH
10752-128
Figure 28. Output Spectrum vs. Frequency (FFT), POUT = 100 mW, RL = 8 Ω
1.0
–1.0
–0.5
0
0.5
–80 0–20–40–60 –10–30–50–70
CURRENT S E NS E ( dBFS )
INPUT LEVEL (d Br)
10752-129
Figure 29. Current Sense Linearity
1.0
0.8
0.6
0.4
0.2
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
PVDD SENSE LEVEL (F S)
PVDD (V)
R
L
= 8Ω + 33µH
10752-130
Figure 30. PVDD ADC Sense Level vs. PVDD Range, RL = 8 Ω
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0.01 1010.1
THD + N ( dBF S )
OUTPUT POW ER (W)
RL = 8Ω + 33µH
48kHz ISENSE
48kHz VSENSE
24kHz VSENSE
24kHz ISENSE
10752-131
Figure 31. Sense ADC THD + N vs. Output Power into 8 Ω
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0.01 1010.1
THD + N ( dBF S )
OUTPUT POW ER (W)
RL = 4Ω + 15µH
48kHz ISENSE
48kHz VSENSE
24kHz VSENSE
24kHz ISENSE
10752-132
Figure 32. Sense ADC THD + N vs. Output Power into 4 Ω
Data Sheet SSM4321
Rev. 0 | Page 13 of 24
0
–100
–90
–80
–70
–60
–50
–40
–30
–20
–10
0.01 1010.1
THD + N ( dBF S )
OUTPUT POW ER (W)
R
L
= 3Ω + 7.5µH
48kHz I
SENSE
48kHz V
SENSE
24kHz V
SENSE
24kHz I
SENSE
10752-133
Figure 33. Sense ADC THD + N vs. Output Power into 3 Ω
0
–80
–70
–60
–50
–40
–30
–20
–10
20 20k2k200
THD + N ( dBF S )
FRE QUENCY ( Hz )
RL = 8Ω + 33µH 800mW VSENSE
800mW ISENSE
400mW VSENSE
400mW ISENSE
200mW VSENSE
200mW ISENSE
10752-134
Figure 34. Sense ADC THD + N vs. Frequency, PVDD = 5 V, RL = 8 Ω
0
–80
–70
–60
–50
–40
–30
–20
–10
20 20k2k200
THD + N ( dBF S )
FRE QUENCY ( Hz )
RL = 4Ω + 15µH 2W VSENSE
2W ISENSE
1W VSENSE
1W ISENSE
500mW VSENSE
500mW ISENSE
10752-135
Figure 35. Sense ADC THD + N vs. Frequency, PVDD = 5 V, RL = 4 Ω
0
–70
–60
–50
–40
–30
–20
–10
20 20k2k200
THD + N ( dBF S )
FRE QUENCY ( Hz )
RL = 3Ω + 7.5µH 2W VSENSE
2W ISENSE
1W VSENSE
1W ISENSE
500mW VSENSE
500mW ISENSE
10752-136
Figure 36. Sense ADC THD + N vs. Frequency, PVDD = 5 V, RL = 3 Ω
0
–160
–140
–120
–100
–80
–60
–40
–20
10 100k10k1k100
SPECTRUM (dBFS)
FRE QUENCY ( Hz )
RL = 8Ω +33µH 24kHz VSENSE
24kHz ISENSE
48kHz VSENSE
48kHz ISENSE
10752-137
Figure 37. Output Spectrum of Sense ADC vs. Frequency (FFT),
POUT = 100 mW, RL = 8 Ω
SSM4321 Data Sheet
Rev. 0 | Page 14 of 24
THEORY OF OPERATION
OVERVIEW
The SSM4321 mono Class-D audio amplifier features a filterless
modulation scheme that greatly reduces the external component
count, conserving board space and, thus, reducing system cost.
The SSM4321 does not require an output filter but, instead, relies
on the inherent inductance of the speaker coil and the natural
filtering of the speaker and human ear to fully recover the audio
component of the square wave output.
Most Class-D amplifiers use some variation of pulse-width
modulation (PWM), but the SSM4321 uses Σ-Δ modulation to
determine the switching pattern of the output devices, resulting
in a number of important benefits.
