2013-2018 Microchip Technology Inc. DS70005144G-page 1
dsPIC33EVXXXGM00X/10X FAMILY
Operating Conditions
• 4.5V to 5.5V, 0°C to +85°C, DC to 70 MIPS
• 4.5V to 5.5V, -40°C to +125°C, DC to 60 MIPS
• 4.5V to 5.5V, -40°C to +150°C, DC to 40 MIPS
Core: 16-Bit dsPIC33E CPU
• Code-Efficient (C and Assembly) Architecture
• 16-Bit Wide Data Path
• Two 40-Bit Wide Accumulators
• Single-Cycle (MAC/MPY) with Dual Data Fetch
• Single-Cycle, Mixed-Sign MUL plus Hardware
Divide
• 32-Bit Multiply Support
• Intermediate Security for Memory:
- Provides a Boot Flash Segment in addition to
the existing General Flash Segment
• Error Code Correction (ECC) for Flash
• Added Two Alternate Register Sets for Fast
Context Switching
Clock Management
• Internal, 15% Low-Power RC (LPRC) – 32 kHz
• Internal, 1% Fast RC (FRC) – 7.37 MHz
• Internal, 10% Backup FRC (BFRC) – 7.37 MHz
• Programmable PLLs and Oscillator Clock Sources
• Fail-Safe Clock Monitor (FSCM)
• Additional FSCM Source (BFRC), Intended to
Provide a Clock Fail Switch Source for the
System Clock
• Independent Watchdog Timer (WDT)
• System Windowed Watchdog Timer (DMT)
• Fast Wake-up and Start-up
Power Management
• Low-Power Management modes (Sleep, Idle
and Doze)
• Power Consumption Minimized Executing
NOP String
• Integrated Power-on Reset (POR) and Brown-out
Reset (BOR)
• 0.5 mA/MHz Dynamic Current (typical)
• 50 µA at +25°C I
PD
Current (typical)
PWM
• Up to Six Pulse-Width Modulation (PWM) Outputs
(three generators)
• Primary Master Time Base Inputs allow
Time Base Synchronization from Internal/External
Sources
• Dead Time for Rising and Falling Edges
• 7.14 ns PWM Resolution
• PWM Support for:
- DC/DC, AC/DC, inverters, Power Factor
Correction (PFC) and lighting
- Brushless Direct Current (BLDC), Permanent
Magnet Synchronous Motor (PMSM),
AC Induction Motor (ACIM), Switched
Reluctance Motor (SRM)
- Programmable Fault inputs
- Flexible trigger configurations for
Analog-to-Digital conversion
- Supports PWM lock, PWM output chopping
and dynamic phase shifting
Advanced Analog Features
• ADC module:
- Configurable as 10-bit, 1.1 Msps with
four S&H or 12-bit, 500 ksps with one S&H
- Up to 36 analog inputs
• Flexible and Independent ADC Trigger Sources
• Up to Four Op Amp/Comparators with Direct
Connection to the ADC module:
- Additional dedicated comparator and
7-bit Digital-to-Analog Converter (DAC)
- Two comparator voltage reference outputs
- Programmable references with 128 voltage
points
- Programmable blanking and filtering
• Charge Time Measurement Unit (CTMU):
- Supports mTouch
®
capacitive touch sensing
- Provides high-resolution time
measurement (1 ns)
- On-chip temperature measurement
- Temperature sensor diode
- Nine sources of edge input triggers (CTED1,
CTED2, OCPWM, TMR1, SYSCLK, OSCLK,
FRC, BFRC and LPRC)
16-Bit, 5V Digital Signal Controllers with
PWM, SENT, Op Amps and Advanced Analog Features
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 2 2013-2018 Microchip Technology Inc.
Timers/Output Compare/Input Capture
• Nine General Purpose Timers:
- Five 16-bit and up to two 32-bit
timers/counters; Timer3 can provide ADC
trigger
• Four Output Compare modules Configurable as
Timers/Counters
• Four Input Capture modules
Communication Interfaces
• Two Enhanced Addressable Universal
Asynchronous Receiver/Transmitter (UART)
modules (6.25 Mbps):
- With support for LIN/J2602 bus and IrDA
®
- High and low speed (SCI)
• Two SPI modules (15 MHz):
- 25 MHz data rate without using PPS
•One I
2
C module (up to 1 Mbaud) with SMBus
Support
• Two SENT J2716 (Single-Edge Nibble
Transmission-Transmit/Receive) module for
Automotive Applications
• One CAN module:
- 32 buffers, 16 filters and 3 masks
Direct Memory Access (DMA)
• Four-Channel DMA with User-Selectable Priority
Arbitration
• UART, Serial Peripheral Interface (SPI), ADC,
Input Capture, Output Compare and Controller
Area Network (CAN)
Input/Output
• GPIO Registers to Support Selectable
Slew Rate I/Os
• Peripheral Pin Select (PPS) to allow Function
Remap
• Sink/Source: 8 mA or 12 mA, Pin-Specific for
Standard V
OH
/V
OL
• Selectable Open-Drain, Pull-ups and Pull-Downs
• Change Notice Interrupts on All I/O Pins
Qualification and Class B Support
• AEC-Q100 REVG (Grade 1: -40°C to +125°C)
Compliant
• AEC-Q100 REVG (Grade 0: -40°C to +150°C)
Compliant
• Class B Safety Library, IEC 60730
Class B Fault Handling Support
• Backup FRC
• Windowed WDT uses LPRC
• Windowed Deadman Timer (DMT) uses System
Clock (System Windowed Watchdog Timer)
• H/W Clock Monitor Circuit
• Oscillator Frequency Monitoring through CTMU
(OSCI, SYSCLK, FRC, BFRC, LPRC)
• Dedicated PWM Fault Pin
• Lockable Clock Configuration
Debugger Development Support
• In-Circuit and In-Application Programming
• Three Complex and Five Simple Breakpoints
• Trace and Run-Time Watch
2013-2018 Microchip Technology Inc. DS70005144G-page 3
dsPIC33EVXXXGM00X/10X FAMILY
dsPIC33EVXXXGM00X/10X PRODUCT FAMILIES
The device names, pin counts, memory sizes and peripheral availability of each device are listed in Tab le 1. The following pages show the devices’ pinout diagrams.
TABLE 1: dsPIC33EVXXXGM00X/10X FAMILY DEVICES
Device
Program M emory Bytes
SRAM Bytes
CAN
DMA Channels
16-Bit Timers (T1)
32-Bit Timers
Input Capture
Output Compare
PWM
UART
SPI
I2C
SENT
10/12-Bit ADC
ADC Inputs
Op Amp/Comparators
CTMU
Security
Peripheral Pin Select (PPS)
General Purpose I/O (GPIO)
External Interrupts
Pins
Packages
dsPIC33EV32GM002 32K 4K 0
4 5 2 4 4 3x2 2 2 1 2 1 11 3/4 1 Intermediate Y 21 3 28 SPDIP, SOIC,
SSOP, QFN-S
dsPIC33EV32GM102 1
dsPIC33EV64GM002 64K 8K 0
dsPIC33EV64GM102 1
dsPIC33EV128GM002 128K 8K 0
dsPIC33EV128GM102 1
dsPIC33EV256GM002 256K 16K 0
dsPIC33EV256GM102 1
dsPIC33EV32GM003 32K 4K 0
4 5 2 4 4 3x2 2 2 1 2 1 13 3/4 1 Intermediate Y 25 3 36 UQFN
dsPIC33EV32GM103 1
dsPIC33EV64GM003 64K 8K 0
dsPIC33EV64GM103 1
dsPIC33EV128GM003 128K 8K 0
dsPIC33EV128GM103 1
dsPIC33EV256GM003 256K 16K 0
dsPIC33EV256GM103 1
dsPIC33EV32GM004 32K 4K 0
4 5 2 4 4 3x2 2 2 1 2 1 24 4/5 1 Intermediate Y 35 3 44 TQFP, QFN
dsPIC33EV32GM104 1
dsPIC33EV64GM004 64K 8K 0
dsPIC33EV64GM104 1
dsPIC33EV128GM004 128K 8K 0
dsPIC33EV128GM104 1
dsPIC33EV256GM004 256K 16K 0
dsPIC33EV256GM104 1
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 4 2013-2018 Microchip Technology Inc.
dsPIC33EV32GM006 32K 4K 0
4 5 2 4 4 3x2 2 2 1 2 1 36 4/5 1 Intermediate Y 53 3 64 TQFP, QFN
dsPIC33EV32GM106 1
dsPIC33EV64GM006 64K 8K 0
dsPIC33EV64GM106 1
dsPIC33EV128GM006 128K 8K 0
dsPIC33EV128GM106 1
dsPIC33EV256GM006 256K 16K 0
dsPIC33EV256GM106 1
TABLE 1: dsPIC33EVXXXGM00X/10X FAMILY DEVICES (CONTINUED)
Device
Program Memory Bytes
SRAM Bytes
CAN
DMA Channels
16-Bit Timers (T1)
32-Bit Timers
Input Capture
Output Compare
PWM
UART
SPI
I2C
SENT
10/12-Bit ADC
ADC Inputs
Op Amp/Comparators
CTMU
Security
Peripheral Pin Select (PPS)
General Purpose I/O (GPIO)
External Interrupts
Pins
Packages
2013-2018 Microchip Technology Inc. DS70005144G-page 5
dsPIC33EVXXXGM00X/10X FAMILY
Pin Diagrams
28-Pin SPDIP/SOIC/SSOP
(1,2,3)
MCLR AVDD
AVSS
RPI47/PWM1L/T5CK/RB15
PGED3/OA2IN-/AN2/C2IN1-/SS1/RPI32/CTED2/RB0 RPI46/PWM1H/T3CK/RB14
RPI45/PWM2L/CTPLS/RB13
PGEC1/OA1IN+/AN4/C1IN3-/C1IN1+/C2IN3-/RPI34/RB2 RPI44/PWM2H/RB12
PGED1/OA1IN-/AN5/C1IN1-/CTMUC/RP35/RB3 RP43/PWM3L/RB11
RP42/PWM3H/RB10
OSC1/CLKI/AN32/RPI18/RA2 VCAP
OSC2/CLKO/RPI19/RA3 VSS
FLT32/RP36/RB4 OA5IN-/AN27/C5IN1-/ASDA1/SDI1/RP41/RB9
OA5IN+/AN24/C5IN3-/C5IN1+/RP20/T1CK/RA4 AN26/CV
REF1O
/ASCL1/SDO1/RP40/T4CK/RB8
VDD OA5OUT/AN25/C5IN4-/C4IN1+/SCK1/RP39/INT0/RB7
PGED2/SDA1/RP37/RB5 PGEC2/SCL1/RP38/RB6
VSS
OA2OUT/AN0/C2IN4-/C4IN3-/RPI16/RA0
OA2IN+/AN1/C2IN1+/RPI17/RA1
dsPIC33EV128GM002/102
dsPIC33EV64GM002/102
dsPIC33EV256GM002/102
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Note 1: The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See Section 1 1. 5 “Peripheral
Pin Select (PPS )” for available peripherals and information on limitations.
2: Every I/O port pin (RAx-RGx) can be used as a Change Notification pin (CNAx-CNGx). See Section 11.0 “I/O
Ports” for more information.
3: If the op amp is selected when OPAEN (CMxCON<10>) = 1, the OAx input is used; otherwise, the ANx input is
used.
dsPIC33EV32GM002/102
PGEC3/OA1OUT/AN3/C1IN4-/C4IN2-/RPI33/CTED1/RB1
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 6 2013-2018 Microchip Technology Inc.
Pin Diagrams (Continued)
28-Pin QFN-S
(1,2,3,4)
dsPIC33EV 64GM002/102
dsPIC33EV 128GM002/102
dsPIC33EV256GM002/102
28 27 26 25 24 23 22
89
10 11 12 13 14
3
18
17
16
15
4
5
7
1
220
19
6
21
OA5OUT/AN25/C5IN4-/C4IN1+/SCK1/RP39/INT0/RB7
PGEC2/SCL1/RP38/RB6
PGED2/SDA1/RP37/RB5
VDD
OA 5IN+/AN24/C5IN3-/C5 IN1+/RP20/T1CK/RA4
FLT32/RP36/RB4
RPI45/PWM2L/CTPLS/RB13
RPI44/PWM2H/RB12
RP43/PWM3L/RB11
RP42/PWM3H/RB10
V
CAP
V
SS
OA5IN-/AN27/C5IN1-/ASDA1/SDI1/RP41/RB9
RPI46/PWM1H/T3CK/RB14
RPI47/PWM1L/T5CK/RB15
AVSS
AVDD
MCLR
PGED3/OA2IN-/AN2/C21N1-/SS1/RPI32/CTED2/RB0
PGEC3/OA1OUT/AN3/C1IN4-/C4IN2-/RPI33/CTED1/RB1
V
SS
OSC1/CLKI/AN32/RPI18/RA2
OSC2/CLKO/RPI19/RA3
PGEC1/OA1IN+/AN4/C1IN3-/C1IN1+/C2IN3-/RPI34/RB2
PGED1/OA1IN-/AN5/C1IN1-/CTMUC/RP35/RB3
OA2OUT/AN0/C2IN4-/C4IN3-/RPI16/RA0
OA2IN+/AN1/C2IN1+/RPI17/RA1
AN26/CV
REF1O
/ASCL1/SDO1/RP40/T4CK/RB8
Note 1: The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See Section 11.5 “Peripheral
Pin Select (PPS)” for available peripherals and information on limitations.
2: Every I/O port pin (RAx-RGx) can be used as a Change Notification pin (CNAx-CNGx). See Section 11.0 “I/O
Ports” for more information.
3: If the op amp is selected when OPAEN (CMxCON<10>) = 1, the OAx input is used; otherwise, the ANx input is
used.
4: The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected to
V
SS
externally.
dsPIC33EV 32GM002/102
2013-2018 Microchip Technology Inc. DS70005144G-page 7
dsPIC33EVXXXGM00X/10X FAMILY
Pin Diagrams (Continued)
36-Pin UQFN
(1,2,3,4)
AN26/CVREF1O/ASCL1/SDO1/RP40/T4CK/RB8
OA5OUT/AN25/C5IN4-/SCK1/RP39/INT0/RB7
PGEC2/SCL1/RP38/RB6
PGED2/SDA1/RP37/RB5
V
DD
OA5IN+/AN24/C5IN3-/C5IN1+/RP20/T1CK/RA4
FLT32/RP36/RB4
RPI45/PWM2L/CTPLS/RB13
RPI44/PWM2H/RB12
RP43/PWM3L/RB11
RP42/PWM3H/RB10
V
CAP
V
SS
OA5IN-/AN27/C5IN1-/ASDA1/SDI1/RP41/RB9
RPI46/PWM1H/T3CK/RB14
RPI47/PWM1L/T5CK/RB15
AV
SS
AV
DD
MCLR
PGED3/OA2IN-/AN2/C2IN1-/SS1/RPI32/CTED2/RB0
PGEC3/OA1OUT/AN3/C1IN4-/C4IN2-/RPI33/CTED1/RB1
V
SS
OSC1/CLK1/AN32/RPI18/RA2
OSC2/CLKO/RPI19/RA3
PGEC1/OA1IN+/AN4/C1IN3-/C1IN1+/C2IN3-/RPI34/RB2
PGED1/OA1IN-/AN5/C1IN1-/(CTMUC)/RP35/RB3
OA2OUT/AN0/C2IN4-/C4IN3-/RPI16/RA0
OA2IN+/AN1/C2IN1+/RPI17/RA1
dsPIC33EV32GM003/103
1
3
4
5
7
2
6
18171615
20
19
21
8
9
10 11 12 13 14
27
26
25
24
23
22
2829303136 35 34 33 32
V
DD
RP56/RC8
V
DD
V
SS
V
DD
RPI24/RA8
AN6/C3IN4-/C4IN4-/C4IN1+/RP48RC0
AN7/C3IN1-/C4IN1-/RP49/RC1
dsPIC33EV64GM003/103
dsPIC33EV128GM003/103
dsPIC33EV256GM003/103
Note 1: The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See Section 11.5 “Peripheral
Pin Select (PPS)” for available peripherals and information on limitations.
2: Every I/O port pin (RAx-RGx) can be used as a Change Notification pin (CNAx-CNGx). See Section 11.0 “I/O Ports”
for more information.
3: If the op amp is selected when OPAEN (CMxCON<10>) = 1, the OAx input is used; otherwise, the ANx input is used.
4: The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected to V
SS
externally.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 8 2013-2018 Microchip Technology Inc.
Pin Diagrams (Continued)
AN26/CV
REF1O
/ASCL1/RP40/T4CK/RB8
AN56/RA10
RPI45/PWM2L/CTPLS/RB13 PGEC1/OA1IN+/AN4/C1IN3-/C1IN1+/C2IN3-/RPI34/RB2
PGED1/OA1IN-/AN5/C1IN1-/CTMUC/RP35/RB3
OA3OUT/AN6/C3IN4-/C4IN4-/C4IN1+/RP48/RC0
OA3IN-/AN7/C3IN1-/C4IN1-/RP49/RC1
OA3IN+/AN8/C3IN3-/C3IN1+/RPI50/U1RTS/BCLK1/FLT3/RC2
V
DD
OSC1/CLKI/AN32/RPI18/RA2
OSC2/CLKO/RPI19/RA3
RPI24/RA8
FLT32/RP36/RB4
AN55/RA7
RPI46/PWM1H/T3CK/RB14
RPI47/PWM1L/T5CK/RB15
AV
SS
AV
DD
MCLR
OA2OUT/AN0/C2IN4-/C4IN3-/RPI16/RA0
OA2IN+/AN1/C2IN1+/RPI17/RA1
PGED3/OA2IN-/AN2/C2IN1-/SS1/RPI32/CTED2/RB0
PGEC3/OA1OUT/AN3/C1IN4-/C4IN2-/RPI33/CTED1/RB1
RPI44/PWM2H/RB12
RP43/PWM3L/RB11
RP42/PWM3H/RB10
V
CAP
V
SS
AN54/RP57/RC9
AN51/RP56/RC8
AN52/RP55/RC7
AN53/RP54/RC6
OA5IN-/AN27/C5IN1-/ASDA1/RP41/RB9
OA5OUT/AN25/C5IN4-/RP39/INT0/RB7
PGEC2/SCL1/RP38/RB6
PGED2/SDA1/RP37/RB5
V
DD
V
SS
AN31/CV
REF2O
/RPI53/RC5
AN30/CV
REF
+/RPI52/RC4
AN29/SCK1/RPI51/RC3
AN28/SDI1/RPI25/RA9
OA5IN+/AN24/C5IN3-/C5IN1+/SDO1/RP20/T1CK/RA4
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
31
30
29
28
27
26
25
24
23
33
32
1
2
3
4
5
6
7
8
9
10
11
V
SS
dsPIC33EV64GM004/104
dsPIC33EV128GM004/104
dsPIC33EV256GM004/104
Note 1: The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See Section 1 1 .5 “Periphe ral
Pin Select (PPS)” for available peripherals and information on limitations.
2: Every I/O port pin (RAx-RGx) can be used as a Change Notification pin (CNAx-CNGx). See Section 11.0 “I/O
Ports” for more information.
3: If the op amp is selected when OPAEN (CMxCON<10>) = 1, the OAx input is used; otherwise, the ANx input is
used.
44-Pin TQFP
(1,2,3)
dsPIC33EV32GM004/104
2013-2018 Microchip Technology Inc. DS70005144G-page 9
dsPIC33EVXXXGM00X/10X FAMILY
Pin Diagrams (Continued)
dsPIC33EV64GM004/104
dsPIC33EV128GM004/104
dsPIC33EV256GM004/104
43 42 41 40 39 38 37 36 35
12 13 14 15 16 17 18 19 20 21
3
30
29
28
27
26
25
24
23
4
5
7
8
9
10
11
1
232
31
6
22
33
34
AN26/CV
REF1O
/ASCL1/RP40/T4CK/RB8
AN56/RA10
RPI45/PWM2L/CTPLS/RB13 PGEC1/OA1IN+/AN4/C1IN3-/C1IN1+/C2IN3-/RPI34/RB2
PGED1/OA1IN-/AN5/C1IN1-/CTMUC/RP35/RB3
OA3OUT/AN6/C3IN4-/C4IN4-/C4IN1+/RP48/RC0
OA3IN-/AN7/C3IN1-/C4IN1-/RP49/RC1
OA3IN+/AN8/C3IN3-/C3IN1+/RPI50/U1RTS/BCLK1/FLT3/RC2
V
DD
V
SS
OSC1/CLKI/AN32/RPI18/RA2
OSC2/CLKO/RPI19/RA3
RPI24/RA8
FLT32/RP36/RB4
AN55/RA7
RPI46/PWM1H/T3CK/RB14
RPI47/PWM1L/T5CK/RB15
AV
SS
AV
DD
MCLR
OA2OUT/AN0/C2IN4-/C4IN3-/RPI16/RA0
OA2IN+/AN1/C2IN1+/RPI17/RA1
PGED3/OA2IN-/AN2/C2IN1-/SS1/RPI32/CTED2/RB0
PGEC3/OA1OUT/AN3/C1IN4-/C4IN2-/RPI33/CTED1/RB1
RPI44/PWM2H/RB12
RP43/PWM3L/RB11
RP42/PWM3H/RB10
V
CAP
V
SS
AN54/RP57/RC9
AN51/RP56/RC8
AN52/RP55/RC7
AN53/RP54/RC6
OA5IN-/AN27/C5IN1-/ASDA1/RP41/RB9
OA5OUT/AN25/C5IN4-/RP39/INT0/RB7
PGEC2/SCL1/RP38/RB6
PGED2/SDA1/RP37/RB5
V
DD
V
SS
AN31/CV
REF2O
/RPI53/RC5
AN30/CV
REF
+/RPI52/RC4
AN29/SCK1/RPI51/RC3
AN28/SDI1/RPI25/RA9
OA5IN+/AN24/C5IN3-/C5IN1+/SDO1/RP20/T1CK/RA4
44
44-Pin QFN
(1,2,3,4)
Note 1: The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See Section 1 1 .5 “Peripheral
Pin Select (PPS)” for available peripherals and information on limitations.
2: Every I/O port pin (RAx-RGx) can be used as a Change Notification pin (CNAx-CNGx). See Section 11.0 “I/O
Ports” for more information.
3: If the op amp is selected when OPAEN (CMxCON<10>) = 1, the OAx input is used; otherwise, the ANx input is
used.
4: The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected to
V
SS
externally.
dsPIC33EV32GM004/104
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 10 2013-2018 Microchip Technology Inc.
Pin Diagrams (Continued)
64- Pin TQFP
(1,2,3)
AN55/RA7
RPI46/PWM1H/T3CK/RB14
RPI47/PWM1L/T5CK/RB15
AN19/RP118/RG6
AN18/RPI119/RG7
AN17/RP120/RG8
MCLR
AN16/RPI121/RG9
V
SS
V
DD
AN10/RPI28/RA12
AN9/RPI27/RA11
OA2OUT/AN0/C2IN4-/C4IN3-/RPI16/RA0
OA2IN+/AN1/C2IN1+/RPI17/RA1
PGED3/OA2IN-/AN2/C2IN1-/
SS1/RPI32/CTED2/RB0
PGEC3/OA1OUT/AN3/C1IN4-/C4IN2-/RPI33/CTED1/RB1
AN56/RA10
RPI45/PWM2L/CTPLS/RB13
RPI44/PWM2H/RB12
RP43/PWM3L/RB11
RP42/PWM3H/RB10
RP97/RF1
RPI96/RF0
V
DD
V
CAP
AN54/RP57/RC9
RP70/RD6
RP69/RD5
AN51/RP56/RC8
AN52/RP55/RC7
AN53/RP54/RC6
OA5IN-/AN27/C5IN1-/ASDA1/RP41/RB9
AN26/CV
REF1O
/ASCL1/RP40/T4CK/RB8
RPI61/RC13
OA5OUT/AN25/C5IN4-/RP39/INT0/RB7
AN48/CV
REF2O
/RPI58/RC10
PGEC2/SCL1/RP38/RB6
PGED2/SDA1/RP37/RB5
RPI72/RD8
V
SS
OSC2/CLKO/RPI63/RC15
OSC1/CLKI/AN49/RPI60/RC12
V
DD
AN31/RPI53/RC5
AN30/CV
REF
+/RPI52/RC4
AN29/SCK1/RPI51/RC3
AN28/SDI1/RPI25/RA9
OA5IN+/AN24/C5IN3-/C5IN1+/SDO1/RP20/T1CK/RA4
PGEC1/OA1IN+/AN4/C1IN3-/C1IN1+/C2IN3-/RPI34/RB2
PGED1/OA1IN-/AN5/C1IN1-/(CTMUC)/RP35/RB3
AV
DD
AV
SS
OA3OUT/AN6/C3IN4-/C4IN4-/C4IN1+/RP48/RC0
OA3IN-/AN7/C3IN1-/C4IN1-/RP49/RC1
OA3IN+/AN8/C3IN3-/C3IN1+/RPI50/
U1RTS/BCLK1/FLT3/RC2
AN11/C1IN2-/
U1CTS/FLT4/RC11
V
SS
V
DD
AN12/C2IN2-/C5IN2-/
U2RTS/BCLK2/FLT5/RE12
AN13/C3IN2-/
U2CTS/FLT6/RE13
AN14/RPI94/
FLT7/RE14
AN15/RPI95/
FLT8/RE15
RPI24/RA8
FLT32
/RP36/RB4
dsPIC33EV64GM006/106
dsPIC33EV128GM006/106
dsPIC33EV256GM006/106
64
63
62
61
60
59
58
57
56
5
5
54
53
52
51
50
49
148
247
346
445
544
643
742
841
940
10 39
11 38
12 37
13 36
14 35
15 34
16 33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Note 1: The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See Section 11.5 “Peripheral
Pin Select (PPS )” for available peripherals and information on limitations.
2: Every I/O port pin (RAx-RGx) can be used as a Change Notification pin (CNAx-CNGx). See Section 11.0 “I/O
Ports” for more information.
3: If the op amp is selected when OPAEN (CMxCON<10>) = 1, the OAx input is used; otherwise, the ANx input is
used.
dsPIC33EV32GM006/106
2013-2018 Microchip Technology Inc. DS70005144G-page 11
dsPIC33EVXXXGM00X/10X FAMILY
Pin Diagrams (Continued)
64-Pin QFN
(1,2,3,4)
dsPIC33EV64GM006/106
dsPIC33EV128GM006/106
dsPIC33EV256GM006/106
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
148
247
346
445
544
643
742
841
940
10 39
11 38
12 37
13 36
14 35
15 34
16 33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
AN56/RA10
RPI45/PWM2L/CTPLS/RB13
RPI44/PWM2H/RB12
RP43/PWM3L/RB11
RP42/PWM3H/RB10
RP97/RF1
RPI96/RF0
V
DD
V
CAP
AN54/ RP57/RC9
RP70/RD6
RP69/RD5
AN51/RP56/RC8
AN52/RP55/RC7
AN53/RP54/RC6
OA5IN-/AN27/C5IN1-/ASDA1/RP41/RB9
AN26/CV
REF1O
/ASCL1/RP40/T4CK/RB8
RPI61/RC13
OA5OUT/AN25/C5IN4-/RP39/INT0/RB7
AN48/CV
REF2O
/RPI58/RC10
PGEC2/SCL1/RP38/RB6
PGED2/SDA1/RP37/RB5
RPI72/RD8
V
SS
OSC2/CLKO/RPI63/RC15
OSC1/CLKI/AN49/RPI60/RC12
V
DD
AN31/RPI53/RC5
AN30/CV
REF
+/RPI52/RC4
AN29/SCK1/RPI51/RC3
AN28/SDI1/RPI25/RA9
OA5
IN+/AN24/C5IN3-/C5IN1+/ SDO1/RP20/T1CK/RA4
PGEC1/OA1IN+/AN4/C1IN3-/C1IN1+/C2IN3-/RPI34/RB2
PGED1/OA1IN-/AN5/C1IN1-/(CTMUC)/RP35/RB3
AV
DD
AV
SS
OA3OUT/AN6/C3IN4-/C4IN4-/C4IN1+/RP48/RC0
OA3IN-/AN7/C3IN1-/C4IN1-/RP49/RC1
OA3IN+/AN8/C3IN3-/C3IN1+/RPI50/U1RTS/BCLK1/FLT3/RC2
AN11/C1IN2-/U1CTS/FLT4/RC11
V
SS
V
DD
AN12/C2IN2-/C5IN2-/U2RTS/BCLK2/FLT5/RE12
AN13/C3IN2-/U2CTS/FLT6/RE13
AN14/RPI94/FLT7/RE14
AN15/RPI95/FLT8/RE15
RPI24/RA8
FLT32/RP36/RB4
AN55/RA7
RPI46/PWM1H/T3CK/RB14
RPI47/PWM1L/T5CK/RB15
AN19/RP118/RG6
AN18/RPI119/RG7
AN17/RP120/RG8
MCLR
AN16/RPI121/RG9
V
SS
V
DD
AN10/RPI28/RA12
AN9/RPI27/RA11
OA2OUT/AN0/C2IN4-/C4IN3-/RPI16/RA0
OA2IN+/AN1/C2IN1+/RPI17/RA1
PGED3/OA2IN-/AN2/C2IN1-/
SS1/RPI32/CTED2/RB0
PGEC3/OA1OUT/AN3/C1IN4-/C4IN2-/RPI33/CTED1/RB1
Note 1: The RPn/RPIn pins can be used by any remappable peripheral with some limitation. See Section 11.5 “P eripheral
Pin Select (PPS)” for available peripherals and information on limitations.
2: Every I/O port pin (RAx-RGx) can be used as a Change Notification pin (CNAx-CNGx). See Section 11.0 “I/O
Ports” for more information.
3: If the op amp is selected when OPAEN (CMxCON<10>) = 1, the OAx input is used; otherwise, the ANx input is
used.
4: The metal pad at the bottom of the device is not connected to any pins and is recommended to be connected to
V
SS
externally.
dsPIC33EV32GM006/106
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 12 2013-2018 Microchip Technology Inc.
Table of Contents
1.0 Device Overview ........................................................................................................................................................................ 15
2.0 Guidelines for Getting Started with 16-Bit Digital Signal Controllers.......................................................................................... 19
3.0 CPU............................................................................................................................................................................................ 23
4.0 Memory Organization ................................................................................................................................................................. 33
5.0 Flash Program Memory.............................................................................................................................................................. 85
6.0 Resets ....................................................................................................................................................................................... 93
7.0 Interrupt Controller ..................................................................................................................................................................... 97
8.0 Direct Memory Access (DMA) .................................................................................................................................................. 111
9.0 Oscillator Configuration ............................................................................................................................................................ 125
10.0 Power-Saving Features............................................................................................................................................................ 135
11.0 I/O Ports ................................................................................................................................................................................... 145
12.0 Timer1 ...................................................................................................................................................................................... 175
13.0 Timer2/3 and Timer4/5 ............................................................................................................................................................ 177
14.0 Deadman Timer (DMT) ............................................................................................................................................................ 183
15.0 Input Capture............................................................................................................................................................................ 191
16.0 Output Compare....................................................................................................................................................................... 195
17.0 High-Speed PWM Module ....................................................................................................................................................... 201
18.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 223
19.0 Inter-Integrated Circuit (I
2
C) ..................................................................................................................................................... 231
20.0 Single-Edge Nibble Transmission (SENT) ............................................................................................................................... 239
21.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 249
22.0 Controller Area Network (CAN) Module (dsPIC33EVXXXGM10X Devices Only).................................................................... 255
23.0 Charge Time Measurement Unit (CTMU) ................................................................................................................................ 281
24.0 10-Bit/12-Bit Analog-to-Digital Converter (ADC) ...................................................................................................................... 287
25.0 Op Amp/Comparator Module ................................................................................................................................................... 303
26.0 Comparator Voltage Reference................................................................................................................................................ 315
27.0 Special Features ...................................................................................................................................................................... 319
28.0 Instruction Set Summary .......................................................................................................................................................... 329
29.0 Development Support............................................................................................................................................................... 339
30.0 Electrical Characteristics .......................................................................................................................................................... 343
31.0 High-Temperature Electrical Characteristics............................................................................................................................ 405
32.0 Characteristics for Industrial/Extended Temperature Devices (-40°C to +125°C).................................................................... 415
33.0 Characteristics for High-Temperature Devices (+150°C) ......................................................................................................... 441
34.0 Packaging Information.............................................................................................................................................................. 463
Appendix A: Revision History............................................................................................................................................................. 489
Index ................................................................................................................................................................................................. 491
The Microchip Web Site..................................................................................................................................................................... 499
Customer Change Notification Service .............................................................................................................................................. 499
Customer Support .............................................................................................................................................................................. 499
Product Identification System............................................................................................................................................................. 501
2013-2018 Microchip Technology Inc. DS70005144G-page 13
dsPIC33EVXXXGM00X/10X FAMILY
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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Customer No tific at ion System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 14 2013-2018 Microchip Technology Inc.
Referenced Sources
This device data sheet is based on the following
individual chapters of the “dsPIC33/PIC24 Family
Reference Manual”, which are available from the
Microchip web site (www.microchip.com). The follow-
ing documents should be considered as the general
reference for the operation of a particular module or
device feature:
•“Introduction” (DS70573)
•“CPU” (DS70359)
•“Data Memory” (DS70595)
•“dsPIC33E/PIC24E Program Memory ” (DS70000613)
•“Flash Programming” (DS70609)
•“Interrupts” (DS70000600)
•“Oscillator” (DS70580)
•“Reset” (DS70602)
•“Watchdog Timer and Power-Saving Modes” (DS70615)
•“I/O Ports” (DS70000598)
•“Timers” (DS70362)
•“CodeGuard™ Intermediate Security” (DS70005182)
•“Deadman Timer” (DS70005155)
•“Input Capture with Dedicated Timer” (DS70000352)
•“Output Compare with Dedicated Timer” (DS70005159)
•“High-Speed PWM” (DS70645)
•“Analog-to-Digital Converter (ADC)” (DS70621)
•“Universal Asynchronous Receiver T ransmitte r (UART)” (DS70000582)
•“Serial Peripheral Interface (SPI)” (DS70005185)
•“Inter-Integ rated Circuit (I
2
C)” (DS70000195)
•“Enhanced Controller Area Network (ECAN™)” (DS70353)
•“Direct Memory Access (DMA)” (DS70348)
•“Programming and Diagnostics” (DS70608)
•“Op Amp/Comparator” (DS70000357)
•“Device Configuration” (DS70000618)
•“Charge T ime Me asurement Unit (CTMU) and CTMU Operation with Threshold Detect” (DS30009743)
•“Single-Edge Nibble Transmission (SENT) Module” (DS70005145)
2013-2018 Microchip Technology Inc. DS70005144G-page 15
dsPIC33EVXXXGM00X/10X FAMILY
1.0 DEVICE OVERVIEW
This document contains device-specific information for
the dsPIC33EVXXXGM00X/10X family Digital Signal
Controller (DSC) devices.
dsPIC33EVXXXGM00X/10X family devices contain
extensive Digital Signal Processor (DSP) functionality
with a high-performance, 16-bit MCU architecture.
Figure 1-1 shows a general block diagram of the core
and peripheral modules. Table 1-1 lists the functions of
the various pins shown in the pinout diagrams.
FIGURE 1-1: dsPIC33EVXXXGM00X/10X FAMILY BLOCK DIAGRAM
Note 1: This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the related section in the
“dsPIC33/PIC24 Family Reference Man-
ual”, which is available from the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
PORTA
Power-up
Timer
Oscillator
Start-up
OSC1/CLKI
MCLR
V
DD
, V
SS
UART1/2
Timing
Generation
CAN1
(1)
I2C1
ADC
Timers
Input
Capture
Output
Compare
AV
DD
, AV
SS
SPI1/2
Watchdog
Timer/
POR/BOR
PWM
Remappable
Pins
Note 1: This feature or peripheral is only available on dsPIC33EVXXXGM10X devices.
CTMU
SENT1/2
CPU
Refer to Figure 3-1 for CPU diagram details.
16
16
PORTB
PORTC
PORTD
PORTE
PORTF
PORTG
PORTS
Peripheral Modules
Timer
Deadman
Op Amp/
Comparator
Timer
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 16 2013-2018 Microchip Technology Inc.
TABLE 1-1: PINOUT I/O DESCRIPTIONS
Pin Name Pin
Type Buffer
Type PPS Description
AN0-AN19
AN24-AN32
AN48, AN49
AN51-AN56
I Analog No Analog input channels.
CLKI
CLKO
I
O
ST/
CMOS
—
No
No
External clock source input. Always associated with OSC1 pin
function.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes.
Always associated with OSC2 pin function.
OSC1
OSC2
I
I/O
ST/
CMOS
—
No
No
Oscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise.
Oscillator crystal output. Connects to crystal or resonator in Crystal
Oscillator mode. Optionally functions as CLKO in RC and EC modes.
REFCLKO O — Yes Reference clock output.
IC1-IC4 I ST Yes Capture Inputs 1 to 4.
OCFA
OC1-OC4
I
O
ST
—
Yes
Yes
Compare Fault A input (for compare channels).
Compare Outputs 1 to 4.
INT0
INT1
INT2
I
I
I
ST
ST
ST
No
Yes
Yes
External Interrupt 0.
External Interrupt 1.
External Interrupt 2.
RA0-RA4, RA7-RA12 I/O ST Yes PORTA is a bidirectional I/O port.
RB0-RB15 I/O ST Yes PORTB is a bidirectional I/O port.
RC0-RC13, RC15 I/O ST Yes PORTC is a bidirectional I/O port.
RD5-RD6, RD8 I/O ST Yes PORTD is a bidirectional I/O port.
RE12-RE15 I/O ST Yes PORTE is a bidirectional I/O port.
RF0-RF1 I/O ST No PORTF is a bidirectional I/O port.
RG6-RG9 I/O ST Yes PORTG is a bidirectional I/O port.
T1CK
T2CK
T3CK
T4CK
T5CK
I
I
I
I
I
ST
ST
ST
ST
ST
No
Yes
No
No
No
Timer1 external clock input.
Timer2 external clock input.
Timer3 external clock input.
Timer4 external clock input.
Timer5 external clock input.
CTPLS
CTED1
CTED2
O
I
I
ST
ST
ST
No
No
No
CTMU pulse output.
CTMU External Edge Input 1.
CTMU External Edge Input 2.
U1CTS
U1RTS
U1RX
U1TX
I
O
I
O
ST
—
ST
—
Yes
Yes
Yes
Yes
UART1 Clear-to-Send.
UART1 Ready-to-Send.
UART1 receive.
UART1 transmit.
U2CTS
U2RTS
U2RX
U2TX
I
O
I
O
ST
—
ST
—
Yes
Yes
Yes
Yes
UART2 Clear-to-Send.
UART2 Ready-to-Send.
UART2 receive.
UART2 transmit.
SCK1
SDI1
SDO1
SS1
I/O
I
O
I/O
ST
ST
—
ST
No
No
No
No
Synchronous serial clock input/output for SPI1.
SPI1 data in.
SPI1 data out.
SPI1 slave synchronization or frame pulse I/O.
Legend: CMOS = CMOS compatible input or output Analog = Analog input P = Power
ST = Schmitt Trigger input with CMOS levels O = Output I = Input
PPS = Peripheral Pin Select TTL = TTL input buffer
2013-2018 Microchip Technology Inc. DS70005144G-page 17
dsPIC33EVXXXGM00X/10X FAMILY
SCK2
SDI2
SDO2
SS2
I/O
I
O
I/O
ST
ST
—
ST
Yes
Yes
Yes
Yes
Synchronous serial clock input/output for SPI2.
SPI2 data in.
SPI2 data out.
SPI2 slave synchronization or frame pulse I/O.
SCL1
SDA1
ASCL1
ASDA1
I/O
I/O
I/O
I/O
ST
ST
ST
ST
No
No
No
No
Synchronous serial clock input/output for I2C1.
Synchronous serial data input/output for I2C1.
Alternate synchronous serial clock input/output for I2C1.
Alternate synchronous serial data input/output for I2C1.
C1RX
C1TX
I
O
ST
—
Yes
Yes
CAN1 bus receive pin.
CAN1 bus transmit pin.
SENT1TX
SENT1RX
SENT2TX
SENT2RX
O
I
O
I
—
—
—
—
Yes
Yes
Yes
Yes
SENT1 transmit pin.
SENT1 receive pin.
SENT2 transmit pin.
SENT2 receive pin.
CV
REF
O Analog No Comparator Voltage Reference output.
C1IN1+, C1IN2-,
C1IN1-, C1IN3-
C1OUT
I
O
Analog
—
No
Yes
Comparator 1 inputs.
Comparator 1 output.
C2IN1+, C2IN2-,
C2IN1-, C2IN3-
C2OUT
I
O
Analog
—
No
Yes
Comparator 2 inputs.
Comparator 2 output.
C3IN1+, C3IN2-,
C2IN1-, C3IN3-
C3OUT
I
O
Analog
—
No
Yes
Comparator 3 inputs.
Comparator 3 output.
C4IN1+, C4IN2-,
C4IN1-, C4IN3-
C4OUT
I
O
Analog
—
No
Yes
Comparator 4 inputs.
Comparator 4 output.
C5IN1+, C5IN2-,
C5IN1-, C5IN3-
C5OUT
I
O
Analog
—
No
Yes
Comparator 5 inputs.
Comparator 5 output.
FLT1-FLT2
FLT3-FLT8
FLT32
DTCMP1-DTCMP3
PWM1L-PWM3L
PWM1H-PWM3H
SYNCI1
SYNCO1
I
I
I
I
O
O
I
O
ST
ST
ST
ST
—
—
ST
—
Yes
NO
NO
Yes
No
No
Yes
Yes
PWM Fault Inputs 1 and 2.
PWM Fault Inputs 3 to 8.
PWM Fault Input 32.
PWM Dead-Time Compensation Inputs 1 to 3.
PWM Low Outputs 1 to 3.
PWM High Outputs 1 to 3.
PWM Synchronization Input 1.
PWM Synchronization Output 1.
PGED1
PGEC1
PGED2
PGEC2
PGED3
PGEC3
I/O
I
I/O
I
I/O
I
ST
ST
ST
ST
ST
ST
No
No
No
No
No
No
Data I/O pin for Programming/Debugging Communication Channel 1.
Clock input pin for Programming/Debugging Communication Channel 1.
Data I/O pin for Programming/Debugging Communication Channel 2.
Clock input pin for Programming/Debugging Communication Channel 2.
Data I/O pin for Programming/Debugging Communication Channel 3.
Clock input pin for Programming/Debugging Communication Channel 3.
MCLR I/P ST No Master Clear (Reset) input. This pin is an active-low Reset to the
device.
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name Pin
Type Buffer
Type PPS Description
Legend: CMOS = CMOS compatible input or output Analog = Analog input P = Power
ST = Schmitt Trigger input with CMOS levels O = Output I = Input
PPS = Peripheral Pin Select TTL = TTL input buffer
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 18 2013-2018 Microchip Technology Inc.
AV
DD
P P No Positive supply for analog modules. This pin must be connected at all
times.
AV
SS
P P No Ground reference for analog modules.
V
DD
P — No Positive supply for peripheral logic and I/O pins.
V
CAP
P — No CPU logic filter capacitor connection.
V
SS
P — No Ground reference for logic and I/O pins.
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name Pin
Type Buffer
Type PPS Description
Legend: CMOS = CMOS compatible input or output Analog = Analog input P = Power
ST = Schmitt Trigger input with CMOS levels O = Output I = Input
PPS = Peripheral Pin Select TTL = TTL input buffer
2013-2018 Microchip Technology Inc. DS70005144G-page 19
dsPIC33EVXXXGM00X/10X FAMILY
2.0 GUIDELINES FOR GETTING
STARTED WITH 16-BIT
DIGITAL SIGNAL
CONTROLLERS
2.1 Basic Connection Requirements
Getting started with the dsPIC33EVXXXGM00X/10X
family of 16-bit microcontrollers (MCUs) requires
attention to a minimal set of device pin connections
before proceeding with development. The following is a
list of pin names, which must always be connected:
•All V
DD
and V
SS
pins
(see Section 2.2 “Decoupling Capacitors”)
•All AV
DD
and AV
SS
pins (regardless if ADC module
is not used)
(see Section 2.2 “Decoupling Capacitors”)
•V
CAP
(see Section 2.3 “CPU Logic Filter Capacitor
Connection (V
CAP
)”)
•MCLR
pin
(see Section 2.4 “Master Clear (MCLR) Pin”)
• PGECx/PGEDx pins used for In-Circuit Serial
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
• OSC1 and OSC2 pins when external oscillator
source is used
(see Section 2.6 “External Oscillator Pins”)
2.2 Decoupling Capacitors
The use of decoupling capacitors on every pair of
power supply pins, such as V
DD
, V
SS
, AV
DD
and
AV
SS
, is required.
Consider the following criteria when using decoupling
capacitors:
•Value and type of capa cito r: A value of 0.1 µF
(100 nF), 10V-20V is recommended. This
capacitor should be a Low Equivalent Series
Resistance (low-ESR), and have resonance
frequency in the range of 20 MHz and higher. It is
recommended to use ceramic capacitors.
