250-0587-00 - FLIR Systems, Inc

www.teledynerelays.com 116C/1203/Q1

ESTABLISHED RELIABILITY

SERIES

116C

CENTIGRID®

ESTABLISHED RELIABILITY

RELAY

DPDT

CMOS COMPATIBLE

DESCRIPTION

The 116C Centigrid®relay is an ultraminiature, hermetically sealed, armature

relay capable of being directly driven by most IC logic families. Its low profile

height and .100" grid spaced terminals, which preclude the need for spreader

pads, make it ideal for applications where extreme packaging density and/or

close PC board spacing are required.

The basic concept and internal mechanical structure are similar to the 114

DPDT relay. The following unique construction features and manufacturing

techniques provide overall high reliability and excellent resistance to

environmental extremes:

• All welded construction.

• Unique uni-frame design providing high magnetic efficiency and mechanical

rigidity.

• High force/mass ratios for resistance to shock and vibration.

• Advanced cleaning techniques provide maximum assurance of internal

cleanliness.

• Precious metal alloy contact material with gold plating assures excellent

high current and dry circuit switching capabilities.

By virtue of its inherently low intercontact capacitance and contact circuit

losses, the 116C relay has proven to be an excellent ultraminiature RF switch

for frequency ranges well into the UHF spectrum. A typical RF application for

this Centigrid®relay is in handheld radio transceivers, wherein the combined

features of good RF performance, small size, low coil power dissipation and

high reliability make it a preferred method of Transmit-Receive switching (see

Figure 1).

The Series 116C utilizes an internal silicon diode for coil suppression, a Zener

diode to protect the MOSFET gate input, and an N-channel enhancement

mode MOSFET chip, which enables direct relay interfacing with most

Microprocessor and IC logic families (CMOS, TTL and MOS).

INTERNAL CONSTRUCTION

SERIES

DESIGNATION RELAY TYPE

116C DPDT general-purpose relay with internal power MOSFET driver, Zener

diode gate protection, and diode coil suppression

UPPER

STATIONARY

CONTACT

LOWER

STATIONARY

CONTACT

MOVING CONTACT

UNI-FRAME

ARMATURE

ENVIRONMENTAL AND

PHYSICAL SPECIFICATIONS

Temperature

(Ambient) –65°C to +125°C

Vibration

(General Note 1) 30 g’s to 3000 Hz

Shock

(General Note 1)

75 g’s,

6 msec, half-sine

Acceleration 50 g’s

Enclosure Hermetically sealed

Weight 0.11 oz. (3.12g) max.

www.teledynerelays.com 116C/1203/Q1

ESTABLISHED RELIABILITY

SERIES 116C

GENERAL ELECTRICAL SPECIFICATIONS (–65°C to +125°C unless otherwise noted) (Notes 2 & 3)

DETAILED ELECTRICAL SPECIFICATIONS (–65°C to +125°C unless otherwise noted) (Note 3)

Contact Arrangement 2 Form C (DPDT)

Rated Duty Continuous

Contact Resistance 0.1 ohm max. before life; 0.2 ohm max. after life at 1A/28Vdc (measured 1/8" from header)

Contact Load Ratings (DC)

(See Fig. 2 for other DC

resistive voltage/current ratings)

Resistive: 1 Amp/28Vdc

Inductive: 200 mA/28Vdc (320 mH)

Lamp: 100 mA/28Vdc

Low Level: 10 to 50 μA/10 to 50mV

Contact Load Ratings (AC) Resistive: 250 mA/115Vac, 60 and 400 Hz (Case not grounded)

100 mA/115Vac, 60 and 400 Hz (Case grounded)

Contact Life Ratings

10,000,000 cycles (typical) at low level

1,000,000 cycles (typical) at 0.5A/28Vdc resistive

100,000 cycles min. at all other loads specified above

Contact Overload Rating 2A/28Vdc Resistive (100 cycles min.)

Contact Carry Rating Contact factory

Operate Time 2.5 msec max. at nominal rated coil voltage

Release Time 4.0 msec max.

