GLT6200L08/M08/N08 ADVANCED 256K x 8 Super Low Power & Low Voltage SRAM FEATURES Organization: 256K x 8 Low Data Retention Voltage: 1.5 V (min) Power Supply Voltage Maximum 2 A Standby Current Three-state output status and TTL compatible Package type; JEDEC standard 32-Pin SOP, 32-Pin TSOP I, 32-Pin Shrink TSOP I - GLT6200L08: 2.7 V ~ 3.6 V - GLT6200M08: 2.3 V ~ 2.7 V - GLT6200N08: 1.8 V ~ 2.3 V Product Family Organization Part Number VCC Isb1 Speed Temperature 256Kx8 GLT6200L/LI 2.7 ~ 3.6 V 2 a 70/85/100 256Kx8 GLT6200M/MI 2.3 ~2.7 V 2 a 100/120/150 Commercial: 0 to +70C Industrial: -40 to +85C 256Kx8 GLT6200N/NI 1.8 ~ 2.3 V 2 a 150/300 GENERAL DESCRIPTION The GLT 6200L08/M08/N08 Super Low-Power SRAM family can support various voltage and operating temperature ranges and has various package types for user flexibility of system design. The family also support low data retention voltage for battery back-up operations with low data retention current. April 23, 1999 1 ADVANCED GLT6200L08/M08/N08 FUNCTIONAL BLOCK DIAGRAM A[17:0] Addr Buffer Decoder CS1 CS2 Buffer OE Control Memory Array I/O [7:0] WE Data Path Figure 1. GLT6200L08/M08/N08 256K x 8 Signal Descriptions Symbol A[17:0] Type Input Description Address Inputs WE Control Write Enable Input CS1 Control Chip Select Input CS2 Control Chip Select Input OE Control Output Enable Input I/O[7:0] I/O VCC Power VSS Power NC N/A Data Input/Output Power Ground No Connection Functional Truth Table [1] CS1 CS2 WE OE Mode I/O [7:0] Current Mode H X X X Not Select High-Z ISB1 X L X X Not Select High-Z ISB1 L H H H Output Disable High-Z ICC L H H L Read DOUT ICC L H L X Write DIN ICC 1. X means don't care (High or Low) 2 G-LINK Technology April 23, 1999 ADVANCED GLT6200L08/M08/N08 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings [1] Parameter Rating -0.2 V to VCC + 0.5 V Voltage on any Pin Relative to VSS Voltage on VCC Supply Relative to VSS -0.2 V to 4.0 V Power Dissipitation 1.0 W Storage Temperature -55 C to +150 C Operation Temperature Commercial 0 C to +70 C Industrial -40 C to +85 C Soldering Temperature and Time 260 C, 5 Sec (Lead Only) 1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Recommended DC Operating Conditions [1] [2] Symbol Description Product Min Typ [3] Max Units VCC Supply Voltage GLT6200L GLT6200M GLT6200N 2.7 2.3 1.8 3.3 2.5 2.0 3.6 2.7 2.3 V V V VSS Ground All Family 0 0 0 V VIH Input High Voltage Input Low Voltage VIL 1. 2. 3. 4. 5. + 0.2 [4] V V GLT6200L 2.2 - VCC GLT6200M 2.0 - VCC + 0.2 [4] + 0.2 [4] V 0.4 V GLT6200N 1.6 - All Family -0.2 [5] - VCC Commercial product: TA = 0 to +70 C, unless otherwise specified. Industrial Product: TA = -40 to +85 C, unless specified otherwise TA = 25 C VIH (max) = VCC + 1.0 V for 20 ns pulse width VIL (min) = -1.0V for 20 ns pulse width Capacitance [1] (f = 1MHz, TA = 25C) Symbol Min Max Units CIN Input Capacitance Description VIN = 0 V Conditions - 8 pF CIO Input/Output Capacitance VIO = 0 V - 10 pF 1. Capacitance is sampled, not 100% tested G-LINK Technology April 23, 1999 3 ADVANCED GLT6200L08/M08/N08 DC Characteristics Symbol Test Conditions [1] Description Min TYP Max Units ILI Input Leakage Current VIN = VSS to VCC -1 - 1 A ILO Output Leakage Current CS1 = VIH or CS2 = VIL or WE = VIL, or OE = VIH VIO = VSS to VCC -1 - 1 A ICC Operating Power Supply Current CS1 = VIL, CS2 = VIH, VIN = VIH or VIL, IIO = 0 mA - - 12 [2] mA ICC1 Average Operating Current Cycle time = 1 s, 100% duty, CS1 0.2V, CS2 VCC - 0.2V, IIO = 0 mA, VIN 0.2 V, or VIN VCC - 0.2 V - - 15 [2] mA ICC2 Average Operating Current CS1 = VIL, CS2 = VIH, IIO = 0 mA Min cycle, 100% duty VIN = VIL or VIH VCC = 3.3V @ 70 ns - - 40 [3] mA VCC = 2.7V @ 100 ns - - 25 VCC = 2.2V @ 150 ns - - 15 LOL VCC = 3.0/3.3V 2.1 mA - - 0.4 VCC = 2.5V 0.5 mA - - VCC = 2.0V 0.33 mA - VCC = 3.0/3.3V -1.0 mA 2.4 - - VCC = 2.5V -0.5 mA 2.0 - - VCC = 2.0V -0.44 mA 1.6 - - - - 0.3 mA Super Low Power - 0.05 [4] 2 [5] A Low Low Power - - 10 [6] A VOL VOH ISB ISB1 Output Low Voltage Output High Voltage LOH Standby Current (TTL) CS2 VIL or CS1 VIH, CS2 VIH Standby Current (CMOS) CS1 VCC - 0.2V, CS2 VCC - 0.2V or CS2 0.2V GLT6200x08SL GLT6200x08LL G-LINK Technology April 23, 1999 0.4 0.4 1. Commercial Products TA = 0 to 70C, VCC = 2.7 ~ 3.6V for GLT6200L Family, VCC = 2.3 (min) ~ 2.7V (max) for GLT6200M Family, VCC = 1.8 (min) ~ 2.3V (max) for GLT6200N Family Industrial Product TA = -40 to 85C, VCC = 2.7 ~ 3.6V for GLT6200LI Family, VCC = 2.3 (min) ~ 2.7V (max) for GLT6200MI Family, VCC = 1.8 (min) ~ 2.3V (max) for GLT6200NI Family 2. The Value is measured at VCC = 3.6V. The value measured at VCC = 2.5/2.0V 0.2 is under the value of VCC = 3.6V 3. ICC2 = 40 mA with 70 ns cycle at VCC = 2.7 ~ 3.6V, but the value is not 100% tested but obtained statistically ICC2 = 25 mA with 120 ns cycle at VCC = 2.5V 0.2, but the value is not 100% tested but obtained statistically ICC2 = 15 mA with 300 ns cycle at VCC = 1.8~ 2.3V, but the value is not 100% tested but obtained statistically 4. The value is not 100% tested but obtained statistically at Temp = 25C 5. The value has a difference by 1 A. 6. ISB1 = 10A for VCC = 2.3 ~ 3.6V ISB1 = 6A for VCC = 1.8 ~ 2.3V 4 V V ADVANCED GLT6200L08/M08/N08 AC Timing Characteristics -70 Symbol -100 -120 -150 -300 Min Max Min Max Min Max Min Max Min Max Min Max Unit Read Cycle Time 70 - 85 - 100 - 120 - 150 - 300 - ns tAA Address Access Time - 70 - 85 - 100 - 120 - 150 - 300 ns tCO Chip Select to Output - 70 - 85 - 100 - 120 - 150 - 300 ns tOE Output Enable to Valid Output - 35 - 45 - 50 - 60 - 75 - 150 ns tLZ Chip Select To Low-Z Output 10 - 10 - 10 - 10 - 20 - 50 - ns tRC Parameter -85 Read tOLZ Output enable to Low-Z Output 5 - 5 - 5 - 5 - 10 - 30 - ns tHZ Chip Disable To High-Z Output 0 25 0 25 0 30 0 35 0 40 0 60 ns tOHZ Output Disable to High-Z Output 0 25 0 25 0 30 0 35 0 40 0 60 ns tOH Output Hold From Address Change 10 - 15 - 15 - 15 - 15 - 30 - ns Write Cycle Time 70 - 85 - 100 - 120 - 150 - 300 - ns tCW Chip Select to end of Write 65 - 70 - 80 - 100 - 120 - 300 - ns tAS Address Set-up time 0 - 0 - 0 - 0 - 0 - 0 - ns tAW Address Valid to end of Write 65 - 70 - 80 - 100 - 120 - 300 - ns tWP Write Pulse Width 55 - 60 - 70 - 80 - 100 - 200 - ns tWR Write Recovery time 0 - 0 - 0 - 0 - 0 - 0 - ns tWHZ Write To Output High-Z 0 25 0 25 0 30 0 35 0 40 0 60 ns tDW Data to Write Time Overlap 30 - 35 - 40 - 50 - 60 - 120 - ns tDH Data Hold From Write Time 0 - 0 - 0 - 0 - 0 - 