"Spansion, Inc." and "Cypress Semiconductor Corp." have merged together to deliver high-performance, high-quality so lutions
at the heart of today's most advanced embedded systems, from automotive, industrial and networking platforms to highly
interactive consumer and mobile devices. The new company "Cypress Semiconductor Corp." will conti nue to offer "Spansion,
Inc." products to new and existing customers.
Continuity of Specifications
There is no change to this document as a result of offering the device as a Cypress product. Any changes that have been made
are the result of normal document improvements and are noted in the document history page, where supported. Fu ture
revisions will occur when appropriate, and changes will be noted in a document history page.
Continuity of Ordering Part Numbers
Cypress continues to support existing part numbers. To order these products, please use only the Ordering Part Numbers listed
in this document.
For More Information
Please contact your local sa les office for additional information about Cypress products and solutions.
Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600
Document Number: 002-00615 Rev. *A Revised October 13, 2015
S29PL-J
128/128/64/32 Mbit (8/8/4/2M x 16-Bit)
3 V, Flash with Enhanced VersatileIO™
Distinctive Characteristics
Architectural Advantages
128/128/64/32 Mbit Page Mode devices
– Page size of 8 words: Fast page read acce ss from random locations within
the page
Single power supply operation
– Full Voltage range: 2.7 to 3.6 volt read, erase, and program operations for
battery-powered applicati ons
Dual Chip Enable inputs (only in PL129J)
– Two CE# inputs control selection of each half of the memory space
Simultaneous Read/Write Operation
– Data can be continuously read from one bank while executing erase/
program functions in another ban k
– Zero latency switching from write to read operations
FlexBank Architecture (PL127J/ PL064J/PL032J)
– 4 separate banks, with up to two simultaneous operations per device
–Bank A:
PL127J -16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J - 8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J - 4 Mbit (4 Kw x 8 and 32 Kw x 7)
–Bank B:
PL127J - 48 Mbit (32 Kw x 96)
PL064J - 24 Mbit (32 Kw x 48)
PL032J - 12 Mbit (32 Kw x 24)
–Bank C:
PL127J - 48 Mbit (32 Kw x 96)
PL064J - 24 Mbit (32 Kw x 48)
PL032J - 12 Mbit (32 Kw x 24)
–Bank D:
PL127J -16 Mbit (4 Kw x 8 and 32 Kw x 31)
PL064J - 8 Mbit (4 Kw x 8 and 32 Kw x 15)
PL032J - 4 Mbit (4 Kw x 8 and 32 Kw x 7)
FlexBank Architecture (PL129J)
– 4 separate banks, with up to two simultaneous operations per device
– CE#1 controlled banks:
Bank 1A: PL129J - 16Mbit (4Kw x 8 and 32Kw x 31)
Bank 1B: PL129J - 48Mbit (32Kw x 96)
– CE#2 controlled banks:
Bank 2A: PL129J - 48 Mbit (32Kw x 96)
Bank 2B: PL129J - 16Mbit (4Kw x 8 and 32Kw x 31)
Enhanced VersatileI/O (VIO) Control
– Output voltage generated and input volta ges tolerated on all control inputs
and I/Os is determined by the voltage on the VIO pin
–V
IO options at 1.8 V and 3 V I/O for PL127J and PL129J devices
–3V V
IO for PL064J and PL032J devices
Secured Silicon Sector region
– Up to 128 words accessible through a command sequence
– Up to 64 factory-locked words
– Up to 64 customer-lockable words
Both top and bottom boot blocks in one device
Manufactured on 110 nm process technology
Data Retention: 20 years typical
Cycling Endurance: 1 million cycles per sector typical
Performance Characteristics
High Performance
– Page access times as fast as 20 ns
– Random access times as fast as 55 ns
Power consumption (typical values at 10 MHz)
– 45 mA active read current
– 17 mA program/erase current
– 0.2 µA typical standby mode current
Software Features
Software command-set compatible with JEDEC 42.4 standard
– Backward compatible with Am29F, Am29LV, Am29DL, and AM29PDL
families and MBM29QM/RM, MBM29LV, MBM29DL, MBM29PDL families
CFI (Common Flash Interface) compliant
– Provides device-specific information to the system, allowing host software to
easily reconfigure for different Flash devices
Erase Suspend / Erase Resu me
– Suspends an erase operation to al low read or program operations in other
sectors of same bank
Program Suspend / Program Resume
– Suspends a program operation to allow read operation from sectors other
than the one being progra mmed
Unlock Bypass Program command
– Reduces overall programming time when issuing multiple program
command sequences
Hardware Features
Ready/Busy# pin (RY/BY#)
– Provides a hardware method of detecting prog ram or erase cycle
completion
Hardw are reset pin (RES ET#)
– Hardware method to reset the device to reading array data
WP#/ ACC (Write Protect/Acceleration) input
–At V
IL, hardware level protection for the first and last two 4K word sectors.
–At V
IH, allows removal of sector protection
–At V
HH, provides accelerated programming in a factory setting
Persistent Sector Protection
– A command sector protection method to lock combinations of individual
sectors and sector groups to prevent program or erase operations within
that sector
– Sectors can be locked and unlocked in-system at VCC level
Password Sector Protection
– A sophisticated sector protection method to lock combinations of individual
sectors and sector groups to prevent program or erase operations within
that sector using a user-defined 64-bit password
Package options
– Standard discrete pinouts
11 x 8 mm, 80-ball Fine-pitch BGA (PL127J) (VBG080)
8.15 x 6.15 mm, 48-ball Fine pi tch BGA (PL064J/PL032J)
(VBK048)
– MCP-compatible pinout
8 x 11.6 mm, 64-ball Fine-pitch BGA (PL127J)
7 x 9 mm, 56-ball Fine-pitch BGA (PL064J and PL032J)
Compatible with MCP pinout , allowing easy integ ration of RAM into existing
designs
– 20 x 14 mm, 56-pin TSOP (PL127J) (TS056)
Document Number: 002-00615 Rev. *A Page 3 of 103
S29PL-J
Contents
Distinctive Characteristics .................................................. 2
1. General Description..................................................... 4
2. Simultaneous Read/Write Operation
with Zero Latency ........................................................ 4
2.1 Page Mode Features ..................................................... 4
2.2 Standard Flash Memory Features ................................. 4
3. Ordering Information................................................... 5
4. Product Selector Guide............................................... 7
5. Block Diagram.............................................................. 8
6. Simultaneous Read/Write Block Diagram.................. 9
7. Simultaneous Read/Write Block Diagram (PL129J) 10
8. Connection Diagrams................................................ 11
8.1 Special Package Handling Instructions........................ 11
8.2 80-Ball Fine-Pitch BGA—PL127J................................ 11
8.3 64-Ball Fine-Pitch BGA—MCP Compatible—PL127J . 12
8.4 48- Bal l Fi ne- Pitch BGA, PL064J and PL032J.............. 13
8.5 56-Pin TSOP 20 x 14 mm............... ................ ... .......... 14
8.6 56-Ball Fine-Pitch Ball Grid Array, PL064J
and PL032J.................................................................. 15
9. Pin Description........................................................... 16
10. Logic Symbol ............................................................. 17
11 . Device Bus Operations.............................................. 17
11.1 Requirements for Reading Array Data......................... 18
11.2 Simultaneous Read/Write Operation ........................... 19
11.3 Writing Commands/Command Sequences.................. 19
11.4 Standby Mode.............................................................. 20
11.5 Automatic Sleep Mode................................................. 21
11.6 RESET#: Hardware Reset Pin..................................... 21
11.7 Output Disable Mode................................................... 21
11.8 Autoselect Mode......... ... ... ........................................... 45
11.9 Selecting a Sector Protection Mode............................. 50
12. Sector Protection....................................................... 51
12.1 Persistent Sector Protection........................................ 51
12.2 Password Sector Protection......................................... 51
12.3 WP# Hardware Protection........................................... 51
12.4 Selecting a Sector Protection Mode............................. 51
13. Persistent Sector Protection..................................... 52
13.1 Persistent Protection Bit (PPB).................................... 52
13.2 Persistent Protection Bit Lock (PPB Lock)................... 52
13.3 Dynamic Protection Bit (DYB)...................................... 52
13.4 Persistent Sector Protection Mode Locking Bit............ 53
14. Password Protection Mode....................................... 54
14.1 Password and Password Mode Locking Bit................. 54
14.2 64-bit Password........................................................... 54
14.3 Write Protect (WP#)..................................................... 55
14.4 High Voltage Sector Protection.................................... 55
14.5 Temporary Sector Unprotect........................................ 57
14.6 Secured Silicon Sector Flash Memory Region ............ 57
14.7 Hardware Data Protection.. ... .. ................. ... ................. . 59
15. Common Fla sh Memo ry Interface (CFI).................... 59
16. Command Definit ion s................................................. 62
16.1 Reading Array Data...................................................... 62
16.2 Reset Command........................................................... 63
16.3 Autoselect Command Sequence .................................. 63
16.4 Enter/Exit Secured Silicon Sector
Command Sequence.................................................... 63
16.5 Word Program Command Sequence ............................ 64
16.6 Chip Erase Command Sequence ................................. 65
16.7 Sector Erase Command Sequence .............................. 66
16.8 Erase Suspend/Erase Resume Commands................. 67
16.9 Program Suspend/Program Resume Commands ........ 68
16.10Command Definitions Tables ....................................... 68
17. Write Operation Status............................................... 71
17.1 DQ7: Data# Polling....................................................... 71
17.2 RY/BY#: Ready/Busy#.................................................. 72
17.3 DQ6: Toggle Bit I .......................................................... 72
17.4 DQ2: Toggle Bit II......................................................... 74
17.5 Reading Toggle Bits DQ6/DQ2..................................... 74
17.6 DQ5: Exceeded Timing Limits ...................................... 74
17.7 DQ3: Sector Erase Timer.............................................. 75
18. Absol ute Maximum Ratings....................................... 76
19. Operating Ranges....................................................... 77
20. DC Characteristics...................................................... 78
21. AC Characteristic........................................................ 79
21.1 Test Conditions............................................................. 79
21.2 Switching Waveforms................................................... 79
21.3 Read Operations........................................................... 80
21.4 Reset ............................................................................ 82
21.5 Erase/ Program Operat ions........... ... ................. ... ......... 82
21.6 Timing Diagrams . .......................................................... 84
22. Protect/Unprotect........................................................ 88
22.1 Controlled Erase Operations......................................... 90
23. Pin Capacitance .......................................................... 92
23.1 BGA Pin Capacitance................................................... 92
23.2 TSOP Pin Capacitance................................................. 92
24. Physical Dimen sion s.................................................. 93
24.1 VBG080—80-Ball Fine-pitch
Ball Grid Array 8 x 11 mm Package (PL127J).............. 93
24.2 VBH064—64-Ball Fine-pitch
Ball Grid Array 8 x 11.6 mm package (PL127J)............ 94
24.3 VBK048—48-Ball Fine-pitch
Ball Grid Array 8.15 x 6.15 mm package
(PL032J and PL064J)...................................................... 95
24.4 VBU056—56-Ball Fine-pitch
BGA 7 x 9mm package (PL064J and PL032J)............. 96
24.5 TS056—20 x 14 mm, 56-pin TSOP (PL127J)............... 97
25. Revision Summary...................................................... 98
Document Number: 002-00615 Rev. *A Page 4 of 103
S29PL-J
1. General Description
The PL127J/PL129J/PL064J/PL032J is a 128/128/64/32 Mbit, 3.0 volt-only Page Mode and Simultaneous Read/Write Flash
memory device organized as 8/8/4/2 Mwords. The devices are offered in the following packages:
– 11 mm x 8 mm, 80-ball Fine-pitch BGA standalone (PL127J)
– 8 mm x 11.6 mm, 64-ball Fine-pitch BGA multi-chip compatible (PL127J)
– 8.15 mm x 6.15 mm, 48-ball Fine-pitch BGA standalone (PL064J/PL032J)
– 7 mm x 9 mm, 56-ball Fine-pitch BGA multi-chip compatible (PL064J and PL032J)
– 20 mm x 14 mm, 56-pin TSOP (PL127J)
The word-wide data (x16) appears on DQ15-DQ0. This device can be programmed in-system or in standard EPROM programmers.
A 12.0 V VPP is not required for write or erase operations.
2. Simultaneous Read/Write Operation with Zero Latency
The Simultaneous Read/Write architecture provides simultaneous operation by dividing the memory space into 4 banks, whic h
can be considered to be four separate memory arrays as far as certain operations are concerned. The device can improve overall
system performance by allowing a host system to program or erase in one bank, then immediately and simultaneously read from
another bank with zero latency (with two simultaneous operations operating at any one time). This releases the system from waiting
for the completion of a program or erase operation, greatly im proving system performance.
The device can be organized in both top and bottom sector configurations. The banks are organized as follows:
2.1 Page Mode Features
The page size is 8 words. After initial page access is accomplished, the page mode operation provides fast read access speed of
random locations within that page.
2.2 Standard Flash Memory Features
The device requires a single 3.0 volt power supply (2.7 V to 3.6 V) for both read and write functions. Internally generated and
regulated voltages are provided for the program and erase operations.
The device is entirely command set compatible with the JEDEC 42.4 single-power-supply Flash standard. Commands are written
to the command register using standard microprocessor write timing. Register contents serve as inputs to an internal state-machine
that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming
and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices.
Device programming occurs by executing the program command sequence. The Unlock Bypass mode facilitates faster
programming times by requiring only two write cycles to program data instead of four. Device erasure occurs by executing the erase
command sequence.
Bank PL127J Sectors PL064J Sectors PL032J Sectors
A 16 Mbit (4 Kw x 8 and 32 Kw x 31) 8 Mbit (4 Kw x 8 and 32 Kw x 15) 4 Mbit (4 Kw x 8 and 32 Kw x 7)
B 48 Mbit (32 Kw x 96) 24 Mbit (32 Kw x 48) 12 Mbit (32 Kw x 24)
C 48 Mbit (32 Kw x 96) 24 Mbit (32 Kw x 48) 12 Mbit (32 Kw x 24)
D 16 Mbit (4 Kw x 8 and 32 Kw x 31) 8 Mbit (4 Kw x 8 and 32 Kw x 15) 4 Mbit (4 Kw x 8 and 32 Kw x 7)
Bank PL129J Sectors CE# Control
1A 16 Mbit (4 Kw x 8 and 32 Kw x 31) CE1#
1B 48 Mbit (32 Kw x 96) CE1#
2A 48 Mbit (32 Kw x 96) CE2#
2B 16 Mbit (4 Kw x 8 and 32 Kw x 31) CE2#
Document Number: 002-00615 Rev. *A Page 5 of 103
S29PL-J
The host system can detect whether a program or erase operation is complete by reading the DQ7 (Data# Polling) and DQ6 (toggle)
st at us bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other
sectors. The device is fully erased when shipped from the factory.
Hardware data protection measures include a low VCC detector that automatically inhibits write operations during power
transitions. The hardware sector protection feature disables both program and erase operations in any combination of sectors of
memory. This can be achieved in-system or via programming equipment.
The Erase Suspend/Erase Resume feature enables the user to put erase on hold for any period of time to read data from, or
program data to, any sector that is not selected for erasure. True background erase can thus be achieved . If a read is needed from
the Secured Silicon Sector area (One Time Program area) after an erase suspend, then the user must use the proper command
sequence to enter and exit this region.
The Program Suspend/Program Resume feature enables the user to hold the program operation to read data from any sector that
is not selected for programming. If a read is needed from the Secured Silicon Sector area, Persistent Protection area, Dynamic
Protection area, or the CFI area, after a program suspend, then the user must use the proper command sequence to enter and exit
this region.
The device offers two power-saving features . When addresses have been stable for a specified amount of time, the device enters
the automati c slee p mode. The system can also place the device into the standby mode. Power consumption is greatly reduced in
both these modes. The device electrically erases all bits within a sector simultaneously via Fowler-Nordheim tunneling. The data is
programmed using hot electron injection.
3. Ordering Information
The order number (Valid Combination) is formed by a valid combinations of the following:
S29PL-J 55 BA W 00 0 Packing Type
0=Tray
1=Tube
2 = 7-inch Tape and Reel
3 = 13- inch Tape and Reel
Model Number (Additional Ordering Options)
00 = 3.0V VIO, 80-ball 11 x 8 mm FBGA (VBG080)
01 = 1.8V VIO, 80-ball 11 x 8 mm FBGA (VBG080)
02 = 3.0V VIO, 64-ball 8 x 11.6 mm FBGA (VBH064)
12 = 3.0V VIO, 48-ball 8 x 6 mm FBGA (VBK048)
13 = 3.0V VIO, 56-pin 20 x 14 mm TSOP (TS056)
15 = 3.0V VIO, 56-ball 7 x 9 mm FBGA (VBU056)
Temperature Range
W = Wireless (–25°C to +85°C)
I = Industr ial (–40°C to +85°C)
Package Type
BA= Fine-Pitch Grid Array (FBGA),
Standard
BF = Fine-Pitch Grid Array (FBGA)
Lead (Pb)-free
TA = Thin Small Outline Package (TSOP) Standard Pinout
Standard
TF = Thin Small Outline Package (TSOP) Standard Pinout
Lead (Pb)-free
Clock Speed
55 = 55 ns (Contact factory for availability)
60 = 60 ns
65 = 65 ns
70 = 70 ns
80 = 80 ns
Device Nu mber/Des cr ip t ion
128 Megabit (8 M x 16-Bit), 64 Megabit (4 M x 16-Bit), 32 Megabit (2 M x 16-Bit)
CMOS Flash Memory, Simultaneous-Read/Writ e, Page-Mode Flash Memory,
3.0 Volt-only Read, Program, and Erase
Document Number: 002-00615 Rev. *A Page 6 of 103
S29PL-J
Valid Combinations to be Supported for this Device
128 Mb Products Based on 110 nm Floating Gate Technology
Device Number/
Description Speed (ns) Package
Type Temperature
Range Additional
Ordering Options CE#
Configuration
S29PL127J 60, 65, 70 BA, BF, TA, TF W, I 00, 13 Single CE#
S29PL127J 80 BA, BF W, I 01 Single CE#
64 Mb Products Based on 110 nm Floating Gate Technology
Device Number/
Description Speed (ns) Package
Type Temperature
Range Additional
Ordering Options
S29PL064J 55, 60, 70 BA, BF W, I 12, 15
32 Mb Products Based on 110 nm Floating Gate Technology
Device Number/
Description Speed (ns) Package
Type Temperature
Range Additional
Ordering Options
S29PL032J 55, 60, 70 BA, BF W, I 12, 15
Document Number: 002-00615 Rev. *A Page 7 of 103
S29PL-J
Notes
1. Please contact the factory for PL129J availability.
2. BGA package marking omits leading S29 and packing type designator from orderi ng part number.
3. 55 ns speed only supported for PL032J and PL127J.
Note
TSOP package markings omit packing type designator from ordering part number.
4. Product Selector Guide
Note
55 ns speed bin only supported for PL032J and PL064J.
Valid Combinations for BGA Packages
Order Number (Note 1) Speed (ns) VIO Range
PL129J, PL127J,PL064J, PL032J 55, 60, 65, 70 (3) 2.7–3.6
PL129J, PL127J 80 1.65–1.95
Valid Combinations for TSOP Packages
Order Number Speed (ns) VIO Range
S29PL127J 60, 70 2.7–3.6
Part Number S29PL032J/S29PL064J/S29PL0127J/S29PL129J
Speed Option
VCC,VIO = 2.7 V – 3.6 V 55
(See Note) 60 65 — 70
VCC = 2.7 V – 3.6 V,
VIO = 1.65 V – 1.95 V
(PL127J and PL129J only) ———80—
Max Access Time, ns (tACC)55
(See Note) 60 65 80 70
Max CE# Access, ns (tCE)
Max Page Access, ns (tPACC)20
(See Note) 25 30 30
Max OE# Access, ns (tOE)
Document Number: 002-00615 Rev. *A Page 8 of 103
S29PL-J
5. Block Diagram
Notes
1. R Y/BY# is an open drain output.
2. Amax = A22 (PL127J), A21 (PL129J and PL064J), A20 (PL032J)
3. For PL129J there are two CE# (CE1# and CE2#)
VCC
VSS
State
Control
Command
Register PGM Voltage
Generator
VCC Detector Timer
Erase Voltage
Generator
Input/Output
Buffers
Sector
Switches
Chip Enable
Output Enable
Logic
Y-Gating
Cell Matrix
Address Latch
Y-Decoder
X-Decoder
Data Latch
RESET#
RY/BY#
Amax–A3
A2–A0
CE#
WE#
DQ15–DQ0
VIO
OE#
Document Number: 002-00615 Rev. *A Page 9 of 103
S29PL-J
6. Simultaneous Read/Write Block Diagram
Note
Amax = A22 (PL127J), A21 (PL064J), A20 (PL032J)
V
CC
V
SS
Bank A Address
Bank B Address
Amax–A0
RESET#
WE#
CE#
DQ0–DQ15
STATE
CONTROL
&
COMMAND
REGISTER
RY/BY#
Bank A
X-Decoder
OE#
DQ15–DQ0
Status
Control
Amax–A0
Amax–A0
A22–A0A22–A0
DQ15–DQ0
DQ15–DQ0
DQ15–DQ0
DQ15–DQ0
Mux
Mux
Mux
Bank B
X-Decoder
Y-gate
Bank C
X-Decoder
Bank D
X-Decoder
Y-gate
Bank C Address
Bank D Address
WP#/ACC
Document Number: 002-00615 Rev. *A Page 10 of 103
S29PL-J
7. Simultaneous Read/Write Block Diagram (PL129J)
Note
Amax = A21 (PL129J)
V
CC
V
SS
Bank 1A Address
Bank 1B Address
A21–A0
RESET#
WE#
CE1#
DQ0–DQ15
CE2#
STATE
CONTROL
&
COMMAND
REGISTER
RY/BY#
Bank 1A
X-Decoder
OE#
DQ15–DQ0
Status
Control
A21–A0
A21–A0
A21–A0A21–A0
DQ15–DQ0
DQ15–DQ0
DQ15–DQ0
DQ15–DQ0
Mux
Mux
Mux
Bank 1B
X-Decoder
Y-gate
Bank 2A
X-Decoder
Bank 2B
X-Decoder
Y-gate
Bank 2A Address
Bank 2B Address
CE1#=L
CE2#=H
CE1#=H
CE2#=L
WP#/ACC
Document Number: 002-00615 Rev. *A Page 11 of 103
S29PL-J
8. Connection Diagrams
8.1 Special Package Handling Instructions
8.1.1 TSOP, BGA, PDIP, SSOP, and PLCC Packages
Special handling is required for Flash Memory products in mold ed packages.
The package and/or data integrity may be compromised if th e packa ge body is exp osed to temp era tures abo ve 150°C for prolonged
periods of time.
8.1.2 FBGA Packages
Special handling is required for Flash Memory products in FB GA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data
integrity may be compromised if the package body is exposed to temp eratures above 150°C for prolonged periods of ti me.
8.2 80-Ball Fine-Pitch BGA—PL127J
Figure 8.1 80-Ball Fine-Pitch BGA, Top View, Balls Facing Down —PL127J
B2 D2 E2 F2 G2 H2 J2
D3 E3 F3 G3 H3 J3
D4 E4 F4 G4 H4 J4
D5 E5 F5 G5 H5 J5
D6 E6 F6 G6 H6 J6
B7 D7 E7 F7 G7 H7 J7
NC DQ15A16A15A14A12A13NC
DQ14 DQ13DQ7A11A10A8A9
DQ12 VCC
DQ5A19A21RESET#WE#
DQ10 DQ11DQ2A20A18WP#/ACCRY/BY#
DQ8 DQ9DQ0A5A6A17A7
CE# OE#
K2
K3
K4
K5
K6
K7
VSS
DQ6
DQ4
DQ3
DQ1
VSS
A0A1A2A4A3NC
B1 D1 E1 F1 G1 H1 J1
VIO NCNCNCNCNCNCNC
A1
NC
B8 D8
C2
C3
C4
C5
C6
C7
A2
A7
NC
NC
C1
C8 E8 F8 G8 H8 J8
NC NC
K1
NC
K8
NC
L2
L7
NC
NC
M2
M7
NC
NC
L1
NC
L8
NC
M1
NC
M8
NCVSS
VIO
NCA22NCNC
A8
NC
Document Number: 002-00615 Rev. *A Page 12 of 103
S29PL-J
8.3 64-Ball Fine-Pitch BGA—MCP Compatible—PL127J
Figure 8.2 64-Ball Fine-Pitch BGA, MCP Compatible, Top View, Balls Facing Down—PL127J
F7 F8 F9
G3 G4 G7 G8 G9G2
H3 H4 H5 H6 H7 H8 H9H2
NC NC
B5 B6
C4 C5 C6 C7 C8
D2 D3 D4 D5 D6 D7 D8 D9
E2 E3 E4 E5 E6 E7 E8 E9
F2 F3 F4
J3 J4 J5 J6 J7 J8 J9J2
K3 K4 K5 K6 K7 K8
L5 L6
NC NC
C3
M1 M10
A1 A10
A5 A18 RY/BY # A20 A9 A13 A21
A6 RFU RESET# RFU A19 A12 A15
A7 RFU WP#/ACC WE# A8 A11
A2
A3
A22A14A10A17A4A1
VCCfDQ15DQ13DQ4DQ3DQ9OE#CE#f1
RFU RFU
A16RFUDQ6DQ1VSSA0
VSSDQ7DQ12RFUVCCfDQ10DQ0RFU
DQ14DQ5RFUDQ11DQ2DQ8
RFURFU
Document Number: 002-00615 Rev. *A Page 13 of 103
S29PL-J
8.4 48-Ball Fine-Pitch BGA, PL064J and PL032J
Figure 8. 3 48-Ball Fi ne-Pitch BGA, Top View, Balls Facing Down—PL064J—PL032J: C4(A21 )=NC
B3 C3 D3 E3 F3 G3 H3
B4 C4 D4 E4 F4 G4 H4
B5 C5 D5 E5 F5 G5 H5
B6 C6 D6 E6 F6 G6 H6
V
SS
DQ15NCA16A15A14A12
DQ6DQ13DQ14DQ7A11A10A8
DQ4VCC
DQ12DQ5A19A21RESET#
DQ3DQ11DQ10DQ2A20A18WP#/ACC
A3
A4
A5
A6
A13
A9
WE#
RY/BY#
B2 C2 D2 E2 F2 G2 H2
DQ1DQ9DQ8DQ0A5A6A17
A2
A7
B1 C1 D1 E1 F1 G1 H1
V
SS
OE#CE#A0A1A2A4
A1
A3
Document Number: 002-00615 Rev. *A Page 14 of 103
S29PL-J
8.5 56-Pin TSOP 20 x 14 mm
Figure 8.4 56-Pin TSOP 20 x 14 mm Configuration—PL127J
For this family of products, a single multi-chip compatible package (TSOP) is offered for each density to allow both standalon e and
multi-chip qualification using a single, adaptable package. This new methodology allows package standardization resulting in faster
development. The multi-chip compatible package includes all the pins required for standalone devic e operation and verification. In
addition, extra pins are included for insertion of common data storage or logic devices to be used for multi-chip products. If a
standalone device is required, the extra multi-chip specific pins are not connected and the standalone device operates normally. The
multi-chip compatible package sizes were chosen to serve the largest number of combinations possible. There are only a few cases
where a larger package size would be required to accommodate the multi-chip combination. This multi-chip compatible package set
does not allow for direct package migration from the Am29BDS128H, Am29BDS128G, Am29BDS640G products, which use legacy
standalone packages.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
RESET#
RY/BY#
A0
A1
A2
A3
A4
A5
V
CC
DQ0
DQ1
DQ2
DQ3
V
SSQ
DQ4
DQ5
DQ6
DQ7
V
SS
NC
A6
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
WP#/ACC
WE#
NC
A22
A21
A20
OE#
NC
CE#
V
SS
DQ15
DQ14
DQ13
DQ12
V
SSQ
V
CCQ
DQ11
DQ10
DQ9
DQ8
V
CC
A19
23
24
25
26
27
28
A7
A8
A9
A10
A11
A12
34
33
32
31
30
29
A18
A17
A16
A15
A14
A13
V
CCQ
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8.6 56-Ball Fine-Pitch Ball Grid Array, PL064J and PL032J
Figure 8.5 56-ball Fine-Pitch BGA, Top View , Balls Fa cing Dow n,—PL064J and PL032J,
A7
A3
A2
DQ8 DQ14
RFU
RFU WP/ACC WE# A8 A11
A2 A3 A4 A5 A6 A7
A6 RFU RST# RFU A19 A12 A15
B1 B2 B3 B4 B5 B6 B7 B8
A5 A18 RY/BY# A20 A9 A13 A21
C1 C2 C3 C4 C5 C6 C7 C8
A1 A4 A17 A10 A14 RFU
D1 D2 D3 D6 D7 D8
VSS DQ1A0 DQ6 RFU A16
E2 E3E1 E6 E7 E8
CE1#f
DQ0
OE# DQ9 DQ3 DQ4 DQ13 DQ15 RFU
F1 F2 F3 F4 F5 F6 F7 F8
DQ10 VCCf RFU DQ12 DQ7 VSS
G1 G2 G3 G4 G5 G6 G7 G8
DQ2 DQ11 RFU DQ5
H2 H7
H3 H4 H5 H6
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9. Pin Description
Note
Amax = A22 (PL127J), A21 (PL129J and PL064J), A20 (PL032J)
Amax–A0 Address bus
DQ15–DQ0 16-bit data inputs/outputs/float
CE# Chip Enable Inputs
OE# Output Enable Input
WE# Write Enable
VSS Device Ground
NC Not Connected. No device internal signal is connected to the package connector nor is there any future plan to
use the connector for a signal. The connection may safely be used for routing space for a signal on a Printed
Circuit Board (PCB).
