Product family data sheet
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
WWW.CREE.COM/XLAMP
CLD-DS39 REV 7G
Cree® XLamp® ML-B LEDs
PRODUCT DESCRIPTION
The Cree XLamp® ML-B LED
brings lighting-class reliability and
performance to 1/4-watt LEDs. The
XLamp ML-B LED expands Cree’s
lighting-class leadership to linear and
distributed lighting applications. With
XLamp LED lighting-class reliability, a
wide viewing angle, uniform light output,
and industry-leading chromaticity
binning in a 3.5-mm X 3.5-mm package,
the XLamp ML-B LED continues
Cree’s history of segment-focused
product innovation in LEDs for lighting
applications.
The XLamp ML-B LED brings high
performance and a smooth look to a
wide range of lighting applications,
including linear lighting, uorescent
retrots and retail-display lighting.
FEATURES
• Available in white (2200K and
2600K to 8300K CCT) and 80-, 85-
and 90-CRI minimum
• ANSI-compatible sub-bins
• Maximum drive current: 175mA
• 120° viewing angle, uniform
chromaticity prole
• Electrically neutral thermal path
• RoHS and REACh compliant
• UL® recognized component
(E349212)
TABLE OF CONTENTS
Characteristics ......................................... 2
Flux Characteristics ................................. 2
Relative Spectral Power Distribution ...... 3
Relative Flux vs. Junction Temperature .. 3
Electrical Characteristics ......................... 4
Relative Flux vs. Current .......................... 4
Typical Spatial Distribution ...................... 5
Thermal Design ........................................ 5
Reow Soldering Characteristics ............ 6
Notes ........................................................ 7
Mechanical Dimensions .......................... 9
Tape and Reel ......................................... 10
Packaging ............................................... 11
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
2
XLamp® mL-B LED
CHARACTERISTICS
Characteristics Unit Minimum Typical Maximum
Thermal resistance, junction to solder point °C/W 25
Viewing angle (FWHM) degrees 120
Temperature coefcient of voltage mV/°C -3.5
ESD classication (HBM per Mil-Std-883D) Class 2
DC forward current mA 175
Reverse voltage V 5
Forward voltage (@ 80mA) V 3.3 3.5
LED junction temperature °C 150
FLUX CHARACTERISTICS (TJ=25°C)
The following table provides several base order codes for XLamp ML-B LEDs. It is important to note that the base order codes listed here
are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-
code nomenclature, please consult the XLamp ML LED Family Binning and Labeling document.
Color
CCT Range Minimum Luminous Flux
(lm) @ 80mA Order Code
Min. Max. Group Flux (lm)
Cool White 4500 K 8300 K J0 23.5 MLBAWT-A1-0000-000W51
Warm White
3700 K 4300 K
J0 23.5 MLBAWT-A1-0000-000WE5
H0 18.1 MLBAWT-A1-0000-000VE5
2800 K 3200 K
J0 23.5 MLBAWT-A1-0000-000WE7
H0 18.1 MLBAWT-A1-0000-000VE7
2000 K 2400 K G0 13.9 MLBAWT-A1-0000-000UEA
80-CRI
Warm White
3700 K 4300 K H0 18.1 MLBAWT-H1-0000-000VE5
2800 K 3200 K H0 18.1 MLBAWT-H1-0000-000VE7
85-CRI Warm
White
3700 K 4300 K H0 18.1 MLBAWT-P1-0000-000VE5
2800 K 3200 K H0 18.1 MLBAWT-P1-0000-000VE7
90-CRI Warm
White
3700 K 4300 K H0 18.1 MLBAWT-U1-0000-000VE5
2800 K 3200 K H0 18.1 MLBAWT-U1-0000-000VE7
Notes:
• Cree maintains a tolerance of ±7% on ux measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2% for CRI
measurements. See the Measurements section (page 7).
• Typical CRI for Cool White (4300K – 8300K CCT) is 75.
• Typical CRI for Warm White (2600K – 4300K CCT) is 80.
• Minimum CRI for 80-CRI White is 80.
• Minimum CRI for 85-CRI White is 85.
• Minimum CRI for 90-CRI White is 90.
