DATA SH EET
Product specification
Supersedes data of 1997 Mar 11
File under Integrated Circuits, IC11
1997 Sep 19
INTEGRATED CIRCUITS
TDA5051
Home automation modem
1997 Sep 19 2
Philips Semiconductors Product specification
Home automation modem TDA5051
FEATURES
•Full digital carrier generation and shaping
•Modulation/demodulation frequency set by clock
adjustment, from microcontroller or on-chip oscillator
•High clock rate of 6 bits D/A (Digital-to-Analog)
converter for rejection of aliasing components
•Fully integrated output power stage with overload
protection
•Automatic gain control at receiver input
•8-bit A/D and narrow digital filtering
•Digital demodulation delivering baseband data
•Easy compliance with EN50065-1 with simple coupling
network
•Few external components for low cost applications
•SO16 plastic package.
APPLICATIONS
•Home appliance control (air conditioning, shutters,
lighting, alarms and so on)
•Energy/heating control
•ASK (Amplitude Shift Keying) data transmission using
the home power network.
GENERAL DESCRIPTION
The TDA5051 is a modem IC, specifically dedicated to
ASK transmission by means of the home power supply
network, at 600 or 1200 baud data rate. It operates from a
single 5 V supply.
QUICK REFERENCE DATA
Note
1. Frequency range corresponding to the EN50065-1 band. However the modem can operate at any lower oscillator
frequency.
ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VDD supply voltage 4.75 5.0 5.25 V
IDD(tot) total supply current fosc = 8.48 MHz
reception mode −28 38 mA
transmission mode (DATAIN =0) Z
L=30Ω−47 68 mA
power down mode −19 25 mA
Tamb operating ambient temperature 0 −70 °C
fcr carrier frequency note 1 95 132.5 148.5 kHz
fosc oscillator frequency 6.08 8.48 9.504 MHz
Vo(rms) output carrier signal on CISPR16 load
(RMS value) 120 −122 dBµV
Vi(rms) input signal (RMS value) 66 −122 dBµV
THD total harmonic distortion on CISPR16
load with coupling network −−55 −dB
ZLload impedance 1 30 −Ω
BR baud rate −600 1200 bits/s
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA5051T SO16 plastic small outline package: 16 leads; body width 7.5 mm SOT162-1
1997 Sep 19 3
Philips Semiconductors Product specification
Home automation modem TDA5051
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MGK006
1
4
7
DGND
5
6
10
AGND
12
VDDA VDDAP
TXOUT
RXIN
APGND
PD
13
VDDD
311
10
9
15
14
8
2
8
U
H
L
D
5
16
ROM
DAC clock
filter clock
OSCILLATOR
DATAOUT
OSC2
OSC1
DIGITAL
DEMODULATOR
DIGITAL
BANDPASS
FILTER
÷2
CONTROL LOGIC
D/A
modulated
carrier
TDA5051
A/D
TEST1 SCANTEST
U/D
COUNT
PEAK
DETECT
POWER
DRIVE
WITH
PROTECTION
6
DATAIN
CLKOUT
1997 Sep 19 4
Philips Semiconductors Product specification
Home automation modem TDA5051
PINNING
SYMBOL PIN DESCRIPTION
DATAIN 1 digital data input (active LOW)
DATAOUT 2 digital data output (active LOW)
VDDD 3 digital supply voltage
CLKOUT 4 clock output
DGND 5 digital ground
SCANTEST 6 test input (LOW in application)
OSC1 7 oscillator input
OSC2 8 oscillator output
APGND 9 analog ground for power amplifier
TXOUT 10 analog signal output
VDDAP 11 analog supply voltage for power
amplifier
AGND 12 analog ground
VDDA 13 analog supply voltage
RXIN 14 analog signal input
PD 15 power-down input (active HIGH)
TEST1 16 test input (HIGH in application) Fig.2 Pin configuration.
handbook, halfpage
MGK005
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
DATAIN
DATAOUT
VDDD
CLKOUT
DGND
SCANTEST
OSC1
OSC2 APGND
TXOUT
VDDAP
AGND
VDDA
RXIN
PD
TEST1
TDA5051T
1997 Sep 19 5
Philips Semiconductors Product specification
Home automation modem TDA5051
FUNCTIONAL DESCRIPTION
Both transmission and reception stages are controlled
either by the master clock of the microcontroller, or by the
on-chip reference oscillator connected to a crystal.