RFU Reserved for Future Use. Not currently connected internally but the pin/ball location should be left
unconnected and unused by PCB routing channel for future compatibility. The pin/ball may be
used by a signal in the future.
RY/BY#
Ready/Busy output and open drain.
When RY/BY#= VIH, the device is ready to accept read operations and commands. When RY/
BY#= VOL, the device is either executing an embedded algorithm or the device is executing a
hardware reset operation.
WP#/ACC
Write Protect/Acceleration Input.
When WP#/ACC= VIL, the highest and lowest two 4K-word sectors are write protected regardless
of other sector protection configurations. When WP#/ACC= VIH, these sector are unprotected
unless the DYB or PPB is programmed. When WP#/ACC= VHH, program and erase operations
are accelerated.
VIO Input/Output Buffer Power Supply
(1.65 V to 1.95 V (for PL127J and PL129J) or 2.7 V to 3.6 V (for all PLxxxJ devices))
VCC Chip Power Supply
(2.7 V to 3.6 V or 2.7 to 3.3 V)
RESET# Hardware Reset Pin
CE1#, CE2# Chip Enable Inputs.
CE1# controls the 64Mb in Banks 1A and 1B.
CE2# controls the 64 Mb in Banks 2A and 2B. (Only for PL129J)
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10. Logic Symbol
11. Device Bus Operations
This section describes the re quirements and use of the device bus operations, which are initiated through the interna l comman d
register. The command register itself doe s not occupy any addressable memory location. The register is a latch used to store the
commands, along with the address and da ta information needed to execute the comma nd. The contents of the register serve as
inputs to the internal state machine. The state machine outputs dictate the function of the device. Table 11.1 lists the device bus
operations, the inputs and control leve ls they require, and the resul tin g output. The following subsections describe each of these
operations in further detail.
Table 11.1 PL127J Device Bus Operations
Operation CE# OE# WE# RESET# WP#/ACC Addresses
(Amax–A0) DQ15–
DQ0
Read L L H H X AIN DOUT
Write L H L H X (Note 2) AIN DIN
Standby VIO0.3 V X X VIO 0.3 V X (Note 2) X High-Z
Output Disable L H H H X X High-Z
Reset X X X L X X High-Z
Temporary Sector Unprotect
(High Volta ge) XXXV
ID XA
IN DIN
max+1
16
DQ15–DQ0
Amax–A0
CE#
OE#
WE#
RESET# RY/BY#
WP#/ACC
VIO (VCCQ)
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Legend:
L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 8.5–9.5 V, X = Don’t Care, SA = Sector Address, AIN = Address In, DIN = Data In, DOUT = Data Out
Notes
1. The sector protect and sector unprotect functions may also be implemented via programming equipment. See High Voltage Sector Protection on page 55.
2. WP#/ACC must be high when writing to upper two and lower t wo sectors.
11.1 Requirements for Reading Array Data
To read array data from the outputs, the system must drive the OE# and appropriate CE# pins (For PL129J - CE1#/CE2# pins) to
VIL. In PL129J, CE1# and CE2# are the power control and select the lower (CE1#) or upper (CE2#) halves of the device. CE# is the
power control. OE# is the output control and gates array data to the output pins. WE# should remain at VIH.
The internal state machine is set for reading array data upon device power-up, or afte r a hardware reset. This ensures that no
spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array
data. Standard microprocessor read cycles that assert valid addresses on the device address inputs prod uce valid data on the
device data outputs. Each bank remains enabled for read access until the command register contents are altered.
Refer to Table 22.3 on page 91 for timing specifications and to Figure 21.3 on page 81 for the timing diagram. ICC1 in the DC
Characteristics table represents the active current specification for reading array data.
11.1.1 Random Read (Non-Page Read)
Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable access time (tCE) is the
delay from the stable addresses and stable CE# to valid data at the output inputs. The output enable access time is the delay from
the falling edge of the OE# to valid dat a at the output inputs (assuming the addresses have been stable for at least tACC–tOE time).
11.1.2 Page Mode Read
The device is capable of fast page mode read and is compatible with the page mode Mask ROM read operation. This mode provides
faster read access speed for random locations within a page. Address bits Amax–A3 select an 8 word page, and address bits A2–A0
select a specif ic w ord wi t hi n tha t pa g e. This is an asynchronous opera tion with the microprocessor supplying the specific word
location.
The random or initial page access is tACC or tCE and subsequent page read accesses (as long as the locations specified by the
microprocessor falls within that page) is equivalent to tPACC. When CE# (CE1# and CE#2 in PL129J) is deasserted (=VIH), the
reassertion of CE# (CE1# or CE#2 in PL129J) for subsequent access has access time of tACC or tCE. Here again, CE# (CE1# /CE#2
in PL129J)selects the device and OE# is the output control and should be used to gate data to the output inputs if the device is
selected. Fast page mode accesses are obtained by keeping Amax–A3 constant and changing A2–A0 to select th e specific word
within that page.
Table 11.2 PL129J Device Bus Operations
Operation CE1# CE2# OE# WE# RESET# WP#/ACC Addresses
(A21–A0) DQ15–
DQ0
Read LH
LH H X A
IN DOUT
HL
Write LH
HL H X
(Note 2) AIN DIN
HL
Standby VIO
0.3 V VIO
0.3 V XX VIO
0.3 V X X High-Z
Output Disable L L H H H X X High-Z
Reset X X X X L X X High-Z
Temporary Sector Unprotect
(High Volta ge) XXXX V
ID XA
IN DIN
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11.2 Simultaneous Read/Write Operation
In addition to the conventional features (read, program, erase-suspend read, erase-suspend program, and program-suspend read),
the device is capable of reading data from one bank of memory while a program or erase operation is in progress in another bank of
memory (simultaneous operation). The bank can be selected by bank addresses (PL127J: A22–A20, PL129J and PL064J: A21–
A19, PL032J: A20–A18) with zero latency.
The simultaneous operation can ex ecute multi-function mode in the same bank.
11.3 Writing Commands/Command Sequences
To write a command or comma nd sequence (which includes programming data to the device and era sing sectors of memory), the
system must drive WE# and CE# (CE1# or CE#2 in PL129J) to VIL, and OE# to VIH.
The device features an Unlock Bypass mode to facilitate faster programming. Once a bank enters the Unlock Bypass mode, onl y
two write cycles are required to program a word, instead of four. W ord Program Command Sequence on page 64 has details on
programming data to the device using both standard and Unlock Bypass command sequences.
An erase operation can erase one sector, multiple sectors, or the entire device. Tab le 11.4 on page 19 indicates the set of address
space that each sector occupies. A “bank address” is the set of address bits required to uniquely select a bank. Similarly, a “sector
address” refers to the address bits required to uniquely select a sector. Command Definitions on page 62 has details on erasing a
sector or the entire chip, or suspending/resuming the erase operation.
ICC2 in the DC Characteristics on page 78 represents the active current specification for the write mode. See the timing specification
tables and timing diagrams in section Reset on page 82 for write operations.
11.3.1 Accelerated Program Operation
The device offers accelerated prog ram operations through the ACC function. This function is primarily intended to allow faster
manufacturing throughput at the factory.
Table 11.3 Page Select
Word A2 A1 A0
Word 0 000
Word 1 001
Word 2 010
Word 3 011
Word 4 100
Word 5 101
Word 6 110
Word 7 111
Table 11.4 Bank Select
Bank PL 127J: A22–A20, PL064J: A21–A19, PL032J: A20–A18
Bank A 000
Bank B 001, 010, 011
Bank C 100, 101, 110
Bank D 111
Bank CE1# CE2# PL129J: A21–A20
Bank 1A 0 1 00
Bank 1B 0 1 01, 10, 11
Bank 2A 1 0 00, 01, 10
Bank 2B 1 0 11
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If the system asserts VHH on this pin, the device automatically enters the aforementioned Unlock Bypass mode, te mporarily
unprotects any protected sectors, and uses the higher voltage on the pin to reduce the time requi red for program operations. The
system would use a two-cycle program command sequence as required by the Unlock Bypass mode. Removing VHH from the WP#/
ACC pin returns the device to normal operation. Note that VHH must not be asserted on WP#/ACC for operations other than
accelerated programming, or device damage may result. In addition, the WP#/ACC pin should be raised to VCC when not in use.
That is, the WP#/ACC pin should not be left floating or unconnected; inconsistent behavior of the device may result.
11.3.2 Autoselect Functions
If the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read
autoselect codes from the internal register (which is separate from the memory array) on DQ15–DQ0. Standard read cycle timings
apply in this mode. Refer to the Table 11.9, Secured Silicon Sector Addresse s on page 44 and Autoselect Command Sequence
on page 63 for more information.
11.4 Standby Mode
When the system is not reading or writing to the device, it can place the device in the standby mode. In this mode, current
consumption is greatly reduced, and the outputs are placed in the high impedance state, independent of the OE# input.
The device enters the CMOS standby mode when the CE# (CE1#,CE#2 in PL129J) and RESET# pins are both held at VIO ± 0.3 V.
(Note that this is a more restricted voltage range than VIH.) If CE# (CE1#,CE#2 in PL129J) and RESET# are held at VIH, but not
within VIO ± 0.3 V, the device will be in the standby mode, but the standby current will be greater. The device requires standard
access time (tCE) for read access when the device is in either of these standby modes, before it is ready to read data.
If the device is deselected during erasure or programming, the device draws active current until the operation is comple ted.
ICC3 in DC Characteristics on page 78 represents the CMOS standby current specification.
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11.5 Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. Th e device automatica lly enables this mode when
addresses remain stable for tACC + 30 ns. T he automatic sleep mode is independent of the CE#, WE#, and OE# control signals.
Standard address access timings provide ne w data when ad dresses are changed. While in sleep mode, output data is latched and
always available to the system. Note that during automatic sleep mode, OE# must be at VIH before the device reduces current to the
stated sleep mode specification. ICC5 in DC Characteristics on page 78 represents the automatic sleep mode current specification.
11.6 RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of resetting the device to reading array data. When the RESET# pin is driven low for
at least a period of tRP, th e device immediately terminates any operati on in progress, tristates all output pins, and ignores all read/
write commands for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The
operation that was interrupted shoul d be reinitiated once the device is ready to accept another command sequ ence, to ensure data
integrity.
Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS±0.3 V, the device draws CMOS standby
current (ICC4). If RESET# is held at VIL but not within VSS±0.3 V, the standby current will be greater.
The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash memory, enabling the
system to read the boot-up firmware from the Flash memory.
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a “0” (busy) until the internal reset operation is
complete, which requires a time of tREADY (during Embedded Algorithms). The system can thus monitor RY/BY# to determine
whether the reset operation is complete. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is
“1”), the reset operation is completed within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after
the RESET# pin returns to VIH.
Refer to the tables in AC Characteristic on page 79 for RESET# parameters and to Figure 21.5 on page 82 for the timing diagram.
11.7 Output Disable Mode
When the OE# input is at VIH, output from the device is disabled. The output pins (except for RY/BY#) are placed in the highest
Impedance state
Table 11.5 PL127J Sector Architecture (Sheet 1 of 9)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Bank A
SA0 00000000000 4 000000h–000FFFh
SA1 00000000001 4 001000h–001FFFh
SA2 00000000010 4 002000h–002FFFh
SA3 00000000011 4 003000h–003FFFh
SA4 00000000100 4 004000h–004FFFh
SA5 00000000101 4 005000h–005FFFh
SA6 00000000110 4 006000h–006FFFh
SA7 00000000111 4 007000h–007FFFh
SA8 00000001XXX 32 008000h–00FFFFh
SA9 00000010XXX 32 010000h–017FFFh
SA10 00000011XXX 32 018000h–01FFFFh
SA11 00000100XXX 32 020000h–027FFFh
SA12 00000101XXX 32 028000h–02FFFFh
SA13 00000110XXX 32 030000h–037FFFh
SA14 00000111XXX 32 038000h–03FFFFh
SA15 00001000XXX 32 040000h–047FFFh
SA16 00001001XXX 32 048000h–04FFFFh
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Bank A
SA17 00001010XXX 32 050000h–057FFFh
SA18 00001011XXX 32 058000h–05FFFFh
SA19 00001100XXX 32 060000h–067FFFh
SA20 00001101XXX 32 068000h–06FFFFh
SA21 00001110XXX 32 070000h–077FFFh
SA22 00001111XXX 32 078000h–07FFFFh
SA23 00010000XXX 32 080000h–087FFFh
SA24 00010001XXX 32 088000h–08FFFFh
SA25 00010010XXX 32 090000h–097FFFh
SA26 00010011XXX 32 098000h–09FFFFh
SA27 00010100XXX 32 0A0000h–0A7FFFh
SA28 00010101XXX 32 0A8000h–0AFFFFh
SA29 00010110XXX 32 0B0000h–0B7FFFh
SA30 00010111XXX 32 0B8000h–0BFFFFh
SA31 00011000XXX 32 0C0000h–0C7FFFh
SA32 00011001XXX 32 0C8000h–0CFFFFh
SA33 00011010XXX 32 0D0000h–0D7FFFh
SA34 00011011XXX 32 0D8000h–0DFFFFh
SA35 00011100XXX 32 0E0000h–0E7FFFh
SA36 00011101XXX 32 0E8000h–0EFFFFh
SA37 00011110XXX 32 0F0000h–0F7FFFh
SA38 00011111XXX 32 0F8000h–0FFFFFh
Table 11.5 PL127J Sector Architecture (Sheet 2 of 9)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
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Bank B
SA39 00100000XXX 32 100000h–107FFFh
SA40 00100001XXX 32 108000h–10FFFFh
SA41 00100010XXX 32 110000h–117FFFh
SA42 00100011XXX 32 118000h–11FFFFh
SA43 00100100XXX 32 120000h–127FFFh
SA44 00100101XXX 32 128000h–12FFFFh
SA45 00100110XXX 32 130000h–137FFFh
SA46 00100111XXX 32 138000h–13FFFFh
SA47 00101000XXX 32 140000h–147FFFh
SA48 00101001XXX 32 148000h–14FFFFh
SA49 00101010XXX 32 150000h–157FFFh
SA50 00101011XXX 32 158000h–15FFFFh
SA51 00101100XXX 32 160000h–167FFFh
SA52 00101101XXX 32 168000h–16FFFFh
SA53 00101110XXX 32 170000h–177FFFh
SA54 00101111XXX 32 178000h–17FFFFh
SA55 00110000XXX 32 180000h–187FFFh
SA56 00110001XXX 32 188000h–18FFFFh
SA57 00110010XXX 32 190000h–197FFFh
SA58 00110011XXX 32 198000h–19FFFFh
SA59 00110100XXX 32 1A0000h–1A7FFFh
SA60 00110101XXX 32 1A8000h–1AFFFFh
SA61 00110110XXX 32 1B0000h–1B7FFFh
SA62 00110111XXX 32 1B8000h–1BFFFFh
SA63 00111000XXX 32 1C0000h–1C7FFFh
SA64 00111001XXX 32 1C8000h–1CFFFFh
SA65 00111010XXX 32 1D0000h–1D7FFFh
Table 11.5 PL127J Sector Architecture (Sheet 3 of 9)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
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Bank B
SA66 00111011XXX 32 1D8000h–1DFFFFh
SA67 00111100XXX 32 1E0000h–1E7FFFh
SA68 00111101XXX 32 1E8000h–1EFFFFh
SA69 00111110XXX 32 1F0000h–1F7FFFh
SA70 00111111XXX 32 1F8000h–1FFFFFh
SA71 01000000XXX 32 200000h–207FFFh
SA72 01000001XXX 32 208000h–20FFFFh
SA73 01000010XXX 32 210000h–217FFFh
SA74 01000011XXX 32 218000h–21FFFFh
SA75 01000100XXX 32 220000h–227FFFh
SA76 01000101XXX 32 228000h–22FFFFh
SA77 01000110XXX 32 230000h–237FFFh
SA78 01000111XXX 32 238000h–23FFFFh
SA79 01001000XXX 32 240000h–247FFFh
SA80 01001001XXX 32 248000h–24FFFFh
SA81 01001010XXX 32 250000h–257FFFh
SA82 01001011XXX 32 258000h–25FFFFh
SA83 01001100XXX 32 260000h–267FFFh
SA84 01001101XXX 32 268000h–26FFFFh
SA85 01001110XXX 32 270000h–277FFFh
SA86 01001111XXX 32 278000h–27FFFFh
SA87 01010000XXX 32 280000h–287FFFh
SA88 01010001XXX 32 288000h–28FFFFh
SA89 01010010XXX 32 290000h–297FFFh
SA90 01010011XXX 32 298000h–29FFFFh
SA91 01010100XXX 32 2A0000h–2A7FFFh
SA92 01010101XXX 32 2A8000h–2AFFFFh
SA93 01010110XXX 32 2B0000h–2B7FFFh
SA94 01010111XXX 32 2B8000h–2BFFFFh
SA95 01011000XXX 32 2C0000h–2C7FFFh
SA96 01011001XXX 32 2C8000h–2CFFFFh
SA97 01011010XXX 32 2D0000h–2D7FFFh
SA98 01011011XXX 32 2D8000h–2DFFFFh
SA99 01011100XXX 32 2E0000h–2E7FFFh
SA100 01011101XXX 32 2E8000h–2EFFFFh
SA101 01011110XXX 32 2F0000h–2F7FFFh
SA102 01011111XXX 32 2F8000h–2FFFFFh
SA103 01100000XXX 32 300000h–307FFFh
SA104 01100001XXX 32 308000h–30FFFFh
SA105 01100010XXX 32 310000h–317FFFh
SA106 01100011XXX 32 318000h–31FFFFh
SA107 01100100XXX 32 320000h–327FFFh
SA108 01100101XXX 32 328000h–32FFFFh
SA109 01100110XXX 32 330000h–337FFFh
SA110 01100111XXX 32 338000h–33FFFFh
SA111 01101000XXX 32 340000h–347FFFh
SA112 01101001XXX 32 348000h–34FFFFh
Table 11.5 PL127J Sector Architecture (Sheet 4 of 9)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
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Bank B
SA115 01101100XXX 32 360000h–367FFFh
SA116 01101101XXX 32 368000h–36FFFFh
SA117 01101110XXX 32 370000h–377FFFh
SA118 01101111XXX 32 378000h–37FFFFh
SA119 01110000XXX 32 380000h–387FFFh
SA120 01110001XXX 32 388000h–38FFFFh
SA121 01110010XXX 32 390000h–397FFFh
SA122 01110011XXX 32 398000h–39FFFFh
SA123 01110100XXX 32 3A0000h–3A7FFFh
SA124 01110101XXX 32 3A8000h–3AFFFFh
SA125 01110110XXX 32 3B0000h–3B7FFFh
SA126 01110111XXX 32 3B8000h–3BFFFFh
SA127 01111000XXX 32 3C0000h–3C7FFFh
SA128 01111001XXX 32 3C8000h–3CFFFFh
SA129 01111010XXX 32 3D0000h–3D7FFFh
SA130 01111011XXX 32 3D8000h–3DFFFFh
SA131 01111100XXX 32 3E0000h–3E7FFFh
SA132 01111101XXX 32 3E8000h–3EFFFFh
SA133 01111110XXX 32 3F0000h–3F7FFFh
SA134 01111111XXX 32 3F8000h–3FFFFFh
Table 11.5 PL127J Sector Architecture (Sheet 5 of 9)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
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Bank C
SA135 10000000XXX 32 400000h–407FFFh
SA136 10000001XXX 32 408000h–40FFFFh
SA137 10000010XXX 32 410000h–417FFFh
SA138 10000011XXX 32 418000h–41FFFFh
SA139 10000100XXX 32 420000h–427FFFh
SA140 10000101XXX 32 428000h–42FFFFh
SA141 10000110XXX 32 430000h–437FFFh
SA142 10000111XXX 32 438000h–43FFFFh
SA143 10001000XXX 32 440000h–447FFFh
SA144 10001001XXX 32 448000h–44FFFFh
SA145 10001010XXX 32 450000h–457FFFh
SA146 10001011XXX 32 458000h–45FFFFh
SA147 10001100XXX 32 460000h–467FFFh
SA148 10001101XXX 32 468000h–46FFFFh
SA149 10001110XXX 32 470000h–477FFFh
SA150 10001111XXX 32 478000h–47FFFFh