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
3
XLamp® mL-B LED
RELATIVE SPECTRAL POWER DISTRIBUTION
RELATIVE FLUX VS. JUNCTION TEMPERATURE (IF=80mA)
Relative Spectral Power
ML-B OK
0
20
40
60
80
100
380 430 480 530 580 630 680 730 780
Relative Radiant Power (%)
Wavelength (nm)
5000 K - 8300 K CCT
3500 K - 5000 K CCT
2600 K - 3500 K CCT
Relative Flux Output vs. Junction Temperature
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
25 50 75 100 125 150
Relative Luminous Flux
Junction Temperature (ºC)
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
4
XLamp® mL-B LED
ELECTRICAL CHARACTERISTICS (TJ=25°C)
RELATIVE FLUX VS. CURRENT (TJ=25°C)
Electrical Characteristics (Tj = 25ºC) ML-B Good
0
20
40
60
80
100
120
140
160
180
2.50 2.75 3.00 3.25 3.50 3.75 4.00
Forward Current (mA)
Forward Voltage (V)
Relative Intensity vs. Current (Tj = 25ºC)
0%
20%
40%
60%
80%
100%
120%
140%
160%
180%
200%
025 50 75 100 125 150 175
Relative Luminous Flux
Forward Current (mA)
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
5
XLamp® mL-B LED
TYPICAL SPATIAL DISTRIBUTION
THERMAL DESIGN
The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end
product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life
and optical characteristics.
Typical Spatial Radiation Pattern
0
20
40
60
80
100
-90 -70 -50 -30 -10 10 30 50 70 90
Relative Luminous Intensity (%)
Angle (º)
Thermal Design
0
20
40
60
80
100
120
140
160
180
200
020 40 60 80 100 120 140 160
Maximum Current (mA)
Ambient Temperature (ºC)
Rj-a = 30°C/W
Rj-a = 40°C/W
Rj-a = 50°C/W
Rj-a = 60°C/W
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
6
XLamp® mL-B LED
REFLOW SOLDERING CHARACTERISTICS
In testing, Cree has found XLamp ML-B LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general
guideline, Cree recommends that users follow the recommended soldering prole provided by the manufacturer of the solder paste used.
Note that this general guideline may not apply to all PCB designs and congurations of reow soldering equipment.
Profile Feature Lead-Free Solder
Average Ramp-Up Rate (Tsmax to Tp) 1.2°C/second
Preheat: Temperature Min (Tsmin) 120 °C
Preheat: Temperature Max (Tsmax)170 °C
Preheat: Time (tsmin to tsmax)65-150 seconds
Time Maintained Above: Temperature (TL)217 °C
Time Maintained Above: Time (tL)45-90 seconds
Peak/Classication Temperature (Tp) 235 - 245 °C
Time Within 5°C of Actual Peak Temperature (tp) 20-40 seconds
Ramp-Down Rate 1 - 6 °C/second
Time 25°C to Peak Temperature 4 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Note: While the high reow temperatures (above) have been approved, Cree’s best practice guideline for reow is to use as low a
temperature as possible during the reow soldering process for these LEDs.
IPC/JEDEC J-STD-020C
TP
TL
Temperature
Time
t 25˚C to Peak
Preheat
ts
tS
tP
25
Ramp-down
Ramp-up
Critical Zone
TL to TP
Tsmax
Tsmin
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
7
XLamp® mL-B LED
NOTES
Measurements
The luminous ux, radiant power, chromaticity, forward voltage and CRI measurements in this document are binning specications only
and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number
of factors that are not within Cree’s control and are not intended or provided as operational specications for the products. Calculated
values are provided for informational purposes only and are not intended as specications.
Pre‑Release Qualication Testing
Please read the LED Reliability Overview for details of the qualication process Cree applies to ensure long-term reliability for XLamp
LEDs and details of Cree’s pre-release qualication testing for XLamp LEDs.
Lumen Maintenance
Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance.
For information on the specic LM-80 data sets available for this LED, refer to the public LM-80 results document.
Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting.
Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect
the LED junction temperature.
Moisture Sensitivity
Cree recommends keeping XLamp ML-B LEDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to
soldering. Unopened MBPs that contain XLamp LEDs do not need special storage for moisture sensitivity.
Once the MBP is opened, XLamp ML-B LEDs should be handled and
stored as MSL 2a per JEDEC J-STD-033, meaning they have limited
exposure time before damage to the LED may occur during the soldering
operation. The table on the right species the maximum exposure time
in days depending on temperature and humidity conditions. LEDs with
exposure time longer than the specied maximums must be baked
according to the baking conditions listed below.