Σ-Δ modulators do not produce a sharp peak with many
harmonics in the AM frequency band, as pulse-width
modulators often do.
Σ-Δ modulation reduces the amplitude of spectral compo-
nents at high frequencies, thus reducing EMI emissions that
might otherwise be radiated by speakers and long cable traces.
Due to the inherent spread-spectrum nature of Σ-Δ modu-
lation, the need for oscillator synchronization is eliminated
for designs that incorporate multiple SSM4321 amplifiers.
The SSM4321 also integrates overcurrent and overtemperature
protection.
POWER-DOWN OPERATION
The SSM4321 contains a clock loss detect circuit that works
with the BCLK input clock. When no BCLK is present, the part
automatically powers down all internal circuitry to its lowest
power state. When a BCLK is returned, the part automatically
powers up.
If BCLK is active but FSYNC or LRCLK is not present, the
amplifier continues to operate, but the ADC, sense blocks, and
digital processing are shut down, reducing quiescent current
when the output sense data is not needed. The ADC shutdown
feature is not available in PDM operating mode.
GAIN SELECTION
The gain of the SSM4321 can be set from 0 dB to 12 dB in 3 dB
steps using the GAIN pin and one (optional) external resistor.
The external resistor is used to select the 9 dB or 12 dB gain
setting (see Table 6).
Table 6. Setting the Gain of the SSM4321 with the GAIN Pin
Gain Setting (dB)
GAIN Pin Configuration
0 Tie to GND
3 Open
6 Tie to PVDD
9 Tie to GND through a 47 kΩ resistor
12 Tie to PVDD through a 47 kΩ resistor
POP-AND-CLICK SUPPRESSION
Voltage transients at the output of audio amplifiers can occur
when shutdown is activated or deactivated. Voltage transients
as low as 10 mV can be heard as an audible pop in the speaker.
Pops and clicks can also be classified as undesirable audible
transients generated by the amplifier system and, therefore, as
not coming from the system input signal.
The SSM4321 has a pop-and-click suppression architecture that
reduces these output transients, resulting in noiseless activation
and deactivation.
OUTPUT MODULATION DESCRIPTION
The SSM4321 uses three-level, Σ-Δ output modulation. Each
output can swing from GND to PVDD and vice versa. Ideally,
when no input signal is present, the output differential voltage is
0 V because there is no need to generate a pulse. In a real-world
situation, noise sources are always present.
Due to the constant presence of noise, a differential pulse is
generated, when required, in response to this stimulus. A small
amount of current flows into the inductive load when the differ-
ential pulse is generated.
Most of the time, however, the output differential voltage is 0 V,
due to the Analog Devices, Inc., three-level, Σ-Δ output modula-
tion. This feature ensures that the current flowing through the
inductive load is small.
When the user wants to send an input signal, an output pulse
(OUT+ and OUT−) is generated to follow the input voltage. The
differential pulse density (VOUT) is increased by raising the input
signal level. Figure 38 depicts three-level, Σ-Δ output modulation
with and without input stimulus.
OUTPUT > 0V
+5V
0V
OUT+
+5V
0V
OUT–
+5V
0V
V
OUT
OUTPUT < 0V
+5V
0V
OUT+
+5V
0V
OUT–
0V
–5V
V
OUT
OUTPUT = 0V
OUT+
+5V
0V
+5V
0V
OUT–
+5V
–5V
0V
V
OUT
10752-015
Figure 38. Three-Level, Σ-Δ Output Modulation
With and Without Input Stimulus
Data Sheet SSM4321
Rev. 0 | Page 15 of 24
EMI NOISE
The SSM4321 uses a proprietary modulation and spread-spectrum
technology to minimize EMI emissions from the device. For
applications that have difficulty passing FCC Class B emission tests
or experience antenna and RF sensitivity problems, the ultralow
EMI architecture of the SSM4321 significantly reduces the radiated
emissions at the Class-D outputs, particularly above 100 MHz.
EMI emission tests on the SSM4321 were performed in an FCC-
certified EMI laboratory with a 1 kHz input signal, producing
0.5 W of output power into an 8 Ω load from a 5.0 V supply. The
SSM4321 passed FCC Class B limits with 50 cm of unshielded
twisted pair speaker cable. Note that reducing the power supply
voltage greatly reduces radiated emissions.
