IXD_609 9-Ampere Low-Side Ultrafast MOSFET Drivers Features Description * 9A Peak Source/Sink Drive Current * Wide Operating Voltage Range: 4.5V to 35V * -40C to +125C Extended Operating Temperature Range * Logic Input Withstands Negative Swing of up to 5V * Matched Rise and Fall Times * Low Propagation Delay Time * Low, 10A Supply Current * Low Output Impedance The IXDD609/IXDI609/IXDN609 high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. The IXD_609 high-current output can source and sink 9A of peak current while producing voltage rise and fall times of less than 25ns. The input is CMOS compatible, and is virtually immune to latch up. Proprietary circuitry eliminates cross-conduction and current "shoot-through." Low propagation delay and fast, matched rise and fall times make the IXD_609 family ideal for high-frequency and high-power applications. Applications * * * * * * Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver Pb RoHS 2002/95/EC e3 The IXDD609 is configured as a non-inverting driver with an enable, the IXDN609 is configured as a non-inverting driver, and the IXDI609 is configured as an inverting driver. The IXD_609 family is available in a standard 8-pin DIP (PI); 8-lead SOIC (SIA); 8-lead SOIC with an exposed, grounded metal back (SI); an 8-lead DFN (D2) package; and a 5-pin TO-263 package. Ordering Information Part Number IXDD609D2TR IXDD609SI IXDD609SITR IXDD609SIA IXDD609SIATR IXDD609PI IXDD609YI IXDI609SI IXDI609SITR IXDI609SIA IXDI609SIATR IXDI609PI IXDI609YI IXDN609SI IXDN609SITR IXDN609SIA IXDN609SIATR IXDN609PI IXDN609YI DS-IXD_609-R00D Logic Configuration IN OUT EN IN OUT IN OUT Package Type Packing Method Quantity 8-Lead DFN 8-Lead SOIC with Exposed Grounded Metal Back 8-Lead SOIC with Exposed Grounded Metal Back 8-Lead SOIC 8-Lead SOIC 8-Pin DIP 5-Pin TO-263 8-Lead SOIC with Exposed Grounded Metal Back 8-Lead SOIC with Exposed Grounded Metal Back 8-Lead SOIC 8-Lead SOIC 8-Pin DIP 5-Pin TO-263 8-Lead SOIC with Exposed Grounded Metal Back 8-Lead SOIC with Exposed Grounded Metal Back 8-Lead SOIC 8-Lead SOIC 8-Pin DIP 5-Pin TO-263 Tape & Reel Tube Tape & Reel Tube Tape & Reel Tube Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tube Tape & Reel Tube Tape & Reel Tube Tube 2000 100 2000 100 2000 50 50 100 2000 100 2000 50 50 100 2000 100 2000 50 50 PRELIMINARY 1 IXD_609 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 3 4 4 5 5 2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.1 IXDD609 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 IXDI609 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.3 IXDN609 Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.4 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 6 6 7 7 3. Performance Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 R00D PRELIMINARY 2 IXD_609 1 Specifications 1.1 Pin Configurations 1.2 Pin Definitions IXDD609 D2 / PI / SI / SIA IXDD609 