0 - ns tOW End Write To Output Low-Z 5 - 5 - 5 - 5 - 5 - 20 - ns tWC Write G-LINK Technology April 23, 1999 5 ADVANCED GLT6200L08/M08/N08 Test Load and Input/Output Reference [1] VTM Item Value Remark Input Pulse Level 0.4 V to 2.2 V VCC = 3.3 V, 3.0 V, 2.5 V 0.4 V to 1.8 V VCC = 2.0 V Input Rise Fall Time 5 ns - Input And Output Reference Voltage 1.5 V 1.1 V 0.9 V VCC = 3.3 V, 3.0 V VCC = 2.5 V VCC = 2.0 V Output Load CL = 100 PF + 1TTL R1 CI R2 NOTE: 1. Including Scope and jig capacitance 2. R1 = 3070, R2 = 3150 3. VTM = 2.8 for VCC = 3.0/3.3V, 2.3V for VCC = 2.5V, 1.8 V for VCC = 2.0V See Test Condition #2 Figure 2. CL = 30 PF + 1TTL 1. See test condition of DC and Operating Characteristics Temperature and VCC Conditions Product Family Temperature VCC Range Typical Supply VCC Speed (ns) Commercial 0 C to +70C 1.8 (min) ~ 2.3V (max) 2.0 0.2V 150 [1] / 300 2.3 (min) ~ 2.7V (max) 2.5 0.2V 100 [1] / 120 / 150 GLT6200L 2.7 (min) ~ 3.6V (max) 3.0 0.3V 85 [1] / 100 GLT6200L 3.0 (min) ~ 3.6V (max) 3.3 0.3V 70 [1] / 85 1.8 (min) ~ 2.3V (max) 2.0 0.2V 150 [1] / 300 2.3 (min) ~ 2.7V (max) 2.5 0.2V 100 [1] / 120 / 150 GLT6200LI 2.7 (min) ~ 3.6V (max) 3.0 0.3V 85 [1] / 100 GLT6200LI 3.0 (min) ~ 3.6V (max) 3.3 0.3V 70 [1] / 85 GLT6200N GLT6200M GLT6200NI Industrial -40 C to +85C GLT6200MI 1. Parameters are measured with 30 pF test load 6 G-LINK Technology April 23, 1999 ADVANCED GLT6200L08/M08/N08 Data Retention Characteristics Symbol Description Conditions VDR VCC For Data Retention CS1 VCC - 0.2 V, CS2 VCC - 0.2 V or CS2 0.2 V IDR Data Retention Current VCC = 3.0 V CS1 VCC - 0.2 V, CS2 VCC - 0.2 V or CS2 0.2 V tSDR Data Retention Set-up Time tRDR Recovery Time Min Typ Max Units 1.5 - 3.6 V Super Low Power - - 2 [1] A Low Low Power - - 10 [1] 0 - - tRC - - See Data Retention Waveform ns 1. IDR = 5A for low low power at VCC = 1.5V IDR = 1A for super low power at VCC = 1.5V and need special handling. CS1 Controlled VCC 3.3/3.0/2.7/2.3/1.8V 2.2 V VDR GND & CS1 tSDR Data Retention Mode CS1 VCC -0.2V tRDR CS2 Controlled VCC 3.3/3.0/2.7/2.3/1.8V 2.2 V VDR GND & CS2 tSDR Data Retention Mode tRDR CS2 VCC -0.2V Figure 3. Data Retention Timing Diagram G-LINK Technology April 23, 1999 7 ADVANCED GLT6200L08/M08/N08 tRC ADDRESS tAA tOH DATA OUT PREVIOUS DATA VALID VALID DATA NOTE: 1. tHZ and tOHZ are defined as the time at which the output achieves the open circuit conditions and are not referenced to output voltage levels. 2. At any given temperature and voltage condition, tHZ (Max) is less than tLZ (Min) both for a given device and device to device interconnection. Figure 4. Read Cycle Timing (Address Controlled, CS1 = OE = VIL, WE = CS2 = VIH) tRC ADDRESS tAA tCO tOH CS1 CS2 tCO OE tOE tOLZ DATA OUT HIGH-Z tOHZ DATA VALID tLZ NOTE: 1. tHZ and tOHZ are defined as the time at which the output achieves the open circuit conditions and are not referenced to output voltage levels. 