•Placement o n the Printed Circuit Board (PCB):
The decoupling capacitors should be placed as
close to the pins as possible. It is recommended
to place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
•Handling high-frequency noise: If the board is
experiencing high-frequency noise, above tens of
MHz, add a second ceramic-type capacitor in
parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
•Maximiz ing perform anc e: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing the PCB track
inductance.
Note 1: This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the related section in the
“dsPIC33/PIC24 Family Reference Man-
ual”, which is available from the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: The AV
DD
and AV
SS
pins must be
connected, regardless of the ADC voltage
reference source.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 20 2013-2018 Microchip Technology Inc.
FIGURE 2-1: RECOMMENDE D
MINIMUM CONNECTION
2.2.1 TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including DSCs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that
connects the power supply source to the device, and
the maximum current drawn by the device in the appli-
cation. In other words, select the tank capacitor so that
it meets the acceptable voltage sag at the device.
Typical values range from 4.7 µF to 47 µF.
2.3 CPU Logic Filter Capacitor
Connection (V
CAP)
A low-ESR (<1 Ohms) capacitor is required on the V
CAP
pin, which is used to stabilize the internal voltage regulator
output. The V
CAP
pin must not be connected to V
DD
, and
must have a capacitor greater than 4.7 µF (10 µF is
recommended), with at least a 16V rating connected to
the ground. The type can be ceramic or tantalum. See
Section 30.0 “Electrical Ch aracteristics” for additional
information.
The placement of this capacitor should be close to the
V
CAP
pin. It is recommended that the trace length
should not exceed one-quarter inch (6 mm).
2.4 Master Clear (MCLR) Pin
The MCLR pin provides two specific device
functions:
• Device Reset
• Device Programming and Debugging
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (V
IH
and V
IL
) and fast signal
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For example, as shown in Figure 2-1, it is
recommended that the capacitor, C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components as shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2: EXAMPLE OF MCLR PIN
CONNECTIONS
dsPIC33EV
VDD
VSS
V
DD
V
SS
V
SS
V
DD
AVDD
AVSS
VDD
VSS
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
C
R
V
DD
MCLR
0.1 µF
Ceramic
VCAP
L1
(1)
R1
10 µF
Tantalum
Note 1:
As an option, instead of a hard-wired connection, an
inductor (L1) can be substituted between V
DD
and
AV
DD
to improve ADC noise rejection. The inductor
impedance should be less than 1
and the inductor
capacity greater than 10 mA.
Where:
fF
CNV
2
--------------=
f1
2LC
-----------------------=
L1
2fC
----------------------
2
=
(i.e., ADC Conversion Rate/2)
Note 1: R 10 k is recommended. A suggested
starting value is 10 k. Ensure that the MCLR
pin V
IH
and V
IL
specifications are met.
2: R1 470 will limit any current flow into
MCLR from the external capacitor, C, in the
event of MCLR pin breakdown due to Electro-
static Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
IH
and V
IL
specifications are met.
C
R1
(2)
R
(1)
V
DD
MCLR
dsPIC33EV
JP
2013-2018 Microchip Technology Inc. DS70005144G-page 21
dsPIC33EVXXXGM00X/10X FAMILY
2.5 ICSP Pins
The PGECx and PGEDx pins are used for ICSP and
debugging purposes. It is recommended to keep the
trace length between the ICSP connector and the ICSP
pins on the device as short as possible. If the ICSP con-
nector is expected to experience an ESD event, a
series resistor is recommended, with the value in the
range of a few tens of Ohms, not exceeding 100 Ohms.
Pull-up resistors, series diodes and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin Voltage Input High
(V
IH
) and Voltage Input Low (V
IL
) requirements.
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
®
PICkit™ 3, MPLAB ICD 3 or MPLAB
REAL ICE™.
For more information on MPLAB ICD 2, ICD 3 and
REAL ICE connection requirements, refer to the
following documents that are available on the
Microchip web site (www.microchip.com).
•“Using MPLAB
®
ICD 3” (poster) (DS51765)
•“MPLAB
®
ICD 3 Design Advisory” (DS51764)
•“MPLAB
®
REAL ICE™ In-Circuit Em ulator User’s
Guide” (DS51616)
•“Using MPL AB
®
REAL ICE™ In -Circuit E mulator”
(poster) (DS51749)
2.6 External Oscillator Pins
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator. For more information, see
Section 9.0 “Oscillator Configuration”.
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed as
shown in Figure 2-3.
FIGURE 2-3: SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
2.7 Oscillator Value Conditions on
Device Start-up
If the PLL of the target device is enabled and
configured for the device start-up oscillator, the
maximum oscillator source frequency must be limited
to 5 MHz < F
IN
< 13.6 MHz to comply with device PLL
start-up conditions. This intends that, if the external
oscillator frequency is outside this range, the
application must start up in the FRC mode first. The
default PLL settings after a POR with an oscillator
frequency outside this range will violate the device
operating speed.
Once the device powers up, the application firmware
can initialize the PLL SFRs, CLKDIV and PLLFBD, to a
suitable value, and then perform a clock switch to the
Oscillator + PLL clock source.
2.8 Unused I/Os
Unused I/O pins should be configured as outputs and
driven to a logic low state.
Alternatively, connect a 1k to 10k resistor between V
SS
and unused pins, and drive the output to logic low.
Note: Clock switching must be enabled in the
device Configuration Word.
Main Oscillator
Guard Ring
Guard Trace
Oscillator Pins
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 22 2013-2018 Microchip Technology Inc.
NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 23
dsPIC33EVXXXGM00X/10X FAMILY
3.0 CPU
The CPU has a 16-bit (data) modified Harvard archi-
tecture with an enhanced instruction set, including
significant support for digital signal processing. The
CPU has a 24-bit instruction word with a variable length
opcode field. The Program Counter (PC) is 23 bits wide
and addresses up to 4M x 24 bits of user program
memory space.
An instruction prefetch mechanism helps maintain
throughput and provides predictable execution. Most
instructions execute in a single-cycle effective execu-
tion rate, with the exception of instructions that change
the program flow, the double-word move (MOV.D)
instruction, PSV accesses and the table instructions.
Overhead-free program loop constructs are supported
using the DO and REPEAT instructions, both of which
are interruptible at any point.
3.1 Registers
The dsPIC33EVXXXGM00X/10X family devices have
sixteen, 16-bit Working registers in the programmer’s
model. Each of the Working registers can act as a Data,
Address or Address Offset register. The sixteenth
Working register (W15) operates as a Software Stack
Pointer for interrupts and calls.
In addition, the dsPIC33EVXXXGM00X/10X devices
include two alternate Working register sets, which
consist of W0 through W14. The alternate registers can
be made persistent to help reduce the saving and
restoring of register content during Interrupt Service
Routines (ISRs). The alternate Working registers can
be assigned to a specific Interrupt Priority Level (IPL1
through IPL6) by configuring the CTXTx<2:0> bits in
the FALTREG Configuration register.
The alternate Working registers can also be accessed
manually by using the CTXTSWP instruction.
The CCTXI<2:0> and MCTXI<2:0> bits in the CTXTSTAT
register can be used to identify the current, and most
recent, manually selected Working register sets.
3.2 Instruction Set
The device instruction set has two classes of instruc-
tions: the MCU class of instructions and the DSP class
of instructions. These two instruction classes are
seamlessly integrated into the architecture and exe-
cute from a single execution unit. The instruction set
includes many addressing modes and was designed
for optimum C compiler efficiency.
3.3 Data S pace Addressing
The Base Data Space can be addressed as 4K words
or 8 Kbytes and is split into two blocks, referred to as X
and Y data memory. Each memory block has its own
independent Address Generation Unit (AGU). The
MCU class of instructions operates solely through the
X memory AGU, which accesses the entire memory
map as one linear Data Space. On dsPIC33EV
devices, certain DSP instructions operate through the
X and Y AGUs to support dual operand reads, which
splits the data address space into two parts. The X and
Y Data Space boundary is device-specific.
The upper 32 Kbytes of the Data Space (DS) memory
map can optionally be mapped into Program Space (PS)
at any 16K program word boundary. The Program-to-
Data Space mapping feature, known as Program Space
Visibility (PSV), lets any instruction access Program
Space as if it were Data Space. Moreover, the Base Data
Space address is used in conjunction with a Data Space
Read or Write Page register (DSRPAG or DSWPAG) to
form an Extended Data Space (EDS) address. The EDS
can be addressed as 8M words or 16 Mbytes. For more
information on EDS, PSV and table accesses, refer to
“Data Memory” (DS70595) and “dsPIC33E/PIC24E
Program Memory” (DS70000613) in the “dsPIC33/
PIC24 Family Reference Manual”.
On dsPIC33EV devices, overhead-free circular buffers
(Modulo Addressing) are supported in both X and Y
address spaces. The Modulo Addressing removes the
software boundary checking overhead for DSP
algorithms. The X AGU Circular Addressing can be
used with any of the MCU class of instructions. The
X AGU also supports Bit-Reversed Addressing to greatly
simplify input or output data reordering for radix-2 FFT
algorithms. Figure 3-1 illustrates the block diagram of the
dsPIC33EVXXXGM00X/10X family devices.
3.4 Addressing Modes
The CPU supports these addressing modes:
• Inherent (no operand)
• Relative
•Literal
• Memory Direct
• Register Direct
• Register Indirect
Each instruction is associated with a predefined
addressing mode group, depending upon its functional
requirements. As many as six addressing modes are
supported for each instruction.
Note 1: This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “CPU” (DS70359) in the
“dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 24 2013-2018 Microchip Technology Inc.
FIGURE 3-1: dsPIC33EVXXXGM00X/10X FAMILY CPU BLOCK DIAGRAM
16
PCH
16
Program Counter
16-Bit ALU
24
24
24
24
X Data Bus
PCU 16
16 16
Divide
Support
Engine
DSP
ROM Latch
16
Y Data Bus
EA MUX
X RAGU
X WAGU
Y AGU
16
24
16
16
16
16
16
16
16
8
Interrupt
Controller PSV and Table
Data Access
Control Block
Stack
Control
Logic
Loop
Control
Logic
Data LatchData Latch
Y Data
RAM
X Data
RAM
Address
Latch
Address
Latch
16
Data Latch
16
16
16
X Address Bus
Y Address Bus
24
Literal Data
Program Memory
Address Latch
Power, Reset
and Oscillator
Control Signals
to Various Blocks
Ports
Peripheral
Modules
Modules
PCL
16 x 16
W Register Array
IR
Instruction
Decode and
Control
2013-2018 Microchip Technology Inc. DS70005144G-page 25
dsPIC33EVXXXGM00X/10X FAMILY
3.5 Programmer’s Model
The programmer’s model for the dsPIC33EVXXXGM00X/
10X family is shown in Figure 3-2. All registers in the
programmer’s model are memory-mapped and can be
manipulated directly by instructions. Table 3-1 lists a
description of each register.
In addition to the registers contained in the programmer’s
model, the dsPIC33EVXXXGM00X/10X family devices
contain control registers for Modulo Addressing and Bit-
Reversed Addressing, and interrupts. These registers
are described in subsequent sections of this document.
All registers associated with the programmer’s model
are memory-mapped, as shown in Table 4-1.
TABLE 3-1: PROGRAMMER’S MODEL REGISTER DESCRIPTIONS
Register(s) Name Description
W0 through W15
(1)
Working Register Array
W0 through W14
(1)
Alternate Working Register Array 1
W0 through W14
(1)
Alternate Working Register Array 2
ACCA, ACCB 40-Bit DSP Accumulators
PC 23-Bit Program Counter
SR ALU and DSP Engine STATUS Register
SPLIM Stack Pointer Limit Value Register
TBLPAG Table Memory Page Address Register
DSRPAG Extended Data Space (EDS) Read Page Register
RCOUNT REPEAT Loop Counter Register
DCOUNT DO Loop Count Register
DOSTARTH
(2)
, DOSTARTL
(2)
DO Loop Start Address Register (High and Low)
DOENDH, DOENDL DO Loop End Address Register (High and Low)
CORCON Contains DSP Engine, DO Loop Control and Trap Status bits
Note 1: Memory-mapped W0 through W14 represents the value of the register in the currently active CPU context.
2: The DOSTARTH and DOSTARTL registers are read-only.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 26 2013-2018 Microchip Technology Inc.
FIGURE 3-2: PRO GR A MME R’S MODEL
W0
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12
W13
W14
D0D15
W0
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12
W13
W14
NOVZ C
TBLPAG
PC23 PC0
70
D0D15
Program Counter
Data Table Page Address
STATUS Register
Alternate
Working/Address
DSP Operand
Registers
W0 (WREG)
W1
W2
W3
W4
W5
W6
W7
W8
W9
W10
W11
W12
W13
Frame Pointer/W14
Stack Pointer/W15
DSP Address
Registers
AD39 AD0
AD31
DSP
Accumulators
(1)
ACCA
ACCB
DSRPAG
90
RA
0
OA OB SA SB
RCOUNT
15 0
REPEAT Loop Counter
15 0
DO Loop Counter and Stack
DOSTART
23 0
DO Loop Start Address and Stack
0
DOEND DO Loop End Address and Stack
IPL2 IPL1
SPLIM Stack Pointer Limit
AD15
23 0
SRL
IPL0
PUSH.S and POP.S Shadows
Nested DO Stack
0
0
OAB SAB
X Data Space Read Page Address
DA DC
0
0
0
0
CORCON
15 0
CPU Core Control Register
DCOUNT
D0D15
Registers
Working/Address
Registers
2013-2018 Microchip Technology Inc. DS70005144G-page 27
dsPIC33EVXXXGM00X/10X FAMILY
3.6 CPU Control Registers
REGISTER 3-1: SR: CPU STATUS REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/C-0 R/C-0 R-0 R/W-0
OA OB SA
(3)
SB
(3)
OAB SAB DA DC
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
IPL2
(1,2)
IPL1
(1,2)
IPL0
(1,2)
RA N OV Z C
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 OA: Accumulator A Overflow Status bit
1 = Accumulator A has overflowed
0 = Accumulator A has not overflowed
bit 14 OB: Accumulator B Overflow Status bit
1 = Accumulator B has overflowed
0 = Accumulator B has not overflowed
bit 13 SA: Accumulator A Saturation ‘Sticky’ Status bit
(3)
1 = Accumulator A is saturated or has been saturated at some time
0 = Accumulator A is not saturated
bit 12 SB: Accumulator B Saturation ‘Sticky’ Status bit
(3)
1 = Accumulator B is saturated or has been saturated at some time
0 = Accumulator B is not saturated
bit 11 OAB: OA || OB Combined Accumulator Overflow Status bit
1 = Accumulator A or B has overflowed
0 = Accumulator A and B have not overflowed
bit 10 SAB: SA || SB Combined Accumulator ‘Sticky’ Status bit
1 = Accumulator A or B is saturated or has been saturated at some time
0 = Accumulator A and B have not been saturated
bit 9 DA: DO Loop Active bit
1 = DO loop is in progress
0 = DO loop is not in progress
bit 8 DC: MCU ALU Half Carry/Borrow bit
1 = A carry-out from the 4
th
low-order bit (for byte-sized data) or 8
th
low-order bit (for word-sized data)
of the result occurred
0 = No carry-out from the 4
th
low-order bit (for byte-sized data) or 8
th
low-order bit (for word-sized
data) of the result occurred
Note 1: The IPL<2:0> bits are concatenated with the IPL3 bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL3 = 1. User interrupts are disabled when IPL3 = 1.
2: The IPL<2:0> Status bits are read-only when the NSTDIS bit (INTCON1<15>) = 1.
3: A data write to the SR register can modify the SA and SB bits by either a data write to SA and SB or by
clearing the SAB bit. To avoid a possible SA or SB bit write race condition, the SA and SB bits should not
be modified using the bit operations.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 28 2013-2018 Microchip Technology Inc.
bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits
(1,2)
111 = CPU Interrupt Priority Level is 7 (15); user interrupts are disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
bit 4 RA: REPEAT Loop Active bit
1 = REPEAT loop is in progress
0 = REPEAT loop is not in progress
bit 3 N: MCU ALU Negative bit
1 = Result was negative
0 = Result was non-negative (zero or positive)
bit 2 OV: MCU ALU Overflow bit
This bit is used for signed arithmetic (two’s complement). It indicates an overflow of the magnitude that
causes the sign bit to change state.
1 = Overflow occurred for signed arithmetic (in this arithmetic operation)
0 = Overflow has not occurred for signed arithmetic
bit 1 Z: MCU ALU Zero bit
1 = An operation that affects the Z bit has set it at some time in the past
0 = The most recent operation that affects the Z bit has cleared it (i.e., a non-zero result)
bit 0 C: MCU ALU Carry/Borrow bit
1 = A carry-out from the Most Significant bit (MSb) of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
REGISTER 3-1: SR: CPU STATUS REGISTER (CONTINUED)
Note 1: The IPL<2:0> bits are concatenated with the IPL3 bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL3 = 1. User interrupts are disabled when IPL3 = 1.
2: The IPL<2:0> Status bits are read-only when the NSTDIS bit (INTCON1<15>) = 1.
3: A data write to the SR register can modify the SA and SB bits by either a data write to SA and SB or by
clearing the SAB bit. To avoid a possible SA or SB bit write race condition, the SA and SB bits should not
be modified using the bit operations.
2013-2018 Microchip Technology Inc. DS70005144G-page 29
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 3-2: CORCON: CORE CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-0
VAR — US1 US0 EDT
(1)
DL2 DL1 DL0
bit 15 bit 8
R/W-0 R/W-0 R/W-1 R/W-0 R/C-0 R-0 R/W-0 R/W-0
SATA SATB SATDW ACCSAT IPL3
(2)
SFA RND IF
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 VAR: Variable Exception Processing Latency Control bit
1 = Variable exception processing latency is enabled
0 = Fixed exception processing latency is enabled
bit 14 Unimplemented: Read as ‘0’
bit 13-12 US<1:0>: DSP Multiply Unsigned/Signed Control bits
11 = Reserved
10 = DSP engine multiplies are mixed-sign
01 = DSP engine multiplies are unsigned
00 = DSP engine multiplies are signed
bit 11 EDT: Early DO Loop Termination Control bit
(1)
1 = Terminates executing the DO loop at the end of the current loop iteration
0 = No effect
bit 10-8 DL<2:0>: DO Loop Nesting Level Status bits
111 = 7 DO loops are active
•
•
•
001 = 1 DO loop is active
000 = 0 DO loops are active
bit 7 SATA: ACCA Saturation Enable bit
1 = Accumulator A saturation is enabled
0 = Accumulator A saturation is disabled
bit 6 SATB: ACCB Saturation Enable bit
1 = Accumulator B saturation is enabled
0 = Accumulator B saturation is disabled
bit 5 SATDW: Data Space Write from DSP Engine Saturation Enable bit
1 = Data Space write saturation is enabled
0 = Data Space write saturation is disabled
bit 4 ACCSAT: Accumulator Saturation Mode Select bit
1 = 9.31 saturation (super saturation)
0 = 1.31 saturation (normal saturation)
Note 1: This bit is always read as ‘0’.
2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 30 2013-2018 Microchip Technology Inc.
bit 3 IPL3: CPU Interrupt Priority Level Status bit 3
(2)
1 = CPU Interrupt Priority Level is greater than 7
0 = CPU Interrupt Priority Level is 7 or less
bit 2 SFA: Stack Frame Active Status bit
1 = Stack frame is active; W14 and W15 address 0x0000 to 0xFFFF, regardless of DSRPAG and
DSWPAG values
0 = Stack frame is not active; W14 and W15 address of EDS or Base Data Space
bit 1 RND: Rounding Mode Select bit
1 = Biased (conventional) rounding is enabled
0 = Unbiased (convergent) rounding is enabled
bit 0 IF: Integer or Fractional Multiplier Mode Select bit
1 = Integer mode is enabled for DSP multiply
0 = Fractional mode is enabled for DSP multiply
REGISTER 3-2: CORCON: CORE CONTROL REGISTER (CONTINUED)
Note 1: This bit is always read as ‘0’.
2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.
2013-2018 Microchip Technology Inc. DS70005144G-page 31
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 3-3: CTXTSTAT: CPU W REGISTER CONTEXT STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 R-0 R-0 R-0
— — — — — CCTXI2 CCTXI1 CCTXI0
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R-0 R/W-0 R/W-0
— — — — — MCTXI2 MCTXI1 MCTXI0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0’
bit 10-8 CCTXI<2:0>: Current (W Register) Context Identifier bits
111 = Reserved
•
•
•
011 = Reserved
010 = Alternate Working Register Set 2 is currently in use
001 = Alternate Working Register Set 1 is currently in use
000 = Default register set is currently in use
bit 7-3 Unimplemented: Read as ‘0’
bit 2-0 MCTXI<2:0>: Manual (W Register) Context Identifier bits
111 = Reserved
•
•
•
011 = Reserved
010 = Alternate Working Register Set 2 was most recently manually selected
001 = Alternate Working Register Set 1 was most recently manually selected
000 = Default register set was most recently manually selected
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 32 2013-2018 Microchip Technology Inc.
3.7 Arithmetic Logic Unit (ALU)
The dsPIC33EVXXXGM00X/10X family ALU is 16 bits
wide and is capable of addition, subtraction, bit shifts
and logic operations. Unless otherwise mentioned,
arithmetic operations are two’s complement in nature.
Depending on the operation, the ALU can affect the
values of the Carry (C), Zero (Z), Negative (N),
Overflow (OV) and Digit Carry (DC) Status bits in the
SR register. The C and DC Status bits operate as
Borrow and Digit Borrow bits, respectively, for
subtraction operations.
The ALU can perform 8-bit or 16-bit operations,
depending on the mode of the instruction that is used.
The data for the ALU operation can come from the W
register array or from the data memory, depending on
the addressing mode of the instruction. Similarly, the
output data from the ALU can be written to the W
register array or a data memory location.
For information on the SR bits affected by each
instruction, refer to the “16-Bit MCU and DSC
Programmer’s Reference Manual” (DS70000157).
The core CPU incorporates hardware support for both
multiplication and division. This includes a dedicated
hardware multiplier and support hardware for 16-bit
divisor division.
3.7.1 MULTIPLIER
Using the high-speed, 17-bit x 17-bit multiplier, the ALU
supports unsigned, signed or mixed-sign operation in
several MCU multiplication modes:
• 16-bit x 16-bit signed
• 16-bit x 16-bit unsigned
• 16-bit signed x 5-bit (literal) unsigned
• 16-bit signed x 16-bit unsigned
• 16-bit unsigned x 5-bit (literal) unsigned
• 16-bit unsigned x 16-bit signed
• 8-bit unsigned x 8-bit unsigned
3.7.2 DIVIDER
The divide block supports 32-bit/16-bit and 16-bit/16-bit
signed and unsigned integer divide operations with the
following data sizes:
• 32-bit signed/16-bit signed divide
• 32-bit unsigned/16-bit unsigned divide
• 16-bit signed/16-bit signed divide
• 16-bit unsigned/16-bit unsigned divide
The quotient for all divide instructions ends up in W0
and the remainder in W1. The 16-bit signed and
unsigned DIV instructions can specify any W register
for both the 16-bit divisor (Wn) and any W register
(aligned) pair (W(m + 1):Wm) for the 32-bit dividend.
The divide algorithm takes the single-cycle per bit of
the divisor, so both 32-bit/16-bit and 16-bit/16-bit
instructions take the same number of cycles to
execute.
3.8 DSP Engine
The DSP engine consists of a high-speed, 17-bit x 17-bit
multiplier, a 40-bit barrel shifter and a 40-bit adder/
subtracter (with two target accumulators, round and
saturation logic).
The DSP engine can also perform inherent accumulator-
to-accumulator operations that require no additional
data. These instructions are ADD, SUB and NEG.
The DSP engine has options selected through bits in
the CPU Core Control register (CORCON) as follows:
• Fractional or Integer DSP Multiply (IF)
• Signed, Unsigned or Mixed-Sign DSP Multiply (US)
• Conventional or Convergent Rounding (RND)
• Automatic Saturation On/Off for ACCA (SATA)
• Automatic Saturation On/Off for ACCB (SATB)
• Automatic Saturation On/Off for Writes to Data
Memory (SATDW)
• Accumulator Saturation mode Selection
(ACCSAT)
TABLE 3-2: DSP INSTRUCTIONS
SUMMARY
Instruction Algebraic
Operation ACC
Write-Back
CLR A = 0 Yes
ED A = (x – y)
2
No
EDAC A = A + (x – y)
2
No
MAC A = A + (x • y) Yes
MAC A = A + x
2
No
MOVSAC No change in A Yes
MPY A = x • y No
MPY A = x
2
No
MPY.N A = – x • y No
MSC A = A – x • y Yes
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dsPIC33EVXXXGM00X/10X FAMILY
4.0 MEMORY ORGAN IZATION
The dsPIC33EVXXXGM00X/10X family architecture
features separate program and data memory spaces
and buses. This architecture also allows the direct
access of program memory from the Data Space (DS)
during code execution.
4.1 Program Address Space
The program address memory space of the
dsPIC33EVXXXGM00X/10X family devices is 4M
instructions. The space is addressable by a 24-bit
value derived either from the 23-bit PC, during program
execution or from table operation, or from DS
remapping, as described in Section 4.7 “Interfacing
Program and Data Memory Spaces”.
User application access to the program memory space
is restricted to the lower half of the address range
(0x000000 to 0x02ABFF). The exception is the use of
the TBLRD operations, which use TBLPAG<7> to read
Device ID sections of the configuration memory space
and the TBLWT operations, which are used to set up the
write latches located in configuration memory space.
The program memory maps, which are presented by
the device family and memory size, are shown in
Figure 4-1 through Figure 4-4.
FIGURE 4-1: PROGRAM MEMORY MAP FOR dsPIC33EV32GM00X/10X DEVICES
(1)
Note: This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To com-
plement the information in this data sheet,
refer to “dsPIC33E/PIC24E Program
Memory” (DS70000613) in the “dsPIC33/
PIC24 Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
Reset Address
0x000000
0x000002
User Program
Flash Memory
0x005780
0x00577E
(10944 instructions)
0x800000
DEVID
0xFEFFFE
0xFF0000
0xFFFFFE
Unimplemented
(Read ‘0’s)
GOTO Instruction
0x000004
Reserved
0x7FFFFE
0x000200
0x0001FE
Interrupt Vector Table
Configuration Memory Space User Memory Space
Device Configuration
0x005800
0x0057FE
Reserved
0xFF0002
Note 1: Memory areas are not shown to scale.
0xFF0004
Executive Code Memory
0x801000
0x800FFE
User OTP Memory
0xF9FFFE
0xFA0000
0xFA0002
0xFA0004
Write Latches
Reserved
0x800F80
Reserved
0x800BFE
0x800C00
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DS70005144G-page 34 2013-2018 Microchip Technology Inc.
FIGURE 4-2: PROGRAM MEMORY MAP FOR dsPIC33EV64GM00X/10X DEVICES
(1)
Note 1: Memory areas are not shown to scale.
Reset Address
0x000000
0x000002
User Program
Flash Memory
0x00AB80
0x00AB7E
(21696 instructions)
0x800000
DEVID
0xFEFFFE
0xFF0000
0xFFFFFE
Unimplemented
(Read ‘0’s)
GOTO Instruction
0x000004
Reserved
0x7FFFFE
0x000200
0x0001FE
Interrupt Vector Table
Configuration Memory Space User Memory Space
Device Configuration
0x00AC00
0x00ABFE
Reserved
0xFF0002
0xFF0004
Executive Code Memory
0x801000
0x800FFE
User OTP Memory
0xF9FFFE
0xFA0000
0xFA0002
0xFA0004
Write Latches
Reserved
0x800F80
Reserved
0x800BFE
0x800C00
2013-2018 Microchip Technology Inc. DS70005144G-page 35
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FIGURE 4-3: PROGRAM MEMORY MAP FOR dsPIC33EV128GM00X/10X DEVICES
(1)
Reset Address
0x000000
0x000002
User Program
Flash Memory
0x015780
0x01577E
(44736 instructions)
0x800000
0xFA0000
Write Latches 0xFA0002
0xFA0004
DEVID
0xFEFFFE
0xFF0000
0xFFFFFE
0xF9FFFE
Unimplemented
(Read ‘0’s)
GOTO Instruction
0x000004
Reserved
0x7FFFFE
Reserved
0x000200
0x0001FE
Interrupt Vector Table
Configuration Memory Space User Memory Space
0x015800
0x0157FE
Reserved
0xFF0002
Note 1: Memory areas are not shown to scale.
0xFF0004
Executive Code Memory
0x801000
0x800FFE
User OTP Memory
Device Configuration
0x800F80
Reserved
0x800BFE
0x800C00
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DS70005144G-page 36 2013-2018 Microchip Technology Inc.
FIGURE 4-4: PROGRAM MEMORY MAP FOR dsPIC33EV256GM00X/10X DEVICES
(1)
Reset Address
0x000000
0x000002
User Program
Flash Memory
0x02AB80
0x02AB7E
(87232 instructions)
0x800000
0xFA0000
Write Latches
0xFA0002
0xFA0004
DEVID
0xFEFFFE
0xFF0000
0xFFFFFE
0xF9FFFE
Unimplemented
(Read ‘
0
’
s
)
GOTO Instruction
0x000004
Reserved
0x7FFFFE
Reserved
0x000200
0x0001FE
Interrupt Vector Table
Configuration Memory Space User Memory Space
0x02AC00
0x02ABFE
Reserved
0xFF0002
Note 1: Memory areas are not shown to scale.
0xFF0004
Executive Code Memory
0x801000
0x800FFE
User OTP Memory
0x800F80
Device Configuration
Reserved
0x800BFE
0x800C00
2013-2018 Microchip Technology Inc. DS70005144G-page 37
dsPIC33EVXXXGM00X/10X FAMILY
4.1.1 PROGRAM MEMORY
ORGANIZATION
The program memory space is organized in word-
addressable blocks. Although it is treated as 24 bits
wide, it is more appropriate to think of each address of
the program memory as a lower and upper word, with
the upper byte of the upper word being unimplemented.
The lower word always has an even address, while the
upper word has an odd address (see Figure 4-5).
Program memory addresses are always word-aligned
on the lower word and addresses are incremented or
decremented by two during the code execution. This
arrangement provides compatibility with the Data
Memory Space Addressing and makes data in the
program memory space accessible.
4.1.2 INTERRUPT AND TRAP VECTORS
All dsPIC33EVXXXGM00X/10X family devices reserve
the addresses between 0x000000 and 0x000200 for
hard-coded program execution vectors. A hardware
Reset vector is provided to redirect code execution
from the default value of the PC on device Reset to the
actual start of code. A GOTO instruction is programmed
by the user application at address, 0x000000 of Flash
memory, with the actual address for the start of code at
address, 0x000002 of Flash memory.
For more information on the Interrupt Vector Tables,
see Section 7.1 “Interrupt Vector Table”.
FIGURE 4-5: PROGRAM MEMORY ORGANIZATION
0816
PC Address
0x000000
0x000002
0x000004
0x000006
23
00000000
00000000
00000000
00000000
Program Memory
‘Phantom’ Byte
(read as ‘0’)
Least Significant WordMost Significant Word
Instruction Width
0x000001
0x000003
0x000005
0x000007
msw
Address (lsw Address)
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4.2 Data Addres s Space
The dsPIC33EVXXXGM00X/10X family CPU has a
separate, 16-bit wide data memory space. The Data
Space (DS) is accessed using separate Address Gen-
eration Units (AGUs) for read and write operations. The
data memory maps, which are presented by device
family and memory size, are shown in Figure 4-6 and
Figure 4-8.
All Effective Addresses (EAs) in the data memory space
are 16 bits wide and point to bytes within the DS. This
arrangement gives a Base Data Space address range of
64 Kbytes or 32K words.
The Base Data Space address is used in conjunction
with a Data Space Read or Write Page register
(DSRPAG or DSWPAG) to form an Extended Data
Space (EDS), which has a total address range of
16 Mbytes.
dsPIC33EVXXXGM00X/10X family devices implement
up to 20 Kbytes of data memory (4 Kbytes of data
memory for Special Function Registers and up to
16 Kbytes of data memory for RAM). If an EA points to
a location outside of this area, an all zero word or byte
is returned.
4.2.1 DATA SPACE WIDTH
The data memory space is organized in byte-
addressable, 16-bit wide blocks. Data is aligned in
data memory and registers as 16-bit words, but all DS
EAs resolve to bytes. The Least Significant Bytes
(LSBs) of each word have even addresses, while the
Most Significant Bytes (MSBs) have odd addresses.
4.2.2 DATA MEMORY ORGANIZATION
AND ALIGNMENT
To maintain backward compatibility with PIC
®
MCU
devices and improve Data Space memory usage
efficiency, the dsPIC33EVXXXGM00X/10X family
instruction set supports both word and byte operations.
As a consequence of byte accessibility, all the Effective
Address calculations are internally scaled to step
through word-aligned memory. For example, the core
recognizes that Post-Modified Register Indirect
Addressing mode [Ws++] results in a value of Ws + 1
for byte operations and Ws + 2 for word operations.
A data byte read, reads the complete word that con-
tains the byte, using the LSb of any EA to determine
which byte to select. The selected byte is placed onto
the LSB of the data path. That is, data memory and reg-
isters are organized as two parallel, byte-wide entities
with shared (word) address decode, but separate write
lines. Data byte writes only write to the corresponding
side of the array or register that matches the byte
address.
All word accesses must be aligned to an even address.
Misaligned word data fetches are not supported, there-
fore, care must be taken when mixing byte and word
operations or translating from 8-bit MCU code. If a
misaligned read or write is attempted, an address error
trap is generated. If the error occurred on a read, the
instruction underway is completed. If the error occurred
on a write, the instruction is executed but the write does
not occur. In either case, a trap is then executed,
allowing the system and/or user application to examine
the machine state prior to execution of the address
Fault.
All byte loads into any W register are loaded into the
LSB; the MSB is not modified.
A Sign-Extend (SE) instruction is provided to allow user
applications to translate 8-bit signed data to 16-bit
signed values. Alternatively, for 16-bit unsigned data,
user applications can clear the MSB of any W register
by executing a Zero-Extend (ZE) instruction on the
appropriate address.
4.2.3 SFR SPACE
The first four Kbytes of the Near Data Space, from
0x0000 to 0x0FFF, is primarily occupied by Special
Function Registers (SFRs). These are used by the
dsPIC33EVXXXGM00X/10X family core and peripheral
modules for controlling the operation of the device.
SFRs are distributed among the modules that they
control and are generally grouped together by module.
Much of the SFR space contains unused addresses;
these are read as ‘0’.
4.2.4 NEAR DATA SPACE
The 8-Kbyte area, between 0x0000 and 0x1FFF, is
referred to as the Near Data Space. Locations in this
space are directly addressable through a 13-bit abso-
lute address field within all memory direct instructions.
Additionally, the whole DS is addressable using MOV
instructions, which support Memory Direct Addressing
mode with a 16-bit address field, or by using Indirect
Addressing mode using a Working register as an
Address Pointer.
Note: The actual set of peripheral features and
interrupts varies by the device. Refer to the
corresponding device tables and pinout
diagrams for device-specific information.
2013-2018 Microchip Technology Inc. DS70005144G-page 39
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FIGURE 4-6: DATA MEMORY MAP FOR 32-Kbyte DEVICES
(1)
0x0000
0x0FFE
0xFFFE
LSB
Address
16 Bits
LSBMSB
MSB
Address
0x0001
0x0FFF
0xFFFF
Optionally
Mapped
into Program
Memory Space
0x1FFF 0x1FFE
0x1001 0x1000
4-Kbyte
SFR Space
4-Kbyte
SRAM Space
0x20000x2001
Space
Near Data
8-Kbyte
Note 1: Memory areas are not shown to scale.
(via PSV)
0x17FE
0x17FF
0x1801 0x1800
X Data
Unimplemented (X)
SFR Space
0x7FFF 0x7FFE
0x8000
0x8001
X Data RAM (X)
Y Data RAM (Y)
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DS70005144G-page 40 2013-2018 Microchip Technology Inc.
FIGURE 4-7: DATA MEMORY MAP FOR 64-Kbyte/128-Kbyte DEVICES
(1)
0x0000
0x0FFE
0xFFFE
LSB
Address
16 Bits
LSBMSB
MSB
Address
0x0001
0x0FFF
0xFFFF
Optionally
Mapped
into Program
Memory Space
0x2FFF 0x2FFE
0x1001 0x1000
4-Kbyte
SFR Space
8-Kbyte
SRAM Space
0x30000x3001
Space
Near Data
8-Kbyte
Note 1: Memory areas are not shown to scale.
(via PSV)
0x1FFE
0x1FFF
0x2001 0x2000
X Data
Unimplemented (X)
SFR Space
0x7FFF 0x7FFE
0x8000
0x8001
X Data RAM (X)
Y Data RAM (Y)
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FIGURE 4-8: DATA MEMORY MAP FOR 256-Kbyte DEVICES
(1)
0x0000
0x0FFE
0xFFFE
LSB
Address
16 Bits
LSBMSB
MSB
Address
0x0001
0x0FFF
0xFFFF
Optionally
Mapped
into Program
Memory Space
0x4FFF 0x4FFE
0x1001 0x1000
4-Kbyte
SFR Space
16-Kbyte
SRAM Space
0x5000
0x5001
Space
Near Data
8-Kbyte
Note 1: Memory areas are not shown to scale.
(via PSV)
0x2FFE
0x2FFF
0x3001 0x3000
X Data
Unimplemented (X)
SFR Space
X Data RAM (X)
0x7FFF 0x7FFE
0x8000
0x8001
0x1FFE
0x2000
0x1FFF
0x2001
Y Data RAM (Y)
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4.2.5 X AND Y DATA SPACES
The dsPIC33EVXXXGM00X/10X family core has two
Data Spaces: X and Y. These Data Spaces can be
considered either separate (for some DSP instructions)
or as one unified, linear address range (for MCU
instructions). The Data Spaces are accessed using two
Address Generation Units (AGUs) and separate data
paths. This feature allows certain instructions to
concurrently fetch two words from RAM, thereby
enabling efficient execution of DSP algorithms, such as
Finite Impulse Response (FIR) filtering and Fast
Fourier Transform (FFT).
The X DS is used by all instructions and supports all
addressing modes. The X DS has separate read and
write data buses. The X read data bus is the read data
path for all instructions that view the DS as combined X
and Y address space. It is also the X data prefetch path
for the dual operand DSP instructions (MAC class).
The Y DS is used in concert with the X DS by the MAC
class of instructions (CLR, ED, EDAC, MAC, MOVSAC,
MPY, MPY.N and MSC) to provide two concurrent data
read paths.
Both the X and Y Data Spaces support Modulo
Addressing mode for all instructions, subject to
addressing mode restrictions. Bit-Reversed Addressing
mode is only supported for writes to the X Data Space.
All data memory writes, including in DSP instructions,
view Data Space as combined X and Y address space.
The boundary between the X and Y Data Spaces is
device-dependent and is not user-programmable.
2013-2018 Microchip Technology Inc. DS70005144G-page 43
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4.3 Special Function Register Map s
TABLE 4-1: CPU CORE REGISTER MAP
SFR
Name Addr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
W0 0000 W0 (WREG) 0000
W1 0002 W1 0000
W2 0004 W2 0000
W3 0006 W3 0000
W4 0008 W4 0000
W5 000A W5 0000
W6 000C W6 0000
W7 000E W7 0000
W8 0010 W8 0000
W9 0012 W9 0000
W10 0014 W10 0000
W11 0016 W11 0000
W12 0018 W12 0000
W13 001A W13 0000
W14 001C W14 0000
W15 001E W15 0800
SPLIM 0020 SPLIM xxxx
ACCAL 0022 ACCAL xxxx
ACCAH 0024 ACCAH xxxx
ACCAU 0026 Sign Extension of ACCA<39> ACCAU xxxx
ACCBL 0028 ACCBL xxxx
ACCBH 002A ACCBH xxxx
ACCBU 002C Sign Extension of ACCB<39> ACCBU xxxx
PCL 002E Program Counter Low Word Register —0000
PCH 0030 — — — — — — — — — Program Counter High Word Register 0000
DSRPAG 0032 — — — — — — Data Space Read Page Register 0001
DSWPAG 0034 — — — — — — — Data Space Write Page Register 0001
RCOUNT 0036 REPEAT Loop Counter Register 0 xxxx
DCOUNT 0038 DCOUNT<15:1> 0 xxxx
DOSTARTL 003A DOSTARTL<15:1> 0 xxxx
DOSTARTH 003C — — — — — — — — — — DOSTARTH<5:0> 00xx
DOENDL 003E DOENDL<15:1> —xxxx
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
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DOENDH 0040 — — — — — — — — — — DOENDH<5:0> 00xx
SR 0042 OA OB SA SB OAB SAB DA DC IPL2 IPL1 IPL0 RA N OV Z C 0000
CORCON 0044 VAR — US1 US0 EDT DL2 DL1 DL0 SATA SATB SATDW ACCSAT IPL3 SFA RND IF 0020
MODCON 0046 XMODEN YMODEN —— BWM3 BWM2 BWM1 BWM0 YWM3 YWM2 YWM1 YWM0 XWM3 XWM2 XWM1 XWM0 0000
XMODSRT 0048 XMODSRT<15:1> 0 xxxx
XMODEND 004A XMODEND<15:1> 1 xxxx
YMODSRT 004C YMODSRT<15:1> 0 xxxx
YMODEND 004E YMODEND<15:1> 1 xxxx
XBREV 0050 BREN XBREV14 XBREV13 XBREV12 XBREV11 XBREV10 XBREV9 XBREV8 XBREV7 XBREV6 XBREV5 XBREV4 XBREV3 XBREV2 XBREV1 XBREV0 0xxx
DISICNT 0052 — — DISICNT<13:0> xxxx
TBLPAG 0054 — — — — — — — — TBLPAG<7:0> 0000
MSTRPR 0058 MSTRPR<15:0> 0000
CTXTSTAT 005A — — — — — CCTXI2 CCTXI1 CCTXI0 — — — — — MCTXI2 MCTXI1 MCTXI0 0000
TABLE 4-1: CPU CORE REGISTER MAP (CONTINUED)
SFR
Name Addr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2013-2018 Microchip Technology Inc. DS70005144G-page 45
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TABLE 4-2: TIMERS REGISTER MAP
SFR
Name Addr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TMR1 0100 Timer1 Register 0000
PR1 0102 Period Register 1 FFFF
T1CON 0104 TON —TSIDL — — — — — — TGATE TCKPS1 TCKPS0 — TSYNC TCS —0000
TMR2 0106 Timer2 Register 0000
TMR3HLD 0108 Timer3 Holding Register (For 32-bit timer operations only) 0000
TMR3 010A Timer3 Register 0000
PR2 010C Period Register 2 FFFF
PR3 010E Period Register 3 FFFF
T2CON 0110 TON —TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 —TCS —0000
T3CON 0112 TON —TSIDL — — — — — — TGATE TCKPS1 TCKPS0 ——TCS —0000
TMR4 0114 Timer4 Register 0000
TMR5HLD 0116 Timer5 Holding Register (For 32-bit operations only) 0000
TMR5 0118 Timer5 Register 0000
PR4 011A Period Register 4 FFFF
PR5 011C Period Register 5 FFFF
T4CON 011E TON —TSIDL — — — — — — TGATE TCKPS1 TCKPS0 T32 —TCS —0000
T5CON 0120 TON —TSIDL — — — — — — TGATE TCKPS1 TCKPS0 ——TCS —0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
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TABLE 4-3: INPUT CAPTURE 1 THROUGH INPUT CAPTURE 4 REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
IC1CON1 0140 —— ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC1CON2 0142 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC1BUF 0144 Input Capture 1 Buffer Register xxxx
IC1TMR 0146 Input Capture 1 Timer Register 0000
IC2CON1 0148 —— ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC2CON2 014A — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC2BUF 014C Input Capture 2 Buffer Register xxxx
IC2TMR 014E Input Capture 2 Timer Register 0000
IC3CON1 0150 —— ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC3CON2 0152 — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC3BUF 0154 Input Capture 3 Buffer Register xxxx
IC3TMR 0156 Input Capture 3 Timer Register 0000
IC4CON1 0158 —— ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — — — ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0 0000
IC4CON2 015A — — — — — — — IC32 ICTRIG TRIGSTAT — SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000D
IC4BUF 015C Input Capture 4 Buffer Register xxxx
IC4TMR 015E Input Capture 4 Timer Register 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-4: I2C1 REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
I2C1CON1 0200 I2CEN — I2CSIDL SCLREL STRICT A10M DISSLW SMEN GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN 1000
I2C1CON2 0202 — — — — — — — — — PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 1000
I2C1STAT 0204 ACKSTAT TRSTAT ACKTIM —— BCL GCSTAT ADD10 IWCOL I2COV D_A P S R_W RBF TBF 0000
I2C1ADD 0206 — — — — — — I2C1 Address Register 0000
I2C1MSK 0208 — — — — — — I2C1 Address Mask Register 0000
I2C1BRG 020A Baud Rate Generator Register 0000
I2C1TRN 020C — — — — — — — — I2C1 Transmit Register 00FF
I2C1RCV 020E — — — — — — — — I2C1 Receive Register 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2013-2018 Microchip Technology Inc. DS70005144G-page 47
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-6: SPI1 AND SPI2 REGISTER MAP
TABLE 4-5: UART1 AND UART2 REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
U1MODE 0220 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD URXINV BRGH PDSEL1 PDSEL0 STSEL 0000
U1STA 0222 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0110
U1TXREG 0224 — — — — — — — UART1 Transmit Register xxxx
U1RXREG 0226 — — — — — — — UART1 Receive Register 0000
U1BRG 0228 UART1 Baud Rate Generator Prescaler Register 0000
U2MODE 0230 UARTEN — USIDL IREN RTSMD — UEN1 UEN0 WAKE LPBACK ABAUD URXINV BRGH PDSEL1 PDSEL0 STSEL 0000
U2STA 0232 UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN UTXBF TRMT URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA 0110
U2TXREG 0234 — — — — — — — UART2 Transmit Register xxxx
U2RXREG 0236 — — — — — — — UART2 Receive Register 0000
U2BRG 0238 UART2 Baud Rate Generator Prescaler Register 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
SPI1STAT 0240 SPIEN — SPISIDL —— SPIBEC2 SPIBEC1 SPIBEC0 SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF 0000
SPI1CON1 0242 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000
SPI1CON2 0244 FRMEN SPIFSD FRMPOL — — — — — — — — — — — FRMDLY SPIBEN 0000
SPI1BUF 0248 SPI1 Transmit and Receive Buffer Register 0000
SPI2STAT 0260 SPIEN — SPISIDL —— SPIBEC2 SPIBEC1 SPIBEC0 SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF 0000
SPI2CON1 0262 — — — DISSCK DISSDO MODE16 SMP CKE SSEN CKP MSTEN SPRE2 SPRE1 SPRE0 PPRE1 PPRE0 0000
SPI2CON2 0264 FRMEN SPIFSD FRMPOL — — — — — — — — — — — FRMDLY SPIBEN 0000
SPI2BUF 0268 SPI2 Transmit and Receive Buffer Register 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 48 2013-2018 Microchip Technology Inc.
