SP4T Antenna Switch for GSM/UMTS CXG1194XR Description The CXG1194XR is a high power SP4T antenna switch for GSM/UMTS applications. The low insertion loss on transmit means increased talk time as the Tx power amplifier can be operated at a lower output level. On chip logic reduces component count and simplifies the PCB layout by allowing direct connection of the switch to digital baseband control lines with CMOS logic levels. This switch is SP4T, one antenna can be routed to either of the 2Tx or 2Rx ports. It requires 2 CMOS control lines. The Sony GaAs JPHEMT MMIC process is used for low insertion loss. (Applications: GSM dual-band handsets, GSM/UMTS dual-mode handsets) Features Insertion loss (Tx) : 0.35dB (Typ.) at 34dBm (GSM900) 0.45dB (Typ.) at 32dBm (GSM1800) Package Small and Low height package size: 14-pin XQFN (2.5mm x 2.5mm x 0.35mm (Typ.)) Structure GaAs JPHEMT MMIC This IC is ESD sensitive device. Special handling precautions are required. The actual ESD test data will be available later. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E05X02-PS CXG1194XR Absolute Maximum Ratings (Ta = 25C) Bias Voltage VDD 7 V Control Voltage Vctl 5 V Input power max. [ANT, RF1, RF4] 35 dBm Input power max. [RF2, RF3] 13 dBm Operating temperature Topr Maximum power dissipation PD (Duty cycle = 12.5 to 50%) C -35 to +85 500 mW Copper-clad lamination of glass board (4 layers) : 30mm square, t = 0.8mm, FR-4. Note) Use this product without exceeding the PD value specified in this specification. If it is used with exceeding the PD value even for a moment, the heat generated by the operation may cause the degradation or breakdown of the product. Block Diagram ANT RF1 (Tx) F1 F5 F6 RF2 (Rx) F2 RF3 (Rx) F3 F7 F8 RF4 (Tx) F4 RF3 GND RF4 GND Pin Configuration 7 6 5 4 3 VDD GND 8 1 CTLB 12 13 14 GND 11 ANT GND 10 RF1 2 CTLA GND RF2 9 Truth Table ON Path CTLA CTLB F1 F2 F3 F4 F5 F6 F7 F8 ANT - RF1 L L ON OFF OFF OFF OFF ON ON ON ANT - RF2 H L OFF ON OFF OFF ON OFF ON ON ANT - RF3 L H OFF OFF ON OFF ON ON OFF ON ANT - RF4 H H OFF OFF OFF ON ON ON ON OFF -2- CXG1194XR Electrical Characteristics (Ta = 25C) Item Symbol Port ANT - RF1 ANT - RF2 Insertion loss IL ANT - RF3 ANT - RF4 ANT - RF1 ANT - RF2 Isolation ISO. ANT - RF3 ANT - RF4 VSWR VSWR 2fo 3fo 2fo Harmonics*1 Condition Min. Typ. Max. Unit 824 to 960MHz 0.35 0.50 dB 1710 to 1990MHz 0.45 0.65 dB 824 to 960MHz 0.45 0.60 dB 1710 to 1990MHz 0.55 0.70 dB 824 to 960MHz 0.45 0.60 dB 1710 to 1990MHz 0.55 0.70 dB 824 to 960MHz 0.35 0.50 dB 1710 to 1990MHz 0.45 0.65 dB 824 to 960MHz 25 30 dB 1710 to 1990MHz 22 26 dB 824 to 960MHz 30 35 dB 1710 to 1990MHz 25 30 dB 824 to 960MHz 30 35 dB 1710 to 1990MHz 25 30 dB 824 to 960MHz 30 35 dB 1710 to 1990MHz 25 30 dB 824 to 960MHz 1.2 -- 1710 to 1990MHz 1.2 -- *2 ANT - RF1 *3 3fo 2fo 3fo 2fo *2 ANT - RF4 *3 3fo -33 -28 dBm -34 -28 dBm -35 -30 dBm -37 -33 dBm -34 -30 dBm -35 -30 dBm -35 -30 dBm -38 -34 dBm ANT - RF1, 4 *2 35 dBm ANT - RF1, 4 *3 33 dBm P1dB compression input power P1dB Control current Ictl Vctl = 2.8V 15 40 A Supply current IDD VDD = 2.8V 0.12 0.23 mA Note) Electrical Characteristics are measured with all RF ports terminated in 50. *1 *2 *3 Harmonics measured with Tx inputs harmonically matched. The use of harmonic matching is recommended to ensure optimum performance. Power incident on Tx, Pin = 34dBm, 824 to 915MHz, VDD = 2.8V, RF1 or RF4 enabled Power incident on Tx, Pin = 32dBm, 1710 to 1910MHz, VDD = 2.8V, RF1 or RF4 enabled -3- CXG1194XR DC Bias Condition (Ta = 25C) Item Min. Typ. Max. Unit Vctl (H) 2.0 2.8 3.6 V Vctl (L) 0 -- 0.4 V 2.6 2.8 3.6 V VDD -4- CXG1194XR Recommended Circuit RF3 RF4 GND GND CRF CRF 7 6 5 4 8 3 VDD Cbypass 9 2 CTLA Cbypass 10 1 CTLB Cbypass GND RF2 CRF GND 11 12 CRF 13 14 CRF GND RF1 GND ANT When using this IC, the following external components should be used: CRF: This capacitor is used for RF decoupling and must be used for all applications. Cbypass: This capacitor is used for DC line filtering. 100pF is recommended. -5- CXG1194XR Package Outline (Unit: mm) 14PIN XQFN (PLASTIC) x4 0.05 0.35 0.05 2.5 10 0.4 0.1 S A-B C C 8 7 14 4 A B 2.5 11 1 3 8-C0.1 PIN 1 INDEX 0.24 0.5 0.05 M S A-B C MAX 0.02 S S Solder Plating 0.05 S +0.09 0.24 -0.03 TERMINAL SECTION Note:Cutting burr of lead are 0.05mm MAX. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING EIAJ CODE LEAD MATERIAL COPPER ALLOY JEDEC CODE PACKAGE MASS 0.01g SONY CODE XQFN-14P-01 LEAD PLATING SPECIFICATIONS ITEM SPEC. LEAD MATERIAL COPPER ALLOY SOLDER COMPOSITION Sn-Bi Bi:1-4wt% PLATING THICKNESS 5-18m -6- Sony Corporation