OUTPUT CURRENT SENSING
The SSM4321 uses an external sense resistor to determine the
output current flowing to the load. As shown in Figure 1, one end
of the sense resistor is tied to one amplifier output pin (OUT+);
the other end of the sense resistor is tied to the load, which is also
connected to one sense input pin (SENSE−).
The voltage across the sense resistor is proportional to the load
current and is sent to an analog-to-digital converter (ADC) run-
ning nominally at 128 fS. The output of this ADC is downsampled
using digital filtering. The downsampled signal is output at a rate
of 8 kHz to 48 kHz on Slot 1 of the TDM bus. The 16-bit data is
in signed fractional format.
The current sense output is scaled so that an output current of
0.75 A (6 V/8 Ω) with a 200 mΩ sense resistor results in full-scale
output from the ADC. Table 7 lists the optimal sense resistor
values for commonly used output loads.
Table 7. Optimal Sense Resistor for Typical Loads
Load Value (Ω) Peak Current (A) Sense Resistor (mΩ)
8 0.75 200
4 1.5 100
3 2 75
OUTPUT VOLTAGE SENSING
The output voltage level is monitored and sent to an ADC
running nominally at 128 fS. The output of this ADC is down-
sampled using digital filtering. The downsampled signal is
output at a rate of 8 kHz to 48 kHz on Slot 2 of the TDM bus.
The 16-bit data is in signed fractional format.
PVDD SENSING
The SSM4321 contains an 8-bit ADC that measures the voltage
of the PVDD supply in real time. The output of the ADC is in
8-bit unsigned format and is presented on the 8 MSBs of Slot 3
on the TDM bus. The eight LSBs are driven low.
SSM4321 Data Sheet
Rev. 0 | Page 16 of 24
SERIAL DATA INPUT/OUTPUT
The SSM4321 includes circuitry to sense output current, output
voltage, and the PVDD supply voltage. The output current, output
voltage, and PVDD voltage are sent to ADCs. The output of these
ADCs is available on the TDM or I2S output serial port. A direct
PDM bit stream of voltage and current data (or current and PVDD
data) can also be selected.
TDM OPERATING MODE
The digitized output current, output voltage, and PVDD sense
signals can be output on a TDM serial port. This serial port is
always a slave and requires a bit clock (BCLK) and a frame
synchronization signal (FSYNC) to operate. The output data is
driven on the SDATAO/PDM_DATA pin at the IOVDD voltage.
(See the Timing Diagrams, TDM Mode section.)
The FSYNC signal operates at the desired sample rate. A rising
edge of the FSYNC signal indicates the start of a new frame. For
proper operation, this signal should be one BCLK cycle wide,
transitioning on a falling BCLK edge. The MSB of the Slot 1 data
is output on the SDATAO/PDM_DATA pin one BCLK cycle later.
The SDATAO signal should be latched on a rising edge of BCLK.
Each slot is 64 BCLK cycles wide.
The SSM4321 can drive only four slots on its output, but it can
work with 8 slots, 12 slots, or 16 slots. In this way, up to four
SSM4321 devices can use the same TDM bus. At startup, the
number of slots used is recognized automatically by the number
of BCLK cycles between FSYNC pulses. Internal clocking is
automatically generated from BCLK based on the determined
BCLK rate.
The set of four TDM slots to be driven is determined by the
configuration of the SLOT pin on the SSM4321 (see Table 8).
The value of the SLOT pin must be stable at startup.
Table 8. TDM Slot Selection
Device Setting SLOT Pin Configuration
TDM Slot 1 to Slot 4 used Tie to IOVDD
TDM Slot 5 to Slot 8 used Open
TDM Slot 9 to Slot 12 used Tie to GND
TDM Slot 13 to Slot 16 used Tie to IOVDD through a 47 kΩ resistor
The SSM4321 sets the SDATAO/PDM_DATA pin to a high
impedance state when a slot is present that is not being driven.
Connect a pull-down resistor to the SDATAO/PDM_DATA pin
so that it is always in a known state.
