This is information on a product in full production.
October 2013 DocID024171 Rev 3 1/13
MP33AB01H
MEMS audio surface-mount bottom-port silicon microphone with
analog output
Datasheet - production data
Features
Single supply voltage
Low power consumption
Omnidirectional sensitivity
High signal-to-noise ratio
High bandwidth
Package compliant with reflow soldering
Description
The MP33AB01H is a compact, low-power
microphone built with a low-profile sensing
element.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process to
produce audio sensors.
The MP33AB01H has an acoustic overload point
of 125 dBSPL with a 66 dB signal-to-noise ratio.
The MP33AB01H is available in a package
compliant with reflow solde ring and is guaran teed
to operate over an extended temperature range
from -30 °C to +100 °C.
RHLGA 3.76 x 2.95 x 1.0 mm
Table 1. Device su mmary
Order code Temperature range [°C] Package Packing
MP33AB01H -30 to +100 RHLGA (3.76 x 2.95 x 1.0) mm Tray
MP33AB01HTR -30 to +100 RHLGA (3.76 x 2.95 x 1.0) mm Tape and reel
www.st.com
Contents MP33AB01H
2/13 DocID024171 Rev 3
Contents
1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
DocID024171 Rev 3 3/13
MP33AB01H Pin description
13
1 Pin description
Figure 1. Pin connections
Table 2. Pin description
Pin # Pin name Function
1 Output Anal o g output
2 GND 0 V supply
3 GND 0 V supply
4 Vdd Power supply
5 GND 0 V supply
6 GND 0 V supply
TOP VIEW BOTTOM VIEW
3
45
2
1
6
Acoustic and electrical specifications MP33AB01H
4/13 DocID024171 Rev 3
2 Acoustic and electrical specifications
2.1 Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 2.2 V unless otherwise noted.
Table 3. Acoustic and electrical characteristics
Symbol Parameter Test condition Min. Typ.(1)
1. Typical specifications are not guaranteed.
Max. Unit
Vdd Supply voltage 1.5 2.2 3.6 V
Idd Current consumption mean value = 2 V 0.25 mA
FR Frequency range 100 10000 Hz
So Sensitivity at 1 kHz (0 dB = 1 V/Pa) -41 -38 -35 dBV
SNR Signal-to-noise ratio at 1 kHz (0 dB = 1 V/Pa) 64 66 dB
Top Operating temperature range -30 +100 °C
Table 4. Distortion specifications at 1 k Hz
Parameter Test condition Value
Distortion 94 dBSPL < 1% THD
Distortion 125 dBSPL 10% THD (typ.)
DocID024171 Rev 3 5/13
MP33AB01H Acoustic and elect r ical specifications
13
2.2 Frequency response
Figure 2. Typical frequency respons e normalized at 1 kHz
-30
-20
-10
0
10
20
30
10 100 1000 10000
Sensitivity (dBV)
Frequency (Hz)
Absolute maximum ratings MP33AB01H
6/13 DocID024171 Rev 3
3 Absolute maximum ratings
Stresses above those listed as “Absolute ma ximum ratin gs” may caus e permane nt damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended per iods m ay
affect device reliability.
Table 5. Absolute maximum ratings
Symbol Ratings Maximum value Unit
Vdd Supply voltage -0.5 to 4 V
TSTG Storage temperature range -40 to +100 °C
This device is sensitive to mechanical shock, improper handling can cause
permanent damage to the part.
This device is ESD-sensitive, improper handling can cause permanent damage to the
part.
DocID024171 Rev 3 7/13
MP33AB01H Application recommendations
13
4 Application recommendations
Figure 3. MP33AB01H electrical connections and external component values
The DC-blocking capacitor C1 is required on the Vout pin as shown in Figure 3. The C1
value and the input resistance of the interface circuit (R) affect the cut-off frequency of the
Audio signal pa th as:
3 dB cut-off freq = 1 / 2 RC1
It's advisable to have a cut-off frequency well below 20 HZ, so for a typical input resist an ce
of about 20 kit is recommended to use a C1 > 1 µF.