SA151 10010000XXX 32 480000h–487FFFh
SA152 10010001XXX 32 488000h–48FFFFh
SA153 10010010XXX 32 490000h–497FFFh
SA154 10010011XXX 32 498000h–49FFFFh
SA155 10010100XXX 32 4A0000h–4A7FFFh
SA156 10010101XXX 32 4A8000h–4AFFFFh
SA157 10010110XXX 32 4B0000h–4B7FFFh
SA158 10010111XXX 32 4B8000h–4BFFFFh
SA159 10011000XXX 32 4C0000h–4C7FFFh
SA160 10011001XXX 32 4C8000h–4CFFFFh
SA161 10011010XXX 32 4D0000h–4D7FFFh
SA162 10011011XXX 32 4D8000h–4DFFFFh
SA163 10011100XXX 32 4E0000h–4E7FFFh
Table 11.5 PL127J Sector Architecture (Sheet 6 of 9)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
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Bank C
SA164 10011101XXX 32 4E8000h–4EFFFFh
SA165 10011110XXX 32 4F0000h–4F7FFFh
SA166 10011111XXX 32 4F8000h–4FFFFFh
SA167 10100000XXX 32 500000h–507FFFh
SA168 10100001XXX 32 508000h–50FFFFh
SA169 10100010XXX 32 510000h–517FFFh
SA170 10100011XXX 32 518000h–51FFFFh
SA171 10100100XXX 32 520000h–527FFFh
SA172 10100101XXX 32 528000h–52FFFFh
SA173 10100110XXX 32 530000h–537FFFh
SA174 10100111XXX 32 538000h–53FFFFh
SA175 10101000XXX 32 540000h–547FFFh
SA176 10101001XXX 32 548000h–54FFFFh
SA177 10101010XXX 32 550000h–557FFFh
SA178 10101011XXX 32 558000h–15FFFFh
SA179 10101100XXX 32 560000h–567FFFh
SA180 10101101XXX 32 568000h–56FFFFh
SA181 10101110XXX 32 570000h–577FFFh
SA182 10101111XXX 32 578000h–57FFFFh
SA183 10110000XXX 32 580000h–587FFFh
SA184 10110001XXX 32 588000h–58FFFFh
SA185 10110010XXX 32 590000h–597FFFh
SA186 10110011XXX 32 598000h–59FFFFh
SA187 10110100XXX 32 5A0000h–5A7FFFh
SA188 10110101XXX 32 5A8000h–5AFFFFh
SA189 10110110XXX 32 5B0000h–5B7FFFh
SA190 10110111XXX 32 5B8000h–5BFFFFh
SA191 10111000XXX 32 5C0000h–5C7FFFh
SA192 10111001XXX 32 5C8000h–5CFFFFh
SA193 10111010XXX 32 5D0000h–5D7FFFh
SA194 10111011XXX 32 5D8000h–5DFFFFh
SA195 10111100XXX 32 5E0000h–5E7FFFh
SA196 10111101XXX 32 5E8000h–5EFFFFh
SA197 10111110XXX 32 5F0000h–5F7FFFh
SA198 10111111XXX 32 5F8000h–5FFFFFh
SA199 11000000XXX 32 600000h–607FFFh
SA200 11000001XXX 32 608000h–60FFFFh
SA201 11000010XXX 32 610000h–617FFFh
SA202 11000011XXX 32 618000h–61FFFFh
SA203 11000100XXX 32 620000h–627FFFh
SA204 11000101XXX 32 628000h–62FFFFh
SA205 11000110XXX 32 630000h–637FFFh
SA206 11000111XXX 32 638000h–63FFFFh
SA207 11001000XXX 32 640000h–647FFFh
SA208 11001001XXX 32 648000h–64FFFFh
SA209 11001010XXX 32 650000h–657FFFh
SA210 11001011XXX 32 658000h–65FFFFh
Table 11.5 PL127J Sector Architecture (Sheet 7 of 9)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 28 of 103
S29PL-J
Bank C
SA213 11001110XXX 32 670000h–677FFFh
SA214 11001111XXX 32 678000h–67FFFFh
SA215 11010000XXX 32 680000h–687FFFh
SA216 11010001XXX 32 688000h–68FFFFh
SA217 11010010XXX 32 690000h–697FFFh
SA218 11010011XXX 32 698000h–69FFFFh
SA219 11010100XXX 32 6A0000h–6A7FFFh
SA220 11010101XXX 32 6A8000h–6AFFFFh
SA221 11010110XXX 32 6B0000h–6B7FFFh
SA222 11010111XXX 32 6B8000h–6BFFFFh
SA223 11011000XXX 32 6C0000h–6C7FFFh
SA224 11011001XXX 32 6C8000h–6CFFFFh
SA225 11011010XXX 32 6D0000h–6D7FFFh
SA226 11011011XXX 32 6D8000h–6DFFFFh
SA227 11011100XXX 32 6E0000h–6E7FFFh
SA228 11011101XXX 32 6E8000h–6EFFFFh
SA229 11011110XXX 32 6F0000h–6F7FFFh
SA230 11011111XXX 32 6F8000h–6FFFFFh
Table 11.5 PL127J Sector Architecture (Sheet 8 of 9)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 29 of 103
S29PL-J
Bank D
SA231 11100000XXX 32 700000h–707FFFh
SA232 11100001XXX 32 708000h–70FFFFh
SA233 11100010XXX 32 710000h–717FFFh
SA234 11100011XXX 32 718000h–71FFFFh
SA235 11100100XXX 32 720000h–727FFFh
SA236 11100101XXX 32 728000h–72FFFFh
SA237 11100110XXX 32 730000h–737FFFh
SA238 11100111XXX 32 738000h–73FFFFh
SA239 11101000XXX 32 740000h–747FFFh
SA240 11101001XXX 32 748000h–74FFFFh
SA241 11101010XXX 32 750000h–757FFFh
SA242 11101011XXX 32 758000h–75FFFFh
SA243 11101100XXX 32 760000h–767FFFh
SA244 11101101XXX 32 768000h–76FFFFh
SA245 11101110XXX 32 770000h–777FFFh
SA246 11101111XXX 32 778000h–77FFFFh
SA247 11110000XXX 32 780000h–787FFFh
SA248 11110001XXX 32 788000h–78FFFFh
SA249 11110010XXX 32 790000h–797FFFh
SA250 11110011XXX 32 798000h–79FFFFh
SA251 11110100XXX 32 7A0000h–7A7FFFh
SA252 11110101XXX 32 7A8000h–7AFFFFh
SA253 11110110XXX 32 7B0000h–7B7FFFh
SA254 11110111XXX 32 7B8000h–7BFFFFh
SA255 11111000XXX 32 7C0000h–7C7FFFh
SA256 11111001XXX 32 7C8000h–7CFFFFh
SA257 11111010XXX 32 7D0000h–7D7FFFh
SA258 11111011XXX 32 7D8000h–7DFFFFh
SA259 11111100XXX 32 7E0000h–7E7FFFh
SA260 11111101XXX 32 7E8000h–7EFFFFh
SA261 11111110XXX 32 7F0000h–7F7FFFh
Bank D
SA262 11111111000 4 7F8000h–7F8FFFh
SA263 11111111001 4 7F9000h–7F9FFFh
SA264 11111111010 4 7FA000h–7FAFFFh
SA265 11111111011 4 7FB000h–7FBFFFh
SA266 11111111100 4 7FC000h–7FCFFFh
SA267 11111111101 4 7FD000h–7FDFFFh
SA268 11111111110 4 7FE000h–7FEFFFh
SA269 11111111111 4 7FF000h–7FFFFFh
Table 11.5 PL127J Sector Architecture (Sheet 9 of 9)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 30 of 103
S29PL-J
Table 11.6 PL064J Sector Architecture (Sheet 1 of 5)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Bank A
SA0 0000000000 4 000000h–000FFFh
SA1 0000000001 4 001000h–001FFFh
SA2 0000000010 4 002000h–002FFFh
SA3 0000000011 4 003000h–003FFFh
SA4 0000000100 4 004000h–004FFFh
SA5 0000000101 4 005000h–005FFFh
SA6 0000000110 4 006000h–006FFFh
SA7 0000000111 4 007000h–007FFFh
SA8 0000001XXX 32 008000h–00FFFFh
SA9 0000010XXX 32 010000h–017FFFh
SA10 0000011XXX 32 018000h–01FFFFh
SA11 0000100XXX 32 020000h–027FFFh
SA12 0000101XXX 32 028000h–02FFFFh
SA13 0000110XXX 32 030000h–037FFFh
SA14 0000111XXX 32 038000h–03FFFFh
SA15 0001000XXX 32 040000h–047FFFh
SA16 0001001XXX 32 048000h–04FFFFh
SA17 0001010XXX 32 050000h–057FFFh
SA18 0001011XXX 32 058000h–05FFFFh
SA19 0001100XXX 32 060000h–067FFFh
SA20 0001101XXX 32 068000h–06FFFFh
SA21 0001110XXX 32 070000h–077FFFh
SA22 0001111XXX 32 078000h–07FFFFh
Bank B
SA23 0010000XXX 32 080000h–087FFFh
SA24 0010001XXX 32 088000h–08FFFFh
SA25 0010010XXX 32 090000h–097FFFh
SA26 0010011XXX 32 098000h–09FFFFh
SA27 0010100XXX 32 0A0000h–0A7FFFh
SA28 0010101XXX 32 0A8000h–0AFFFFh
SA29 0010110XXX 32 0B0000h–0B7FFFh
SA30 0010111XXX 32 0B8000h–0BFFFFh
SA31 0011000XXX 32 0C0000h–0C7FFFh
SA32 0011001XXX 32 0C8000h–0CFFFFh
SA33 0011010XXX 32 0D0000h–0D7FFFh
SA34 0011011XXX 32 0D8000h–0DFFFFh
SA35 0011100XXX 32 0E0000h–0E7FFFh
SA36 0011101XXX 32 0E8000h–0EFFFFh
Document Number: 002-00615 Rev. *A Page 31 of 103
S29PL-J
Bank B
SA37 0011110XXX 32 0F0000h–0F7FFFh
SA38 0011111XXX 32 0F8000h–0FFFFFh
SA39 0100000XXX 32 100000h–107FFFh
SA40 0100001XXX 32 108000h–10FFFFh
SA41 0100010XXX 32 110000h–117FFFh
SA42 0100011XXX 32 118000h–11FFFFh
SA43 0100100XXX 32 120000h–127FFFh
SA44 0100101XXX 32 128000h–12FFFFh
SA45 0100110XXX 32 130000h–137FFFh
SA46 0100111XXX 32 138000h–13FFFFh
SA47 0101000XXX 32 140000h–147FFFh
SA48 0101001XXX 32 148000h–14FFFFh
SA49 0101010XXX 32 150000h–157FFFh
SA50 0101011XXX 32 158000h–15FFFFh
SA51 0101100XXX 32 160000h–167FFFh
SA52 0101101XXX 32 168000h–16FFFFh
SA53 0101110XXX 32 170000h–177FFFh
SA54 0101111XXX 32 178000h–17FFFFh
SA55 0110000XXX 32 180000h–187FFFh
SA56 0110001XXX 32 188000h–18FFFFh
SA57 0110010XXX 32 190000h–197FFFh
SA58 0110011XXX 32 198000h–19FFFFh
SA59 0110100XXX 32 1A0000h–1A7FFFh
SA60 0110101XXX 32 1A8000h–1AFFFFh
SA61 0110110XXX 32 1B0000h–1B7FFFh
SA62 0110111XXX 32 1B8000h–1BFFFFh
SA63 0111000XXX 32 1C0000h–1C7FFFh
SA64 0111001XXX 32 1C8000h–1CFFFFh
SA65 0111010XXX 32 1D0000h–1D7FFFh
SA66 0111011XXX 32 1D8000h–1DFFFFh
SA67 0111100XXX 32 1E0000h–1E7FFFh
SA68 0111101XXX 32 1E8000h–1EFFFFh
SA69 0111110XXX 32 1F0000h–1F7FFFh
SA70 0111111XXX 32 1F8000h–1FFFFFh
Table 11.6 PL064J Sector Architecture (Sheet 2 of 5)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 32 of 103
S29PL-J
Bank C
SA71 1000000XXX 32 200000h–207FFFh
SA72 1000001XXX 32 208000h–20FFFFh
SA73 1000010XXX 32 210000h–217FFFh
SA74 1000011XXX 32 218000h–21FFFFh
SA75 1000100XXX 32 220000h–227FFFh
SA76 1000101XXX 32 228000h–22FFFFh
SA77 1000110XXX 32 230000h–237FFFh
SA78 1000111XXX 32 238000h–23FFFFh
SA79 1001000XXX 32 240000h–247FFFh
SA80 1001001XXX 32 248000h–24FFFFh
SA81 1001010XXX 32 250000h–257FFFh
SA82 1001011XXX 32 258000h–25FFFFh
SA83 1001100XXX 32 260000h–267FFFh
SA84 1001101XXX 32 268000h–26FFFFh
SA85 1001110XXX 32 270000h–277FFFh
Table 11.6 PL064J Sector Architecture (Sheet 3 of 5)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 33 of 103
S29PL-J
Bank C
SA86 1001111XXX 32 278000h–27FFFFh
SA87 1010000XXX 32 280000h–287FFFh
SA88 1010001XXX 32 288000h–28FFFFh
SA89 1010010XXX 32 290000h–297FFFh
SA90 1010011XXX 32 298000h–29FFFFh
SA91 1010100XXX 32 2A0000h–2A7FFFh
SA92 1010101XXX 32 2A8000h–2AFFFFh
SA93 1010110XXX 32 2B0000h–2B7FFFh
SA94 1010111XXX 32 2B8000h–2BFFFFh
SA95 1011000XXX 32 2C0000h–2C7FFFh
SA96 1011001XXX 32 2C8000h–2CFFFFh
SA97 1011010XXX 32 2D0000h–2D7FFFh
SA98 1011011XXX 32 2D8000h–2DFFFFh
SA99 1011100XXX 32 2E0000h–2E7FFFh
SA100 1011101XXX 32 2E8000h–2EFFFFh
SA101 1011110XXX 32 2F0000h–2F7FFFh
SA102 1011111XXX 32 2F8000h–2FFFFFh
SA103 1100000XXX 32 300000h–307FFFh
SA104 1100001XXX 32 308000h–30FFFFh
SA105 1100010XXX 32 310000h–317FFFh
SA106 1100011XXX 32 318000h–31FFFFh
SA107 1100100XXX 32 320000h–327FFFh
SA108 1100101XXX 32 328000h–32FFFFh
SA109 1100110XXX 32 330000h–337FFFh
SA110 1100111XXX 32 338000h–33FFFFh
SA111 1101000XXX 32 340000h–347FFFh
SA112 1101001XXX 32 348000h–34FFFFh
SA113 1101010XXX 32 350000h–357FFFh
SA114 1101011XXX 32 358000h–35FFFFh
SA115 1101100XXX 32 360000h–367FFFh
SA116 1101101XXX 32 368000h–36FFFFh
SA117 1101110XXX 32 370000h–377FFFh
SA118 1101111XXX 32 378000h–37FFFFh
Table 11.6 PL064J Sector Architecture (Sheet 4 of 5)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 34 of 103
S29PL-J
Bank D
SA119 1110000XXX 32 380000h–387FFFh
SA120 1110001XXX 32 388000h–38FFFFh
SA121 1110010XXX 32 390000h–397FFFh
SA122 1110011XXX 32 398000h–39FFFFh
SA123 1110100XXX 32 3A0000h–3A7FFFh
SA124 1110101XXX 32 3A8000h–3AFFFFh
SA125 1110110XXX 32 3B0000h–3B7FFFh
SA126 1110111XXX 32 3B8000h–3BFFFFh
SA127 1111000XXX 32 3C0000h–3C7FFFh
SA128 1111001XXX 32 3C8000h–3CFFFFh
SA129 1111010XXX 32 3D0000h–3D7FFFh
SA130 1111011XXX 32 3D8000h–3DFFFFh
SA131 1111100XXX 32 3E0000h–3E7FFFh
SA132 1111101XXX 32 3E8000h–3EFFFFh
SA133 1111110XXX 32 3F0000h–3F7FFFh
SA134 1111111000 4 3F8000h–3F8FFFh
Bank D
SA135 1111111001 4 3F9000h–3F9FFFh
SA136 1111111010 4 3FA000h–3FAFFFh
SA137 1111111011 4 3FB000h–3FBFFFh
SA138 1111111100 4 3FC000h–3FCFFFh
SA139 1111111101 4 3FD000h–3FDFFFh
SA140 1111111110 4 3FE000h–3FEFFFh
SA141 1111111111 4 3FF000h–3FFFFFh
Table 11.7 PL032J Sector Architecture (Sheet 1 of 3)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Bank A
SA0 000000000 4 000000h–000FFFh
SA1 000000001 4 001000h–001FFFh
SA2 000000010 4 002000h–002FFFh
SA3 000000011 4 003000h–003FFFh
SA4 000000100 4 004000h–004FFFh
SA5 000000101 4 005000h–005FFFh
SA6 000000110 4 006000h–006FFFh
SA7 000000111 4 007000h–007FFFh
SA8 000001XXX 32 008000h–00FFFFh
SA9 000010XXX 32 010000h–017FFFh
SA10 000011XXX 32 018000h–01FFFFh
SA11 000100XXX 32 020000h–027FFFh
SA12 000101XXX 32 028000h–02FFFFh
SA13 000110XXX 32 030000h–037FFFh
SA14 000111XXX 32 038000h–03FFFFh
Table 11.6 PL064J Sector Architecture (Sheet 5 of 5)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 35 of 103
S29PL-J
Bank B
SA15 001000XXX 32 040000h–047FFFh
SA16 001001XXX 32 048000h–04FFFFh
SA17 001010XXX 32 050000h–057FFFh
SA18 001011XXX 32 058000h–05FFFFh
SA19 001100XXX 32 060000h–067FFFh
SA20 001101XXX 32 068000h–06FFFFh
SA21 001110XXX 32 070000h–077FFFh
SA22 001111XXX 32 078000h–07FFFFh
SA23 010000XXX 32 080000h–087FFFh
SA24 010001XXX 32 088000h–08FFFFh
SA25 010010XXX 32 090000h–097FFFh
SA26 010011XXX 32 098000h–09FFFFh
SA27 010100XXX 32 0A0000h–0A7FFFh
SA28 010101XXX 32 0A8000h–0AFFFFh
SA29 010110XXX 32 0B0000h–0B7FFFh
SA30 010111XXX 32 0B8000h–0BFFFFh
SA31 011000XXX 32 0C0000h–0C7FFFh
SA32 011001XXX 32 0C8000h–0CFFFFh
SA33 011010XXX 32 0D0000h–0D7FFFh
SA34 011011XXX 32 0D8000h–0DFFFFh
SA35 011100XXX 32 0E0000h–0E7FFFh
SA36 011101XXX 32 0E8000h–0EFFFFh
SA37 011110XXX 32 0F0000h–0F7FFFh
Bank B SA38 011111XXX 32 0F8000h–0FFFFFh
Table 11.7 PL032J Sector Architecture (Sheet 2 of 3)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 36 of 103
S29PL-J
Bank C
SA39 100000XXX 32 100000h–107FFFh
SA40 100001XXX 32 108000h–10FFFFh
SA41 100010XXX 32 110000h–117FFFh
SA42 100011XXX 32 118000h–11FFFFh
SA43 100100XXX 32 120000h–127FFFh
SA44 100101XXX 32 128000h–12FFFFh
SA45 100110XXX 32 130000h–137FFFh
SA46 100111XXX 32 138000h–13FFFFh
SA47 101000XXX 32 140000h–147FFFh
SA48 101001XXX 32 148000h–14FFFFh
SA49 101010XXX 32 150000h–157FFFh
SA50 101011XXX 32 158000h–15FFFFh
SA51 101100XXX 32 160000h–167FFFh
SA52 101101XXX 32 168000h–16FFFFh
SA53 101110XXX 32 170000h–177FFFh
SA54 101111XXX 32 178000h–17FFFFh
SA55 110000XXX 32 180000h–187FFFh
SA56 110001XXX 32 188000h–18FFFFh
SA57 110010XXX 32 190000h–197FFFh
SA58 110011XXX 32 198000h–19FFFFh
SA59 110100XXX 32 1A0000h–1A7FFFh
SA60 110101XXX 32 1A8000h–1AFFFFh
SA61 110110XXX 32 1B0000h–1B7FFFh
SA62 110111XXX 32 1B8000h–1BFFFFh
Bank D
SA63 111000XXX 32 1C0000h–1C7FFFh
SA64 111001XXX 32 1C8000h–1CFFFFh
SA65 111010XXX 32 1D0000h–1D7FFFh
SA66 111011XXX 32 1D8000h–1DFFFFh
SA67 111100XXX 32 1E0000h–1E7FFFh
SA68 111101XXX 32 1E8000h–1EFFFFh
SA69 111110XXX 32 1F0000h–1F7FFFh
SA70 111111000 4 1F8000h–1F8FFFh
SA71 111111001 4 1F9000h–1F9FFFh
SA72 111111010 4 1FA000h–1FAFFFh
SA73 111111011 4 1FB000h–1FBFFFh
SA74 111111100 4 1FC000h–1FCFFFh
SA75 111111101 4 1FD000h–1FDFFFh
SA76 111111110 4 1FE000h–1FEFFFh
SA77 111111111 4 1FF000h–1FFFFFh
Table 11.7 PL032J Sector Architecture (Sheet 3 of 3)
Bank Sector Sector Address (A22-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 37 of 103
S29PL-J
Table 11.8 S29PL129J Secto r Architecture (Sheet 1 of 8)
Bank Sector CE1# CE2# Sector Address (A21-A12) Sector Size (Kwords) Address Range (x16)
Bank 1A
SA1-0 0 1 0000000000 4 000000h–000FFFh
SA1-1 0 1 0000000001 4 001000h–001FFFh
SA1-2 0 1 0000000010 4 002000h–002FFFh
SA1-3 0 1 0000000011 4 003000h–003FFFh
SA1-4 0 1 0000000100 4 004000h–004FFFh
SA1-5 0 1 0000000101 4 005000h–005FFFh
SA1-6 0 1 0000000110 4 006000h–006FFFh
SA1-7 0 1 0000000111 4 007000h–007FFFh
SA1-8 0 1 0000001XXX 32 008000h–00FFFFh
SA1-9 0 1 0000010XXX 32 010000h–017FFFh
SA1-10 0 1 0000011XXX 32 018000h–01FFFFh
SA1-11 0 1 0000100XXX 32 020000h–027FFFh
SA1-12 0 1 0000101XXX 32 028000h–02FFFFh
SA1-13 0 1 0000110XXX 32 030000h–037FFFh
SA1-14 0 1 0000111XXX 32 038000h–03FFFFh
SA1-15 0 1 0001000XXX 32 040000h–047FFFh
SA1-16 0 1 0001001XXX 32 048000h–04FFFFh
SA1-17 0 1 0001010XXX 32 050000h–057FFFh
SA1-18 0 1 0001011XXX 32 058000h–05FFFFh
SA1-19 0 1 0001100XXX 32 060000h–067FFFh
SA1-20 0 1 0001101XXX 32 068000h–06FFFFh
SA1-21 0 1 0001110XXX 32 070000h–077FFFh
SA1-22 0 1 0001111XXX 32 078000h–07FFFFh
SA1-23 0 1 0010000XXX 32 080000h–087FFFh
SA1-24 0 1 0010001XXX 32 088000h–08FFFFh
SA1-25 0 1 0010010XXX 32 090000h–097FFFh
SA1-26 0 1 0010011XXX 32 098000h–09FFFFh
SA1-27 0 1 0010100XXX 32 0A0000h–0A7FFFh
SA1-28 0 1 0010101XXX 32 0A8000h–0AFFFFh
SA1-29 0 1 0010110XXX 32 0B0000h–0B7FFFh
SA1-30 0 1 0010111XXX 32 0B8000h–0BFFFFh
SA1-31 0 1 0011000XXX 32 0C0000h–0C7FFFh
SA1-32 0 1 0011001XXX 32 0C8000h–0CFFFFh
SA1-33 0 1 0011010XXX 32 0D0000h–0D7FFFh
SA1-34 0 1 0011011XXX 32 0D8000h–0DFFFFh
SA1-35 0 1 0011100XXX 32 0E0000h–0E7FFFh
SA1-36 0 1 0011101XXX 32 0E8000h–0EFFFFh
SA1-37 0 1 0011110XXX 32 0F0000h–0F7FFFh
SA1-38 0 1 0011111XXX 32 0F8000h–0FFFFFh
Document Number: 002-00615 Rev. *A Page 38 of 103
S29PL-J
Bank 1B
SA1-39 0 1 0100000XXX 32 100000h–107FFFh
SA1-40 0 1 0100001XXX 32 108000h–10FFFFh
SA1-41 0 1 0100010XXX 32 110000h–117FFFh
SA1-42 0 1 0100011XXX 32 118000h–11FFFFh
SA1-43 0 1 0100100XXX 32 120000h–127FFFh
SA1-44 0 1 0100101XXX 32 128000h–12FFFFh
SA1-45 0 1 0100110XXX 32 130000h–137FFFh
SA1-46 0 1 0100111XXX 32 138000h–13FFFFh
SA1-47 0 1 0101000XXX 32 140000h–147FFFh
Table 11.8 S29PL129J Secto r Architecture (Sheet 2 of 8)
Bank Sector CE1# CE2# Sector Address (A21-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 39 of 103
S29PL-J
Bank 1B
SA1-48 0 1 0101001XXX 32 148000h–14FFFFh
SA1-49 0 1 0101010XXX 32 150000h–157FFFh
SA1-50 0 1 0101011XXX 32 158000h–15FFFFh
SA1-51 0 1 0101100XXX 32 160000h–167FFFh
SA1-52 0 1 0101101XXX 32 168000h–16FFFFh
SA1-53 0 1 0101110XXX 32 170000h–177FFFh
SA1-54 0 1 0101111XXX 32 178000h–17FFFFh
SA1-55 0 1 0110000XXX 32 180000h–187FFFh
SA1-56 0 1 0110001XXX 32 188000h–18FFFFh
SA1-57 0 1 0110010XXX 32 190000h–197FFFh
SA1-58 0 1 0110011XXX 32 198000h–19FFFFh
SA1-59 0 1 0110100XXX 32 1A0000h–1A7FFFh
SA1-60 0 1 0110101XXX 32 1A8000h–1AFFFFh
SA1-61 0 1 0110110XXX 32 1B0000h–1B7FFFh
SA1-62 0 1 0110111XXX 32 1B8000h–1BFFFFh
SA1-63 0 1 0111000XXX 32 1C0000h–1C7FFFh
SA1-64 0 1 0111001XXX 32 1C8000h–1CFFFFh
SA1-65 0 1 0111010XXX 32 1D0000h–1D7FFFh
SA1-66 0 1 0111011XXX 32 1D8000h–1DFFFFh
SA1-67 0 1 0111100XXX 32 1E0000h–1E7FFFh
SA1-68 0 1 0111101XXX 32 1E8000h–1EFFFFh
SA1-69 0 1 0111110XXX 32 1F0000h–1F7FFFh
SA1-70 0 1 0111111XXX 32 1F8000h–1FFFFFh
SA1-71 0 1 1000000XXX 32 200000h–207FFFh
SA1-72 0 1 1000001XXX 32 208000h–20FFFFh
SA1-73 0 1 1000010XXX 32 210000h–217FFFh
SA1-74 0 1 1000011XXX 32 218000h–21FFFFh
SA1-75 0 1 1000100XXX 32 220000h–227FFFh
SA1-76 0 1 1000101XXX 32 228000h–22FFFFh
SA1-77 0 1 1000110XXX 32 230000h–237FFFh
SA1-78 0 1 1000111XXX 32 238000h–23FFFFh
SA1-79 0 1 1001000XXX 32 240000h–247FFFh
SA1-80 0 1 1001001XXX 32 248000h–24FFFFh
SA1-81 0 1 1001010XXX 32 250000h–257FFFh
SA1-82 0 1 1001011XXX 32 258000h–25FFFFh
SA1-83 0 1 1001100XXX 32 260000h–267FFFh
SA1-84 0 1 1001101XXX 32 268000h–26FFFFh
SA1-85 0 1 1001110XXX 32 270000h–277FFFh
SA1-86 0 1 1001111XXX 32 278000h–27FFFFh
SA1-87 0 1 1010000XXX 32 280000h–287FFFh
SA1-88 0 1 1010001XXX 32 288000h–28FFFFh
SA1-89 0 1 1010010XXX 32 290000h–297FFFh
SA1-90 0 1 1010011XXX 32 298000h–29FFFFh
SA1-91 0 1 1010100XXX 32 2A0000h–2A7FFFh
SA1-92 0 1 1010101XXX 32 2A8000h–2AFFFFh
SA1-93 0 1 1010110XXX 32 2B0000h–2B7FFFh
SA1-94 0 1 1010111XXX 32 2B8000h–2BFFFFh
Table 11.8 S29PL129J Secto r Architecture (Sheet 3 of 8)
Bank Sector CE1# CE2# Sector Address (A21-A12) Sector Size (Kwords) Address Range (x16)
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Bank 1B
SA1-97 0 1 1011010XXX 32 2D0000h–2D7FFFh
SA1-98 0 1 1011011XXX 32 2D8000h–2DFFFFh
SA1-99 0 1 1011100XXX 32 2E0000h–2E7FFFh
SA1-100 0 1 1011101XXX 32 2E8000h–2EFFFFh
SA1-101 0 1 1011110XXX 32 2F0000h–2F7FFFh
SA1-102 0 1 1011111XXX 32 2F8000h–2FFFFFh
SA1-103 0 1 1100000XXX 32 300000h–307FFFh
SA1-104 0 1 1100001XXX 32 308000h–30FFFFh
SA1-105 0 1 1100010XXX 32 310000h–317FFFh
SA1-106 0 1 1100011XXX 32 318000h–31FFFFh
SA1-107 0 1 1100100XXX 32 320000h–327FFFh
SA1-108 0 1 1100101XXX 32 328000h–32FFFFh
SA1-109 0 1 1100110XXX 32 330000h–337FFFh
SA1-110 0 1 1100111XXX 32 338000h–33FFFFh