Contact Bounce 1.5 msec max.

Intercontact Capacitance 0.4 pf typical

Insulation Resistance 10,000 megohms min. between mutually isolated terminals

Dielectric Strength Atmospheric pressure: 500 Vrms/60Hz 70,000 ft.: 125 Vrms/60Hz

Negative Coil Transient (Vdc) 1.0 max

Diode P.I.V. (Vdc) 100 min.

Zener Voltage (Vdc) 17 min. to 23 max.

Zener Leakage Current (AμA @ 15.2 Vdc) 2.5 max

Power FET

Characteristics

–65°C to +125°C

Gate Voltage to Turn Off (Vdc, Max.) 0.5

Gate Voltage to Turn On (Vdc, Max.) 3.8 (Note 4)

Drain-Source Voltage (Vdc, Max.) 55

BASE PART

NUMBERS

(See Note 8 for full P/N example)

116C-5 116C-6 116C-9 116C-12 116C-18 116C-26

Coil Voltage (Vdc) Nom. 5.0 6.0 9.0 12.0 18.0 26.5

Max. 5.6 8.0 12.0 16.0 24.0 32.0

Coil Current (mAdc @25°C) Max. 132.3 83.9 47.1 36.1 24.1 19.9

Min. 96.5 60.3 33.1 24.9 16.1 12.9

Nominal Coil Operating Power @ 25°C (Milliwatts) 641 462 368 369 368 450

Pick-up Voltage (Vdc) (Note 4) Max. 4.0 4.9 7.3 9.8 14.6 19.5

Drop-out Voltage (Vdc)

(Note 4)

Min. 0.13 0.18 0.27 0.36 0.54 0.72

Max. 2.3 3.2 4.9 6.5 9.8 13.0

PERFORMANCE CURVES

(NOTE 2)

.01 0.5 .1 .5 1.0

FREQUENCY (GHz)

FIGURE 1

TYPICAL RF PERFORMANCE

INSERTION LOSS

ISOLATION ACROSS CONTACTS

ISOLATION ACROSS POLES

1.92

1.22

1.07

1.02

1.01

1.00

VSWR

300

250

200

150

100

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0

LOAD CURRENT (AMPS DC)

FIGURE 2

TYPICAL DC CONTACT RATING (RESISTIVE)

LOAD VOLTAGE (VDC)

RETURN LOSS (VSWR)

www.teledynerelays.com 116C/1203/Q1

ESTABLISHED RELIABILITY

CASE DETAIL

.335 MAX.

(8.51) .435 MAX.

(11.05) .375 MAX.

(9.53)

.275 MAX.

(6.99)

.75 MIN.

(19.05)

.100 ±.010

(2.54 ±.25)

TYP

.017 (.43) DIA.

+.002 (.051)

±.001 (.043)

9 LEADS DIMENSIONS ARE SHOWN IN INCHES (MILLIMETERS)

TERMINAL LOCATIONS

(Viewed from Terminals; Numbers for Reference Only)

.031 ±.003

(.79 ±.08)

.035 ±.010

(.89 ±.25)

.475 MAX.

(12.06)

.200 ±.010

(5.08 ±0.25)

910

OUTLINE DIMENSIONS

GENERAL NOTES

1. Relay contacts will exhibit no chatter in excess of 10 μsec or

transfer in excess of 1 μsec.

2. “Typical” characteristics are based on available data and are best

estimates. No on-going verification tests are performed.

3. Unless otherwise specified, parameters are initial values.

4. Maximum rated gate voltage = 15 Vdc.

5. Unless otherwise specified, relays will be supplied with either gold

plated or solder coated leads.

6. The slash and character appearing after the slash are not marked

on the relay.

7. Screened HI-REL versions available. Contact factory.

Logic element

1 = 3.8 to 15Vdc

0 = 0.5Vdc min.

Pin10

Pin 9

Pin 1

Vcc

Notes:

Logic 1 activates the relay.