With a single SSM4321 operating with four slots, Slot 1 is for
the output current, Slot 2 is for the output voltage, Slot 3 is for
the PVDD supply, and Slot 4 is not driven. With more than four
slots, this pattern is repeated. Table 9 shows an example with
three SSM4321 devices and 12 TDM slots.
Table 9. TDM Output Slot ExampleThree SSM4321 Devices
TDM Slot Data Present
1 Output current, Device 1
2 Output voltage, Device 1
3 PVDD voltage, Device 1
4
High-Z
5 Output current, Device 2
6 Output voltage, Device 2
7
PVDD voltage, Device 2
8 High-Z
9 Output current, Device 3
10 Output voltage, Device 3
11 PVDD voltage, Device 3
12 High-Z
I2S AND LEFT JUSTIFIED OPERATING MODE
An I2S or left justified output interface can be selected by reversing
the pin connections for BCLK and FSYNC; that is, the I2S LRCLK
is connected to Ball D3 (BCLK_TDM/PDM_CLK/LRCLK_I2S),
and the I2S BCLK is connected to Ball D2 (FSYNC_TDM/
BCLK_I2S).
The I2S interface requires 64 BCLK cycles per LRCLK cycle. The
voltage information is sent when LRCLK is low, and the current
information is sent when LRCLK is high. (See the Timing
Diagrams, I2S and Left Justified Modes section.)
The SLOT pin configures the I2S or left justified output as follows
(see Table 10).
Selection of I2S or left justified mode.
Output of PVDD sense information. When PVDD data is
output, eight bits are appended to the 16-bit voltage sense
data to create a 24-bit output. The 16 MSBs represent the
voltage data; the eight LSBs represent the PVDD data.
Sample rate range. The sample rate ranges from 16 kHz
to 48 kHz. A range of 32 kHz to 48 kHz is also allowed in
low power I2S mode.
Table 10. I2S and Left Justified Slot Selection
Device Setting BCLK Setting SLOT Pin Configuration
I2S mode at 16 kHz to 48 kHz; voltage and current data only
64 × fS
Tie to IOVDD
Left justified mode at 16 kHz to 48 kHz; voltage and current data only 64 × f
S
Open
I
2
S mode at 16 kHz to 48 kHz; PVDD data appended to voltage data 64 × f
S
Tie to GND
Left justified mode at 16 kHz to 48 kHz; PVDD data appended to voltage data 64 × f
S
Tie to IOVDD through a 47 kΩ resistor
Low power I2S mode at 32 kHz to 48 kHz; voltage and current data only 32 × f
S
or 64 × f
S
Tie to GND through a 47 kΩ resistor
Data Sheet SSM4321
Rev. 0 | Page 17 of 24
MULTICHIP I2S OPERATING MODE
A special multichip I2S mode is enabled when the part is wired
for TDM mode (BCLK and FSYNC not reversed) but the FSYNC
signal has a 50% duty cycle. If the FSYNC signal consists of one-
clock-cycle pulses, TDM operating mode is active instead.
The multichip I2S interface allows multiple chips to drive a single
I2S bus. Each chip takes control of the bus every two or four frames
(depending on the number of chips placed on the bus), allowing
a maximum of four chips on the bus. The SLOT pin assignments
determine the order of control. (See the Timing Diagrams,
Multichip I2S Mode section.)
Each frame also contains a 1-bit ID code, which is appended to
the current data in the frame. This code indicates the chip that
sent the data for that frame. Table 11 provides the mapping of
SLOT pin assignments to ID code.
Table 11. Multichip I2S Slot Selection
Chip No.
ID Code
SLOT Pin Configuration
1 0001 Tie to IOVDD
2 0010 Open
3 0100 Tie to GND
4 1000 Tie to IOVDD through a 47 kΩ resistor
The part is automatically configured for two-chip or four-chip
operation, depending on the number of chips detected on the bus.
The part starts up in four-chip operation, but after it detects that
Slot 3 and Slot 4 are unused, the part switches to two-chip oper-
ation. For two-chip operation, the first and second slots must be
used. If there are three chips on the bus, Slot 1 must be used along
with any two other slots.
Table 12 lists the FSYNC and BCLK rates that are supported in
multichip I2S mode.