SA1-111 0 1 1101000XXX 32 340000h–347FFFh
SA1-112 0 1 1101001XXX 32 348000h–34FFFFh
SA1-113 0 1 1101010XXX 32 350000h–357FFFh
SA1-114 0 1 1101011XXX 32 358000h–35FFFFh
SA1-115 0 1 1101100XXX 32 360000h–367FFFh
SA1-116 0 1 1101101XXX 32 368000h–36FFFFh
SA1-117 0 1 1101110XXX 32 370000h–377FFFh
SA1-118 0 1 1101111XXX 32 378000h–37FFFFh
SA1-119 0 1 1110000XXX 32 380000h–387FFFh
SA1-120 0 1 1110001XXX 32 388000h–38FFFFh
SA1-121 0 1 1110010XXX 32 390000h–397FFFh
SA1-122 0 1 1110011XXX 32 398000h–39FFFFh
SA1-123 0 1 1110100XXX 32 3A0000h–3A7FFFh
SA1-124 0 1 1110101XXX 32 3A8000h–3AFFFFh
SA1-125 0 1 1110110XXX 32 3B0000h–3B7FFFh
SA1-126 0 1 1110111XXX 32 3B8000h–3BFFFFh
SA1-127 0 1 1111000XXX 32 3C0000h–3C7FFFh
SA1-128 0 1 1111001XXX 32 3C8000h–3CFFFFh
SA1-129 0 1 1111010XXX 32 3D0000h–3D7FFFh
SA1-130 0 1 1111011XXX 32 3D8000h–3DFFFFh
SA1-131 0 1 1111100XXX 32 3E0000h–3E7FFFh
SA1-132 0 1 1111101XXX 32 3E8000h–3EFFFFh
SA1-133 0 1 1111110XXX 32 3F0000h–3F7FFFh
SA1-134 0 1 1111111XXX 32 3F8000h–3FFFFFh
Table 11.8 S29PL129J Secto r Architecture (Sheet 4 of 8)
Bank Sector CE1# CE2# Sector Address (A21-A12) Sector Size (Kwords) Address Range (x16)
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Bank 2A
SA2-0 1 0 0000000XXX 32 000000h–007FFFh
SA2-1 1 0 0000001XXX 32 008000h–00FFFFh
SA2-2 1 0 0000010XXX 32 010000h–017FFFh
SA2-3 1 0 0000011XXX 32 018000h–01FFFFh
SA2-4 1 0 0000100XXX 32 020000h–027FFFh
SA2-5 1 0 0000101XXX 32 028000h–02FFFFh
SA2-6 1 0 0000110XXX 32 030000h–037FFFh
SA2-7 1 0 0000111XXX 32 038000h–03FFFFh
SA2-8 1 0 0001000XXX 32 040000h–047FFFh
SA2-9 1 0 0001001XXX 32 048000h–04FFFFh
SA2-10 1 0 0001010XXX 32 050000h–057FFFh
Table 11.8 S29PL129J Secto r Architecture (Sheet 5 of 8)
Bank Sector CE1# CE2# Sector Address (A21-A12) Sector Size (Kwords) Address Range (x16)
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Bank 2A
SA2-11 1 0 0001011XXX 32 058000h–05FFFFh
SA2-12 1 0 0001100XXX 32 060000h–067FFFh
SA2-13 1 0 0001101XXX 32 068000h–06FFFFh
SA2-14 1 0 0001110XXX 32 070000h–077FFFh
SA2-15 1 0 0001111XXX 32 078000h–07FFFFh
SA2-16 1 0 0010000XXX 32 080000h–087FFFh
SA2-17 1 0 0010001XXX 32 088000h–08FFFFh
SA2-18 1 0 0010010XXX 32 090000h–097FFFh
SA2-19 1 0 0010011XXX 32 098000h–09FFFFh
SA2-20 1 0 0010100XXX 32 0A0000h–0A7FFFh
SA2-21 1 0 0010101XXX 32 0A8000h–0AFFFFh
SA2-22 1 0 0010110XXX 32 0B0000h–0B7FFFh
SA2-23 1 0 0010111XXX 32 0B8000h–0BFFFFh
SA2-24 1 0 0011000XXX 32 0C0000h–0C7FFFh
SA2-25 1 0 0011001XXX 32 0C8000h–0CFFFFh
SA2-26 1 0 0011010XXX 32 0D0000h–0D7FFFh
SA2-27 1 0 0011011XXX 32 0D8000h–0DFFFFh
SA2-28 1 0 0011100XXX 32 0E0000h–0E7FFFh
SA2-29 1 0 0011101XXX 32 0E8000h–0EFFFFh
SA2-30 1 0 0011110XXX 32 0F0000h–0F7FFFh
SA2-31 1 0 0011111XXX 32 0F8000h–0FFFFFh
SA2-32 1 0 0100000XXX 32 100000h–107FFFh
SA2-33 1 0 0100001XXX 32 108000h–10FFFFh
SA2-34 1 0 0100010XXX 32 110000h–117FFFh
SA2-35 1 0 0100011XXX 32 118000h–11FFFFh
SA2-36 1 0 0100100XXX 32 120000h–127FFFh
SA2-37 1 0 0100101XXX 32 128000h–12FFFFh
SA2-38 1 0 0100110XXX 32 130000h–137FFFh
SA2-39 1 0 0100111XXX 32 138000h–13FFFFh
SA2-40 1 0 0101000XXX 32 140000h–147FFFh
SA2-41 1 0 0101001XXX 32 148000h–14FFFFh
SA2-42 1 0 0101010XXX 32 150000h–157FFFh
SA2-43 1 0 0101011XXX 32 158000h–15FFFFh
SA2-44 1 0 0101100XXX 32 160000h–167FFFh
SA2-45 1 0 0101101XXX 32 168000h–16FFFFh
SA2-46 1 0 0101110XXX 32 170000h–177FFFh
SA2-47 1 0 0101111XXX 32 178000h–17FFFFh
SA2-48 1 0 0110000XXX 32 180000h–187FFFh
SA2-49 1 0 0110001XXX 32 188000h–18FFFFh
SA2-50 1 0 0110010XXX 32 190000h–197FFFh
SA2-51 1 0 0110011XXX 32 198000h–19FFFFh
SA2-52 1 0 0110100XXX 32 1A0000h–1A7FFFh
SA2-53 1 0 0110101XXX 32 1A8000h–1AFFFFh
SA2-54 1 0 0110110XXX 32 1B0000h–1B7FFFh
SA2-55 1 0 0110111XXX 32 1B8000h–1BFFFFh
SA2-56 1 0 0111000XXX 32 1C0000h–1C7FFFh
SA2-57 1 0 0111001XXX 32 1C8000h–1CFFFFh
Table 11.8 S29PL129J Secto r Architecture (Sheet 6 of 8)
Bank Sector CE1# CE2# Sector Address (A21-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 43 of 103
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Bank 2A
SA2-60 1 0 0111100XXX 32 1E0000h–1E7FFFh
SA2-61 1 0 0111101XXX 32 1E8000h–1EFFFFh
SA2-62 1 0 0111110XXX 32 1F0000h–1F7FFFh
SA2-63 1 0 0111111XXX 32 1F8000h–1FFFFFh
SA2-64 1 0 1000000XXX 32 200000h–207FFFh
SA2-65 1 0 1000001XXX 32 208000h–20FFFFh
SA2-66 1 0 1000010XXX 32 210000h–217FFFh
SA2-67 1 0 1000011XXX 32 218000h–21FFFFh
SA2-68 1 0 1000100XXX 32 220000h–227FFFh
SA2-69 1 0 1000101XXX 32 228000h–22FFFFh
SA2-70 1 0 1000110XXX 32 230000h–237FFFh
SA2-71 1 0 1000111XXX 32 238000h–23FFFFh
SA2-72 1 0 1001000XXX 32 240000h–247FFFh
SA2-73 1 0 1001001XXX 32 248000h–24FFFFh
SA2-74 1 0 1001010XXX 32 250000h–257FFFh
SA2-75 1 0 1001011XXX 32 258000h–25FFFFh
SA2-76 1 0 1001100XXX 32 260000h–267FFFh
SA2-77 1 0 1001101XXX 32 268000h–26FFFFh
SA2-78 1 0 1001110XXX 32 270000h–277FFFh
SA2-79 1 0 1001111XXX 32 278000h–27FFFFh
SA2-80 1 0 1010000XXX 32 280000h–287FFFh
SA2-81 1 0 1010001XXX 32 288000h–28FFFFh
SA2-82 1 0 1010010XXX 32 290000h–297FFFh
SA2-83 1 0 1010011XXX 32 298000h–29FFFFh
SA2-84 1 0 1010100XXX 32 2A0000h–2A7FFFh
SA2-85 1 0 1010101XXX 32 2A8000h–2AFFFFh
SA2-86 1 0 1010110XXX 32 2B0000h–2B7FFFh
SA2-87 1 0 1010111XXX 32 2B8000h–2BFFFFh
SA2-88 1 0 1011000XXX 32 2C0000h–2C7FFFh
SA2-89 1 0 1011001XXX 32 2C8000h–2CFFFFh
SA2-90 1 0 1011010XXX 32 2D0000h–2D7FFFh
SA2-91 1 0 1011011XXX 32 2D8000h–2DFFFFh
SA2-92 1 0 1011100XXX 32 2E0000h–2E7FFFh
SA2-93 1 0 1011101XXX 32 2E8000h–2EFFFFh
SA2-94 1 0 1011110XXX 32 2F0000h–2F7FFFh
SA2-95 1 0 1011111XXX 32 2F8000h–2FFFFFh
Table 11.8 S29PL129J Secto r Architecture (Sheet 7 of 8)
Bank Sector CE1# CE2# Sector Address (A21-A12) Sector Size (Kwords) Address Range (x16)
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Bank 2B
SA2-96 1 0 1100000XXX 32 300000h–307FFFh
SA2-97 1 0 1100001XXX 32 308000h–30FFFFh
SA2-98 1 0 1100010XXX 32 310000h–317FFFh
SA2-99 1 0 1100011XXX 32 318000h–31FFFFh
SA2-100 1 0 1100100XXX 32 320000h–327FFFh
SA2-101 1 0 1100101XXX 32 328000h–32FFFFh
SA2-102 1 0 1100110XXX 32 330000h–337FFFh
SA2-103 1 0 1100111XXX 32 338000h–33FFFFh
SA2-104 1 0 1101000XXX 32 340000h–347FFFh
SA2-105 1 0 1101001XXX 32 348000h–34FFFFh
SA2-106 1 0 1101010XXX 32 350000h–357FFFh
SA2-107 1 0 1101011XXX 32 358000h–35FFFFh
SA2-108 1 0 1101100XXX 32 360000h–367FFFh
Bank 2B
SA2-109 1 0 1101101XXX 32 368000h–36FFFFh
SA2-110 1 0 1101110XXX 32 370000h–377FFFh
SA2-111 1 0 1101111XXX 32 378000h–37FFFFh
SA2-112 1 0 1110000XXX 32 380000h–387FFFh
SA2-113 1 0 1110001XXX 32 388000h–38FFFFh
SA2-114 1 0 1110010XXX 32 390000h–397FFFh
SA2-115 1 0 1110011XXX 32 398000h–39FFFFh
SA2-116 1 0 1110100XXX 32 3A0000h–3A7FFFh
SA2-117 1 0 1110101XXX 32 3A8000h–3AFFFFh
SA2-118 1 0 1110110XXX 32 3B0000h–3B7FFFh
SA2-119 1 0 1110111XXX 32 3B8000h–3BFFFFh
SA2-120 1 0 1111000XXX 32 3C0000h–3C7FFFh
SA2-121 1 0 1111001XXX 32 3C8000h–3CFFFFh
SA2-122 1 0 1111010XXX 32 3D0000h–3D7FFFh
SA2-123 1 0 1111011XXX 32 3D8000h–3DFFFFh
SA2-124 1 0 1111100XXX 32 3E0000h–3E7FFFh
SA2-125 1 0 1111101XXX 32 3E8000h–3EFFFFh
SA2-126 1 0 1111110XXX 32 3F0000h–3F7FFFh
SA2-127 1 0 1111111000 4 3F8000h–3F8FFFh
SA2-128 1 0 1111111001 4 3F9000h–3F9FFFh
SA2-129 1 0 1111111010 4 3FA000h–3FAFFFh
SA2-130 1 0 1111111011 4 3FB000h–3FBFFFh
SA2-131 1 0 1111111100 4 3FC000h–3FCFFFh
SA2-132 1 0 1111111101 4 3FD000h–3FDFFFh
SA2-133 1 0 1111111110 4 3FE000h–3FEFFFh
SA2-134 1 0 1111111111 4 3FF000h–3FFFFFh
Table 11.9 Secured Silicon Sector Addresses
Sector Size Address Range
Factory-Locked Area 64 words 000000h-00003Fh
Customer-Lockable Area 64 words 000040h-00007Fh
Table 11.8 S29PL129J Secto r Architecture (Sheet 8 of 8)
Bank Sector CE1# CE2# Sector Address (A21-A12) Sector Size (Kwords) Address Range (x16)
Document Number: 002-00615 Rev. *A Page 45 of 103
S29PL-J
11.8 Autoselect Mode
The autoselect mode provid es manufacturer and device identification, and sector protection verification, through identifier codes
output on DQ7–DQ0. This mode is primarily intende d for programming equipment to automatically match a device to be
programmed with its corresponding programming algorithm. However, th e autosele ct codes can also be accessed in-system
through the command register.
When using programmi ng equipment, the autoselect mode requires VID on address pin A9. Address pins must be as shown in
Table 11.10 on page 45 and Table 11.11 on page 46. In addition, when verifying sector protection, the sector address must appear
on the appropriate highest order address bits (see Table 11.4 on page 19). Table 11.10 and Table 11.11 show the remaining
address bits that are don’t care. When all necessary bits have been set as required, the programming equipment may then read the
corresponding identifier code on DQ7–DQ0. However, the autoselect codes can also be accessed in-system through the command
register, for instances when the device is erased or programmed in a system without access to high voltage on the A9 pin. The
command sequence is illustrated in Table 16.1 on page 69. Note that if a Bank Address (BA) (on address bits PL127J: A22–A20,
PL129J and PL064J: A21–A19, PL032J: A20–A18) is asserted during the third write cycle of the autoselect command, the host
system can read autoselect data that bank and then immediately read array data from the other bank, without exiting the autoselect
mode.
To access the autoselect codes in-system, the host system can issue the autoselect command via the c ommand register, as shown
in Table 16.1 on page 69. This method does not require VID. Refer to the Autoselect Command Sequence on page 63 for more
information.
Legend
L = Logic Low = VIL, H = Logic High = VIH, BA = Bank Address, SA = Sector Address, X = Don’t care.
Note
When Polling the Secured Silicon indicator bit the Bank Address (BA) should be set within the address range 004000h-03FFFFh.
Table 11.10 Autoselect Codes (High Vol tage Method)
Description CE# OE# WE#
Amax
to
A12 A10 A9 A8 A7 A6
A5
to
A4 A3 A2 A1 A0 DQ15
to DQ0
Manufacturer ID:
Spansion products LLH BA X
VI
DX L L X L L L L 0001h
Device ID
Read Cycle 1 L
LH BA X
VI
DXLL L
L L L H 227Eh
Read Cycle 2 L H H H L 2220h (PL127J)
2202h (PL064J)
220Ah (PL032J)
Read Cycle 3 L HHHH
2200h (PL127J)
2201h (PL064J)
2201h (PL032J)
Sector Protection
Verification LLH SA X
VI
DXLL L LLHL
0001h (protected),
0000h (unprotected)
Secured Silicon
Indicator Bit
(DQ7, DQ6) LLH BA
(See Note) XVI
DXXL X LLHH
DQ7=1
(factory locked),
DQ6=1
(factory and
customer locked)
Document Number: 002-00615 Rev. *A Page 46 of 103
S29PL-J
Legend
L = Logic Low = VIL, H = Logic High = VIH, BA = Bank Address, SA = Sector Address, X = Don’t care.
Note
1. When Polling the Secured Silicon indicator bit the A21 to A12 should be set within the address range 004000h- 03FFFFh.
2. The autoselect codes may also be accessed in-system by using the command sequences
Table 11.11 Autoselect Codes for PL129J
Description CE1# CE2# OE# WE#
A21
to
A12 A10 A9 A8 A7 A6
A5
to
A4 A3 A2 A1 A0 DQ15
to DQ0
Manufacturer ID:
Spansion
products
LH
LH X X
VI
DX L L X L L L L 0001h
HL
Device ID
Read
Cycle 1 LH
LH X X
VI
DXLLL
L L L H 227Eh
HL
Read
Cycle 2 LH H H H L 2221h
HL
Read
Cycle 3 LH H H H H 2200h
HL
Sector Protection
Verification
LH
LH SA X
VI
DXLLLLLHL
0001h
(protected),
0000h
(unprotected)
HL
Secured Silicon
Indicator Bit
(DQ7, DQ6)
LH
LH X
(Note 1) XVI
DXXLXLLHH
DQ7=1
(factory locked),
DQ6=1
(factory and
customer locked)
HL
Document Number: 002-00615 Rev. *A Page 47 of 103
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Table 11.12 PL127J Boot Sector/Sector Block Addresses for Protection/Unprotection
Sector A22-A12 Sector/
Sector Block Size Sector A22-A12 Sector/
Sector Block Size
SA0 00000000000 4 Kwords SA131-SA134 011111XXXXX 128 (4x32) Kwords
SA1 00000000001 4 Kwords SA135-SA138 100000XXXXX 128 (4x32) Kwords
SA2 00000000010 4 Kwords SA139-SA142 100001XXXXX 128 (4x32) Kwords
SA3 00000000011 4 Kwords SA143-SA146 100010XXXXX 128 (4x32) Kwords
SA4 00000000100 4 Kwords SA147-SA150 100011XXXXX 128 (4x32) Kwords
SA5 00000000101 4 Kwords SA151-SA154 100100XXXXX 128 (4x32) Kwords
SA6 00000000110 4 Kwords SA155-SA158 100101XXXXX 128 (4x32) Kwords
SA7 00000000111 4 Kwords SA159-SA162 100110XXXXX 128 (4x32) Kwords
SA8 00000001XXX 32 Kwords SA163-SA166 100111XXXXX 128 (4x32) Kwords
SA9 00000010XXX 32 Kwords SA167-SA170 101000XXXXX 128 (4x32) Kwords
SA10 00000011XXX 32 Kwords SA171-SA174 101001XXXXX 128 (4x32) Kwords
SA11-SA14 000001XXXXX 128 (4x32) Kwords SA175-SA178 101010XXXXX 128 (4x32) Kwords
SA15-SA18 000010XXXXX 128 (4x32) Kwords SA179-SA182 101011XXXXX 128 (4x32) Kwords
SA19-SA22 000011XXXX X 128 (4x32) Kwords SA183-SA186 101100XXXXX 128 (4x32) Kwords
SA23-SA26 000100XXXXX 128 (4x32) Kwords SA187-SA190 101101XXXXX 128 (4x32) Kwords
SA27-SA30 000101XXXXX 128 (4x32) Kwords SA191-SA194 101110XXXXX 128 (4x32) Kwords
SA31-SA34 000110XXXX X 128 (4x32) Kwords SA195-SA198 101111XXXXX 128 (4x32) Kwords
SA35-SA38 000111XXXXX 128 (4x32) Kwords SA199-SA202 110000XXXXX 128 (4x32) Kwords
SA39-SA42 001000XXXXX 128 (4x32) Kwords SA203-SA206 110001XXXXX 128 (4x32) Kwords
SA43-SA46 001001XXXXX 128 (4x32) Kwords SA207-SA210 110010XXXXX 128 (4x32) Kwords
SA47-SA50 001010XXXXX 128 (4x32) Kwords SA211-SA214 110011XXXXX 128 (4x32) Kwords
SA51-SA54 001011XXXX X 128 (4x32) Kwords SA215-SA218 110100XXXXX 128 (4x32) Kwords
SA55-SA58 001100XXXX X 128 (4x32) Kwords SA219-SA222 110101XXXXX 128 (4x32) Kwords
SA59-SA62 001101XXXX X 128 (4x32) Kwords SA223-SA226 110110XXXXX 128 (4x32) Kwords
SA63-SA66 001110XXXXX 128 (4x32) Kwords SA227-SA230 110111XXXXX 128 (4x32) Kwords
SA67-SA70 001111XXXXX 128 (4x32) Kwords SA231-SA234 111000XXXXX 128 (4x32) Kwords
SA71-SA74 010000XXXXX 128 (4x32) Kwords SA235-SA238 111001XXXXX 128 (4x32) Kwords
SA75-SA78 010001XXXXX 128 (4x32) Kwords SA239-SA242 111010XXXXX 128 (4x32) Kwords
SA79-SA82 010010XXXXX 128 (4x32) Kwords SA243-SA246 111011XXXXX 128 (4x32) Kwords
SA83-SA86 010011XXXX X 128 (4x32) Kwords SA247-SA250 111100XXXXX 128 (4x32) Kwords
SA87-SA90 010100XXXXX 128 (4x32) Kwords SA251-SA254 111101XXXXX 128 (4x32) Kwords
SA91-SA94 010101XXXXX 128 (4x32) Kwords SA255-SA258 111110XXXXX 128 (4x32) Kwords
SA95-SA98 010110XXXXX 128 (4x32) Kwords SA259 11111100XXX 32 Kwords
SA99-SA102 010111XXXXX 128 (4x32) Kwords SA260 11111101XXX 32 Kwords
SA103-SA106 011000XXXXX 128 (4x32) Kwords SA261 11111110XXX 32 Kwords
SA107-SA110 011001XXXXX 128 (4x32) Kwords SA262 11111111000 4 Kwords
SA111-SA114 011010XXXXX 128 (4x32) Kwords SA263 11111111001 4 Kwords
SA115-SA118 011011XXXXX 128 (4x32) Kwords SA264 11111111010 4 Kwords
SA119-SA122 011100XXXXX 128 (4x32) Kwords SA265 11111111011 4 Kwords
SA123-SA126 011101XXXXX 128 (4x32) Kwords
SA127-SA130 011110XXXXX 128 (4x32) Kwords
Document Number: 002-00615 Rev. *A Page 48 of 103
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Table 11.13 PL129J Boot Sector/Sector Block Addresses for Protection/Unprotection
CE1# Control CE2# Control
Sector Group A21-12 Sector/Sector Block Size Sector Group A21-12 Sector/Sector Bl oc k Size
SA1-0 0000000000 4 Kwords SA2-0–SA2-3 00000XXXXX 128 (4x32) Kwords
SA1-1 0000000001 4 Kwords SA2-4–SA2-7 00001XXXXX 128 (4x32) Kwords
SA1-2 0000000010 4 Kwords SA2-8–SA2-11 00010XXXXX 1 28 (4x32) Kwords
SA1-3 0000000011 4 Kwords SA2-12–SA2-15 00011XXXXX 128 (4x32) Kwords
SA1-4 0000000100 4 Kwords SA2-16–SA2-19 00100XXXXX 128 (4x32) Kwords
SA1-5 0000000101 4 Kwords SA2-20–SA2-23 00101XXXXX 128 (4x32) Kwords
SA1-6 0000000110 4 Kwords SA2-24–SA2-27 00110XXXXX 128 (4x32) Kwords
SA1-7 0000000111 4 Kwords SA2-28–SA2-31 00111XXXXX 128 (4x32) Kwords
SA1-8 0000001XXX 32 Kwords SA2-32–SA2-35 01000XXXXX 128 (4x32) Kwords
SA1-9 0000010XXX 32 Kwords SA2-36–SA2-39 01001XXXXX 128 (4x32) Kwords
SA1-10 0000011XXX 32 Kwords SA2-40–SA2-43 01010XXXXX 128 (4x32) Kwords
SA1-11 - SA1-14 00001XXXXX 128 (4x32) Kwords SA2-44–SA2-47 01011XXXXX 128 (4x32) Kwords
SA1-15 - SA1-18 00010XXXXX 128 (4x32) Kwords SA2-48–SA2-51 01100XXXXX 128 (4x32) Kwords
SA1-19 - SA1-22 00011XXXXX 128 (4x32) Kwords SA2-52–SA2-55 01101XXXXX 128 (4x32) Kwords
SA1-23 - SA1-26 00100XXXXX 128 (4x32) Kwords SA2-56–SA2-59 01110XXXXX 128 (4x32) Kwords
SA1-27 - SA1-30 00101XXXXX 128 (4x32) Kwords SA2-60–SA2-63 01111XXXXX 128 (4x32) Kwords
SA1-31 - SA1-34 00110XXXXX 128 (4x32) Kwords SA2-64–SA2-67 10000XXXXX 128 (4x32) Kwords
SA1-35 - SA1-38 00111XXXXX 128 (4x32) Kwords SA2-68–SA2-71 10001XXXXX 128 (4x32) Kwords
SA1-39 - SA1-42 01000XXXXX 128 (4x32) Kwords SA2-72–SA2-75 10010XXXXX 128 (4x32) Kwords
SA1-43 - SA1-46 01001XXXXX 128 (4x32) Kwords SA2-76–SA2-79 10011XXXXX 128 (4x32) Kwords
SA1-47 - SA1-50 01010XXXXX 128 (4x32) Kwords SA2-80–SA2-83 10100XXXXX 128 (4x32) Kwords
SA1-51 - SA1-54 01011XXXXX 128 (4x32) Kwords SA2-84–SA2-87 10101XXXXX 128 (4x32) Kwords
SA1-55 - SA1-58 01100XXXXX 128 (4x32) Kwords SA2-88–SA2-91 10110XXXXX 128 (4x32) Kwords
SA1-59 - SA1-62 01101XXXXX 128 (4x32) Kwords SA2-92–SA2-95 10111XXXXX 128 (4x32) Kwords
SA1-63 - SA1-66 01110XXXXX 128 (4x32) Kwords SA2-96–SA2-99 11000XXXXX 128 (4x32) Kwords
SA1-67 - SA1-70 01111XXXXX 128 (4x32) Kwords SA2-100–SA2-103 11001XXXXX 128 (4x32) Kwords
SA1-71 - SA1-74 10000XXXXX 128 (4x32) Kwords SA2-104–SA2-107 11010XXXXX 128 (4x32) Kwords
SA1-75 - SA1-78 10001XXXXX 128 (4x32) Kwords SA2-108–SA2-111 11011XXXXX 128 (4x32) Kwords
SA1-79 - SA1-82 10010XXXXX 128 (4x32) Kwords SA2-112–SA2-115 11100XXXXX 128 (4x32) Kwords
SA1-83 - SA1-86 10011XXXXX 128 (4x32) Kwords SA2-116–SA2-119 11101XXXXX 128 (4x32) Kwords
SA1-87 - SA1-90 10100XXXXX 128 (4x32) Kwords SA2-120–SA2-123 11110XXXXX 128 (4x32) Kwords
SA1-91 - SA1-94 10101XXXXX 128 (4x32) Kwords SA2-124 1111100XXX 32 Kwords
SA1-95 - SA1-98 10110XXXXX 128 (4x32) Kwords SA2-125 1111101XXX 32 Kwords
SA1-99 - SA1-102 10111XXXXX 128 (4x32) Kwords SA2-126 1111110XXX 32 Kwords
SA1-103 - SA1-106 11000XXXXX 128 (4x32) Kwords SA2-127 1111111000 4 Kwords
SA1-107 - SA1-110 11001XXXXX 128 (4x32) Kwords SA2-128 1111111001 4 Kwords
SA1-111 - SA1-114 11010XXXXX 128 (4x32) Kwords SA2-129 1111111010 4 Kwords
SA1-115 - SA1-118 11011XXXXX 128 (4x32) Kwords SA2-130 1111111011 4 Kwords
SA1-119 - SA1-122 11100XXXXX 128 (4x32) Kwords SA2-131 1111111100 4 Kwords
SA1-123 - SA1-126 11101XXXXX 128 (4x32) Kwords SA2-132 1111111101 4 Kwords
SA1-127 - SA1-130 11110XXXXX 128 (4x32) Kwords SA2-133 1111 111110 4 Kwords
SA1-131 - SA1-134 11111XXXXX 128 (4x32) Kwords SA2-134 1111111111 4 Kwords
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The device is shipped with all sectors unprotected. Optional Spansion programming services enable programming and pro te ctin g
sectors at the factory prior to shipping th e device. Contact yo ur local sales office for details.
It is possible to determine whether a sector is protected or unprotected. See the Table 11.9, Secured Silicon Sector Addresses
on page 44 for details.