YI Pin Name VCC 1 8 VCC IN 2 7 OUT EN 3 6 OUT GND 4 5 GND VCC 1 OUT 2 GND 3 IN 4 EN 5 IXDI609 PI / SI / SIA VCC 1 8 VCC IN 2 7 OUT NC 3 6 OUT GND 4 5 GND VCC 1 2 GND 3 IN 4 NC 5 IXDN609 PI / SI / SIA VCC 1 8 VCC IN 2 7 OUT NC 3 6 OUT 4 5 GND GND IN Logic Input EN Output Enable - Drive pin low to disable output, and force output to a high impedance state OUT Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT OUT Inverted Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT VCC Supply Voltage - Provides power to the device GND Ground - Common ground reference for the device IXDI609 YI OUT Description NC Not connected IXDN609 YI VCC 1 OUT 2 GND 3 IN 4 NC 5 1.3 Absolute Maximum Ratings Parameter Symbol Minimum Maximum Units Supply Voltage VCC All Other Pins - - 40 V -0.3 VCC+0.3 Output Current IOUT V - 9 A Junction Temperature TJ -55 +150 C Storage Temperature TSTG -65 +150 C Unless stated otherwise, absolute maximum electrical ratings are at 25C Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. R00D PRELIMINARY 3 IXD_609 1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range Symbol Minimum Maximum Units VCC 4.5 35 V TA -40 +125 C 1.5 Electrical Characteristics Test Conditions: TA=25C, 4.5V < VCC < 35V. Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 - VIN -5 - VCC+0.3 Input Current 0V < VIN < VCC IIN -10 - 10 EN Input Voltage, High IXDD609 only VENH 2/3VCC - - EN Input Voltage, Low IXDD609 only VENL - - 1/3VCC Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - 0.6 1 Output Resistance, Low State VCC=18V, IOUT=10mA ROL - 0.4 0.8 IDC - - 2 Input Voltage Range Units V A V V Rise Time Limited by package power dissipation CLOAD=10nF, VCC=18V tR - 22 45 Fall Time CLOAD=10nF, VCC=18V tF - 15 40 On-Time Propagation Delay CLOAD=10nF, VCC=18V tONDLY - 37 50 Off-Time Propagation Delay CLOAD=10nF, VCC=18V tOFFDLY - 38 50 Enable to Output-High Delay Time IXDD609 only tENOH - 35 50 Disable to High Impedance State Delay Time IXDD609 only tDOLD - 70 80 - REN - 200 - k - 1 3 mA - - 10 - - 10 Output Current, Continuous Enable Pull-Up Resistor VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V VCC=18V, VIN=VCC 4 PRELIMINARY ICC A ns A R00D IXD_609 1.6 Electrical Characteristics Test Conditions: TA=-40C to +125C, 4.5V < VCC < 35V, TJ<150C. Parameter Conditions Symbol Minimum Typical Maximum Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - Input Voltage, Low 4.5V < VCC < 18V VIL - - 0.8 - VIN -5 - VCC+0.3 0V < VIN < VCC IIN -10 - 10 Output Voltage, High - VOH VCC-0.025 - - Output Voltage, Low - VOL - - 0.025 Output Resistance, High State VCC=18V, IOUT=-10mA ROH - - 2 Output Resistance, Low State VCC=18V, IOUT=10mA ROL - - 1.5 IDC - - 1 tR - - 60 Input Voltage Range Input Current Rise Time Limited by package power dissipation CLOAD=10nF, VCC=18V Fall Time CLOAD=10nF, VCC=18V tF - - 60 On-Time Propagation Delay CLOAD=10nF, VCC=18V tONDLY - - 55 Off-Time