DATA SHEET NEC / BIPOLAR ANALOG INTEGRATED CIRCUIT _______ uPC29L00 Series THREE TERMINAL LOW DROPOUT VOLTAGE REGULATOR DESCRIPTION uPC29L00 Series are low dropout regulators which have 100 mA capable for the output current. The variation of output voltage is 3V,3.3V,4 Vand 5V. FEATURES CONNECTION DIAGRAM Low dropout voltage. Vor < 0.3 V (TOP VIEW) + Built-in: overcurrent protection circuit. uPC29L00J Series Built-in thermal shut-down circuit. ORDERING INFORMATION 2 3 Ut Output Voltage Type Number Package U i (] 3V uPC29L03J TO-92 t uPC29LO3T SOT-89 / \ 3.3V HPC29L334 10-92 OUTPUT GNO INPUT HPC29L33T SQT-89 4v uPC28L.045 9-92 uUPC29LO0T Series uPC29LoT SOT-89 GND Sv HPC29L05J 70-92 TY uPC29L05T SOT-89 NS, a f \ OUTPUT GND INPUT Document No. G10354EJ2V0DS00 (2nd edition) Date Published December 1995 P Printed in Japan NEC Corporation 19 342NEC yuPC29L00 Series BLOCK DIAGRAM Sr oe mine neem tt eee at ce ce ete RS SA nm on penne CS INPUT i Over-current oe protection 4 ~ I 2 | a] |g , 2 S fem eC OUTPUT eo i 3 S 3 : Error _ 3 n 2 i amplifier g Co e c ! z $ I 3 H 3S e / 3 | s a + a ay - ! ! t | 2 S > I 5 thee eh weer eens ens ae eee GNDNEC uPC29L00 Series ABSOLUTE MAXIMUM RATINGS (Ta = 25 C, Unless otherwise specified.) PARAMETER SYMBOL RATING UNIT Input Voltage Vin 16 v internal Power Dissipation Py J 700 Note 1 mw T 40Q Note 1 2000 Note 1, 2 Operating Ambient Temperature Range Ta -30 to +85 Operating Junction Temperature Range Ta +30 to +150 Storage Temperature Range Tstg 55 to +150 Thermal Resistance (Junction to Case) Rina - 0 J ~ CIW T 30 Thermal Resistance (Junction to Ambient) Rinu-a | d 180 CAW T 316 62.5 Note 2 Notes 1. Ta < 25C 2. With the 16 cm? x 0.7 mm ceramic substrate TYPICAL CONNECTION De a i INPUT O---+-~ HPC29L00 }-+4~-0 OUTPUT 1 4l Cw Cole F De Le per Cin. 0.4 to 0.47 wr. Cour: More than 10 pF. D: =: Need for Vo > Vin. De : Need for Vo < GND. RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL TYPE NUMBER MIN. TYP. MAX. | UNIT input Voltage Vin uPC2SL03 3.5 9 Vv yPC29L33 3.8 9 uPC29Lo4 45 12 uPC29L05 5.5 12 Output Current lo Alf 0 40 mA Operating Ambient Temperature Range Ta All -30 +85 Operating Junction Temperature Range Ts All -30 4125 C 344NEC pPC29L00 Series ELECTRICAL CHARACTERISTICS uPC29L03 (Vin = 4 V, lo = 40 mA, Ts = 25 C, Uniess otherwise specified) PARAMETER SYMBOL TEST CONDITIONS MIN. Tye. MAX. | UNIT Output Voltage Vo 288 | 30 | 312 1 3.5 Ve Vans9V,1mA 4 L . a uPC29L00T At |S | 318 CWT f~f~- ltd. | 5 0 50 +00 180 Ta - Ambient Temperature - C ipias (Inass)) - Vin (4 PC29L.03) Te = 25C 4 E < E a 6 = Do 3 & = a e 3 0 2 4 6 8 10 Vin - Input Voltage - V Vow - Ts jo= 40 mA > oS a 2 > 3 4PC29L03 & 2 a > uPC2SL05 -20 0 50 100 Tu Junction Temperature - C 150 lous - Quiescent Currant - mA Vo - Output Voltage - V Vor - Dropout Voitage - V uPC29L00 Series Vo- Vis (uPC29L03) Ta = 25C | Vin - Input Voltage - V laias (leiasisi) - Vin (2 PC 291.05) Ts = 26C 2 4 6 8 10 Vw - Input Voltage - V Voit - Io 0.8 Tj = 25C 0.4 0.3 - ra 0.2 Ln) Li 0.1 t Le "| 0 0 20 40 60 80 100 jo - Output Current - mA 349NEC uUPC29L00 Series TYPICAL CHARACTERISTICS R-R - Ripple Rejection - dB 350 A Vo - Output Voltage Deviation - mV 4 Vo - Output Voltage Deviation - mV A Vo - Ts (uPG291.03} 100 50 z Vine 4V lo=40mA loz 5 mA 80 8 HPC29L03 = 3 0 60 & 3 40 s S -50 & 2 20 o 9 > 0 100 10 100 1k 10k 100 k 0 5D 100 150 {- Frequency - Hz Ts - Junction Temperature - C AVo- Ts (uPC29L33) A Vo - Ts {#PC29L.04) > 50 Vin = 5 V loz Sma & 8 8 > 8 0 c-] > S -50 & 2 o 2 Vin = 6V lo=SmA < _100 0 50 100 150 5 50 100 150 Ta - Junction Temperature - C Ts - Junction Temperature - C A Vo - Ts ( uPC291.05) Vn=6V low 5mA 0 50 100 156 Ts - Junction Temperature - CNEC PACKAGE DIMENSIONS (Unit: mm) uPC29L00J Series 3PIN PLASTIC SIP (TO-92} 12711 |133 MAX. =H 0.507915 [S10.12 S| 0.509 5.2 MAX. 4.2 MAX. x < | =. 1 3 we |! oS : 2 if {E i i Wop WoT I | 2.8 MAX. P3J--127B uPC29L00 Series 351NEC uPC29L00 Series uPC2SLO00T Series SOT-89 352NEC RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. uPC29L00 Series Please consult with cur sales offices in case other seldering process is used, or in case soldering is done under different conditions. TYPES OF THROUGH HOLE MOUNT DEVICE uPC29L00J Series Soldering Process Soldering Canditions Symbol Wave soidering Solder temperature: 260 C or below. Fiow Time: 10 seconds or below. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document Semiconductor Device Mounting Manual (/EI-1207). uUPC29LO00T Series Soidering Process Seidering Canditions Symwboi Infrared ray rellaw Peak package's temperature: 235 C or below. 1R35-C0-2 Reflow time: 30 seconds or below (210 C or higher). Number of flow process: 2. Exposure limit Note. None Vapor phase soldering Peak packages temperature: 215 C or befow PTE-00-2 Reflow time: 40 seconds or betow (200 C or higher). Number of flow process: 2. Exposure limit Note: None ; Wave soldering Solder temperature: 260 C or befow. 1 WS60-00-1 Flow time: 10 seconds or below. Number of flow process: 1. Exposure imit Note. None. Note Exposure limit before soldering after dry-pack package is opened. Remark Storage conditions: 25 C and relative humidity at 65 % or less. Caution Do not apply more than a single process at once, except for Partial heating method. REFERENCE Document Name Documen: No. NEC semiconductor device reliability/quality contro! system. f1-1242 Quality grade on NEC semiconductor devices i1El-1209 Semiconductor device mounting technology manual, {Et-1207 Semiconductor device package manual. IE 1213 Guide to quality assurance for semiconductor devices. MEI-1292 Semiconductor selection quide. MF-1134 353