Baking Conditions
It is not necessary to bake all XLamp ML-B LEDs. Only the LEDs that meet all of the following criteria must be baked:
1. LEDs that have been removed from the original MBP.
2. LEDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above.
3. LEDs that have not been soldered.
Temp. Maximum Percent Relative Humidity
30% 40% 50% 60% 70% 80% 90%
35 ºC - - - 17 1 .5 .5
30 ºC - - - 28 111
25 ºC - - - - 2 1 1
20 ºC - - - - 2 1 1
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
8
XLamp® mL-B LED
LEDs should be baked at 70ºC for 24 hours. LEDs may be baked on the original reels. Remove LEDs from the MBP before baking. Do
not bake parts at temperatures higher than 70ºC. This baking operation resets the exposure time as dened in the Moisture Sensitivity
section above.
Storage Conditions
XLamp ML-B LEDs that have been removed from the original MBP but not soldered should be stored in one of the following ways:
• Store the parts in a rigid metal container with a tight-tting lid. Verify that the storage temperature is <30°C, and place fresh desiccant
and an RH indicator in the container to verify that the RH is no greater than 60%.
• Store the parts in a dry, nitrogen-purged cabinet or container that actively maintains the temperature at <30° and the RH at no greater
than 60%.
• For short-term store only: LEDs can be resealed in the original MBP soon after opening. Fresh desiccant may be needed. Use the
included humidity indicator card to verify <60% RH.
If an environment of <60% RH is not available for storage, XLamp ML-B LEDs should be baked (described above) before reow soldering.
RoHS Compliance
The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold
limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as
implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product
Documentation sections of of www.cree.com.
REACh Compliance
REACh substances of very high concern (SVHCs) information is available for this product. Since the European Chemical Agency (ECHA)
has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to
insure you get the most up-to-date REACh SVHC Declaration. REACh banned substance information (REACh Article 67) is also available
upon request.
UL® Recognized Component
Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a re and electrical enclosure per ANSI/
UL 8750.
Vision Advisory
WARNING. Do not look at exposed LED lamps in operation. Eye injury can result. For more information about LEDs and eye safety, please
refer to the LED Eye Safety application note.
NOTES - CONTINUED
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
9
XLamp® mL-B LED
MECHANICAL DIMENSIONS (TA=25°C)
All measurements are ±.13mm unless otherwise indicated.
Recommended FR4 Solder Pad
MX3535 Pad Layout
Top View
Bottom View Side View
Top View
Recommended MCPCB Solder Pad Alternative Solder Pad
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
10
XLamp® mL-B LED
TAPE AND REEL
All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard.
Except as noted, all dimensions in mm.
Loaded Pockets
(1,000 Lamps)
Leader
400mm (min) of
empty pockets with
at least 100mm
sealed by tape
(50 empty pockets min.)
Trailer
160mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
START
END
Cathode Side
Anode Side
(denoted by + and circle)
160.0
A
A
B
2.5
±.1
SECTION A-A
SCALE 2 : 1
1.5
±.1
8.0
±.1
4.0
±.1
1.75
±.10
12.0 .0
+
.3
DETAIL B
SCALE 2 : 1
13
mm
7"
Cover Tape
Pocket Tape
User Feed Direction
User Feed Direction
(8 )
(1.75 )
(4 )
(Ø1.5)
(1.65)
Trailer Loaded Pockets Leader
160 mm (min) of
empty pockets
sealed with tape
(20 pockets min.)
400 mm (min) of
empty pockets with
at least 100 mm
sealed by tape
(50 empty pockets min.)
(1,400 pcs /Reel
CATHODE SIDE
ANODE SIDE
Cathode Mark
Copyright © 2010-2017 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are registered trademarks and the Cree logo is a trademark of
Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
11
XLamp® mL-B LED
PACKAGING
Patent Label
(on bottom of box)
Label with Cree Bin Code,
Quantity, Reel ID
Label with Cree Bin
Code, Quantity, Reel ID
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Order Code,
Quantity, Reel ID, PO #
Label with Cree Bin Code,
Quantity, Reel ID
Unpackaged Reel
Packaged Reel
Boxed Reel
CREE Bin Code
& Barcode Label
Vacuum-Sealed
Moisture Barrier Bag
Label with Customer
P/N, Qty, Lot #, PO #
Label with Cree Bin
Code, Qty, Lot #
Label with Cree Bin
Code, Qty, Lot #
Vacuum-Sealed
Moisture Barrier Bag
Patent Label
Label with Customer Order
Code, Qty, Reel ID, PO #
Humidity Indicator Card
(inside bag)
Dessicant
(inside bag)