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11.9 Selecting a Sector Protection Mode
Table 11.14 PL064J Boot Sector/Sector Block Addresses for Protection/Unprotection
Sector A21-A12 Sector/Sector Block Size
SA0 0000000000 4 Kwords
SA1 0000000001 4 Kwords
SA2 0000000010 4 Kwords
SA3 0000000011 4 Kwords
SA4 0000000100 4 Kwords
SA5 0000000101 4 Kwords
SA6 0000000110 4 Kwords
SA7 0000000111 4 Kwords
SA8 0000001XXX 32 Kwords
SA9 0000010XXX 32 Kwords
SA10 0000011XXX 32 Kwords
SA11-SA14 00001XXXXX 128 (4x32) Kwords
SA15-SA18 00010XXXXX 128 (4x32) Kwords
SA19-SA22 00011XXXXX 128 (4x32) Kwords
SA23-SA26 00100XXXXX 128 (4x32) Kwords
SA27-SA30 00101XXXXX 128 (4x32) Kwords
SA31-SA34 00110XXXXX 128 (4x32) Kwords
SA35-SA38 00111XXXXX 128 (4x32) Kwords
SA39-SA42 01000XXXXX 128 (4x32) Kwords
SA43-SA46 01001XXXXX 128 (4x32) Kwords
SA47-SA50 01010XXXXX 128 (4x32) Kwords
SA51-SA54 01011XXXXX 128 (4x32) Kwords
SA55-SA58 01100XXXXX 128 (4x32) Kwords
SA59-SA62 01101XXXXX 128 (4x32) Kwords
SA63-SA66 01110XXXXX 128 (4x32) Kwords
SA67-SA70 01111XXXXX 128 (4x32) Kwords
SA71-SA74 10000XXXXX 128 (4x32) Kwords
SA75-SA78 10001XXXXX 128 (4x32) Kwords
SA79-SA82 10010XXXXX 128 (4x32) Kwords
SA83-SA86 10011XXXXX 128 (4x32) Kwords
SA87-SA90 10100XXXXX 128 (4x32) Kwords
SA91-SA94 10101XXXXX 128 (4x32) Kwords
SA95-SA98 10110XXXXX 128 (4x32) Kwords
SA99-SA102 10111XXXXX 128 (4x32) Kwords
SA103-SA106 11000XXXXX 128 (4x32) Kwords
SA107-SA110 11001XXXXX 128 (4x32) Kwords
SA111-SA114 11010XXXXX 128 (4x32) Kwords
SA115-SA118 11011XXXXX 128 (4x32) Kwords
SA119-SA122 11100XXXXX 128 (4x32) Kwords
SA123-SA126 11101XXXXX 128 (4x32) Kwords
SA127-SA130 11110XXXXX 128 (4x32) Kwords
SA131 1111100XXX 32 Kwords
SA132 1111101XXX 32 Kwords
SA133 1111110XXX 32 Kwords
SA134 1111111000 4 Kwords
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12. Sector Protection
The PL127J, PL129J, PL064J, and PL032J features several levels of sector protection, which ca n disable both the program and
erase operations in certain sectors or sector groups:
12.1 Persistent Sector Protection
A command sector protection method that replaces the old 12 V controlled protection method.
12.2 Password Sector Protection
A highly sophisticate d protection method that requires a password before changes to certain sectors or sector groups are permitted
12.3 WP# Hardware Protection
A write protect pin that can prevent program or erase operations in sectors SA1-133, SA1-134, SA2-0 and SA2-1.
The WP# Hardware Protection feature is always available, independent of the software managed protection method chosen.
12.4 Selecting a Sector Protection Mode
All parts default to operate in the Persiste nt Sector Protec tion mode. The customer must then choose if the Persistent or Password
Protection method is most desirable. There are two one-time programmable non-volatile bits that define which sector protection
method will be used. If the Persistent Sector Protection method is desired, programming the Persistent Sector Protection Mode
Locking Bit permanently sets the device to the Persistent Sector Protection mode. If the Password Sector Protection method is
desired, programming the Password Mode Locking Bit permanently sets the device to the Password Sector Protection mode. It is
not possible to switch between the two protection modes once a locking bit has bee n set. One of the two modes must be selecte d
when the device is first programmed. This prevents a program or virus from later setting the Pa ssw ord Mode Locking B it , whi c h
would cause an unexpected shift from the default Persistent Sector Protection Mode into the Password Protection Mode.
The device is shipped with all sectors unprotected. Optional Spansion programming services enable programming and pro te ctin g
sectors at the factory prior to shipping th e device. Contact yo ur local sales office for details.
It is possible to determine whether a sector is protected or unprotected. See Autoselect Mode on page 45 for details.
SA135 1111111001 4 Kwords
SA136 1111111010 4 Kwords
SA137 1111111011 4 Kwords
SA138 1111111100 4 Kwords
Table 11.15 Sector Protection Schemes
DYB PPB PPB Lock Sector State
0 0 0 Unprotected—PPB and DYB are changeable
0 0 1 Unprotected—PPB not changea ble, DYB is changeable
010
Protected—PPB and DYB are changeable100
110
011
Protected—PPB not changeable, DYB is changeable101
111
Table 11.14 PL064J Boot Sector/Sector Block Addresses for Protection/Unprotection (Continued)
Sector A21-A12 Sector/Sector Block Size
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13. Persistent Sector Protection
The Persistent Sector Protection method replaces the 12 V controlled protection method in previous flash devices. This new method
provides three different sector protection states:
Persistently Locked—The sector is protected and cannot be changed.
Dynamically Locked—The sector is protected and can be changed by a simple command.
Unlocked—The sector is unprotected and can be changed by a simple command.
To achieve these states, three types of “bits” are used:
Persistent Protection Bit
Persistent Protection Bit Lock
Persistent Sector Protection Mode Locking Bit
13.1 Persistent Protection Bit (PPB)
A single Persistent (non-volatile) Protection Bit is assigned to a maximum four sectors (see the sector address tables for specific
sector protection groupings). All 4 Kword boot-block sectors have individual sector Persistent Protection Bits (PPBs) for greater
flexibility. Each PPB is individually modifiable through the PPB Wri te Command.
The device erases all PPBs in parallel. If any PPB requires erasure, the device must be instructed to preprogram all of the sector
PPBs prior to PPB erasure. Otherwise, a previously erased sector PPBs can potentially be over-erased. The flash device does not
have a built-in means of preventing sector PPBs over-erasure.
13.2 Persistent Protection Bit Lock (PPB Lock)
The Persistent Protection Bit Lock (PPB Lock) is a global volatile bit. When set to “1”, the PPBs cannot be changed. When cleared
(“0”), the PPBs are changeable. There is only one PPB Lock bit per device. The PPB Lock is cleared after power-up or hardware
reset. There is no command sequence to unlock the PPB Lock.
13.3 Dynamic Protection Bit (DYB)
A volatile protection bit is assigned fo r each secto r . After power-up or hardware reset, the contents of all DYBs is “0”. Each DYB is
individually modifiable through the DYB Write Command.
When the parts are first shipped, the PPBs are cleared, the DYBs are cleared, and PPB Lock is defaulted to power up in the cleared
state – meaning the PPBs are changeable.
When the device is first powered on the DYBs power up cleared (sec tors not protected). The Protection State for each sector is
determined by the logical OR of the PPB and the DYB related to that sector. For the sectors that have the PPBs cleared, the DYBs
control whether or not the sector is protected or unprotected. By issuing the DYB Write command sequences, the DYBs will be set or
cleared, thus placing each sector in the protected or unprotected state. These are the so-called Dynamic Locked or Unlocked states.
They are called dynamic states because it is very easy to switch back and forth between the protected and unprotected conditions.
This allows software to easily protect sectors against inadvertent changes yet does not prevent the easy removal of protection when
changes are needed. The DYBs maybe set or cleared as often as needed.
The PPBs allow for a more static, and difficult to change, leve l of protection. The PPBs retain their state across power cycles
because they are non-volatile. Individual PPBs are set with a command but must all be cleared as a group through a complex
sequence of program and erasing commands. The PPBs are also limited to 100 erase cycles.
The PPB Lock bit adds an additional level of protection. Once all PPBs are programmed to the desired settings, the PPB Lock may
be set to “1”. Setting the PPB Lock disable s all program and erase commands to the non-volatile PPBs. In effect, the PPB Lock Bit
locks the PPBs into their current state. The only way to clear the PPB Lock is to go through a power cycle. System boot code can
determine if any changes to the PPB are needed; for example, to allow new system code to be downloaded. If no changes are
needed then the boo t code can set the PPB Lock to disable any further changes to the PPBs during system operation.
The WP#/ACC write protect pin adds a final level of hardware protection to sectors SA1-133, SA1-134, SA2-0 and SA2-1. When this
pin is low it is not possible to change the contents of these sectors. These sectors generally hold system boot code. The WP#/ACC
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pin can prevent any changes to the boot code that could override the choices made while setting up sector protection during system
initialization.
For customers who are concerned about malicious viruses there is another level of security - the persistently locked state. To
persistently protect a given sector or sector group , the PPBs associated with that sector need to be set to “1”. Once all PPBs are
programmed to the desired settings, the PPB Lock should be set to “1”. Setting the PPB Lock automatically disables all program and
erase commands to the Non-Volatile PPBs. In effect, the PPB Lock “freezes” the PPBs into their current state. The only way to clear
the PPB Lock is to go through a power cycle.
It is possible to have sectors that have been persistently locked, and sectors tha t are le ft in the dynamic state . The sectors in the
dynamic state are all unprotected. If there is a need to protect some of them, a simple DYB Write command sequence is all that is
necessary. The DYB write command for the dynamic sectors switch the DYBs to signify protected and unprotected, respectively. If
there is a need to change the status of the persistently locked sectors, a fe w more steps are required. First, the PPB Lock bit must
be disabled by either putting the device through a power-cycle, or hardwa re reset. The PPBs can then be changed to reflect the
desired settings. Setting the PPB lock bit once again will lock the PPBs, and the device operates normally again.
The best protection is achieved by executing the PPB lock bit set command early in the boo t code, and protect the boot code by
holding WP#/ACC = VIL.
Table 11.15 on page 51 contains all possible combinations of the DYB, PPB, and PPB lock relating to the status of the sector.
In summary, if the PPB is set, and the PPB lock is set, the sector is protected and the protection can not be removed until the next
power cycle clears the PPB lock. If the PPB is cleared, the sector can be dynamically locked or unlocked. The DYB then controls
whether or not the sector is protected or unprotected.
If the user attempts to program or erase a protected sector, the device ignores the command and returns to read mode . A program
command to a protected sector enables status polling for approximately 1 µs before the device returns to read mode without having
modified the contents of the protected sector. An er ase command to a protected sector enables status polling for approximately 50
µs after which the device returns to read mode without having erased the pro tected sector.
The programming of the DYB, PPB, and PPB lock for a given sector can be verified by writing a DYB/PPB/PPB lock verify command
to the device. There is an alternative means of reading the protection status. Take RESET# to VIL and hold WE# at VIH. (The high
voltage A9 Autoselect Mode also works for reading the status of the PPBs). Scanning the addresses (A18–A11) while (A6, A1, A0) =
(0, 1, 0) will produce a logical ‘1” code at device output DQ0 for a protected sector or a “0” for an unprotected sector. In this mode,
the other addresses are don’t cares. Address lo cation with A1 = VIL are reserved for au toselect manufacturer and device codes.
13.4 Persistent Sector Protection Mode Locking Bit
Like the password mode locking bit, a Persistent Sector Protection mode locking bit exists to guarantee that the device remain in
software sector protection. Once set, the Persistent Sector Protection locking bit prevents programming of the password protection
mode locking bit. This guarantees that a hacker could not place the device in password protection mode.
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14. Password Protection Mode
The Password Sector Protection Mode method allows an even hig her level of security than the Persistent Sector Protection Mode.
There are two main differences between the Persistent Sector Protection and the Password Sector Protection Mode:
When the device is first powered on, or comes out of a reset cycle, the PPB Lock bit set to the locked state, rather than cleared to
the unlocked state.
The only means to clear the PPB Lock bit is by writing a unique 64-bit Password to the device.
The Password Sector Protection method is otherwise identical to the Persistent Sector Protection method.
A 64-bit password is the only additiona l tool utilized in this method.
Once the Password Mode Locking Bit is set, the password is permanently set with no means to read, program, or erase it. The
password is used to clear the PPB Lock bit. The Password Unlock command must be written to the flash, along with a password.
The flash device internally compares the given password with the pre-programmed password. If they match, the PPB Lock bit is
cleared, and the PPBs can be altered. If they do not match, the flash device does nothing. There is a built-in 2 µs delay for each
“password check.” This delay is intended to thwart any efforts to run a program that tries all possible combinations in order to crack
the password.
14.1 Password and Password Mode Locking Bit
In order to select the Password sector protection scheme, the customer must first program the password. The password may be
correlated to the unique Electronic Serial Number (ESN) of the particular flash device. Each ESN is different for every flash device;
therefore each password should be different for every flash device. While programming in the password region, the customer may
perform Password Verify operations.
Once the desired password is programmed in, the customer must then set the Password Mode Locking Bit. This operation achieves
two objectives:
Permanently sets the device to operate using the Password Protection Mode. It is not possible to reverse this function.
Disables all further commands to the password region. All program, and read operations are ignored.
Both of these objectives are important, and if not carefully considered, may lead to unrecoverable errors. The user must be sure that
the Password Protection method is desired when setting the Password Mode Locking Bit. More importantly, the user must be sure
that the password is correct when the Password Mode Locking Bit is set. Due to the fact that read operations are disabled, there is
no means to verify what the password is afterwards. If the password is lost after setting the Password Mode Locking Bit, there will be
no way to clear the PPB Lock bit.
The Password Mode Locking Bit, once set, prevents reading the 64-bit password on the DQ bus and further password programming.
The Password Mode Locking Bit is not erasable. Once Password Mode Locking Bit is programmed, the Persistent Sector Protection
Locking Bit is disabled from programming, guaranteein g that no changes to the protection scheme are allowed.
14.2 64-bit Password
The 64-bit Password is located in its own memory space and is accessible through the use of the Password Program and Verify
commands (see “Password Verify Command”). The password function works in conjunction with the Password Mode Locking Bit,
which when set, prevents the Password Verify command from reading the contents of the password on the pins of the device.
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14.3 Write Protect (WP#)
The Write Protect feature provides a hardware method of protecting the upper two and lower two sectors without using VID. This
function is provided by the WP # pi n and overrides the previously discussed High Voltage Sector Protection on page 55 method.
If the system asserts VIL on the WP#/ACC pin, the device disables program and erase functions in the two outermost 4 Kword
sectors on both ends of the flash array independent of whether it was previous ly protected or unprotected.
If the system asserts VIH on the WP#/ACC pin, the device reverts the upper two and lower two sectors to whether they were last set
to be protected or unprotected. That is, sector protection or unprotection for these sectors depends on whether they were last
protected or unprotected using the method described in the High Voltage Sector Protection on page 55.
Note that the WP# / AC C pin mu st not be left floating or unconnected; inconsistent behavior of the device may result.
14.3.1 Persistent Protection Bit Lock
The Persistent Protection Bit (PPB) Lock is a volatile bit that reflects the state of the Password Mode Locking Bit after power-up
reset. If the Password Mode Lock Bit is also set after a hardware reset (RESET# asserted) or a power-up reset, the ONLY means for
clearing the PPB Lock Bit in Password Protection Mode is to issue the Password Unlock command. Successful execution of the
Password Unlock command clears the PPB Lock Bit, allowing for sector PPBs modifications. Asserting RESET#, taking the device
through a power-on reset, or issuing the PPB Lock Bit Set command sets the PPB Lock Bit to a “1” when the Password Mode Lock
Bit is not set.
If the Password Mode Locking Bit is not set, including Persistent Protection Mode, the PPB Lock Bit is cleared after power-up or
hardware reset. The PPB Lock Bit is set by issuing the PPB Lock Bit Set command. Once set the only means for clearing the PPB
Lock Bit is by issuing a hardware or power-up reset. The Password Unlock command is ignored in Persistent Protection Mode.
14.4 High Voltage Sector Protection
Sector protection and unprotectio n may also be implemented using programming equipment. The procedure requires high voltage
(VID) to be placed on the RESET# pin. Refer to Figure 14.1 on page 56 for details on this procedure. Note that for sector unprotect,
all unprotected sectors must first be protected prior to the first sector write cycle.
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Figure 14.1 In-System Sector Protection/Sector Unprotection Algorithms
Sector Protect:
Write 60h to sector
address with
A7-A0 = 00000010
Set up sector
address
Wait 150 µs
Verify Sector
Protect: Write 40h
to sector address
with A7-A0 =
00000010
Read from
sector address
with A7-A0 =
00000010
START
PLSCNT = 1
RESET# = V
ID
Wait 1 μs
First Write
Cycle = 60h?
Data = 01h?
Remove V
ID
from RESET#
Write reset
command
Sector Protect
complete
Yes
Yes
No
PLSCNT
= 25?
Yes
Increment
PLSCNT
Temporary Sector
Unprotect Mode No
Sector Unprotect:
Write 60h to sector
address with
A7-A0 =
01000010
Set up first sector
address
Wait 15 ms
Verify Sector
Unprotect: Write
40h to sector
address with
A7-A0 =
00000010
Read from
sector address
with A7-A0 =
00000010
START
PLSCNT = 1
RESET# = V
ID
Wait 1 μs
Data = 00h?
Last sector
verified?
Remove V
ID
from RESET#
Write reset
command
Sector Unprotect
complete
Yes
No
PLSCNT
= 1000?
Yes
Increment
PLSCNT
Temporary Secto
r
Unprotect Mode
No All sectors
protected?
Yes
Protect all sectors:
The indicated portion
of the sector protect
algorithm must be
performed for all
unprotected sectors
prior to issuing the
first sector
unprotect address
Set up
next sector
address
No
Yes
No
Yes
No
No
Yes
No
Sector Protect
Algorithm
Sector Unprotect
Algorithm
First Write
Cycle = 60h?
Protect another
sector?
Reset
PLSCNT = 1
Device failed
Remove VID
from RESET#
Write reset
command
Sector Protect
complete
Device failed
Remove VID
from RESET#
Write reset
command
Sector Protect
complete
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14.5 Temporary Sector Unprotect
This feature allows temporary unprotection of previously protected sectors to change data in-system. The Sector Unprotect mode is
activated by sett ing the R ESET# pi n to VID. During this mode, formerly protected sectors can be programmed or erased by selecting
the sector addresses. Once VID is removed from the RESET# pin, all the previously protected sectors are protected again.
Figure 14.2 on page 57 shows the algorithm, and Figure 22.1 on page 88 shows the timing diagrams, for this feature. While PPB
lock is set, the device cannot enter the Temporary Sector Unprotection Mode.
Figure 14.2 Temporary Sector Unprotect Operation
Notes:
1. All protected sectors unprotected (If WP#/ ACC = VIL, upper t wo and lower two sectors will remain protected).
2. All previously protected sectors are protected once aga in
14.6 Secured Silicon Sector Flash Memory Region
The Secured Silicon Sector feature provides a Flash memory region that enables permanent part identification through an Electronic
Serial Number (ESN) The 128-word Secured Silicon sector is divided into 64 factory-lockable words that can be programme d and
locked by the customer. The Secured Silicon sector is located at addresses 000000h-00007Fh in both Persistent Protecti on mode
and Password Protection mode. Indicator bi ts DQ6 and DQ7 are used to indicate the factory-locked and customer locked status of
the part.
The system accesses the Secured Silicon Sector through a command sequence (see the Enter/Exit Secured Silicon Sector
Command Sequence on page 63). After the system has written the Enter Secured Silicon Sector command sequence, it may read
the Secured Silicon Sector by using the addresses normally occupied by the boot sectors. This mode of operation continues until the
system issues the Exit Secured Silicon Sector command sequence, or until power is removed from the device. Once the Enter SecSi
Sector Command sequence has been entered, the stan dard array cannot be accessed until the Exit SecSi Sector command has
been entered or the device has been reset. On power-up, or following a hardware reset, the device reverts to sending commands to
the normal address space. Note that the ACC function and unlock bypass modes are not available when the Secured Silicon Sector
is enabled.
START
Perform Erase or
Program Operations
RESET# = VIH
Temporary Sector
Unprotect Completed
(Note 2)
RESET# = VID
(Note 1)
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14.6.1 Factory-Locked Area (64 words)
The factory-locked area of the Secured Silicon Sector (000000h-00003Fh ) is locked when the part is shipped, whether or not the
area was programmed at the factory. The Secured Silicon Sector Factory-locked Indicator Bit (DQ7) is permanently set to a “1 ”.
Optional Spansion programming services can program the factory-locked area with a random ESN, a customer-defined code, or any
combination of the two. Because only Spansion can program and pro te c t the factory-locked area, this method ensures the security
of the ESN once the product is shipped to the field. Contact your local sales office for details on using Spansion’s programming
services. Note that the ACC function and unlock bypass modes are not available when the Secured Silicon sector is enabled.
14.6.2 Customer-Lockable Area (64 words)
The customer-lockable area of the Secured Silicon Sector (000040h-00007Fh) is shipped unprotected, which allows the customer to
program and optionally lock the area as appropriate for the appli cation. The Secured Silicon Sector Customer-lo cked Indicator Bit
(DQ6) is shipped as “0” and can be permanently locked to “1” by issuing the Secured Silicon Protection Bit Program Command. The
Secured Silicon Sector can be read any number of times, but can be programmed and locked only once. Note that the accelerated
programming (ACC) and unlock bypass functions are not available when programmin g the Secured Silicon Sector.
The Customer-lockable Secured Silicon Sector area can be protected using one of the following procedures:
Write the three-cycle Enter Secured Silicon Sector Region command sequence, and then follow the in-system sector
protect algo ri th m as sh ow n in Fig ure 14.1 on page 56, except that RESET# may be at either VIH or VID. This allows in-
system protection of the Secured Silicon Sector Region without raising any device pin to a high voltage. Note that this
method is only applicable to the Secured Silicon Sector.
To verify the protect/unprotect status of the Secured Silicon Sector, follow the algorithm shown in Figure on page 58.
Once the Secured Silicon Sector is locked and verified, the system must write the Exit Secured Silicon Sector Region
command sequence to return to reading and writing the remainder of the array.
The Secured Silicon Sector lock must be used with caution sinc e, once locked, there is no procedure avai lable for unlocking the
Secured Silicon Sector area and none of the bits in the Secured Silicon Sector memory space can be modified in any way.
14.6.3 Secured Silicon Sector Protection Bits
The Secured Silicon Sector Protection Bits prevent programming of the Secured Silicon Sector memory area. Once set, the Secured
Silicon Sector memory area contents are non-modifiable.
Figure 14.3 Secured Silicon Sector Protect Verify
Write 60h to
any address
Write 40h to SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
START
RESET# =
V
IH
or V
ID
Wait 1 µs
Read from SecSi
Sector address
with A6 = 0,
A1 = 1, A0 = 0
If data = 00h,
SecSi Sector is
unprotected.
If data = 01h,
SecSi Sector is
protected.
Remove V
IH
or V
ID
from RESET#
Write reset
command
SecSi Sector
Protect Verify
complete
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14.7 Hardware Data Protection
The command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent
writes. In ad d i ti on, the followi n g hardware data pro tection measures prevent accidental erasure or programming, which might
otherwise be caused by spurious system level signals during VCC power-up and power-down transitions, or from system noise.
14.7.1 Low VCC Write Inhibit
When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC power-up and power-down.
The command register and all internal program/er ase circuits are disabled, and the de vice resets to the read mode . Subsequent
writes are ignored until VCC is greater than VLKO. The system must provide the proper signals to the control pins to prevent
unintentional writes when VCC is greater than VLKO.
14.7.2 Write Pulse “Glitch” Protection
Noise pulses of less than 3 ns (typical) on OE#, CE#, (CE1#, CE2# in PL129J) or WE# do not initiate a write cycle.
14.7.3 Logical Inhibit
Write cycles are inhibited by holding any one of OE# = VIL, CE# (CE1# = CE2# in PL129J)= VIH or
WE# = VIH. To initiate a write cycle, CE# (CE1# / CE2# in PL129J) and WE# must be a logical zero while OE# is a logical one.
14.7.4 Power-Up Write Inhibit
If WE# = CE# (CE1#, CE2# in PL129J) = VIL and OE# = VIH during power up, the device does not accept commands on the rising
edge of WE#. The internal state machine is automatically reset to the read mode on power -up.
15. Common Flash Memory Interface (CFI)
The Common Flash Interface (CFI) specification outlines device and host system software interrogation handshake, whic h allo ws
specific vendor-specified software algorithms to be used for entire families of devices. Software support can then be device-
independent, JEDEC ID-independent, and forward- and backward-compati ble for the specified flash device families. Flash vendors
can standardize their existing interfaces for long-term compatibility.
This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address 55h, any time the device
is ready to read array data. The system can read CFI informati on at the addresses give n in Table 15.1 on page 60 to Table 15.4
on page 61. To terminate reading CFI data, the system must write the reset command. The CFI Query mode is not accessible when
the device is executing an Embedded Program or embedded Erase algorithm.
The system can also write the CFI query command when the device is in the autoselect mode. The device enters the CFI query
mode, and the system can read CFI data at the addresses given in Table 15.1 to Table 15.4. The system must write the reset
command to return the device to reading array data.
For further information, please refer to the CFI Specification and CFI Publication 100. Contac t your local sales office for copies of
these documents.