TABLE 4-7: ADC1 REGISTER MAP
SFR
Name A ddr. Bit 15 B it 14 Bit 13 Bit 12 Bit 1 1 Bit 1 0 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
ADC1BUF0 0300 ADC1 Data Buffer 0
xxxx
ADC1BUF1 0302 ADC1 Data Buffer 1
xxxx
ADC1BUF2 0304 ADC1 Data Buffer 2
xxxx
ADC1BUF3 0306 ADC1 Data Buffer 3
xxxx
ADC1BUF4 0308 ADC1 Data Buffer 4
xxxx
ADC1BUF5 030A ADC1 Data Buffer 5
xxxx
ADC1BUF6 030C ADC1 Data Buffer 6
xxxx
ADC1BUF7 030E ADC1 Data Buffer 7
xxxx
ADC1BUF8 0310 ADC1 Data Buffer 8
xxxx
ADC1BUF9 0312 ADC1 Data Buffer 9
xxxx
ADC1BUFA 0314 ADC1 Data Buffer 10
xxxx
ADC1BUFB 0316 ADC1 Data Buffer 11
xxxx
ADC1BUFC 0318 ADC1 Data Buffer 12
xxxx
ADC1BUFD 031A ADC1 Data Buffer 13
xxxx
ADC1BUFE 031C ADC1 Data Buffer 14
xxxx
ADC1BUFF 031E ADC1 Data Buffer 15
xxxx
AD1CON1 0320 ADON — ADSIDL ADDMABM — AD12B FORM1 FORM0 SSRC2 SSRC1 SSRC0 SSRCG SIMSAM ASAM SAMP DONE
0000
AD1CON2 0322 VCFG2 VCFG1 VCFG0 —— CSCNA CHPS1 CHPS0 BUFS SMPI4 SMPI3 SMPI2 SMPI1 SMPI0 BUFM ALTS
0000
AD1CON3 0324 ADRC —— SAMC4 SAMC3 SAMC2 SAMC1 SAMC0 ADCS7 ADCS6 ADCS5 ADCS4 ADCS3 ADCS2 ADCS1 ADCS0
0000
AD1CHS123 0326 — — — CH123SB2 CH123SB1 CH123NB1 CH123NB0 CH123SB0 — — — CH123SA2 CH123SA1 CH123NA1 CH123NA0 CH123SA0
0000
AD1CHS0 0328 CH0NB —CH0SB5 CH0SB4 CH0SB3 CH0SB2 CH0SB1 CH0SB0 CH0NA —CH0SA5 CH0SA4 CH0SA3 CH0SA2 CH0SA1 CH0SA0
0000
AD1CSSH 032E CSS<31:24> — — — — CSS<19:16>
0000
AD1CSSL 0330 CSS<15:0>
0000
AD1CON4 0332 — — — — — — — ADDMAEN — — — — — DMABL2 DMABL1 DMABL0
0000
Legend:
x
= unknown value on Reset; — = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
TABLE 4-8: CTMU REGISTER MAP
SFR
Name A d dr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 B it 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CTMUCON1 033A CTMUEN — CTMUSIDL TGEN EDGEN EDGSEQEN IDISSEN CTTRIG — — — — — — — —
0000
CTMUCON2 033C EDG1MOD EDG1POL EDG1SEL3 EDG1SEL2 EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT EDG2MOD EDG2POL EDG2SEL3 EDG2SEL2 EDG2SEL1 EDG2SEL0 — —
0000
CTMUICON 033E ITRIM5 ITRIM4 ITRIM3 ITRIM2 ITRIM1 ITRIM0 IRNG1 IRNG0 — — — — — — — —
0000
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
2013-2018 Microchip Technology Inc. DS70005144G-page 49
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-9: CAN1 REGISTER MAP WHEN WIN (C1CTRL<0>) = 0 OR 1 FOR dsPIC33EVXXXGM10X DEVICES
SFR
Name A ddr. Bit 1 5 Bit 14 Bit 1 3 Bi t 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
C1CTRL1 0400 —— CSIDL ABAT CANCKS REQOP2 REQOP1 REQOP0 OPMODE2 OPMODE1 OPMODE0 —CANCAP——WIN
0480
C1CTRL2 0402 — — — — — — — — — — —DNCNT<4:0>
0000
C1VEC 0404 — — — FILHIT4 FILHIT3 FILHIT2 FILHIT1 FILHIT0 — ICODE6 ICODE5 ICODE4 ICODE3 ICODE2 ICODE1 ICODE0
0000
C1FCTRL 0406 DMABS2 DMABS1 DMABS0 — — — — — — — FSA5 FSA4 FSA3 FSA2 FSA1 FSA0
0000
C1FIFO 0408 —— FBP5 FBP4 FBP3 FBP2 FBP1 FBP0 —— FNRB5 FNRB4 FNRB3 FNRB2 FNRB1 FNRB0
0000
C1INTF 040A —— TXBO TXBP RXBP TXWAR RXWAR EWARN IVRIF WAKIF ERRIF — FIFOIF RBOVIF RBIF TBIF
0000
C1INTE 040C — — — — — — — — IVRIE WAKIE ERRIE — FIFOIE RBOVIE RBIE TBIE
0000
C1EC 040E TERRCNT7 TERRCNT6 TERRCNT5 TERRCNT4 TERRCNT3 TERRCNT2 TERRCNT1 TERRCNT0 RERRCNT7 RERRCNT6 RERRCNT5 RERRCNT4 RERRCNT3 RERRCNT2 RERRCNT1RERRCNT0
0000
C1CFG1 0410 — — — — — — — — SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0
0000
C1CFG2 0412 —WAKFIL— — — SEG2PH2 SEG2PH1 SEG2PH0 SEG2PHTS SAM SEG1PH2 SEG1PH1 SEG1PH0 PRSEG2 PRSEG1 PRSEG0
0000
C1FEN1 0414 FLTEN<15:0>
FFFF
C1FMSKSEL1 0418 F7MSK1 F7MSK0 F6MSK1 F6MSK0 F5MSK1 F5MSK0 F4MSK1 F4MSK0 F3MSK1 F3MSK0 F2MSK1 F2MSK0 F1MSK1 F1MSK0 F0MSK1 F0MSK0
0000
C1FMSKSEL2 041A F15MSK1 F15MSK0 F14MSK1 F14MSK0 F13MSK1 F13MSK0 F12MSK1 F12MSK0 F11MSK1 F11MSK0 F10MSK1 F10MSK0 F9MSK1 F9MSK0 F8MSK1 F8MSK0
0000
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
TABLE 4-10: CAN1 REGISTER MAP WHEN WIN (C1CTRL<0>) = 0 FOR dsPIC33EVXXXGM10X DEVICES
SFR
Name Addr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
0400-
041E
See definition when WIN = x
C1RXFUL1 0420 RXFUL<15:0> 0000
C1RXFUL2 0422 RXFUL<31:16> 0000
C1RXOVF1 0428 RXOVF<15:0> 0000
C1RXOVF2 042A RXOVF<31:16> 0000
C1TR01CON 0430 TXEN1 TXABT1 TXLARB1 TXERR1 TXREQ1 RTREN1 TX1PRI1 TX1PRI0 TXEN0 TXABAT0 TXLARB0 TXERR0 TXREQ0 RTREN0 TX0PRI1 TX0PRI0 0000
C1TR23CON 0432 TXEN3 TXABT3 TXLARB3 TXERR3 TXREQ3 RTREN3 TX3PRI1 TX3PRI0 TXEN2 TXABAT2 TXLARB2 TXERR2 TXREQ2 RTREN2 TX2PRI1 TX2PRI0 0000
C1TR45CON 0434 TXEN5 TXABT5 TXLARB5 TXERR5 TXREQ5 RTREN5 TX5PRI1 TX5PRI0 TXEN4 TXABAT4 TXLARB4 TXERR4 TXREQ4 RTREN4 TX4PRI1 TX4PRI0 0000
C1TR67CON 0436 TXEN7 TXABT7 TXLARB7 TXERR7 TXREQ7 RTREN7 TX7PRI1 TX7PRI0 TXEN6 TXABAT6 TXLARB6 TXERR6 TXREQ6 RTREN6 TX6PRI1 TX6PRI0 xxxx
C1RXD 0440 CAN1 Receive Data Word Register xxxx
C1TXD 0442 CAN1 Transmit Data Word Register xxxx
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 50 2013-2018 Microchip Technology Inc.
TABLE 4-11: CAN1 REGISTER MAP WHEN WIN (C1CTRL<0>) = 1 FOR dsPIC33EVXXXGM10X DEVICES
SFR
Name Addr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
0400-
041E
See definition when WIN = x
C1BUFPNT1 0420 F3BP3 F3BP2 F3BP1 F3BP0 F2BP3 F2BP2 F2BP1 F2BP0 F1BP3 F1BP2 F1BP1 F1BP0 F0BP3 F0BP2 F0BP1 F0BP0 0000
C1BUFPNT2 0422 F7BP3 F7BP2 F7BP1 F7BP0 F6BP3 F6BP2 F6BP1 F6BP0 F5BP3 F5BP2 F5BP1 F5BP0 F4BP3 F4BP2 F4BP1 F4BP0 0000
C1BUFPNT3 0424 F11BP3 F11BP2 F11BP1 F11BP0 F10BP3 F10BP2 F10BP1 F10BP0 F9BP3 F9BP2 F9BP1 F9BP0 F8BP3 F8BP2 F8BP1 F8BP0 0000
C1BUFPNT4 0426 F15BP3 F15BP2 F15BP1 F15BP0 F14BP3 F14BP2 F14BP1 F14BP0 F13BP3 F13BP2 F13BP1 F13BP0 F12BP3 F12BP2 F12BP1 F12BP0 0000
C1RXM0SID 0430 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 —MIDE—EID17EID16xxxx
C1RXM0EID 0432 EID<15:0> xxxx
C1RXM1SID 0434 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 —MIDE—EID17EID16xxxx
C1RXM1EID 0436 EID<15:0> xxxx
C1RXM2SID 0438 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 —MIDE—EID17EID16xxxx
C1RXM2EID 043A EID<15:0> xxxx
C1RXF0SID 0440 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF0EID 0442 EID<15:0> xxxx
C1RXF1SID 0444 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF1EID 0446 EID<15:0> xxxx
C1RXF2SID 0448 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF2EID 044A EID<15:0> xxxx
C1RXF3SID 044C SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF3EID 044E EID<15:0> xxxx
C1RXF4SID 0450 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF4EID 0452 EID<15:0> xxxx
C1RXF5SID 0454 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF5EID 0456 EID<15:0> xxxx
C1RXF6SID 0458 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF6EID 045A EID<15:0> xxxx
C1RXF7SID 045C SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF7EID 045E EID<15:0> xxxx
C1RXF8SID 0460 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF8EID 0462 EID<15:0> xxxx
C1RXF9SID 0464 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF9EID 0466 EID<15:0> xxxx
C1RXF10SID 0468 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF10EID 046A EID<15:0> xxxx
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2013-2018 Microchip Technology Inc. DS70005144G-page 51
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-12: SENT1 RECEIVER REGISTER MAP
TABLE 4-13: SENT2 RECEIVER REGISTER MAP
C1RXF11SID 046C SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF11EID 046E EID<15:0> xxxx
C1RXF12SID 0470 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF12EID 0472 EID<15:0> xxxx
C1RXF13SID 0474 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF13EID 0476 EID<15:0> xxxx
C1RXF14SID 0478 SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF14EID 047A EID<15:0> xxxx
C1RXF15SID 047C SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3 SID2 SID1 SID0 — EXIDE —EID17EID16xxxx
C1RXF15EID 047E EID<15:0> xxxx
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
SENT1CON1 0500 SNTEN — SNTSIDL — RCVEN TXM TXPOL CRCEN PPP SPCEN —PS — NIBCNT2 NIBCNT1 NIBCNT0 0000
SENT1CON2 0504 TICKTIME<15:0> (Transmit modes) or SYNCMAX<15:0> (Receive mode) FFFF
SENT1CON3 0508 FRAMETIME<15:0> (Transmit modes) or SYNCMIN<15:0> (Receive mode) FFFF
SENT1STAT 050C — — — — — — — — PAUSE NIB2 NIB1 NIB0 CRCERR FRMERR RXIDLE SYNCTXEN 0000
SENT1SYNC 0510 Synchronization Time Period Register (Transmit mode) 0000
SENT1DATL 0514 DATA4<3:0> DATA5<3:0> DATA6<3:0> CRC<3:0> 0000
SENT1DATH 0516 STAT<3:0> DATA1<3:0> DATA2<3:0> DATA3<3:0> 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
SENT2CON1 0520 SNTEN — SNTSIDL — RCVEN TXM TXPOL CRCEN PPP SPCEN —PS — NIBCNT2 NIBCNT1 NIBCNT0 0000
SENT2CON2 0524 TICKTIME<15:0> (Transmit modes) or SYNCMAX<15:0> (Receive mode) FFFF
SENT2CON3 0528 FRAMETIME<15:0> (Transmit modes) or SYNCMIN<15:0> (Receive mode) FFFF
SENT2STAT 052C — — — — — — — — PAUSE NIB2 NIB1 NIB0 CRCERR FRMERR RXIDLE SYNCTXEN 0000
SENT2SYNC 0530 Synchronization Time Period Register (Transmit mode) 0000
SENT2DATL 0534 DATA4<3:0> DATA5<3:0> DATA6<3:0> CRC<3:0> 0000
SENT2DATH 0536 STAT<3:0> DATA1<3:0> DATA2<3:0> DATA3<3:0> 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
TABLE 4-11: CAN1 REGISTER MAP WHEN WIN (C1CTRL<0>) = 1 FOR dsPIC33EVXXXGM10X DEVICES (CONTINUED)
SFR
Name Addr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 52 2013-2018 Microchip Technology Inc.
TABLE 4-14: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33EVXXXGM002/102 DEVICES
TABLE 4-15: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33EVXXXGM004/104 DEVICES
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RPOR0 0670 —— RP35R5 RP35R4 RP35R3 RP35R2 RP35R1 RP35R0 —— RP20R5 RP20R4 RP20R3 RP20R2 RP20R1 RP20R0 0000
RPOR1 0672 —— RP37R5 RP37R4 RP37R3 RP37R2 RP37R1 RP37R0 —— RP36R5 RP36R4 RP36R3 RP36R2 RP36R1 RP36R0 0000
RPOR2 0674 —— RP39R5 RP39R4 RP39R3 RP39R2 RP39R1 RP39R0 —— RP38R5 RP38R4 RP38R3 RP38R2 RP38R1 RP38R0 0000
RPOR3 0676 —— RP41R5 RP41R4 RP41R3 RP41R2 RP41R1 RP41R0 —— RP40R5 RP40R4 RP40R3 RP40R2 RP40R1 RP40R0 0000
RPOR4 0678 —— RP43R5 RP43R4 RP43R3 RP43R2 RP43R1 RP43R0 —— RP42R5 RP42R4 RP42R3 RP42R2 RP42R1 RP42R0 0000
RPOR10 0684 —— RP176R<5:0> — — — — — — — — 0000
RPOR11 0686 —— RP178R5 RP178R4 RP178R3 RP178R2 RP178R1 RP178R0 —— RP177R5 RP177R4 RP177R3 RP177R2 RP177R1 RP177R0 0000
RPOR12 0688 —— RP180R5 RP180R4 RP180R3 RP180R2 RP180R1 RP180R0 —— RP179R5 RP179R4 RP179R3 RP179R2 RP179R1 RP179R0 0000
RPOR13 068A — — — — — — — — — — RP181R<5:0> 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RPOR0 0670 —— RP35R5 RP35R4 RP35R3 RP35R2 RP35R1 RP35R0 —— RP20R5 RP20R4 RP20R3 RP20R2 RP20R1 RP20R0 0000
RPOR1 0672 —— RP37R5 RP37R4 RP37R3 RP37R2 RP37R1 RP37R0 —— RP36R5 RP36R4 RP36R3 RP36R2 RP36R1 RP36R0 0000
RPOR2 0674 —— RP39R5 RP39R4 RP39R3 RP39R2 RP39R1 RP39R0 —— RP38R5 RP38R4 RP38R3 RP38R2 RP38R1 RP38R0 0000
RPOR3 0676 —— RP41R5 RP41R4 RP41R3 RP41R2 RP41R1 RP41R0 —— RP40R5 RP40R4 RP40R3 RP40R2 RP40R1 RP40R0 0000
RPOR4 0678 —— RP43R5 RP43R4 RP43R3 RP43R2 RP43R1 RP43R0 —— RP42R5 RP42R4 RP42R3 RP42R2 RP42R1 RP42R0 0000
RPOR5 067A —— RP49R5 RP49R4 RP49R3 RP49R2 RP49R1 RP49R0 —— RP48R5 RP48R4 RP48R3 RP48R2 RP48R1 RP48R0 0000
RPOR6 067C —— RP55R5 RP55R4 RP55R3 RP55R2 RP55R1 RP55R0 —— RP54R5 RP54R4 RP54R3 RP54R2 RP54R1 RP54R0 0000
RPOR7 067E —— RP57R5 RP57R4 RP57R3 RP57R2 RP57R1 RP57R0 —— RP56R5 RP56R4 RP56R3 RP56R2 RP56R1 RP56R0 0000
RPOR10 0684 —— RP176R<5:0> — — — — — — — — 0000
RPOR11 0686 —— RP178R5 RP178R4 RP178R3 RP178R2 RP178R1 RP178R0 —— RP177R5 RP177R4 RP177R3 RP177R2 RP177R1 RP177R0 0000
RPOR12 0688 —— RP180R5 RP180R4 RP180R3 RP180R2 RP180R1 RP180R0 —— RP179R5 RP179R4 RP179R3 RP179R2 RP179R1 RP179R0 0000
RPOR13 068A — — — — — — — — — — RP181R<5:0> 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2013-2018 Microchip Technology Inc. DS70005144G-page 53
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-16: PERIPHERAL PIN SELECT OUTPUT REGISTER MAP FOR dsPIC33EVXXXGM006/106 DEVICES
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RPOR0 0670 —— RP35R5 RP35R4 RP35R3 RP35R2 RP35R1 RP35R0 —— RP20R5 RP20R4 RP20R3 RP20R2 RP20R1 RP20R0 0000
RPOR1 0672 —— RP37R5 RP37R4 RP37R3 RP37R2 RP37R1 RP37R0 —— RP36R5 RP36R4 RP36R3 RP36R2 RP36R1 RP36R0 0000
RPOR2 0674 —— RP39R5 RP39R4 RP39R3 RP39R2 RP39R1 RP39R0 —— RP38R5 RP38R4 RP38R3 RP38R2 RP38R1 RP38R0 0000
RPOR3 0676 —— RP41R5 RP41R4 RP41R3 RP41R2 RP41R1 RP41R0 —— RP40R5 RP40R4 RP40R3 RP40R2 RP40R1 RP40R0 0000
RPOR4 0678 —— RP43R5 RP43R4 RP43R3 RP43R2 RP43R1 RP43R0 —— RP42R5 RP42R4 RP42R3 RP42R2 RP42R1 RP42R0 0000
RPOR5 067A —— RP49R5 RP49R4 RP49R3 RP49R2 RP49R1 RP49R0 —— RP48R5 RP48R4 RP48R3 RP48R2 RP48R1 RP48R0 0000
RPOR6 067C —— RP55R5 RP55R4 RP55R3 RP55R2 RP55R1 RP55R0 —— RP54R5 RP54R4 RP54R3 RP54R2 RP54R1 RP54R0 0000
RPOR7 067E —— RP57R5 RP57R4 RP57R3 RP57R2 RP57R1 RP57R0 —— RP56R5 RP56R4 RP56R3 RP56R2 RP56R1 RP56R0 0000
RPOR8 0680 —— RP70R5 RP70R4 RP70R3 RP70R2 RP70R1 RP70R0 —— RP69R5 RP69R4 RP69R3 RP69R2 RP69R1 RP69R0 0000
RPOR9 0682 —— RP118R5 RP118R4 RP118R3 RP118R2 RP118R1 RP118R0 —— RP97R5 RP97R4 RP97R3 RP97R2 RP97R1 RP97R0 0000
RPOR10 0684 —— RP176R5 RP176R4 RP176R3 RP176R2 RP176R1 RP176R0 —— RP120R5 RP120R4 RP120R3 RP120R2 RP120R1 RP120R0 0000
RPOR11 0686 —— RP178R5 RP178R4 RP178R3 RP178R2 RP178R1 RP178R0 —— RP177R5 RP177R4 RP177R3 RP177R2 RP177R1 RP177R0 0000
RPOR12 0688 —— RP180R5 RP180R4 RP180R3 RP180R2 RP180R1 RP180R0 —— RP179R5 RP179R4 RP179R3 RP179R2 RP179R1 RP179R0 0000
RPOR13 068A — — — — — — — — — — RP181R<5:0> 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 54 2013-2018 Microchip Technology Inc.
TABLE 4-17: PERIPHERAL PIN SELECT INPUT REGISTER MAP
SFR
Name Ad d r. Bit 15 Bit 1 4 Bit 1 3 Bit 12 B i t 11 Bit 10 Bit 9 Bit 8 Bit 7 B it 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RPINR0 06A0 INT1R<7:0> — — — — — — — —
0000
RPINR1 06A2 — — — — — — — —INT2R<7:0>
0000
RPINR3 06A6 — — — — — — — — T2CKR<7:0>
0000
RPINR7 06AE IC2R7 IC2R6 IC2R5 IC2R4 IC2R3 IC2R2 IC2R1 IC2R0 IC1R7 IC1R6 IC1R5 IC1R4 IC1R3 IC1R2 IC1R1 IC1R0
0000
RPINR8 06B0 IC4R7 IC4R6 IC4R5 IC4R4 IC4R3 IC4R2 IC4R1 IC4R0 IC3R7 IC3R6 IC3R5 IC3R4 IC3R3 IC3R2 IC3R1 IC3R0
0000
RPINR11 06B6 — — — — — — — — OCFAR<7:0>
0000
RPINR12 06B8 FLT2R7 FLT2R6 FLT2R5 FLT2R4 FLT2R3 FLT2R2 FLT2R1 FLT2R0 FLT1R7 FLT1R6 FLT1R5 FLT1R4 FLT1R3 FLT1R2 FLT1R1 FLT1R0
0000
RPINR18 06C4 — — — — — — — — U1RXR<7:0>
0000
RPINR19 06C6 — — — — — — — — U2RXR<7:0>
0000
RPINR22 06CC SCK2R7 SCK2R6 SCK2R5 SCK2R4 SCK2R3 SCK2R2 SCK2R1 SCK2R0 SDI2R7 SDI2R6 SDI2R5 SDI2R4 SDI2R3 SDI2R2 SDI2R1 SDI2R0
0000
RPINR23 06CE — — — — — — — — SS2R<7:0>
0000
RPINR26 06D4 — — — — — — — — C1RXR<7:0>
(1)
0000
RPINR37 06EA SYNCI1R<7:0> — — — — — — — —
0000
RPINR38 06EC DTCMP1R<7:0> — — — — — — — —
0000
RPINR39 06EE DTCMP3R7 DTCMP3R6 DTCMP3R5 DTCMP3R4 DTCMP3R3 DTCMP3R2 DTCMP3R1 DTCMP3R0 DTCMP2R7 DTCMP2R6 DTCMP2R5 DTCMP2R4 DTCMP2R3 DTCMP2R2 DTCMP2R1 DTCMP2R0
0000
RPINR44 06F8 SENT1R<7:0> — — — — — — — —
0000
RPINR45 06FA — — — — — — — — SENT2R<7:0>
0000
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
Note 1:
This feature is available only on dsPIC33EVXXXGM10X devices.
TABLE 4-18: DMT REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
DMTCON 0700 ON — — — — — — — — — — — — — — — 0000
DMTPRECLR 0704 STEP1<7:0> — — — — — — — — 0000
DMTCLR 0708 — — — — — — — — STEP2<7:0> 0000
DMTSTAT 070C — — — — — — — — BAD1 BAD2 DMTEVENT — — — —WINOPN0000
DMTCNTL 0710 COUNTER<15:0> 0000
DMTCNTH 0712 COUNTER<31:16> 0000
DMTHOLDREG 0714 UPRCNT<15:0> 0000
DMTPSCNTL 0718 PSCNT<15:0> 0000
DMTPSCNTH 071A PSCNT<31:16> 0000
DMTPSINTVL 071C PSINTV<15:0> 0000
DMTPSINTVH 071E PSINTV<31:16> 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2013-2018 Microchip Technology Inc. DS70005144G-page 55
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-19: NVM REGISTER MAP
TABLE 4-20: SYSTEM CONTROL REGISTER MAP
TABLE 4-21: REFERENCE CLOCK REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
NVMCON 0728 WR WREN WRERR NVMSIDL —— RPDF URERR — — — — NVMOP3 NVMOP2 NVMOP1 NVMOP0
0000
NVMADR 072A NVMADR<15:0>
0000
NVMADRU 072C — — — — — — — — NVMADRU<23:16>
0000
NVMKEY 072E — — — — — — — — NVMKEY<7:0>
0000
NVMSRCADRL 0730 NVMSRCADR<15:1>
00000
NVMSRCADRH 0732 — — — — — — — — NVMSRCADR<23:16>
0000
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
RCON 0740 TRAPR IOPUWR ——VREGSF — CM VREGS EXTR SWR SWDTEN WDTO SLEEP IDLE BOR POR Note 1
OSCCON 0742 — COSC2 COSC1 COSC0 — NOSC2 NOSC1 NOSC0 CLKLOCK IOLOCK LOCK —CF——OSWENNote 2
CLKDIV 0744 ROI DOZE2 DOZE1 DOZE0 DOZEN FRCDIV2 FRCDIV1 FRCDIV0 PLLPOST1 PLLPOST0 — PLLPRE4 PLLPRE3 PLLPRE2 PLLPRE1 PLLPRE0 0000
PLLFBD 0746 — — — — — — — PLLDIV<8:0> 0000
OSCTUN 0748 — — — — — — — — — — TUN<5:0> 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: RCON register Reset values are dependent on the type of Reset.
2: OSCCON register Reset values are dependent on the Configuration fuses.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
REFOCON 074E ROON — ROSSLP ROSEL RODIV3 RODIV2 RODIV1 RODIV0 — — — — — — — — 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 56 2013-2018 Microchip Technology Inc.
TABLE 4-22: PMD REGISTER MAP FOR dsPIC33EVXXXGM00X/10X FAMILY DEVICES
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PMD1 0760 T5MD T4MD T3MD T2MD T1MD —PWMMD— I2C1MD U2MD U1MD SPI2MD SPI1MD —C1MD
(1)AD1MD 0000
PMD2 0762 — — — — IC4MD IC3MD IC2MD IC1MD — — — — OC4MD OC3MD OC2MD OC1MD 0000
PMD3 0764 — — — — —CMPMD— — — — — — — — — — 0000
PMD4 0766 — — — — — — — — — — —REFOMDCTMUMD— — 0000
PMD6 076A — — — — — PWM3MD PWM2MD PWM1MD — — — — — — — — 0000
PMD7 076C — — — — — — — — — — —DMA0MD— — — — 0000
DMA1MD
DMA2MD
DMA3MD
PMD8 076E — — —SENT2MDSENT1MD ——DMTMD — — — — — — — — 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
Note 1: This feature is available only on dsPIC33EVXXXGM10X devices.
2013-2018 Microchip Technology Inc. DS70005144G-page 57
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-23: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC33EVXXXGM00X/10X FAMILY DEVICES
SFR
Name Ad d r. Bit 15 Bit 14 Bit 13 Bit 1 2 Bit 11 Bit 1 0 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bi t 2 Bit 1 Bit 0 All
Resets
IFS0 0800 NVMIF DMA1IF AD1IF U1TXIF U1RXIF SPI1IF SPI1EIF T3IF T2IF OC2IF IC2IF DMA0IF T1IF OC1IF IC1IF INT0IF
0000
IFS1 0802 U2TXIF U2RXIF INT2IF T5IF T4IF OC4IF OC3IF DMA2IF — — — INT1IF CNIF CMPIF MI2C1IF SI2C1IF
0000
IFS2 0804 — — — — — — — — — IC4IF IC3IF DMA3IF C1IF C1RXIF
(1)
SPI2IF SPI2EIF
0000
IFS3 0806 — — — — — — PSEMIF — — — — — — — — —
0000
IFS4 0808 ——CTMUIF — — — — — —C1TXIF
(1)
— — — U2EIF U1EIF —
0000
IFS5 080A PWM2IF PWM1IF — — — — — — — — — — — — — —
0000
IFS6 080C — — — — — — — — — — — — — — —PWM3IF
0000
IFS8 0810 — ICDIF — — — — — — — — — — — — — —
0000
IFS10 0814 —— I2C1BCIF — — — — — — — — — — — —
0000
IFS11 0816 — — — — — ECCSBEIF SENT2IF SENT2EIF SENT1IF SENT1EIF — — — — — —
0000
IEC0 0820 NVMIE DMA1IE AD1IE U1TXIE U1RXIE SPI1IE SPI1EIE T3IE T2IE OC2IE IC2IE DMA0IE T1IE OC1IE IC1IE INT0IE
0000
IEC1 0822 U2TXIE U2RXIE INT2IE T5IE T4IE OC4IE OC3IE DMA2IE — — — INT1IE CNIE CMPIE MI2C1IE SI2C1IE
0000
IEC2 0824 — — — — — — — — — IC4IE IC3IE DMA3IE C1IE C1RXIE
(1)
SPI2IE SPI2EIE
0000
IEC3 0826 — — — — — — PSEMIE — — — — — — — — —
0000
IEC4 0828 ——CTMUIE — — — — — —C1TXIE
(1)
— — — U2EIE U1EIE —
0000
IEC5 082A PWM2IE PWM1IE — — — — — — — — — — — — — —
0000
IEC6 082C — — — — — — — — — — — — — — —PWM3IE
0000
IEC8 0830 — ICDIE — — — — — — — — — — — — — —
0000
IEC10 0834 —— I2C1BCIE — — — — — — — — — — — — —
0000
IEC11 0836 — — — — — ECCSBEIE SENT2IE SENT2EIE SENT1IE SENT1EIE — — — — — —
0000
IPC0 0840 — T1IP2 T1IP1 T1IP0 — OC1IP2 OC1IP1 OC1IP0 — IC1IP2 IC1IP1 IC1IP0 — INT0IP2 INT0IP1 INT0IP0
4444
IPC1 0842 — T2IP2 T2IP1 T2IP0 — OC2IP2 OC2IP1 OC2IP0 — IC2IP2 IC2IP1 IC2IP0 — DMA0IP2 DMA0IP1 DMA0IP0
4444
IPC2 0844 — U1RXIP2 U1RXIP1 U1RXIP0 — SPI1IP2 SPI1IP1 SPI1IP0 — SPI1EIP2 SPI1EIP1 SPI1EIP0 — T3IP2 T3IP1 T3IP0
4444
IPC3 0846 — NVMIP2 NVMIP1 NVMIP0 — DMA1IP2 DMA1IP1 DMA1IP0 — AD1IP2 AD1IP1 AD1IP0 — U1TXIP2 U1TXIP1 U1TXIP0
4444
IPC4 0848 — CNIP2 CNIP1 CNIP0 — CMPIP2 CMPIP1 CMPIP0 — MI2C1IP2 MI2C1IP1 MI2C1IP0 — SI2C1IP2 SI2C1IP1 SI2C1IP0
4444
IPC5 084A — — — — — — — — — — — — — INT1IP<2:0>
0004
IPC6 084C — T4IP2 T4IP1 T4IP0 — OC4IP2 OC4IP1 OC4IP0 — OC3IP2 OC3IP1 OC3IP0 — DMA2IP2 DMA2IP1 DMA2IP0
4444
IPC7 084E — U2TXIP2 U2TXIP1 U2TXIP0 — U2RXIP2 U2RXIP1 U2RXIP0 — INT2IP2 INT2IP1 INT2IP0 — T5IP2 T5IP1 T5IP0
4444
IPC8 0850 — C1IP2 C1IP1 C1IP0 — C1RXIP2
(1)
C1RXIP1
(1)
C1RXIP0
(1)
— SPI2IP2 SPI2IP1 SPI2IP0 — SPI2EIP2 SPI2EIP1 SPI2EIP0
4444
IPC9 0852 — — — — — IC4IP2 IC4IP1 IC4IP0 — IC3IP2 IC3IP1 IC3IP0 — DMA3IP2 DMA3IP1 DMA3IP0
0444
IPC14 085C — — — — — — — — — PSEMIP<2:0> — — — —
0040
IPC16 0860 — — — — — U2EIP2 U2EIP1 U2EIP0 — U1EIP2 U1EIP1 U1EIP0 — — — —
0440
IPC17 0862 — — — — — C1TXIP<2:0>
(1)
— — — — — — — —
0400
Legend:
— = unimplemented, read as ‘
0
’ Reset values are shown in hexadecimal.
Note 1:
This feature is available only on dsPIC33EVXXXGM10X devices.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 58 2013-2018 Microchip Technology Inc.
IPC19 0866 — — — — — — — — — CTMUIP<2:0> — — — —
0040
IPC23 086E — PWM2IP2 PWM2IP1 PWM2IP0 — PWM1IP2 PWM1IP1 PWM1IP0 — — — — — — — —
4400
IPC24 0870 — — — — — — — — — — — — — PWM3IP<2:0>
0004
IPC35 0886 — — — — — ICDIP<2:0> — — — — — — — —
0400
IPC43 0896 — — — — — — — — — I2C1BCIP<2:0> — — — —
0040
IPC45 089A — SENT1IP2 SENT1IP1 SENT1IP0 — SENT1EIP2 SENT1EIP1 SENT1EIP0 — — — — — — — —
4400
IPC46 089C — — — — — ECCSBEIP2 ECCSBEIP1 ECCSBEIP0 — SENT2IP2 SENT2IP1 SENT2IP0 — SENT2EIP2 SENT2EIP1 SENT2EIP0
0444
INTCON1 08C0 NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE SFTACERR DIV0ERR DMACERR MATHERR ADDRERR STKERR OSCFAIL —
0000
INTCON2 08C2 GIE DISI SWTRAP — — — —AIVTEN— — — — — INT2EP INT1EP INT0EP
0000
INTCON3 08C4 DMT — — — — — — — — — DAE DOOVR — — — —
0000
INTCON4 08C6 — — — — — — — — — — — — — — ECCDBE SGHT
0000
INTTREG 08C8 — — — — — ILR3 ILR2 ILR1 VECNUM7 VECNUM6 VECNUM5 VECNUM4 VECNUM3 VECNUM2 VECNUM1 VECNUM0
0000
TABLE 4-23: INTERRUPT CONTROLLER REGISTER MAP FOR dsPIC33EVXXXGM00X/10X FAMILY DEVICES (CONTINUED)
SFR
Name Ad d r. Bit 15 Bit 14 Bit 13 Bit 1 2 Bit 11 Bit 1 0 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bi t 2 Bit 1 Bit 0 All
Resets
Legend:
— = unimplemented, read as ‘
0
’ Reset values are shown in hexadecimal.
Note 1:
This feature is available only on dsPIC33EVXXXGM10X devices.
2013-2018 Microchip Technology Inc. DS70005144G-page 59
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-24: OUTPUT COMPARE REGISTER MAP
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
OC1CON1 0900 —— OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 ——ENFLTA —— OCFLTA TRIGMODE OCM2 OCM1 OCM0 0000
OC1CON2 0902 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC1RS 0904 Output Compare 1 Secondary Register xxxx
OC1R 0906 Output Compare 1 Register xxxx
OC1TMR 0908 Output Compare 1 Timer Value Register xxxx
OC2CON1 090A —— OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 ——ENFLTA —— OCFLTA TRIGMODE OCM2 OCM1 OCM0 0000
OC2CON2 090C FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC2RS 090E Output Compare 2 Secondary Register xxxx
OC2R 0910 Output Compare 2 Register xxxx
OC2TMR 0912 Output Compare 2 Timer Value Register xxxx
OC3CON1 0914 —— OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 ——ENFLTA —— OCFLTA TRIGMODE OCM2 OCM1 OCM0 0000
OC3CON2 0916 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC3RS 0918 Output Compare 3 Secondary Register xxxx
OC3R 091A Output Compare 3 Register xxxx
OC3TMR 091C Output Compare 3 Timer Value Register xxxx
OC4CON1 091E —— OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 ——ENFLTA —— OCFLTA TRIGMODE OCM2 OCM1 OCM0 0000
OC4CON2 0920 FLTMD FLTOUT FLTTRIEN OCINV — — — OC32 OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0 000C
OC4RS 0922 Output Compare 4 Secondary Register xxxx
OC4R 0924 Output Compare 4 Register xxxx
OC4TMR 0926 Output Compare 4 Timer Value Register xxxx
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 60 2013-2018 Microchip Technology Inc.
TABLE 4-25: OP AMP/COMPARATOR REGISTER MAP
SFR
Name A d d r. Bit 15 Bit 14 Bit 13 Bit 12 Bi t 11 Bit 10 Bit 9 Bi t 8 Bit 7 Bit 6 B it 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
CMSTAT 0A80 PSIDL —— C5EVT C4EVT C3EVT C2EVT C1EVT — — — C5OUT C4OUT C3OUT C2OUT C1OUT
0000
CVR1CON 0A82 CVREN CVROE
(1)
—— CVRSS VREFSEL — — — CVR6 CVR5 CVR4 CVR3 CVR2 CVR1 CVR0
0000
CM1CON 0A84 CON COE CPOL —— OPAEN CEVT COUT EVPOL1 EVPOL0 —CREF —— CCH1 CCH0
0000
CM1MSKSRC 0A86 — — — — SELSRCC3 SELSRCC2 SELSRCC1 SELSRCC0 SELSRCB3 SELSRCB2 SELSRCB1 SELSRCB0 SELSRCA3 SELSRCA2 SELSRCA1 SELSRCA0
0000
CM1MSKCON 0A88 HLMS — OCEN OCNEN OBEN OBNEN OAEN OANEN NAGS PAGS ACEN ACNEN ABEN ABNEN AAEN AANEN
0000
CM1FLTR 0A8A — — — — — — — — — CFSEL2 CFSEL1 CFSEL0 CFLTREN CFDIV2 CFDIV1 CFDIV0
0000
CM2CON 0A8C CON COE CPOL —— OPAEN CEVT COUT EVPOL1 EVPOL0 —CREF —— CCH1 CCH0
0000
CM2MSKSRC 0A8E — — — — SELSRCC3 SELSRCC2 SELSRCC1 SELSRCC0 SELSRCB3 SELSRCB2 SELSRCB1 SELSRCB0 SELSRCA3 SELSRCA2 SELSRCA1 SELSRCA0
0000
CM2MSKCON 0A90 HLMS — OCEN OCNEN OBEN OBNEN OAEN OANEN NAGS PAGS ACEN ACNEN ABEN ABNEN AAEN AANEN
0000
CM2FLTR 0A92 — — — — — — — — — CFSEL2 CFSEL1 CFSEL0 CFLTREN CFDIV2 CFDIV1 CFDIV0
0000
CM3CON 0A94 CON COE CPOL —— OPAEN CEVT COUT EVPOL1 EVPOL0 —CREF —— CCH1 CCH0
0000
CM3MSKSRC 0A96 — — — — SELSRCC3 SELSRCC2 SELSRCC1 SELSRCC0 SELSRCB3 SELSRCB2 SELSRCB1 SELSRCB0 SELSRCA3 SELSRCA2 SELSRCA1 SELSRCA0
0000
CM3MSKCON 0A98 HLMS — OCEN OCNEN OBEN OBNEN OAEN OANEN NAGS PAGS ACEN ACNEN ABEN ABNEN AAEN AANEN
0000
CM3FLTR 0A9A — — — — — — — — — CFSEL2 CFSEL1 CFSEL0 CFLTREN CFDIV2 CFDIV1 CFDIV0
0000
CM4CON 0A9C CON COE CPOL — — — CEVT COUT EVPOL1 EVPOL0 —CREF —— CCH1 CCH0
0000
CM4MSKSRC 0A9E — — — — SELSRCC3 SELSRCC2 SELSRCC1 SELSRCC0 SELSRCB3 SELSRCB2 SELSRCB1 SELSRCB0 SELSRCA3 SELSRCA2 SELSRCA1 SELSRCA0
0000
CM4MSKCON 0AA0 HLMS — OCEN OCNEN OBEN OBNEN OAEN OANEN NAGS PAGS ACEN ACNEN ABEN ABNEN AAEN AANEN
0000
CM4FLTR 0AA2 — — — — — — — — — CFSEL2 CFSEL1 CFSEL0 CFLTREN CFDIV2 CFDIV1 CFDIV0
0000
CM5CON 0AA4 CON COE CPOL —— OPAEN CEVT COUT EVPOL1 EVPOL0 —CREF —— CCH1 CCH0
0000
CM5MSKSRC 0AA6 — — — — SELSRCC3 SELSRCC2 SELSRCC1 SELSRCC0 SELSRCB3 SELSRCB2 SELSRCB1 SELSRCB0 SELSRCA3 SELSRCA2 SELSRCA1 SELSRCA0
0000
CM5MSKCON 0AA8 HLMS — OCEN OCNEN OBEN OBNEN OAEN OANEN NAGS PAGS ACEN ACNEN ABEN ABNEN AAEN AANEN
0000
CM5FLTR 0AAA — — — — — — — — — CFSEL2 CFSEL1 CFSEL0 CFLTREN CFDIV2 CFDIV1 CFDIV0
0000
CVR2CON 0AB4 CVREN CVROE
(1)
—— CVRSS VREFSEL — — — CVR6 CVR5 CVR4 CVR3 CVR2 CVR1 CVR0
0000
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
Note 1:
CVROE (CVR2CON<14>) is not available on 28-pin and 36-pin devices.