Table 12. FSYNC and BCLK Rates in Multichip I2S Mode,
fS = 16 kHz to 48 kHz
Valid Slots FSYNC Rate BCLK Rate
1 and 2 2 × fS
(32 kHz to 96 kHz)
128 × fS
(2.048 MHz to 6.144 MHz)
1, 2, 3, 4 4 × fS
(64 kHz to 128 kHz)
256 × fS
(4.096 MHz to 12.288 MHz)
PDM OUTPUT MODE
By connecting the SLOT pin to GND through a 47 kΩ resistor,
the 1-bit PDM data from the ADCs can be output directly. In
PDM mode, a 1 MHz to 6.144 MHz clock must be provided on
Ball D3 (BCLK_TDM/PDM_CLK/LRCLK_I2S). PDM data is
sent on both edges of the clock and is output on Ball D1 (SDATAO/
PDM_DATA). (See the Timing Diagrams, PDM Mode section.)
In PDM mode, Ball D2 (FSYNC_TDM/BCLK_I2S) is used to
select the information that is output on the two possible channels
(see Table 13).
Table 13. FSYNC_TDM Pin Settings for PDM Mode
Output Data FSYNC_TDM Pin
Current data on rising edge;
voltage data on falling edge
Tie to IOVDD
Current data on rising edge;
PVDD data on falling edge
Tie to GND
SSM4321 Data Sheet
Rev. 0 | Page 18 of 24
TIMING DIAGRAMS, TDM MODE
TDM Mode, One Device
SLOT pin is tied to IOVDD.
64 BCLKs
CURRENT VOLTAGE
16 BCLKs
PVDD
16 BCLKs 8 BCLKs
BCLK_TDM
FSYNC_TDM
SDATAO
10752-016
Figure 39. TDM Mode, One Device
TDM Mode, Two Devices
IC 1: SLOT pin is tied to IOVDD; IC 2: SLOT pin is open.
BCLK_TDM
FSYNC_TDM
SDATAO CURRENT, IC 1 VOLTAGE, IC 1 PVDD, IC 1
16 BCLKs 16 BCLKs 8 BCLKs
64 BCL K s
CURRENT, IC 2 VOLTAGE, IC 2 PVDD, IC 2
16 BCLKs 16 BCLKs 8 BCLKs
64 BCLKs
128 BCLKs
10752-017
Figure 40. TDM Mode, Two Devices
TDM Mode, Three Devices
IC 1: SLOT pin is tied to IOVDD; IC 2: SLOT pin is open; IC 3: SLOT pin is tied to GND.
BCLK_TDM
FSYNC_TDM
SDATAO
CURRENT, IC 1 VOL TAGE, I C 1 PVDD, IC 1
16 BCLKs 16 BCLKs 8 BCLKs
64 BCLKs
CURRENT, IC 2 VOLT AGE, IC 2 PVDD, IC 2
16 BCLKs 16 BCLKs 8 BCLKs
64 BCLKs
192 BCLKs
64 BCLKs
CURRENT, IC 3 VO LT AGE, I C 3 PVDD, I C 3
16 BCLKs 16 BCLKs 8 BCLKs
10752-018
Figure 41. TDM Mode, Three Devices
TIMING DIAGRAMS, I2S AND LEFT JUSTIFIED MODES
I2S and Left Justified Modes with Voltage, Current, and PVDD Output, 64 × fS
I2S output mode: SLOT pin is tied to GND.
Left justified output mode: SLOT pin is tied to IOVDD through a 47 kΩ resistor.
64 BCLKs
VOLTAGE
VOLTAGE
16 BCLKs 16 BCLKs
CURRENT
CURRENT
16 BCLKs 16 BCLKs
8 BCLKs
8 BCLKs
PVDD
PVDD
BCLK_I2S
LRCLK_I2S
SDATAO I
2
S
SDATAO L J
10752-019
Figure 42. I2S and Left Justified Modes with Voltage, Current, and PVDD Output, 64 × fS
Data Sheet SSM4321
Rev. 0 | Page 19 of 24
I2S and Left Justified Modes with Voltage and Current Output Only, 64 × fS
I2S output mode: SLOT pin is tied to IOVDD (or tied to GND through a 47 kΩ resistor for low power operation at 64 × fS).