This holds for the accuracy of the transmission carrier and
the exact trimming of the digital filter, thus making the
performance totally independent of application
disturbances such as component spread, temperature,
supply drift and so on.
The interface with the power network is made by means of
a LC network (see Fig.18). The device includes a power
output stage able to feed a 120 dBµV (RMS) signal on a
typical 30 Ωload.
To reduce power consumption, the IC is disabled by a
power-down input (pin PD): in this mode, the on-chip
oscillator remains active and the clock continues to be
supplied at pin CLKOUT. For low-power operation in
reception mode, this pin can be dynamically controlled by
the microcontroller (see Section “Power-down mode”).
When the circuit is connected to an external clock
generator (see Fig.6), the clock signal must be applied at
pin OSC1 (pin 7); OSC2 (pin 8) must be left open. Use of
the on-chip clock circuitry is shown in Fig.7.
All logic inputs and outputs are compatible with
TTL/CMOS levels, providing an easy connection to a
standard microcontroller I/O port.
The digital part of the IC is fully scan-testable. Two digital
inputs, SCANTEST and TEST1, are used for production
test: these pins must be left open in functional mode
(correct levels are internally defined by pull-up/down
resistors).
Transmission mode
The carrier frequency is generated by the scanning of a
ROM memory under the control of the microcontroller
clock or the reference frequency provided by the on-chip
oscillator, thus providing strict stability with respect to
environmental conditions. High frequency clocking rejects
the aliasing components to such an extent that they are
filtered by the coupling LC network and do not cause any
significant disturbance. The data modulation is applied
through pin DATAIN and smoothly applied by specific
digital circuitry to the carrier (shaping). Harmonic
components are limited in this process, thus avoiding
unacceptable disturbance of the transmission channel
(according to CISPR16 and EN50065-1
recommendations). A −55 dB total harmonic distortion is
reached when using the typical LC coupling network (or an
equivalent filter).
The D/A converter and the power stage are set in order to
provide a maximum signal level of 122 dBµV (RMS) at the
output.
The output of the power stage (TXOUT)always has to be
connected to a decoupling capacitor, because of a DC
level of 0.5VDD at this pin, present even when the device is
not transmitting. This pin also has to beprotected against
overvoltage and negative transient signals. The DC
level of TXOUT can be used to bias an unipolar transient
suppressor, as shown in the application diagram (see
Fig.18).
Direct connection to the mains is done through a LC
network for low-cost applications. However, a HF signal
transformer could be used when power-line insulation has
to be performed.
Receiving mode
The input signal received by the modem is applied to a
wide range input amplifier with Automatic Gain Control
(AGC) (−6 to +30 dB). This is basically for noise
performance improvement and signal level adjustment
that ensures a maximum sensitivity of the A/D converter.
Then an 8 bit A/D conversion is performed, followed by
digital bandpass filtering, in order to meet the CISPR
normalization and to comply with some additional
limitations encountered in current applications. After digital
demodulation, the baseband data signal is made available
after pulse shaping.
The signal pin (RXIN) is a high-impedance input, which has
to be protected and DC decoupled for the same reasons
as with pin TXOUT. The high sensitivity (66 dBµV) of this
input requires an efficient 50 Hz rejection filter (realized by
the LC coupling network) also used as an anti-aliasing filter
for the internal digital processing (see Fig.18).
