SUPPLEMENT
1/13/98 Publication# 21257 Rev: B Amendment/0
Issue Date: Decembe r 19 97
Am 29F200A Known Good D ie
2 Megabit (256 K x 8-Bit /128 K x 16- Bit)
CMOS 5.0 Volt-only, Sectored Flash Memory—Die Revision 1
DISTINCTIVE CHARACTERISTICS
■5.0 V ± 10% for read and write operations
— Minimizes system level power requirements
■High performance
— 90 or 120 ns access time
■Low power consumption
— 20 mA typical active read current (byte mode)
— 28 mA typical active read current for
(word mode)
— 30 mA typical program/erase current
— 1 µA typical standby current
■Sector erase architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and
three 64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and
three 32 Kword sectors (word mode)
— Supports full chip erase
— Sector Protection features:
A hardware method of lock ing a sector to
prev ent any program or erase operations within
that sector
Sectors can be locked via programming
equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
■Top or bottom boot block configurations
available
■Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically
writes and veri fies data at specified addresses
■Minimum 100,000 write/erase cycles guar anteed
■Compatible w ith JEDEC standards
— Pinout and software compatible with
single-power-supply flash
— Superior inadvertent wr ite protection
■Data# Polling and Toggle Bit
— Detects program or erase cycle completion
■Ready/Busy# output (RY/BY#)
— Hardware method for detection of program or
erase cycle completion
■Erase Suspend/Resume
— Supports reading data from a sector not being
erased
■Hardware RESET# pin
— Resets internal state machine to the reading
array data
■Tested to datasheet specifications at
temperature
■Quality and reliability levels equivalent t o
standard packaged components
2 Am29F200A Known Good Die 1/13/98
SUPPLEMENT
GENERAL DESCRIPTION
The Am29F 200A in Known Good Die (KGD ) form is a
2 Mbit, 5.0 Volt-only Flash memory. AMD defines KGD
as standard product in die form , tested for functionality
and speed. AMD KGD products have the same reli-
ability and quality as AMD products in packaged form.
Am29F200A Features
The Am29F200A is organized as 262,144 bytes of 8
bits each or 131,072 words of 16 bits each. The 8-bit
data appears on DQ0-DQ7; the 16-bit data appears on
DQ0-DQ15. This device is desi gned to be programmed
in-system with the standard system 5.0 Volt V CC sup-
ply. A 12.0 vol t VPP is not required for program or erase
operations.
The standard Am29F200A in KGD form offers an ac-
cess time of 90 or 120 ns, allowing high-speed micro-
processors to operate without wait states. To eliminate
bus contention the device has separate chip enable
(CE#), write enable (WE#), and output enable (OE#)
controls.
The device r equires only a single 5.0 volt power sup-
ply for both read and w rite functions. Internally gener-
ated and regulated voltages are provided for the
program and erase operations.
The devic e is entir ely command set compatibl e with the
JEDEC single-power-supply F lash standard . Com-
mands are written to the command r egister using s tan-
dard microprocessor write timings. Register contents
serve as input to an internal state-machine that con-
trols the erase and programming circuitry. Write cycles
also internal ly latch addres ses and data needed for the
programming and erase operations. Reading data out
of the device is similar to reading from other Flash or
EPROM devices.
Device programming occurs by executing the program
command sequence. This initiates the Embedded
Program algorithm—an internal algorithm that auto-
matically times the program pulse widths and verifies
proper cell margin.
Device erasure occurs by executing the erase com-
mand seq uence . This in itiate s the Embedded Erase
algorithm—an internal algorithm that automatically
preprograms the array (if it is not already pro-
grammed) before executing the erase operation. Dur-
ing erase, the device automatically times the erase
pulse widths and verifies pr oper cell margin.
The host system can detect whether a program or
erase operation is complete by observing the RY/BY #
pin, or by reading the DQ7 (Data# Polling) and DQ6/
DQ2 (toggle) status bits. After a program or erase
cycle has been completed, the device is ready to read
array data or accept another command.
The sector erase architecture allows memor y sectors
to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully
erased when shipped from the factory.
Hardware data protection measures include a low
VCC detector that automatically inhibits write opera-
tions during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of mem-
ory. This can be achi eved via programming equipment.
The Erase Suspend feature enables the user to put
erase on hold for any period of time to read data from,
or program data to, any sector that is not selected for
erasure. T r ue bac kground er ase can thus be achieved.
