TD62008APG/AFG
2005-02-28
1
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
TD62008APG,TD62008AFG
7CH DARLINGTON SINK DRIVER
The TD62008APG / AFG are high−voltage, high−current
darlington drivers comprised of seven NPN darlington pairs.
All units feature integral clamp diodes for switching inductive
loads and protective diodes against a negative input voltage.
The TD62008APG / AFG are suitable for interfaces from minus
and plus dual supply voltage system to plus single supply voltage
system.
Applications include relay, hammer, lamp and display (LED)
drivers.
Please observe the thermal condition for using.
This devices are a product for the Pb free(Sn-Ag).
FEATURES
Output current (single output) 400 mA (Max)
High sustaining voltage output 50 V (Min)
Output clamp diodes
Protective diodes against a negative input voltage
Inputs base resistor RIN = 20 kΩ
Inputs compatible with 9~15 V PMOS, CMOS.
Package type−AP : DIP−16 pin
Package type−F, AF : SOP−16 pin
PIN CONNECTION (TOP VIEW) SCHEMATICS
(EACH DRIVER)
Note: The input and output parasitic diodes cannot
be used as clamp diodes.
Weight
DIP16−P−300−2.54A : 1.11 g (Typ.)
SOP16−P−225−1.27 : 0.16 g (Typ.)
TD62008APG
TD62008AFG
TD62008APG/AFG
2005-02-28
2
MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC SYMBOL RATING UNIT
Output Sustaining
Voltage VCE (SUS) −0.5 ~ 50 V
Output Current IOUT 400 mA / ch
Input Voltage VIN −40 ~ 40 V
Clamp Diode Reverse
Voltage VR 50 V
Clamp Diode Forward Current IF 400 mA
AP 1.47
Power Dissipation
F / AF
PD 0.625 (Note)
W
Operating Temperature Topr −40 ~ 85 °C
Storage Temperature Tstg −55 ~ 150 °C
Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
RECOMMENDED OPERATING CONDITIONS (Ta = −40 ~ 85°C)
CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT
Output Sustaining
Voltage VCE (SUS) 0 ― 50 V
DC 1 Circuit, Tpw = 25%, Duty = 40% 0 ― 400
Output Current IOUT Tpw = 25 ms, Duty = 10%, 7 Circuits 0 ― 200
mA
Input Voltage VIN −35 ― 35 V
Clamp Diode Reverse
Voltage VR ― ― 50 V
Clamp Diode Forward Current IF ― ― 400 mA
AP ― ― 0.52
Power Dissipation
AF
PD Ta = 85°C (Note) ― ― 0.325
W
Note: On Glass Epoxy PCB (30 × 30 × 1.6 mm Cu 50%)
TD62008APG/AFG
2005-02-28
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ELECTRICAL CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC SYMBOL
TEST
CIR−
CUIT
TEST CONDITION MIN TYP. MAX UNIT
Output Leakage
Current ICEX 1 VOUT = 50 V ― ― 100 µA
IOUT = 400 mA ― 1.3 2.4
Collector−Emitter Saturation Voltage VCE (sat) 2
IOUT = 200 mA ― 1.0 1.6
V
VIN = 18 V ― 0.85 1.8
“H” Level IIN (ON) 4
VIN = 35 V ― ― 3.8
mA
Input Current
“L” Level IIN (OFF) 4 VIN = −35 V ― ― −20 µA
DC Current Transfer Ratio hFE 3 VCE = 4 V, IOUT = 350 mA 1000 3000 ―
Clamp Diode Reverse Current IR 5 VR = 50 V, VR = 35 V (Type−F) ― ― 100 µA
Clamp Diode Forward Voltage VF 6 IF = 400 mA ― 1.5 2.4 V
Turn−On Delay tON VOUT = 50 V, RL = 156 Ω ― 0.1 ― µs
Turn−Off Delay tOFF
7 CL =
15 pF
VOUT = 50 V, RL = 156 Ω ― 0.2 ― µs
TD62008APG/AFG
2005-02-28
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TEST CIRCUIT
1. ICEX 2. VCE (sat) 3. hFE
4. IIN (ON), IIN (OFF) 5. IR 6. VF
7. tON, tOFF
PRECAUTIONS for USING
This IC does not include built-in protection circuits for excess current or overvoltage.
If this IC is subjected to excess current or overvoltage, it may be destroyed.
Hence, the utmost care must be taken when systems which incorporate this IC are designed.
Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed
due to short−circuit between outputs, air contamination fault, or fault by improper grounding.
Note 1: Pulse Width 50 µs
Duty Cycle 10%
Output Impedance 50 Ω
tr ≤ 5 ns, tf ≤ 10 ns
Note 2: CL includes probe and jig capacitance
TD62008APG/AFG
2005-02-28
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① Type-APG Free Air
② Type-AFG Free Air
③ Type-APG On Glass Epoxy
PCB 30x30x16mm Cu 50%
TD62008APG/AFG
2005-02-28
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PACKAGE DIMENSIONS
DIP16−P−300−2.54A Unit : mm
Weight: 1.11 g (Typ.)
TD62008APG/AFG
2005-02-28
7
PACKAGE DIMENSIONS
SOP16−P−225−1.27 Unit : mm
Weight: 0.16 gTyp.)
TD62008APG/AFG
2005-02-28
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About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-63Pb solder Bath
· solder bath temperature
= 230°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature
= 245°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
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devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
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conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
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(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
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030619EBA
RESTRICTIONS ON PRODUCT USE