CAUTION
In transmission mode, the receiving part of the circuit is
not disabled and the detection of the transmitted signal
is normally performed. In this mode, the gain chosen
before the beginning of the transmission is stored, and
the AGC is internally set to −6dBas long as DATAIN
is LOW. Then, the old gain setting is automatically
restored.
1997 Sep 19 6
Philips Semiconductors Product specification
Home automation modem TDA5051
Data format
TRANSMISSION MODE
The data input (DATAIN) is active LOW: this means that a
burst is generated on the line (pin TXOUT) when
pin DATAIN is LOW.
Pin TXOUT is in high-impedance state as long as the
device is not transmitting. Successive logic 1s are treated
in a NRZ mode (see pulse shape description in
Figs 8 and 9).
RECEIVING MODE
The data output (pin DATAOUT) is active LOW; this means
that the data output is LOW when a burst is received.
Pin DATAOUT remains LOW as long as a burst is received.
Power-down mode
Power-down input (pin PD) is active HIGH; this means that
the power consumption is minimal when pin PD is HIGH.
All functions, except clock generation, are disabled then.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling MOS devices.
SYMBOL PARAMETER MIN. MAX. UNIT
VDD supply voltage 4.5 5.5 V
fosc oscillator frequency −12 MHz
Tstg storage temperature −50 +150 °C
Tamb operating ambient temperature −10 +80 °C
Tjjunction temperature −125 °C
1997 Sep 19 7
Philips Semiconductors Product specification
Home automation modem TDA5051
CHARACTERISTICS
VDDD =V
DDA =5V±5%; Tamb = 0 to 70 °C; VDDD connected to VDDA; DGND connected to AGND.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VDD supply voltage 4.75 5 5.25 V
IDD(RX/TX)(tot) total analog + digital supply
current; TX or RX mode VDD =5V±5% −28 38 mA
IDD(PD)(tot) total analog + digital supply
current; power-down mode VDD =5V±5%;
PD = HIGH −19 25 mA
IDD(PAMP) power amplifier supply current
in transmission mode VDD =5V±5%;
ZL=30Ω;
DATAIN = LOW
−19 30 mA
IDD(PAMP)(max) maximum power amplifier
supply current in transmission
mode
VDD =5V±5%;
ZL=1Ω;
DATAIN = LOW
−76 −mA
DATAIN input, PD input: DATAOUT output, CLKOUT output
VIH HIGH-level input voltage 0.2VDD + 0.9 −VDD + 0.5 V
VIL LOW-level input voltage −0.5 −0.2VDD −0.1 V
VOH HIGH-level output voltage IOH =−1.6 mA 2.4 −− V
V
OL LOW-level output voltage IOL = 1.6 mA −−0.45 V
OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open when
using an external clock generator)
VIH HIGH-level input voltage 0.7VDD −VDD + 0.5 V
VIL LOW-level input voltage −0.5 −0.2VDD −0.1 V
VOH HIGH-level output voltage IOH =−1.6 mA 2.4 −− V
V
OL LOW-level output voltage IOL = 1.6 mA −−0.45 V
Clock
fosc oscillator frequency 6.080 −9.504 MHz
ratio between oscillator and
carrier frequency −64 −
ratio between oscillator and
clock output frequency −2−
fosc
fcr
--------
fosc
fCLKOUT
--------------------
1997 Sep 19 8
Philips Semiconductors Product specification
Home automation modem TDA5051