2. At any given temperature and voltage condition, tHZ (Max) is less than tLZ (Min) both for a given device and device to device interconnection. Figure 5. Read Cycle Timing (WE = VIH) 8 G-LINK Technology April 23, 1999 HIGH-Z ADVANCED GLT6200L08/M08/N08 tWC ADDRESS tCW [2] tWR [4] CS1 tAW CS2 tCW [2] tAS [3] tWP [1] WE tDW DATA IN High-Z tDH DATA VALID High-Z tWHZ DATA OUT tOW DATA UNDEFINED NOTE: 1. A write occurs during the overlap of a low CS1, A high CS2 and a low WE. A write begins at the latest transition among CS1 going and WE going low. A write ends at the earliest transition among CS1 goes high and WE going high, tWP is measured from the beginning of write to the end of write. 2. tCW is measured from the later of CS1 going low to the end of write. 3. tAS is measured from the address valid to the beginning of write. 4. tWR is measured from the end of write to the address change. tWR1 applied encase a write ends at CS1, or WE going high. Figure 6. Write Cycle Timing (WE Controlled) tWC ADDRESS tAS [3] tCW [2] tWR [4] CS1 tAW CS2 tCW [2] tWP [1] WE tDW DATA IN Data Out tDH DATA VALID High-Z NOTE: 1. A write occurs during the overlap of a low CS1, A high CS2 and a low WE. A write begins at the latest transition among CS1 going and WE going low. A write ends at the earliest transition among CS1 goes high and WE going high, tWP is measured from the beginning of write to the end of write. 2. tCW is measured from the later of CS1 going low to the end of write. 3. tAS is measured from the address valid to the beginning of write. 4. tWR is measured from the end of write to the address change. tWR1 applied encase a write ends at CS1, or WE going high. Figure 7. Write Cycle Timing (CS1 Controlled) G-LINK Technology April 23, 1999 9 ADVANCED GLT6200L08/M08/N08 tWC ADDRESS tCW [2] tWR [4] CS1 tAW tBW CS2 tAS [3] tWP [1] WE tDW DATA IN tDH DATA VALID DATA OUT HIGH-Z NOTE: 1. A write occurs during the overlap of a low CS1, A high CS2 and a low WE. A write begins at the latest transition among CS1 going and WE going low. A write ends at the earliest transition among CS1 goes high and WE going high, tWP is measured from the beginning of write to the end of write. 2. tCW is measured from the later of CS1 going low to the end of write. 3. tAS is measured from the address valid to the beginning of write. 4. tWR is measured from the end of write to the address change. tWR1 applied encase a write ends at CS1, or WE going high. Figure 8. Write Cycle Timing (CS2 Controlled) 10 G-LINK Technology April 23, 1999 ADVANCED GLT6200L08/M08/N08 PACKAGING INFORMATION A11 A9 A8 A13 WE CS 2 A15 VCC A17 A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Top View 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CS 1 I/O 7 I/O 6 I/O 5 I/O 4 I/O 3 VSS I/O 2 I/O 1 I/O 0 A0 A1 A2 A3 Figure 9. 32-Pin TSOP and sTSOP I Pin Assignment G-LINK Technology April 23, 1999 11 ADVANCED GLT6200L08/M08/N08 1.20 max 1.05 0.05 20.00 0.20 18.40 0.10 #1 0.00 min #32 0.2 0.50 #16 0.10 max #17 8.0 0.2 0.25 0.15 +0.10/-0.05 0~ 8 0.50 0.10 Dimensions in millimeters Figure 10. 32-Pin TSOP (Type I) 8 x20 Forward Package Dimensions 12 G-LINK Technology April 23, 1999 ADVANCED GLT6200L08/M08/N08 1.20 max 1.05 0.05 13.40 0.10 11.80 0.10 0.00 min #1 #32 0.2 +0.10/-0.05 0.50 #16 0.10 max #17 8.40 max 0.25 0.15 +0.10/-0.05 0.50 0.10 Dimensions in millimeters Figure 11. 