TD62008APG/AFG TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62008APG,TD62008AFG 7CH DARLINGTON SINK DRIVER The TD62008APG / AFG are high-voltage, high-current darlington drivers comprised of seven NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads and protective diodes against a negative input voltage. The TD62008APG / AFG are suitable for interfaces from minus and plus dual supply voltage system to plus single supply voltage system. Applications include relay, hammer, lamp and display (LED) drivers. Please observe the thermal condition for using. This devices are a product for the Pb free(Sn-Ag). TD62008APG TD62008AFG FEATURES Output current (single output) 400 mA (Max) High sustaining voltage output 50 V (Min) Output clamp diodes Protective diodes against a negative input voltage Inputs base resistor RIN = 20 k Inputs compatible with 9~15 V PMOS, CMOS. Package type-AP : DIP-16 pin Package type-F, AF : SOP-16 pin PIN CONNECTION (TOP VIEW) Weight DIP16-P-300-2.54A : 1.11 g (Typ.) SOP16-P-225-1.27 : 0.16 g (Typ.) SCHEMATICS (EACH DRIVER) Note: 1 The input and output parasitic diodes cannot be used as clamp diodes. 2005-02-28 TD62008APG/AFG MAXIMUM RATINGS (Ta = 25C) CHARACTERISTIC Output Sustaining Voltage SYMBOL RATING UNIT VCE (SUS) -0.5 ~ 50 V Output Current IOUT 400 mA / ch Input Voltage VIN -40 ~ 40 V Clamp Diode Reverse Voltage VR 50 V 400 mA Clamp Diode Forward Current Power Dissipation IF AP F / AF PD 1.47 0.625 (Note) W Operating Temperature Topr -40 ~ 85 C Storage Temperature Tstg -55 ~ 150 C Note: On Glass Epoxy PCB (30 x 30 x 1.6 mm Cu 50%) RECOMMENDED OPERATING CONDITIONS (Ta = -40 ~ 85C) CHARACTERISTIC SYMBOL Output Sustaining Voltage CONDITION VCE (SUS) MIN TYP. MAX UNIT 0 50 V DC 1 Circuit, Tpw = 25%, Duty = 40% 0 400 Tpw = 25 ms, Duty = 10%, 7 Circuits 0 200 VIN -35 35 V Clamp Diode Reverse Voltage VR 50 V Clamp Diode Forward Current IF 400 mA 0.52 0.325 Output Current IOUT Input Voltage Power Dissipation Note: AP AF PD Ta = 85C (Note) mA W On Glass Epoxy PCB (30 x 30 x 1.6 mm Cu 50%) 2 2005-02-28 TD62008APG/AFG ELECTRICAL CHARACTERISTICS (Ta = 25C) SYMBOL TEST CIR- CUIT ICEX 1 Collector-Emitter Saturation Voltage VCE (sat) 2 "H" Level IIN (ON) 4 "L" Level IIN (OFF) CHARACTERISTIC Output Leakage Current TEST CONDITION MIN TYP. MAX UNIT VOUT = 50 V 100 A IOUT = 400 mA 1.3 2.4 IOUT = 200 mA 1.0 1.6 VIN = 18 V 0.85 1.8 VIN = 35 V 3.8 4 VIN = -35 V -20 hFE 3 VCE = 4 V, IOUT = 350 mA 1000 3000 Clamp Diode Reverse Current IR 5 VR = 50 V, VR = 35 V (Type-F) 100 A Clamp Diode Forward Voltage VF 6 IF = 400 mA 1.5 2.4 V Turn-On Delay tON VOUT = 50 V, RL = 156 0.1 s 7 CL = 15 pF VOUT = 50 V, RL = 156 0.2 s Input Current DC Current Transfer Ratio Turn-Off Delay tOFF 3 V mA A 2005-02-28 TD62008APG/AFG TEST CIRCUIT 1. ICEX 2. VCE (sat) 3. hFE 4. IIN (ON), IIN (OFF) 5. IR 6. VF 7. tON, tOFF Note 1: Pulse Width 50 s Duty Cycle 10% Output Impedance 50 tr 5 ns, tf 10 ns Note 2: CL includes probe and jig capacitance PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. 4 2005-02-28 TD62008APG/AFG Type-APG Free Air Type-AFG Free Air Type-APG On Glass Epoxy PCB 30x30x16mm Cu 50% 5 2005-02-28 TD62008APG/AFG PACKAGE DIMENSIONS DIP16-P-300-2.54A Unit : mm Weight: 1.11 g (Typ.) 6 2005-02-28 TD62008APG/AFG PACKAGE DIMENSIONS SOP16-P-225-1.27 Unit : mm Weight: 0.16 gTyp.) 7 2005-02-28 TD62008APG/AFG About solderability, following conditions were confirmed * Solderability (1) Use of Sn-63Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux RESTRICTIONS ON PRODUCT USE 030619EBA * The information contained herein is subject to change without notice. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 8 2005-02-28