Transmission mode
fcr carrier frequency fosc = 8.48 MHz −132.5 −kHz
tsu set-up time of the shaped
burst fosc = 8.48 MHz;
see Fig.8 −170 −µs
t
hhold time of the shaped burst fosc = 8.48 MHz;
see Fig.8 −170 −µs
t
W(DI)(min) minimum pulse width of
DATAIN signal fosc = 8.48 MHz;
see Fig.8 −190 −µs
V
o(rms) output carrier signal (RMS
value) ZL= CISPR16
DATAIN = LOW 120 −122 dBµV
Io(max) power amplifier maximum
output current (peak value) ZL=1Ω;
DATAIN = LOW −160 −mA
Zooutput impedance of the
power amplifier −5−Ω
V
Ooutput DC level at TXOUT −2.5 −V
THD total harmonic distortion on
CISPR16 load with the
coupling network
(measured on the first ten
harmonics)
Vo(rms) = 121 dBµ
V on CISPR16
load;
fosc = 8.48 MHz;
DATAIN = LOW
(no modulation);
see Figs 3 and 16
−−55 −dB
B−20dB bandwidth of the shaped
output signal (at −20 dB) on
CISPR16 load with the
coupling network
Vo(rms) = 121 dBµ
V on CISPR16
load;
fosc = 8.48 MHz;
DATAIN = 300 Hz;
duty factor = 50%;
see Fig.4
−3000 −Hz
Reception mode
Vi(rms) analog input signal (RMS
value) 68 −122 dBµV
VIDC level at pin RXIN −2.5 −V
ZiRXIN input impedance −50 −kΩ
RAGC automatic gain control range −36 −dB
tc(AGC) automatic gain control time
constant fosc = 8.48 MHz;
see Fig.5 −296 −µs
t
d(dem)(su) demodulation delay set-up
time fosc = 8.48 MHz;
see Fig.15 −410 460 µs
td(dem)(h) demodulation delay hold time fosc = 8.48 MHz;
see Fig.15 −330 380 µs
Bdet detection bandwidth fosc = 8.48 MHz −3−kHz
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1997 Sep 19 9
Philips Semiconductors Product specification
Home automation modem TDA5051
BER bit error rate fosc = 8.48 MHz;
600 baud;
S/N = 35 dB;
signal 76 dBµV;
see Fig.17
−1−1×10−4
Power-up timing
td(pu)(TX) delay between power-up and
DATAIN in transmission mode XTAL = 8.48 MHz;
C1 = C2 = 27 pF;
Rp= 2.2 MΩ;
see Fig.10
−1−µs
t
d(pu)(RX) delay between power-up and
DATAOUT in reception mode XTAL = 8.48 MHz;
C1 = C2 = 27pF;
Rp= 2.2 MΩ;
fRXIN = 132.5 kHz;
120 dBµV
sinewave;
see Fig.11
−1−µs
Power-down timing
td(pd)(TX) delay between PD = 0 and
DATAIN in transmission mode fosc = 8.48 MHz;
see Fig.12 −10 −µs
t
d(pd)(RX) delay between PD = 0 and
DATAOUT in reception mode fosc = 8.48 MHz;
fRXIN = 132.5 kH;
120 dBµV
sinewave;
see Fig.13
−500 −µs
t
active(min) minimum active time with
T = 10 ms power-down period
in reception mode
fosc = 8.48 MHz;
fRXIN = 132.5 kH;
120 dBµV
sinewave;
see Fig.14
−1−µs
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1997 Sep 19 10
Philips Semiconductors Product specification
Home automation modem TDA5051
Fig.3 Carrier spectrum.
Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBµV (RMS); marker at −5 dBV (RMS) = 115 dBµV (RMS);
the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBµV (RMS).
d
book, full pagewidth
−100
0
MGK834
132.5 kHz
Vo(rms)
(dBV)
106
105f (Hz)
1997 Sep 19 11
Philips Semiconductors Product specification
Home automation modem TDA5051
Fig.4 Shaped signal spectrum.
