PART NUMBER DATA SHEET ECLIPTEK
CORPORATION
R
REGULATORY COMPLIANCE (Data Sheet downloaded on Sep 25, 2016)
2011/65 +
2015/863 169 SVHC
EA5070CA12-24.000M TR
ITEM DESCRIPTION
Quartz Crystal Resonator 5.0mm x 7.0mm x 1.3mm 4 Pad Ceramic Surface Mount (SMD) 24.000MHz ±50ppm at 25°C, ±100ppm
over -40°C to +85°C 12pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency 24.000MHz
Frequency Tolerance/Stability ±50ppm at 25°C, ±100ppm over -40°C to +85°C
Aging at 25°C ±3ppm/year Maximum
Load Capacitance 12pF Parallel Resonant
Shunt Capacitance 7pF Maximum
Equivalent Series Resistance 30 Ohms Maximum
Mode of Operation AT-Cut Fundamental
Drive Level 50µWatts Maximum
Spurious Response -3dB Minimum (Measured from Fo to Fo +5000ppm)
Storage Temperature Range -40°C to +85°C
Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Flammability UL94-V0
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 12/01/2015 | Page 1 of 5
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET ECLIPTEK
CORPORATION
R
EA5070CA12-24.000M TR
MECHANICAL DIMENSIONS (all dimensions in millimeters)
MARKING
ORIENTATION
7.00
±0.15
5.00
±0.15
1.3 MAX
Terminal Plating Thickness: Gold (0.3 to 1.0µm). Nickel (1.27 to 8.89µm).
1.0 ±0.2
(x4)
Note: Chamfer and index
mark not shown.
4.6
±0.2
1.2 ±0.1
(x4)
2.54 ±0.20
2
3
41
PIN CONNECTION
1 Crystal
2 Cover/Ground
3 Crystal
4 Cover/Ground
LINE MARKING
1E24.00
E=Ecliptek Designator
2XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
3.60
1.10
1.40 (x4)
2.20 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 12/01/2015 | Page 2 of 5
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET
Tape & Reel Dimensions
All Dimensions in Millimeters
Compliant to EIA-481
DIA 50 MIN
DIA 20.20 MIN
DIA 13.00 ±0.20
2.50 MIN Width
10 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.50 MIN
Direction of Unreeling
MARKING
ORIENTATION
EA5070CA12-24.000M TR
16.00 ±0.30
7.50 ±0.10
DIA 1.50 MIN
4.00 ±0.10
2.00 ±0.10
8.00 ±0.10 A0
DIA 1.50 +0.10/-0.00
1.75 ±0.10
B0
0.60 MAX
0.10 MAX
K0
22.40 MAX
Quantity Per Reel: 1,000 units
360 MAX
16.40 +2.00/-0.00
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 12/01/2015 | Page 3 of 5
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET ECLIPTEK
CORPORATION
R
EA5070CA12-24.000M TR
Recommended Solder Reflow Methods
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/Second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 Seconds
Ramp-down Rate 6°C/Second Maximum
Time 25°C to Peak Temperature (t) 8 Minutes Maximum
Moisture Sensitivity Level Level 1
Additional Notes Temperature shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 12/01/2015 | Page 4 of 5
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
PART NUMBER DATA SHEET ECLIPTEK
CORPORATION
R
EA5070CA12-24.000M TR
Recommended Solder Reflow Methods
Low Temperature Infrared/Convection 245°C
TS MAX to TL (Ramp-up Rate) 5°C/Second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 30 - 60 Seconds
Ramp-up Rate (TL to TP)5°C/Second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)245°C Maximum
Target Peak Temperature (TP Target) 245°C Maximum 2 Times / 230°C Maximum 1 Time
Time within 5°C of actual peak (tp)10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time
Ramp-down Rate 5°C/Second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Additional Notes Temperature shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 12/01/2015 | Page 5 of 5
Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200
