© Semiconductor Components Industries, LLC, 2011
November, 2011 Rev. 11
1Publication Order Number:
BCP69T1/D
BCP69T1G, NSVBCP69T1G
PNP Silicon
Epitaxial Transistor
This PNP Silicon Epitaxial Transistor is designed for use in low
voltage, high current applications. The device is housed in the
SOT223 package, which is designed for medium power surface
mount applications.
Features
High Current: IC = 1.0 A
The SOT223 Package Can Be Soldered Using Wave or Reflow.
SOT223 package ensures level mounting, resulting in improved
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering, eliminating
the possibility of damage to the die.
NPN Complement is BCP68
AECQ101 Qualified and PPAP Capable
NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating Symbol Value Unit
CollectorEmitter Voltage VCEO 20 Vdc
CollectorBase Voltage VCBO 25 Vdc
EmitterBase Voltage VEBO 5.0 Vdc
Collector Current IC1.0 Adc
Total Power Dissipation @ TA = 25°C (Note 1)
Derate above 25°C
PD1.5
12
W
mW/°C
Operating and Storage Temperature Range TJ, Tstg 65 to
150
°C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance JunctiontoAmbient
(Surface Mounted)
RqJA 83.3 °C/W
Lead Temperature for Soldering,
0.0625 in from case
Time in Solder Bath
TL260
10
°C
s
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.
x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in.
MEDIUM POWER
PNP SILICON
HIGH CURRENT
TRANSISTOR
SURFACE MOUNT
12
3
4
COLLECTOR 2,4
BASE
1
EMITTER 3
http://onsemi.com
SOT223 (TO261)
CASE 318E
STYLE 1
AYW
CEG
G
Device Package Shipping
ORDERING INFORMATION
BCP69T1G SOT223
(PbFree)
1000 / Tape & Reel
CE = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G= PbFree Package
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MARKING
DIAGRAM
(*Note: Microdot may be in either location)
NSVBCP69T1G SOT223
(PbFree)
1000 / Tape & Reel
BCP69T1G, NSVBCP69T1G
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristics Symbol Min Typ Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage (IC = 100 mAdc, IE = 0) V(BR)CES 25 Vdc
CollectorEmitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0) V(BR)CEO 20 Vdc
EmitterBase Breakdown Voltage (IE = 10 mAdc, IC = 0) V(BR)EBO 5.0 Vdc
CollectorBase Cutoff Current (VCB = 25 Vdc, IE = 0) ICBO 10 mAdc
EmitterBase Cutoff Current (VEB = 5.0 Vdc, IC = 0) IEBO 10 mAdc
ON CHARACTERISTICS
DC Current Gain
(IC = 5.0 mAdc, VCE = 10 Vdc)
(IC = 500 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 Adc, VCE = 1.0 Vdc)
hFE 50
85
60
375
CollectorEmitter Saturation Voltage (IC = 1.0 Adc, IB = 100 mAdc) VCE(sat) 0.5 Vdc
BaseEmitter On Voltage (IC = 1.0 Adc, VCE = 1.0 Vdc) VBE(on) 1.0 Vdc
DYNAMIC CHARACTERISTICS
CurrentGain Bandwidth Product
(IC = 10 mAdc, VCE = 5.0 Vdc)
fT60 MHz
TYPICAL ELECTRICAL CHARACTERISTICS
Figure 1. DC Current Gain
IC, COLLECTOR CURRENT (mA)
f , CURRENT GAIN BANDWIDTH PRODUCT (MHz)
T
Figure 2. Current Gain Bandwidth Product
300
200
100
30
70
50
-10 -100 -1000
VCE = -10 V
TJ = 25°C
f = 30 MHz
IC, COLLECTOR CURRENT (A)
1010.10.010.001
0
100
200
300
400
hFE, DC CURRENT GAIN
VCE = 1 V
150°C
25°C
55°C
BCP69T1G, NSVBCP69T1G
http://onsemi.com
3
TYPICAL ELECTRICAL CHARACTERISTICS
Figure 3. Collector Emitter Saturation Voltage
vs. Collector Current
IC, COLLECTOR CURRENT (A)
10.10.010.001
0
0.05
0.15
0.25
0.35
VCE(sat), COLLECTOREMITTER
SATURATION VOLTAGE (V)
IC/IB = 10
150°C
25°C
55°C
0.10
0.20
0.30
Figure 4. Base Emitter Saturation Voltage vs.
Collector Current
IC, COLLECTOR CURRENT (A)
1010.10.010.001
0.2
0.6
1.0
1.4
VBE(sat), BASEEMITTER
SATURATION VOLTAGE (V)
IC/IB = 10
150°C
25°C
55°C
0.4
0.8
1.2
Figure 5. Base Emitter Voltage vs. Collector
Current
IC, COLLECTOR CURRENT (A)
1010.10.010.001
0.2
0.3
0.5
0.9
1.2
VBE(on), BASEEMITTER VOLTAGE (V)
VCE = 1 V
150°C
25°C
55°C
0.4
0.8
1.0
0.6
0.7
1.1
160
0
VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Capacitances
C, CAPACITANCE (pF)
120
80
40
Cob
Cib
-5.0
-1.0
-2.0
-4.0
-2.5
-5.0
Cib
Cob
TJ = 25°C
-1.0
-2.0
-1.5
-3.0 VCE, COLLECTOR-EMITTER VOLTAGE (V)
Figure 7. Safe Operating Area
0.01
10
1.0
0.1
1.0 1000.1 10
10 ms
Single Pulse Test
@ TA = 25°C
Thermal Limit
100 ms
IC, COLLECTOR CURRENT (A)
1 ms
1 s
SOT223 (TO261)
CASE 318E04
ISSUE R
DATE 02 OCT 2018
SCALE 1:1
q
q
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42680B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 2
SOT223 (TO261)
© Semiconductor Components Industries, LLC, 2018 www.onsemi.com
SOT223 (TO261)
CASE 318E04
ISSUE R
DATE 02 OCT 2018
STYLE 4:
PIN 1. SOURCE
2. DRAIN
3. GATE
4. DRAIN
STYLE 6:
PIN 1. RETURN
2. INPUT
3. OUTPUT
4. INPUT
STYLE 8:
CANCELLED
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
STYLE 10:
PIN 1. CATHODE
2. ANODE
3. GATE
4. ANODE
STYLE 7:
PIN 1. ANODE 1
2. CATHODE
3. ANODE 2
4. CATHODE
STYLE 3:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
STYLE 2:
PIN 1. ANODE
2. CATHODE
3. NC
4. CATHODE
STYLE 9:
PIN 1. INPUT
2. GROUND
3. LOGIC
4. GROUND
STYLE 5:
PIN 1. DRAIN
2. GATE
3. SOURCE
4. GATE
STYLE 11:
PIN 1. MT 1
2. MT 2
3. GATE
4. MT 2
STYLE 12:
PIN 1. INPUT
2. OUTPUT
3. NC
4. OUTPUT
STYLE 13:
PIN 1. GATE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
1
A = Assembly Location
Y = Year
W = Work Week
XXXXX = Specific Device Code
G= PbFree Package
GENERIC
MARKING DIAGRAM*
AYW
XXXXXG
G
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98ASB42680B
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 2 OF 2
SOT223 (TO261)
© Semiconductor Components Industries, LLC, 2018 www.onsemi.com
www.onsemi.com
1
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