MP33AB01H
Pin.4
Pin.1
Pin.2,3,5,6
+
Vdd
C1
C2 C3
(Ground)
R2
Typical values:
C1 > 1 µF
C2 ~ 1000 pF
C3 = 1 µF
(
Vout
)
-
R1
Vref
Ext. gain = (R1+R2) / R1
Vref
R
Package mechanical data MP33AB01H
8/13 DocID024171 Rev 3
5 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Soldering information
The RHLGA (3.76 x 2.95) mm package is also compliant with the RoHS and “Gr een”
standards and is qualified for soldering heat resista nce according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
Figure 4. Recommended soldering profile limits
Table 6. Recommended soldering profile limits
Description Parameter Pb free
Average ramp rate TL to TP3 °C/sec max
Preheat Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)
TSMIN
TSMAX
tS
150 °C
200 °C
60 sec to 120 sec
Ramp-up rate TSMAX to TL
Time maintained above liquidous temperatu re
Liquidous temperature tL
TL
60 sec to 150 sec
217 °C
Peak temperature TP260 °C max
Time within 5 °C of actual peak temperature 20 sec to 40 sec
Ramp-down rate 6 °C/sec max
Time 25 °C (t25 °C) to peak temperature 8 minutes max
T25°C to PEAK
RAMP-DOWN
RAMP-UP
ts
PREHEAT
tL
tp
CRITICAL ZONE
TLto TP
TSMAX
TSMIN
TIME
TP
TL
TEMPERATURE
30 60 90 120 150 180 210 240 270 300 330 360 390 AM045166v1
DocID024171 Rev 3 9/13
MP33AB01H Package mechanical data
13
Figure 5. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package outline
D1
E1
A1
N2
L2
N1
L1
N3
L3
D2
G1
G2
d
P2
P1
R1
G5
E2
G3
E
D
C
K
K
D
K
E
K
C
K
Pin 1 Indicator
Pin 1 Indicator
G4
Pad 5
Pad 6
TOP VIEW BOTTOM VIEW
//
8233292_D
Ta b le 7. R HL GA 3. 76 mm x 2.95 mm x 1.0 mm package dimensions
Symbol mm. inch.
Min. Typ. Max. Min. Typ. Max.
A1 0.900 1.000 1.100 0.0354 0.0394 0.0433
D1 3.660 3.760 3.860 0.1441 0.1480 0.1520
D2 0.600 0.750 0.900 0.0236 0.0295 0.0354
R1 0.200 0.250 0.300 0.0079 0.0098 0.0118
E1 2.850 2.950 3.050 0.1122 0.1161 0.1201
E2 1.325 1.475 1.625 0.0522 0.0581 0.0640
L1 2.690 2.740 2.790 0.1059 0.1079 0.1098
L2 1.882 1.932 1.982 0.0741 0.0761 0.0780
L3 1.981 2.031 2.181 0.0780 0.0800 0.0859
N1 1.300 1.350 1.400 0.0512 0.0531 0.0551
N2 0.916 0.966 1.116 0.0361 0.0380 0.0440
N3 0.965 1.015 1.065 0.0380 0.0400 0.0419
G1 0.673 0.723 0.763 0.0265 0.0285 0.0300
G2 0.512 0.562 0.612 0.0202 0.0221 0.0241
G3 0.562 0.612 0.662 0.0221 0.0241 0.0261
G4 0.562 0.612 0.662 0.0221 0.0241 0.0261
G5 1.174 1.224 1.274 0.0462 0.0482 0.0502
P1 1.680 1.730 1.780 0.0661 0.0681 0.0701
P2 1.275 1.325 1.375 0.0502 0.0522 0.0541
Package mechanical data MP33AB01H
10/13 DocID024171 Rev 3
Figure 6. Device footprint and PCB land pattern
d 0.150 0.0059
K 0.050 0.0020
Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions (continued)
Symbol mm. inch.
Min. Typ. Max. Min. Typ. Max.
DocID024171 Rev 3 11/13
MP33AB01H Package mechanical data
13
Figure 7. Recommended stenc il openings
DocID024171 Rev 3 13/13
MP33AB01H
13
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