The hardware RE SET# pin terminates any operation
in progress and resets the internal state machine to
reading array data. The RESET# pi n may be tied to the
system reset circuitr y. A system reset would thus also
reset the device, enabling the system microprocessor
to read the boot-up firmware from the Flash memory.
The system can place the device into the standby mode.
Power consumption is greatly r educed i n this mode.
AMD’s Flash tech nology com bines years of Fla sh mem-
ory manufacturing experience to produce the highest lev-
els of quality, reliability and cost ef fectiveness. The device
electrically erases a l l b i t s w it h i n a s e ct o r s i m ul t a -
n eou sl y v ia Fow le r-No rdheim t unnelin g. The dat a is
programmed using hot electron injection.
ELECTRICAL SPECIFICATIONS
Refer to the Am29F200A data sheet, publication
number 20380, for full electrical specifications on the
Am29F200A.
PRODUCT SELECTOR GUIDE
Family Part Number Am29F200A KGD
Speed Option (VCC = 5.0 V ± 10%) -90 -120
Max access time, ns (tACC) 90 120
Max CE# access time, ns (tCE) 90 120
Max OE# access time, ns (tOE)3550
1/13/98 Am29F200A Known G ood Die 3
SUPPLEMENT
DIE PHOTOGRAPH
DIE PAD LOCATIONS
Orientation relative
to top left corner of
Gel-Pak
Orientation relative
to leading edge of
tape and reel
123456789
10
11
12
13
14
15
16 17 18 19 20 21 22 23 24 25
28
29
AM D logo location
30
3435363738394041
31
32
33
26 27
42
4 Am29F200A Known Good Die 1/13/98
SUPPLEMENT
PAD DESCRI PTION
Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.
Pad Signal Pad Center (mils) Pad Center (millimeters)
XYXY
1V
CC 0.0 0.0 0.0000 0.0000
2DQ48.5–1.2 –0.2159 –0.0305
3 DQ12 –17.3 –1.2 –0.4394 –0.0305
4 DQ5 –26.1 –1.2 –0.6629 –0.0305
5 DQ13 –34.9 –1.2 –0.8865 –0.0305
6 DQ6 –43.6 –1.2 –1.1074 –0.0305
7 DQ14 –52.4 –1.2 –1.3310 –0.0305
8 DQ7 –61.2 –1.2 –1.5545 –0.0305
9 DQ15/A-1 –69.9 –1.2 –1.7755 –0.0305
10 VSS –80.2 2.7 –2.0371 0.0686
11 BYTE# –82.3 –13.5 –2.0904 –0.3429
12 A16 –82.3 –24.1 –2.0904 –0.6121
13 A15 –82.3 –128.4 –2.0904 –3.2614
14 A14 –82.3 –138.7 –2.0904 –3.5230
15 A13 –82.3 –150.0 –2.0904 –3.8100
16 A12 –68.2 –150.0 –1.7323 –3.8100
17 A11 –57.9 –150.0 –1.4707 –3.8100
18 A10 –47.6 –150.0 –1.2090 –3.8100
19 A9 –36.7 –150.0 –0.9322 –3.8100
20 A8 –26.4 –150.0 –0.6706 –3.8100
21 WE# –16.1 –150.0 –0.4089 –3.8100
22 RESET# –5.2 –150.0 –0.1321 –3.8100
23 RY/BY# 26.1 –150.0 0.6629 –3.8100
24 A7 50.2 –150.0 1.2751 –3.8100
25 A6 60.5 –150.0 1.5367 –3.8100
26 A5 70.8 –150.0 1.7983 –3.8100
27 A4 81.1 –150.0 2.0599 –3.8100
28 A3 91.4 –150.0 2.3216 –3.8100
29 A2 91.5 –138.7 2.3241 –3.5230
30 A1 91.5 –128.4 2.3241 –3.2614
31 A0 91.5 –24.1 2.3241 –0.6121
32 CE# 91.5 –13.6 2.3241 –0.3454
33 VSS 91.1 1.8 2.3139 0.0457
34 OE# 79.8 –0.7 2.0269 –0.0178
35 DQ0 70.0 –1.2 1.7780 –0.0305
36 DQ8 61.3 –1.2 1.5570 –0.0305
37 DQ1 52.5 –1.2 1.3335 –0.0305
38 DQ9 43.7 –1.2 1.1100 –0.0305
39 DQ2 34.9 –1.2 0.8865 –0.0305
40 DQ10 26.2 –1.2 0.6655 –0.0305
41 DQ3 17.4 –1.2 0.4420 –0.0305
42 DQ11 8.6 –1.2 0.2184 –0.0305
1/13/98 Am29F200A Known G ood Die 5
SUPPLEMENT
ORDERING INFORM ATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is
form ed by a combination of the following:
Valid Combinations
Valid Combinations list configurations planned to be sup-
port ed in vol ume f or th is device. Consul t the local AMD sales
off ice to confirm avai lability of specific valid combinations and
to check on new ly released combinations.
