136
Detector Slide Push Rotary Power
Dual-in-line
Package Type
SPED2
Smooth and linear operation feeling
4.5mm-travel Push-push Type
SPED210203
2,000
Japan Export
2 1
1 2
Poles
Positions
Non shorting
Changeover
timing
For PC board
−
Terminal
type
1,12 0280
400
Minimum order unit （pcs.）
Alternate
Operation
SPED220200
Product No.
Product Line
PC board
Connector
Mounting
method
4.5
Total travel
（mm）
1
2
Drawing
No.
■Typical Specifications
Items Specifications
Rating （Resistive load）
1A 14.5V DC
Contact resistance
（Initial / After operating life）
100mΩ max. / 100mΩ max.
Operating force
4.17±0.74N
Operating life （With load）
30,000 cycles （1A 14.5V DC）
Circuit configuration
2-pole, 1-position
1-pole, 2-position
Style PC board mounting dimensions
（Viewed from the mounting face side）
15.58
ø3
2.85
3.55
2.65
8
4-1
ø4.8
1.05
14
16.8
2
11.65
0.89.5
18.3
8.3
26.7
Turnover position
3.5
ø9.7
ø10
ø11.15
4.5
Travel
Terminal No.
C1
Terminal No.
C2
Terminal No.
1
Terminal No. 2
A
Dimensions Unit:mm
15
2-2.1
2.2
ø
3.05 hole
2.65
8
4-
ø
1.2 hole
11.65
(T=1.6)
No.
1
Refer to P.140 for soldering conditions.
Product No. Number of packages （pcs.）
Export package measurements
（mm）
1 case /
Japan
1 case / export packing
SPED210203 400 2,000 400×270×290
Bulk
Product No. Number of packages （pcs.）
Export package measurements
（mm）
1 case /
Japan
1 case / export packing
SPED220200 280 1,12 0 555×375×223
Packing Specifications
Tray
Horizontal
Type
Vertical
Type
137
Detector Slide Push Rotary Power
Dual-in-line
Package Type
SPED2／4.5mm-travel Push-push Type
Factory setting for contact points can be either 1 or 2.
Note
Circuit Diagram
C1
C2
12
Style
Dimensions Unit:mm
No.
2
6.75
8
ø4.8
ø10
14
16.8
6.1
9.5
Turnover position
3.5
ø9.7
8.8
ø10
ø11.15
1.2
17.2
4.5
Travel
Terminal No.
C1 C2
Terminal No. 2
Terminal No.1
Horizontal
Type
Vertical
Type
117
Horizontal
Type
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Vertical
Type
Series Vertical
SPEF SPED2 SPED3 SPED4 SPED5
Photo
Dimensions
（mm）
W
9.4 14 13 . 5
D
916 . 8 18 18 . 2
H
6.9 18 . 3 16 . 9 7 13 .1 18
Travel （mm）
1. 5 — — — —
Total travel （mm）
2.7 4.5 3.8
Number of poles
11
21
Operating
temperature range
−40℃ to ＋85℃ −40℃ to ＋95℃
Automotive use
●●●●●●
Life cycle
Rating （max.）
（Resistive load）
1A 14.5 V D C 2 A 14 . 5 V DC
Rating （min.）
（Resistive load）
50μA 3V DC ————
Durability
Operating life
without load
——————
Operating life with load
（at max. rated load）
30,000 cycles 100mΩ max.
Electrical
performance
Initial contact
resistance
10 0 mΩ ma x .
Insulation
resistance
3 MΩ min . 10 0 V D C 3MΩ min. 500V DC
Voltage proof
10 0 V A C f o r 1m i n u t e
Mechanical
performance
Terminal
strength
—————
Wire strength 30N
Actuator
strength
Operating
direction
90N 98N 90N 98N
Pulling
direction
30N — — — —
Environmental
performance
Cold
−40℃ 96h
Dry heat
85℃ 96h
85℃ 96h (Connector type)
105℃ 192h (Dip type)
10 5 ℃ 19 2 h
Damp heat
40℃, 90 to 95%RH 96h
Page
13 4 13 6 13 8
Push Switches Soldering Conditions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 140
Push Switches Cautions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 141
Note
● Indicates applicability to all products in the series.
140
Detector Slide Push Rotary Power
Dual-in-line
Package Type
Horizontal
Type
Vertical
Type
Soldering time
SPEH
Series
Series
Example of Reflow Soldering Condition
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface).
A heat resisting tape should be used for fixed measurement.
3. Temperature profile
300
200
100
A max.
B
E
D
Time (s)
C
Pre-heating
F max.
Room
temperature
Temperature (˚C )
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's
temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Notes
260
Series（Reflow type）
230 40 18 0 15 0 12 0
SPEG
SPEJ
SPEF
A（℃）
3s max. B（℃） C（s） D（℃） E（℃） F（s）
10 ±1s
Soldering temperature Duration of immersion
Preheating temperature
Preheating time
SPPJ2, SPPH1, SPED2, SPED4, SPEF
SPUJ, SPPH2, SPPH4
SPUN
SPPJ3 10 0 ℃ ma x . 60s max. 260±5℃ 5 ±1s
10 0 ℃ ma x . 60s max. 260±5℃ 10 ±1s
—260±5℃ 5 ±1s
—260±5℃
Items Dip soldering
Reference for Dip Soldering
(For PC board terminal types)
3 0 0 ±10 ℃
SPUJ 3 +1/ 0 s
350℃ max.
SPEH
, SPPH2
SPEG, SPEF
SPEJ
SPED2, SPED4
SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 3 5 0 ±10 ℃ 3 +1/ 0 s
3 5 0 ±10 ℃ 3±0.5s
3 5 0 ±10 ℃ 4s max.
350±5℃ 3s max.
3s max.
Soldering temperature
Reference for Hand Soldering
For PC board 端子タイプに適用
Push Switches Soldering Conditions