2013-2018 Microchip Technology Inc. DS70005144G-page 61
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-26: DMAC REGISTER MAP
SFR
Name Ad dr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
DMA0CON 0B00 CHEN SIZE DIR HALF NULLW — — — — — AMODE1 AMODE0 ——MODE1MODE0
0000
DMA0REQ 0B02 FORCE — — — — — — — IRQSEL7 IRQSEL6 IRQSEL5 IRQSEL4 IRQSEL3 IRQSEL2 IRQSEL1 IRQSEL0
00FF
DMA0STAL 0B04 STA<15:0>
0000
DMA0STAH 0B06 — — — — — — — —STA<23:16>
0000
DMA0STBL 0B08 STB<15:0>
0000
DMA0STBH 0B0A — — — — — — — — STB<23:16>
0000
DMA0PAD 0B0C PAD<15:0>
0000
DMA0CNT 0B0E — — CNT<13:0>
0000
DMA1CON 0B10 CHEN SIZE DIR HALF NULLW — — — — — AMODE1 AMODE0 ——MODE1MODE0
0000
DMA1REQ 0B12 FORCE — — — — — — — IRQSEL7 IRQSEL6 IRQSEL5 IRQSEL4 IRQSEL3 IRQSEL2 IRQSEL1 IRQSEL0
00FF
DMA1STAL 0B14 STA<15:0>
0000
DMA1STAH 0B16 — — — — — — — —STA<23:16>
0000
DMA1STBL 0B18 STB<15:0>
0000
DMA1STBH 0B1A — — — — — — — — STB<23:16>
0000
DMA1PAD 0B1C PAD<15:0>
0000
DMA1CNT 0B1E — — CNT<13:0>
0000
DMA2CON 0B20 CHEN SIZE DIR HALF NULLW — — — — — AMODE1 AMODE0 ——MODE1MODE0
0000
DMA2REQ 0B22 FORCE — — — — — — — IRQSEL7 IRQSEL6 IRQSEL5 IRQSEL4 IRQSEL3 IRQSEL2 IRQSEL1 IRQSEL0
00FF
DMA2STAL 0B24 STA<15:0>
0000
DMA2STAH 0B26 — — — — — — — —STA<23:16>
0000
DMA2STBL 0B28 STB<15:0>
0000
DMA2STBH 0B2A — — — — — — — — STB<23:16>
0000
DMA2PAD 0B2C PAD<15:0>
0000
DMA2CNT 0B2E — — CNT<13:0>
0000
DMA3CON 0B30 CHEN SIZE DIR HALF NULLW — — — — — AMODE1 AMODE0 ——MODE1MODE0
0000
DMA3REQ 0B32 FORCE — — — — — — — IRQSEL7 IRQSEL6 IRQSEL5 IRQSEL4 IRQSEL3 IRQSEL2 IRQSEL1 IRQSEL0
00FF
DMA3STAL 0B34 STA<15:0>
0000
DMA3STAH 0B36 — — — — — — — —STA<23:16>
0000
DMA3STBL 0B38 STB<15:0>
0000
DMA3STBH 0B3A — — — — — — — — STB<23:16>
0000
DMA3PAD 0B3C PAD<15:0>
0000
DMA3CNT 0B3E — — CNT<13:0>
0000
DMAPWC 0BF0 — — — — — — — — — — — —PWCOL<3:0>
0000
DMARQC 0BF2 — — — — — — — — — — — —RQCOL<3:0>
0000
DMAPPS 0BF4 — — — — — — — — — — — — PPST<3:0>
0000
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 62 2013-2018 Microchip Technology Inc.
DMALCA 0BF6 — — — — — — — — — — — — LSTCH<3:0>
000F
DSADRL 0BF8 DSADR<15:0>
0000
DSADRH 0BFA — — — — — — — — DSADR<23:16>
0000
TABLE 4-27: PWM REGISTER MAP
SFR
Name Ad dr. Bit 15 Bit 14 Bit 1 3 Bit 12 Bit 11 Bit 1 0 Bit 9 Bit 8 Bi t 7 Bit 6 B it 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PTCON 0C00 PTEN — PTSIDL SESTAT SEIEN EIPU SYNCPOL SYNCOEN SYNCEN SYNCSRC2 SYNCSRC1 SYNCSRC0 SEVTPS3 SEVTPS2 SEVTPS1 SEVTPS0
0000
PTCON2 0C02 — — — — — — — — — — — — — PCLKDIV<2:0>
0000
PTPER 0C04 PTPER<15:0>
FFF8
SEVTCMP 0C06 SEVTCMP<15:0>
0000
MDC 0C0A MDC<15:0>
0000
CHOP 0C1A CHPCLKEN — — — — — CHOPCLK9 CHOPCLK8 CHOPCLK7 CHOPCLK6 CHOPCLK5 CHOPCLK4 CHOPCLK3 CHOPCLK2 CHOPCLK1 CHOPCLK0
0000
PWMKEY 0C1E PWMKEY<15:0>
0000
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
TABLE 4-28: PWM GENERATOR 1 REGISTER MAP
SFR
Name Ad d r. Bit 1 5 B it 1 4 Bit 13 Bit 1 2 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 B it 4 Bit 3 B it 2 Bi t 1 Bit 0 All
Resets
PWMCON1 0C20 FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC1 DTC0 DTCP —— CAM XPRES IUE
0000
IOCON1 0C22 PENH PENL POLH POLL PMOD1 PMOD0 OVRENH OVRENL OVRDAT1 OVRDAT0 FLTDAT1 FLTDAT0 CLDAT1 CLDAT0 SWAP OSYNC
0000
FCLCON1 0C24 — CLSRC4 CLSRC3 CLSRC2 CLSRC1 CLSRC0 CLPOL CLMOD FLTSRC4 FLTSRC3 FLTSRC2 FLTSRC1 FLTSRC0 FLTPOL FLTMOD1 FLTMOD0
0000
PDC1 0C26 PDC1<15:0>
0000
PHASE1 0C28 PHASE1<15:0>
0000
DTR1 0C2A — — DTR1<13:0>
0000
ALTDTR1 0C2C — — ALTDTR1<13:0>
0000
TRIG1 0C32 TRGCMP<15:0>
0000
TRGCON1 0C34 TRGDIV3 TRGDIV2 TRGDIV1 TRGDIV0 — — — — — — TRGSTRT5 TRGSTRT4 TRGSTRT3 TRGSTRT2 TRGSTRT1 TRGSTRT0
0000
PWMCAP1 0C38 PWMCAP1<15:0>
0000
LEBCON1 0C3A PHR PHF PLR PLF FLTLEBEN CLLEBEN — — — — BCH BCL BPHH BPHL BPLH BPLL
0000
LEBDLY1 0C3C — — — — LEB<11:0>
0000
AUXCON1 0C3E — — — — BLANKSEL3 BLANKSEL2 BLANKSEL1 BLANKSEL0 —— CHOPSEL3 CHOPSEL2 CHOPSEL1 CHOPSEL0 CHOPHEN CHOPLEN
0000
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
TABLE 4-26: DMAC REGISTER MAP (CONTINUED)
SFR
Name Ad dr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
2013-2018 Microchip Technology Inc. DS70005144G-page 63
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-29: PWM GENERATOR 2 REGISTER MAP
SFR
Name Add r . Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PWMCON2 0C40 FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC1 DTC0 DTCP —— CAM XPRES IUE
0000
IOCON2 0C42 PENH PENL POLH POLL PMOD1 PMOD0 OVRENH OVRENL OVRDAT1 OVRDAT0 FLTDAT1 FLTDAT0 CLDAT1 CLDAT0 SWAP OSYNC
0000
FCLCON2 0C44 — CLSRC4 CLSRC3 CLSRC2 CLSRC1 CLSRC0 CLPOL CLMOD FLTSRC4 FLTSRC3 FLTSRC2 FLTSRC1 FLTSRC0 FLTPOL FLTMOD1 FLTMOD0
0000
PDC2 0C46 PDC2<15:0>
0000
PHASE2 0C48 PHASE2<15:0>
0000
DTR2 0C4A — — DTR2<13:0>
0000
ALTDTR2 0C4C — — ALTDTR2<13:0>
0000
TRIG2 0C52 TRGCMP<15:0>
0000
TRGCON2 0C54 TRGDIV3 TRGDIV2 TRGDIV1 TRGDIV0 — — — — — — TRGSTRT5 TRGSTRT4 TRGSTRT3 TRGSTRT2 TRGSTRT1 TRGSTRT0
0000
PWMCAP2 0C58 PWMCAP2<15:0>
0000
LEBCON2 0C5A PHR PHF PLR PLF FLTLEBEN CLLEBEN — — — — BCH BCL BPHH BPHL BPLH BPLL
0000
LEBDLY2 0C5C — — — — LEB<11:0>
0000
AUXCON2 0C5E — — — — BLANKSEL3 BLANKSEL2 BLANKSEL1 BLANKSEL0 —— CHOPSEL3 CHOPSEL2 CHOPSEL1 CHOPSEL0 CHOPHEN CHOPLEN
0000
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
TABLE 4-30: PWM GENERATOR 3 REGISTER MAP
SFR
Name A ddr . Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
PWMCON3 0C60 FLTSTAT CLSTAT TRGSTAT FLTIEN CLIEN TRGIEN ITB MDCS DTC1 DTC0 DTCP —— CAM XPRES IUE
0000
IOCON3 0C62 PENH PENL POLH POLL PMOD1 PMOD0 OVRENH OVRENL OVRDAT1 OVRDAT0 FLTDAT1 FLTDAT0 CLDAT1 CLDAT0 SWAP OSYNC
0000
FCLCON3 0C64 — CLSRC4 CLSRC3 CLSRC2 CLSRC1 CLSRC0 CLPOL CLMOD FLTSRC4 FLTSRC3 FLTSRC2 FLTSRC1 FLTSRC0 FLTPOL FLTMOD1 FLTMOD0
0000
PDC3 0C66 PDC3<15:0>
0000
PHASE3 0C68 PHASE3<15:0>
0000
DTR3 0C6A — — DTR3<13:0>
0000
ALTDTR3 0C6C — — ALTDTR3<13:0>
0000
TRIG3 0C72 TRGCMP<15:0>
0000
TRGCON3 0C74 TRGDIV3 TRGDIV2 TRGDIV1 TRGDIV0 — — — — — — TRGSTRT5 TRGSTRT4 TRGSTRT3 TRGSTRT2 TRGSTRT1 TRGSTRT0
0000
PWMCAP3 0C78 PWMCAP3<15:0>
0000
LEBCON3 0C7A PHR PHF PLR PLF FLTLEBEN CLLEBEN — — — — BCH BCL BPHH BPHL BPLH BPLL
0000
LEBDLY3 0C7C — — — — LEB<11:0>
0000
AUXCON3 0C7E ———— BLANKSEL3 BLANKSEL2 BLANKSEL1 BLANKSEL0 —— CHOPSEL3 CHOPSEL2 CHOPSEL1 CHOPSEL0 CHOPHEN CHOPLEN
0000
Legend:
— = unimplemented, read as ‘
0
’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 64 2013-2018 Microchip Technology Inc.
TABLE 4-31: PORTA REGISTER MAP FOR dsPIC33EVXXXGMX06 DEVICES
TABLE 4-32: PORTA REGISTER MAP FOR dsPIC33EVXXXGMX04 DEVICES
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISA 0E00 ———TRISA<12:7>—— TRISA4 —— TRISA<1:0> 1F93
PORTA 0E02 ———RA<12:7>——RA4—— RA<1:0> 0000
LATA 0E04 ———LATA<12:7>——LATA4——LATA<1:0>0000
ODCA 0E06 ——— ODCA<12:7> —— ODCA4 —— ODCA<1:0> 0000
CNENA 0E08 ——— CNIEA<12:7> —— CNIEA4 —— CNIEA<1:0> 0000
CNPUA 0E0A ——— CNPUA<12:7> —— CNPUA4 —— CNPUA<1:0> 0000
CNPDA 0E0C ——— CNPDA<12:7> —— CNPDA4 —— CNPDA<1:0> 0000
ANSELA 0E0E ———ANSA<12:9>— ANSA7 —— ANSA4 ——ANSA<1:0>1E93
SR1A 0E10 — — — — — —SR1A9————SR1A4— — — — 0000
SR0A 0E12 — — — — — —SR0A9————SR0A4— — — — 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISA 0E00 — — — — — TRISA<10:7> —— TRISA<4:0> DF9F
PORTA 0E02 — — — — —RA<10:7>——RA<4:0>0000
LATA 0E04 — — — — —LATA<10:7>——LATA<4:0>0000
ODCA 0E06 — — — — — ODCA<10:7> —— ODCA<4:0> 0000
CNENA 0E08 — — — — — CNIEA<10:7> —— CNIEA<4:0> 0000
CNPUA 0E0A — — — — — CNPUA<10:7> —— CNPUA<4:0> 0000
CNPDA 0E0C — — — — — CNPDA<10:7> —— CNPDA<4:0> 0000
ANSELA 0E0E — — — — — ANSA<10:9> — ANSA7 —— ANSA4 — ANSA<2:0> 1813
SR1A 0E10 — — — — — —SR1A9————SR1A4— — — — 0000
SR0A 0E12 — — — — — —SR0A9————SR0A4— — — — 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2013-2018 Microchip Technology Inc. DS70005144G-page 65
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-33: PORTA REGISTER MAP FOR dsPIC33EVXXXGMX02 DEVICES
TABLE 4-34: PORTB REGISTER MAP FOR dsPIC33EVXXXGMX06 DEVICES
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISA 0E00 — — — — — — — — — — — TRISA<4:0> DF9F
PORTA 0E02 — — — — — — — — — — —RA<4:0>0000
LATA 0E04 — — — — — — — — — — —LATA<4:0>0000
ODCA 0E06 — — — — — — — — — — — ODCA<4:0> 0000
CNENA 0E08 — — — — — — — — — — — CNIEA<4:0> 0000
CNPUA 0E0A — — — — — — — — — — — CNPUA<4:0> 0000
CNPDA 0E0C — — — — — — — — — — — CNPDA<4:0> 0000
ANSELA 0E0E — — — — — — — — — — — ANSA4 — ANSA<2:0> 1813
SR1A 0E10 — — — — — — — — — — —SR1A4— — — — 0000
SR0A 0E12 — — — — — — — — — — —SR0A4— — — — 0000
Legend: — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISB 0E14 TRISB<15:0> FFFF
PORTB 0E16 RB<15:0> xxxx
LATB 0E18 LATB<15:0> xxxx
ODCB 0E1A ODCB<15:0> 0000
CNENB 0E1C CNIEB<15:0> 0000
CNPUB 0E1E CNPUB<15:0> 0000
CNPDB 0E20 CNPDB<15:0> 0000
ANSELB 0E22 — — — — — — ANSB<9:7> — — — ANSB<3:0> 038F
SR1B 0E24 — — — — — — SR1B<9:7> ——SR1B4— — — — 0000
SR0B 0E26 — — — — — — SR0B<9:7> ——SR0B4— — — — 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 66 2013-2018 Microchip Technology Inc.
TABLE 4-35: PORTB REGISTER MAP FOR dsPIC33EVXXXGMX04 DEVICES
TABLE 4-36: PORTB REGISTER MAP FOR dsPIC33EVXXXGMX02 DEVICES
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISB 0E14 TRISB<15:0> DF9F
PORTB 0E16 RB<15:0> xxxx
LATB 0E18 LATB<15:0> xxxx
ODCB 0E1A ODCB<15:0> 0000
CNENB 0E1C CNIEB<15:0> 0000
CNPUB 0E1E CNPUB<15:0> 0000
CNPDB 0E20 CNPDB<15:0> 0000
ANSELB 0E22 — — — — — — ANSB<9:7> — — — ANSB<3:0> 010F
SR1B 0E24 — — — — — — SR1B<9:7> ——SR1B4— — — — 0000
SR0B 0E26 — — — — — — SR0B<9:7> ——SR0B4— — — — 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISB 0E14 TRISB<15:0> DF9F
PORTB 0E16 RB<15:0> xxxx
LATB 0E18 LATB<15:0> xxxx
ODCB 0E1A ODCB<15:0> 0000
CNENB 0E1C CNIEB<15:0> 0000
CNPUB 0E1E CNPUB<15:0> 0000
CNPDB 0E20 CNPDB<15:0> 0000
ANSELB 0E22 — — — — — — ANSB<9:7> — — — ANSB<3:0> 010F
SR1B 0E24 — — — — — — SR1B<9:7> ——SR1B4— — — — 0000
SR0B 0E26 — — — — — — SR0B<9:7> ——SR0B4— — — — 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2013-2018 Microchip Technology Inc. DS70005144G-page 67
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-37: PORTC REGISTER MAP FOR dsPIC33EVXXXGMX06 DEVICES
TABLE 4-38: PORTC REGISTER MAP FOR dsPIC33EVXXXGMX04 DEVICES
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISC 0E28 TRISC15 —TRISC<13:0> BFFF
PORTC 0E2A RC15 —RC<13:0> xxxx
LATC 0E2C LATC15 —LATC<13:0> xxxx
ODCC 0E2E ODCC15 —ODCC<13:0> 0000
CNENC 0E30 CNIEC15 —CNIEC<13:0> 0000
CNPUC 0E32 CNPUC15 —CNPUC<13:0> 0000
CNPDC 0E34 CNPDC15 —CNPDC<13:0> 0000
ANSELC 0E36 — — — ANSC<12:0> 1FFF
SR1C 0E38 —————— SR1C<9:6> —— SR1C3 ———0000
SR0C 0E3A —————— SR0C<9:6> —— SR0C3 ———0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISC 0E28 —————— TRISC<9:0> BFFF
PORTC 0E2A —————— RC<9:0> xxxx
LATC 0E2C ——————LATC<9:0>xxxx
ODCC 0E2E —————— ODCC<9:0> 0000
CNENC 0E30 —————— CNIEC<9:0> 0000
CNPUC 0E32 —————— CNPUC<9:0> 0000
CNPDC 0E34 —————— CNPDC<9:0> 0000
ANSELC 0E36 —————— ANSC<9:0> 0807
SR1C 0E38 —————— SR1C<9:6> —— SR1C3 ———0000
SR0C 0E3A —————— SR0C<9:6> —— SR0C3 ———0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 68 2013-2018 Microchip Technology Inc.
TABLE 4-39: PORTD REGISTER MAP FOR dsPIC33EVXXXGMX06 DEVICES
TABLE 4-40: PORTE REGISTER MAP FOR dsPIC33EVXXXGMX06 DEVICES
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISD 0E3C ———————TRISD8— TRISD<6:5> — — — — — 0160
PORTD 0E3E ——————— RD8 — RD<6:5> — — — — — xxxx
LATD 0E40 ———————LATD8— LATD<6:5> — — — — — xxxx
ODCD 0E42 ——————— ODCD8 — ODCD<6:5> — — — — — 0000
CNEND 0E44 ——————— CNIED8 — CNIED<6:5> — — — — — 0000
CNPUD 0E46 ——————— CNPUD8 — CNPUD<6:5> — — — — — 0000
CNPDD 0E48 ——————— CNPDD8 — CNPDD<6:5> — — — — — 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISE 0E50 TRISE<15:12> — — — — — — — — — — — — F000
PORTE 0E52 RE<15:12> — — — — — — — — — — — — xxxx
LATE 0E54 LATE<15:12> — — — — — — — — — — — — xxxx
ODCE 0E56 ODCE<15:12> — — — — — — — — — — — — 0000
CNENE 0E58 CNIEE<15:12> — — — — — — — — — — — — 0000
CNPUE 0E5A CNPUE<15:12> — — — — — — — — — — — — 0000
CNPDE 0E5C CNPDE<15:12> — — — — — — — — — — — — 0000
ANSELE 0E5E ANSE<15:12> — — — — — — — — — — — — F000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
2013-2018 Microchip Technology Inc. DS70005144G-page 69
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 4-41: PORTF REGISTER MAP FOR dsPIC33EVXXXGMX06 DEVICES
TABLE 4-42: PORTG REGISTER MAP FOR dsPIC33EVXXXGMX06 DEVICES
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISF 0E64 — — — — — — — — — — — — — — TRISF<1:0> 0003
PORTF 0E66 — — — — — — — — — — — — — —RF<1:0>xxxx
LATF 0E68 — — — — — — — — — — — — — —LATF<1:0>xxxx
ODCF 0E6A — — — — — — — — — — — — — —ODCF<1:0>0000
CNENF 0E6C — — — — — — — — — — — — — — CNIEF<1:0> 0000
CNPUF 0E6E — — — — — — — — — — — — — — CNPUF<1:0> 0000
CNPDF 0E70 — — — — — — — — — — — — — — CNPDF<1:0> 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
SFR
Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 All
Resets
TRISG 0E78 —————— TRISG<9:6> — — — — — — 03C0
PORTG 0E7A ——————RG<9:6>— — — — — — xxxx
LATG 0E7C ——————LATG<9:6>— — — — — — xxxx
ODCG 0E7E —————— ODCG<9:6> — — — — — — 0000
CNENG 0E80 ——————CNIEG<9:6>— — — — — — 0000
CNPUG 0E82 —————— CNPUG<9:6> — — — — — — 0000
CNPDG 0E84 —————— CNPDG<9:6> — — — — — — 0000
ANSELG 0E86 ——————ANSG<9:6>— — — — — — 0000
Legend: x = unknown value on Reset; — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 70 2013-2018 Microchip Technology Inc.
4.3.1 PAGED MEMORY SCHEME
The dsPIC33EVXXXGM00X/10X family architecture
extends the available DS through a paging scheme,
which allows the available DS to be accessed using
MOV instructions in a linear fashion for pre- and post-
modified Effective Addresses (EAs). The upper half of
the Base Data Space address is used in conjunction
with the Data Space Page registers, the 10-bit Data
Space Read Page register (DSRPAG) or the 9-bit Data
Space Write Page register (DSWPAG), to form an EDS
address, or Program Space Visibility (PSV) address.
The Data Space Page registers are located in the SFR
space. Construction of the EDS address is shown in
Figure 4-9 and Figure 4-10. When DSRPAG<9> = 0
and the base address bit, EA<15> = 1, the
DSRPAG<8:0> bits are concatenated onto EA<14:0> to
form the 24-bit EDS read address. Similarly, when the
base address bit, EA<15> = 1, the DSWPAG<8:0>
bits are concatenated onto EA<14:0> to form the
24-bit EDS write address.
FIGURE 4-9: EXTENDED DATA SPACE (EDS) READ ADDRESS GENERATION
1
DSRPAG<8:0>
9 Bits
EA
15 Bits
Select
Byte24-Bit EDS EA
Select
EA
(DSRPAG = Don’t Care) No EDS Access
Select16-Bit DS EA
Byte
EA<15> = 0
DSRPAG
0
EA<15>
Note: DS read access when DSRPAG = 0x000 will force an address error trap.
= 1?
DSRPAG<9>
Y
N
Generate
PSV Address
0
2013-2018 Microchip Technology Inc. DS70005144G-page 71
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 4-10: EXTENDED DATA SPACE (EDS) WRITE ADDRESS GENERATION
The paged memory scheme provides access to
multiple 32-Kbyte windows in the EDS and PSV
memory. The Data Space Page registers, DSxPAG, in
combination with the upper half of the Data Space
address, can provide up to 16 Mbytes of additional
address space in the EDS and 8 Mbytes (DSRPAG
only) of PSV address space. The paged data memory
space is shown in Figure 4-11.
The Program Space (PS) can be accessed with a
DSRPAG of 0x200 or greater. Only reads from PS are
supported using the DSRPAG. Writes to PS are not
supported, therefore, the DSWPAG is dedicated to DS,
including EDS. The Data Space and EDS can be read
from and written to using DSRPAG and DSWPAG,
respectively.
1
DSWPAG<8:0>
9 Bits
EA
15 Bits
Byte24-Bit EDS EA
Select
EA
(DSWPAG = Don’t Care)
No EDS Access
Select16-Bit DS EA
Byte
EA<15> = 0
Note: DS read access when DSRPAG = 0x000 will force an address error trap.
Generate
PSV Address
0
EA<15>
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 72 2013-2018 Microchip Technology Inc.
FIGURE 4-11: PAGED DATA MEMORY SPACE
0x0000
Program Memory
0x0000
0x7FFF
0x7FFF
EDS Page 0x001
0x0000
SFR Registers
0x0FFF
0x1000
Up to 8-Kbyte
0x2FFF
Local Data Space EDS
(DSRPAG<9:0>/DSWPAG<8:0>)
Reserved
(Will produce an
address error trap)
32-Kbyte
EDS Window
0xFFFF
0x3000
Page 0
Program Space
0x00_0000
0x7F_FFFF
(lsw – <15:0>)
0x0000
(DSRPAG = 0x001)
(DSWPAG = 0x001)
EDS Page 0x1FF
(DSRPAG = 0x1FF)
(DSWPAG = 0x1FF)
EDS Page 0x200
(DSRPAG = 0x200)
PSV
Program
Memory
EDS Page 0x2FF
(DSRPAG = 0x2FF)
EDS Page 0x300
(DSRPAG = 0x300)
EDS Page 0x3FF
(DSRPAG = 0x3FF)
0x7FFF
0x0000
0x7FFF
0x0000
0x7FFF
0x0000
0x7FFF
0x0000
0x7FFF
DS_Addr<14:0>
DS_Addr<15:0>
(lsw)
PSV
Program
Memory
(MSB)
Table Address Space
(TBLPAG<7:0>)
Program Memory
0x00_0000
0x7F_FFFF
(MSB – <23:16>)
0x0000 (TBLPAG = 0x00)
0xFFFF
DS_Addr<15:0>
lsw Using
TBLRDL/TBLWTL,
MSB Using
TBLRDH/TBLWTH
0x0000
(TBLPAG = 0x7F)
0xFFFF
lsw Using
TBLRDL/TBLWTL,
MSB Using
TBLRDH/TBLWTH
(Instruction & Data)
No Writes Allowed
No Writes Allowed
No Writes Allowed
No Writes Allowed
RAM
0x7FFF
0x8000
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Allocating different Page registers for read and write
access allows the architecture to support data
movement between different pages in the data
memory. This is accomplished by setting the DSRPAG
register value to the page from which you want to read,
and configure the DSWPAG register to the page to
which it needs to be written. Data can also be moved
from different PSV to EDS pages by configuring the
DSRPAG and DSWPAG registers to address PSV and
EDS space, respectively. The data can be moved
between pages by a single instruction.
When an EDS or PSV page overflow or underflow
occurs, EA<15> is cleared as a result of the register
indirect EA calculation. An overflow or underflow of the
EA in the EDS or PSV pages can occur at the page
boundaries when:
• The initial address, prior to modification,
addresses an EDS or a PSV page.
• The EA calculation uses Pre- or Post-Modified
Register Indirect Addressing. However, this does
not include Register Offset Addressing.
In general, when an overflow is detected, the DSxPAG
register is incremented and the EA<15> bit is set to
keep the base address within the EDS or PSV window.
When an underflow is detected, the DSxPAG register is
decremented and the EA<15> bit is set to keep the
base address within the EDS or PSV window. This
creates a linear EDS and PSV address space, but only
when using the Register Indirect Addressing modes.
Exceptions to the operation described above arise
when entering and exiting the boundaries of Page 0,
EDS and PSV spaces. Ta b l e 4 - 4 3 lists the effects of
overflow and underflow scenarios at different
boundaries.
In the following cases, when an overflow or underflow
occurs, the EA<15> bit is set and the DSxPAG is not
modified; therefore, the EA will wrap to the beginning of
the current page:
• Register Indirect with Register Offset Addressing
• Modulo Addressing
• Bit-Reversed Addressing
TABLE 4-43: OVERFLOW AND UNDERFLOW SCENARIOS AT PAGE 0, EDS AND
PSV SPACE BOUNDARIES
(2,3,4)
O/U,
R/W Operation
Before After
DSxPAG DS
EA<15> Page
Description DSxPAG DS
EA<15> Page Description
O,
Read
[++Wn]
or
[Wn++]
DSRPAG = 0x1FF 1EDS: Last Page DSRPAG = 0x1FF 0See Note 1
O,
Read
DSRPAG = 0x2FF 1PSV: Last lsw
Page
DSRPAG = 0x300 1PSV: First MSB
Page
O,
Read
DSRPAG = 0x3FF 1PSV: Last MSB
Page
DSRPAG = 0x3FF 0See Note 1
O,
Write
DSWPAG = 0x1FF 1EDS: Last Page DSWPAG = 0x1FF 0See Note 1
U,
Read [--Wn]
or
[Wn--]
DSRPAG = 0x001 1PSV Page DSRPAG = 0x001 0See Note 1
U,
Read
DSRPAG = 0x200 1PSV: First lsw
Page
DSRPAG = 0x200 0See Note 1
U,
Read
DSRPAG = 0x300 1PSV: First MSB
Page
DSRPAG = 0x2FF 1PSV: Last lsw
Page
Legend: O = Overflow, U = Underflow, R = Read, W = Write
Note 1: The Register Indirect Addressing now addresses a location in the Base Data Space (0x0000-0x8000).
2: An EDS access with DSxPAG = 0x000 will generate an address error trap.
3: Only reads from PS are supported using DSRPAG. An attempt to write to PS using DSWPAG will generate
an address error trap.
4: Pseudolinear Addressing is not supported for large offsets.
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4.3.2 EXTENDED X DATA SPACE
The lower portion of the base address space range,
between 0x0000 and 0x2FFF, is always accessible
regardless of the contents of the Data Space Page
registers; it is indirectly addressable through the
register indirect instructions. It can be regarded as
being located in the default EDS Page 0 (i.e., EDS
address range of 0x000000 to 0x002FFF with the base
address bit, EA<15> = 0, for this address range).
However, Page 0 cannot be accessed through the
upper 32 Kbytes, 0x8000 to 0xFFFF, of Base Data
Space, in combination with DSRPAG = 0x000 or
DSWPAG = 0x000. Consequently, the DSRPAG and
DSWPAG registers are initialized to 0x001 at Reset.
The remaining pages, including both EDS and PSV
pages, are only accessible using the DSRPAG or
DSWPAG registers in combination with the upper
32 Kbytes, 0x8000 to 0xFFFF, of the base address,
where the base address bit, EA<15> = 1.
For example, when DSRPAG = 0x001 or
DSWPAG = 0x001, accesses to the upper 32 Kbytes,
0x8000 to 0xFFFF of the Data Space, will map to the
EDS address range of 0x008000 to 0x00FFFF. When
DSRPAG = 0x002 or DSWPAG = 0x002, accesses to
the upper 32 Kbytes of the Data Space will map to the
EDS address range of 0x010000 to 0x017FFF and so
on, as shown in the EDS memory map in Figure 4-12.
For more information on the PSV page access using
Data Space Page registers, refer to Section 5.0
“Program Space Visibility from Data Space” in
“dsPIC33E/PIC24E Program Memory” (DS70000613)
of the “dsPIC33/PIC24 Family Reference Manual”.
FIGURE 4-12: EDS MEMORY MAP
Note 1: DSxPAG should not be used to access
Page 0. An EDS access with DSxPAG
set to 0x000 will generate an address
error trap.
2: Clearing the DSxPAG in software has no
effect.
0x008000
0x010000
0x018000
PAGE 3
PAGE 2
PAGE 1FD
0xFE8000
0xFF0000
0xFF8000
PAGE 1FF
PAGE 1FE
SFR/DS
0x0000
0xFFFF
EDS EA Address (24 bits)
DS
Conventional
EA<15:0>
0x8000
(PAGE 0)
(DSRPAG<8:0>, EA<14:0>)
(DSWPAG<8:0>, EA<14:0>)
PAGE 1
DSRPAG<9> = 0
DS Address
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4.3.3 DATA MEMORY ARBITRATION AND
BUS MASTER PRIORITY
EDS accesses from bus masters in the system are
arbitrated.
The arbiter for data memory (including EDS) arbitrates
between the CPU, the DMA and the MPLAB
®
ICD
module. In the event of coincidental access to a bus by
the bus masters, the arbiter determines which bus
master access has the highest priority. The other bus
masters are suspended and processed after the
access of the bus by the bus master with the highest
priority.
By default, the CPU is Bus Master 0 (M0) with the
highest priority and the MPLAB ICD is Bus Master 4
(M4) with the lowest priority. The remaining bus master
(DMA Controller) is allocated to M3 (M1 and M2 are
reserved and cannot be used). The user application
may raise or lower the priority of the DMA Controller to
be above that of the CPU by setting the appropriate bits
in the EDS Bus Master Priority Control (MSTRPR)
register. All bus masters with raised priorities will
maintain the same priority relationship relative to each
other (i.e., M1 being highest and M3 being lowest, with
M2 in between). Also, all the bus masters with priorities
below that of the CPU maintain the same priority
relationship relative to each other. The priority schemes
for bus masters with different MSTRPR values are
listed in Ta b l e 4 - 4 4 .
Figure 4-13 shows the arbiter architecture.
The bus master priority control allows the user
application to manipulate the real-time response of the
system, either statically during initialization or
dynamically in response to real-time events.
TABLE 4-44: DATA MEMORY BUS
ARBITER PRIORITY
FIGURE 4-13: ARBITER ARCHITECTURE
Priority MSTRPR<15:0> Bit Setting
(1)
0x0000 0x0020
M0 (highest) CPU DMA
M1 Reserved CPU
M2 Reserved Reserved
M3 DMA Reserved
M4 (lowest) MPLAB
®
ICD MPLAB ICD
Note 1: All other values of MSTRPR<15:0> are
reserved.
MPLAB
®
ICD
Reserved
Data Memory Arbiter
M0 M1 M2 M3 M4
MSTRPR<15:0>
DMA CPU
SRAM
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4.3.4 SOFTWARE STACK
The W15 register serves as a dedicated Software
Stack Pointer (SSP) and is automatically modified by
exception processing, subroutine calls and returns;
however, W15 can be referenced by any instruction in
the same manner as all other W registers. This simpli-
fies reading, writing and manipulating the SSP (for
example, creating stack frames).
W15 is initialized to 0x1000 during all Resets. This
address ensures that the SSP points to valid RAM in all
dsPIC33EVXXXGM00X/10X family devices and per-
mits stack availability for non-maskable trap exceptions.
These can occur before the SSP is initialized by the
user software. You can reprogram the SSP during
initialization to any location within the Data Space.
The SSP always points to the first available free word
and fills the software stack, working from lower toward
higher addresses. Figure 4-14 illustrates how it pre-
decrements for a stack pop (read) and post-increments
for a stack push (writes).
When the PC is pushed onto the stack, PC<15:0> are
pushed onto the first available stack word, then
PC<22:16> are pushed into the second available stack
location. For a PC push during any CALL instruction,
the MSB of the PC is zero-extended before the push,
as shown in Figure 4-14. During exception processing,
the MSB of the PC is concatenated with the lower eight
bits of the CPU STATUS Register (SR). This allows the
contents of SRL to be preserved automatically during
interrupt processing.
FIGURE 4-14: CALL STACK FRAME
4.4 Instruction Addressing Modes
The addressing modes shown in Table 4-45 form the
basis of the addressing modes optimized to support the
specific features of the individual instructions. The
addressing modes provided in the MAC class of
instructions differ from those in the other instruction types.
4.4.1 FILE REGISTER INSTRUCTIONS
Most file register instructions use a 13-bit address
field (f) to directly address data present in the first
8192 bytes of data memory (Near Data Space). Most
file register instructions employ a Working register, W0,
which is denoted as WREG in these instructions. The
destination is typically either the same file register or
WREG (with the exception of the MUL instruction),
which writes the result to a register or register pair. The
MOV instruction allows additional flexibility and can
access the entire Data Space.
4.4.2 MCU INSTRUCTIONS
The three-operand MCU instructions are of the form:
Operand 3 = Operand 1 <function> Operand 2
where, Operand 1 is always a Working register (that
is, the addressing mode can only be Register Direct),
which is referred to as Wb. Operand 2 can be a
W register fetched from data memory or a 5-bit literal.
The result location can be either a W register or a data
memory location. The following addressing modes are
supported by MCU instructions:
• Register Direct
• Register Indirect
• Register Indirect Post-Modified
• Register Indirect Pre-Modified
• 5-Bit or 10-Bit Literal
Note: To protect against misaligned stack
accesses, W15<0> is fixed to ‘0’ by the
hardware.
Note 1: To maintain system SSP (W15) coherency,
W15 is never subject to (EDS) paging, and
is therefore, restricted to an address range
of 0x0000 to 0xFFFF. The same applies to
the W14 when used as a Stack Frame
Pointer (SFA = 1).
2: As the stack can be placed in, and can
access X and Y spaces, care must be
taken regarding its use, particularly with
regard to local automatic variables in a
‘C’ development environment.
Note: Not all instructions support all of the
addressing modes given above. Individual
instructions can support different subsets
of these addressing modes.
<Free Word>
PC<15:0>
b‘000000000’
015
W15 (before
CALL
)
W15 (after
CALL
)
Stack Grows Toward
Higher Address
0x0000
PC<22:16>
CALL SUBR
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TABLE 4-45: FUNDAMENTAL ADDRESSING MODES SUPPORTED
4.4.3 MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP accumulator class of
instructions provide a greater addressing flexibility than
other instructions. In addition to the addressing modes
supported by most MCU instructions, move and accu-
mulator instructions also support Register Indirect with
Register Offset Addressing mode, also referred to as
Register Indexed mode.
In summary, the following addressing modes are
supported by move and accumulator instructions:
• Register Direct
• Register Indirect
• Register Indirect Post-Modified
• Register Indirect Pre-Modified
• Register Indirect with Register Offset (Indexed)
• Register Indirect with Literal Offset
• 8-Bit Literal
• 16-Bit Literal
4.4.4 MAC INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC and MSC), also referred
to as MAC instructions, use a simplified set of addressing
modes to allow the user application to effectively
manipulate the Data Pointers through register indirect
tables.
The Two-Source Operand Prefetch registers must be
members of the set, {W8, W9, W10, W11}. For data
reads, W8 and W9 are always directed to the X RAGU,
and W10 and W11 are always directed to the Y AGU.
The Effective Addresses generated (before and after
modification) must, therefore, be valid addresses within
X Data Space for W8 and W9, and Y Data Space for
W10 and W11.
In summary, the following addressing modes are
supported by the MAC class of instructions:
• Register Indirect
• Register Indirect Post-Modified by 2
• Register Indirect Post-Modified by 4
• Register Indirect Post-Modified by 6
• Register Indirect with Register Offset (Indexed)
4.4.5 OTHER INSTRUCTIONS
Besides the addressing modes outlined previously, some
instructions use literal constants of various sizes. For
example, BRA (Branch) instructions use 16-bit signed
literals to specify the Branch destination directly, whereas
the DISI instruction uses a 14-bit unsigned literal field. In
some instructions, such as ULNK, the source of an
operand or result is implied by the opcode itself. Certain
operations, such as a NOP, do not have any operands.
Addressing Mode Description
File Register Direct The address of the file register is specified explicitly.
Register Direct The contents of a register are accessed directly.
Register Indirect The contents of Wn form the Effective Address (EA).
Register Indirect Post-Modified The contents of Wn form the EA. Wn is post-modified (incremented or
decremented) by a constant value.
Register Indirect Pre-Modified Wn is pre-modified (incremented or decremented) by a signed constant value
to form the EA.
Register Indirect with Register Offset
(Register Indexed)
The sum of Wn and Wb forms the EA.
Register Indirect with Literal Offset The sum of Wn and a literal forms the EA.
Note: For the MOV instructions, the addressing
mode specified in the instruction can differ
for the source and destination EA. How-
ever, the 4-bit Wb (Register Offset) field is
shared by both source and destination
(but typically only used by one).
Note: Not all instructions support all the
addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
Note: Register Indirect with Register Offset
Addressing mode is available only for W9 (in
X Data Space) and W11 (in Y Data Space).
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4.5 Modulo Addressing
Modulo Addressing mode is a method of providing an
automated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either Data or
Program Space (since the Data Pointer mechanism is
essentially the same for both). One circular buffer can
be supported in each of the X (which also provides the
pointers into Program Space) and Y Data Spaces.
Modulo Addressing can operate on any W Register
Pointer. However, it is not advisable to use W14 or W15
for Modulo Addressing, since these two registers are
used as the SFP and SSP, respectively.
In general, any particular circular buffer can be config-
ured to operate in only one direction, as there are
certain restrictions on the buffer start address (for
incrementing buffers) or end address (for decrementing
buffers), based upon the direction of the buffer.
The only exception to the usage restrictions is for
buffers that have a power-of-two length. As these
buffers satisfy the start and end address criteria, they
can operate in a Bidirectional mode (that is, address
boundary checks are performed on both the lower and
upper address boundaries).
4.5.1 START AND END ADDRESS
The Modulo Addressing scheme requires that a
starting and ending address be specified and loaded
into the 16-bit Modulo Buffer Address registers:
XMODSRT, XMODEND, YMODSRT and YMODEND
(see Tab l e 4 - 1).
The length of a circular buffer is not directly specified. It
is determined by the difference between the corre-
sponding start and end addresses. The maximum
possible length of the circular buffer is 32K words
(64 Kbytes).
4.5.2 W ADDRESS REGISTER
SELECTION
The Modulo and Bit-Reversed Addressing Control
register, MODCON<15:0>, contains enable flags, as well
as a W register field to specify the W Address registers.
The XWM and YWM fields select the registers that
operate with Modulo Addressing:
• If XWM = 1111, X RAGU and X WAGU Modulo
Addressing is disabled
• If YWM = 1111, Y AGU Modulo Addressing is
disabled
The X Address Space Pointer W register (XWM) to
which Modulo Addressing is to be applied is stored in
MODCON<3:0> (see Table 4-1). Modulo Addressing is
enabled for X Data Space when XWM is set to any
value other than ‘1111’ and the XMODEN bit
(MODCON<15>) is set
The Y Address Space Pointer W register (YWM) to
which Modulo Addressing is to be applied is stored in
MODCON<7:4>. Modulo Addressing is enabled for
Y Data Space when YWM is set to any value other than
‘1111’ and the YMODEN bit (MODCON<14>) is set.
Figure 4-15 shows an example of Modulo Addressing
operation.
FIGURE 4-15: MODULO ADDRESSING OPERATION EXAMPLE
Note: Y Data Space Modulo Addressing EA
calculations assume word-sized data
(LSb of every EA is always clear).
0x1100
0x1163
Start Addr = 0x1100
End Addr = 0x1163
Length = 32 Words
Byte
Address
MOV #0x1100, W0
MOV W0, XMODSRT ;set modulo start address
MOV #0x1163, W0
MOV W0, MODEND ;set modulo end address
MOV #0x8001, W0
MOV W0, MODCON ;enable W1, X AGU for modulo
MOV #0x0000, W0 ;W0 holds buffer fill value
MOV #0x1110, W1 ;point W1 to buffer
DO AGAIN, #0x31 ;fill the 50 buffer locations
MOV W0, [W1++] ;fill the next location
AGAIN: INC W0, W0 ;increment the fill value
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4.5.3 MODULO ADDRESSING
APPLICABILITY
Modulo Addressing can be applied to the Effective
Address (EA) calculation associated with any W
register. Address boundaries check for addresses
equal to:
• The upper boundary addresses for incrementing
buffers
• The lower boundary addresses for decrementing
buffers
The address boundaries check for addresses less than
or greater than the upper (for incrementing buffers) and
lower (for decrementing buffers) boundary addresses
(not just equal to). Address changes can, therefore,
jump beyond boundaries and still be adjusted correctly.
4.6 Bit-Reversed Addressing
Bit-Reversed Addressing mode is intended to simplify
data reordering for radix-2 FFT algorithms. It is
supported by the X AGU for data writes only.
The modifier, which can be a constant value or register
contents, is regarded as having its bit order reversed.
The address source and destination are kept in normal
order. Thus, the only operand requiring reversal is the
modifier.
4.6.1 BIT-REVERSED ADDRESSING
IMPLEMENTATION
Bit-Reversed Addressing mode is enabled when all of
these conditions are met:
• BWM<3:0> bits (W register selection) in the
MODCON register are any value other than
‘1111’ (the stack cannot be accessed using
Bit-Reversed Addressing)
• The BREN bit is set in the XBREV register
• The addressing mode used is Register Indirect
with Pre-Increment or Post-Increment
If the length of a bit-reversed buffer is M = 2
N
bytes,
the last ‘N’ bits of the data buffer start address must
be zeros.
XB<14:0> is the Bit-Reversed Addressing modifier, or
‘pivot point’, which is typically a constant. In the case of
an FFT computation, its value is equal to half of the FFT
data buffer size.
When enabled, Bit-Reversed Addressing is executed
only for Register Indirect with Pre-Increment or Post-
Increment Addressing and word-sized data writes. It
does not function for any other addressing mode or for
byte-sized data and normal addresses are generated
instead. When Bit-Reversed Addressing is active, the
W Address Pointer is always added to the address
modifier (XB) and the offset associated with the Regis-
ter Indirect Addressing mode is ignored. In addition, as
word-sized data is a requirement, the LSb of the EA is
ignored (and always clear).
If Bit-Reversed Addressing has already been enabled
by setting the BREN (XBREV<15>) bit, a write to the
XBREV register should not be immediately followed by
an indirect read operation using the W register that has
been designated as the Bit-Reversed Pointer.
The operation of Bit-Reversed Addressing is shown in
Figure 4-16 and Tab le 4 -46.
Note: The modulo corrected Effective Address
is written back to the register only when
Pre-Modify or Post-Modify Addressing
mode is used to compute the Effective
Address. When an address offset, such as
[W7 + W2] is used, Modulo Addressing
correction is performed, but the contents
of the register remain unchanged.
Note: All bit-reversed EA calculations assume
word-sized data (LSb of every EA is
always clear). The XB value is scaled
accordingly to generate compatible (byte)
addresses.
Note: Modulo Addressing and Bit-Reversed
Addressing can be enabled simultaneously
using the same W register, but Bit-
Reversed Addressing operation will always
take precedence for data writes when
enabled.
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FIGURE 4-16: BIT-REVERSED ADDRESSING EXAMPLE
TABLE 4-46: BIT-REVERSED ADDRESSIN G SEQU ENCE (16-ENTRY)
Normal Address Bit-Reversed Address
A3 A2 A1 A0 Decimal A3 A2 A1 A0 Decimal
0000 00000 0
0001 11000 8
0010 20100 4
0011 31100 12
0100 40010 2
0101 51010 10
0110 60110 6
0111 71110 14
1000 80001 1
1001 91001 9
1010 10 0101 5
1011 11 1101 13
1100 12 0011 3
1101 13 1011 11
1110 14 0111 7
1111 15 1111 15
b3 b2
b1
0
b2 b3 b4
0
Bit Locations Swapped Left-to-Right
Around Center of Binary Value
Bit-Reversed Address
XB = 0x0008 for a 16-Word Bit-Reversed Buffer
b7 b6
b5
b1
b7 b6
b5 b4b11 b10 b9
b8
b11 b10 b9 b8
b15 b14 b13 b12
b15 b14 b13 b12
Sequential Address
Pivot Point
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4.7 Interfacing Program and Data
Memory Spaces
The dsPIC33EVXXXGM00X/10X family architecture
uses a 24-bit wide Program Space and a 16-bit wide
Data Space. The architecture is also a modified Harvard
scheme, meaning that data can also be present in the
Program Space. To use this data successfully, it must be
accessed in a way that preserves the alignment of
information in both the spaces.