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Table 15.1 CFI Query Identification String
Addresses Data Description
10h
11h
12h
0051h
0052h
0059h Query Unique ASCII string “QRY”
13h
14h 0002h
0000h Primary OEM Command Set
15h
16h 0040h
0000h Address for Primary Extend ed Table
17h
18h 0000h
0000h Alternate OEM Command Set (00h = none exists)
19h
1Ah 0000h
0000h Address for Alterna te OEM Extended Table (00h = none exists)
Table 15.2 System Interface String
Addresses Data Description
1Bh 0027h VCC Min. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Ch 0036h VCC Max. (write/erase)
D7–D4: volt, D3–D0: 100 millivolt
1Dh 0000h VPP Min. voltage (00h = no VPP pin present)
1Eh 0000h VPP Max. voltage (00h = no VPP pin present)
1Fh 0003h Typical timeout per single byte/word write 2N µs
20h 0000h Typical timeout for Min. size buffer write 2N µs (00h = not supported)
21h 0009h Typical timeout per individual block erase 2N ms
22h 0000h Typical timeout for full chip erase 2N ms (00h = not supported)
23h 0004h Max. timeout for byte/word write 2N times typical
24h 0000h Max. timeout for buffer write 2N times typical
25h 0004h Max. timeout per individual block erase 2N times typical
26h 0000h Max. timeout for full chip erase 2N times typical (00h = not supported)
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Table 15.3 Device Geometry Definition
Addresses Data Description
27h
0018h (PL127J)
0018h (PL129J)
0017h (PL064J)
0016h (PL032J)
Device Size = 2N byte
28h
29h 0001h
0000h Flash Device Interface descri ption (refer to CFI publication 100)
2Ah
2Bh 0000h
0000h Max. number of byte in multi-byte write = 2N
(00h = not supported)
2Ch 0003h Number of Erase Block Regions within device
2Dh
2Eh
2Fh
30h
0007h
0000h
0020h
0000h
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
31h
00FDh (PL127J)
00FDh (PL129J)
007Dh (PL064J)
003Dh (PL032J) Erase Block Region 2 Information
(refer to the CFI specification or CFI publication 100)
32h
33h
34h
0000h
0000h
0001h
35h
36h
37h
38h
0007h
0000h
0020h
0000h
Erase Block Region 3 Information
(refer to the CFI specification or CFI publication 100)
39h
3Ah
3Bh
3Ch
0000h
0000h
0000h
0000h
Erase Block Region 4 Information
(refer to the CFI specification or CFI publication 100)
Table 15.4 Primary Vendor-Specific Extended Query
Addresses Data Description
40h
41h
42h
0050h
0052h
0049h Query-unique ASCII string “PRI”
43h 0031h Major version number, ASCII (reflects modifications to the silicon)
44h 0033h Minor version number, ASCII (reflects modifications to the CFI table)
45h TBD Address Sensitive Unlock (Bits 1-0)
0 = Required, 1 = Not Required
Silicon Revision Number (Bits 7-2)
46h 0002h Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
47h 0001h Sector Protect
0 = Not Supported, X = Number of sectors in per group
48h 0001h Sector Temporary Unprotect
00 = Not Supported, 01 = Supported
49h 0007h (PLxxxJ) Sector Protect/Unprotect scheme
07 = Advanced Sector Protection
4Ah
00E7h (PL127J)
00E7h (PL129J)
0077h (PL064J)
003Fh (PL032J)
Simultaneous Operation
00 = Not Supported, X = Number of Sectors excluding Bank 1
4Bh 0000h Burst Mode Type
00 = Not Supported, 01 = Supported
4Ch 0002h (PLxxxJ) Page Mode Type
00 = Not Supported, 01 = 4 W ord Page, 02 = 8 Word Page
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16. Command Definitions
Writing specific address and data commands or sequences into the command register initiates device operations. Table 16.1
on page 69 defines the valid register command sequences. Writing incorrect ad dress and data values or writing them in the
improper sequence may place the devi c e in an unkn own state . A re set command is then required to return the device to reading
array data.
All addresses are latched on the falling edge of WE# or CE# (CE1# / CE2# in PL129J), whichever happens later. All data is latched
on the rising edge of WE# or CE# (CE1# / CE2# in PL129J), whichever happens first. Refer to AC Characteristic on page 79 for
timing diagr ams.
16.1 Reading Array Data
The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. Each bank
is ready to read array data after completing an Embedded Program or Embedded Erase algorithm.
After the device accepts an Erase Suspend command, the corresponding bank enters the erase-suspend-read mode, after which
the system can read data from any non-erase-suspended sector within the same bank. The system can read array data using the
standard read timing, except that if it reads at an address within erase-suspende d sectors, the device outputs status data. After
completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same
exception. See Erase Suspend/Erase Resume Commands on page 67 for more information.
After the device accepts a Program Suspend command, the corresponding bank enters the program-suspend-read mode, after
which the system can read data from any non-program-suspended sector within the same bank. See Program Suspend/Program
Resume Commands on page 68 for more information.
The system must issue the reset command to return a bank to the read (or erase-suspend-read) mode if DQ5 go es high during an
active program or erase operation, or if the bank is in the autoselect mode. See the next section, Reset Command on page 63, for
more information.
4Dh 0085h ACC (Acceleration) Supply Minimum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
4Eh 0095h ACC (Acceleration) Supply Maximum
00h = Not Supported, D7-D4: Volt, D3-D0: 100 mV
4Fh 0001h
Top/Bottom Boot Sector Flag
00h = Uniform device, 01h = Both top and bottom boot with write pr otect,
02h = Bottom Boot Device, 03h = Top Boot Device,
04h = Both Top and Bottom
50h 0001h Program Suspend
0 = Not supported, 1 = Supported
57h 0004h Bank Organization
00 = Data at 4Ah is zero, X = Number of Banks
58h
0027h (PL127J)
0027h (PL129J)
0017h (PL064J)
000Fh (PL032J)
Bank 1 Region Information
X = Number of Sectors in Bank 1
59h
0060h (PL127J)
0060h (PL129J)
0030h (PL064J)
0018h (PL032J)
Bank 2 Region Information
X = Number of Sectors in Bank 2
5Ah
0060h (PL127J)
0060h (PL129J)
0030h (PL064J)
0018h (PL032J)
Bank 3 Region Information
X = Number of Sectors in Bank 3
5Bh
0027h (PL127J)
0027h (PL129J)
0017h (PL064J)
000Fh (PL032J)
Bank 4 Region Information
X = Number of Sectors in Bank 4
Table 15.4 Primary Vendor-Specific Extended Query (Continued)
Addresses Data Description
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See also Requirements for Reading Array Data on page 18 for more information. The table AC Characteristic on page 79 provides
the read parameters, and Figure 17.2 on page 73 shows the timing diagram.
16.2 Reset Command
Writing the reset command resets the banks to the read or erase-suspend-read mode. Address bits are don’t cares for this
command.
The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This
resets the bank to which the system was writing to the read mode. Once erasure begins, however, the device ignores reset
commands until the operati on is complete.
The reset command may be written between the sequence cycles in a program command sequence before programming begins.
This resets the bank to which the system was writing to the read mode. If the program command sequence is written to a bank that
is in the Erase Suspend mode, writing the reset command returns that bank to the erase-suspend-read mode. Once programming
begins, however, the device ignores reset command s until the operation is complete.
The reset command may be written between the sequence cycles in an autoselect command sequence. Once in the autoselect
mode, the reset command must be written to return to the read mode. If a bank entered the autoselect mode while in the Erase
Suspend mode, writing the reset command returns that bank to the erase-suspend-read mode.
If DQ5 goes high during a program or erase operation, writing the reset command returns the banks to the read mode (or erase-
suspend-read mode if that ba nk was in Erase Suspend and program-suspend-read mode if that bank was in Program Suspend).
16.3 Autoselect Command Sequence
The autoselect command sequence allows the host system to access the manufacturer and device codes, and determine whether or
not a sector is protected. The autoselect command sequence may be written to an address within a bank that is either in the read or
erase-suspend-read mode. The autoselect command may not be written while the device is actively programming or erasing in the
other bank.
The autoselect command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle that contains
the bank address and the autoselect command. The bank then enters the autoselect mode. The system may read any number of
autoselect codes without reinitiating the command sequence.
Table 16.1 on page 69 shows the address and data requirements. To determine sector protection information, the system must write
to the appropriate bank address (BA) and sector address (SA). Table 11.4 on page 19 shows the address range and bank number
associated with each sector.
The system must write the reset command to return to the read mode (or erase-suspend-read mode if the bank was previously in
Erase Suspend).
16.4 Enter/Exit Secured Silicon Sector Command Sequence
The Secured Silicon Sector region provides a secured data area containing a random, eight word electronic serial number (ESN).
The system can access the Secured Silicon Sector region by issuing the three-cycle Enter Secured Silicon Sector command
sequence. The device continues to access the Secured Silicon Sector region until the system issues the four-cycle Exit Secured
Silicon Sector command sequence. The Exit Secured Silicon Sector command sequence returns the device to normal operation.
The Secured Silicon Sector is not accessible when the device is executing an Embedded Program or embedded Eras e algorithm.
Table 16.1 on page 69 shows the address and data requirements for both command sequences. See also Secured Silicon Sector
Flash Memory Region on page 57 for further information. Note that the ACC function and unlock bypass modes are not available
when the Secured Silicon Sector is enabled.
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16.5 Word Program Command Sequence
Programming is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles, followed
by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program
algorithm. The system is not required to provide further controls or timings. The device automatically provides internally generated
program pulses and verifies the programmed cell margin. Table 16.1 on page 69 shows the address and data requirements for the
program command sequence. Note that the Secured Silicon Sector, autoselect, and CFI functions are unavailable when a [program/
erase] operation is in progress.
When the Embedded Program algorithm is complete, that bank then returns to the read mode and addresses are no longer latched.
The system can determine the status of the program operation by using DQ7, DQ6, or RY/BY#. Refer to Write Operation Stat us
on page 71 for information on these status bits.
Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a hardware reset immediately
terminates the program operation. The program command sequence should be reinitiated once that bank has returned to the read
mode, to ensure data integrity. Note that the Secured Silicon Sector, autoselect and CFI functions are unavailable when the Secured
Silicon Sector is enabled.
Programming is allowed in any sequence and across sector boun daries. A bit cannot be programmed from “0” back to a “1.”
Attempting to do so may cause that bank to set DQ5 = 1, or cause the DQ7 and DQ6 status bits to indicate the operation was
successful. However, a succeeding read will show tha t the data is still “0.” Only erase operations can convert a “0” to a “1.”
16.5.1 Unlock Bypass Command Sequence
The unlock bypass feature allows the system to program data to a bank faster than using the standard program command
sequence. The unlock bypass command sequence is initiated by first writing two unlock cycles. This is followed by a third write cycle
containing the unlock bypass command, 20h. That bank then enters the unlock bypass mode. A two-cycle unlock bypass program
command sequence is all that is required to program in this mode. The first cycle in this sequence contains the unlock bypass
program command, A0h; the second cycle contains the program address and data . Additional data is programmed in the same
manner. This mode dispenses with the initial two unlock cycles required in the standard program command sequence, resulting in
faster total programming time. Table 16.1 on page 69 shows the requirements for the command sequence.
During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands are valid. To exit the unlock
bypass mode, the system must issue the two-cycle unlock bypass reset command sequence. (See Table 16.2 on page 70)
The device offers accelerated prog ram operations through the WP#/ACC pin. When the system asserts VHH on the WP#/ACC pin,
the device automatically enters the Unlock Bypass mode. The system may then write the two-cycle Unlock Bypass program
command sequence. The device uses the higher voltage on the WP#/ACC pin to accelerate the operation. Note that the WP#/ACC
pin must not be at VHH any operation other than accelerated programming, or device damage may result. In addition, the WP#/ACC
pin must not be left floating or unconnected; inconsistent behavior of the device may result.
Figure 16.1 on page 65 illustrates the algorithm for the program operation. Refer to the table Erase/Program Operat ions on page 82
for parameters, and Figure 21.6 on page 84 for timing diagrams.
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Figure 16.1 Program Operation
Note
See Table 16.1 on page 69 for program command sequence.
16.6 Chip Erase Command Sequence
Chip erase is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a
set-up command. Two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the
Embedded Erase algorithm. The device does not require the system to preprogram prior to erase. The Embedded Erase algorithm
automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not
required to provide any controls or timings during these operations. Table 16.1 on page 69 shows the address and data
requirements for the chip erase command sequence.
When the Embedded Erase algorithm is complete, that ba nk returns to the read mode and addresses are no longer latched. The
system can determine the status of the erase operation by using DQ7, DQ6, DQ2, or
RY/BY#. Refer to Write Operation Status on page 71 for information on these status bits.
Any commands written during the chip erase operation are ignored. Note that Secured Silicon Sector, autoselect, and CFI functions
are unavailable when a [program/erase] operation is in progress. However, note that a hardware reset immediately terminates the
erase operation. If that occurs, the chip erase command sequence should be reinitiated once that bank has returned to reading array
data, to ensure data integrity.
Figure 16.2 on page 66 illustrates the algorithm for the erase operation. Refer to the tables in Erase/Program Operations on page 82
for parameters, and Figure 21.8 on page 85 for timing diagrams.
START
Write Program
Command Sequence
Data Poll
from System
Verify Data? No
Yes
Last Address?
No
Yes
Programming
Completed
Increment Address
Embedded
Program
algorithm
in progress
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16.7 Sector Erase Command Sequence
Sector erase is a six bus cycle operation. The sector erase command sequence is initiated by writing two unlock cycles, followed by
a set-up command. Two additional unlock cycles are writte n, and are then followed by the address of the sector to be erased, and
the sector erase command. Table 16.1 on page 69 shows the address and data requirements for the sector erase command
sequence.
The device does not requ ire the system to preprogram prior to erase. The Embedded Erase algorithm automatically programs and
verifies the entire memory for an all zero data pattern prior to electrical erase. The system is not required to provide any controls or
timings during these operations.
After the command sequence is written, a sector erase time-out of 50 µs occurs. During the time-out period, additional sector
addresses and sector erase commands may be written. Loading the sector erase buffer may be done in any sequence, and the
number of sectors may be from one sector to all sectors. The time between these additional cycles must be less than 50 µs,
otherwise erasure may begin. Any sector erase address and command following the exceeded time-out may or may not be
accepted. It is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The
interrupts can be re-enabled after the last Sector Erase command is written. If any command other than 30h, B0h, F0h is input
during the time-out period, the normal operation will not be guaranteed. The system must rewrite the command sequence and
any additional addresses and commands. Note that Secured Silicon Sector, au toselect, and CFI functions are unavailable when a
[program/erase] operation is in progress.
The system can monitor DQ3 to determine if the sector erase timer has timed out (See the section on DQ3: Sector Erase Timer).
The time-out begins from the rising edge of the fin al WE# pulse in the command sequence.
When the Embedded Erase algorithm is complete, the bank returns to reading array data and addresses are no longer latched. Note
that while the Embedded Eras e operation is in progress, the system can read data from the non-erasing bank. Th e system can
determine the status of the erase operation by reading DQ7, DQ6, DQ2, or RY/BY# in the erasing bank. Refer to Write Ope r ation
Status on page 71 for information on these status bits.
Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands are ignored. However,
note that a hardware reset immediately terminates the erase operation. If that occurs, the sector erase command sequence should
be reinitiated once that bank has returned to reading array data, to ensure data integrity.
Figure 8.2 on page 12 illustrates the algorithm for the erase operation. Refer to the tables in Erase/Program Operations on page 82
for parameters, and Figure 21.8 on page 85 for timing diagrams.
Figure 16.2 Erase Operation
Notes
1. See Table 16.1 on page 69 for erase command sequence.
2. See the section on DQ3 for information on the sector erase timer.
START
Write Erase
Command Sequence
(Notes 1, 2)
Data Poll to Erasing
Bank from System
Data = FFh?
No
Yes
Erasure Completed
Embedded
Erase
algorithm
in progress
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16.8 Erase Suspend/Erase Resume Commands
The Erase Suspend command, B0h, allows the system to interrupt a sector erase operation and then read data from, or program
data to, any sector not selected for erasure. The ba nk address is required when writing this command. This command is valid only
during the sector erase operation, including the 50 µs time-out period du ring the sector erase command sequence. The Erase
Suspend command is ignored if written during the chip erase operation or Embedded Program algorithm.
When the Erase Suspend command is written durin g the sector erase operation, the device requires a maximum of 35 µs to
suspend the erase operation. However, when the Erase Suspend command is written during the sector erase time-out, the device
immediately terminates the time-out period and suspends the erase ope ration. Addresses are “don’t-cares” when writing the Erase
suspend command.
After the erase operation has been suspended, the bank enters the erase-suspend-read mode. The system can read data from or
program data to any sector not selected for erasure. (The device “erase suspends” all sectors selected for erasure.) Reading at any
address within erase-suspended sectors produces status information on DQ7–DQ0. The system can use DQ7, or DQ6 and DQ2
together, to determine if a sector is actively erasing or is erase-suspended. Refer to Write Operation Status on page 71 for
information on these status bits.
After an erase-suspended program operation is complete, the bank returns to the erase-suspend-read mode. The system can
determine the status of the program operation using the DQ7 or DQ6 status bits, just as in the standard Word Program operation.
Refer to Write Operation Status on page 71 for more information.
In the erase-suspend-read mode, the system can also issue the autoselect command sequence. The device allows reading
autoselect codes even at addresses within erasing sectors, since the codes are not stored in the memory array. When the device
exits the autoselect mode, the device reverts to the Erase Suspend mode, and is ready for another valid operation. Refer to
Table 11.9, Secured Silicon Sector Addresses on page 44 and Autoselect Command Sequence on page 63 for details.
To resume the sector erase operation, the system must write the Erase Resume command (address bi ts are don’t care). The bank
address of the erase-suspended bank is required when writing this command. Further writes of the Resume command are ignored.
Another Erase Suspend command can be written after the chip has resumed erasing.
If the Persistent Sector Protection Mode Locking Bit is verified as programmed without margin, the Persistent Sector Protection
Mode Locking Bit Program Command should be reissued to improve program margin. If the Secured Silicon Sector Protection Bit is
verified as programmed without margin, the Secured Silicon Sector Protection Bit Program Command should be reissued to improve
program margin. µµAfter programming a PPB, two additional cycles are needed to determine whether the PPB has been
programmed with margin. If the PPB has been programmed without margin, the program command should be reissued to improve
the program margin. Also note that the total number of PPB program/erase cycles is limited to 100 c ycles. Cycling the PPBs beyond
100 cycles is not guaranteed.
After erasing the PPBs, two additiona l cycles are needed to determine whether the PPB has been erased with margin. If the PPBs
has been erased without margin, the erase command should be reissued to improve the program margin. The programming of either
the PPB or DYB for a given sector or sector group can be verified by writing a Sector Protection Status command to the device.
Note that there is no single command to inde pendently verify the programming of a DYB for a given sector group.
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16.9 Program Suspend/Program Resume Commands
The Program Suspend command allows the system to interrupt an embedded programming operation so that data can read from
any non-suspended secto r. Whe n the Program Suspend command is written during a programming process, the device halts the
programming operation within tPSL (program suspend latency) and updates the status bits. Addresses are “don’t-cares” when writing
the Program Suspend command. After the programmin g operation has been suspended, the system can read array data from any
non-suspended sector. The Program Suspend command may also be issued during a programming operation while an erase is
suspended. In this case, data may be read from any addresses not in Erase Suspend or Program Suspend. If a read is needed from
the Secured Silicon Sector area, then user must use the proper command sequences to enter and exit this region. The system may
also write the autoselect command sequence when the device is in Program Suspend mode . The device allows reading autoselect
codes in the suspended sectors, since the codes are not stored in the memory array. When the device exits the autoselect mode,
the device reverts to Program Suspend mode, a nd is ready for another valid opera tion. See Autoselect Command Sequence
on page 63 for more information. After the Program Resume command is written, the device reverts to programming. The system
can determine the status of the program operation using the DQ7 or DQ6 status bits, just as in the standard program operation. See
Write Operation Status on page 71 for more information. The system must write the Program Resume command (address bits are
“don’t care”) to exit the Program Suspend mode and continue the programming operation. Further writes of the Program Resume
command are ignored. Another Program Suspend command can be written after the device has resumed programming.
16.10 Command Definitions Tables
Table 16.1 on page 69 contains the Memory Array Command Definitions.
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Legend
BA = Address of bank switching to autoselect mode, bypass mode, or erase operation. Determined by PL127J: Amax:A20, PL064J and PL129J: Amax:A19, PL032J:
Amax:A18.
PA = Program Address (Amax:A0). Addresses latch on falling edge of WE# or CE# (CE1#/CE2# for PL129J) pulse, whichever happens later.
PD = Program Data (DQ15: DQ0) written to location PA. Data latches on rising edge of WE# or CE# (CE1# /CE2# for PL129J) pulse, whichever happens first.
RA = Read Address (Amax:A0).
RD = Read Data (DQ15:DQ0) from location RA.
SA = Sector Address (Amax:A12) for verifying (in autoselect mode) or erasing.
WD = Write Data. See “Configuration Register” definition for specific write data. Data latched on rising edge of WE#.
X = Don’t care
Notes
1. See Table 11.1 on page 17 for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells in table denote read cycles. All other cycles are write operations.
4. During unlock and command cycles, when lower address bits are 555 or 2AAh as shown in t abl e, address bit s higher th an A11 (except where BA is required) an d data
bits higher tha n DQ7 are don’t cares.
5. No unlock or command cycles required when bank is reading array data.
6. The Reset command is required to retur n to r eading a rray (or to erase-suspe nd-read mode if previously in Erase Suspend) when bank i s in autoselect mode, or if DQ5
goes high (while bank is providing status information).
7. Fourth cycle of autosele ct command se quen ce is a re ad cycle. S yst em must provid e ban k address to ob t ain manuf acturer ID or device ID information. See Autoselect
Command Sequence on page 63 for more information.
8. The data is DQ6=1 for factory and customer locked and DQ7=1 for factory locked.
9. The data is 00h for an unprotected sector group and 01h for a protected sector group.
10.Device ID must be read across cycles 4, 5, and 6. PL127J (X0Eh = 2220h, X0Fh = 2200h), PL129J (X0Eh = 2221h, X0Fh = 2200h),PL064J (X0Eh = 2202h, X0Fh =
2201h), PL032J (X0Eh = 220Ah, X0Fh = 2201h).
11. System may read and program in non-erasing sectors, or enter aut oselect mode, when in Program/Erase Suspend mode. Program/Erase Suspend command is valid
only during a sector erase operation, and requires bank address.
12.Program/Erase Resume command is valid only during Erase Suspend mode, and requir es bank address.
13.Command is valid when device is ready to read array data or when device is in aut oselect mode.
14.WP#/ACC must be at VID during the entire operation of command.
Table 16.1 Memory Array Command Definitions
Command (Notes)
Cycles
Bus Cycles (Notes 1–4)
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Read (5) 1RA RD
Reset (6) 1XXX F0
Autoselect
(Note 7)
Manufacturer ID 4 555 AA 2AA 55 (BA)
555 90 (BA)
X00 01
Device ID (10) 6 555 AA 2AA 55 (BA)
555 90 (BA)
X01 227E (BA)
X0E (10) (BA)
X0F (10)
Secured Silicon Sector
Factory Protect (8) 4 555 AA 2AA 55 (BA)
555 90 X03 (8)
Sector Group
Protect Verify(9) 4 555 AAA 2AA 55 (BA)
555 90 (SA) X02 XX00/
XX01
Program 4 555 AA 2AA 55 555 A0 PA PD
Chip Erase 6 555 AA 2AA 55 555 80 555 AA 2AA 55 555 10
Sector Erase 6 555 AA 2AA 55 555 80 555 AA 2AA 55 SA 30
Program/Erase Suspend (11) 1BA B0
Program/Erase Resume (12) 1BA 30
CFI Query (13) 155 98
Accelerated Program (14) 2XX A0 PA PD
Unlock Bypass Entry (14) 3 555 AA 2AA 55 555 20
Unlock Bypass Program (14) 2XX A0 PA PD
Unlock Bypass Erase (14) 2XX80XX10
Unlock Bypass CFI (13)(14) 1XX 98
Unlock Bypass Reset (14) 2XXX 90 XXX 00
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Legend
DYB = Dynamic Protection Bit
OW = Address (A7:A0) is (00011010)
PD[3:0] = Password Data (1 of 4 portions)
PPB = Persistent Protecti on Bit
PWA = Password Address. A1:A0 selects portion of password.
PWD = Password Data being verified.
PL = Password Protection Mode Lock Address (A7:A0) is (00001010)
RD(0) = Read Data DQ0 for protection indicator bit.
RD(1) = Read Data DQ1 for PPB Lock status.
SA = Sector Address where security co mmand applies. Address bits Amax:A12 uniquely select any sector.
SL = Persistent Protection Mode Lock Address (A7:A0) is (00 010010)
WP = PPB Address (A7:A0) is (00000010)
X = Don’t care
PPMLB = Password Protection Mode Locking Bit
SPMLB = Persistent Protection Mode Locking Bit
Table 16.2 Sector Protection Command Definitions
Command (Notes)
Cycles
Bus Cycles (Notes 1-4)
Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Reset 1 XXX F0
Secured Silicon
Sector Entry (16) 3 555 AA 2AA 55 555 88
Secured Silicon
Sector Exit (16) 4 555 AA 2AA 55 555 90 XX 00
Secured Silicon
Protection Bit
Program (Notes 5, 6)6 555 AA 2AA 55 555 60 OW 68 OW 48 OW RD
(0)
Secured Silicon
Protection Bit Status 5 555 AA 2AA 55 555 60 OW 48 OW RD
(0)
Password Program
(Notes 5, 7, 8)4 555 AA 2AA 55 555 38 XX
[0-3] PD
[0-3]
Password Verify
(Notes 6, 8, 9)4 555 AA 2AA 55 555 C8 PWA
[0-3] PWD
[0-3]
Password Unlock
(Notes 7, 10, 11)7 555 AA 2AA 55 555 28 PWA
[0] PWD
[0] PWA
[1] PWD
[1] PWA
[2] PWD
[2] PWA
[3] PWD
[3]
PPB Program
(Notes 5, 6, 11)6 555 AA 2AA 55 555 60 (SA)
WP 68 (SA)
WP 48 (SA)
WP RD(0)
PPB Status 4 555 AA 2AA 55 BA+
555 90 (SA)
WP RD
(0)
All PPB Erase
(Notes 5, 6, 13, 14)6 555 AA 2AA 55 555 60 WP 60 (SA) 40 (SA)
WP RD(0)
PPB Lock Bit Set 3 555 AA 2AA 55 555 78
PPB Lock Bit Status (15) 4 555 AA 2AA 55 BA+
555 58 SA RD
(1)
DYB Write (7) 4 555 AA 2AA 55 555 48 SA X1
DYB Erase (7) 4 555 AA 2AA 55 555 48 SA X0
DYB Status (6) 4 555 AA 2AA 55 BA+
555 58 SA RD
(0)
PPMLB Program
(Notes 5, 6, 12)6 555 AA 2AA 55 555 60 PL 68 PL 48 PL RD(0)
PPMLB Status (5) 5 555 AA 2AA 55 555 60 PL 48 PL RD
(0)
SPMLB Program
(Notes 5, 6, 12)6 555 AA 2AA 55 555 60 SL 68 SL 48 SL RD(0)
SPMLB Status (5) 5 555 AA 2AA 55 555 60 SL 48 SL RD
(0)
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Notes
1. See Table 11.1 on page 17 for description of bus operations.
2. All values are in hexadecimal.
3. Shaded cells in table denote read cycles. All other cycles are write operations.
4. During unlock and command cycles, when lower address bits are 555 or 2AAh as shown in t abl e, address bit s higher th an A11 (except where BA is required) an d data
bits higher tha n DQ7 are don’t cares.
5. The reset command returns device to reading array.
6. Cycle 4 programs the addressed locking bit. Cycles 5 and 6 validate bit has been fully programmed when DQ0 = 1. If DQ0 = 0 in cycle 6, program command must be
issued and verified again.
7. Data is latched on th e r i sing edge of WE#.
8. Entire command sequence must be entered for each portion of passwor d.
9. Command sequence returns FFh if PPMLB is set.
10.The password is written over four consecutive cycles, at addresses 0-3.
11. A 2 µs timeout is required between any two portions of p assword.
12.A 100 µs timeout is required between cycles 4 and 5.
13.A 1.2 ms timeout is required between cycles 4 and 5.
14.Cycle 4 erases all PPBs. Cycles 5 and 6 validate bits have been fully erased when DQ0 = 0. If DQ0 = 1 in cycle 6, erase command must be issued and ve rif ied aga in.
Before issuing erase command, all PPB s should be programmed to prevent PPB overerasure.
15.DQ1 = 1 if PPB locked, 0 if unlocke d.
16.Once the Secured Silicon Sector Entry Command sequence has been entered, the st an dard ar ray ca nnot b e accessed until t he Exit SecSi Sect or command has been
entered or the device has been reset.
17. Write Operation Status
The device provides several bits to determine the status of a program or erase operation: DQ2, DQ3, DQ5, DQ6, and DQ7.