Left justified output mode: SLOT pin is open.
BCLK_I2S
LRCLK_I2S
SDATAO I
2
S
SDATAO L J
64 BCLKs
VOLTAGE
VOLTAGE
16 BCLKs 16 BCLKs
CURRENT
CURRENT
16 BCLKs 16 BCL Ks
10752-020
Figure 43. I2S and Left Justified Modes with Voltage and Current Output Only, 64 × fS
I2S Low Power Mode with Voltage and Current Output Only, 32 × fS
SLOT pin is tied to GND through a 47 kΩ resistor for low power operation at 32 × fS.
VOLTAGE CURRENT
32 BCLKs
16 BCLKs 16 BCLKs
BCLK_I2S
LRCLK_I2S
SDATA O I
2
S
10752-021
Figure 44. I2S Low Power Mode with Voltage and Current Output Only, 32 × fS
TIMING DIAGRAMS, MULTICHIP I2S MODE
Multichip I2S Mode with Two Devices on the Bus
IC 1: SLOT pin is tied to IOVDD; IC 2: SLOT pin is open.
IDCURRENT, I C 1PVDD, IC 1VOLTAGE, IC 1 IDCURRE NT, IC 2PVDD, IC 2VOLT AGE , I C 2
16 BCL Ks 8 BCLKs 16 BCLKs 4 BCLKs 16 BCLKs 8 BCL Ks 16 BCLKs 4 BCLKs
64 BCL Ks
BCLK_TDM
FSYNC_TDM
SDATAO
10752-022
Figure 45. Multichip I2S Mode with Two Devices on the Bus
Multichip I2S Mode with Three or Four Devices on the Bus
IC 1: SLOT pin is tied to IOVDD; IC 2: SLOT pin is open; IC 3: SLOT pin is tied to GND; IC 4: SLOT pin is tied to IOVDD through a
47 kΩ resistor.
IDCURRE NT, I C 1PVDD, IC 1VOL TAGE, IC 1 IDC URRENT, I C 2PVDD, IC 2VOLTAGE, I C 2
16 BCL Ks 8 BCLK s 16 BCLKs 4 BCLKs 16 BCLKs 8 BCLKs 16 BCLKs 4 BCLKs
64 BCLKs
BCLK_TDM
FSYNC_TDM
SDATAO
BCLK_TDM
FSYNC_TDM
SDATAO IDCURRENT , IC 3PVDD, IC 3VO LTAGE, I C 3 IDCURRENT , IC 4PVDD, I C 4VOLTAGE, IC 4
16 BCLKs 8 BCLKs 16 BCLKs 4 BCLKs 16 BCLKs 8 BCLKs 16 BCLKs
4 BCLKs
10752-023
Figure 46. Multichip I2S Mode with Three or Four Devices on the Bus
SSM4321 Data Sheet
Rev. 0 | Page 20 of 24
TIMING DIAGRAMS, PDM MODE
PDM Mode with Current and Voltage Output
SLOT pin is tied to GND through a 47 kΩ resistor; FSYNC_TDM pin is tied to IOVDD.
IVIVIVIVIVIVIVIVIVIVIVIVI
PDM_CLK
FSYNC_TDM
PDM_DATA
10752-024
Figure 47. PDM Mode with Current and Voltage Output
PDM Mode with Current and PVDD Output
SLOT pin is tied to GND through a 47 kΩ resistor; FSYNC_TDM pin is tied to GND.
I PVDD I PVDD I PVDD I PVDD I PVDD I PVDD I PVDD I PVDD I PVDD I PVDD I PVDD I PVDD I
PDM_CLK
FSYNC_TDM
PDM_DATA
10752-025
Figure 48. PDM Mode with Current and PVDD Output
Data Sheet SSM4321
Rev. 0 | Page 21 of 24
APPLICATIONS INFORMATION
LAYOUT
As output power increases, care must be taken to lay out PCB
traces and wires properly between the amplifier, load, and power
supply. A good practice is to use short, wide PCB tracks to decrease
voltage drops and minimize inductance. Ensure that track widths
are at least 200 mil for every inch of track length for lowest DCR,
and use 1 oz or 2 oz copper PCB traces to further reduce IR drops
and inductance. A poor layout increases voltage drops, conse-
quently affecting efficiency. Use large traces for the power supply
inputs and amplifier outputs to minimize losses due to parasitic
trace resistance.