Propagation Delay CLOAD=10nF, VCC=18V tOFFDLY - - 40 IXDD609 only tENOH - - 60 IXDD609 only tDOLD - - 100 - 1 3 - - 10 - - 10 Output Current, Continuous Enable to Output-High Delay Time Disable to High Impedance State Delay Time VCC=18V, VIN=3.5V Power Supply Current VCC=18V, VIN=0V ICC VCC=18V, VIN=VCC Units V A V A ns mA A 1.7 Thermal Characteristics Package Parameter D2 (8-Lead DFN) 125 JA 85 SIA (8-Lead SOIC) 120 YI (5-Lead TO-263) 46 R00D Units 35 PI (8-Lead DIP) SI (8-Lead SOIC with Exposed Metal Back) Rating PRELIMINARY C/W 5 IXD_609 2 Functional Description 2.1 IXDD609 Functional Block Diagram 2.3 IXDN609 Functional Block Diagram IXDD609 IXDN609 VCC VCC IN OUT OUT IN GND EN GND IN EN OUT IN OUT 0 1 or open 0 0 0 1 1 or open 1 1 1 0 0 Z 1 0 Z 2.2 IXDI609 Functional Block Diagram IXDI609 VCC OUT IN GND 6 IN OUT 0 1 1 0 PRELIMINARY R00D IXD_609 2.4 Timing Diagrams VIH IN VIH IN VIL tONDELAY VIL tOFFDELAY tOFFDELAY tONDELAY 90% OUT OUT 10% 90% 10% tF tR tF tR 2.5 Characteristics Test Diagram EN OUT + 0.1F 10F IN VCC - VCC GND CLOAD VIN R00D PRELIMINARY Tektronix Current Probe 6302 7 IXD_609 3 Performance Data Rise Time vs. Supply Voltage (Input=0-5V, f=10kHz, TA=25C) 60 CL=10nF CL=5.4nF CL=1.5nF 50 40 30 20 30 20 10 0 0 5 10 15 20 25 Supply Voltage (V) 30 CL=10nF CL=5.4nF CL=1.5nF 40 10 0 35 5 10 15 20 25 Supply Voltage (V) VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 40 30 Fall Time (ns) Rise Time (ns) 50 20 4000 6000 8000 Load Capacitance (pF) 40 30 0 20 40 60 80 Temperature (C) 100 120 140 20 150 tOFFDLY tONDLY 10000 0 2000 4000 6000 8000 Load Capacitance (pF) Propagation Delay vs. Input Voltage (VIN=5V, f=1kHz, CL=5.4nF, VCC=12V) 180 160 tONDLY 140 120 100 80 tOFFDLY 60 40 20 30 Input Threshold Voltage vs. Temperature (CL=2.5nF, VCC=18V) 50 tOFFDLY 45 40 tONDLY 35 30 2 35 10000 Propagation Delay vs. Junction Temperature (f=1kHz, CL=5.4nF, VCC=18V) 55 0 10 15 20 25 Supply Voltage (V) 4 6 8 Input Voltage (V) 10 -40 -20 12 Input Threshold vs. Supply Voltage 0 20 40 60 80 Temperature (C) 100 120 140 Enable Threshold vs. Supply Voltage 3.5 25 2.7 2.6 2.5 Min VIH 2.4 2.3 2.2 2.1 Max VIL 2.0 3.0 Enable Threshold (V) Input Threshold (V) Input Threshold Voltage (V) -40 -20 35 Propagation Delay (ns) Propagation Delay vs. Supply Voltage (Input=0-5V, f=1kHz, CL=5.4nF) Propagation Delay (ns) Propagation Delay (ns) 2000 0 Min VIH 2.5 Max VIL 2.0 1.5 1.0 1.9 -40 -20 8 30 0 0 2.8 6 10 0 5 tF 7 VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=25V VCC=30V VCC=35V 50 10 0 8 60 60 50 tR 9 Fall Time vs. Load Capacitance Rise Time vs. Load Capacitance 100 10 5 0 70 200 11 50 Fall Time (ns) Rise Time (ns) 60 Rise and Fall Times vs. Temperature (Input=0-5V, f=10kHz, CL=2.5nF, VCC=18V) Rise & Fall Times (ns) 70 Fall Time vs. Supply Voltage (Input=0-5V, f=10kHz, TA=25C) 0 20 40 60 80 Temperature (C) 100 120 140 20 Min VENH 15 Max VENL 10 5 0 0 5 10 15 20 25 Supply