Aside from normal execution, the architecture of the
dsPIC33EVXXXGM00X/10X family devices provides
two methods by which Program Space can be
accessed during operation:
• Using table instructions to access individual bytes
or words anywhere in the Program Space
• Remapping a portion of the Program Space into
the Data Space (Program Space Visibility)
Table instructions allow an application to read or write
to small areas of the program memory. This capability
makes the method ideal for accessing data tables that
need to be updated periodically. It also allows access
to all bytes of the program word. The remapping
method allows an application to access a large block of
data on a read-only basis, which is ideal for look-ups
from a large table of static data. The application can
only access the least significant word of the program
word.
Table 4-47 shows the construction of the Program
Space address.
How the data is accessed from Program Space is
shown in Figure 4-17.
TABLE 4-47: PROGRAM SPACE ADDRESS CONSTRUCTION
Access Type Access
Space Program Space Address
<23> <22:16> <15> <14:1> <0>
Instruction Access
(Code Execution)
User 0PC<22:1> 0
0xx xxxx xxxx xxxx xxxx xxx0
TBLRD/TBLWT
(Byte/Word Read/Write)
User TBLPAG<7:0> Data EA<15:0>
0xxx xxxx xxxx xxxx xxxx xxxx
Configuration TBLPAG<7:0> Data EA<15:0>
1xxx xxxx xxxx xxxx xxxx xxxx
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FIGURE 4-17: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION
0
Program Counter
23 Bits
Program Counter
(1)
TBLPAG
8 Bits
EA
16 Bits
Byte Select
0
1/0
User/Configuration
Table Operations
(2)
Space Select
24 Bits
1/0
Note 1: The Least Significant bit (LSb) of Program Space addresses is always fixed as ‘
0
’ to maintain word alignment
of data in the Program and Data Spaces.
2: Table operations are not required to be word-aligned. Table Read operations are permitted in the
configuration memory space.
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4.7.1 DATA ACCESS FROM PROGRAM
MEMORY USING TABLE
INSTRUCTIONS
The TBLRDL and TBLWTL instructions offer a direct
method of reading or writing the lower word of any
address within the Program Space without going
through the Data Space. The TBLRDH and TBLWTH
instructions are the only method to read or write the
upper eight bits of a Program Space word as data.
The PC is incremented by two for each successive
24-bit program word. This allows program memory
addresses to directly map to Data Space addresses.
Program memory can thus be regarded as two 16-bit
wide word address spaces, residing side by side, each
with the same address range. The TBLRDL and
TBLWTL instructions access the space that contains
the least significant data word. TBLRDH and TBLWTH
access the space that contains the upper data byte.
Two table instructions are provided to move byte or
word-sized (16-bit) data to and from Program Space.
Both function as either byte or word operations.
•TBLRDL (Table Read Low):
- In Word mode, this instruction maps the
lower word of the Program Space location
(P<15:0>) to a data address (D<15:0>).
- In Byte mode, either the upper or lower byte of
the lower program word is mapped to the lower
byte of a data address. The upper byte is
selected when Byte Select is ‘1’; the lower byte
is selected when it is ‘0’.
•TBLRDH (Table Read High):
- In Word mode, this instruction maps the entire
upper word of a program address (P<23:16>)
to a data address. The ‘phantom’ byte
(D<15:8>) is always ‘0’.
- In Byte mode, this instruction maps the upper
or lower byte of the program word to D<7:0>
of the data address, as in the TBLRDL
instruction. The data is always ‘0’ when the
upper ‘phantom’ byte is selected
(Byte Select = 1).
Similarly, two table instructions, TBLWTH and TBLWTL,
are used to write individual bytes or words to a Program
Space address. The details of their operation are
explained in Section 5.0 “Flash Program Memory”.
For all table operations, the area of program memory
space to be accessed is determined by the Table Page
register (TBLPAG). TBLPAG covers the entire program
memory space of the device, including user application
and configuration spaces. When TBLPAG<7> = 0, the
table page is located in the user memory space. When
TBLPAG<7> = 1, the page is located in configuration
space. Accessing the program memory with table
instructions is shown in Figure 4-18.
FIGURE 4-18: ACCESSING PROGRAM MEMORY WITH TABLE INSTRUCTIONS
081623
00000000
00000000
00000000
00000000
‘Phantom’ Byte
TBLRDH.B
(Wn<0> =
0
)
TBLRDL.W
TBLRDL.B
(Wn<0> =
1
)
TBLRDL.B
(Wn<0> =
0
)
23 15 0
TBLPAG
02
0x000000
0x800000
0x020000
0x030000
Program Space
The address for the table operation is determined by the data EA
within the page defined by the TBLPAG register.
Only read operations are shown; write operations are also valid
in the user memory area.
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NOTES:
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dsPIC33EVXXXGM00X/10X FAMILY
5.0 FLASH PROGRAM MEMORY
The dsPIC33EVXXXGM00X/10X family devices
contain internal Flash program memory for storing and
executing application code. The memory is readable,
writable and erasable during normal operation over the
entire V
DD
range.
The Flash memory can be programmed in the following
three ways:
• In-Circuit Serial Programming™ (ICSP™)
• Run-Time Self-Programming (RTSP)
• Enhanced In-Circuit Serial Programming
(Enhanced ICSP)
ICSP allows for a dsPIC33EVXXXGM00X/10X family
device to be serially programmed while in the end
application circuit. This is done with two lines for
programming clock and programming data (PGECx/
PGEDx) lines, and three other lines for power (V
DD
),
ground (V
SS
) and Master Clear (MCLR). This allows
customers to manufacture boards with unprogrammed
devices and then program the device just before
shipping the product. This also allows the most recent
firmware or a custom firmware to be programmed.
Enhanced ICSP uses an on-board bootloader, known as
the Program Executive (PE), to manage the programming
process. Using an SPI data frame format, the Program
Executive can erase, program and verify program
memory. For more information on Enhanced ICSP, refer
to the specific device programming specification.
RTSP is accomplished using the TBLRD (Table Read)
and TBLWT (Table Write) instructions. With RTSP, the
user application can write program memory data as a
double program memory word, a row of 64 instructions
(192 bytes) and erase program memory in blocks of
512 instruction words (1536 bytes) at a time.
5.1
Table Instructions and Flash
Programming
The Flash memory read and the double-word
programming operations make use of the TBLRD and
TBLWT instructions, respectively. These allow direct read
and write access to the program memory space from the
data memory while the device is in normal operating
mode. The 24-bit target address in the program memory
is formed using bits<7:0> of the TBLPAG register and
the Effective Address (EA) from a W register, specified
in the table instruction, as shown in Figure 5-1.
The TBLRDL and the TBLWTL instructions are used to
read or write to bits<15:0> of the program memory.
TBLRDL and TBLWTL can access program memory in
both Word and Byte modes.
The TBLRDH and TBLWTH instructions are used to read
or write to bits<23:16> of the program memory.
TBLRDH and TBLWTH can also access program
memory in Word or Byte mode.
FIGURE 5-1: ADDRESSING FOR TABLE REGISTERS
Note 1: This data sheet summarizes the
features of the dsPIC33EVXXXGM00X/
10X family of devices. It is not intended
to be a comprehensive reference
source. To complement the information
in this data sheet, refer to “Flash Pro-
gramming” (DS70609) in the “dsPIC33/
PIC24 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
0
Program Counter
24 Bits
Program Counter
TBLPAG Reg
8 Bits
Working Reg EA
16 Bits
Byte
24-Bit EA
0
1/0
Select
Using
Table Instruction
Using
User/Configuration
Space Select
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5.2 RTSP Operation
RTSP allows the user application to erase a single
page of memory, program a row and to program two
instruction words at a time. See Tab le 1 in the
“dsPIC33EVXXXGM00X/10X Product Families”
section for the page sizes of each device.memory array
is organized into rows of 64 instructions or 192 bytes.
RTSP allows the user application to era
The Flash program memory array is organized into
rows of 64 instructions or 192 bytes. RTSP allows the
user application to erase a page of program memory,
which consists of eight rows (512 instructions) at a
time, and to program one row or two adjacent words at
a time. The 8-row erase pages and single row write
rows are edge-aligned, from the beginning of program
memory, on boundaries of 1536 bytes and 192 bytes,
respectively. Table 30-13 in Section 30.0 “Electrical
Characteristics” lists the typical erase and
programming times.
The basic sequence for RTSP word programming is to
use the TBLWTL and TBLWTH instructions to load two of
the 24-bit instructions into the write latches found in
configuration memory space. See Figure 4-1 to
Figure 4-5 for write latch addresses. Programming is
performed by unlocking and setting the control bits in
the NVMCON register.
Row programming is performed by loading 192 bytes
into data memory and then loading the address of the
first byte in that row into the NVMSRCADR register.
Once the write has been initiated, the device will auto-
matically load the write latches and increment the
NVMSRCADR and the NVMADR(U) registers until all
bytes have been programmed. The RPDF bit
(NVMCON<9>) selects the format of the stored data in
RAM to be either compressed or uncompressed. See
Figure 5-2 for data formatting. Compressed data helps
to reduce the amount of required RAM by using the
upper byte of the second word for the MSB of the second
instruction.
For more information on erasing and programming the
Flash memory, refer to “Flash Programming”
(DS70609) in the “dsPIC33/PIC24 Family Reference
Manual”.
FIGURE 5-2: UNCOMPRESSED/
COMPRESSED FORMAT
5.3 Programming Operations
A complete programming sequence is necessary for
programming or erasing the internal Flash in RTSP
mode. The processor stalls (waits) until the program-
ming operation is finished. Setting the WR bit
(NVMCON<15>) starts the operation and the WR bit is
automatically cleared when the operation is finished.
5.3.1 PROGRAMMING ALGORITHM FOR
FLASH PROGRAM MEMORY
Programmers can program two adjacent words
(24 bits x 2) of program Flash memory at a time on
every other word address boundary (0x000002,
0x000006, 0x00000A, etc.). To do this, erase the page
that contains the desired address of the location the
user wants to change. For protection against accidental
operations, the write initiate sequence for NVMKEY
must be used to allow any erase or program operation
to proceed. After the programming command has been
executed, the user application must wait for the
programming time until programming is complete. The
two instructions following the start of the programming
sequence should be NOPs.
Refer to “Flash Programming” (DS70609) in the
“dsPIC33/PIC24 Family Reference Manual” for details
and code examples on programming using RTSP.
Note 1: Before reprogramming either of the two
words in a double-word pair, the user
must erase the Flash memory page in
which it is located.
2: Before reprogramming any word in a row,
the user must erase the Flash memory
page in which it is located.
LSW1
MSB10x00
LSW2
0x00 MSB2
LSW1
MSB1MSB2
LSW2
15 7 0
15 7 0
Even Byte
Address
Even Byte
Address
Increasing
Address
Increasing
Address
UNCOMPRESSED FORMAT (RPDF =
0
)
COMPRESSED FORMAT (RPDF =
1
)
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5.4 Error Co r rect in g Code (E CC)
In order to improve program memory performance and
durability, these devices include Error Correcting Code
functionality (ECC) as an integral part of the Flash
memory controller. ECC can determine the presence of
single-bit errors in program data, including which bit is
in error, and correct the data automatically without user
intervention. ECC cannot be disabled.
When data is written to program memory, ECC
generates a 7-bit Hamming code parity value for every
two (24-bit) instruction words. The data is stored in
blocks of 48 data bits and seven parity bits; parity data
is not memory-mapped and is inaccessible. When the
data is read back, the ECC calculates the parity on it
and compares it to the previously stored parity value. If
a parity mismatch occurs, there are two possible
outcomes:
• Single-bit errors are automatically identified and
corrected on read-back. An optional device-level
interrupt (ECCSBEIF) is also generated.
• Double-bit errors will generate a generic hard trap
and the read data is not changed. If special
exception handling for the trap is not
implemented, a device Reset will also occur.
To use the single-bit error interrupt, set the ECC Single-
Bit Error Interrupt Enable bit (ECCSBEIE) and
configure the ECCSBEIP bits to set the appropriate
interrupt priority.
Except for the single-bit error interrupt, error events are
not captured or counted by hardware. This functionality
can be implemented in the software application, but it
is the user’s responsibility to do so.
5.5 Flash Memory Resources
Many useful resources are provided on the main
product page of the Microchip web site for the devices
listed in this data sheet. This product page contains the
latest updates and additional information.
5.5.1 KEY RESOURCES
• Code Samples
• Application Notes
• Software Libraries
• Webinars
• All Related “dsPIC33/PIC24 Family Reference
Manual” Sections
• Development Tools
5.6 Control Registers
The following five SFRs are used to read and write the
program Flash memory: NVMCON, NVMKEY,
NVMADR, NVMADRU and NVMSRCADR.
The NVMCON register (Register 5-1) selects the
operation to be performed (page erase, word/row
program, inactive panel erase) and initiates the
program/erase cycle.
NVMKEY (Register 5-4) is a write-only register that is
used for write protection. To start a programming or
erase sequence, the user application must
consecutively write 0x55 and 0xAA to the NVMKEY
register.
There are two NVM Address registers: NVMADRU and
NVMADR. These two registers, when concatenated,
form the 24-bit Effective Address (EA) of the selected
word/row for programming operations or the selected
page for erase operations. The NVMADRU register is
used to hold the upper eight bits of the EA, while the
NVMADR register is used to hold the lower 16 bits of
the EA. For row programming operation, data to be
written to program Flash memory is written into data
memory space (RAM) at an address defined by the
NVMSRCADR register (location of the first element in
row programming data).
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REGISTER 5-1: NVMCON: NONVOLATILE MEMORY (NVM) CONTROL REGISTER
R/SO-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0
WR
(1)
WREN
(1)
WRERR
(1)
NVMSIDL
(2)
—— RPDF URERR
bit 15 bit 8
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — —NVMOP3
(1,3,4)
NVMOP2
(1,3,4)
NVMOP1
(1,3,4)
NVMOP0
(1,3,4)
bit 7 bit 0
Legend: SO = Settable Only bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 WR: Write Control bit
(1)
1 = Initiates a Flash memory program or erase operation; the operation is self-timed and the bit is
cleared by hardware once the operation is complete
0 = Program or erase operation is complete and inactive
bit 14 WREN: Write Enable bit
(1)
1 = Flash program or erase operations are enabled
0 = Flash program or erase operations are inhibited
bit 13 WRERR: Write Sequence Error Flag bit
(1)
1 = An improper program or erase sequence attempt, or termination has occurred (bit is set automatically
on any set attempt of the WR bit)
0 = The program or erase operation completed normally
bit 12 NVMSIDL: NVM Stop in Idle Control bit
(2)
1 = Primary Flash operation discontinues when the device enters Idle mode
0 = Primary Flash operation continues when the device enters Idle mode.
bit 11-10 Unimplemented: Read as ‘0’
bit 9 RPDF: Row Programming Data Format Control bit
1 = Row data to be stored in RAM is in a compressed format
0 = Row data to be stored in RAM is in an uncompressed format
bit 8 URERR: Row Programming Data Underrun Error Flag bit
1 = Row programming operation has been terminated due to a data underrun error
0 = No data underrun has occurred
bit 7-4 Unimplemented: Read as ‘0’
Note 1: These bits can only be reset on a POR.
2: If this bit is set, there will be minimal power savings (I
IDLE
), and upon exiting Idle mode, there is a delay
(T
VREG
) before Flash memory becomes operational.
3: All other combinations of NVMOP<3:0> are unimplemented.
4: Execution of the PWRSAV instruction is ignored while any of the NVM operations are in progress.
5: Two adjacent words on a 4-word boundary are programmed during execution of this operation.
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bit 3-0 NVMOP<3:0>: NVM Operation Select bits
(1,3,4)
1111 = Reserved
1110 = User memory and executive memory bulk erase operation
1101 = Reserved
1100 = Reserved
1011 = Reserved
1010 = Reserved
1001 = Reserved
1000 = Reserved
0111 = Reserved
0101 = Reserved
0100 = Reserved
0011 = Memory page erase operation
0010 = Memory row program operation
0001 = Memory double word
(5)
0000 = Reserved
REGISTER 5-1: NVMCON: NONVOLATILE MEMORY (NVM) CONTROL REGISTER (CONTINUED)
Note 1: These bits can only be reset on a POR.
2: If this bit is set, there will be minimal power savings (I
IDLE
), and upon exiting Idle mode, there is a delay
(T
VREG
) before Flash memory becomes operational.
3: All other combinations of NVMOP<3:0> are unimplemented.
4: Execution of the PWRSAV instruction is ignored while any of the NVM operations are in progress.
5: Two adjacent words on a 4-word boundary are programmed during execution of this operation.
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REGISTER 5-2: NVMADRU: NONVOLATILE MEMORY UPPER ADDRESS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
NVMADRU<23:16>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 NVMADRU<23:16>: NVM Memory Upper Write Address bits
Selects the upper eight bits of the location to program or erase in program Flash memory. This register may
be read or written to by the user application.
REGISTER 5-3: NVMADR: NONVOLATILE MEMORY LOWER ADDRESS REGISTER
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
NVMADR<15:8>
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
NVMADR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 NVMADR<15:0>: NVM Memory Lower Write Address bits
Selects the lower 16 bits of the location to program or erase in program Flash memory. This register
may be read or written to by the user application.
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REGISTER 5-4: NVMKEY: NONVOLATILE MEMORY KEY REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0
NVMKEY<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 NVMKEY<7:0>: NVM Key Register bits (write-only)
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REGISTER 5-5: NVMSRCADRH: NVM DAT A MEMORY UPPER ADDRESS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
NVMSRCADR<23:16>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 NVMSRCADRH<23:16>: Data Memory Upper Address bits
REGISTER 5-6: NVMSRCADRL: NVM DATA MEMORY LOWER ADDRESS REGISTER
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
NVMSRCADR<15:8>
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x r-0
NVMSRCADR<7:1> —
bit 7 bit 0
Legend: r = Reserved bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-1 NVMSRCADRL<15:1>: Data Memory Lower Address bits
bit 0 Reserved: Maintain as ‘0’
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6.0 RESETS
The Reset module combines all Reset sources and
controls the device Master Reset Signal, SYSRST. The
following is a list of device Reset sources:
• POR: Power-on Reset
• BOR: Brown-out Reset
•MCLR
: Master Clear Pin Reset
•SWR: RESET Instruction
• WDTO: Watchdog Timer Time-out Reset
• CM: Configuration Mismatch Reset
• TRAPR: Trap Conflict Reset
• IOPUWR: Illegal Condition Device Reset
- Illegal Opcode Reset
- Uninitialized W Register Reset
- Security Reset
- Illegal Address Mode Reset
A simplified block diagram of the Reset module is
shown in Figure 6-1.
Any active source of Reset will make the SYSRST
signal active. On system Reset, some of the registers
associated with the CPU and peripherals are forced to
a known Reset state and some are unaffected.
All types of device Reset set a corresponding status bit
in the RCON register to indicate the type of Reset (see
Register 6-1).
A POR clears all the bits, except for the POR and BOR
bits (RCON<1:0>) that are set. The user application
can set or clear any bit at any time during code
execution. The RCON bits only serve as status bits.
Setting a particular Reset status bit in software does
not cause a device Reset to occur.
The RCON register also has other bits associated with
the Watchdog Timer and device power-saving states.
The function of these bits is discussed in the other
sections of this device data sheet.
Note 1: This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To com-
plement the information in this data sheet,
refer to “R eset” (DS70602) in the
“dsPIC33/PIC24 Family Reference Man-
ual”, which is available from the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: Refer to the specific peripheral section or
Section 4.0 “Memory Organization” of
this device data sheet for register Reset
states.
Note: The status bits in the RCON register
should be cleared after they are read.
Therefore, the next RCON register value
after a device Reset is meaningful.
Note: In all types of Resets, to select the device
clock source, the contents of OSCCON are
initialized from the FNOSCx Configuration
bits in the FOSCSEL Configuration register.
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FIGURE 6-1: RESET SYSTEM BLOCK DIAGRAM
MCLR
V
DD
BOR
Sleep or Idle
RESET
Instruction
WDT
Module
Glitch Filter
Trap Conflict
Illegal Opcode
Uninitialized W Register
SYSRST
POR
Configuration Mismatch
Security Reset
Internal
Regulator
Illegal Address Mode Reset
V
DD
Rise
Detect
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REGISTER 6-1: RCON: RESET CONTROL REGISTER
(1)
R/W-0 R/W-0 U-0 U-0 R/W-0 U-0 R/W-0 R/W-0
TRAPR IOPUWR ——VREGSF —CMVREGS
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-1
EXTR SWR SWDTEN
(2)
WDTO SLEEP IDLE BOR POR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 TRAPR: Trap Reset Flag bit
1 = A Trap Conflict Reset has occurred
0 = A Trap Conflict Reset has not occurred
bit 14 IOPUWR: Illegal Opcode or Uninitialized W Register Access Reset Flag bit
1 = An Illegal Opcode detection or an Illegal Address mode, or Uninitialized W register used as an
Address Pointer caused a Reset
0 = An Illegal Opcode Reset or Uninitialized W Register Reset has not occurred
bit 13-12 Unimplemented: Read as ‘0’
bit 11 VREGSF: Flash Voltage Regulator Standby During Sleep bit
1 = Flash voltage regulator is active during Sleep mode
0 = Flash voltage regulator goes into Standby mode during Sleep mode
bit 10 Unimplemented: Read as ‘0’
bit 9 CM: Configuration Mismatch Flag bit
1 = A Configuration Mismatch Reset has occurred.
0 = A Configuration Mismatch Reset has not occurred
bit 8 VREGS: Voltage Regulator Standby During Sleep bit
1 = Voltage regulator is active during Sleep
0 = Voltage regulator goes into Standby mode during Sleep
bit 7 EXTR: External Reset (MCLR) Pin bit
1 = A Master Clear (pin) Reset has occurred
0 = A Master Clear (pin) Reset has not occurred
bit 6 SWR: Software RESET (Instruction) Flag bit
1 = A RESET instruction has been executed
0 = A RESET instruction has not been executed
bit 5 SWDTEN: Software Enable/Disable of WDT bit
(2)
1 = WDT is enabled
0 = WDT is disabled
bit 4 WDTO: Watchdog Timer Time-out Flag bit
1 = WDT time-out has occurred
0 = WDT time-out has not occurred
Note 1: All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
2: If the FWDTEN<1:0> Configuration bits are ‘11’ (unprogrammed), the WDT is always enabled, regardless
of the SWDTEN bit setting.
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bit 3 SLEEP: Wake-up from Sleep Flag bit
1 = Device has been in Sleep mode
0 = Device has not been in Sleep mode
bit 2 IDLE: Wake-up from Idle Flag bit
1 = Device was in Idle mode
0 = Device was not in Idle mode
bit 1 BOR: Brown-out Reset Flag bit
1 = A Brown-out Reset has occurred
0 = A Brown-out Reset has not occurred
bit 0 POR: Power-on Reset Flag bit
1 = A Power-on Reset has occurred
0 = A Power-on Reset has not occurred
REGISTER 6-1: RCON: RESET CONTROL REGISTER
(1)
(CONTINUED)
Note 1: All of the Reset status bits can be set or cleared in software. Setting one of these bits in software does not
cause a device Reset.
2: If the FWDTEN<1:0> Configuration bits are ‘11’ (unprogrammed), the WDT is always enabled, regardless
of the SWDTEN bit setting.
2013-2018 Microchip Technology Inc. DS70005144G-page 97
dsPIC33EVXXXGM00X/10X FAMILY
7.0 INTERRUPT CONTROLLER
The dsPIC33EVXXXGM00X/10X family interrupt
controller reduces the numerous peripheral interrupt
request signals to a single interrupt request signal to
the dsPIC33EVXXXGM00X/10X CPU. The Interrupt
Vector Table (IVT) provides 246 interrupt sources
(unused sources are reserved for future use) that can
be programmed with different priority levels.
The interrupt controller has the following features:
• Interrupt Vector Table with up to 246 Vectors
• Alternate Interrupt Vector Table (AIVT)
• Up to Eight Processor Exceptions and Software
Traps
• Seven User-Selectable Priority Levels
• Interrupt Vector Table (IVT) with a Unique Vector
for Each Interrupt or Exception Source
• Fixed Priority within a Specified User Priority Level
• Fixed Interrupt Entry and Return Latencies
• Software can Generate any Peripheral Interrupt
• Alternate Interrupt Vector Table (AIVT) is available
if Boot Security is Enabled and
AIVTEN = 1
7.1 Interrupt Vector Table
The dsPIC33EVXXXGM00X/10X family IVT, shown
in Figure 7-2, resides in program memory, starting at
location, 000004h. The IVT contains seven non-
maskable trap vectors and up to 187 sources of
interrupt. In general, each interrupt source has its own
vector. Each interrupt vector contains a 24-bit wide
address. The value programmed into each interrupt
vector location is the starting address of the associated
Interrupt Service Routine (ISR).
Interrupt vectors are prioritized in terms of their natural
priority. This priority is linked to their position in the
vector table. Lower addresses generally have a higher
natural priority. For example, the interrupt associated
with Vector 0 takes priority over interrupts at any other
vector address.
7.2 Alternate Interrupt Vector Table
The Alternate Interrupt Vector Table (AIVT), shown in
Figure 7-1, is available if the Boot Segment (BS) is
defined, the AIVTEN bit is set in the INTCON2 register
and if the AIVTDIS Configuration bit is set to ‘1’. The
AIVT begins at the start of the last page of the Boot
Segment.
Note 1: This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X
family of devices. It is not intended to be
a comprehensive reference source. To
complement the information in this
data sheet, refer to “Interrupts”
(DS70000600) in the “dsPIC33/PIC24
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
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FIGURE 7-1: dsPIC33EVXX XGM00X /10X FAMI LY ALTERNATE INTERRUPT VECTOR TABLE
IVT
Reserved BSLIM<12:0>
(1)
+ 0x000000
Reserved BSLIM<12:0>
(1)
+ 0x000002
Oscillator Fail Trap Vector BSLIM<12:0>
(1)
+ 0x000004
Address Error Trap Vector BSLIM<12:0>
(1)
+ 0x000006
Generic Hard Trap Vector BSLIM<12:0>
(1)
+ 0x000008
Stack Error Trap Vector BSLIM<12:0>
(1)
+ 0x00000A
Math Error Trap Vector BSLIM<12:0>
(1)
+ 0x00000C
DMAC Error Trap Vector BSLIM<12:0>
(1)
+ 0x00000E
Generic Soft Trap Vector BSLIM<12:0>
(1)
+ 0x000010
Reserved BSLIM<12:0>
(1)
+ 0x000012
Interrupt Vector 0 BSLIM<12:0>
(1)
+ 0x000014
Interrupt Vector 1 BSLIM<12:0>
(1)
+ 0x000016
::
::
::
Interrupt Vector 52 BSLIM<12:0>
(1)
+ 0x00007C
Interrupt Vector 53 BSLIM<12:0>
(1)
+ 0x00007E
Interrupt Vector 54 BSLIM<12:0>
(1)
+ 0x000080
::
::
::
Interrupt Vector 116 BSLIM<12:0>
(1)
+ 0x0000FC
Interrupt Vector 117 BSLIM<12:0>
(1)
+ 0x00007E
Interrupt Vector 118 BSLIM<12:0>
(1)
+ 0x000100
Interrupt Vector 119 BSLIM<12:0>
(1)
+ 0x000102
Interrupt Vector 120 BSLIM<12:0>
(1)
+ 0x000104
::
::
::
Interrupt Vector 244 BSLIM<12:0>
(1)
+ 0x0001FC
Interrupt Vector 245 BSLIM<12:0>
(1)
+ 0x0001FE
See Table 7-1 for
Interrupt Vector Details
Note 1: The address depends on the size of the Boot Segment defined by BSLIM<12:0>:
[(BSLIM<12:0> – 1) x 0x400] + Offset.
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FIGURE 7-2: dsPIC33EVXXXGM00X/10X FAMILY INTERRUPT VECTOR TABLE
IVT
Decreasing Natural Order Priority
Reset – GOTO Instruction 0x000000
Reset – GOTO Address 0x000002
Oscillator Fail Trap Vector 0x000004
Address Error Trap Vector 0x000006
Generic Hard Trap Vector 0x000008
Stack Error Trap Vector 0x00000A
Math Error Trap Vector 0x00000C
DMAC Error Trap Vector 0x00000E
Generic Soft Trap Vector 0x000010
Reserved 0x000012
Interrupt Vector 0 0x000014
Interrupt Vector 1 0x000016
::
::
::
Interrupt Vector 52 0x00007C
Interrupt Vector 53 0x00007E
Interrupt Vector 54 0x000080
::
::
::
Interrupt Vector 116 0x0000FC
Interrupt Vector 117 0x0000FE
Interrupt Vector 118 0x000100
Interrupt Vector 119 0x000102
Interrupt Vector 120 0x000104
::
::
::
Interrupt Vector 244 0x0001FC
Interrupt Vector 245 0x0001FE
START OF CODE 0x000200
See Ta b l e 7 - 1 for
Interrupt Vector Details
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TABLE 7-1: INTERRUPT VECTOR DETAILS
Interrupt Source Vector
No. IRQ
No. IVT Address Interrupt Bit Location
Flag Enable Priority
Highest Natural Order Priority
External Interrupt 0 (INT0) 8 0 0x000014 IFS0<0> IEC0<0> IPC0<2:0>
Input Capture 1 (IC1) 9 1 0x000016 IFS0<1> IEC0<1> IPC0<6:4>
Output Compare 1 (OC1) 10 2 0x000018 IFS0<2> IEC0<2> IPC0<10:8>
Timer1 (T1) 11 3 0x00001A IFS0<3> IEC0<3> IPC0<14:12>
DMA Channel 0 (DMA0) 12 4 0x00001C IFS0<4> IEC0<4> IPC1<2:0>
Input Capture 2 (IC2) 13 5 0x00001E IFS0<5> IEC0<5> IPC1<6:4>
Output Compare 2 (OC2) 14 6 0x000020 IFS0<6> IEC0<6> IPC1<10:8>
Timer2 (T2) 15 7 0x000022 IFS0<7> IEC0<7> IPC1<14:12>
Timer3 (T3) 16 8 0x000024 IFS0<8> IEC0<8> IPC2<2:0>
SPI1 Error (SPI1E) 17 9 0x000026 IFS0<9> IEC0<9> IPC2<6:4>
SPI1 Transfer Done (SPI1) 18 10 0x000028 IFS0<10> IEC0<10> IPC2<10:8>
UART1 Receiver (U1RX) 19 11 0x00002A IFS0<11> IEC0<11> IPC2<14:12>
UART1 Transmitter (U1TX) 20 12 0x00002C IFS0<12> IEC0<12> IPC3<2:0>
ADC1 Convert Done (AD1) 21 13 0x00002E IFS0<13> IEC0<13> IPC3<6:4>
DMA Channel 1 (DMA1) 22 14 0x000030 IFS0<14> IEC0<14> IPC3<10:8>
NVM Write Complete (NVM) 23 15 0x000032 IFS0<15> IEC0<15> IPC3<14:12>
I2C1 Slave Event (SI2C1) 24 16 0x000034 IFS1<0> IEC1<0> IPC4<2:0>
I2C1 Master Event (MI2C1) 25 17 0x000036 IFS1<1> IEC1<1> IPC4<6:4>
Comparator Combined Event
(CMP1)
26 18 0x000038 IFS1<2> IEC1<2> IPC4<10:8>
Input Change Interrupt (CN) 27 19 0x00003A IFS1<3> IEC1<3> IPC4<14:12>
External Interrupt 1 (INT1) 28 20 0x00003C IFS1<4> IEC1<4> IPC5<2:0>
DMA Channel 2 (DMA2) 32 24 0x000044 IFS1<8> IEC1<8> IPC6<2:0>
Output Compare 3 (OC3) 33 25 0x000046 IFS1<9> IEC1<9> IPC6<6:4>
Output Compare 4 (OC4) 34 26 0x000048 IFS1<10> IEC1<10> IPC6<10:8>
Timer4 (T4) 35 27 0x00004A IFS1<11> IEC1<11> IPC6<14:12>
Timer5 (T5) 36 28 0x00004C IFS1<12> IEC1<12> IPC7<2:0>
External Interrupt 2 (INT2) 37 29 0x00004E IFS1<13> IEC1<13> IPC7<6:4>
UART2 Receiver (U2RX) 38 30 0x000050 IFS1<14> IEC1<14> IPC7<10:8>
UART2 Transmitter (U2TX) 39 31 0x000052 IFS1<15> IEC1<15> IPC7<14:12>
SPI2 Error (SPI2E) 40 32 0x000054 IFS2<0> IEC2<0> IPC8<2:0>
SPI2 Transfer Done (SPI2) 41 33 0x000056 IFS2<1> IEC2<1> IPC8<6:4>
CAN1 RX Data Ready (C1RX)(1)42 34 0x000058 IFS2<2> IEC2<2> IPC8<10:8>
CAN1 Event (C1)(1)43 35 0x00005A IFS2<3> IEC2<3> IPC8<14:12>
DMA Channel 3 (DMA3) 44 36 0x00005C IFS2<4> IEC2<4> IPC9<2:0>
Input Capture 3 (IC3) 45 37 0x00005E IFS2<5> IEC2<5> IPC9<6:4>
Input Capture 4 (IC4) 46 38 0x000060 IFS2<6> IEC2<6> IPC9<10:8>
Reserved 54 46 0x000070 — — —
PWM Special Event Match
Interrupt (PSEM)
65 57 0x000086 IFS3<9> IEC3<9> IPC14<6:4>
Reserved 69 61 0x00008E — — —
Reserved 71-72 63-64 0x000092-0x000094 — — —
Note 1: This interrupt source is available on dsPIC33EVXXXGM10X devices only.
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UART1 Error Interrupt (U1E) 73 65 0x000096 IFS4<1> IEC4<1> IPC16<6:4>
UART2 Error Interrupt (U2E) 74 66 0x000098 IFS4<2> IEC4<2> IPC16<10:8>
Reserved 76-77 68–69 0x00009C-0x00009E — — —
CAN1 TX Data Request (C1TX)(1) 78 70 0x0000A0 IFS4<6> IEC4<6> IPC17<10:8>
Reserved 80 72 0x0000A4 — — —
Reserved 82 74 0x0000A8 — — —
Reserved 84 76 0x0000AC — — —
CTMU Interrupt (CTMU) 85 77 0x0000AE IFS4<13> IEC4<13> IPC19<6:4>
Reserved 86-88 78-80 0x0000B0-0x0000B4 — — —
Reserved 92-94 84-86 0x0000BC-0x0000C0 — — —
Reserved 100-101 92-93 0x0000CC-0x0000CE — — —
PWM Generator 1 (PWM1) 102 94 0x0000D0 IFS5<14> IEC5<14> IPC23<10:8>
PWM Generator 2 (PWM2) 103 95 0x0000D2 IFS5<15> IEC5<15> IPC23<14:12>
PWM Generator 3 (PWM3) 104 96 0x0000D4 IFS6<0> IEC6<0> IPC24<2:0>
Reserved 108-149 100-141 0x0000DC-0x00012E — — —
ICD Application (ICD) 150 142 0x000142 IFS8<14> IEC8<14> IPC35<10:8>
Reserved 152 144 0x000134 — — —
Bus Collision (I2C1) — 173 0x00016E IFS10<13> IEC10<13> IPC43<4:6>
SENT1 Error (SENT1ERR) — 182 0x000180 IFS11<6> IEC11<6> IPC45<10:8>
SENT1 TX/RX (SENT1) — 183 0x000182 IFS11<7> IEC11<7> IPC45<14:12>
SENT2 Error (SENT2ERR) — 184 0x000184 IFS11<8> IEC11<8> IPC46<2:0>
SENT2 TX/RX (SENT2) — 185 0x000186 IFS11<9> IEC11<9> IPC46<6:4>
ECC Single-Bit Error (ECCSBE) — 186 0x000188 IFS11<10> IEC11<10> IPC45<10:8>
Reserved 159-245 187-245 0x000142-0x0001FE — — —
Lowest Natural Order Priority
TABLE 7-1: INTERRUPT VECTOR DETAILS (CONTINUED)
Interrupt Source Vector
No. IRQ
No. IVT Addre ss Interrupt Bit Location
Flag Enable Priority
Note 1: This interrupt source is available on dsPIC33EVXXXGM10X devices only.
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7.3 Reset Sequence
A device Reset is not a true exception because the
interrupt controller is not involved in the Reset process.
The dsPIC33EVXXXGM00X/10X family devices clear
their registers in response to a Reset, which forces the
PC to zero. The device then begins program execution
at location, 0x000000. A GOTO instruction at the Reset
address can redirect program execution to the
appropriate start-up routine.
7.4 Interrupt Control and Status
Registers
dsPIC33EVXXXGM00X/10X family devices implement
the following registers for the interrupt controller:
• INTCON1
• INTCON2
• INTCON3
• INTCON4
•IFSx
•IECx
•IPCx
•INTTREG
7.4.1 INTCON1 THROUGH INTCON4
Global interrupt control functions are controlled from
the INTCON1, INTCON2, INTCON3 and INTCON4
registers.
INTCON1 contains the Interrupt Nesting Disable bit
(NSTDIS), as well as the control and status flags for the
processor trap sources.
The INTCON2 register controls external interrupt
request signal behavior and also contains the Global
Interrupt Enable bit (GIE).
INTCON3 contains the status flags for the DMT (Dead-
man Timer), DMA and DO stack overflow status trap
sources.
The INTCON4 register contains the ECC Double-Bit
Error (ECCDBE) and Software-Generated Hard Trap
(SGHT) status bit.
7.4.2 IFSx
The IFSx registers maintain all of the interrupt request
flags. Each source of interrupt has a status bit, which is
set by the respective peripherals or external signal and
is cleared through software.
7.4.3 IECx
The IECx registers maintain all of the interrupt enable
bits. These control bits are used to individually enable
interrupts from the peripherals or external signals.
7.4.4 IPCx
The IPCx registers are used to set the Interrupt Priority
Level (IPL) for each source of interrupt. Each user
interrupt source can be assigned to one of eight priority
levels.
7.4.5 INTTREG
The INTTREG register contains the associated
interrupt vector number and the new CPU Interrupt
Priority Level, which are latched into Vector Number
(VECNUM<7:0>) and Interrupt Priority Level bit
(ILR<3:0>) fields in the INTTREG register. The new
Interrupt Priority Level is the priority of the pending
interrupt.
The interrupt sources are assigned to the IFSx, IECx
and IPCx registers in the same sequence as they are
listed in Table 7-1. For example, the INT0 (External
Interrupt 0) is shown as having Vector Number 8 and a
natural order priority of 0. Thus, the INT0IF bit is found
in IFS0<0>, the INT0IE bit in IEC0<0> and the INT0IP
bits in the first position of IPC0 (IPC0<2:0>).
7.4.6 STATUS/CONTROL REGISTERS
Although these registers are not specifically part of the
interrupt control hardware, two of the CPU Control
registers contain bits that control interrupt functionality.
For more information on these registers, refer to
“CPU” (DS70359) in the “dsPIC33/PIC24 Family
Reference Manual”.
• The CPU STATUS Register, SR, contains the
IPL<2:0> bits (SR<7:5>). These bits indicate the
current CPU Interrupt Priority Level. The user
software can change the current CPU Interrupt
Priority Level by writing to the IPLx bits.
• The CORCON register contains the IPL3 bit
which, together with IPL<2:0>, also indicates the
current CPU Interrupt Priority Level. IPL3 is a
read-only bit so that trap events cannot be
masked by the user software.
All Interrupt registers are described in Register 7-3 to
Register 7-7.
Note: Any unimplemented or unused vector
locations in the IVT should be pro-
grammed with the address of a default
interrupt handler routine that contains a
RESET instruction.
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REGISTER 7-1: SR: CPU STATUS REGISTER
(1)
R/W-0 R/W-0 R/W-0 R/W-0 R/C-0 R/C-0 R-0 R/W-0
OA OB SA SB OAB SAB DA DC
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
IPL2
(2,3)
IPL1
(2,3)
IPL0
(2,3)
RA NOV Z C
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-5 IPL<2:0>: CPU Interrupt Priority Level Status bits
(2,3)
111 = CPU Interrupt Priority Level is 7 (15); user interrupts are disabled
110 = CPU Interrupt Priority Level is 6 (14)
101 = CPU Interrupt Priority Level is 5 (13)
100 = CPU Interrupt Priority Level is 4 (12)
011 = CPU Interrupt Priority Level is 3 (11)
010 = CPU Interrupt Priority Level is 2 (10)
001 = CPU Interrupt Priority Level is 1 (9)
000 = CPU Interrupt Priority Level is 0 (8)
Note 1: For complete register details, see Register 3-1.
2: The IPL<2:0> bits are concatenated with the IPL3 bit (CORCON<3>) to form the CPU Interrupt Priority
Level. The value in parentheses indicates the IPL if IPL3 = 1. User interrupts are disabled when IPL3 = 1.
3: The IPL<2:0> Status bits are read-only when the NSTDIS bit (INTCON1<15>) = 1.
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REGISTER 7-2: CORCON: CORE CONTROL REGISTER
(1)
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R-0 R-0 R-0
VAR —US1 US0 EDT DL2 DL1 DL0
bit 15 bit 8
R/W-0 R/W-0 R/W-1 R/W-0 R/C-0 R-0 R/W-0 R/W-0
SATA SATB SATDW ACCSAT IPL3
(2)
SFA RND IF
bit 7 bit 0
Legend: C = Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 VAR: Variable Exception Processing Latency Control bit
1 = Variable exception processing latency is enabled
0 = Fixed exception processing latency is enabled
bit 3 IPL3: CPU Interrupt Priority Level Status bit 3
(2)
1 = CPU Interrupt Priority Level is greater than 7
0 = CPU Interrupt Priority Level is 7 or less
Note 1: For complete register details, see Register 3-2.
2: The IPL3 bit is concatenated with the IPL<2:0> bits (SR<7:5>) to form the CPU Interrupt Priority Level.