Proper grounding helps to improve audio performance, mini-
mize crosstalk between channels, and prevent switching noise
from coupling into the audio signal. To maintain high output
swing and high peak output power, the PCB traces that connect
the output pins to the load, as well as the PCB traces to the supply
pins, should be as wide as possible to maintain the minimum trace
resistances. It is also recommended that a large ground plane be
used for minimum impedances.
In addition, good PCB layout isolates critical analog paths from
sources of high interference. Separate high frequency circuits
(analog and digital) from low frequency circuits.
Properly designed multilayer PCBs can reduce EMI emissions
and increase immunity to the RF field by a factor of 10 or more
compared with double-sided boards. A multilayer board allows
a complete layer to be used for the ground plane, whereas the
ground plane side of a double-sided board is often disrupted by
signal crossover.
If the system has separate analog and digital ground and power
planes, the analog ground plane should be directly beneath the
analog power plane, and, similarly, the digital ground plane should
be directly beneath the digital power plane. There should be no
overlap between the analog and digital ground planes or between
the analog and digital power planes.
INPUT CAPACITOR SELECTION
The SSM4321 does not require input coupling capacitors if
the input signal is biased from 1.0 V to PVDD − 1.0 V. Input
capacitors are required if the input signal is not biased within
this recommended input dc common-mode voltage range, if
high-pass filtering is needed, or if a single-ended source is used.
If high-pass filtering is needed at the input, the input capacitor
(CIN) and the input impedance of the SSM4321 (80 kΩ) form a
high-pass filter with a corner frequency determined by the
following equation:
fC = 1/(2π × 80 kΩ × CIN)
The input capacitor value and the dielectric material can
significantly affect the performance of the circuit. Not using
input capacitors degrades both the output offset voltage of the
amplifier and the dc PSRR performance.
POWER SUPPLY DECOUPLING
To ensure high efficiency, low total harmonic distortion (THD),
and high PSRR, proper power supply decoupling is necessary.
Noise transients on the power supply lines are short-duration
voltage spikes. These spikes can contain frequency components
that extend into the hundreds of megahertz. The power supply
input must be decoupled with a good quality, low ESL, low ESR
capacitor, with a minimum value of 4.7 µF. This capacitor bypasses
low frequency noises to the ground plane. For high frequency
transient noises, use a 0.1 µF capacitor as close as possible to the
PVDD pin of the device. Placing the decoupling capacitors as
close as possible to the SSM4321 helps to maintain efficient
performance.
SSM4321 Data Sheet
Rev. 0 | Page 22 of 24
OUTLINE DIMENSIONS
07-13-2011-A
A
B
C
D
0.560
0.500
0.440
SIDE VIEW
0.230
0.200
0.170
0.300
0.260
0.220
COPLANARITY
0.05
SEATING
PLANE
1
2
3
4
BOT TO M VIEW
(BAL L S IDE UP)
TOP VIEW
( BALL SIDE DOWN)
BALL A1
IDENTIFIER
0.40
REF
1.20
REF
1.780
1.74 0 S Q
1.700
Figure 49. 16-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-16-15)
Dimensions shown in millimeters
ORDERING GUIDE
Model1 Temperature Range Package Description Package Option2 Branding
SSM4321ACBZ-R7 −40°C to +85°C 16-Ball Wafer Level Chip Scale Package [WLCSP] CB-16-15 Y4E
SSM4321ACBZ-RL −40°C to +85°C 16-Ball Wafer Level Chip Scale Package [WLCSP] CB-16-15 Y4E
EVAL-SSM4321Z Evaluation Board
1 Z = RoHS Compliant Part.
2 This package option is halide free.
Data Sheet SSM4321
Rev. 0 | Page 23 of 24
NOTES
SSM4321 Data Sheet
Rev. 0 | Page 24 of 24
NOTES
©2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D10752-0-10/12(0)