Logic 0 de-activates the relay.

Vcc = logic bias power.

Vr = coil energization voltage.

SCHEMATIC DIAGRAM

TYPICAL CMOS INTERFACE CIRCUIT

DC Logic Voltage Supply

Teledyne Part Numbering System for

T2R

®Established Reliability Relay

ER 116C Z M9 - 26 A / S Q

Established Reliability

Designator

Pad Option

(See Appendix)

Relay Series

Ground Pin Option

(See Appendix)

Q= Solder Coated Leads

G= Gold Plated Leads

(Notes 5 and 6)

S= 0.187" leads

(Note 6)

Coil Voltage

Screening and Reliability

Level

Teledyne Part Numbering System for Military Qualified (JAN) Relays

J 116C Z M9 - 26 L

Military (JAN)

Designator

Pad Option

(See Appendix)

Relay Series

Ground Pin Option

(See Appendix) Coil Voltage

Screening and Reliability

Level

SCHEMATIC IS VIEWED FROM TERMINALS

PIN 1: + SUPPLY

PIN 9: – SUPPLY

PIN 10: GATE

SERIES 116C

Pad designation and

bottom view dimensions Height For use with the following: Dim. H

Max.

“M4” Pad for TO-5

ER411T

ER412, ER412D, ER412DD .295 (7.49)

712, 712D, 712TN,

RF300, RF310, RF320 .300 (7.62)

ER420, ER422D, ER420DD, 421,

ER421D, ER421DD, ER422, ER422D,

ER422DD, 722, 722D, RF341

.305 (7.75)

ER431T, ER432T,

ER432, ER432D, ER432DD .400 (10.16)

732, 732D, 732TN, RF303, RF313,

RF323 .410 (10.41)

RF312 .350 (8.89)

“M4” Pad for TO-5

ER411, ER411D, ER411DD .295 (7.49)

ER431, ER431D, ER431DD .400 (10.16)

RF311 .300 (7.62)

RF331 .410 (10.41)

“M4” Pad for Centigrid®

172, 172D .305 (7.75)

ER114, ER114D, ER114DD,

J114, J114D, J114DD .300 (7.62)

ER134, ER134D, ER134DD,

J134, J134D, J134DD .400 (10.16)

RF100 .315 (8.00)

RF103 .420 (10.67)

“M9” Pad for Centigrid®

122C, A152 .320 (8.13)

ER116C, J116C .300 (7.62)

ER136C, J136C .400 (10.16)

RF180 .325 (8.25)

A150 .305 (7.75)

Notes:

1. Spacer pad material: Polyester  lm.

2. To specify an “M4” or “M9” spacer pad, refer to the mounting variants portion of the part numbering

example in the applicable datasheet.

3. Dimensions are in inches (mm).

4. Unless otherwise speci ed, tolerance is ± .010 (.25).

5. Add 10 m to the contact resistance show in the datasheet.

6. Add 0.01 oz. (0.25 g) to the weight of the relay assembly shown in the datasheet.

Ø.150

[3.81]

(REF)

Dim H

MAX

Dim H

MAX

Dim H

MAX

.156

[3.96]

(REF)

.256

[6.5]

(REF)

Dim H

MAX

Appendix A: Spacer Pads

Pad designation and

bottom view dimensions Height For use with the following: Dim. H

Max.

“M” Pad 5/ 6/

ER411T, J411T, ER412, ER412D

ER412DD, J412, J412D, J412DD

ER412T, J412T

.388 (9.86)

712, 712D, 712TN .393 (9.99)

ER431T, J431T, ER432, ER432D

ER432DD, J432, J432D, J432DD

ER432T, J432T

.493 (12.52)

732, 732D, 732TN .503 (12.78)

ER420, J420, ER420D, J420D

ER420DD, J420DD, ER421, J421

ER421D, J421D, ER421DD

J422D, ER422DD, J422DD, 722

.398 (10.11)