Voltage (V) PRELIMINARY 30 35 0 5 10 15 20 25 Supply Voltage (V) 30 35 R00D IXD_609 300 200 100 0 1000 150 100 50 150 100 50 0 1000 10000 10000 Load Capacitance (pF) Supply Current vs. Frequency (VCC=18V) Supply Current vs. Frequency (VCC=12V) Supply Current vs. Frequency (VCC=8V) 1000 1 1000 CL=10nF CL=5.4nF CL=1.5nF 100 10 1 10 100 1000 Frequency (kHz) 10000 1 10 100 1000 Frequency (kHz) 1.0 0.8 0.6 0.4 0.2 VIN=0V & 18V 0 1 0.1 20 40 60 80 Temperature (C) 10000 1 10 100 1000 Frequency (kHz) 10000 0.60 0.55 0.50 0.45 0.40 0.35 -40 -20 100 120 140 Output Source Current vs. Supply Voltage (f=422Hz, CL=66nF) -5 -10 -15 -20 -25 0 20 40 60 80 Temperature (C) 100 120 140 Output Sink Current vs. Supply Voltage (f=422Hz, CL=66nF) 30 Output Sink Current (A) 0 Source Current (A) 0.65 VIN=3.5V VIN=5V VIN=10V 1.2 Supply Current (mA) Supply Current (mA) 1.4 -40 -20 10 Dynamic Supply Current vs. Temperature (VIN=5V, f=1kHz, CL=1.5nF, VCC=18V) Quiescent Supply Current vs. Temperature 0.0 CL=10nF CL=5.4nF CL=1.5nF 100 0.01 0.1 0.1 25 20 15 10 5 0 -30 0 R00D f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz Load Capacitance (pF) 10 1 Supply Current vs. Load Capacitance (VCC=8V) Load Capacitance (pF) CL=10nF CL=5.4nF CL=1.5nF 100 200 0 1000 10000 Supply Current (mA) Supply Current (mA) 1000 200 f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz 250 Supply Current (mA) 400 300 Supply Current vs. Load Capacitance (VCC=12V) Supply Current (mA) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz f=1kHz Supply Current (mA) Supply Current (mA) 500 Supply Current vs. Load Capacitance (VCC=18V) 5 10 15 20 25 Supply Voltage (V) 30 35 0 PRELIMINARY 5 10 15 20 25 Supply Voltage (V) 30 35 9 IXD_609 Output Source Current vs. Temperature (f=422Hz, CL=66nF, VCC=18V) 14.0 Output Sink Current (A) Output Source Current (A) -9.0 -9.5 -10.0 -10.5 -11.0 -11.5 -12.0 13.5 13.0 12.5 12.0 11.5 11.0 10.5 10.0 -40 -20 0 20 40 60 80 Temperature (C) 100 120 140 -40 -20 20 40 60 80 Temperature (C) 100 120 140 1.1 Output Resistance () 1.5 Output Resistance () 0 Low State Output Resistance at +10mA vs. Supply Voltage High State Output Resistance at -10mA vs. Supply Voltage 1.0 0.5 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.0 0 10 Output Sink Current vs. Temperature (f=422Hz, CL=66nF, VCC=18V) 5 10 15 20 25 Supply Voltage (V) 30 35 0 PRELIMINARY 5 10 15 20 25 Supply Voltage (V) 30 35 R00D IXD_609 4 Manufacturing Information 4.1 Mechanical Dimensions 4.1.1 8-Pin SOIC - IXD_609SIA 0.10 / 0.25 (0.004 / 0.010) 1.27 (0.050) 0.40 / 1.27 (0.016 / 0.050) 3.80 / 4.00 (0.150 / 0.157) 5.80 / 6.20 (0.228 / 0.244) 5.40 (0.213) 1.55 (0.061) PIN 1 0.31 / 0.51 (0.012 / 0.020) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45 (0.010 / 0.020 x45) 0.60 (0.024) 0 / 8 4.80 / 5.00 (0.190 / 0.197) Recommended PCB Land Pattern Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 0.10 / 0.25 (0.004 / 