Resolution bandwidth = 100 Hz; B−20dB = 3000 Hz (2 ×1500 Hz).
handbook, full pagewidth
−60
117.5 132.5
dBV
(RMS)
147.5
f (kHz)
−10
MBH664
1500 Hz
20 dB
Fig.5 AGC time constant definition (not to scale).
handbook, full pagewidth
MGK011
VRXIN
V(I)
0
8.68 dB AGC range
tc(AGC)
(AGC time constant)
+30 dB
−6 dB
GAGC
modulated sinewave 122 dBµV amplitude
t
1997 Sep 19 12
Philips Semiconductors Product specification
Home automation modem TDA5051
TIMING
Configurations for clock
Table 1 Clock oscillator parameters
fosc
OSCILLATOR
FREQUENCY
fcr
CARRIER
FREQUENCY
1⁄2fosc
CLOCK OUTPUT
FREQUENCY EXTERNAL COMPONENTS
6.080 to 9.504 MHz 95 to 148.5 kHz 3.040 to 4.752 MHz C1 = C2 = 27 to 47 pF; Rp= 2.2 to 4.7 MΩ;
XTAL = standard quartz crystal
Fig.6 External clock.
For parameter description see Table 1.
handbook, full pagewidth
MGK007
MICRO-
CONTROLLER
CLKOUT
GND
TDA5051
OSC1
DGND
XTAL
fosc 7
5
Fig.7 Typical configuration for on-chip clock circuit.
For parameter description see Table 1.
handbook, full pagewidth
MGK008
MICRO-
CONTROLLER
CLKIN
GND
TDA5051 Rp
CLKOUT
DGND
OSC2
OSC1
XTAL
fosc / 2 4
5
8
7
C1
C2
1997 Sep 19 13
Philips Semiconductors Product specification
Home automation modem TDA5051
Table 2 Calculation of parameters depending of the clock frequency
SYMBOL PARAMETER CONDITIONS UNIT
fosc oscillator frequency with on-chip oscillator: frequency of the crystal quartz; with
external clock: frequency of the signal applied at OSC1 Hz
fCLKOUT clock output frequency 1⁄2fosc Hz
fcr carrier frequency/digital filter
tuning frequency 1⁄64fosc Hz
tsu set-up time of the shaped burst or s
thhold time of the shaped burst or s
tW(DI)(min) minimum pulse width of DATAIN
signal tsu +s
tW(burst)(min) minimum burst time of VO(DC)
signal tW(DI)(min) +t
hs
t
c(AGC) AGC time constant s
tsu(demod) demodulation set-up time (≈max.) s
th(demod) demodulation hold time (≈max.) s
23
fcr
------ 1472
fosc
23
fcr
------ 1472
fosc
-------------
1
fcr
-----
2514
fosc
-------------
3700
fosc
-------------
3050
fosc
-------------
Fig.8 Relationship between DATAIN and TXOUT (see Table 3).
handbook, full pagewidth
MGK837
tW(burst)
tsu
0
VO(DC)
th
tW(burst)(min)
TXOUT
tW(DI) tW(DI)(min)
DATAIN
(1) (2) (3)
(1) tW(DI) >t
W(DI)(min)
(2) tW(DI)(min) =t
su +
(3) tW(DI)(min) <t
su; wrong operation
1
fcr
-----
1997 Sep 19 14
Philips Semiconductors Product specification
Home automation modem TDA5051
Table 3 Relationship between DATAIN and TXOUT
Note
1. X = don’t care.
PD DATAIN TXOUT
1X
(1) high impedance
0 1 high impedance (after th)
00active with DC offset
Fig.9 Pulse shape characteristics.
handbook, halfpage
MGK010
tW(burst)
tsu th
100%
1997 Sep 19 15
Philips Semiconductors Product specification
Home automation modem TDA5051
Timing diagrams
Fig.10 Timing diagram during power-up in transmission mode.