“M2” Pad 7/ 8/

ER411T

ER412, ER412D, ER412DD

J412, J412D, J412DD

.441 (11.20)

712, 712D .451 (11.46)

ER421, ER421D, ER421DD

722, 732D .451 (11.46)

ER431T

ER432, ER432D, ER432DD .546 (13.87)

732, 732D .556 (14.12)

“M3” Pad 5/ 6/ 9/

ER411, ER411D, ER411DD

ER411TX

ER412X, ER412DX, ER412DDX

ER412TX

.388 (9.86)

712X, 712DX, 712TNX .393 (9.99)

ER420X, ER420DX, ER420DDX

ER421X, ER421DX, ER421DDX

ER422X, ER422DX

ER422DDX, 722X, 722DDX

.398 (10.11)

ER431, ER431D, ER431DD

ER431TX

ER432X, ER432DX, ER432DDX

ER432TX

.493 (12.52)

732X, 732DX, 732TNX .503 (12.78)

Notes:

1. Spreader pad material: Diallyl Phthalate.

2. To specify an “M”, “M2” or “M3” spreader pad, refer to the mounting variants portion of the part number example

in the applicable datasheet.

3. Dimensions are in inches (mm).

4. Unless otherwise speci ed, tolerance is ± .010” (0.25).

5/. Add 25 m to the contact resistance shown in the datasheet.

6/. Add .01 oz. (0.25 g) to the weight of the relay assembly shown in the datasheet.

7/. Add 50 m to the contact resistance shown in the datasheet.

8/. Add 0.025 oz (0.71 g) to the weight of the relay assembly shown in the datasheet.

9/. M3 pad to be used only when the relay has a center pin (e.g. ER411M3-12A, 722XM3-26.)

.370 [9.4]

MAX SQ

.150

[3.81]

.100

[2.54]

.200

[5.08]

.300

[7.62]

.100

[2.54]

Dim H

MAX

.370

[9.4]

MIN

.014

[0.36]

(REF)

.390 [9.91]

.300

[7.62]

.100

[2.54]

.300

[7.62]

.100

[2.54] .150

[3.81]

.150

[3.81]

.130

[3.3]

Dim H

MAX

.370 [9.4]

MAX SQ

.150

[3.81]

.100

[2.54]

.200

[5.08]

.300

[7.62]

.100

[2.54]

Dim H

MAX

.370

[9.4]

MIN

.014

[0.36]

(REF)

Appendix A: Spreader Pads

.100

[2.54]

.100

[2.54]

.100

[2.54]

"Y" POSITION

"Z" POSITION

.100

[2.54]

.100

[2.54]

.100

[2.54]

"W" POSITION

"U" POSITION

(ER116C and ER136C only)

"X" POSITION

"Z" POSITION

"Y" POSITION

.050

[1.27]

36°±3°

Ø.200

[Ø5.08]

"Z" POSITION

"Y" POSITION

"X" POSITION

45°±3°

"Z" POSITION

"Y" POSITION

Ø.200

[Ø5.08]

Centigrid® Relays:

RF100, RF103, ER114, ER134, 172

Centigrid® Relays:

RF180, ER116C, 122C, ER136C

TO-5 Relays:

ER411T, ER412, ER412T, ER420, ER421, ER422,

ER431T, ER432, ER432T, 712, 712TN, 400H, 400K,

400V, RF300, RF303, RF341, RF312, RF310, RF313,

RF320, RF323

TO-5 Relays:

ER411, ER431, RF311, RF331

NOTES

1. Terminal views shown

2. Dimensions are in inches (mm)

3. Tolerances: ± .010 (±.25) unless otherwise speci ed

4. Ground pin positions are within .015 (0.38) dia. of true position

5. Ground pin head dia., 0.035 (0.89) ref: height 0.010 (0.25) ref.

6. Lead dia. 0.017 (0.43) nom.

Indicates ground pin position

Indicates glass insulated lead position

Indicates ground pin or lead position

depending on relay type

Appendix A: Ground Pin Positions