0.010) 1.30 / 1.75 (0.051 / 0.069) NOTE: Molded package conforms to JEDEC standard configuration MS-012 variation AA. 4.1.2 8-Pin SOIC - IXD_609SI 3.80 (0.150) 0.10 / 0.25 (0.004 / 0.010) 0.40 / 1.27 (0.016 / 0.050) 3.80 / 4.00 (0.150 / 0.157) 5.80 / 6.20 (0.228 / 0.244) 5.40 2.75 (0.209) (0.108) 1.55 (0.061) PIN 1 0.31 / 0.51 (0.012 / 0.020) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45 (0.010 / 0.020 x45) 1.27 (0.050) 0.60 (0.024) 0 / 8 4.80 / 5.00 (0.190 / 0.197) Recommended PCB Land Pattern 0.03 / 0.10 (0.001 / 0.004) 1.30 / 1.75 (0.051 / 0.069) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 2.29 / 2.79 (0.090 / 0.110) 3.30 / 3.81 (0.130 / 0.150) R00D NOTE: Molded package conforms to JEDEC standard configuration MS-012 variation BA. PRELIMINARY 11 IXD_609 4.1.3 8-Pin DFN - IXD_609D2 5.00 BSC (0.197 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.20 REF (0.008 REF) Pin 1 4.00 BSC (0.158 BSC) 0.35 x 45 (0.014 x 45) 0.95 (0.037) 4.50 (0.177) 3.05 (0.120) 0.45 (0.018) 0.00 / 0.05 (0.000 / 0.002) 2.55 (0.100) 1.20 (0.047) 0.76 / 0.81 (0.030 / 0.032) Recommended PCB Land Pattern 3.04 / 3.09 (0.120 / 0.122) 0.30 / 0.45 (0.012 / 0.018) 0.95 BSC (0.037 BSC) Pin 1 0.35 / 0.45 x 45 (0.014 / 0.018 x 45) Pin 8 Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 2.54 / 2.59 (0.100 / 0.102) 4.1.4 8-Pin DIP - IXD_609PI 9.02 / 10.16 (0.355 / 0.400) 0.20 / 0.38 (0.008 / 0.015) 6.10 / 6.86 (0.240 / 0.270) 7.62 BSC (0.300 BSC) 2.540 BSC (0.100 BSC) 0.38 / 1.02 (0.015 / 0.040) 7.37 / 8.26 (0.290 / 0.325) 3.05 / 3.81 (0.120 / 0.150) 7.62 / 10.92 (0.300 / 0.430) 8-0.900 DIA. (8-0.035 DIA.) 2.540 (0.100) 7.50 (0.295) 1.40 (0.055) PC Board Pattern 3.43 / 4.70 (0.135 / 0.185) Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 1.14 / 1.65 (0.045 / 0.065) 0.38 / 0.58 (0.015 / 0.023) 12 3.18 / 3.81 (0.125 / 0.150) NOTE: Molded package conforms to JEDEC standard configuration MS-001 variation BA. PRELIMINARY R00D IXD_609 4.1.5 5-Pin TO-263 - IXD_609YI 1.00 / 1.40 (0.039 / 0.055) 9.65 / 10.30 (0.380 / 0.406) 8.80 / 9.50 (0.346 / 0.374) 1 2 3 4 5 1.20 / 1.40 (0.047 / 0.055) 4.20 / 4.80 (0.165 / 0.189) 10.40 (0.409) 9.15 (0.360) 3.65 (0.144) 14.80 / 15.80 (0.583 / 0.622) 6.35 (0.250) 1.70 BSC (0.067 BSC) 0.60 / 0.99 (0.024 / 0.039) Recommended PCB Pattern 3.85 (0.152) 0.40 / 0.70 (0.016 / 0.028) 1.70 (0.067) 1.05 (0.041) 2.24 / 2.84 (0.088 / 0.112) 7.50 / 8.20 (0.295 / 0.323) Optional 0 - 3 6.60 / 7.20 (0.260 / 0.283) 6 DIMENSIONS mm MIN / mm MAX (inches MIN / inches / MAX) 2.10 / 2.70 (0.083 / 0.106) 1.20 / 1.70 (0.047 / 0.067) NOTES: 1. All metal surfaces are solder solder-plated except trimmed area. 2. Short lead of No. 3 is optional to IXYS. 3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally. For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_609-R00D (c)Copyright 2010, Clare, Inc. All rights reserved. Printed in USA. 7/7/2010 R00D PRELIMINARY 13