32-Pin sTSOP (Type I) 8 x13.4 Forward Package Dimensions G-LINK Technology April 23, 1999 13 ADVANCED GLT6200L08/M08/N08 ORDERING INFO GLT6200x08LL Standby Current Cycle Time VCC Range Temperature Orientation GLT6200L08LL-70TS 10 A 70 ns 3.0 ~ 3.6 Commercial Forward 32-Pin TSOP I (330mil) GLT6200L08LL-85TS 10 A 85 ns 2.7 ~ 3.6 Commercial Forward 32-Pin TSOP I (330mil) GLT6200L08LL-70ST 10 A 70 ns 3.0 ~ 3.6 Commercial Forward 32-Pin s-TSOP I (330mil) GLT6200L08LL-85ST 10 A 85 ns 2.7 ~ 3.6 Commercial Forward 32-Pin s-TSOP I (330mil) GLT6200M08LL-100TS 10 A 100 ns 2.3 ~ 2.7 Commercial Forward 32-Pin TSOP I (330mil) GLT6200M08LL-120TS 10 A 120 ns 2.3 ~ 2.7 Commercial Forward 32-Pin TSOP I (330mil) GLT6200M08LL-100ST 10 A 100 ns 2.3 ~ 2.7 Commercial Forward 32-Pin TSOP I (330mil) GLT6200M08LL-120ST 10 A 120 ns 2.3 ~ 2.7 Commercial Forward 32-Pin s-TSOP I (330mil) GLT6200N08LL-150TS 10 A 150 ns 1.8 ~ 2.3 Commercial Forward 32-Pin s-TSOP I (330mil) GLT6200N08LL-150ST 10 A 150 ns 1.8 ~ 2.3 Commercial Forward 32-Pin s-TSOP I (330mil) GLT6200N08LL-300TS 10 A 300 ns 1.8 ~ 2.3 Commercial Forward 32-Pin TSOP I (330mil) GLT6200N08LL-300ST 10 A 300 ns 1.8 ~ 2.3 Commercial Forward 32-Pin s-TSOP I (330mil) Standby Current Cycle Time VCC Range Temperature Orientation GLT6200L080LLI-70TS 10 A 70 ns 3.0 ~ 3.6 Industrial Forward 32-Pin TSOP I (330mil) GLT6200L080LLI-85TS 10 A 85 ns 2.7 ~ 3.6 Industrial Forward 32-Pin TSOP I (330mil) GLT6200L080LLI-70ST 10 A 70 ns 3.0 ~ 3.6 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200L080LLI-85ST 10 A 85 ns 2.7 ~ 3.6 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200M08LLI-100TS 10 A 100 ns 2.3 ~ 2.7 Industrial Forward 32-Pin TSOP I (330mil) GLT6200M08LLI-120TS 10 A 120 ns 2.3 ~ 2.7 Industrial Forward 32-Pin TSOP I (330mil) GLT6200M08LLI-100ST 10 A 100 ns 2.3 ~ 2.7 Industrial Forward 32-Pin TSOP I (330mil) GLT6200M08LLI-120ST 10 A 120 ns 2.3 ~ 2.7 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200N08LLI-150TS 10 A 150 ns 1.8 ~ 2.3 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200N08LLI-150ST 10 A 150 ns 1.8 ~ 2.3 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200N08LLI-300TS 10 A 300 ns 1.8 ~ 2.3 Industrial Forward 32-Pin TSOP I (330mil) GLT6200N08LLI-300ST 10 A 300 ns 1.8 ~ 2.3 Industrial Forward 32-Pin s-TSOP I (330mil) Part Number Package GLT6200x08LLI Part Number 14 G-LINK Technology April 23, 1999 Package ADVANCED GLT6200L08/M08/N08 GLT6200x08SL Standby Current Cycle Time VCC Range Temperature Orientation GLT6200L08SL-70TS 2 A 70 ns 3.0 ~ 3.6 Commercial Forward 32-Pin TSOP I (330mil) GLT6200L08SL-85TS 2 A 85 ns 3.0 ~ 3.6 Commercial Forward 32-Pin TSOP I (330mil) GLT6200L08SL-70ST 2 A 70 ns 2.7 ~ 3.6 Commercial Forward 32-Pin s-TSOP I (330mil) GLT6200L08SL-85ST 2 A 85 ns 2.7 ~ 3.6 Commercial Forward 32-Pin s-TSOP I (330mil) GLT6200M08SL-100TS 2 A 100 ns 2.3 ~ 2.7 Commercial Forward 32-Pin TSOP I (330mil) GLT6200M08SL-120TS 2 A 120 ns 2.3 ~ 2.7 Commercial Forward 32-Pin TSOP I (330mil) GLT6200M08SL-100ST 2 A 100 ns 2.3 ~ 2.7 Commercial Forward 32-Pin TSOP I (330mil) Part Number Package GLT6200M08SL-120ST 2 A 120 ns 2.3 ~ 2.7 Commercial Forward 32-Pin s-TSOP I (330mil) GLT6200N08SL-150TS 2 A 150 ns 1.8 ~ 2.3 Commercial Forward 32-Pin s-TSOP I (330mil) GLT6200N08SL-150ST 2 A 150 ns 1.8 ~ 2.3 Commercial Forward 32-Pin s-TSOP I (330mil) GLT6200N08SL-300TS 2 A 300 ns 1.8 ~ 2.3 Commercial Forward 32-Pin