Table 17.1 on page 75 and the following subsections describe the function of these bits. DQ7 and DQ6 each offer a method for
determining whether a prog ram or erase operation is complete or in progress. The device also provides a hardware-based output
signal, RY/BY#, to determine whether an Embedded Program or Erase operation is in progress or has been completed.
17.1 DQ7: Data# Polling
The Data# Polling bit, DQ7, indicates to the host system whether an Embedded Program or Erase algorithm is in progress or
completed, or whether a bank is in Erase Suspend. Data# Polling is valid after the rising edge of the final WE# pulse in the command
sequence.
During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to DQ7. This DQ7
status also applies to programming during Erase Suspend. When the Embedded Program algorithm is complete, the device outputs
the datum programmed to DQ7. The system must provide the program address to read valid status information on DQ7. If a program
address falls within a protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then that bank returns to the read
mode.
During the Embedded Erase algorithm, Data# Polling produces a “0” on DQ7. When the Embedded Erase algorithm is complete, or
if the bank enters the Erase Suspend mode, Data# Polling produce s a “1” on DQ7. The system must provide an address within any
of the sectors selected for erasure to read valid status information on DQ7.
After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Poll ing on DQ7 is active for
approximately 400 µs, then the bank returns to the read mode. If not all selected sectors are protected, the Embedded Erase
algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. However, if the system reads DQ7 at
an address within a protected sector, the status may not be valid.
When the system detects DQ7 has changed from the complement to true data, it can read valid data at DQ15–DQ0 on the following
read cycles. Just prior to the completion of an Embedded Progr am or Erase operation, DQ7 may change asynchronously with
DQ15–DQ0 while Output Enable (OE#) is asserted low. That is, the device may change from providing status information to valid
data on DQ7. Depending on when the system samples the DQ7 output, it may read the status or vali d data. Even if the device has
completed the program or erase operation and DQ7 has valid data, the data outputs on DQ15–DQ0 may be still invalid. Valid data
on DQ15–DQ0 will appear on successive read cycles.
Table 17.1 on page 75 shows the outputs for Data# Polling on DQ7. Figure 17.1 on page 72 shows the Data# Polling algorithm.
Figure 21.10 on page 86 shows the Data# Polling timing diagram.
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Figure 17.1 Data# Polling Algorithm
Notes
1. VA = Valid address for programming. During a sector erase operation, a valid address is any sector address within the sector being erased. During chip erase, a valid
address is any non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5.
17.2 RY/BY#: Ready/Busy#
The RY/BY# is a dedicated, open-drain output pin which indicates whether an Embedded Algorithm is in progress or complete. The
RY/BY# status is valid after the rising edge of the final WE# pulse in the command sequence. Since RY/BY# is an open-drain output,
several RY/BY# pins can be tied togethe r in parallel with a pull-up resistor to VCC.
If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.)
If the output is high (Ready), the device is in the read mode, the standby mode, or one of the banks is in the erase-suspend-read
mode.
Table 17.1 on page 75 shows the outputs for RY/BY#.
17.3 DQ6: Toggle Bit I
Toggle Bit I on DQ6 indicates whether an Embedded Program or Era s e algorithm is in progress or complete, or whether the device
has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE#
pulse in the command sequence (prior to the program or erase operation), and during the sector erase time-out.
During an Embedded Program or Erase algorithm operation, successi ve read cycles to any address cause DQ6 to toggle. The
system may use either OE# or CE# to control the read cycles. When the operati on is complete, DQ6 stops toggling.
After an erase command sequence is written, if all sectors selected for erasing are protected, DQ6 toggles for approximately 400 µs,
then returns to reading array data. If not all selected sectors are protected, the Embedded Eras e al gorithm erases the unprotected
sectors, and ignores the selected sectors that are protected.
DQ7 = Data? Ye s
No
No
DQ5 = 1?
No
Ye s
Ye s
FAIL PASS
Read DQ7–DQ0
Addr = VA
Read DQ7–DQ0
Addr = VA
DQ7 = Data?
START
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The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erase-suspended. When the
device is actively erasing (that is, the Embedded Erase algorithm is in progre ss), DQ6 toggles. When the device enters the Erase
Suspend mode, DQ6 stops toggling. However, the system must also use DQ2 to determine which sectors are erasing or erase-
suspended. Alternatively, the system can use DQ7 (see the DQ7: Data# Polling on page 71).
If a program address falls within a protected sector, DQ6 toggles for approximately 1 µs after the program command sequence is
written, then returns to reading array data.
DQ6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program algorithm is complete.
Table 17.1 on page 75 shows the outputs for Toggle Bit I on DQ6. Figure 17.2 on page 73 shows the toggle bit algorithm.
Figure 21.11 on page 87 in shows the toggle bit timing diagrams. Figure 21.12 on page 87 shows the differences between DQ2 and
DQ6 in graphical form. See also the DQ2: Toggle Bit II on page 74.
Figure 17.2 Toggle Bit Algorithm
Note:
The system should recheck the toggle bit even if DQ5 = “1” because the toggle bit may stop toggling as DQ5 changes to “1 .” See the DQ6: Toggle Bit I on page 72 and
DQ2: Toggle Bit II on page 74 for more information.
START
No
Yes
Yes
DQ5 = 1?
No
Yes
Toggle Bit
= Toggle?
No
Program/Erase
Operation Not
Complete, Write
Reset Command
Program/Erase
Operation Complete
Toggle Bit
= Toggle?
Read Byte Twice
(DQ7–DQ0)
Address = VA
Read Byte
(DQ7–DQ0)
Address =VA
Read Byte
(DQ7–DQ0)
Address =VA
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17.4 DQ2: Toggle Bit II
The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing (that is, the Embedded
Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE#
pulse in the command sequence.
DQ2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use
either OE# or CE# (CE1# / CE2# for PL129J) to control th e re ad cy cle s.) But DQ2 cannot distinguish whether the sector is actively
erasing or is erase-suspended. DQ6, by comparison, indicates whether the devi ce i s actively erasing, or is in Erase Suspend, but
cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sector and mode information. Refer
to Table 17.1 on page 75 to compa r e outputs for DQ2 and DQ6.
Figure 17.2 on page 73 shows the toggle bit algorithm in flowchart form, and the DQ2: Toggle Bit II on page 74 explains the
algorithm. See also the DQ6: Toggle Bit I on page 72. Figure 21.11 on page 87 shows the toggle bit timing diagram. Figure 21.12
on page 87 shows the differences between DQ2 and DQ6 in graphical form.
17.5 Reading Toggle Bits DQ6/DQ2
Refer to Figure 17.2 on page 73 for the following discussion. Whenever the system initially begins reading toggl e bit status, it must
read DQ7–DQ0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store the
value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the
first. If the toggle bit is not toggling, th e device has completed the program or erase operation. The system can read array data on
DQ7–DQ0 on the following read cycle.
However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note
whether the value of DQ5 is high (see the section on DQ5). If it is, the system should then determine again whether the toggle bit is
toggling, since the toggle bit may have stopped toggling just as DQ5 went high. If the toggle bit is no longer toggling, the device has
successfully completed the program or erase operation. If it is still toggling, the device did not completed the operation successfully,
and the system must write the reset command to return to reading array data.
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not gone high. The system
may continue to monitor the toggle bit and DQ5 through successive read cycles, determining the status as described in the previous
paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the
algorithm when it returns to determine the status of the operation (top of Figure 17.2 on page 73).
17.6 DQ5: Exceeded Timing Limits
DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these conditions DQ5
produces a “1,” indicating that the program or erase cycle was not successfully completed.
The device may output a “1” on DQ5 if the system tries to program a “1” to a location that was previously programmed to “0.” Only
an erase operation can change a “0” back to a “1.” Under this condition, the device halts the operation, and when the timing limit
has been exceeded, DQ5 produces a “1.”
Under both these conditions, the system must write the reset command to return to the read mode (or to the erase-suspend-read
mode if a bank was previously in the erase-suspend-program mode).
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17.7 DQ3: Sector Erase Timer
After writing a sector erase command sequence, the system may read DQ3 to determine whether or not erasure has begun. (The
sector erase timer does not apply to the chip erase command.) If additional sectors are selected for erasure, the entire time-out also
applies after each additional sector erase command. When the time-out period is complete , DQ3 switches from a “0” to a “1.” See
also the Sector Erase Command Sequence on page 66.
After the sector erase command is written, the system should read the status of DQ7 (Data# Polling) or DQ6 (Toggle Bit I) to ensure
that the device has accepted the command sequence, and then read DQ3. If DQ3 is “1,” the Embedded Erase algorithm has begun;
all further commands (except Erase Suspend) are ignored until the erase operation is complete. If DQ3 is “0,” the device will accept
additional sector erase commands. To ensure the command has been accepted, the system software should check the status of
DQ3 prior to and following each subsequen t sector erase command. If DQ3 is high on the second status check, the last command
might not have been accepted.
Table 17.1 shows the status of DQ3 relative to the other status bits.
Notes:
1. DQ5 switches to ‘1’ when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. Refer to DQ5: Exceeded Timing Limits
on page 74 for more information.
2. DQ7 and DQ2 require a valid address when reading st atus information. Refer to the appropriate subsection for furth er details.
3. When reading write operation status bits, the system must always provide the bank address where the Embedded Algorithm is in progress. The device outputs ar ray
data if the system addresses a non-bus y bank.
Table 17.1 Write Operation Status
Status DQ7
(Note 2) DQ6 DQ5
(Note 1) DQ3 DQ2
(Note 2) RY/BY#
Standard
Mode
Embedded Program
Algorithm DQ7# Toggle 0 N/A No toggle 0
Embedded Erase
Algorithm 0 Toggle 0 1 Toggle 0
Erase
Suspend
Mode
Erase
Suspend-
Read
Erase
Suspended
Sector 1 No toggle 0 N/A Toggle 1
Non-Erase
Suspended
Sector Data Data Data Data Data 1
Erase-Suspend
-Program DQ7# Toggle 0 N/A N/A 0
Program
Suspend
Mode
(Note 3)
Reading within
Program
Suspended Sector
Invalid
(Not Allowed) Invalid
(Not Allowed) Invalid
(Not Allowed) Invalid
(Not Allowed) Invalid
(Not Allowed) 1
Reading within
Non-program
Suspended Sector Data Data Data Data Data 1
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18. Absolute Maximum Ratings
Notes:
1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input or I/O pins may overshoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC
voltage on input or I/O pins is VCC +0.5 V. During voltage transitions, input or I/ O pins may overshoot to VCC +2.0 V for periods up to 20 ns. See Figure 18.1
on page 76.
2. Minimum DC input voltage on pins A9, OE#, RESET# , and WP#/ACC is –0.5 V. During voltage transi tio ns, A9, OE#, WP#/ACC, and RESET# may overshoot VSS to –
2.0 V for period s of up to 20 ns. Se e Figu re 18.1 on page 76. Maximum DC input voltage on pin A9, OE#, and RE SET# is +12.5 V whi ch may o vershoot to +14. 0 V f or
periods up to 20 ns. Maximum DC input voltag e on WP#/ACC is +9.5 V which may overshoot to +12.0 V for periods up to 20 ns.
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greate r than one second.
4. Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rati ng only; functional operation of the
device at these or any o ther conditi ons abov e those indicat ed in the operat ional secti ons of this d ata sheet is n ot implie d. Ex posure of the device to absolute maximum
rating conditions for extended periods may affect device reliability
Figure 18.1 Maximum Overshoot Waveforms
Storage Temperature Plastic Packages –65°C to +150°C
Ambient Temperature with Power Applied –65°C to +125°C
Voltage with Respect to Ground
VCC (Note 1) –0.5 V to +4.0 V
A9, OE#, and RESET# (Note 2) –0.5 V to +12.5 V
WP#/ACC (Note 2) –0.5 V to +10.5 V
All other pins (Note 1) –0.5 V to VCC +0.5 V
Output Short Circuit Current (Note 3) 200 mA
20 ns
20 ns
+0.8 V
–0.5 V
20 ns
–2.0 V
20 ns
20 ns
V
CC
+2.0 V
V
CC
+0.5 V
20 ns
2.0 V
Maximum Negative Overshoot Waveform Maximum Positive Overshoot Waveform
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19. Operating Ranges
Operating ranges define those limits between which the functionality of the device is guarante ed.
Industrial (I) Devices
Ambient Temperature (TA)................–40°C to +85°C
Wireless (W) Devices
Ambient Temperature (TA)................–25°C to +85°C
Supply Voltages
VCC ..................................................2.7–3.6 V
VIO (see Note)...................................1.65–1.95 V (for PL127J and PL129J) or 2.7–3.6 V (for all PLxxxJ devices)
Note:
For all AC and DC specifications, VIO = VCC; contact your local sales office for other VIO options.
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20. DC Characteristics
Notes
1. The ICC current listed is typically less than 5 mA/MHz, with OE# at VIH.
2. Maximum ICC specifications are tested with VCC = VCCmax.
3. ICC active while Embedded Erase or Embedded Program is in progress.
4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns. Typical sleep mode current is 2 µA.
5. Not 100% tested.
6. In S29PL129J there are two CE# (CE1#, CE2#). V alid CE1#/CE2# conditions: (CE1# = VIL, CE2# = VIH,) or (CE1 # = VIH, CE2# = VIL) or (CE1# = VIH, CE2# = VIH)
Table 20.1 CMOS Compatible
Parameter Parameter
Description (notes) Test Conditions Min Typ Max Unit
ILI Input Load Current VIN = VSS to VCC,
VCC = VCC max 1.0 µA
ILIT A9, OE#, RESE T #
Input Load Current VCC = VCC max; VID= 12.5 V 35 µA
ILR Reset Leakage Current VCC = VCC max; VID= 12.5 V 35 µA
ILO Output Leakage Current VOUT = VSS to VCC, OE# = VIH
VCC = VCC max 1.0 µA
ICC1 VCC Active Read Current
(1, 2)OE# = VIH, VCC = VCC max 5 MHz 20 30 mA
10 MHz 45 55
ICC2 VCC Active Write Current (2, 3)OE# = V
IH, WE# = VIL 15 25 mA
ICC3 VCC Standby Current (2) CE#, RESET#, WP#/ACC
= VIO 0.3 V 0.2 5 µA
ICC4 VCC Reset Current (2) RESET# = VSS 0.3 V 0.2 5 µA
ICC5 Automatic Sleep Mode
(Notes 2, 4)VIH = VIO 0.3 V;
VIL = VSS 0.3 V 0.2 5 µA
ICC6 VCC Active Read-While-Program
Current (1, 2)OE# = VIH,5 MHz 21 45 mA
10 MHz 46 70
ICC7 VCC Active Read-While-Erase
Current (1, 2)OE# = VIH,5 MHz 21 45 mA
10 MHz 46 70
ICC8 VCC Active Program-While-Erase-
Suspended Current (2, 5)OE# = VIH 17 25 mA
ICC9 VCC Active Page Read Current (2) OE # = V IH, 8 word Page Read 10 15 mA
VIL Input Low Voltage VIO = 1.65–1.95 V
(PL127J and PL129J) –0.4 0.4 V
VIO = 2.7–3.6 V –0.5 0.8 V
VIH Input High Voltage VIO = 1.65–1.95 V
(PL127J AND PL129J) VIO–0.4 VIO+0.4 V
VIO = 2.7–3.6 V 2.0 VCC+0.3 V
VHH Voltage for ACC
Program Acceleration VCC = 3.0 V ± 10% 8.5 9.5 V
VID Voltage for Autoselect and
Temporary Sector Unprotect VCC = 3.0 V 10% 11.5 12.5 V
VOL Output Low Voltage
IOL = 100 µA, VCC = VCC min,
VIO = 1.65–1.95 V
(PL127J AND PL129J) 0.1 V
IOL = 2.0 mA, VCC = VCC min,
VIO = 2.7–3.6 V 0.4 V
VOH Output High Voltage
IOH = –100 µA, VCC = VCC min,
VIO = 1.65–1.95 V
(PL127J AND PL129J) VIO–0.1 V
IOH = ––100 µA, VIO = VCC min VCC-
0.2V V
VLKO Low VCC Lock-Out Voltage (5) 2.3 2.5 V
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21. AC Characteristic
21.1 Test Conditions
Figure 21.1 Test Setups
Note
Diodes are IN3064 or equivalent
21.2 Switching Waveforms
Table 21.1 Test Specifications
Test Conditions All Speeds Unit
Output Load 1 TTL gate
Output Load Capacitance, CL (including jig capacitance) 30 pF
Input Rise and Fall Times VIO = 1.8 V
(PL127J AND PL129J) 5ns
VIO = 3.0 V
Input Pulse Levels VIO = 1.8 V
(PL127J AND PL129J) 0.0 - 1.8 V
VIO = 3.0 V 0.0–3.0
Input timing measurement reference levels VIO/2 V
Output timing measurement reference levels VIO/2 V
Table 21.2 Key To Switching Waveforms
Waveform Inputs Outputs
Steady
Changing from H to L
Changing from L to H
2.7 k
CL6.2 k
3.6 V
Device
Under
Test
CL
Device
Under
Test
VIO = 3.0 V VIO = 1.8 V (PL127J and PL129J)
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Figure 21.2 Input Waveforms and Measu r ement Levels
21.3 Read Operations
Notes
1. Not 100% tested.
2. See Figure 21.1 on page 79 and Table 21.1 on page 79 for test specifications
3. Measurements performe d by pla cing a 50 ohm termination on the data pin with a bias of VCC /2. The time from OE# high to the data bus driven to VCC /2 is taken as
tDF.
4. S29PL129J has two CE# (CE1#, CE2#).
5. Valid CE1# / CE2# conditions: (CE1# = VIL,C E2# = VIH) or (CE1# = VIH,CE2# = VIL) or (CE1# = VIH, CE2# = VIH)
6. Valid CE1# / CE2# transitions: (CE1# = VIL,CE2# = VIH) or (CE1# = VIH,CE2# = VIL) to (CE1# = CE2# = VIH)
7. Valid CE1# / CE2# transitions: (CE1# = CE2# = VIH) to (CE1# = VIL,CE2# = VIH) or (CE1# = VIH,CE2# = VIL)
8. For 70 pF Output Load Capacitance, 2 ns will be added to the above tACC,tCE,tPACC,tOE values for all speed grades
Don’t Care, Any Change Permitted Changing, St ate Unknown
Does Not Apply Center Line is High Impedance State (High Z)
Table 21.3 Read-O nl y Op erations
Parameter Descripti on (Notes) Test Setup Speed Options UnitJEDEC Std. 55 60 65 70 80
tAVAV tRC Read Cycle Time (1) Min5560657080 ns
tAVQV tACC Address to Output Delay CE#, OE# = VIL Max5560657080 ns
tELQV tCE Chip Enable to Output Delay OE# = VIL Max5560657080 ns
tPACC Page Access Time Max 20 25 25 30 30 ns
tGLQV tOE Output Enable to Output Delay Max 20 25 30 35 ns
tEHQZ tDF Chip Enable to Outpu t High Z (3) Max 16 ns
tGHQZ tDF Output Enable to Output High Z (1, 3) Max 16 ns
tAXQX tOH Output Hold Time From Addresses,
CE# or OE#, Whichever Occurs First (3) Min 5 ns
tOEH Output Enable Hold Time (1) Read Min 0 ns
Toggle and Data# Polling Min 10 ns
Table 21.2 Key To Switching Waveforms
Waveform Inputs Outputs
V
IO
0.0 V
V
IO
/2 V
IO
/2 OutputMeasurement LevelInput
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S29PL-J
Figure 21.3 Read Operation Timings
Notes
1. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
2. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Figure 21.4 Page Read Operation Timings
Notes
1. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
2. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
tOH
tCE
High Z
Valid Data
High Z
Addresses Stable
tRC
tACC
tOEH
tRH
tOE
tRH
0 V
RY/BY#
RESET#
tD
Addresses
CE#
OE#
Data
WE
Amax
-
A3
CE#
OE#
A2
-
A0
Data
Same Page
Aa Ab Ac Ad
Qa Qb Qc Qd
tACC
tPA C C tPA C C tPA C C
Document Number: 002-00615 Rev. *A Page 82 of 103
S29PL-J
21.4 Reset
Note
Not 100% tested .
Figure 21.5 Reset Timings
Notes
1. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
2. S29PL129J - There are two CE# (CE1#, CE2#). In the below waveform CE# = CE1# or CE2#
21.5 Erase/Program Operations
Table 21.4 Hardware Reset (RESET#)
Parameter
Description All Speed
Options UnitJEDEC Std
tReady RESET# Pin Low (During Embedded Algorithms) to Read Mode
(See Note) Max 20 µs
tReady RESET# Pin Low (NOT During Embedded Algorithms) to Read Mode
(See Note) Max 500 ns
tRP RESET# Pulse Width Min 500 ns
tRH Reset High Time Before Read (See Note) Min 50 ns
tRPD RESET# Low to Sta ndby Mode Min 20 µs
tRB RY/BY# Recovery Time Min 0 ns
RESET#
RY/BY#
RY/BY#
t
RP
t
Ready
Reset Timings NOT during Embedded Algorithms
t
Ready
CE#, OE#
t
RH
CE#, OE#
Reset Timings during Embedded Algorithms
RESET#
t
RP
t
RB
Document Number: 002-00615 Rev. *A Page 83 of 103
S29PL-J
Notes:
1. Not 100% tested.
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#).
4. See Table 22.4 on page 91 for more information.
Table 21.5 Erase and Program Operations
Parameter
Description
Speed Options (ns)
JEDEC Std 55 60 65 70 80 Unit
tAVAV tWC Write Cycle Time (Note 1) Min5560657080
tAVWL tAS Address Setup Time Min 0 ns
tASO Address Setup Time to OE# low du ring toggle bit polling Min 15 ns
tWLAX tAH Address Hold Time Min 30 35 ns
tAHT Address Hold Time From CE# (CE1#, CE#2 in PL129J) or OE# high
during toggle bit polling Min 0 ns
tDVWH tDS Data Setup Time Min 25 30 ns
tWHDX tDH Data Hold Time Min 0 ns
tOEPH Output Enable High during toggle bit polling Min 10 ns
tGHWL tGHWL Read Recovery Time Before Write
(OE# High to WE# Low) Min 0 ns
tELWL tCS CE# (CE1# or CE#2 in PL129J) Setup Time Min 0 ns
tWHEH tCH CE# (CE1# or CE#2 in PL129J) Hold Time Min 0 ns
tWLWH tWP Write Pulse Width Min 35 ns
tWHDL tWPH Write Pulse Width High Min 20 25 ns
tSR/W Latency Between Read and Write Operat ions Min 0 ns
tWHWH1 tWHWH1 Programming Operation (Note 4) Typ 6 µs
tWHWH1 tWHWH1 Accelerated Programming Operation (Note 4) Typ 4 µs
tWHWH2 tWHWH2 Sector Erase Operation (Note 4) Typ 0.5 sec
tVCS VCC Setup Time (Note 1) Min 50 µs
tRB Write Recovery Time from RY/BY# Min 0 ns
tBUSY Program/Erase Valid to RY/BY# Delay Max 90 ns
Min 35 ns
tPSL Program Suspend Latency Max 35 µs
tESL Erase Suspend Latency Max 35 µs
Document Number: 002-00615 Rev. *A Page 84 of 103
S29PL-J
21.6 Timing Diagrams
Figure 21.6 Program Operation T imings
Notes
1. PA = program address, PD = program data, DOUT is the true data at the program address
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
OE#
WE#
CE#
VCC
Data
Addresses
tDS
tAH
tDH
tWP
PD
tWHWH1
tWC tAS
tWPH
tVCS
555h PA PA
Read Status Data (last two cycles)
A0h
tCS
Status DOUT
Program Command Sequence (last two cycles)
RY/BY#
tRB
tBUSY
tCH
PA
Document Number: 002-00615 Rev. *A Page 85 of 103
S29PL-J
Figure 21.7 Accelerated Program Timing Diagram
Figure 21.8 Chip/Sector Erase Operation Timings
Notes
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see Write Operation Status on page 71
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#.
WP#/ACC tVHH
VHH
VIL or VIH VIL or VIH
tVHH
OE#
CE#
Addresses
V
CC
WE#
Data
2AAh SA
t
AH
t
WP
t
WC
t
AS
t
WPH
555h for chip erase
10 for Chip Erase
30h
t
DS
t
VCS
t
CS
t
DH
55h
t
CH
Status D
OUT
t
WHWH2
VA
VA
Erase Command Sequence (last two cycles) Read Status Data
RY/BY#
t
RB
t
BUSY
Document Number: 002-00615 Rev. *A Page 86 of 103
S29PL-J
Figure 21.9 Back-to-back Read/Write Cycle Timings
Figure 21.10 Data# Polling Timings (During Embedded Algorithms)
Note
VA = Valid address. The illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle
OE#
CE#
WE#
Addresses
t
OH
Data Valid
In Valid
In
Valid PA Valid RA
t
WC
t
WPH
t
AH
t
WP
t
DS
t
DH
t
AS
t
RC
t
CE
t
AH
Valid
Out
t
OE
t
ACC
t
OEH
t
GHWL
t
DF
Valid
In
CE# Controlled Write CyclesWE# Controlled Write Cycle
Valid PA Valid PA
t
CP
t
CPH
t
WC
t
WC
Read Cycle
t
SR/W
t
AS
WE#
CE#
OE#
High Z
t
OE
High Z
DQ7
DQ6–DQ0
RY/BY#
t
BUSY
Complement True
Addresses VA
t
OEH
t
CE
t
CH
t
OH
t
DF
VA VA
Status Data
Complement
Status Data True
Valid Data
Valid Data
t
ACC
t
RC
Document Number: 002-00615 Rev. *A Page 87 of 103
S29PL-J
Figure 21.11 Toggle Bit Timings (Durin g Embedded Algorithms)
Notes
1. VA = Valid address; not required f or DQ6. The illustration shows first two status cycle after command sequence, last status read cycle, and array data read cycle
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Figure 21.12 DQ2 vs. DQ6
Note
DQ2 toggles only when read at an address wi thin an erase-suspended sector. The system may use OE# or CE# to toggle DQ2 and DQ6.
OE#
CE#
WE#
Addresses
t
OEH
t
DH
t
AHT
t
ASO
t
OEPH
t
OE
Valid Data
(first read) (second read) (stops toggling)
t
CEPH
t
AHT
t
AS
DQ6/DQ2 Valid Dat
a
Valid
Status Valid
Status Valid
Status
RY/BY#
Enter
Erase
Erase
Erase
Enter Erase
Suspend Program
Erase Suspend
Read Erase Suspend
Read
Erase
WE#
DQ6
DQ2
Erase
Complete
Erase
Suspend
Suspend
Program
Resume
Embedded
Erasing
Document Number: 002-00615 Rev. *A Page 88 of 103
S29PL-J
22. Protect/Unprotect
Note
Not 100% tested .