DATAIN is an edge-sensitive input and must be HIGH before starting a transmission.
handbook, full pagewidth
MGK015
td(pu)(TX)
TXOUT
DATAIN
VDD 90% VDD
CLKOUT
HIGH
NOT DEFINED CLOCK STABLE
Fig.11 Timing diagram during power-up in reception mode.
handbook, full pagewidth
MGK016
td(pu)(RX) td(dem)(h)
RXIN
DATAOUT
VDD 90% VDD
CLKOUT
HIGH
NOT DEFINED
NOT DEFINED
CLOCK STABLE
1997 Sep 19 16
Philips Semiconductors Product specification
Home automation modem TDA5051
Fig.12 Power-down sequence in transmission mode.
handbook, full pagewidth
MGK017
td(pd)(TX)
normal operation wrong operation TXOUT delayed by PD
TXOUT
DATAIN
PD
Fig.13 Power-down sequence in reception mode.
handbook, full pagewidth
MGK018
td(dem)(su) td(pd)(RX) td(pd)(RX)
DATAOUT delayed by PD
DATAOUT
RXIN
PD
Fig.14 Power saving by dynamic control of power-down.
handbook, full pagewidth
MGK845
tactive(min)
IDD(RX)
IDD(PD)
IDD
T
DATAOUT
RXIN
PD
0
1997 Sep 19 17
Philips Semiconductors Product specification
Home automation modem TDA5051
TEST INFORMATION
Fig.15 Test set-up for measuring demodulation delay.
handbook, full pagewidth
30 Ω
1 µF
10 nF
XTAL
DATAIN
DATAOUT
td(dem)(su) td(dem)(h)
DATAOUT
DATAIN
TXOUT/RXIN
OSCILLOSCOPE
Y1
TDA5051
(to be tested)
pulse
generator
300 Hz
50%
Y2
TXOUT
RXIN
fosc
2
110
14
87
MGK012
1997 Sep 19 18
Philips Semiconductors Product specification
Home automation modem TDA5051
Fig.16 Test set-up for measuring THD and bandwidth of the TXOUT signal.
(1) Square wave TTL signal 300 Hz, duty factor = 50% for measuring signal bandwidth (see spectrum Fig.3).
(2) DATAIN = LOW for measuring total harmonic distortion (see spectrum Fig.3).
(3) Tuned for fcr = 132.5 kHz.
(4) The CISPR16 network provides a −6 dB attenuation.
handbook, full pagewidth
MGK013
DATAIN
TDA5051
POWER
SUPPLY SPECTRUM
ANALYSER
50 Ω
10
OSC1
12, 5, 9
1
7
OSC2 8
13, 3, 11
TXOUT
AGND, DGND, APGND
VDDA, VDDD, VDDAP 5 Ω
5 Ω
50 Ω
10 µF
33 nF 250 nF
250 nF
47 µH
50 µH
50 µH
33 nF 47 µH
coupling
network(3) CISPR16
network(4)
+5 V
(2)(1)
1997 Sep 19 19
Philips Semiconductors Product specification
Home automation modem TDA5051
Fig.17 Test set-up for measuring bit error rate (BER).
(1) See Fig.16.
handbook, full pagewidth
MGK014
TDA5051
(to be tested)
COUPLING
NETWORK
(1)
V24/TTL
INTERFACE
78
78
14
2
DATAOUT
DATAIN
RXIN out
TDA5051 COUPLING
NETWORK
(1)
SPECTRUM
ANALYSER
50 Ω
WHITE
NOISE
GENERATOR
10
12,
5,
9
12,
5,
9
1OSC1 OSC2
OSC1 OSC2
TXOUT in
AGND, DGND, APGND
AGND, DGND, APGND
V24 SERIAL DATA
ANALYSER
PARAMETERS
600 BAUD
PSEUDO RANDOM SEQUENCE:
29−1 BITS LONG
DATAIN
DATAOUT
RXD
TXD
XTAL = 8.48 MHz
out
in
out ++
1997 Sep 19 20
Philips Semiconductors Product specification
Home automation modem TDA5051
APPLICATION INFORMATION
Fig.18 Application diagram without power line insulation.