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REGISTER 7-3: INTCON1: INTERRUPT CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NSTDIS OVAERR OVBERR COVAERR COVBERR OVATE OVBTE COVTE
bit 15 bit 8
R/W-0 R-0, HC R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0
SFTACERR DIV0ERR DMACERR MATHERR ADDRERR STKERR OSCFAIL —
bit 7 bit 0
Legend: HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 NSTDIS: Interrupt Nesting Disable bit
1 = Interrupt nesting is disabled
0 = Interrupt nesting is enabled
bit 14 OVAERR: Accumulator A Overflow Trap Flag bit
1 = Trap was caused by overflow of Accumulator A
0 = Trap was not caused by overflow of Accumulator A
bit 13 OVBERR: Accumulator B Overflow Trap Flag bit
1 = Trap was caused by overflow of Accumulator B
0 = Trap was not caused by overflow of Accumulator B
bit 12 COVAERR: Accumulator A Catastrophic Overflow Trap Flag bit
1 = Trap was caused by catastrophic overflow of Accumulator A
0 = Trap was not caused by catastrophic overflow of Accumulator A
bit 11 COVBERR: Accumulator B Catastrophic Overflow Trap Flag bit
1 = Trap was caused by catastrophic overflow of Accumulator B
0 = Trap was not caused by catastrophic overflow of Accumulator B
bit 10 OVATE: Accumulator A Overflow Trap Enable bit
1 = Trap overflow of Accumulator A
0 = Trap is disabled
bit 9 OVBTE: Accumulator B Overflow Trap Enable bit
1 = Trap overflow of Accumulator B
0 = Trap is disabled
bit 8 COVTE: Catastrophic Overflow Trap Enable bit
1 = Trap on catastrophic overflow of Accumulator A or B is enabled
0 = Trap is disabled
bit 7 SFTACERR: Shift Accumulator Error Status bit
1 = Math error trap was caused by an invalid accumulator shift
0 = Math error trap was caused by an invalid accumulator shift
bit 6 DIV0ERR: Divide-by-Zero Error Status bit
1 = Math error trap was caused by a divide-by-zero
0 = Math error trap was not caused by a divide-by-zero
bit 5 DMACERR: DMAC Trap Flag bit
1 = DMAC trap has occurred
0 = DMAC trap has not occurred
bit 4 MATHERR: Math Error Status bit
1 = Math error trap has occurred
0 = Math error trap has not occurred
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bit 3 ADDRERR: Address Error Trap Status bit
1 = Address error trap has occurred
0 = Address error trap has not occurred
bit 2 STKERR: Stack Error Trap Status bit
1 = Stack error trap has occurred
0 = Stack error trap has not occurred
bit 1 OSCFAIL: Oscillator Failure Trap Status bit
1 = Oscillator failure trap has occurred
0 = Oscillator failure trap has not occurred
bit 0 Unimplemented: Read as ‘0’
REGISTER 7-3: INTCON1: INTERRUPT CONTROL REGISTER 1 (CONTINUED)
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REGISTER 7-4: INTCON2: INTERRUPT CONTROL REGISTER 2
R/W-1 R/W-0 R/W-0 U-0 U-0 U-0 U-0 R/W-0
GIE DISI SWTRAP — — — —AIVTEN
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
— — — — — INT2EP INT1EP INT0EP
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 GIE: Global Interrupt Enable bit
1 = Interrupts and associated IECx bits are enabled
0 = Interrupts are disabled, but traps are still enabled
bit 14 DISI: DISI Instruction Status bit
1 = DISI instruction is active
0 = DISI instruction is not active
bit 13 SWTRAP: Software Trap Status bit
1 = Software trap is enabled
0 = Software trap is disabled
bit 12-9 Unimplemented: Read as ‘0’
bit 8 AIVTEN: Alternate Interrupt Vector Table is Enabled bit
1 = AIVT is enabled
0 = AIVT is disabled
bit 7-3 Unimplemented: Read as ‘0’
bit 2 INT2EP: External Interrupt 2 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 1 INT1EP: External Interrupt 1 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
bit 0 INT0EP: External Interrupt 0 Edge Detect Polarity Select bit
1 = Interrupt on negative edge
0 = Interrupt on positive edge
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REGISTER 7-5: INTCON3: INTERRUPT CONTROL REGISTER 3
R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
DMT — — — — — — —
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0
——DAEDOOVR— — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 DMT: Deadman Timer (Soft) Trap Status bit
1 = Deadman Timer trap has occurred
0 = Deadman Timer trap has not occurred
bit 14-6 Unimplemented: Read as ‘0’
bit 5 DAE: DMA Address Error Soft Trap Status bit
1 = DMA address error soft trap has occurred
0 = DMA address error soft trap has not occurred
bit 4 DOOVR: DO Stack Overflow Soft Trap Status bit
1 = DO stack overflow soft trap has occurred
0 = DO stack overflow soft trap has not occurred
bit 3-0 Unimplemented: Read as ‘0’
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REGISTER 7-6: INTCON4: INTERRUPT CONTROL REGISTER 4
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 SC/HS/R-0 SC/HS/R-0
— — — — — — ECCDBE
(1)
SGHT
bit 7 bit 0
Legend: HS = Hardware Settable bit SC = Software Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-2 Unimplemented: Read as ‘0’
bit 1 ECCDBE: ECC Double-Bit Error Trap bit
(1)
1 = ECC double-bit error trap has occurred
0 = ECC double-bit error trap has not occurred
bit 0 SGHT: Software-Generated Hard Trap Status bit
1 = Software-generated hard trap has occurred
0 = Software-generated hard trap has not occurred
Note 1: ECC double-bit error causes a generic hard trap.
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REGISTER 7-7: INTTREG: INTERRUPT CONTROL AND STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 R-0 R-0 R-0
— — — — — ILR3 ILR2 ILR1
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
VECNUM7 VECNUM6 VECNUM5 VECNUM4 VECNUM3 VECNUM2 VECNUM1 VECNUM0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0’
bit 10-8 ILR<3:0>: New CPU Interrupt Priority Level bits
1111 = CPU Interrupt Priority Level is 15
•
•
•
0001 = CPU Interrupt Priority Level is 1
0000 = CPU Interrupt Priority Level is 0
bit 7-0 VECNUM<7:0>: Vector Number of Pending Interrupt bits
11111111 = 255, Reserved; do not use
•
•
•
00001001 = 9, Input Capture 1 (IC1)
00001000 = 8, External Interrupt 0 (INT0)
00000111 = 7, Reserved; do not use
00000110 = 6, Generic soft error trap
00000101 = 5, DMAC error trap
00000100 = 4, Math error trap
00000011 = 3, Stack error trap
00000010 = 2, Generic hard trap
00000001 = 1, Address error trap
00000000 = 0, Oscillator fail trap
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8.0 DIRECT MEMORY ACCESS
(DMA)
The DMA Controller transfers data between Peripheral
Data registers and Data Space SRAM. For the
simplified DMA block diagram, refer to Figure 8-1.
In addition, DMA can access the entire data memory
space. The data memory bus arbiter is utilized when
either the CPU or DMA attempts to access SRAM,
resulting in potential DMA or CPU stalls.
The DMA Controller supports four independent
channels. Each channel can be configured for transfers
to or from selected peripherals. The peripherals
supported by the DMA Controller include:
•CAN
• Analog-to-Digital Converter (ADC)
• Serial Peripheral Interface (SPI)
•UART
• Input Capture
• Output Compare
Refer to Tab le 8 -1 for a complete list of supported
peripherals.
FIGURE 8-1: PERIPHER AL TO DMA CONTROLLER
Note 1: This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to “Direct Memory Access
(DMA)” (DS70348) in the “dsPIC33/
PIC24 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
DMAPERIPHERAL Data Memory
SRAM
(see Figure 4-13)
Arbiter
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In addition, DMA transfers can be triggered by timers
as well as external interrupts. Each DMA channel is
unidirectional. Two DMA channels must be allocated to
read and write to a peripheral. If more than one channel
receives a request to transfer data, a simple fixed
priority scheme, based on channel number, dictates
which channel completes the transfer and which
channel or channels are left pending. Each DMA
channel moves a block of data, after which, it generates
an interrupt to the CPU to indicate that the block is
available for processing.
The DMA Controller provides these functional
capabilities:
• Four DMA Channels
• Register Indirect with Post-Increment Addressing
mode
• Register Indirect without Post-Increment
Addressing mode
• Peripheral Indirect Addressing mode (peripheral
generates destination address)
• CPU Interrupt after Half or Full Block Transfer
Complete
• Byte or Word Transfers
• Fixed Priority Channel Arbitration
• Manual (software) or Automatic (peripheral DMA
requests) Transfer Initiation
• One-Shot or Auto-Repeat Block Transfer modes
• Ping-Pong mode (automatic switch between two
SRAM start addresses after each block transfer
complete)
• DMA Request for Each Channel can be Selected
from any Supported Interrupt Source
• Debug Support Features
The peripherals that can utilize DMA are listed in
Table 8-1.
TABLE 8-1: DMA CHANNEL TO PERIPHERAL ASSOCIATIONS
Peripheral to DMA
Association DMAxREQ Register
IRQSEL <7:0> Bits
DMAxPAD Register
(Values to Read from
Peripheral)
DMAxPAD Register
(Values to Write to
Peripheral)
External Interrupt 0 (INT0) 00000000 ——
Input Capture 1 (IC1) 00000001 0x0144 (IC1BUF) —
Input Capture 2 (IC2) 00000101 0x014C (IC2BUF) —
Input Capture 3 (IC3) 00100101 0x0154 (IC3BUF) —
Input Capture 4 (IC4) 00100110 0x015C (IC4BUF) —
Output Compare 1 (OC1) 00000010 — 0x0906 (OC1R)
0x0904 (OC1RS)
Output Compare 2 (OC2) 00000110 — 0x0910 (OC2R)
0x090E (OC2RS)
Output Compare 3 (OC3) 00011001 — 0x091A (OC3R)
0x0918 (OC3RS)
Output Compare 4 (OC4) 00011010 — 0x0924 (OC4R)
0x0922 (OC4RS)
Timer2 (TMR2) 00000111 ——
Timer3 (TMR3) 00001000 ——
Timer4 (TMR4) 00011011 ——
Timer5 (TMR5) 00011100 ——
SPI1 Transfer Done 00001010 0x0248 (SPI1BUF) 0x0248 (SPI1BUF)
SPI2 Transfer Done 00100001 0x0268 (SPI2BUF) 0x0268 (SPI2BUF)
UART1 Receiver (UART1RX) 00001011 0x0226 (U1RXREG) —
UART1 Transmitter (UART1TX) 00001100 — 0x0224 (U1TXREG)
UART2 Receiver (UART2RX) 00011110 0x0236 (U2RXREG) —
UART2 Transmitter (UART2TX) 00011111 — 0x0234 (U2TXREG)
RX Data Ready (CAN1) 00100010 0x0440 (C1RXD) —
TX Data Request (CAN1) 01000110 — 0x0442 (C1TXD)
ADC1 Convert Done (ADC1) 00001101 0x0300 (ADC1BUF0) —
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Figure 8-2 illustrates the DMA Controller block diagram.
FIGURE 8-2: DMA CONTROLLER BLOCK DIAGRAM
8.1 DMAC Controller Registers
Each DMAC Channel x (where x = 0 to 3) contains the
following registers:
• 16-Bit DMA Channel x Control Register (DMAxCON)
• 16-Bit DMA Channel x IRQ Select Register
(DMAxREQ)
• 32-Bit DMA Channel x Start Address Register A
High/Low (DMAxSTAH/L)
• 32-Bit DMA Channel x Start Address Register B
High/Low (DMAxSTBH/L)
• 16-Bit DMA Channel x Peripheral Address
Register (DMAxPAD)
• 14-Bit DMA Channel x Transfer Count Register
(DMAxCNT)
Additional status registers (DMAPWC, DMARQC,
DMAPPS, DMALCA and DSADRH/L) are common to
all DMAC channels. These status registers provide
information on write and request collisions, as well as
on last address and channel access information.
The DMA Interrupt Flags (DMAxIF) are located in an
IFSx register in the interrupt controller. The
corresponding DMA Interrupt Enable bits (DMAxIE)
are located in an IECx register in the interrupt
controller and the corresponding DMA Interrupt
Priority bits (DMAxIP) are located in an IPCx register
in the interrupt controller.
CPU
Arbiter
Peripheral
Non-DMA
DMA X-Bus
Peripheral Indirect Address
DMA
Control
DMA Controller
DMA
CPU Peripheral X-Bus
IRQ to DMA
and Interrupt
Controller
Modules
IRQ to DMA and
Interrupt Controller
Modules
IRQ to DMA and
Interrupt Controller
Modules
0123
SRAM
Channels Peripheral 1
DMA
Ready
CPU DMA
Peripheral 3
DMA
Ready
CPU DMA
Peripheral 2
DMA
Ready
CPU DMA
Note:
CPU and DMA address buses are not shown for clarity.
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REGISTER 8-1: DMAxCON: DMA CHANNEL x CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0
CHEN SIZE DIR HALF NULLW — — —
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0
——AMODE1AMODE0——MODE1MODE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 CHEN: DMA Channel Enable bit
1 = Channel is enabled
0 = Channel is disabled
bit 14 SIZE: DMA Data Transfer Size bit
1 =Byte
0 =Word
bit 13 DIR: DMA Transfer Direction bit (source/destination bus select)
1 = Reads from RAM address, writes to peripheral address
0 = Reads from peripheral address, writes to RAM address
bit 12 HALF: DMA Block Transfer Interrupt Select bit
1 = Initiates interrupt when half of the data has been moved
0 = Initiates interrupt when all of the data has been moved
bit 11 NULLW: Null Data Peripheral Write Mode Select bit
1 = Null data write to peripheral in addition to RAM write (DIR bit must also be clear)
0 = Normal operation
bit 10-6 Unimplemented: Read as ‘0’
bit 5-4 AMODE<1:0>: DMA Channel Addressing Mode Select bits
11 = Reserved
10 = Peripheral Indirect mode
01 = Register Indirect without Post-Increment mode
00 = Register Indirect with Post-Increment mode
bit 3-2 Unimplemented: Read as ‘0’
bit 1-0 MODE<1:0>: DMA Channel Operating Mode Select bits
11 = One-Shot Ping-Pong modes are enabled (one block transfer from/to each DMA buffer)
10 = Continuous Ping-Pong modes are enabled
01 = One-Shot Ping-Pong modes are disabled
00 = Continuous Ping-Pong modes are disabled
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REGISTER 8-2: DMAxREQ: DMA CHANNEL x IRQ SELECT REGISTER
R/S-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
FORCE
(1)
— — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IRQSEL7 IRQSEL6 IRQSEL5 IRQSEL4 IRQSEL3 IRQSEL2 IRQSEL1 IRQSEL0
bit 7 bit 0
Legend: S = Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 FORCE: Force DMA Transfer bit
(1)
1 = Forces a single DMA transfer (Manual mode)
0 = Automatic DMA transfer initiation by DMA request
bit 14-8 Unimplemented: Read as ‘0’
bit 7-0 IRQSEL<7:0>: DMA Peripheral IRQ Number Select bits
01000110 = TX data request (CAN1)
(2)
00100110 = Input Capture 4 (IC4)
00100101 = Input Capture 3 (IC3)
00100010 = RX data ready (CAN1)
00100001 = SPI2 transfer done (SPI2)
00011111 = UART2 Transmitter (UART2TX)
00011110 = UART2 Receiver (UART2RX)
00011100 = Timer5 (TMR5)
00011011 = Timer4 (TMR4)
00011010 = Output Compare 4 (OC4)
00011001 = Output Compare 3 (OC3)
00001101 = ADC1 convert done (ADC1)
00001100 = UART1 Transmitter (UART1TX)
00001011 = UART1 Receiver (UART1RX)
00001010 = SPI1 transfer done (SPI1)
00001000 = Timer3 (TMR3)
00000111 = Timer2 (TMR2)
00000110 = Output Compare 2 (OC2)
00000101 = Input Capture 2 (IC2)
00000010 = Output Compare 1 (OC1)
00000001 = Input Capture 1 (IC1)
00000000 = External Interrupt 0 (INT0)
Note 1: The FORCE bit cannot be cleared by user software. The FORCE bit is cleared by hardware when the
forced DMA transfer is complete or the channel is disabled (CHEN = 0).
2: This select bit is only available on dsPIC33EVXXXGM10X devices.
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REGISTER 8-3: DMAxSTAH: DMA CHANNEL x START ADDRESS REGISTER A (HIGH)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STA<23:16>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 STA<23:16>: DMA Primary Start Address bits (source or destination)
REGISTER 8-4: DMAxSTAL: DMA CHANNEL x START ADDRESS REGISTER A (LOW)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STA<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STA<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 STA<15:0>: DMA Primary Start Address bits (source or destination)
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REGISTER 8-5: DMAxSTBH: DMA CHANNEL x START ADDRESS REGISTER B (HIGH)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STB<23:16>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 STB<23:16>: DMA Secondary Start Address bits (source or destination)
REGISTER 8-6: DMAxSTBL: DMA CHANNEL x START ADDRESS REGISTER B (LOW)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STB<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STB<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 STB<15:0>: DMA Secondary Start Address bits (source or destination)
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REGISTER 8-7: DMAxPAD: DMA CHANNEL x PERIPHERAL ADDRESS REGISTER
(1)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PAD<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PAD<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 PAD<15:0>: DMA Peripheral Address Register bits
Note 1: If the channel is enabled (i.e., active), writes to this register may result in unpredictable behavior of the
DMA channel and should be avoided.
REGISTER 8-8: DMAxCNT: DMA CHANNEL x TRANSFER COUNT REGISTER
(1)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— CNT<13:8>
(2)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CNT<7:0>
(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14 Unimplemented: Read as ‘0’
bit 13-0 CNT<13:0>: DMA Transfer Count Register bits
(2)
Note 1: If the channel is enabled (i.e., active), writes to this register may result in unpredictable behavior of the
DMA channel and should be avoided.
2: The number of DMA transfers = CNT<13:0> + 1.
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REGISTER 8-9: DSADRH: DMA MOST RECENT RAM HIGH ADDRESS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
DSADR<23:16>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 DSADR<23:16>: Most Recent DMA Address Accessed by DMA bits
REGISTER 8-10: DSADRL: DMA MOST RECENT RAM LOW ADDRESS REGISTER
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
DSADR<15:8>
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
DSADR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0 DSADR<15:0>: Most Recent DMA Address Accessed by DMA bits
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REGISTER 8-11: DMAPWC: DMA PERIPHERAL WRITE COLLISION STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0
— — — — PWCOL3 PWCOL2 PWCOL1 PWCOL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-4 Unimplemented: Read as ‘0’
bit 3 PWCOL3: Channel 3 Peripheral Write Collision Flag bit
1 = Write collision is detected
0 = Write collision is not detected
bit 2 PWCOL2: Channel 2 Peripheral Write Collision Flag bit
1 = Write collision is detected
0 = Write collision is not detected
bit 1 PWCOL1: Channel 1 Peripheral Write Collision Flag bit
1 = Write collision is detected
0 = Write collision is not detected
bit 0 PWCOL0: Channel 0 Peripheral Write Collision Flag bit
1 = Write collision is detected
0 = Write collision is not detected
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REGISTER 8-12: DMARQC: DMA REQUEST COLLISION STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0
— — — — RQCOL3 RQCOL2 RQCOL1 RQCOL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-4 Unimplemented: Read as ‘0’
bit 3 RQCOL3: Channel 3 Transfer Request Collision Flag bit
1 = User force and interrupt-based request collision is detected
0 = User force and interrupt-based request collision is not detected
bit 2 RQCOL2: Channel 2 Transfer Request Collision Flag bit
1 = User force and interrupt-based request collision is detected
0 = User force and interrupt-based request collision is not detected
bit 1 RQCOL1: Channel 1 Transfer Request Collision Flag bit
1 = User force and interrupt-based request collision is detected
0 = User force and interrupt-based request collision is not detected
bit 0 RQCOL0: Channel 0 Transfer Request Collision Flag bit
1 = User force and interrupt-based request collision is detected
0 = User force and interrupt-based request collision is not detected
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REGISTER 8-13: DMALCA: DMA LAST CHANNEL ACTIVE STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 R-1 R-1 R-1 R-1
— — — — LSTCH<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-4 Unimplemented: Read as ‘0’
bit 3-0 LSTCH<3:0>: Last DMAC Channel Active Status bits
1111 = No DMA transfer has occurred since system Reset
1110 = Reserved
•
•
•
0100 = Reserved
0011 = Last data transfer was handled by Channel 3
0010 = Last data transfer was handled by Channel 2
0001 = Last data transfer was handled by Channel 1
0000 = Last data transfer was handled by Channel 0
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REGISTER 8-14: DMAPPS: DMA PING-PONG STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 R-0 R-0 R-0 R-0
— — — — PPST3 PPST2 PPST1 PPST0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-4 Unimplemented: Read as ‘0’
bit 3 PPST3: Channel 3 Ping-Pong Mode Status Flag bit
1 = DMA3STB register is selected
0 = DMA3STA register is selected
bit 2 PPST2: Channel 2 Ping-Pong Mode Status Flag bit
1 = DMA2STB register is selected
0 = DMA2STA register is selected
bit 1 PPST1: Channel 1 Ping-Pong Mode Status Flag bit
1 = DMA1STB register is selected
0 = DMA1STA register is selected
bit 0 PPST0: Channel 0 Ping-Pong mode Status Flag bit
1 = DMA0STB register is selected
0 = DMA0STA register is selected
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NOTES:
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9.0 OSCILLATOR CONFIGURATION
The dsPIC33EVXXXGM00X/10X family oscillator
system provides:
• On-Chip Phase-Locked Loop (PLL) to Boost
Internal Operating Frequency on Select Internal
and External Oscillator Sources
• On-the-Fly Clock Switching between Various
Clock Sources
• Doze mode for System Power Savings
• Fail-Safe Clock Monitor (FSCM) that Detects
Clock Failure and Permits Safe Application
Recovery or Shutdown.
• Backup FRC (BFRC) Function that Provides a
System Clock when there is a Failure in the FRC
Clock
• Configuration bits for Clock Source Selection
A simplified diagram of the oscillator system is shown
in Figure 9-1.
FIGURE 9-1: OSCILLATOR SYSTEM DIAGRAM
Note 1: This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X
family of devices. It is not intended to be
a comprehensive reference source. To
complement the information in this data
sheet, refer to “Oscillator” (DS70580) in
the “dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note 1:
See Figure 9-2 for PLL and F
VCO
details.
2:
The term, F
P
, refers to the clock source for all peripherals, while F
CY
refers to the clock source for the CPU. Throughout this
document, F
CY
and F
P
are used interchangeably, except in the case of Doze mode. F
P
and F
CY
will be different when Doze
mode is used with a Doze ratio of 1:2 or lower.
XTPLL, HSPLL,
XT, HS, EC
FRCDIV<2:0>
WDT, PWRT
FRCDIVN
FRCDIV16
ECPLL, FRCPLL
NOSC<2:0> FNOSC<2:0>
Reset
FRC
Oscillator
DOZE<2:0>
S3
S1
S2
S1/S3
S7
S6
FRC
LPRC
S0
S5
Clock Switch
S7
Clock Fail
TUN<5:0>
PLL
(1)
F
CY(2)
F
OSC
FRCDIV
DOZE
FSCM, CTMU
POSCCLK
FRCCLK
F
VCO(1)
OSC2
OSC1 Primary Oscillator
POSCMD<1:0>
F
P(2)
÷ N
ROSEL RODIV<3:0>
REFCLKO
POSCCLK
RPn
F
OSC
Reference Clock Generation
S4
BFRC
LPRC
Oscillator
BFRC
Oscillator
If CF =
1
÷ 16
÷ 2
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9.1 CPU Clocking System
The dsPIC33EVXXXGM00X/10X family of devices
provides the following six system clock options:
• Fast RC (FRC) Oscillator
• FRC Oscillator with Phase-Locked Loop (PLL)
• FRC Oscillator with Postscaler
• Primary (XT, HS or EC) Oscillator
• Primary Oscillator with PLL
• Low-Power RC (LPRC) Oscillator
For instruction execution speed or device operating
frequency, F
CY
, see Equation 9-1.
EQUATION 9-1: DEVICE OPERATING
FREQUENCY
Figure 9-2 provides the block diagram of the PLL
module.
Equation 9-2 provides the relationship between input
frequency (F
IN
) and output frequency (F
OSC
).
Equation 9-3 provides the relationship between input
frequency (F
IN
) and VCO frequency (F
SYS
).
FIGURE 9-2: PLL BLOCK DIAGRAM
EQUATION 9-2: F
OSC
CALCULATION
EQUATION 9-3: F
VCO
CALCULATION
F
CY
= F
OSC
/2
0.8 MHz < F
PLLI(1)
< 8.0 MHz
120 MHz < F
SYS
(1)
< 340 MHz
F
OSC
< 140 MHz
÷ N1
÷ M
÷ N2
VCOPFD
F
PLLI
F
SYS
F
OSC
PLLPST<1:0>
PLLDIV<8:0>
PLLPRE<4:0>
F
IN
Note 1:
This frequency range must be met at all times.
(PLLDIV<8:0> + 2)
(PLLPRE<4:0> + 2) 2(PLLPOST<1:0> + 1)
()
F
OSC
= F
IN
= F
IN
M
N1
()
Where:
N1 = PLLPRE<4 :0> + 2
N2 = 2 x (PLLPOST<1:0> + 1)
M = PLLDIV<8:0> + 2
(PLLDIV< 8 : 0 > + 2)
(PLLPRE<4:0> + 2)
()
F
SYS
= F
IN
= F
IN
M
N1
()
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Table 9-1 provides the Configuration bits which allow
users to choose between the various clock modes.
TABLE 9-1: CONFIGURATION BIT VALUES FOR CLOCK SELECTION
Oscillator Mod e Oscilla tor Source POSCMD<1:0> FNOSC<2:0>
Fast RC Oscillator with Divide-by-N (FRCDIVN)
(1,2)
Internal xx 111
Fast RC Oscillator with Divide-by-16 (FRCDIV16)
(1)
Internal xx 110
Low-Power RC Oscillator (LPRC)
(1)
Internal xx 101
Primary Oscillator (HS) with PLL (HSPLL) Primary 10 011
Primary Oscillator (XT) with PLL (XTPLL) Primary 01 011
Primary Oscillator (EC) with PLL (ECPLL)
(1)
Primary 00 011
Primary Oscillator (HS) Primary 10 010
Primary Oscillator (XT) Primary 01 010
Primary Oscillator (EC)
(1)
Primary 00 010
Fast RC Oscillator (FRC) with Divide-by-N and PLL
(FRCPLL)
(1)
Internal xx 001
Fast RC Oscillator (FRC)
(1)
Internal xx 000
Note 1: OSC2 pin function is determined by the OSCIOFNC Configuration bit.
2: This is the default oscillator mode for an unprogrammed (erased) device.
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REGISTER 9-1: OSCCON: OSCILLATOR CONTROL REGISTER
(1,3)
U-0 R-0 R-0 R-0 U-0 R/W-y R/W-y R/W-y
— COSC2 COSC1 COSC0 —NOSC2
(2)
NOSC1
(2)
NOSC0
(2)
bit 15 bit 8
R/W-0 R/W-0 R-0 U-0 R/C-0 U-0 U-0 R/W-0
CLKLOCK IOLOCK LOCK —CF —— OSWEN
bit 7 bit 0
Legend: C = Clearable bit y = Value set from Configuration bits on POR
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 Unimplemented: Read as ‘0’
bit 14-12 COSC<2:0>: Current Oscillator Selection bits (read-only)
111 = Fast RC Oscillator (FRC) with Divide-by-N
110 = Fast RC Oscillator (FRC) with Divide-by-16
101 = Low-Power RC Oscillator (LPRC)
100 = Backup FRC Oscillator (BFRC)
(4)
011 = Primary Oscillator (XT, HS, EC) with PLL
010 = Primary Oscillator (XT, HS, EC)
001 = Fast RC Oscillator (FRC) Divided by N and PLL
000 = Fast RC Oscillator (FRC)
bit 11 Unimplemented: Read as ‘0’
bit 10-8 NOSC<2:0>: New Oscillator Selection bits
(2)
111 = Fast RC Oscillator (FRC) with Divide-by-N
110 = Fast RC Oscillator (FRC) with Divide-by-16
101 = Low-Power RC Oscillator (LPRC)
100 = Reserved
(5)
011 = Primary Oscillator (XT, HS, EC) with PLL
010 = Primary Oscillator (XT, HS, EC)
001 = Fast RC Oscillator (FRC) Divided by N and PLL
000 = Fast RC Oscillator (FRC)
bit 7 CLKLOCK: Clock Lock Enable bit
1 = If FCKSM0 = 1, then clock and PLL configurations are locked; if FCKSM0 = 0, then clock and PLL
configurations may be modified
0 = Clock and PLL selections are not locked, configurations may be modified
bit 6 IOLOCK: I/O Lock Enable bit
1 = I/O lock is active
0 = I/O lock is not active
bit 5 LOCK: PLL Lock Status bit (read-only)
1 = Indicates that PLL is in lock or PLL start-up timer is satisfied
0 = Indicates that PLL is out of lock, start-up timer is in progress or PLL is disabled
Note 1: Writes to this register require an unlock sequence. Refer to “Oscillator” (DS70580) in the
“dsPIC33/PIC24 Family Reference Manual” (available from the Microchip web site) for details.
2: Direct clock switches between any Primary Oscillator mode with PLL and FRCPLL mode are not permit-
ted. This applies to clock switches in either direction. In these instances, the application must switch to
FRC mode as a transitional clock source between the two PLL modes.
3: This register resets only on a Power-on Reset (POR).
4: COSC<2:0> bits will be set to ‘0b100’ when FRC fails.
5: User cannot write ‘0b100’ to NOSC<2:0>. COSC<2:0> will be set to ‘0b100’ (BFRC) when the FRC fails.
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bit 4 Unimplemented: Read as ‘0’
bit 3 CF: Clock Fail Detect bit (read/clear by application)
1 = FSCM has detected a clock failure
0 = FSCM has not detected a clock failure
bit 2-1 Unimplemented: Read as ‘0’
bit 0 OSWEN: Oscillator Switch Enable bit
1 = Requests oscillator switch to selection specified by the NOSC<2:0> bits
0 = Oscillator switch is complete
REGISTER 9-1: OSCCON: OSCILLATOR CONTROL REGISTER
(1,3)
(CONTINUED)
Note 1: Writes to this register require an unlock sequence. Refer to “Oscillator” (DS70580) in the
“dsPIC33/PIC24 Family Reference Manual” (available from the Microchip web site) for details.
2: Direct clock switches between any Primary Oscillator mode with PLL and FRCPLL mode are not permit-
ted. This applies to clock switches in either direction. In these instances, the application must switch to
FRC mode as a transitional clock source between the two PLL modes.
3: This register resets only on a Power-on Reset (POR).
4: COSC<2:0> bits will be set to ‘0b100’ when FRC fails.
5: User cannot write ‘0b100’ to NOSC<2:0>. COSC<2:0> will be set to ‘0b100’ (BFRC) when the FRC fails.
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REGISTER 9-2: CLKDIV: CLOCK DIVISOR REGISTER
(2)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-1
ROI DOZE2
(3)
DOZE1
(3)
DOZE0
(3)
DOZEN
(1,4)
FRCDIV2 FRCDIV1 FRCDIV0
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PLLPOST1 PLLPOST0 — PLLPRE4 PLLPRE3 PLLPRE2 PLLPRE1 PLLPRE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ROI: Recover on Interrupt bit
1 = Interrupts will clear the DOZEN bit
0 = Interrupts have no effect on the DOZEN bit
bit 14-12 DOZE<2:0>: Processor Clock Reduction Select bits
(3)
111 = F
CY
divided by 128
110 = F
CY
divided by 64
101 = F
CY
divided by 32
100 = F
CY
divided by 16
011 = F
CY
divided by 8
010 = F
CY
divided by 4
001 = F
CY
divided by 2
000 = F
CY
divided by 1 (default)
bit 11 DOZEN: Doze Mode Enable bit
(1,4)
1 = DOZE<2:0> field specifies the ratio between the peripheral clocks and the processor clocks
0 = Processor clock and peripheral clock ratio are forced to 1:1
bit 10-8 FRCDIV<2:0>: Internal Fast RC Oscillator Postscaler bits
111 = FRC divided by 256
110 = FRC divided by 64
101 = FRC divided by 32
100 = FRC divided by 16
011 = FRC divided by 8
010 = FRC divided by 4
001 = FRC divided by 2 (default)
000 = FRC divided by 1
bit 7-6 PLLPOST<1:0>: PLL VCO Output Divider Select bits (also denoted as ‘N2’, PLL postscaler)
11 = Output divided by 8
10 = Reserved
01 = Output divided by 4
00 = Output divided by 2
bit 5 Unimplemented: Read as ‘0’
Note 1: This bit is cleared when the ROI bit is set and an interrupt occurs.
2: This register resets only on a Power-on Reset (POR).
3: DOZE<2:0> bits can only be written to when the DOZEN bit is clear. If DOZEN = 1, any writes to
DOZE<2:0> are ignored.
4: The DOZEN bit cannot be set if DOZE<2:0> = 000. If DOZE<2:0> = 000, any attempt by user software to
set the DOZEN bit is ignored.
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bit 4-0 PLLPRE<4:0>: PLL Phase Detector Input Divider Select bits (also denoted as ‘N1’, PLL prescaler)
11111 = Input divided by 33
•
•
•
00001 = Input divided by 3
00000 = Input divided by 2 (default)
REGISTER 9-2: CLKDIV: CLOCK DIVISOR REGISTER
(2)
(CONTINUED)
Note 1: This bit is cleared when the ROI bit is set and an interrupt occurs.
2: This register resets only on a Power-on Reset (POR).
3: DOZE<2:0> bits can only be written to when the DOZEN bit is clear. If DOZEN = 1, any writes to
DOZE<2:0> are ignored.
4: The DOZEN bit cannot be set if DOZE<2:0> = 000. If DOZE<2:0> = 000, any attempt by user software to
set the DOZEN bit is ignored.
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REGISTER 9-3: PLLFBD: PLL FEEDBACK DIVISOR REGISTER
(1)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
— — — — — — —PLLDIV8
bit 15 bit 8
R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0
PLLDIV<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-9 Unimplemented: Read as ‘0’
bit 8-0 PLLDIV<8:0>: PLL Feedback Divisor bits (also denoted as ‘M’, PLL multiplier)
111111111 = 513
•
•
•
000110000 = 50 (default)
•
•
•
000000010 = 4
000000001 = 3
000000000 = 2
Note 1: This register is reset only on a Power-on Reset (POR).
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REGISTER 9-4: OSCTUN: FRC OSCILLATOR TUNING REGISTER
(1)
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— TUN<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6 Unimplemented: Read as ‘0’
bit 5-0 TUN<5:0>: FRC Oscillator Tuning bits
111111 = Center frequency – 0.048% (7.363 MHz)
•
•
•
100001 = Center frequency – 1.5% (7.259 MHz)
100000 = Center frequency – 1.548% (7.2552 MHz)
011111 = Center frequency + 1.5% (7.48 MHz)
011110 = Center frequency + 1.452% (7.477 MHz)
•
•
•
000001 = Center frequency + 0.048% (7.373 MHz)
000000 = Center frequency (7.37 MHz nominal)
Note 1: This register is reset only on a Power-on Reset (POR).
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REGISTER 9-5: REFOCON: REFERENCE OSCILLATOR CONTROL REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ROON — ROSSLP ROSEL RODIV3
(1)
RODIV2
(1)
RODIV1
(1)
RODIV0
(1)
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 ROON: Reference Oscillator Output Enable bit
1 = Reference oscillator output is enabled on the REFCLK pin
(2)
0 = Reference oscillator output is disabled
bit 14 Unimplemented: Read as ‘0’
bit 13 ROSSLP: Reference Oscillator Run in Sleep bit
1 = Reference oscillator output continues to run in Sleep mode
0 = Reference oscillator output is disabled in Sleep mode
bit 12 ROSEL: Reference Oscillator Source Select bit
1 = Oscillator crystal is used as the reference clock
0 = System clock is used as the reference clock
bit 11-8 RODIV<3:0>: Reference Oscillator Divider bits
(1)
1111 = Reference clock divided by 32,768
1110 = Reference clock divided by 16,384
1101 = Reference clock divided by 8,192
1100 = Reference clock divided by 4,096
1011 = Reference clock divided by 2,048
1010 = Reference clock divided by 1,024
1001 = Reference clock divided by 512
1000 = Reference clock divided by 256
0111 = Reference clock divided by 128
0110 = Reference clock divided by 64
0101 = Reference clock divided by 32
0100 = Reference clock divided by 16
0011 = Reference clock divided by 8
0010 = Reference clock divided by 4
0001 = Reference clock divided by 2
0000 = Reference clock
bit 7-0 Unimplemented: Read as ‘0’
Note 1: The reference oscillator output must be disabled (ROON = 0) before writing to these bits.
2: This pin is remappable. See Section 11.5 “Peripheral Pin Select (PPS)” for more information.
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10.0 POWER-SA VING FEATURES
The dsPIC33EVXXXGM00X/10X devices provide the
ability to manage power consumption by selectively
managing clocking to the CPU and the peripherals.
In general, a lower clock frequency and a reduction
in the number of peripherals being clocked
constitutes lower consumed power.
The dsPIC33EVXXXGM00X/10X family devices can
manage power consumption in the following four
methods:
• Clock Frequency
• Instruction-Based Sleep and Idle modes
• Software Controlled Doze mode
• Selective Peripheral Control in Software
Combinations of these methods can be used to
selectively tailor an application’s power consumption
while still maintaining critical application features,
such as timing-sensitive communications.
10.1 Clock Frequency and Clock
Switching
The dsPIC33EVXXXGM00X/10X family devices allow
a wide range of clock frequencies to be selected under
application control. If the system clock configuration is
not locked, users can choose low-power or high-
precision oscillators by simply changing the NOSCx
bits (OSCCON<10:8>). For more information on the
process of changing a system clock during operation,
as well as limitations to the process, see Section 9.0
“Oscillator Configuration”.
10.2 Instruction-Based Power-Saving
Modes
The dsPIC33EVXXXGM00X/10X family devices have
two special power-saving modes that are entered
through the execution of a special PWRSAV
instruction. Sleep mode stops clock operation and
halts all code execution. Idle mode halts the CPU
and code execution, but allows peripheral modules
to continue operation. The assembler syntax of the
PWRSAV instruction is shown in Example 10-1.
Sleep and Idle modes can be exited as a result of an
enabled interrupt, WDT time-out or a device Reset. When
the device exits these modes, it is said to “wake-up”.
EXAMPL E 10-1: PWRSAV INSTRUCTION SYNT AX
Note 1: This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X
family of devices. It is not intended to be
a comprehensive reference source. To
complement the information in this data
sheet, refer to “Watchdog Timer and
Power-Saving Modes” (DS70615) in
the “dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
Note: SLEEP_MODE and IDLE_MODE are con-
stants defined in the Assembler Include
file for the selected device.
PWRSAV #SLEEP_MODE ; Put the device into Sleep mode
PWRSAV #IDLE_MODE ; Put the device into Idle mode
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10.2.1 SLEEP MODE
The following events occur in Sleep mode:
• The system clock source is shut down. If an
on-chip oscillator is used, it is turned off.
• The device current consumption is reduced to a
minimum, provided that no I/O pin is sourcing
current.
• The Fail-Safe Clock Monitor does not operate,
since the system clock source is disabled.
• The LPRC clock continues to run in Sleep mode if
the WDT is enabled.
• The WDT, if enabled, is automatically cleared
before entering Sleep mode.
• Some device features or peripherals can continue
to operate. This includes items such as the Input
Change Notification (ICN) on the I/O ports or
peripherals that use an external clock input.
• Any peripheral that requires the system clock
source for its operation is disabled.
The device wakes up from Sleep mode on any of these
events:
• Any interrupt source that is individually enabled
• Any form of device Reset
• A WDT time-out
On wake-up from Sleep mode, the processor restarts
with the same clock source that was active when Sleep
mode was entered.
For optimal power savings, the internal regulator and
the Flash regulator can be configured to go into
Standby mode when Sleep mode is entered by clearing
the VREGS (RCON<8>) and VREGSF (RCON<11>)
bits (default configuration).
If the application requires a faster wake-up time, and
can accept higher current requirements, the VREGS
(RCON<8>) and VREGSF (RCON<11>) bits can be set
to keep the internal regulator and the Flash regulator
active during Sleep mode.
10.2.2 IDLE MODE
The following events occur in Idle mode:
• The CPU stops executing instructions.
• The WDT is automatically cleared.
• The system clock source remains active. By
default, all peripheral modules continue to operate
normally from the system clock source, but can
also be selectively disabled (see Section 10.4
“Peripheral Mod ule Di sab le” ).
• If the WDT or FSCM is enabled, the LPRC also
remains active.
The device wakes from Idle mode on any of these
events:
• Any interrupt that is individually enabled
• Any device Reset
• A WDT time-out
On wake-up from Idle mode, the clock is reapplied to
the CPU and instruction execution will begin (2-4 clock
cycles later), starting with the instruction following the
PWRSAV instruction or the first instruction in the
Interrupt Service Routine (ISR).
All peripherals also have the option to discontinue
operation when Idle mode is entered to allow for
increased power savings. This option is selectable in
the control register of each peripheral; for example, the
TSIDL bit in the Timer1 Control register (T1CON<13>).
10.2.3 INTERRUPTS COINCIDENT WITH
POWER SAVE INSTRUCTIONS
Any interrupt that coincides with the execution of a
PWRSAV instruction is held off until entry into Sleep or
Idle mode has completed. The device then wakes up
either from Sleep mode or Idle mode.
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10.3 Doze Mode
The preferred strategies for reducing power consump-
tion are changing clock speed and invoking one of the
power-saving modes. In some circumstances, this may
not be practical. For example, it may be necessary for
an application to maintain uninterrupted synchronous
communication, even while it is doing nothing else.
Reducing system clock speed can introduce communi-
cation errors, while using a power-saving mode can
stop communications completely.
Doze mode is a simple and effective alternative method
to reduce power consumption while the device is still
executing code. In this mode, the system clock
continues to operate from the same source and at the
same speed. Peripheral modules continue to be
clocked at the same speed, while the CPU clock speed
is reduced. Synchronization between the two clock
domains is maintained, allowing the peripherals to
access the SFRs while the CPU executes code at a
slower rate.
Doze mode is enabled by setting the DOZEN bit
(CLKDIV<11>). The ratio between peripheral and core
clock speed is determined by the DOZE<2:0> bits
(CLKDIV<14:12>). There are eight possible configu-
rations, from 1:1 to 1:128, with 1:1 being the default
setting.
Programs can use Doze mode to selectively reduce
power consumption in event-driven applications. This
allows clock-sensitive functions, such as synchronous
communications, to continue without interruption while
the CPU Idles, waiting for something to invoke an inter-
rupt routine. An automatic return to full-speed CPU
operation on interrupts can be enabled by setting the
ROI bit (CLKDIV<15>). By default, interrupt events
have no effect on Doze mode operation.
For example, suppose the device is operating at
20 MIPS and the CAN module has been configured for
500 kbps, based on this device operating speed. If the
device is placed in Doze mode, with a clock frequency
ratio of 1:4, the CAN module continues to communicate
at the required bit rate of 500 kbps, but the CPU now
starts executing instructions at a frequency of 5 MIPS.
10.4 Peripheral Module Dis a ble
The Peripheral Module Disable (PMD) registers
provide a method to disable a peripheral module by
stopping all clock sources supplied to that module.
When a peripheral is disabled, using the appropriate
PMDx control bit, the peripheral is in a minimum power
consumption state. The control and status registers
associated with the peripheral are also disabled, so
writes to those registers do not have any effect and
read values are invalid.
A peripheral module is enabled only if both the associ-
ated bit in the PMDx register is cleared and the peripheral
is supported by the specific dsPIC
®
DSC variant. If the
peripheral is present in the device, it is enabled in the
PMDx register by default.
Note: If a PMDx bit is set, the corresponding
module is disabled after a delay of one
instruction cycle. Similarly, if a PMDx bit is
cleared, the corresponding module is
enabled after a delay of one instruction
cycle (assuming the module control
registers are already configured to enable
module operation).
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REGISTER 10-1: PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0
T5MD T4MD T3MD T2MD T1MD — PWMMD —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
I2C1MD U2MD U1MD SPI2MD SPI1MD —C1MD
(1)
AD1MD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 T5MD: Timer5 Module Disable bit
1 = Timer5 module is disabled
0 = Timer5 module is enabled
bit 14 T4MD: Timer4 Module Disable bit
1 = Timer4 module is disabled
0 = Timer4 module is enabled
bit 13 T3MD: Timer3 Module Disable bit
1 = Timer3 module is disabled
0 = Timer3 module is enabled
bit 12 T2MD: Timer2 Module Disable bit
1 = Timer2 module is disabled
0 = Timer2 module is enabled
bit 11 T1MD: Timer1 Module Disable bit
1 = Timer1 module is disabled
0 = Timer1 module is enabled
bit 10 Unimplemented: Read as ‘0’
bit 9 PWMMD: PWM Module Disable bit
1 = PWM module is disabled
0 = PWM module is enabled
bit 8 Unimplemented: Read as ‘0’
bit 7 I2C1MD: I2C1 Module Disable bit
1 = I2C1 module is disabled
0 = I2C1 module is enabled
bit 6 U2MD: UART2 Module Disable bit
1 = UART2 module is disabled
0 = UART2 module is enabled
bit 5 U1MD: UART1 Module Disable bit
1 = UART1 module is disabled
0 = UART1 module is enabled
bit 4 SPI2MD: SPI2 Module Disable bit
1 = SPI2 module is disabled
0 = SPI2 module is enabled
bit 3 SPI1MD: SPI1 Module Disable bit
1 = SPI1 module is disabled
0 = SPI1 module is enabled
Note 1: This bit is available on dsPIC33EVXXXGM10X devices only.
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bit 2 Unimplemented: Read as ‘0’
bit 1 C1MD: CAN1 Module Disable bit
(1)
1 = CAN1 module is disabled
0 = CAN1 module is enabled
bit 0 AD1MD: ADC1 Module Disable bit
1 = ADC1 module is disabled
0 = ADC1 module is enabled
REGISTER 10-1: PMD1: PERIPHERAL MODULE DISABLE CONTROL REGISTER 1 (CONTINUED)
Note 1: This bit is available on dsPIC33EVXXXGM10X devices only.