Figure 22.1 Temporary Sector Unprotect Timing Diagram
Table 22.1 Temporary Sector Unprotect
Parameter
Description All Speed Options
Unit
JEDEC Std
tVIDR VID Rise and Fall Time (See Note) Min 500 ns
tVHH VHH Rise and Fall Time (See Note) Min 250 ns
tRSP RESET# Setup Time for Temporary Sector Unprotect Min 4 µs
tRRB RESET# Hold Time from RY/BY# High for Temporary
Sector Unprotect Min 4 µs
RESET#
tVIDR
VID
VIL or VIH
VID
VIL or VIH
CE#
WE#
RY/BY#
tVIDR
tRSP
Program or Erase Command Sequence
tRRB
Document Number: 002-00615 Rev. *A Page 89 of 103
S29PL-J
Figure 22.2 Sector/Sector Block Protect and Unprotect Timing Diagram
Notes
1. For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0.
2. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
3. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Sector Group Protect: 150 µs
Sector Group Unprotect: 15 ms
1 µs
RESET#
SA, A6,
A1, A0
Data
CE#
WE#
OE#
60h 60h 40h
Valid* Valid* Valid*
Status
Sector Group Protect/Unprotect Verify
VID
VIH
Document Number: 002-00615 Rev. *A Page 90 of 103
S29PL-J
22.1 Controlled Erase Operations
Notes
1. Not 100% tested.
2. See Erase And Programming Performance on page 91 for more information.
Figure 22.3 Alternate CE# Controlled Wri te (Erase/Program) Operation Timings
Notes
1. Figure indicates last two bus cycles of a program or erase opera tion.
Table 22.2 Alternate CE# Controlled Erase and Program Operations
Parameter Description (Notes) Speed Options UnitJEDEC Std 55 60 65 70 80
tAVAV tWC Write Cycle T ime (Note 1) Min5560657080ns
tAVWL tAS Address Setup Time Min 0 ns
tELAX tAH Address Hold Time Min 30 35 ns
tDVEH tDS Data Setup Time Min 25 30 ns
tEHDX tDH Data Hold Time Min 0 ns
tGHEL tGHEL Read Recovery Time Before Write (OE# High to WE# Low) Min 0 ns
tWLEL tWS WE# Setup Time Min 0 ns
tEHWH tWH WE# Hold Time Min 0 ns
tELEH tCP CE# (CE1# or CE#2 in PL129J) Pulse Width Min 35 40 ns
tEHEL tCPH CE# (CE1# or CE#2 in PL129J) Pulse Width High Min 20 25 ns
tWHWH1 tWHWH1 Programming Operation (Note 2) Typ 6 µs
tWHWH1 tWHWH1 Accelerated Programming Operation (Note 2) Typ 4 µs
tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ 0.5 sec
tGHEL
tWS
OE#
CE#
WE#
RESET#
tDS
Data
tAH
Addresses
tDH
tCP
DQ7# D
OUT
tWC tAS
tCPH
PA
Data# Polling
A0 for program
55 for erase
tRH
tWHWH1 or 2
RY/BY#
tWH
PD for program
30 for sector erase
10 for chip erase
555 for program
2AA for erase PA for program
SA for sector erase
555 for chip erase
tBUSY
Document Number: 002-00615 Rev. *A Page 91 of 103
S29PL-J
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device
4. S29PL129J - During CE1# transitions, CE2# = VIH; During CE2# transitions, CE1# = VIH
5. S29PL129J - There are two CE# (CE1#, CE2#). In the above waveform CE# = CE1# or CE2#
Note
This parameter is de fined for CE1# /CE2# recover time for read/ read, p rogram/r ead, and read/ program operat ions. Pr ogram/program operation are not al lowed and onl y a
single program operation is allowed at one time.
Figure 22.4 Timing Diagram for Alternating Between CE1# and CE2# Control
Notes
1. Typical program and erase times assume the following conditions: 25°C, 3 .0 V VCC, 100,000 cycles. Addition ally, programming typicals assume checkerboard p attern.
All values are subject to change.
2. Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles. All values are subject to change.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster th an th e maxi mum progr am
times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 16.1 on page 69 for further
information on command definitions.
6. The device has a minimum erase and program cycle endurance of 100,000 cycles.
Table 22.3 CE1#/CE2# Timing (S29PL129J only)
Parameter
Description All Speed Options UnitJEDEC Std
tCCR CE1#/CE2# Recover Time (See Note) Min 0 ns
Table 22.4 Erase And Programming Performance
Parameter Typ (Note 1) Max
(Note 2) Unit Comments
Sector Erase Time 0.5 2 sec
Excludes 00h programming
prior to erasure (Note 4)
Chip Erase Time
PL127J/129J 135 216 sec
PL064J 71 113.6 sec
PL032J 39 62.4 sec
Word Program Time 6 100 µs Excludes system level
overhead (Note 5)
Accelerated Word Program 4 60 µs
Chip Program Time
(Note 3)
PL127J/129J 50.4 200 sec
PL064J 25.2 50.4 sec
PL032J 12.6 25.2 sec
CE1#
t
CCR
t
CCR
CE2#
Document Number: 002-00615 Rev. *A Page 92 of 103
S29PL-J
23. Pin Capacitance
23.1 BGA Pin Capacitance
Notes
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
23.2 TSOP Pin Capacitance
Notes
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
Parameter Symbol Parameter Descri ption Test Setup Typ Max Un it
CIN Input Capacitance VIN = 0 6.3 7 pF
COUT Output Cap a citance VOUT = 0 7.0 8 pF
CIN2 Control Pin Capacitance VIN = 0 5.5 8 pF
CIN3 WP#/ACC Pin Capacitance VIN = 0 11 12 pF
Parameter Symbol Parameter Descri ption Test Setup Typ Max Un it
CIN Input Capacitance VIN = 0 10 10.5 pF
COUT Output Cap a citance VOUT = 0 5.5 6.5 pF
CIN2 Control Pin Capacitance VIN = 0 8 10 pF
CIN3 WP#/ACC Pin Capacitance VIN = 0 9.5 10 pF
Document Number: 002-00615 Rev. *A Page 93 of 103
S29PL-J
24. Physical Dimensions
24.1 VBG080—80-Ball Fine-pitch Ball Grid Array 8 x 11 mm Package (PL127J)
3329 \ 16-038.25b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
PACKAGE VBG 080
JEDEC N/A
11.00 mm x 8.00 mm NOM
PACKAGE
SYMBOL MIN NOM MAX NOTE
A --- --- 1.00 OVERALL THICKNESS
A1 0.18 --- --- BALL HEIGHT
A2 0.62 --- 0.76 BODY THICKNESS
D 11.00 BSC. BODY SIZE
E 8.00 BSC. BODY SIZE
D1 8.80 BSC. BALL FOOTPRINT
E1 5.60 BSC. BALL FOOTPRINT
MD 12 ROW MATRIX SIZE D DIRECTION
ME 8 ROW MATRIX SIZE E DIRECTION
N 80 TOTAL BALL COUNT
φb 0.33 --- 0.43 BALL DIAMETER
e 0.80 BSC. BALL PITCH
SD / SE 0.40 BSC. SOLDER BALL PLACEMENT
(A3-A6,B3-B6,L3-L6,M3-M6) DEPOPULATED SOLDER BALLS
TOP VIEW
INDEX MARK
CORNER
10
PIN A1
C0.05
(2X)
(2X) C0.05
E
DA
B
A1 CORNER
ML JK
e
7
BACEDFHG
8
7
6
5
4
3
2
1
e
D1
E1
SE
7
BCA
C
M
φ 0.15
φ 0.08 M
6
NXφbSD
BOTTOM VIEW
SIDE VIEW
A2
A
A1
0.10 C
C0.08
C
SEATING PLANE
Document Number: 002-00615 Rev. *A Page 94 of 103
S29PL-J
24.2 VBH064—64-Ball Fine-pitch Ball Grid Array 8 x 11.6 mm package (PL127J)
3330 \ 16-038.25b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
PACKAGE VBH 064
JEDEC N/A
11.60 mm x 8.00 mm NOM
PACKAGE
SYMBOL MIN NOM MAX NOTE
A --- --- 1.00 OVERALL THICKNESS
A1 0.18 --- --- BALL HEIGHT
A2 0.62 --- 0.76 BODY THICKNESS
D 11.60 BSC. BODY SIZE
E 8.00 BSC. BODY SIZE
D1 8.80 BSC. BALL FOOTPRINT
E1 7.20 BSC. BALL FOOTPRINT
MD 12 ROW MATRIX SIZE D DIRECTION
ME 10 ROW MATRIX SIZE E DIRECTION
N 64 TOTAL BALL COUNT
φb 0.33 --- 0.43 BALL DIAMETER
e 0.80 BSC. BALL PITCH
SD / SE 0.40 BSC. SOLDER BALL PLACEMENT
(A2-9,B1-4,B7-10,C1-K1, DEPOPULATED SOLDER BALLS
M2-9,C10-K10,L1-4,L7-10,
G5-6,F5-6)
BOTTOM VIEW
TOP VIEW
SIDE VIEW
A1 CORNER
A2
A
10
9
10
ML JK
e
C0.05
(2X)
(2X) C0.05
A1
E
D
7
BACEDFHG
8
7
6
5
4
3
2
1
e
D1
E1
SE
7
BCA
C
M
φ 0.15
φ 0.08 M
6
0.10 C
C0.08
NXφb
SD
A
B
C
SEATING PLANE
A1 CORNER
INDEX MARK
Document Number: 002-00615 Rev. *A Page 95 of 103
S29PL-J
24.3 V BK 0 4 8 — 4 8 - B al l F i n e - pi t c h Ball Grid Array 8.15 x 6.15 mm p ackage
(PL032J and PL064J)
3338 \ 16-038.25
b
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEP
T
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
PACKAGE VBK 048
JEDEC N/A
8.15 mm x 6.15 mm NOM
PACKAGE
SYMBOL MIN NOM MAX NOTE
A --- --- 1.00 OVERALL THICKNESS
A1 0.18 --- --- BALL HEIGHT
A2 0.62 --- 0.76 BODY THICKNESS
D 8.15 BSC. BODY SIZE
E 6.15 BSC. BODY SIZE
D1 5.60 BSC. BALL FOOTPRINT
E1 4.00 BSC. BALL FOOTPRINT
MD 8 ROW MATRIX SIZE D DIRECTION
ME 6 ROW MATRIX SIZE E DIRECTION
N 48 TOTAL BALL COUNT
φb 0.33 --- 0.43 BALL DIAMETER
e 0.80 BSC. BALL PITCH
SD / SE 0.40 BSC. SOLDER BALL PLACEMENT
--- DEPOPULATED SOLDER BALLS
SIDE VIEW
TOP VIEW
SEATING PLANE
A2
A
(4X)
0.10
10
D
E
C0.10
A1
C
B
A
C0.08
BOTTOM VIEW
A1 CORNE
R
BA
M
φ 0.15 C
M
7
7
6
eSE
SD
6
5
4
3
2
A
BCDEFG
1
H
φb
E1
D1
C
φ 0.08
PIN A1
CORNER
INDEX MARK
Document Number: 002-00615 Rev. *A Page 96 of 103
S29PL-J
24.4 VBU056—56-Ball Fine-pitch BGA 7 x 9mm package (PL064J and PL032J)
3440\ 16-038.25 \ 01.13.05
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
PACKAGE VBU 056
JEDEC N/A
9.00 mm x 7.00 mm NOM
PACKAGE
SYMBOL MIN NOM MAX NOTE
A --- --- 1.00 OVERALL THICKNESS
A1 0.17 --- --- BALL HEIGHT
A2 0.62 --- 0.76 BODY THICKNESS
D 9.00 BSC. BODY SIZE
E 7.00 BSC. BODY SIZE
D1 5.60 BSC. BALL FOOTPRINT
E1 5.60 BSC. BALL FOOTPRINT
MD 8 ROW MATRIX SIZE D DIRECTION
ME 8 ROW MATRIX SIZE E DIRECTION
N 56 TOTAL BALL COUNT
φb 0.35 0.40 0.45 BALL DIAMETER
e 0.80 BSC. BALL PITCH
SD / SE 0.40 BSC. SOLDER BALL PLACEMENT
A1,A8,D4,D5,E4,E5,H1,H8 DEPOPULATED SOLDER BALLS
SEATING PLANE
E1
7
SE
D1
e
ACDBEFGH
7
8
6
5
3
2
1
e
4
A1 CORNER
7
SD
BOTTOM VIEW
C
C
A
D
E
C
0.05
(2X)
C
0.05
B
(2X)
C
10
SIDE VIEW
TOP VIEW
INDEX MARK
A1
AA2
A1 CORNER
0.10
0.08
BAC
M
MC
φ 0.08
φ 0.15
6
NXφb
Document Number: 002-00615 Rev. *A Page 97 of 103
S29PL-J
24.5 TS056—20 x 14 mm, 56-pin TSOP (PL127J)
-X-
X = A OR B
e/2
DETAIL B
c
L
0.25MM (0.0098") BSC
0˚
DETAIL A
R
GAGE LINE
PARALLEL TO
SEATING PLANE
b
b1
(c)
76
c1
WITH PLATING
BASE METAL
7
C A-B SM
0.08MM (0.0031")
SECTION B-B
e
0.10 C
A2
PLANE
SEATING
C
A1
SEE DETAIL BSEE DETAIL B
BB
BBSEE DETAIL ASEE DETAIL A
2
STANDARD PIN OUT (TOP VIEW)
2
N+1
N
N
1
4
2
A
-A- -B- 5
E
5
D1
D
6
2
3
4
5
7
8
9
TS 056
MO-142 (B) EC
56
MIN
0.05
0.95
0.17
0.17
0.10
0.10
18.30
19.80
0.50
0˚
0.08
13.90
0.50 BASIC
MAX
0.15
1.20
0.27
0.16
0.21
5˚
0.20
18.50
14.10
0.70
20.20
0.23
1.05
0.20
1.00
0.22
18.40
20.00
0.60
3˚
14.00
NOM
Symbol
Jedec
Package
b1
A2
A1
A
D
L
e
E
D1
b
c1
c
0
R
N
1
NOTES:
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (MM).
(DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF
CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT
HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS
0.15MM (.0059") PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE
0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE
BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND
0.25MM (0.0098") FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10MM (0.004") AS MEASURED FROM THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
Document Number: 002-00615 Rev. *A Page 98 of 103
S29PL-J
25. Revision Summary
Spansion Publication Number: 002-00615
Section Description
Revision A0 (January 29, 2004) Initial Release
Revision A1 (February 12, 2004)
Software Features Included backward compatibility with MBM29xx families.
General Description 48-ball BGA package is not supported and was removed.
Ordering Information Model numbers for the 48-ball BGA configurations were removed.
64-Ball Fine Pitch BGA—MCP
Compatible An illustration was added to show the pin-out configuration.
Table 20 Added the description of 01h for address 4Fh and removed the 0004 data.
Table 34 Provided the time units of measure for the erase and programmi ng performances.
Revision A2 (February 17, 2004)
Memory Array Command
Definitions, Table Corrected typo in device ID.
Revision A3 (February 25, 2004)
Architectural Advantages Added 3V VIO for PL064J and PL032J devices.
Ordering Information Corrected the voltage rating, ball configuration, and physical dimensions for model numbers 12
and 13.
Connection Diagrams Removed the 64-ball, 8x9 mm diagram.
Operating Ranges Clarified the supply voltages that apply to the PL127J/PL129J and all other PLxxxJ products.
BGA Pin Capacitance Added information applicable to the CIN3 symbol.
Package Drawings Removed the 9x8 mm package drawing.
Revision A4 (February 27, 2004)
Connection Diagrams Added the 56-ball 7x9 mm pinout diagram.
Package Options Updated to include the 8 x 6 mm, 48-ball Fine pitch BGA and 7 x 9 mm, 56-ball Fine-pitch BGA
options.
Physical Dimensions Added the VBK048 package drawing.
Revision A5 (March 15, 2004)
Connection Diagram s Changed names.
Revision A6 (August 30, 2004)
Global Removed VIO, added TSOP, fixed Secure d Silicon DQ bits.
Product Selector Guide Updated specs in this table.
Ordering Information Updated the Model Number offerings.
Valid Combinations Table
(128Mb)
Corrected the Package Markings for the 64-ball FBGA packages.
Added combinations for the TLC056 package on the PL064J and PL032J devices.
Valid Combinations for BGA Packag es (128Mb)
Updated information in this
table. Package Options
Added the 7 x 9mm 56-ball package.
Connection Diagram 56-ba ll connection diagram
Erase/Programming
Performance Table Notes 1 and 2 corrected to reflect accurate temperatu re ranges and cycling.
Document Number: 002-00615 Rev. *A Page 99 of 103
S29PL-J
Revision A7 (March 2, 2005)
Ordering Information Updated the Model Number offerings
Valid Combinations table Updated the Package Types information.
Figure 6, In-System Sector Protection/Sector Unprotection Algorithms
Updated the illustration.
Program Suspend/Program Resume Commands
New section added. Made global change s to include program suspend/resume commands.
Table 29 on page 82 Added Erase Suspend Latency.
Table 32, CE1#/CE2# Timing
(S29PL129J only) Updated table and added a notes section.
Physical Dimensions Added the VBU056 package
Revision A8 (July 29, 2005)
Autoselect Codes (High
Voltage Method) Table Added note: When Polling the SecSi indicator bit the Bank Address (BA) should be set with in the
address range 004000h-03FFFFh.
Autoselect Codes for PL129J
Table Added note: When Polling the SecSi indicator bit the A21 to A12 should be set within the address
range 004000h-03FFFFh.
Secured Silicon Sector Flash
Memory Region
Added sentence: Once the Enter Secured Silicon Sector Command sequence has been entered,
the standard array cannot be accessed until the Exit Secured Silicon Sector command has been
entered or the device has been reset.
Sector Protection Command
Definitions Table
Added note 16: Once the Secured Silicon Sector Entry Command se quence has been entered,
the standard array cannot be accessed until the Exit Secured Silicon Sector command has been
entered or the device has been reset.
Valid Combinations Content the same, tables co nsolidated to match Ordering Informatio n Descriptions
Connection Diagram s Section
Consolidated Special Package Handling Instructions and put the information before the package/
pinout descriptions.
Added Figure numbers to the connection diagram graphics.
Operating Ranges Update d operating temperatures.
DC Characteristics Table Updated VOH parameter.
Erase/Program Operations
Table Added tESL parameter
VBK048—48-Ball Fine-pitch
Ball Grid Array 8.15 x 6.15 mm
package (PL032J and
PL064J) Updated the product th at uses this package from PL127J to PL064J and PL032J
Revision A9 (September 22, 2006)
64-Ball Fine-Pitch BGA—MCP
Compatible—PL127J Changed ball F9 to A22
Revision A10 (September 7, 2007)
Pin Description Corrected WP#/ACC description.
Revision A11 (September 10, 2009)
Global Changed data sheet status from Advanced Information to Full Production
Ordering Information Modified/Added note to the Valid Combinations to be Supported for this Device tables
VCC Ramp Rate Removed Section
Connection Diagram Corrected 64-Ball Fine-Pitch BGA ball description (H9 and L5)
Revision A12 (December 18, 2009)
Ordering Information Under Package Type, changed wording of “Lead (Pb)-free compliant” material type to “Standard”.
Revision A13 (Febuary 1, 2011)
Section Description
Document Number: 002-00615 Rev. *A Page 100 of 103
S29PL-J
Global Removed 55 ns as a valid speed supported by PL127J.
Product Selector Guide
Corrected the 55 ns Speed Option's Max Page Access and Max OE# Access time from 2 to 20 ns.
Corrected the 65 ns Speed Option's Max Access and Max CE# Access time from 25 to 65 ns.
Dynamic Protection Bit (DYB) Corrected reference to Table 17 to Table 10.15.
Erase Suspend/Erase
Resume Commands
Corrected “This command is valid only during the sector erase operation, including the 80 µs time-
out period...” to “This command is valid only during the sector erase operation, including the 50 µs
time-out period...”.
Command Definitions Tables In Table 15.2, corrected the value of the third bus cycle of the “P PB Status”, “PPB Lock Bit Status”
and “DYB Status” commands from 555 to BA+555.
Absolute Maximum Ratings Corrected the A9, OE# and RESET# “Voltage with Respect to Grou nd” maximum range value
from +13.0V to +12.5V.
Revision A14 (July 8, 2011
DQ6: Toggle Bit I Corrected Figure 16.2: Toggle Bit Algorithm.
Pin Capacitance Added TSOP package pin capacitance values.
Revision A15 (March 14, 2012)
Ordering Information For model number 13, corrected “56-ball” TSOP package description to “56-pin”.
Revision A16 (April 18, 2013)
Global Changed 65 ns and 70 ns initial access time for VIO=1.8V to 80 ns.
Section Description
Document Number: 002-00615 Rev. *A Page 101 of 103
S29PL-J
Document History Page
Document Title: S29PL-J 128/128/64/32 Mbit (8/8/4/2M x 16-Bit) V, Flash with Enhanced VersatileIO™ Control
Document Number: 002-00615
Rev. ECN No. Orig. of
Change Submission
Date Description of Change
** RYSU 01/29/2004 to
04/18/2013
Initial release
Included backward compatibility with MBM29xx families.
48-ball BGA package is not supported and was removed.
Model numbers for the 48-ball BGA configurations were removed.
An illustration was added to show the pin-out configuration.
Added the description of 01h for address 4Fh and removed the 0004 data.
Provided the time units of measure for the erase and programming performanc-
es.
Corrected typo in device ID.
Added 3V VIO for PL064J and PL032J devices.
Corrected the voltage rating, ball configuration, and physical dimensions for
model numbers 12 and 13.
Removed the 64 -b a ll , 8x9 mm di a gram.
Clarified the supply voltages that apply to the PL127J/PL129J and all other
PLxxxJ products.
Added information applicable to the CIN3 symbol.
Removed the 9x8 mm package dra w i n g.
Added the 56-ball 7x9 mm pinout diagram.
Updated to include the 8 x 6 mm, 48-ball Fine pitch BGA and 7 x 9 mm, 56-ball
Fine-pitch BGA options.
Added the VBK048 package drawing.
Changed names.
Updated specs in this table.
Updated the Model Number offerings.
Corrected the Package Markings for the 64-ball FBGA packages.
Added combinations for the TL C056 package on the PL064J and PL032J de-
vices.
Valid Combinations for BGA Packages (128Mb)
Package Options
Added the 7 x 9mm 56-ball package.
56-ball connection diagram
Notes 1 and 2 corrected to reflect accurate temperature ranges and cycling.
Updated the Model Number offerings
Updated the Package Types information.
Figure 6, In-System Sector Protection/Sector Unprotection Algorithms
Program Suspend/Program Resume Commands
New section added. Made global changes to include program suspend/resume
commands.
Added Erase Suspend Latency.
Updated table and added a notes section.
Added the VBU056 package
Document Number: 002-00615 Rev. *A Page 102 of 103
S29PL-J
** (cont'd) RYSU 01/29/2004 to
04/18/2013
Added note: When Polling the SecSi indicator bit the A21 to A12 should be set
within the address range 004000h-03FFFFh.
Added sentence: Once the Ente r Secured Silico n Sector Comman d seq uence
has been entered, the standard array cannot be accessed until the Exit Secured
Silicon Sector command has been entered or th e device has been reset.
Added note 16: Once the Secured Silicon Sector Entry Command sequence
has been entered, the standard array cannot be accessed until the Exit Secured
Silicon Sector command has been entered or th e device has been reset.
Content the same, tables consolidated to match Ordering Information Descrip-
tions
Consolidated Special Package Handling Instructions and put the information
before the package/pinout descriptions.
Added Figure numbers to the connection diagram graphics.
Updated operating temperatures.
Updated VOH parameter.
Added tESL parameter
Updated the product that uses this package from PL127J to PL064J and PL032J
64-Ball Fine-Pitch BGA—MCP Compatible—PL127JChanged bal l F9 to A22
Pin DescriptionCorrected WP#/ACC description.
GlobalChanged data sheet status from Advanced Information to Full Production
Ordering InformationModified/Added note to the V alid Combinations to be Sup-
ported for this Device tables
VCC Ramp RateRemoved Section
Connection DiagramCorrected 64-Ball Fine-Pitch BGA ball description (H9 and
L5)
Ordering InformationUnder Package T ype, changed wording of “Lead (Pb)-free
compliant” material type to “Standard”.
GlobalRemoved 55 ns as a valid speed supported by PL127J.
Product Selector GuideCorrecte d the 55 ns Speed Option's Max Page Access
and Max OE# Access time from 2 to 20 ns.
Corrected the 65 ns Speed Option's Max Access and Max CE# Access time
from 25 to 65 ns.
Dynamic Protection Bit (DYB)Corrected reference to Table 17 to Table 10.15.
Erase Suspend/Erase Resume CommandsCorrected “This command is valid
only during the sector erase operation, including the 80 µs time-out period...” to
“This command is valid only during the sector erase operation, including the 50
µs time-out period...”.
Command Definitions TablesIn Table 15.2, co rrected the valu e of the third b us
cycle of the “PPB Status”, “PPB Lock Bit Status” and “DYB Status” commands
from 555 to BA+555.
Absolute Maximum RatingsCorrected the A9, OE# and RESET# “Voltage with
Respect to Ground” maximum range value from +13.0V to +12.5V.
DQ6: Toggle Bit ICorrected Figure 16.2: Toggle Bit Algorithm.
Pin CapacitanceAdded TSOP package pin capacitance values.
Ordering InformationFor model number 13, corrected “56-ball” T SOP package
description to “56-pin”.
GlobalChanged 65 ns and 70 ns initial access time for VIO=1.8V to 80 ns.
*A 4959015 RYSU 10/13/2015 Updated to Cypress template
Document History Page (Continued)
Document Title: S29PL-J 128/128/64/32 Mbit (8/8/4/2M x 16-Bit) V, Flash with Enhanced VersatileIO™ Control
Document Number: 002-00615
Rev. ECN No. Orig. of
Change Submission
Date Description of Change
Document Number: 002-00615 Rev. *A Revised October 13, 20 15 Page 103 of 103
Cypress®, Spansi on®, MirrorBit®, MirrorBit® E clipse™ , ORNAND™, Hype rBus™, HyperFl ash™, and com binations ther eof, are trad emarks and re gistered tradema rks of Cypress Se miconductor Corp.
All products and company names mentioned in this document may be the trademarks of their respective holders.
© Cypress Semicondu ctor Corpor ation, 2004-2015. The informatio n contai ned herei n is subject to chan ge without no tice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress prod uc ts are n ot war r ant ed no r inte nd ed to be used fo r
medical, life supp or t, l if e savin g, cr it ical control or safety ap pl i cations, unless pur suan t to an express written ag re em en t w it h C ypr ess. Fu rth erm ore, Cyp ress doe s not auth ori ze i t s pr o ducts for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress produ cts in life-supp ort systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protecti on (United States and fore ign),
United S t ates copyright laws and international treaty provis ions. Cyp ress he reby gr ant s to l icense e a pers onal, no n-excl usive , non-tr ansfer able license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of lice nsee product to be used on ly in conjunction wit h a Cypress
integrated circui t as specified in the applicab le agreement. Any r eproduction, mod ification, translati on, compilatio n, or represent ation of this Sour ce Code except a s specified abo ve is prohibit ed without
the express written permis sion of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials de scribed herei n. Cypress d oes not
assume any liabil ity ar ising ou t of the a pplic ation or use o f any pr oduct or circ uit descri bed herein . Cypress d oes not a uthor ize its p roducts fo r use as critical componen ts in life-su pport systems whe re
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
S29PL-J
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