handbook, full pagewidth
MGK020
250 V (AC)
max T 630 mA
1 mH
68 Ω
(2 W) 33 nF
250 V (AC)
47 µH
MOV
250 V (AC)
33 nF
47 µH
100 µF
(16 V)
470 µF
(16 V) 7V5
(1.3 W) 1N4006
1N4006
2 µF
250 V (AC)
10 nF
VDDD VDDAP
APGND AGNDDGND
VDDA
RXIN
TXOUT
P6KE6V8
1 µF
(16 V)
14
1
+5 V
+5 V
2
MICRO-
CONTROLLER
4
7OSC1
XTAL
8.48 MHz
2.2 MΩOSC2
85912
3
31
2
1311
15
47 nF
78L05
PD
27 pF27 pF
10
DATAIN
DATAOUT
CLKOUT TDA5051
1997 Sep 19 21
Philips Semiconductors Product specification
Home automation modem TDA5051
Fig.19 Gain (curve 1) and input impedance (curve 2) of the coupling network (fcr = 132.5 kHz); L = 47 µH;
C = 33 nF.
Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency (1⁄2fosc).
Input impedance always higher than 10 Ω within the 95 to 148.5 kHz band.
handbook, full pagewidth
20
0
−20
−40
−60
−80
−100
MBH907
10
gain
(dB)
10210
102
103
103104105f (Hz)
input
impedance
(Ω)
106107
1
2
Fig.20 Output voltage versus line impedance (with coupling network); L = 47 µH; C = 33 nF.
Main features of the coupling network: 50 Hz rejection >80 dB; anti-aliasing for the digital filter >50 dB at the sampling frequency (1⁄2fosc).
Input impedance always higher than 10 Ω within the 95 to 148.5 kHz band.
handbook, halfpage
130
120
110
100
MBH908
110
V
o
(dBµV)
Zline (Ω)102
1997 Sep 19 22
Philips Semiconductors Product specification
Home automation modem TDA5051
Fig.21 Application diagram with power line insulation.
handbook, full pagewidth
MGK021
250 V (AC)
max T 630 mA
1 VA 230 V
6 V
100 Ω
(0.5 W)
TOKO
T1002
n = 1
470 nF
250 V (AC)
MOV
250 V (AC)
46
3 n = 4 n = 1
6.8
nF
33
nF
3.3
µH
470
nF
21
100 µF
(16 V)
470 µF
(16 V)
VDDD VDDAP VDDA
RXIN
TXOUT
P6KE6V8
14
1
+5 V
+5 V
2
MICRO-
CONTROLLER
4
7OSC1
XTAL
8.48 MHz
2.2 MΩOSC2
85912
3
31
2
1311
15
47 nF
FDB08
78L05
PD
27 pF27 pF
10
TDA5051
APGND AGNDDGND
DATAIN
DATAOUT
CLKOUT
1997 Sep 19 23
Philips Semiconductors Product specification
Home automation modem TDA5051
PACKAGE OUTLINE
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65 0.30
0.10 2.45
2.25 0.49
0.36 0.32
0.23 10.5
10.1 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT162-1
8
16
wM
bp
D
detail X
Z
e
9
1
y
0.25
075E03 MS-013AA
pin 1 index
0.10 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.41
0.40 0.30
0.29 0.050
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
0 5 10 mm
scale
SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1
95-01-24
97-05-22
1997 Sep 19 24
Philips Semiconductors Product specification
Home automation modem TDA5051
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
•A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
•The longitudinal axis of the package footprint must be
parallel to the solder flow.
•The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1997 Sep 19 25
Philips Semiconductors Product specification
Home automation modem TDA5051
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1997 Sep 19 26
Philips Semiconductors Product specification
Home automation modem TDA5051
NOTES
1997 Sep 19 27
Philips Semiconductors Product specification
Home automation modem TDA5051
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors – a worldwide company
© Philips Electronics N.V. 1997 SCA55
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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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under patent- or other industrial or intellectual property rights.
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Printed in The Netherlands 297027/1200/02/pp28 Date of release: 1997 Sep 19 Document order number: 9397 750 02513