REGISTER 10-2: PMD2: PERIPHERAL MODULE DISABLE CONTROL REGISTER 2
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
———— IC4MD IC3MD IC2MD IC1MD
bit 15 bit 8
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
———— OC4MD OC3MD OC2MD OC1MD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12 Unimplemented: Read as ‘0’
bit 11-8 IC<4:1>MD: Input Capture x (x = 1-4) Module Disable bits
1 = Input Capture x module is disabled
0 = Input Capture x module is enabled
bit 7-4 Unimplemented: Read as ‘0’
bit 3-0 OC<4:1>MD: Output Compare x (x = 1-4) Module Disable bits
1 = Output Compare x module is disabled
0 = Output Compare x module is enabled
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REGISTER 10-4: PMD4: PERIPHERAL MODULE DISABLE CONTROL REGISTER 4
REGISTER 10-3: PMD3: PERIPHERAL MODULE DISABLE CONTROL REGISTER 3
U-0 U-0 U-0 U-0 U-0 R/W-0 U-0 U-0
— — — — — CMPMD — —
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0’
bit 10 CMPMD: Comparator Module Disable bit
1 = Comparator module is disabled
0 = Comparator module is enabled
bit 9-0 Unimplemented: Read as ‘0’
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 R/W-0 R/W-0 U-0 U-0
————REFOMDCTMUMD— —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-4 Unimplemented: Read as ‘0’
bit 3 REFOMD: Reference Clock Module Disable bit
1 = Reference clock module is disabled
0 = Reference clock module is enabled
bit 2 CTMUMD: CTMU Module Disable bit
1 = CTMU module is disabled
0 = CTMU module is enabled
bit 1-0 Unimplemented: Read as ‘0’
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REGISTER 10-5: PMD6: PERIPHERAL MODULE DISABLE CONTROL REGISTER 6
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
— — — — —PWM<3:1>MD
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-11 Unimplemented: Read as ‘0’
bit 10-8 PWM<3:1>MD: PWMx (x = 1-3) Module Disable bit
1 = PWMx module is disabled
0 = PWMx module is enabled
bit 7-0 Unimplemented: Read as ‘0’
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REGISTER 10-6: PMD7: PERIPHERAL MODULE DISABLE CONTROL REGISTER 7
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0
— — —DMA0MD
(1)
— — — —
DMA1MD
(1)
DMA2MD
(1)
DMA3MD
(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-5 Unimplemented: Read as ‘0’
bit 4 DMA0MD: DMA0 Module Disable bit
(1)
1 = DMA0 module is disabled
0 = DMA0 module is enabled
DMA1MD: DMA1 Module Disable bit
(1)
1 = DMA1 module is disabled
0 = DMA1 module is enabled
DMA2MD: DMA2 Module Disable bit
(1)
1 = DMA2 module is disabled
0 = DMA2 module is enabled
DMA3MD: DMA3 Module Disable bit
(1)
1 = DMA3 module is disabled
0 = DMA3 module is enabled
bit 3-0 Unimplemented: Read as ‘0’
Note 1: This single bit enables and disables all four DMA channels.
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REGISTER 10-7: PMD8: PERIPHERAL MODULE DISABLE CONTROL REGISTER 8
U-0 U-0 U-0 R/W-0 R/W-0 U-0 U-0 R/W-0
— — — SENT2MD SENT1MD —— DMTMD
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13 Unimplemented: Read as ‘0’
bit 12 SENT2MD: SENT2 Module Disable bit
1 = SENT2 module is disabled
0 = SENT2 module is enabled
bit 11 SENT1MD: SENT1 Module Disable bit
1 = SENT1 module is disabled
0 = SENT1 module is enabled
bit 10-9 Unimplemented: Read as ‘0’
bit 8 DMTMD: Deadman Timer Disable bit
1 = Deadman Timer is disabled
0 = Deadman Timer is enabled
bit 7-0 Unimplemented: Read as ‘0’
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NOTES:
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11.0 I/O PORTS
Many of the device pins are shared among the
peripherals and the Parallel I/O ports. All I/O input ports
feature Schmitt Trigger inputs for improved noise
immunity. All the pins in the device are 5V tolerant pins.
11.1 P a rallel I/O (P I O ) Po rts
Generally, a Parallel I/O port that shares a pin with a
peripheral is subservient to the peripheral. The
peripheral’s output buffer data and control signals are
provided to a pair of multiplexers. The multiplexers
select whether the peripheral or the associated port
has ownership of the output data and control signals of
the I/O pin. The logic also prevents “loop through”, in
which a port’s digital output can drive the input of a
peripheral that shares the same pin. Figure 11-1
illustrates how ports are shared with other peripherals
and the associated I/O pin to which they are connected.
When a peripheral is enabled and the peripheral is
actively driving an associated pin, the use of the pin as a
general purpose output pin is disabled. The I/O pin can
be read, but the output driver for the parallel port bit is
disabled. If a peripheral is enabled, but the peripheral is
not actively driving a pin, that pin can be driven by a port.
All port pins have eight registers directly associated
with their operation as digital I/O. The Data Direction
register (TRISx) determines whether the pin is an input
or an output. If the Data Direction register bit is a ‘1’,
then the pin is an input. All port pins are defined as
inputs after a Reset. Reads from the latch (LATx), read
the latch; writes to the latch, write the latch. Reads from
the port (PORTx), read the port pins, while writes to the
port pins, write the latch.
Any bit and its associated data and control registers
that are not valid for a particular device are disabled.
This means that the corresponding LATx and TRISx
registers, and the port pin are read as zeros.
When a pin is shared with another peripheral or
function that is defined as an input only, it is
nevertheless regarded as a dedicated port, because
there is no other competing source of output.
FIGURE 11-1: BLOCK DIAGRAM OF A TYPICAL SHARED PORT STRUCTURE
Note 1: This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To com-
plement the information in this data sheet,
refer to “I/O Ports” (DS70000598) in the
“dsPIC33/PIC24 Family Reference Man-
ual”, which is available from the Microchip
web site (www.microchip.com).
2: Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization” in
this data sheet for device-specific register
and bit information.
QD
CK
WR LATx +
TRISx Latch
I/O Pin
WR PORTx
Data Bus
QD
CK
Data Latch
Read PORTx
Read TRISx
1
0
1
0
WR TRISx
Peripheral Output Data Output Enable
Peripheral Input Data
I/O
Peripheral Module
Peripheral Output Enable
PIO Modul e
Output Multiplexers
Output Data
Input Data
Peripheral Module Enable
Read LATx
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11.1.1 OPEN-DRAIN CONFIGURATION
In addition to the PORTx, LATx and TRISx registers
for data control, port pins can also be individually
configured for either digital or open-drain outputs. This
is controlled by the Open-Drain Control x register
(ODCx) associated with each port. Setting any of the
bits configures the corresponding pin to act as an
open-drain output.
The open-drain feature allows the generation of
outputs other than V
DD
by using external pull-up
resistors. The maximum open-drain voltage allowed
on any pin is the same as the maximum V
IH
specification for that particular pin.
See Table 30-10 in Section 30.0 “Electrical Charac-
teristics” for the maximum V
IH
specification of each
pin.
11.2 Configuring Analog and Digital
Port Pins
The ANSELx registers control the operation of the
analog port pins. The port pins that are to function as
analog inputs or outputs must have their corresponding
ANSELx and TRISx bits set. In order to use port pins for
I/O functionality with digital modules, such as timers,
UARTs, etc., the corresponding ANSELx bits must be
cleared.
The ANSELx register has a default value of 0xFFFF.
Therefore, all pins that share analog functions are
analog (not digital) by default.
Pins with analog functions affected by the ANSELx
registers are listed with a buffer type of analog in the
Pinout I/O Descriptions table (see Table 1 -1 in
Section 1.0 “Device Overview”).
If the TRISx bit is cleared (output) while the ANSELx bit
is set, the digital output level (V
OH
or V
OL
) is converted
by an analog peripheral, such as the ADC module or
comparator module.
When the PORTx register is read, all pins configured as
analog input channels are read as cleared (a low level).
Pins configured as digital inputs do not convert an
analog input. Analog levels on any pin defined as a
digital input (including the ANx pins) can cause the
input buffer to consume current that exceeds the
device specifications.
11.2.1 I/O PORT WRITE/READ TIMING
One instruction cycle is required between a port
direction change or port write operation and a read
operation of the same port. Typically, this instruction
would be a NOP, as shown in Example 11-1.
11.3 Input Change Notification (ICN)
The Input Change Notification function (ICN) of the I/O
ports allows devices to generate interrupt requests to
the processor in response to a Change-of-State (COS)
on selected input pins. This feature can detect input
Change-of-States, even in Sleep mode, when the
clocks are disabled. Every I/O port pin can be selected
(enabled) for generating an interrupt request on a
Change-of-State.
Three control registers are associated with the ICN
functionality of each I/O port. The CNENx registers
contain the ICN interrupt enable control bits for each of
the input pins. Setting any of these bits enables an ICN
interrupt for the corresponding pins.
Each I/O pin also has a weak pull-up and a weak pull-
down connected to it. The pull-ups and pull-downs act
as a current source or sink source connected to the
pin, and eliminate the need for external resistors when
push button or keypad devices are connected. The
pull-ups and pull-downs are enabled separately using
the CNPUx and the CNPDx registers, which contain
the control bits for each of the pins. Setting any of
the control bits enables the weak pull-ups and/or
pull-downs for the corresponding pins.
EXAMPL E 11 -1 : PORT WRITE/READ
EXAMPLE
Note: The pull-ups and pull-downs on ICN pins
should always be disabled when the port
pin is configured as a digital output.
MOV 0xFF00, W0 ; Configure PORTB<1 5:8>
; as inputs
MOV W0, TRISB ; and PORTB<7:0>
; as outputs
NOP ; Delay 1 cycle
BTSS PORTB, #13 ; Next Instr uction
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11.4 Slew Rate Selection
The slew rate selection feature allows the device to have
control over the slew rate selection on the required I/O
pin which supports this feature. For this purpose, for
each I/O port, there are two registers: SR1x and SR0x,
which configure the selection of the slew rate. The
register outputs are directly connected to the associated
I/O pins, which support the slew rate selection function.
The SR1x register specifies the MSb and the SR0x
register provides the LSb of the 2-bit field that selects the
desired slew rate. For example, slew rate selections for
PORTA are as follows:
EXAMPLE 11-2: SLEW RATE SELECTIONS
FOR PORTA
11.5 Peripheral Pin Select (PPS)
A major challenge in general purpose devices is provid-
ing the largest possible set of peripheral features while
minimizing the conflict of features on I/O pins. The
challenge is even greater on low pin count devices. In
an application where more than one peripheral needs
to be assigned to a single pin, inconvenient work
arounds in application code, or a complete redesign,
may be the only option.
The Peripheral Pin Select (PPS) configuration provides
an alternative to these choices by enabling peripheral
set selection and their placement on a wide range of I/O
pins. By increasing the pinout options available on a par-
ticular device, users can better tailor the device to their
entire application, rather than trimming the application to
fit the device.
The PPS configuration feature operates over a fixed
subset of digital I/O pins. Users may independently
map the input and/or output of most digital peripherals
to any one of these I/O pins. Hardware safeguards are
included that prevent accidental or spurious changes to
the peripheral mapping after it has been established.
11.5.1 AVAILABLE PINS
The number of available pins is dependent on the par-
ticular device and its pin count. Pins that support the
PPS feature include the designation, “RPn” or “RPIn”,
in their full pin designation, where “n” is the remappable
pin number. “RP” is used to designate pins that support
both remappable input and output functions, while
“RPI” indicates pins that support remappable input
functions only.
11.5.2 AVAILABLE PERIPHERALS
The peripherals managed by the PPS are all digital
only peripherals. These include general serial commu-
nications (UART and SPI), general purpose timer clock
inputs, timer related peripherals (input capture and
output compare) and Interrupt-on-Change (IOC)
inputs.
In comparison, some digital only peripheral modules are
never included in the PPS feature, because the
peripheral’s function requires special I/O circuitry on a
specific port and cannot be easily connected to multiple
pins. These modules include I
2
C and the PWM. A similar
requirement excludes all modules with analog inputs,
such as the ADC Converter.
A key difference between the remappable and non-
remappable peripherals is that the remappable
peripherals are not associated with a default I/O pin. The
peripheral must always be assigned to a specific I/O pin
before it can be used. In contrast, the non-remappable
peripherals are always available on a default pin,
assuming that the peripheral is active and not conflicting
with another peripheral.
When a remappable peripheral is active on a given I/O
pin, it takes priority over all the other digital I/O and digital
communication peripherals associated with the pin. Pri-
ority is given regardless of the type of peripheral that is
mapped. Remappable peripherals never take priority
over any analog functions associated with the pin.
11.5.3 CONTROLLING PERIPHERAL PIN
SELECT
The PPS features are controlled through two sets of
SFRs: one to map the peripheral inputs and the other
to map the outputs. Because they are separately con-
trolled, a particular peripheral’s input and output (if the
peripheral has both) can be placed on any selectable
function pin without constraint.
The association of a peripheral to a peripheral-selectable
pin is handled in two different ways, depending on
whether an input or output is being mapped.
11.5.4 INPUT MAPPING
The inputs of the PPS options are mapped on the basis
of the peripheral. That is, a control register associated
with a peripheral dictates the pin it will be mapped to. The
RPINRx registers are used to configure peripheral input
mapping (see Table 11-1 and Register 11-1 through
Register 11-17). Each register contains sets of 8-bit
fields, with each set associated with one of the remap-
pable peripherals. Programming a given peripheral’s bit
field with an appropriate 8-bit value maps the RPn pin
with the corresponding value to that peripheral. For any
given device, the valid range of values for any bit field
corresponds to the maximum number of Peripheral Pin
Selects supported by the device.
SR1Ax, SR0Ax = 00 = Fastest Slew r ate
SR1Ax, SR0Ax = 01 = 4x slow er Slew rate
SR1Ax, SR0Ax = 10 = 8x slow er Slew rate
SR1Ax, SR0Ax = 11 = 16x slo wer Sle w rate
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For example, Figure 11-2 shows the remappable pin
selection for the U1RX input.
FIGURE 11-2:
REMAPP ABLE INPUT FOR
U1RX
11.5.4.1 Virtual Connections
dsPIC33EVXXXGM00X/10X family devices support
virtual (internal) connections to the output of the
op amp/comparator module (see Figure 25-1 in
Secti on 25.0 “Op A mp /Com parator M odul e”).
These devices provide six virtual output pins
(RPV0-RPV5) that correspond to the outputs of six
peripheral pin output remapper blocks (RP176-RP181).
The six virtual remapper outputs (RP176-RP181) are
not connected to actual pins. The six virtual pins may
be read by any of the input remappers as inputs,
RPI176-RPI181. These virtual pins can be used to
connect the internal peripherals, whose signals are of
significant use to the other peripherals, but these
output signals are not present on the device pin.
Virtual connections provide a simple way of inter-
peripheral connection without utilizing a physical pin.
For example, by setting the FLT1R<7:0> bits of the
RPINR12 register to the value of ‘b0000001’, the
output of the analog comparator, C1OUT, will be
connected to the PWM Fault 1 input, which allows the
analog comparator to trigger PWM Faults without the
use of an actual physical pin on the device.
RP0
RP1
RP3
0
1
2
U1RX Input
U1RXR<6:0>
to Peripheral
RPn
n
Note:
For input only, PPS functionality does not
have priority over TRISx settings. There-
fore, when configuring an RPn pin for input,
the corresponding bit in the TRISx register
must also be configured for input (set to ‘
1
’).
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TABLE 11-1: SELECTABLE INPUT SOURCES (MAPS INPUT TO FUNCTION)
Input Name
(1)
Function Name Register Configuration Bits
External Interrupt 1 INT1 RPINR0 INT1R<7:0>
External Interrupt 2 INT2 RPINR1 INT2R<7:0>
Timer2 External Clock T2CK RPINR3 T2CKR<7:0>
Input Capture 1 IC1 RPINR7 IC1R<7:0>
Input Capture 2 IC2 RPINR7 IC2R<7:0>
Input Capture 3 IC3 RPINR8 IC3R<7:0>
Input Capture 4 IC4 RPINR8 IC4R<7:0>
Output Compare Fault A OCFA RPINR11 OCFAR<7:0>
PWM Fault 1 FLT1 RPINR12 FLT1R<7:0>
PWM Fault 2 FLT2 RPINR12 FLT2R<7:0>
UART1 Receive U1RX RPINR18 U1RXR<7:0>
UART2 Receive U2RX RPINR19 U2RXR<7:0>
SPI2 Data Input SDI2 RPINR22 SDI2R<7:0>
SPI2 Clock Input SCK2 RPINR22 SCK2R<7:0>
SPI2 Slave Select SS2 RPINR23 SS2R<7:0>
CAN1 Receive C1RX RPINR26 C1RXR<7:0>
PWM Sync Input 1 SYNCI1 RPINR37 SYNCI1R<7:0>
PWM Dead-Time Compensation 1 DTCMP1 RPINR38 DTCMP1R<7:0>
PWM Dead-Time Compensation 2 DTCMP2 RPINR39 DTCMP2R<7:0>
PWM Dead-Time Compensation 3 DTCMP3 RPINR39 DTCMP3R<7:0>
SENT1 Input SENT1R RPINR44 SENT1R<7:0>
SENT2 Input SENT2R RPINR45 SENT2R<7:0>
Note 1: Unless otherwise noted, all inputs use the Schmitt Trigger input buffers.
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TABLE 11-2: INPUT PIN SELECTION FOR SELECTABLE INPUT SOURCES
Peripheral Pin
Select Input
Register Value
Input/
Output Pin Assignment Peripheral Pin
Select Input
Register Value
Input/
Output Pin Assignment
000 0000 IV
SS
011 0010 IRPI50
000 0001 ICMP1
(1)
011 0011 IRPI51
000 0010 ICMP2
(1)
011 0100 IRPI52
000 0011 ICMP3
(1)
011 0101 IRPI53
000 0100 ICMP4
(1)
011 0110 I/O RP54
000 0101 — — 011 0111 I/O RP55
000 1100 ICMP5
(1)
011 1000 I/O RP56
000 1101 — — 011 1001 I/O RP57
000 1110 — — 011 1010 IRPI58
000 1111 — — 011 1011 — —
001 0000 IRPI16 011 1100 IRPI60
001 0001 IRPI17 011 1101 IRPI61
001 0010 IRPI18 011 1110 — —
001 0011 IRPI19 011 1111 IRPI 63
001 0100 I/O RP20 100 0000 — —
001 0101 — — 100 0001 — —
001 0110 — — 100 0010 — —
001 0111 — — 100 0011 — —
001 1000 IRPI24 100 0100 — —
001 1001 IRPI25 100 0101 I/O RP69
001 1010 — — 100 0110 I/O RP70
001 1011 IRPI27 100 0111 — —
001 1100 IRPI28 100 1000 IRPI72
001 1101 — — 100 1001 — —
001 1110 — — 100 1010 — —
001 1111 — — 100 1011 — —
010 0000 IRPI32 100 1110 — —
010 0001 IRPI33 100 1111 — —
010 0010 IRPI34 101 0010 — —
010 0011 I/O RP35 101 0011 — —
010 0100 I/O RP36 101 0100 — —
010 0101 I/O RP37 010 1001 I/O RP41
010 0110 I/O RP38 010 1010 I/O RP42
010 0111 I/O RP39 010 1011 I/O RP43
010 1000 I/O RP40 101 1000 — —
010 1100 IRPI44 101 1001 — —
010 1101 IRPI45 101 1010 — —
010 1110 IRPI46 101 1011 — —
010 1111 IRPI47 101 1100 — —
011 0000 I/O RP48 101 1101 — —
Legend: Shaded rows indicate the PPS Input register values that are unimplemented.
Note 1: These are virtual pins. See Section 11.5.4.1 “Virtual Connections” for more information on selecting
this pin assignment.
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11.5.5 OUTPUT MAPPING
In contrast to inputs, the outputs of the PPS options are
mapped on the basis of the pin. In this case, a control
register associated with a particular pin dictates the
peripheral output to be mapped. The RPORx registers
are used to control output mapping. Like the RPINRx reg-
isters, each register contains sets of 6-bit fields, with each
set associated with one RPn pin (see Register 11-18 to
Register 11-31). The value of the bit field corresponds to
one of the peripherals and that peripheral’s output is
mapped to the pin (see Table 11-3 and Figure 11-3).
A null output is associated with the Output register
Reset value of ‘0’. This is done to ensure that remap-
pable outputs remain disconnected from all output pins
by default.
FIGURE 11-3: MULTIPLEXING REMAPP ABLE
OUTPU T F OR RPn
011 0001 I/O RP49 101 1110 IRPI94
110 0000 IRPI96 101 1111 IRPI95
110 0001 I/O RP97 111 0011 — —
110 0010 — — 111 0100 — —
110 0011 — — 111 0101 — —
110 0100 — — 111 0110 I/O RP118
110 0101 — — 111 0111 IRPI119
110 0110 — — 111 1000 I/O RP120
110 0111 — — 111 1001 IRPI121
110 1000 — — 111 1010 — —
110 1001 — — 111 1011 — —
110 1010 — — 111 1100 IRPI124
110 1011 — — 111 1101 I/O RP125
101 0101 — — 111 1110 I/O RP126
101 0110 — — 111 1111 I/O RP127
101 0111 — — 10110000 I/O RP176
(1)
110 1100 — — 10110001 I/O RP177
(1)
110 1101 — — 10110010 I/O RP178
(1)
110 1110 — — 10110011 I/O RP179
(1)
110 1111 — — 10110100 I/O RP180
(1)
111 0010 — — 10110101 I/O RP181
(1)
TABLE 11-2: INPUT PIN SELECTION FOR SELECTABLE INPUT SOURCES (CONTINUED)
Peripheral Pin
Select Input
Register Value
Input/
Output Pin Assignment Peripheral Pin
Select Input
Register Value
Input/
Output Pin Assignment
Legend: Shaded rows indicate the PPS Input register values that are unimplemented.
Note 1: These are virtual pins. See Section 11.5.4.1 “Virtual Connections” for more information on selecting
this pin assignment.
RPnR<5:0>
0
49
1
Default
U1TX Output
SDO2 Output 2
REFCLKO Output
Output Data RPn
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DS70005144G-page 152 2013-2018 Microchip Technology Inc.
11.5.5.1 Mapping Limitations
The control schema of the peripheral select pins is not
limited to a small range of fixed peripheral configura-
tions. There are no mutual or hardware-enforced
lockouts between any of the peripheral mapping SFRs.
Literally any combination of peripheral mappings
across any or all of the RPn pins is possible. This
includes both many-to-one, and one-to-many map-
pings of peripheral inputs and outputs to pins. While
such mappings may be technically possible from a con-
figuration point of view, they may not be supportable
from an electrical point of view.
TABLE 1 1-3: OUTPUT SELECTION FOR REMAPPABLE PINS (RPn)
Function RPnR<5:0> Output Name
Default Port 000000 RPn tied to Default Pin
U1TX 000001 RPn tied to UART1 Transmit
U2TX 000011 RPn tied to UART2 Transmit
SDO2 001000 RPn tied to SPI2 Data Output
SCK2 001001 RPn tied to SPI2 Clock Output
SS2 001010 RPn tied to SPI2 Slave Select
C1TX 001110 RPn tied to CAN1 Transmit
OC1 010000 RPn tied to Output Compare 1 Output
OC2 010001 RPn tied to Output Compare 2 Output
OC3 010010 RPn tied to Output Compare 3 Output
OC4 010011 RPn tied to Output Compare 4 Output
C1OUT 011000 RPn tied to Comparator Output 1
C2OUT 011001 RPn tied to Comparator Output 2
C3OUT 011010 RPn tied to Comparator Output 3
SYNCO1 101101 RPn tied to PWM Primary Time Base Sync Output
REFCLKO 110001 RPn tied to Reference Clock Output
C4OUT 110010 RPn tied to Comparator Output 4
C5OUT 110011 RPn tied to Comparator Output 5
SENT1 111001 RPn tied to SENT Out 1
SENT2 111010 RPn tied to SENT Out 2
2013-2018 Microchip Technology Inc. DS70005144G-page 153
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11.6 High-Voltage Detect (HVD)
dsPIC33EVXXXGM00X/10X devices contain High-
Voltage Detection (HVD) which monitors the V
CAP
voltage. The HVD is used to monitor the V
CAP
supply
voltage to ensure that an external connection does not
raise the value above a safe level (~2.4V). If high core
voltage is detected, all I/Os are disabled and put in a tri-
state condition. The device remains in this I/O tri-state
condition as long as the high-voltage condition is
present.
11.7 I/O Helpful Tips
1. In some cases, certain pins, as defined in
Table 30-10 under “Injection Current”, have
internal protection diodes to V
DD
and V
SS
. The
term, “Injection Current”, is also referred to as
“Clamp Current”. On designated pins with suffi-
cient external current-limiting precautions by the
user, I/O pin input voltages are allowed to be
greater or less than the data sheet absolute
maximum ratings, with respect to the V
SS
and
V
DD
supplies. Note that when the user applica-
tion forward biases either of the high or low side
internal input clamp diodes that the resulting
current being injected into the device, that is
clamped internally by the V
DD
and V
SS
power
rails, may affect the ADC accuracy by four to six
counts.
2. I/O pins that are shared with any analog input pin
(i.e., ANx) are always analog pins by default after
any Reset. Consequently, configuring a pin as an
analog input pin automatically disables the digital
input pin buffer and any attempt to read the digital
input level by reading PORTx or LATx will always
return a ‘0’, regardless of the digital logic level on
the pin. To use a pin as a digital I/O pin on a
shared ANx pin, the user application needs to
configure the Analog Pin Configuration registers
in the I/O ports module (i.e., ANSELx) by setting
the appropriate bit that corresponds to that I/O
port pin to a ‘0’.
3. Most I/O pins have multiple functions. Referring
to the device pin diagrams in this data sheet, the
priorities of the functions allocated to any pins
are indicated by reading the pin name, from left-
to-right. The left most function name takes
precedence over any function to its right in the
naming convention; for example, AN16/T2CK/
T7CK/RC1. This indicates that AN16 is the high-
est priority in this example and will supersede all
other functions to its right in the list. Those other
functions to its right, even if enabled, would not
work as long as any other function to its left was
enabled. This rule applies to all of the functions
listed for a given pin.
4. Each pin has an internal weak pull-up resistor
and pull-down resistor that can be configured
using the CNPUx and CNPDx registers, respec-
tively. These resistors eliminate the need for
external resistors in certain applications. The
internal pull-up is up to ~(V
DD
– 0.8), not V
DD
.
This value is still above the minimum V
IH
of
CMOS and TTL devices.
5. When driving LEDs directly, the I/O pin can
source or sink more current than what is
specified in the V
OH
/I
OH
and V
OL
/I
OL
DC charac-
teristic specifications. The respective I
OH
and
I
OL
current rating only applies to maintaining the
corresponding output at or above the V
OH
, and
at or below the V
OL
levels. However, for LEDs,
unlike digital inputs of an externally connected
device, they are not governed by the same min-
imum V
IH
/V
IL
levels. An I/O pin output can safely
sink or source any current less than that listed in
the absolute maximum rating section of this data
sheet. For example:
V
OH
= 4.4V at I
OH
= -8 mA and V
DD
= 5V
The maximum output current sourced by any
8 mA I/O pin = 12 mA.
LED source current, <12 mA, is technically
permitted. For more information, refer to the V
OH
/
I
OH
specifications in Section 30.0 “Electrical
Characteristics”.
Note: Although it is not possible to use a digital
input pin when its analog function is
enabled, it is possible to use the digital I/O
output function, TRISx = 0x0, while the
analog function is also enabled. However,
this is not recommended, particularly if the
analog input is connected to an external
analog voltage source, which would
create signal contention between the
analog signal and the output pin driver.
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6. The PPS pin mapping rules are as follows:
• Only one “output” function can be active on a
given pin at any time, regardless if it is a
dedicated or remappable function (one pin,
one output).
• It is possible to assign a “remappable output”
function to multiple pins and externally short
or tie them together for increased current
drive.
• If any “dedicated output” function is enabled
on a pin, it will take precedence over any
remappable “output” function.
• If any “dedicated digital” (input or output)
function is enabled on a pin, any number of
“input” remappable functions can be mapped
to the same pin.
• If any “dedicated analog” function(s) are
enabled on a given pin, “digital input(s)” of
any kind will all be disabled, although a single
“digital output”, at the user’s cautionary dis-
cretion, can be enabled and active as long as
there is no signal contention with an external
analog input signal. For example, it is
possible for the ADC to convert the digital
output logic level, or to toggle a digital output
on a comparator or ADC input provided there
is no external analog input, such as for a
built-in self-test.
• Any number of “input” remappable functions
can be mapped to the same pin(s) at the
same time, including to any pin with a single
output from either a dedicated or remappable
“output”.
• The TRISx registers control only the digital
I/O output buffer. Any other dedicated or
remappable active “output” will automatically
override the TRISx setting. The TRISx regis-
ter does not control the digital logic “input”
buffer. Remappable digital “inputs” do not
automatically override TRISx settings, which
means that the TRISx bit must be set to input
for pins with only remappable input
function(s) assigned
• All analog pins are enabled by default after
any Reset and the corresponding digital input
buffer on the pin is disabled. Only the Analog
Pin Select registers control the digital input
buffer, not the TRISx register. The user must
disable the analog function on a pin using the
Analog Pin Select registers in order to use
any “digital input(s)” on a corresponding pin;
no exceptions.
2013-2018 Microchip Technology Inc. DS70005144G-page 155
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11.8 Peripheral Pin Select Registers
REGISTER 11-1: RPINR0: PERIPHERAL PIN SELECT INPUT REGISTER 0
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
INT1R<7:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 INT1R<7:0>: Assign External Interrupt 1 (INT1) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
bit 7-0 Unimplemented: Read as ‘0’
REGISTER 11-2: RPINR1: PERIPHERAL PIN SELECT INPUT REGISTER 1
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
INT2R<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 INT2R<7:0>: Assign External Interrupt 2 (INT2) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
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REGISTER 11-3: RPINR3: PERIPHERAL PIN SELECT INPUT REGISTER 3
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
T2CKR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 T2CKR<7:0>: Assign Timer2 External Clock (T2CK) to the Corresponding RPn pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
2013-2018 Microchip Technology Inc. DS70005144G-page 157
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REGISTER 11-4: RPINR7: PERIPHERAL PIN SELECT INPUT REGISTER 7
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IC2R7 IC2R6 IC2R5 IC2R4 IC2R3 IC2R2 IC2R1 IC2R0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IC1R7 IC1R6 IC1R5 IC1R4 IC1R3 IC1R2 IC1R1 IC1R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 IC2R<7:0>: Assign Input Capture 2 (IC2) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
bit 7-0 IC1R<7:0>: Assign Input Capture 1 (IC1) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
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REGISTER 11-5: RPINR8: PERIPHERAL PIN SELECT INPUT REGISTER 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IC4R7 IC4R6 IC4R5 IC4R4 IC4R3 IC4R2 IC4R1 IC4R0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
IC3R7 IC3R6 IC3R5 IC3R4 IC3R3 IC3R2 IC3R1 IC3R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 IC4R<7:0>: Assign Input Capture 4 (IC4) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
bit 7-0 IC3R<7:0>: Assign Input Capture 3 (IC3) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
2013-2018 Microchip Technology Inc. DS70005144G-page 159
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REGISTER 11-6: RPINR11: PERIPHERAL PIN SELECT INPUT REGISTER 11
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
OCFAR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 OCFAR<7:0>: Assign Output Compare Fault A (OCFA) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
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REGISTER 11-7: RPINR12: PERIPHE RAL PIN SELECT INPUT REGISTER 12
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
FLT2R7 FLT2R6 FLT2R5 FLT2R4 FLT2R3 FLT2R2 FLT2R1 FLT2R0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
FLT1R7 FLT1R6 FLT1R5 FLT1R4 FLT1R3 FLT1R2 FLT1R1 FLT1R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 FLT2R<7:0>: Assign PWM Fault 2 (FLT2) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
bit 7-0 FLT1R<7:0>: Assign PWM Fault 1 (FLT1) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
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REGISTER 11-8: RPINR18: PERIP HERAL PI N SELECT INPUT R EGISTER 18
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
U1RXR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 U1RXR<7:0>: Assign UART1 Receive (U1RX) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
REGISTER 11-9: RPINR19: PERIP HERAL PI N SELECT INPUT R EGISTER 19
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
U2RXR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 Unimplemented: Read as ‘0’
bit 7-0 U2RXR<7:0>: Assign UART2 Receive (U2RX) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
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REGISTER 11-10: RPINR22: PERIPHERAL PI N SELEC T INPUT REGISTER 22
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SCK2R7 SCK2R6 SCK2R5 SCK2R4 SCK2R3 SCK2R2 SCK2R1 SCK2R0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SDI2R SDI2R6 SDI2R5 SDI2R4 SDI2R3 SDI2R2 SDI2R1 SDI2R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
SCK2R<7 :0>:
Assign SPI2 Clock Input (SCK2) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
bit 7-0
SDI2R<7:0>:
Assign SPI2 Data Input (SDI2) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
2013-2018 Microchip Technology Inc. DS70005144G-page 163
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REGISTER 11-11: RPINR23: PERIP HERAL PIN SELECT INPUT REGISTER 23
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SS2R<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Unimplemented:
Read as ‘0’
bit 7-0
SS2R<7:0>:
Assign SPI2 Slave Select (SS2) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
REGISTER 11-12: RPINR26: PERIPHERAL PI N SELEC T INPUT REGISTER 26
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
C1RXR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Unimplemented:
Read as ‘0’
bit 7-0
C1RXR<7:0>:
Assign CAN1 RX Input (C1RX) to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
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REGISTER 11-13: RPINR37: PERIPHERAL PI N SELEC T INPUT REGISTER 37
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SYNCI1R<7:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
SYNCI1R<7:0>:
Assign PWM Synchronization Input 1 to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
bit 7-0
Unimplemented:
Read as ‘0’
REGISTER 11-14: RPINR38: PERIPHERAL PI N SELEC T INPUT REGISTER 38
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DTCMP1R<7:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
DTCMP1R<7:0>:
Assign PWM Dead-Time Compensation Input 1 to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
bit 7-0
Unimplemented:
Read as ‘0’
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REGISTER 11-15: RPINR39: PERIPHERAL PI N SELEC T INPUT REGISTER 39
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DTCMP3R7 DTCMP3R6 DTCMP3R5 DTCMP3R4 DTCMP3R3 DTCMP3R2 DTCMP3R1 DTCMP3R0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DTCMP2R7 DTCMP2R6 DTCMP2R5 DTCMP2R4 DTCMP2R3 DTCMP2R2 DTCMP2R1 DTCMP2R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
DTCMP3R<7:0>:
Assign PWM Dead-Time Compensation Input 3 to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
bit 7-0
DTCMP2R<7:0>:
Assign PWM Dead-Time Compensation Input 2 to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
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REGISTER 11-16: RPINR44: PERIPHERAL PI N SELEC T INPUT REGISTER 44
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SENT1R<7:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
SENT1R<7:0>:
Assign SENT Module Input 1 to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000 = Input tied to V
SS
bit 7-0
Unimplemented:
Read as ‘0’
REGISTER 11-17: RPINR45: PERIPHERAL PI N SELEC T INPUT REGISTER 45
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SENT2R<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Unimplemented:
Read as ‘0’
bit 7-0
SENT2R<7:0>:
Assign SENT Module Input 2 to the Corresponding RPn Pin bits
(see Table 11-2 for input pin selection numbers)
10110101 = Input tied to RPI181
•
•
•
00000001 = Input tied to CMP1
00000000= Input tied to V
SS
2013-2018 Microchip Technology Inc. DS70005144G-page 167
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 11-18: RPOR0: PERIPHERAL PIN SELECT OUTPUT REGISTER 0
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP35R5 RP35R4 RP35R3 RP35R2 RP35R1 RP35R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP20R5 RP20R4 RP20R3 RP20R2 RP20R1 RP20R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP35R<5:0>:
Peripheral Output Function is Assigned to RP35 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP20R<5:0>:
Peripheral Output Function is Assigned to RP20 Output Pin bits
(see Table 11-3 for peripheral function numbers)
REGISTER 11-19: RPOR1: PERIPHERAL PIN SELECT OUTPUT REGISTER 1
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP37R5 RP37R4 RP37R3 RP37R2 RP37R1 RP37R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP36R5 RP36R4 RP36R3 RP36R2 RP36R1 RP36R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP37R<5:0>:
Peripheral Output Function is Assigned to RP37 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP36R<5:0>:
Peripheral Output Function is Assigned to RP36 Output Pin bits
(see Table 11-3 for peripheral function numbers)
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 168 2013-2018 Microchip Technology Inc.
REGISTER 11-20: RPOR2: PERIPHERAL PIN SELECT OUTPUT REGISTER 2
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP39R5 RP39R4 RP39R3 RP39R2 RP39R1 RP39R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP38R5 RP38R4 RP38R3 RP38R2 RP38R1 RP38R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP39R<5:0>:
Peripheral Output Function is Assigned to RP39 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP38R<5:0>:
Peripheral Output Function is Assigned to RP38 Output Pin bits
(see Table 11-3 for peripheral function numbers)
REGISTER 11-21: RPOR3: PERIPHERAL PIN SELECT OUTPUT REGISTER 3
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP41R5 RP41R4 RP41R3 RP41R2 RP41R1 RP41R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP40R5 RP40R4 RP40R3 RP40R2 RP40R1 RP40R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP41R<5:0>:
Peripheral Output Function is Assigned to RP41 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP40R<5:0>:
Peripheral Output Function is Assigned to RP40 Output Pin bits
(see Table 11-3 for peripheral function numbers)
2013-2018 Microchip Technology Inc. DS70005144G-page 169
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REGISTER 11-22: RPOR4: PERIPHERAL PIN SELECT OUTPUT REGISTER 4
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP43R5 RP43R4 RP43R3 RP43R2 RP43R1 RP43R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP42R5 RP42R4 RP42R3 RP42R2 RP42R1 RP42R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP43R<5:0>:
Peripheral Output Function is Assigned to RP43 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP42R<5:0>:
Peripheral Output Function is Assigned to RP42 Output Pin bits
(see Table 11-3 for peripheral function numbers)
REGISTER 11-23: RPOR5: PERIPHERAL PIN SELECT OUTPUT REGISTER 5
(1)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP49R5 RP49R4 RP49R3 RP49R2 RP49R1 RP49R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP48R5 RP48R4 RP48R3 RP48R2 RP48R1 RP48R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP49R<5:0>:
Peripheral Output Function is Assigned to RP49 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP48R<5:0>:
Peripheral Output Function is Assigned to RP48 Output Pin bits
(see Table 11-3 for peripheral function numbers)
Note 1:
This register is present in dsPIC33EVXXXGM004/104/006/106 devices only.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 170 2013-2018 Microchip Technology Inc.
REGISTER 11-24: RPOR6: PERIPHERAL PIN SELECT OUTPUT REGISTER 6
(1)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP55R5 RP55R4 RP55R3 RP55R2 RP55R1 RP55R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP54R5 RP54R4 RP54R3 RP54R2 RP54R1 RP54R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP55R<5:0>:
Peripheral Output Function is Assigned to RP55 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP54R<5:0>:
Peripheral Output Function is Assigned to RP54 Output Pin bits
(see Table 11-3 for peripheral function numbers)
Note 1:
This register is present in dsPIC33EVXXXGM004/104/006/106 devices only
REGISTER 11-25: RPOR7: PERIPHERAL PIN SELECT OUTPUT REGISTER 7
(1)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP57R5 RP57R4 RP57R3 RP57R2 RP57R1 RP57R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP56R5 RP56R4 RP56R3 RP56R2 RP56R1 RP56R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP57R<5:0>:
Peripheral Output Function is Assigned to RP57 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP56R<5:0>:
Peripheral Output Function is Assigned to RP56 Output Pin bits
(see Table 11-3 for peripheral function numbers)
Note 1:
This register is present in dsPIC33EVXXXGM004/104/006/106 devices only.
2013-2018 Microchip Technology Inc. DS70005144G-page 171
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REGISTER 11-26: RPOR8: PERIPHERAL PIN SELECT OUTPUT REGISTER 8
(1)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP70R5 RP70R4 RP70R3 RP70R2 RP70R1 RP70R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP69R5 RP69R4 RP69R3 RP69R2 RP69R1 RP69R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP70R<5:0>:
Peripheral Output Function is Assigned to RP70 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP69R<5:0>:
Peripheral Output Function is Assigned to RP69 Output Pin bits
(see Table 11-3 for peripheral function numbers)
Note 1:
This register is present in dsPIC33EVXXXGM004/104/006/106 devices only.
REGISTER 11-27: RPOR9: PERIPHERAL PIN SELECT OUTPUT REGISTER 9
(1)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP118R5 RP118R4 RP118R3 RP118R2 RP118R1 RP118R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP97R5 RP97R4 RP97R3 RP97R2 RP97R1 RP97R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP118R<5:0>:
Peripheral Output Function is Assigned to RP118 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP97R<5:0>:
Peripheral Output Function is Assigned to RP97 Output Pin bits
(see Table 11-3 for peripheral function numbers)
Note 1:
This register is present in dsPIC33EVXXXGM004/106 devices only.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 172 2013-2018 Microchip Technology Inc.
REGISTER 11-28: RPOR10: PERIPHERAL PIN SELECT OUTPUT REGISTER 10
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP176R5 RP176R4 RP176R3 RP176R2 RP176R1 RP176R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP120R5
(1)
RP120R4
(1)
RP120R3
(1)
RP120R2
(1)
RP120R1
(1)
RP120R0
(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP176R<5:0>:
Peripheral Output Function is Assigned to RP176 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP120R<5:0>:
Peripheral Output Function is Assigned to RP120 Output Pin bits
(1)
(see Table 11-3 for peripheral function numbers)
Note 1:
RP120R<5:0> is present in dsPIC33EVXXXGM006/106 devices only.
REGISTER 11-29: RPOR11: PERIPHERAL PIN SELECT OUTPUT REGISTER 11
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP178R5 RP178R4 RP178R3 RP178R2 RP178R1 RP178R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP177R5 RP177R4 RP177R3 RP177R2 RP177R1 RP177R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP178R<5:0>:
Peripheral Output Function is Assigned to RP178 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP177R<5:0>:
Peripheral Output Function is Assigned to RP177 Output Pin bits
(see Table 11-3 for peripheral function numbers)
2013-2018 Microchip Technology Inc. DS70005144G-page 173
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REGISTER 11-30: RPOR12: PERIPHERAL PIN SELECT OUTPUT REGISTER 12
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP180R5 RP180R4 RP180R3 RP180R2 RP180R1 RP180R0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP179R5 RP179R4 RP179R3 RP179R2 RP179R1 RP179R0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
RP180R<5:0>:
Peripheral Output Function is Assigned to RP180 Output Pin bits
(see Table 11-3 for peripheral function numbers)
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
RP179R<5:0>:
Peripheral Output Function is Assigned to RP179 Output Pin bits
(see Table 11-3 for peripheral function numbers)
REGISTER 11-31: RPOR13: PERIPHERAL PIN SELECT OUTPUT REGISTER 13
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— RP181R<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-6
Unimplemented:
Read as ‘0’
bit 5-0
RP181R<5:0>:
Peripheral Output Function is Assigned to RP181 Output Pin bits
(see Table 11-3 for peripheral function numbers)
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 174 2013-2018 Microchip Technology Inc.
NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 175
dsPIC33EVXXXGM00X/10X FAMILY
12.0 TIMER1
The Timer1 module is a 16-bit timer that can operate as
a free-running, interval timer/counter.
The Timer1 module has the following unique features
over other timers:
• Can be Operated in Asynchronous Counter mode
from an External Clock Source
• The Timer1 External Clock Input (T1CK) can
Optionally be Synchronized to the Internal Device
Clock and the Clock Synchronization is
Performed after the Prescaler
A block diagram of Timer1 is shown in Figure 12-1.
The Timer1 module can operate in one of the following
modes:
• Timer mode
• Gated Timer mode
• Synchronous Counter mode
• Asynchronous Counter mode
In Timer and Gated Timer modes, the input clock is
derived from the internal instruction cycle clock (F
CY
).
In Synchronous and Asynchronous Counter modes,
the input clock is derived from the external clock input
at the T1CK pin.
The Timer modes are determined by the following bits:
• Timer Clock Source Control bit (TCS): T1CON<1>
• Timer Synchronization Control bit (TSYNC):
T1CON<2>
• Timer Gate Control bit (TGATE): T1CON<6>
Timer control bit settings for different operating modes
are given in Table 12-1.
TABLE 12-1: TIMER MODE SETTINGS
FIGURE 12-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM
Note 1:
This data sheet summarizes the features of
the dsPIC33EVXXXGM00X/10X family of
devices. It is not intended to be a
comprehensive reference source. To com-
plement the information in this data sheet,
refer to
“Timers”
(DS70362) in the
“dsPIC33/PIC24 Family Reference Man-
ual”, which is available from the Microchip
web site (www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
Mode TCS TGATE TSYNC
Timer 00x
Gated Timer 01x
Synchronous
Counter
1x1
Asynchronous
Counter
1x0
TGATE
TCS
00
10
x1
TGATE
Set T1IF Flag
0
1
TSYNC
1
0
Sync Equal
Reset
T1CK Prescaler
(/n)
TCKPS<1:0>
Gate
Sync
F
P(1)
Falling Edge
Detect
TCKPS<1:0>
Note 1:
F
P
is the peripheral clock.
Latch
Data
CLK
T1CLK
CTMU Edge
Control Logic
TMR1
Comparator
Prescaler
(/n)
PR1
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 176 2013-2018 Microchip Technology Inc.