TSOP I (330mil) GLT6200N08SL-300ST 2 A 300 ns 1.8 ~ 2.3 Commercial Forward 32-Pin s-TSOP I (330mil) Standby Current Cycle Time VCC Range Temperature Orientation GLT6200L080SLI-70TS 2 A 70 ns 3.0 ~ 3.6 Industrial Forward 32-Pin TSOP I (330mil) GLT6200L080SLI-85TS 2 A 85 ns 3.0 ~ 3.6 Industrial Forward 32-Pin TSOP I (330mil) GLT6200L080SLI-70ST 2 A 70 ns 2.7 ~ 3.6 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200L080SLI-85ST 2 A 85 ns 2.7 ~ 3.6 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200M08SLI-100TS 2 A 100 ns 2.3 ~ 2.7 Industrial Forward 32-Pin TSOP I (330mil) GLT6200M08SLI-120TS 2 A 120 ns 2.3 ~ 2.7 Industrial Forward 32-Pin TSOP I (330mil) GLT6200M08SLI-100ST 2 A 100 ns 2.3 ~ 2.7 Industrial Forward 32-Pin TSOP I (330mil) GLT6200M08SLI-120ST 2 A 120 ns 2.3 ~ 2.7 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200N08SLI-150TS 2 A 150 ns 1.8 ~ 2.3 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200N08SLI-150ST 2 A 150 ns 1.8 ~ 2.3 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200N08SLI-300TS 2 A 300 ns 1.8 ~ 2.3 Industrial Forward 32-Pin TSOP I (330mil) GLT6200N08SLI-300ST 2 A 300 ns 1.8 ~ 2.3 Industrial Forward 32-Pin s-TSOP I (330mil) GLT6200x08SLI Part Number Package G-LINK Technology April 23, 1999 15 GLT6200L08/M08/N08 www.glinktech.com G-LINK Technology 1753 South Main Street Milpitas, California, 95035, USA TEL: 408-240-1380 * FAX: 408-240-1385 G-LINK Technology Corporation, Taiwan 6F, No. 24-2, Industry E. Rd. IV Science-Based Industrial Park Hsin Chu, Taiwan, R.O.C. TEL: 03-578-2833 * FAX: 03-578-5820 (c) 2001 G-LINK Technology All rights reserved. No part of this document may be copied or reproduced in any form or by any means or transferred to any third party without the prior written consent of G-LINK Technology. Circuit diagrams utilizing G-LINK products are included as a means of illustrating typical semiconductor applications. Complete information sufficient for design purposes is not necessarily given. G-LINK Technology reserves the right to change products or specifications without notice. The information contained in this document does not convey any license under copyrights, patent rights or trademarks claimed and owned by G-LINK or its subsidiaries. G-LINK assumes no liability for G-LINK applications assistance, customer's product design, or infringement of patents arising from use of semiconductor devices in such systems' designs. Nor does G-LINK warrant or represent that any patent right, copyright, or other intellectual property right of G-LINK covering or relating to any combination, machine, or process in which such semiconductor devices might be or are used. G-LINK Technology's products are not authorized for use in life support devices or systems. Life support devices or systems are device or systems which are: a) intended for surgical implant into the human body and b) designed to support or sustain life; and when properly used according to label instructions, can reasonably be expected to cause significant injury to the user in the event of failure. The information contained in this document is believed to be entirely accurate. However, G-LINK Technology assumes no responsibility for inaccuracies. Printed in USA