Am29F200A
DEVICE NUMBER/DESCRIPTION
Am29F200A Known Good Die
2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS Flash M emory—Die R evision 1
5.0 Volt-only Read, Program, and Erase
-90
SPEED OPTION
See Valid Combinations
PACKAGE TYPE AND
MINIMUM ORDER QUANTITY
DP = Waffle Pack
245 die per 5 tray stack
DG = Gel-Pak® Die Tray
486 die per 6 tray stack
DT = Surftape™ (Tape and Reel)
2500 per 7-inch reel
DW = Gel-Pak® W afer Tray (sawn wafer on frame)
Call AMD sales office fo r minim u m order
quantity
TEMPERATURE RANGE
C = Commercial (0 °C to +70°C)
I=Industr ial ( –40°C to + 85 °C)
E = Extended (–55°C to +125 °C)
DP C1
DIE REVISION
This numbe r ref ers to th e speci fic AMD m anufacturi ng
process and product technology reflected in this
document. It is entered in the revision field of AMD
standard product nomenclature.
T
BOOT CODE SECTOR ARCHITECTURE
T = Top sector
B = Bottom sector
Valid Combinations
Am29F200AT-90,
Am29F200AB-90 DPC 1, DPI 1, DPE 1,
DGC 1, DGI 1, DGE 1,
DTC 1, DTI 1, DTE 1,
DWC 1, DWI 1, DWE 1
Am29F200AT-120,
Am29F200AB-120
6 Am29F200A Known Good Die 1/13/98
SUPPLEMENT
PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good
Die test fl ow. For more detailed information, refer to the
Am29F200A product qualification database supple-
ment for KGD. AMD impl ements quality assurance pro-
cedures throughout the product test flow. In addition,
an off-line quality monitoring program (QMP) further
guarantees AMD quality standards are met on K nown
Good Die products. These QA procedures also allow
AMD to produce KGD products without requiring or
implementing burn-in.
Figure 1. AMD KGD Product Test Flow
Wafer Sort 1
Bake
24 hours at 250°C
Wafer Sort 2
Wafer Sort 3
High Temperature
Packaging for Shipment
Shipment
DC Parameters
Functionality
Programmability
Erasability
Data Retention
DC Parameters
Functionality
Programmability
Erasability
DC Para mete rs
Functionality
Programmability
Erasability
Speed
Incoming Inspection
Wafer Saw
Die Sepa ration
100% Visual Inspection
Die Pack
1/13/98 Am29F200A Known G ood Die 7
SUPPLEMENT
PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . 191 mils x 174 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . .4 .85 mm x 4.42 mm
Die Thickness . . . . . . . . . . . . . . . . . . . . . . . .~20 mils
Bond Pad Size . . . . . . . . . . . . . . 4.55 mils x 4.55 mils
. . . . . . . . . . . . . . . . . . . . . . . . . . 115.6 µm x 115.6 µm
Pad Area Free of Passivation . . . . . . . . . .20.70 mils2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13,363 µm2
Pads Per D i e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Bond Pad Metalization . . . . . . . . . . . . . . . . . . Al/Cu/Si
Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal,
may be grounded (optional)
Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
DC OPERATING CONDITIONS
VCC (Supply Voltage). . . . . . . . . . . . . . .4.5 V to 5.5 V
Junction Temperature Under Bias . .TJ (max) = 130°C
Operating Temperature
Commerci al . . . . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended . . . . . . . . . . . . . . . . . . –55°C to +125°C
MANUFACTURIN G INFORMATIO N
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . .FASL
Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SDC
Manufacturing ID (Top Boot) . . . . . . . . . . . .98483AK
(Bottom Boot) . . . . . . . .98483ABK
Preparation for Shipment . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . CS29AF
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
SPECIAL HAND LING INSTR UCTION S
Processing
Do not expose KGD products to ultraviolet light or
process them at temperatures greater than 250°C.
Failure to adhere to these handling instructions will
result in irreparable damage to the devices. For best
yield, AMD recommends assembly in a Class 10K
clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30°C in a ni trogen-
purged cabinet or vacuum-sealed bag. Observe all
standard ESD handling procedures.
8 Am29F200A Known Good Die 1/13/98
SUPPLEMENT
TERMS AND CONDITIONS OF SALE FOR
AMD NON-VOLATILE MEMORY DIE
All transactions relating to AMD Products under this
agreement shall be subject to AMD’s standard terms
and conditions of sale, or any revisions thereof, which
revisions AMD reserves the right to make at any time
and from time to time. In the event of conflict between
the provi sions of AMD’s standard terms and conditions
of sale and this agreement, the terms of this agreement
shall be controlling.
AMD warrants articles of its manufacture against
defective materials or workmanship for a period of
ninety (90) days from date of shipment. T his warranty
does not extend beyond AMD’s customer, and does
not extend to die which has been affixed onto a board
or subs trate of any kind. The liabil ity of AMD under this
warranty is limited, at AMD ’s option, solely to repair or
to replacement with equivalent articles, or to make an
appropriate credit adj ustment not to exceed the original
sales pr ice, for articles returned to AMD, provided that:
(a) The Buyer promptly notifies AMD in writing of each
and every defect or nonconformity in any article for
which Buyer wishes to make a w arranty claim against
AMD; (b) Buyer obtains authorization from AMD to
return the article; (c) the article is returned to AMD,
transportation charges paid by AMD, F .O.B. AMD’s fac-
tory; and (d) AMD’s examination of such article dis-
closes to its satisfaction that such alleged defect or
nonconformity actually exists and was not caused by
negligence, misuse, improper installation, accident or
unauthori zed repai r or alteration by an entity other than
AMD. The aforementioned provisions do not extend
the original warranty period of any article which has
either been repaired or replaced by AMD.
THIS WARRANTY IS EXPRESSED IN LIEU OF ALL
OTHER WARRANTIES, EXPRESSED OR IMPLIED,
INCLUDIN G THE IMPLIED W ARRANTY OF FITNESS
FOR A PARTICULAR PURPOSE, THE IMPLIED
WARRANTY OF MERCHANTABILITY AND OF ALL
OTHER OBLIGATIONS OR LIABILITIES ON AMD’S
PART, AND IT NEITHER ASSUMES NOR AUTHO-
RIZES ANY OTHER PERSON TO ASSUME FOR
AMD ANY OTHER LIABILITIES. THE FOREGOING
CONSTITUTES THE BUYERS SOLE AND EXCLU-
SIVE REMEDY FOR THE FURNISHING OF DEFEC-
TIVE OR NO N CONFO RMING ARTICLES AN D AMD
SHALL NOT IN ANY EVENT BE LIABLE FOR
DAMAGES BY REASON OF FAILURE OF ANY
PRODU CT TO FUNCTION PROPERLY OR FOR ANY
SPECIAL, INDIRECT, CONSEQUENTIAL, INCI-
DENTAL OR EXEMPLARY DAMAGES, INCLUDING
BUT NOT LIMITED TO, LOSS OF PROFITS, LOSS
OF USE OR COST OF LABOR BY REASON OF THE
FACT THAT SUCH ARTICLES SHALL HAVE BEEN
DEFECTIVE OR NON CONFORMING.
Buyer agrees that it will make no warranty representa-
tions to its customers which exceed those given by
AMD to Buyer unless and until Buyer shall agree to
indemnify AMD in writing for any claims which exceed
AMD’s warranty. Buyer assumes all responsibility for
successful die prep, die attach and wire bonding pro-
cesses. Due to the unprotected nature of the AMD
Products which are the subject hereof, AMD assumes
no responsibility for environmental effects on die.
AMD products are not designed or authorized for use
as components in life support appliances, devices or
systems where malfunction of a product can reason-
ably be expected to result in a personal injury. Buyer’s
use of AMD products for use in life support appli cations
is at Buyer’s own risk and Buyer agrees to fully indem-
nify AMD for any damages resulting in such use or
sale.
REVISION SU MM ARY FOR AM29F2 00A
KNOWN GOOD DIE
Formatted to match current template. Updated Distinc-
tive Characteristics and General Description sections
using the current main data sheet.
Trademarks
Copyright © 1998 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be tradem arks of their respective companies.