12.1 Timer1 Control Register
REGISTER 12-1: T1CON: TIMER1 CONTROL REGISTER
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
TON
(1)
—TSIDL— — — — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 U-0
— TGATE TCKPS1 TCKPS0 — TSYNC
(1)
TCS
(1)
—
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
TON:
Timer1 On bit
(1)
1 = Starts 16-bit Timer1
0 = Stops 16-bit Timer1
bit 14
Unimplemented:
Read as ‘0’
bit 13
TSIDL:
Timer1 Stop in Idle Mode bit
1 = Discontinues module operation when the device enters Idle mode
0 = Continues module operation in Idle mode
bit 12-7
Unimplemented:
Read as ‘0’
bit 6
TGATE:
Timer1 Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation is enabled
0 = Gated time accumulation is disabled
bit 5-4
TCKPS<1:0>:
Timer1 Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3
Unimplemented:
Read as ‘0’
bit 2
TSYNC:
Timer1 External Clock Input Synchronization Select bit
(1)
When TCS = 1:
1 = External clock input is synchronized
0 = External clock input is not synchronized
When TCS = 0:
This bit is ignored.
bit 1
TCS:
Timer1 Clock Source Select bit
(1)
1 = External clock is from pin, T1CK (on the rising edge)
0 = Internal clock (F
P
)
bit 0
Unimplemented:
Read as ‘0’
Note 1:
When Timer1 is enabled in External Synchronous Counter mode (TCS = 1, TSYNC = 1, TON = 1), any
attempts by user software to write to the TMR1 register are ignored.
2013-2018 Microchip Technology Inc. DS70005144G-page 177
dsPIC33EVXXXGM00X/10X FAMILY
13.0 TIMER2/3 AND TIMER4/5
These modules are 32-bit timers, which can also be
configured as four independent, 16-bit timers with
selectable operating modes.
As a 32-bit timer, Timer2/3 and Timer4/5 operate in the
following three modes:
• Two Independent 16-Bit Timers (e.g., Timer2 and
Timer3) with all 16-Bit Operating modes (except
Asynchronous Counter mode)
• Single 32-Bit Timer
• Single 32-Bit Synchronous Counter
They also support these features:
• Timer Gate Operation
• Selectable Prescaler Settings
• Timer Operation during Idle and Sleep modes
• Interrupt on a 32-Bit Period Register Match
• Time Base for Input Capture and Output Compare
Modules
• ADC1 Event Trigger (Timer2/3 only)
Individually, all four of the 16-bit timers can function as
synchronous timers or counters. They also offer the
features listed previously, except for the event trigger;
this is implemented only with Timer2/3. The operating
modes and enabled features are determined by setting
the appropriate bit(s) in the T2CON, T3CON, T4CON
and T5CON registers. T2CON and T4CON are shown
in generic form in Register 13-1. The T3CON and
T5CON registers are shown in Register 13-2.
For 32-bit timer/counter operation, Timer2 and Timer4
are the least significant word (lsw). Timer3 and Timer5
are the most significant word (msw) of the 32-bit timers.
Block diagrams for the Type B and Type C timers are
shown in Figure 13-1 and Figure 13-2, respectively.
A block diagram for an example 32-bit timer pair
(Timer2/3 and Timer4/5) is shown in Figure 13-3.
Note 1:
This data sheet summarizes the features of
the dsPIC33EVXXXGM00X/10X family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to
“Timers”
(DS70362) in the
“dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
Note:
For 32-bit operation, the T3CON and
T5CON control bits are ignored. Only the
T2CON and T4CON control bits are used
for setup and control. Timer2 and Timer4
clock and gate inputs are utilized for the
32-bit timer modules, but an interrupt is
generated with the Timer3 and Timer5
interrupt flags.
Note:
Only Timer2, Timer3, Timer4 and Timer5
can trigger a DMA data transfer.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 178 2013-2018 Microchip Technology Inc.
FIGURE 13-1: TYPE B TIMER BLOCK DIAGRAM (x = 2 AND 4)
FIGURE 13-2: TYPE C TIMER BLOCK DIAGRAM (x = 3 AND 5)
Note 1:
F
P
is the peripheral clock.
TGATE
TCS
00
10
x1
TGATE
Set TxIF Flag
0
1
Equal
Reset
TxCK
TCKPS<1:0>
Gate
Sync
F
P(1)
Falling Edge
Detect
TCKPS<1:0> Latch
Data
CLK
TxCLK
TMRx
Comparator
Prescaler
(/n)
Prescaler
(/n) Sync
PRx
Note 1:
F
P
is the peripheral clock.
2:
The ADC trigger is available on TMR3 and TMR5 only.
TGATE
TCS
00
10
x1
TGATE
Set TxIF Flag
0
1
Equal
Reset
TxCK
TCKPS<1:0>
Gate
Sync
F
P
(1)
Falling Edge
Detect
TCKPS<1:0> Latch Data
CLK
TxCLK
TMRx
Comparator
Prescaler
(/n)
Prescaler
(/n) Sync
ADC Start of
Conversion
PRx
Trigger
(2)
2013-2018 Microchip Technology Inc. DS70005144G-page 179
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 13-3: TYPE B/TYPE C TIMER PAIR BLOCK DIAGRAM (32-BIT TIMER)
TGATE
TCS
00
10
x1
Comparator
TGATE
Set TyIF Flag
0
1
Equal
Reset
TxCK
TCKPS<1:0>
F
P(1)
TCKPS<1:0>
Note 1:
F
P
is the peripheral clock.
2:
Timerx is a Type B timer (x = 2 and 4).
3:
Timery is a Type C timer (y = 3 and 5).
4:
The ADC trigger is available only on the TMR3:TMR2 and TMR5:TMR4 32-bit timer pairs.
Latch
Data
CLK
ADC
(4)
PRx
TMRyHLD
Data Bus<15:0>
mswlsw
Prescaler
(/n)
Prescaler
(/n)
Sync
Gate
Sync
Falling Edge
Detect
PRy
TMRx
(2)
TMRy
(3)
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 180 2013-2018 Microchip Technology Inc.
13.1 Timer2/3 and Timer4/5 Control
Registers
REGISTER 13-1: TxCON (T2CON AND T4CON) CONTROL REGISTER
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
TON —TSIDL— — — — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 U-0
— TGATE TCKPS1 TCKPS0 T32 —TCS
(1)
—
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
TON:
Timerx On bit
When T32 = 1:
1 = Starts 32-bit Timerx/y
0 = Stops 32-bit Timerx/y
When T32 = 0:
1 = Starts 16-bit Timerx
0 = Stops 16-bit Timerx
bit 14
Unimplemented:
Read as ‘0’
bit 13
TSIDL:
Timerx Stop in Idle Mode bit
1 = Discontinues module operation when the device enters Idle mode
0 = Continues module operation in Idle mode
bit 12-7
Unimplemented:
Read as ‘0’
bit 6
TGATE:
Timerx Gated Time Accumulation Enable bit
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation is enabled
0 = Gated time accumulation is disabled
bit 5-4
TCKPS<1:0>:
Timerx Input Clock Prescale Select bits
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3
T32:
32-Bit Timer Mode Select bit
1 = Timerx and Timery form a single 32-bit timer
0 = Timerx and Timery act as two 16-bit timers
bit 2
Unimplemented:
Read as ‘0’
bit 1
TCS:
Timerx Clock Source Select bit
(1)
1 = External clock is from pin, TxCK (on the rising edge)
0 = Internal clock (F
P
)
bit 0
Unimplemented:
Read as ‘0’
Note 1:
The TxCK pin is not available on all timers. Refer to the
“Pin Diagrams”
section for the available pins.
2013-2018 Microchip Technology Inc. DS70005144G-page 181
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 13-2: TyCON (T3CON AND T5CON) CONTROL REGISTER
R/W-0 U-0 R/W-0 U-0 U-0 U-0 U-0 U-0
TON
(1)
—TSIDL
(2)
— — — — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 U-0
—TGATE
(1)
TCKPS1
(1)
TCKPS0
(1)
——TCS
(1,3)
—
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
TON:
Timery On bit
(1)
1 = Starts 16-bit Timery
0 = Stops 16-bit Timery
bit 14
Unimplemented:
Read as ‘0’
bit 13
TSIDL:
Timery Stop in Idle Mode bit
(2)
1 = Discontinues module operation when the device enters an Idle mode
0 = Continues module operation in an Idle mode
bit 12-7
Unimplemented:
Read as ‘0’
bit 6
TGATE:
Timery Gated Time Accumulation Enable bit
(1)
When TCS = 1:
This bit is ignored.
When TCS = 0:
1 = Gated time accumulation is enabled
0 = Gated time accumulation is disabled
bit 5-4
TCKPS<1:0>:
Timery Input Clock Prescale Select bits
(1)
11 = 1:256
10 = 1:64
01 = 1:8
00 = 1:1
bit 3-2
Unimplemented:
Read as ‘0’
bit 1
TCS:
Timery Clock Source Select bit
(1,3)
1 = External clock is from pin, TyCK (on the rising edge)
0 = Internal clock (F
P
)
bit 0
Unimplemented:
Read as ‘0’
Note 1:
When 32-bit operation is enabled (T2CON<3> = 1), these bits have no effect on Timery operation; all timer
functions are set through TxCON.
2:
When 32-bit timer operation is enabled (T32 = 1) in the Timerx Control register (TxCON<3>), the TSIDL
bit must be cleared to operate the 32-bit timer in Idle mode.
3:
The TyCK pin is not available on all timers. See the
“Pin Diagrams”
section for the available pins.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 182 2013-2018 Microchip Technology Inc.
NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 183
dsPIC33EVXXXGM00X/10X FAMILY
14.0 DEADMAN TIMER (DMT)
The primary function of the Deadman Timer (DMT) is to
reset the processor in the event of a software malfunc-
tion. The DMT, which works on the system clock, is a
free-running instruction fetch timer, which is clocked
whenever an instruction fetch occurs, until a count
match occurs. Instructions are not fetched when the
processor is in Sleep mode.
DMT can be enabled in the Configuration fuse or by
software in the DMTCON register by setting the ON bit.
The DMT consists of a 32-bit counter with a time-out
count match value, as specified by the two 16-bit
Configuration Fuse registers: FDMTCNTL and
FDMTCNTH.
A DMT is typically used in mission-critical, and safety-
critical applications, where any single failure of the
software functionality and sequencing must be
detected.
Figure 14-1 shows a block diagram of the Deadman
Timer module.
FIGURE 14-1: DEADMAN TIMER BLOCK DIAGRAM
Note 1:
This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this
data sheet, refer to
“Deadman Timer
(DMT)”
(DS70005155) in the “dsPIC33/
PIC24 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
32-Bit Counter
System Clock
DMT Event
Instruction Fetched Strobe
(2)
Improper Sequence
(Counter) = DMT Max Count
(1)
Note 1:
DMT Max Count is controlled by the initial value of the FDMTCNTL and FDMTCNTH Configuration registers.
2:
DMT window interval is controlled by the value of the FDMTINTVL and FDMTINTVH Configuration registers.
Flag
DMT Enable
(1)
BAD1
BAD2
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 184 2013-2018 Microchip Technology Inc.
14.1 Deadman Timer Control Regist ers
REGISTER 14-1: DMTCON: DEADMAN TIMER CONTROL REGISTER
R/W-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
ON
(1)
— — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
ON:
DMT Module Enable bit
(1)
1 = Deadman Timer module is enabled
0 = Deadman Timer module is not enabled
bit 14-0
Unimplemented:
Read as ‘0’
Note 1:
This bit has control only when DMTEN = 0 in the FDMT register.
REGISTER 14-2: DMTPRECLR: DEADMAN TIMER PRECLEAR REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STEP1<7:0>
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
STEP1<7:0>:
DMT Preclear Enable bits
01000000 = Enables the Deadman Timer preclear (Step 1)
All Other
Write Patterns = Sets the BAD1 flag; these bits are cleared when a DMT Reset event occurs.
STEP1<7:0> bits are also cleared if the STEP2<7:0> bits are loaded with the correct
value in the correct sequence.
bit 7-0
Unimplemented:
Read as ‘0’
2013-2018 Microchip Technology Inc. DS70005144G-page 185
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 14-3: DMTCLR: DEADMAN TIMER CLEAR REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STEP2<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Unimplemented:
Read as ‘0’
bit 7-0
STEP2<7:0>:
DMT Clear Timer bits
00001000 = Clears STEP1<7:0>, STEP2<7:0> and the Deadman Timer if preceded by the correct
loading of the STEP1<7:0> bits in the correct sequence. The write to these bits may be
verified by reading the DMTCNTL/H register and observing the counter being reset.
All Other
Write Patterns = Sets the BAD2 bit; the value of STEP1<7:0> will remain unchanged and the new
value being written to STEP2<7:0> will be captured. These bits are cleared when a
DMT Reset event occurs.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 186 2013-2018 Microchip Technology Inc.
REGISTER 14-4: DMTSTAT: DEADMAN TIMER STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
HC/R-0 HC/R-0 HC/R-0 U-0 U-0 U-0 U-0 R-0
BAD1 BAD2 DMTEVENT — — — —WINOPN
bit 7 bit 0
Legend:
HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Unimplemented:
Read as ‘0’
bit 7
BAD1:
Deadman Timer Bad STEP1<7:0> Value Detect bit
1 = Incorrect STEP1<7:0> value was detected
0 = Incorrect STEP1<7:0> value was not detected
bit 6
BAD2:
Deadman Timer Bad STEP2<7:0> Value Detect bit
1 = Incorrect STEP2<7:0> value was detected
0 = Incorrect STEP2<7:0> value was not detected
bit 5
DMTEVENT:
Deadman Timer Event bit
1 = Deadman Timer event was detected (counter expired, or bad STEP1<7:0> or STEP2<7:0> value
was entered prior to counter increment)
0 = Deadman Timer event was not detected
bit 4-1
Unimplemented:
Read as ‘0’
bit 0
WINOPN:
Deadman Timer Clear Window bit
1 = Deadman Timer clear window is open
0 = Deadman Timer clear window is not open
2013-2018 Microchip Technology Inc. DS70005144G-page 187
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 14-5: DMTCNTL: DEADMAN TIMER COUNT REGISTER LOW
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
COUNTER<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
COUNTER<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
COUNTER<15:0>:
Read Current Contents of Lower DMT Counter bits
REGISTER 14-6: DMTCNTH: DEADMAN TIMER COUNT REGISTER HIGH
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
COUNTER<31:24>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
COUNTER<23:16>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
COUNTER<31:16>:
Read Current Contents of Higher DMT Counter bits
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 188 2013-2018 Microchip Technology Inc.
REGISTER 14-7: DMTPSCNTL: DMT POST-CONFIGURE COUNT STATUS REGISTER LOW
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PSCNT<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PSCNT<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
PSCNT<15:0>:
Lower DMT Instruction Count Value Configuration Status bits
This is always the value of the FDMTCNTL Configuration register.
REGISTER 14-8: DMTPSCNTH: DMT POST-CONFIGURE COUNT STATUS REGISTER HIGH
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PSCNT<31:24>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PSCNT<23:16>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
PSCNT<31:16>:
Higher DMT Instruction Count Value Configuration Status bits
This is always the value of the FDMTCNTH Configuration register.
2013-2018 Microchip Technology Inc. DS70005144G-page 189
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 14-9: DMTPSINTVL: DMT POST-CONFIGURE INTERVAL STATUS REGISTER LOW
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PSINTV<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PSINTV<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
PSINTV<15:0>:
Lower DMT Window Interval Configuration Status bits
This is always the value of the FDMTINTVL Configuration register.
REGISTER 14-10: DMTPSINTVH: DMT POST-CONFIGURE INTERVAL STATUS REGISTER HIGH
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PSINTV<31:24>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PSINTV<23:16>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
PSINTV<31:16>:
Higher DMT Window Interval Configuration Status bits
This is always the value of the FDMTINTVH Configuration register.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 190 2013-2018 Microchip Technology Inc.
REGISTER 14-11: DMTHOLDREG: DMT HOLD REGISTER
(1)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
UPRCNT<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
UPRCNT<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
UPRCNT<15:0>:
Value of the DMTCNTH register when DMTCNTL and DMTCNTH were Last Read bits
Note 1:
The DMTHOLDREG register is initialized to ‘0’ on Reset, and is only loaded when the DMTCNTL and
DMTCNTH registers are read.
2013-2018 Microchip Technology Inc. DS70005144G-page 191
dsPIC33EVXXXGM00X/10X FAMILY
15.0 INPUT CAPTURE
The input capture module is useful in applications
requiring frequency (period) and pulse measurement.
The dsPIC33EVXXXGM00X/10X family devices support
four input capture channels.
Key features of the input capture module include:
• Hardware-Configurable for 32-Bit Operation in All
Modes by Cascading Two Adjacent modules
• Synchronous and Trigger Modes of Output
Compare Operation, with up to 31 User-Selectable
Trigger/Sync Sources Available
• A Four-Level FIFO Buffer for Capturing and
Holding Timer Values for Several Events
• Configurable Interrupt Generation
• Up to Six Clock Sources Available for Each
Module, Driving a Separate Internal 16-Bit Counter
Figure 15-1 shows a block diagram of the Input capture
module.
FIGURE 15-1: INPUT CAPTURE x MODULE BLOCK DIAGRAM
Note 1:
This data sheet summarizes the features of
the dsPIC33EVXXXGM00X/10X family of
devices. It is not intended to be a
comprehensive reference source. To com-
plement the information in this data sheet,
refer to
“Input Capture with Dedicated
Timer”
(DS70000352) in the “dsPIC33/
PIC24 Family Reference Manual”, which
is available from the Microchip web site
(www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
ICxBUF
4-Level FIFO Buffer
ICx Pin
ICM<2:0>
Set ICxIF
Edge Detect Logic
ICI<1:0>
ICOV, ICBNE
Interrupt
Logic
System Bus
Prescaler
Counter
1:1/4/16
and
Clock Synchronizer
Event and
Trigger and
Sync Logic
Clock
Select
ICx Clock
Sources
Trigger and
Sync Sources
ICTSEL<2:0>
SYNCSEL<4:0>
Trigger
(1)
16
16
16
ICxTMR
Increment
Reset
Note 1:
The trigger/sync source is enabled by default and is set to Timer3 as a source. This timer must be enabled for
proper ICx module operation or the trigger/sync source must be changed to another source option.
CTMU Edge
Control Logic
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 192 2013-2018 Microchip Technology Inc.
15.1 Input Capture Control Regist ers
REGISTER 15-1: ICxCON1: INPUT CAPTURE x CONTROL REGISTER 1
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
—— ICSIDL ICTSEL2 ICTSEL1 ICTSEL0 — —
bit 15 bit 8
U-0 R/W-0 R/W-0 HC/HS/R-0 HC/HS/R-0 R/W-0 R/W-0 R/W-0
— ICI1 ICI0 ICOV ICBNE ICM2 ICM1 ICM0
bit 7 bit 0
Legend:
HC = Hardware Clearable bit HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13
ICSIDL:
Input Capture x Stop in Idle Mode Control bit
1 = Input Capture x will halt in CPU Idle mode
0 = Input Capture x will continue to operate in CPU Idle mode
bit 12-10
ICTSEL<2:0>:
Input Capture x Timer Select bits
111 = Peripheral clock (F
P
) is the clock source of the ICx
110 = Reserved
101 = Reserved
100 = T1CLK is the clock source of the ICx (only the synchronous clock is supported)
011 = T5CLK is the clock source of the ICx
010 = T4CLK is the clock source of the ICx
001 = T2CLK is the clock source of the ICx
000 = T3CLK is the clock source of the ICx
bit 9-7
Unimplemented:
Read as ‘0’
bit 6-5
ICI<1:0>:
Number of Captures per Interrupt Select bits (this field is not used if ICM<2:0> = 001 or 111)
11 = Interrupt on every fourth capture event
10 = Interrupt on every third capture event
01 = Interrupt on every second capture event
00 = Interrupt on every capture event
bit 4
ICOV:
Input Capture x Overflow Status Flag bit (read-only)
1 = Input Capture x buffer overflow has occurred
0 = Input Capture x buffer overflow has not occurred
bit 3
ICBNE:
Input Capture x Buffer Not Empty Status bit (read-only)
1 = Input Capture x buffer is not empty, at least one more capture value can be read
0 = Input Capture x buffer is empty
bit 2-0
ICM<2:0>:
Input Capture x Mode Select bits
111 = Input Capture x functions as an interrupt pin only in CPU Sleep and Idle modes (rising edge
detect only, all other control bits are not applicable)
110 = Unused (module is disabled)
101 = Capture mode, every 16th rising edge (Prescaler Capture mode)
100 = Capture mode, every 4th rising edge (Prescaler Capture mode)
011 = Capture mode, every rising edge (Simple Capture mode)
010 = Capture mode, every falling edge (Simple Capture mode)
001 = Capture mode, every edge, rising and falling (Edge Detect mode (ICI<1:0>) is not used in this
mode)
000 = Input Capture x module is turned off
2013-2018 Microchip Technology Inc. DS70005144G-page 193
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 15-2: ICxCON2: INPUT CAPTURE x CONTROL REGISTER 2
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
— — — — — — —IC32
(1)
bit 15 bit 8
R/W-0 HS/R/W-0 U-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-1
ICTRIG
(2)
TRIGSTAT
(3)
— SYNCSEL4
(4)
SYNCSEL3
(4)
SYNCSEL2
(4)
SYNCSEL1
(4)
SYNCSEL0
(4)
bit 7 bit 0
Legend:
HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-9
Unimplemented:
Read as ‘0’
bit 8
IC32:
Input Capture x 32-Bit Timer Mode Select bit (Cascade mode)
(1)
1 = Odd ICx and even ICx form a single 32-bit input capture module
0 = Cascade module operation is disabled
bit 7
ICTRIG:
Input Capture x Trigger Operation Select bit
(2)
1 = Input source is used to trigger the input capture timer (Trigger mode)
0 = Input source is used to synchronize the input capture timer to the timer of another module
(Synchronization mode)
bit 6
TRIGSTAT:
Timer Trigger Status bit
(3)
1 = ICxTMR has been triggered and is running
0 = ICxTMR has not been triggered and is being held clear
bit 5
Unimplemented:
Read as ‘0’
Note 1:
The IC32 bit in both the odd and even ICx must be set to enable Cascade mode.
2:
The input source is selected by the SYNCSEL<4:0> bits of the ICxCON2 register.
3:
This bit is set by the selected input source (selected by the SYNCSEL<4:0> bits); it can be read, set and
cleared in software.
4:
Do not use the ICx module as its own sync or trigger source.
5:
This option should only be selected as a trigger source and not as a synchronization source.
6:
When the source ICx timer rolls over, then in the next clock cycle, trigger or synchronization occurs.
dsPIC33EVXXXGM00X/10X FAMILY
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bit 4-0
SYNCSEL<4:0>:
Input Source Select for Synchronization and Trigger Operation bits
(4)
11111 = Reserved
11110 = Reserved
11101 = Reserved
11100 = CTMU trigger is the source for the capture timer synchronization
11011 = ADC1 interrupt is the source for the capture timer synchronization
(5)
11010 = Analog Comparator 3 is the source for the capture timer synchronization
(5)
11001 = Analog Comparator 2 is the source for the capture timer synchronization
(5)
11000 = Analog Comparator 1 is the source for the capture timer synchronization
(5)
10111 = Analog Comparator 5 is the source for the capture timer synchronization
(5)
10110 = Analog Comparator 4 is the source for the capture timer synchronization
(5)
10101 = Reserved
10100 = Reserved
10011 = Input Capture 4 interrupt is the source for the capture timer synchronization
10010 = Input Capture 3 interrupt is the source for the capture timer synchronization
10001 = Input Capture 2 interrupt is the source for the capture timer synchronization
10000 = Input Capture 1 interrupt is the source for the capture timer synchronization
01111 = GP Timer5 is the source for the capture timer synchronization
01110 = GP Timer4 is the source for the capture timer synchronization
01101 = GP Timer3 is the source for the capture timer synchronization
01100 = GP Timer2 is the source for the capture timer synchronization
01011 = GP Timer1 is the source for the capture timer synchronization
01010 = Reserved
01001 = Reserved
01000 = Input Capture 4 is the source for the capture timer synchronization
(6)
00111 = Input Capture 3 is the source for the capture timer synchronization
(6)
00110 = Input Capture 2 is the source for the capture timer synchronization
(6)
00101 = Input Capture 1 is the source for the capture timer synchronization
(6)
00100 = Output Compare 4 is the source for the capture timer synchronization
00011 = Output Compare 3 is the source for the capture timer synchronization
00010 = Output Compare 2 is the source for the capture timer synchronization
00001 = Output Compare 1 is the source for the capture timer synchronization
00000 = Reserved
REGISTER 15-2: ICxCON2: INPUT CAPTURE x CONTROL REGISTER 2 (CONTINUED)
Note 1:
The IC32 bit in both the odd and even ICx must be set to enable Cascade mode.
2:
The input source is selected by the SYNCSEL<4:0> bits of the ICxCON2 register.
3:
This bit is set by the selected input source (selected by the SYNCSEL<4:0> bits); it can be read, set and
cleared in software.
4:
Do not use the ICx module as its own sync or trigger source.
5:
This option should only be selected as a trigger source and not as a synchronization source.
6:
When the source ICx timer rolls over, then in the next clock cycle, trigger or synchronization occurs.
2013-2018 Microchip Technology Inc. DS70005144G-page 195
dsPIC33EVXXXGM00X/10X FAMILY
16.0 OUTPUT COMPARE
The dsPIC33EVXXXGM00X/10X family devices
support up to four output compare modules. The output
compare module can select one of eight available clock
sources for its time base. The module compares the
value of the timer with the value of one or two Compare
registers, depending on the operating mode selected.
The state of the output pin changes when the timer
value matches the Compare register value. The output
compare module generates either a single output
pulse, or a sequence of output pulses, by changing the
state of the output pin on the compare match events.
The output compare module can also generate
interrupts on compare match events and trigger DMA
data transfers.
Figure 16-1 shows a block diagram of the output
compare module.
FIGURE 16-1: OUTPUT COMPARE x MODULE BLOCK DIAGRAM
Note 1:
This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to
“Output Compare with
Dedicated Timer”
(DS70005159) in
the “dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
Note:
For more information on OCxR and OCxRS
register restrictions, refer to the
“Output
Compare with Dedicated Timer”
(DS70005159) section in the “dsPIC33/
PIC24 Fa mi ly R efe rence M a nu al ”.
OCxR Buffer
Comparator
OCxTMR
OCxCON1
OCxCON2
OCx Interrupt
OCx Pin
OCxRS Buffer
Comparator
Match
Match
Trigger and
Sync Logic
Clock
Select
Increment
Reset
OCx Clock
Sources
Trigger and
Sync Sources
Reset
Match Event
OCFA
OCxR
OCxRS
Event
Event
Rollover
Rollover/Reset
Rollover/Reset
OCx Synchronization/Trigger Event
SYNCSEL<4:0>
Trigger
(1)
Note 1:
The trigger/sync source is enabled by default and is set to Timer2 as a source. This timer must be enabled for
proper OCx module operation or the trigger/sync source must be changed to another source option.
CTMU Edge
Control Logic
OCx Output and
Fault Logic
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16.1 Output Compare Control Register s
REGISTER 16-1: OCxCON1: OUTPUT COMP ARE x
CONTROL REGISTER 1
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
—— OCSIDL OCTSEL2 OCTSEL1 OCTSEL0 — —
bit 15 bit 8
R/W-0 U-0 U-0 HSC/R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ENFLTA —— OCFLTA TRIGMODE OCM2 OCM1 OCM0
bit 7 bit 0
Legend:
HSC = Hardware Settable/Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13
OCSIDL:
Output Compare x Stop in Idle Mode Control bit
1 = Output Compare x halts in CPU Idle mode
0 = Output Compare x continues to operate in CPU Idle mode
bit 12-10
OCTSEL<2:0>:
Output Compare x Clock Select bits
111 = Peripheral clock (F
P
)
110 = Reserved
101 = Reserved
100 = T1CLK is the clock source of the OCx (only the synchronous clock is supported)
011 = T5CLK is the clock source of the OCx
010 = T4CLK is the clock source of the OCx
001 = T3CLK is the clock source of the OCx
000 = T2CLK is the clock source of the OCx
bit 9-8
Unimplemented:
Read as ‘0’
bit 7
ENFLTA:
Output Compare x Fault A Input Enable bit
1 = Output Compare Fault A (OCFA) input is enabled
0 = Output Compare Fault A (OCFA) input is disabled
bit 6-5
Unimplemented:
Read as ‘0’
bit 4
OCFLTA:
PWM Fault A Condition Status bit
1 = PWM Fault A condition on the OCFA pin has occurred
0 = PWM Fault A condition on the OCFA pin has not occurred
bit 3
TRIGMODE:
Trigger Status Mode Select bit
1 = TRIGSTAT (OCxCON2<6>) is cleared when OCxRS = OCxTMR or in software
0 = TRIGSTAT is cleared only by software
Note 1:
OCxR and OCxRS are double-buffered in PWM mode only.
2013-2018 Microchip Technology Inc. DS70005144G-page 197
dsPIC33EVXXXGM00X/10X FAMILY
bit 2-0
OCM<2:0>:
Output Compare x Mode Select bits
111 = Center-Aligned PWM mode: Output sets high when OCxTMR = OCxR and sets low when
OCxTMR = OCxRS
(1)
110 = Edge-Aligned PWM mode: Output sets high when OCxTMR = 0 and sets low when
OCxTMR = OCxR
(1)
101 = Double Compare Continuous Pulse mode: Initializes OCx pin low, toggles OCx state continuously
on alternate matches of OCxR and OCxRS
100 = Double Compare Single-Shot mode: Initializes OCx pin low, toggles OCx state on matches of
OCxR and OCxRS for one cycle
011 = Single Compare mode: Compare event with OCxR, continuously toggles OCx pin
010 = Single Compare Single-Shot mode: Initializes OCx pin high, compare event with OCxR, forces
OCx pin low
001 = Single Compare Single-Shot mode: Initializes OCx pin low, compare event with OCxR, forces
OCx pin high
000 = Output compare channel is disabled
REGISTER 16-1: OCxCON1: OUTPUT COMP ARE x
CONTROL REGISTER 1 (CONTINUED)
Note 1:
OCxR and OCxRS are double-buffered in PWM mode only.
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REGISTER 16-2: OCxCON2: OUTPUT COMPARE x CONTROL REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0
FLTMD FLTOUT FLTTRIEN OCINV — — —OC32
bit 15 bit 8
R/W-0 HS/R/W-0 R/W-0 R/W-0 R/W-1 R/W-1 R/W-0 R/W-0
OCTRIG TRIGSTAT OCTRIS SYNCSEL4 SYNCSEL3 SYNCSEL2 SYNCSEL1 SYNCSEL0
bit 7 bit 0
Legend:
HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
FLTMD:
Fault Mode Select bit
1 = Fault mode is maintained until the Fault source is removed; the OCFLTA bit is cleared in software
and a new PWM period starts
0 = Fault mode is maintained until the Fault source is removed and a new PWM period starts
bit 14
FLTOUT:
Fault Out bit
1 = PWM output is driven high on a Fault
0 = PWM output is driven low on a Fault
bit 13
FLTTRIEN:
Fault Output State Select bit
1 = OCx pin is tri-stated on a Fault condition
0 = OCx pin I/O state is defined by the FLTOUT bit on a Fault condition
bit 12
OCINV:
Output Compare x Invert bit
1 = OCx output is inverted
0 = OCx output is not inverted
bit 11-9
Unimplemented:
Read as ‘0’
bit 8
OC32:
Cascade Two OCx Modules Enable bit (32-bit operation)
1 = Cascade module operation is enabled
0 = Cascade module operation is disabled
bit 7
OCTRIG:
Output Compare x Trigger/Sync Select bit
1 = Triggers OCx from the source designated by the SYNCSELx bits
0 = Synchronizes OCx with the source designated by the SYNCSELx bits
bit 6
TRIGSTAT:
Timer Trigger Status bit
1 = Timer source has been triggered and is running
0 = Timer source has not been triggered and is being held clear
bit 5
OCTRIS:
Output Compare x Output Pin Direction Select bit
1 = Output Compare x is tri-stated
0 = Output Compare x module drives the OCx pin
Note 1:
Do not use the OCx module as its own synchronization or trigger source.
2:
When the OCy module is turned off, it sends a trigger out signal. If the OCx module uses the OCy module
as a trigger source, the OCy module must be unselected as a trigger source prior to disabling it.
2013-2018 Microchip Technology Inc. DS70005144G-page 199
dsPIC33EVXXXGM00X/10X FAMILY
bit 4-0
SYNCSEL<4:0>:
Trigger/Synchronization Source Selection bits
11111 = OCxRS compare event is used for synchronization
11110 = INT2 is the source for compare timer synchronization
11101 = INT1 is the source for compare timer synchronization
11100 = CTMU Trigger is the source for compare timer synchronization
11011 = ADC1 interrupt is the source for compare timer synchronization
11010 = Analog Comparator 3 is the source for compare timer synchronization
11001 = Analog Comparator 2 is the source for compare timer synchronization
11000 = Analog Comparator 1 is the source for compare timer synchronization
10111 = Analog Comparator 5 is the source for compare timer synchronization
10110 = Analog Comparator 4 is the source for compare timer synchronization
10101 = Capture timer is unsynchronized
10100 = Capture timer is unsynchronized
10011 = Input Capture 4 interrupt is the source for compare timer synchronization
10010 = Input Capture 3 interrupt is the source for compare timer synchronization
10001 = Input Capture 2 interrupt is the source for compare timer synchronization
10000 = Input Capture 1 interrupt is the source for compare timer synchronization
01111 = GP Timer5 is the source for compare timer synchronization
01110 = GP Timer4 is the source for compare timer synchronization
01101 = GP Timer3 is the source for compare timer synchronization
01100 = GP Timer2 is the source for compare timer synchronization
01011 = GP Timer1 is the source for compare timer synchronization
01010 = Compare timer is unsynchronized
01001 = Compare timer is unsynchronized
01000 = Capture timer is unsynchronized
00101 = Compare timer is unsynchronized
00100 = Output Compare 4 is the source for compare timer synchronization
(1,2)
00011 = Output Compare 3 is the source for compare timer synchronization
(1,2)
00010 = Output Compare 2 is the source for compare timer synchronization
(1,2)
00001 = Output Compare 1 is the source for compare timer synchronization
(1,2)
00000 = Compare timer is unsynchronized
REGISTER 16-2: OCxCON2: OUTPUT COMPARE x CONTROL REGISTER 2 (CONTINUED)
Note 1:
Do not use the OCx module as its own synchronization or trigger source.
2:
When the OCy module is turned off, it sends a trigger out signal. If the OCx module uses the OCy module
as a trigger source, the OCy module must be unselected as a trigger source prior to disabling it.
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NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 201
dsPIC33EVXXXGM00X/10X FAMILY
17.0 HIGH-SPEED PWM MODULE
The dsPIC33EVXXXGM00X/10X family devices
support a dedicated Pulse-Width Modulation (PWM)
module with up to six outputs.
The high-speed PWMx module consists of the
following major features:
• Three PWM Generators
• Two PWM Outputs per PWM Generator
• Individual Period and Duty Cycle for each PWM Pair
• Duty Cycle, Dead Time, Phase Shift and
Frequency Resolution of 8.32 ns
• Independent Fault and Current-Limit Inputs for
Six PWM Outputs
• Redundant Output
• Center-Aligned PWM mode
• Output Override Control
• Chop mode (also known as Gated mode)
• Special Event Trigger
• Prescaler for Input Clock
• PWMxL and PWMxH Output Pin Swapping
• Independent PWM Frequency, Duty Cycle and
Phase-Shift Changes for each PWM Generator
• Dead-Time Compensation
• Enhanced Leading-Edge Blanking (LEB)
Functionality
• Frequency Resolution Enhancement
• PWM Capture Functionality
The high-speed PWMx module contains up to three
PWM generators. Each PWM generator provides two
PWM outputs: PWMxH and PWMxL
.
The master time
base generator provides a synchronous signal as a
common time base to synchronize the various PWM
outputs.
The individual PWM outputs are available on
the output pins of the device. The input Fault signals
and current-limit signals, when enabled, can monitor
and protect the system by placing the PWM outputs
into a known “safe” state.
Each PWMx can generate a trigger to the ADC module
to sample the analog signal at a specific instance
during the PWM period. In addition, the high-speed
PWMx module also generates a Special Event Trigger
to the ADC module based on the master time base.
The high-speed PWMx module can synchronize itself
with an external signal or can act as a synchronizing
source to any external device. The SYNCI1 input pin,
that utilizes PPS, can synchronize the high-speed
PWMx module with an external signal. The SYNCO1
pin is an output pin that provides a synchronous signal
to an external device.
Figure 17-1 illustrates an architectural overview of the
high-speed PWMx module and its interconnection with
the CPU and other peripherals.
17.1 PWM Faults
The PWMx module incorporates multiple external Fault
inputs as follows:
• FLT1 and FLT2, available on 28-pin, 36-pin, 44-pin
and 64-pin packages, which are remappable using
the PPS feature
• FLT3, available on 44-pin and 64-pin packages,
which is available as a fixed pin
• FLT4-FLT8, available on 64-pin packages, which
are available as fixed pins
• FLT32 is available on a fixed pin on all devices
These Faults provide a safe and reliable way to safely
shut down the PWM outputs when the Fault input is
asserted.
17.1.1 PWM FAULTS AT RESET
During any Reset event, the PWMx module maintains
ownership of the Class B Fault, FLT32. At Reset, this
Fault is enabled in Latched mode to ensure the fail-safe
power-up of the application. The application software
must clear the PWM Fault before enabling the high-
speed motor control PWMx module. To clear the Fault
condition, the FLT32 pin must first be pulled low
externally or the internal pull-down resistor in the
CNPDx register can be enabled
.
Note 1:
This data sheet summarizes the features of
the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To com-
plement the information in this data sheet,
refer to
“High-Speed PWM”
(DS70645) in
the “dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
Note:
In Edge-Aligned PWM mode, the duty
cycle, dead time, phase shift and frequency
resolution are 8.32 ns at 60 MIPS.
Note:
The Fault mode may be changed using
the FLTMOD<1:0> bits (FCLCONx<1:0>),
regardless of the state of FLT32.
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17.1.2 WRITE-PROTECTED REGISTERS
On dsPIC33EVXXXGM00X/10X family devices, write
protection is implemented for the IOCONx and
FCLCONx registers. The write protection feature
prevents any inadvertent writes to these registers.
This protection feature can be controlled by the
PWMLOCK Configuration bit (FDEVOPT<0>). The
default state of the write protection feature is enabled
(PWMLOCK = 1). The write protection feature can be
disabled by configuring PWMLOCK = 0.
To gain write access to these locked registers, the user
application must write two consecutive values (0xABCD
and 0x4321) to the PWMKEY register to perform the
unlock operation. The write access to the IOCONx or
FCLCONx registers must be the next SFR access
following the unlock process. There can be no other SFR
accesses during the unlock process and subsequent
write access. To write to both the IOCONx and
FCLCONx registers requires two unlock operations.
The correct unlocking sequence is described in
Example 17-1.
EXAMPL E 17- 1: PWM 1 WRITE-PR OT ECTED REGISTER UNLOCK SEQUENCE
; FLT32 pin must be pulled low externally in order to clear and disable the fault
; Writing to FCLCON1 register requires unlock sequence
mov #0xabcd, w10 ; Load first unlock key to w10 register
mov #0x4321, w11 ; Load second unlock key to w11 register
mov #0x0000, w0 ; Load desired value of FCLCON1 register in w0
mov w10, PWMKEY ; Write first unlock key to PWMKEY register
mov w11, PWMKEY ; Write second unlock key to PWMKEY register
mov w0, FCLCON1 ; Write desired value to FCLCON1 register
; Set PWM ownership and polarity using the IOCON1 register
; Writing to IOCON1 register requires unlock sequence
mov #0xabcd, w10 ; Load first unlock key to w10 register
mov #0x4321, w11 ; Load second unlock key to w11 register
mov #0xF000, w0 ; Load desired value of IOCON1 register in w0
mov w10, PWMKEY ; Write first unlock key to PWMKEY register
mov w11, PWMKEY ; Write second unlock key to PWMKEY register
mov w0, IOCON1 ; Write desired value to IOCON1 register
2013-2018 Microchip Technology Inc. DS70005144G-page 203
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 17-1: HIGH-SPEED PWMx MODULE ARCHITECTURAL OVERVIEW
CPU
PWM
Generator 3
SYNCI1
SYNCO1
PWM1H
PWM1L
PWM1 Interrupt
(1)
PWM2H
PWM2L
PWM2 Interrupt
(1)
PWM3H
PWM3L
PWM3 Interrupt
(1)
Synchronization Signal
Data Bus
ADC Module FLT1-FLT8, FLT32
Synchronization Signal
Synchronization Signal
Primary Trigger
Primary Special
DTCMP1-DTCMP3
Fault, Current-Limit and
Dead-Time Compensation
Event Trigger
Master Time Base
Fault, Current-Limit
and Dead-Time Compensation
Fault, Current-Limit
and Dead-Time Compensation
F
OSC
Note 1:
The PWM interrupts are generated by logically ORing the FLTSTAT, CLSTAT and TRGSTAT status bits for the
given PWM generator. For more information, refer to
“High-Speed PWM ”
(DS70645) in the “dsPIC33/PIC24
Family Reference Manual”.
PWM
Generator 2
PWM
Generator 1
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FIGURE 17-2: HIGH-SPEED PWMx MODULE REGISTER INTERCONNECTION DIAGRAM
MUX
PTMRx
PDCx
PWMCONx,
PTCON, PTCON2
IOCONx
DTRx
PWMxL
PWMxH
FLTx
PWM1L
PWM1H
FCLCONx
PHASEx
LEBCONx,
ALTDTRx
User Override Logic
Current-Limit
PWM Output Mode
Control Logic
Logic
Pin
Control
Logic
Fault and
Current-Limit
Logic
PWM Ge nerator 1
FLTx
PWM Generator 2 and PWM Generator 3
Interrupt
Logic
(1)
Module Control and Timing
Master Duty Cycle Register
Synchronization Synchronization
Master PeriodMaster Period
Master Duty CycleMaster Duty Cycle
SYNCI1
SYNCO1
SEVTCMP
Comparator
Special Event Trigger
Special Event
Postscaler
PTPER
PMTMR
Primary Ma ste r Time Base
Master Time Base Counter
Special Event Compare Trigger
Comparator
Clock
Prescaler
Comparator
Dead-Time
Fault Override Logic
Override Logic
DTCMPx
DTCMP1
F
OSC
PWMKEY IOCONx and FCLCONx Unlock Register
AUXCONx LEBDLYx
TRGCONx
ADC Trigger
Comparator
TRIGx
Note 1:
The PWM interrupts are generated by logically ORing the FLTSTAT, CLSTAT and TRGSTAT status bits for the
given PWM generator. For more information, refer to,
“High-Speed PWM ”
(DS70645) in the “dsPIC33/PIC24
Family Reference Manual”.
MDC
16-Bit Data Bus
2013-2018 Microchip Technology Inc. DS70005144G-page 205
dsPIC33EVXXXGM00X/10X FAMILY
17.2 PWM Resources
Many useful resources are provided on the main
product page on the Microchip web site
(www.microchip.com) for the devices listed in this data
sheet. This product page contains the latest updates
and additional information.
17.2.1 KEY RESOURCES
•
“High-Speed PWM”
(DS70645) in the “dsPIC33/
PIC24 Family Reference Manual”
• Code Samples
• Application Notes
• Software Libraries
• Webinars
• All Related “dsPIC33/PIC24 Family Reference
Manual” Sections
• Development Tools
Note:
In case the above link is not accessible,
enter this URL in your browser:
http://www.microchip.com/wwwproducts/
Devices.aspx?dDocName=en555464
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17.3 PWMx Control Registers
REGISTER 17-1: PTCON: PWMx TIME BASE CONTROL REGISTER
R/W-0 U-0 R/W-0 HC/HS-0 R/W-0 R/W-0 R/W-0 R/W-0
PTEN — PTSIDL SESTAT SEIEN EIPU
(1)
SYNCPOL
(1)
SYNCOEN
(1)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SYNCEN
(1)
SYNCSRC2
(1)
SYNCSRC1
(1)
SYNCSRC0
(1)
SEVTPS3
(1)
SEVTPS2
(1)
SEVTPS1
(1)
SEVTPS0
(1)
bit 7 bit 0
Legend:
HC = Hardware Clearable bit HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
PTEN:
PWMx Module Enable bit
1 = PWMx module is enabled
0 = PWMx module is disabled
bit 14
Unimplemented:
Read as ‘0’
bit 13
PTSIDL:
PWMx Time Base Stop in Idle Mode bit
1 = PWMx time base halts in CPU Idle mode
0 = PWMx time base runs in CPU Idle mode
bit 12
SESTAT:
Special Event Interrupt Status bit
1 = Special event interrupt is pending
0 = Special event interrupt is not pending
bit 11
SEIEN:
Special Event Interrupt Enable bit
1 = Special event interrupt is enabled
0 = Special event interrupt is disabled
bit 10
EIPU:
Enable Immediate Period Updates bit
(1)
1 = Active Period register is updated immediately
0 = Active Period register updates occur on PWMx cycle boundaries
bit 9
SYNCPOL:
Synchronize Input and Output Polarity bit
(1)
1 = SYNCI1/SYNCO1 polarity is inverted (active-low)
0 = SYNCI1/SYNCO1 is active-high
bit 8
SYNCOEN:
Primary Time Base Sync Enable bit
(1)
1 = SYNCO1 output is enabled
0 = SYNCO1 output is disabled
bit 7
SYNCEN:
External Time Base Synchronization Enable bit
(1)
1 = External synchronization of primary time base is enabled
0 = External synchronization of primary time base is disabled
Note 1:
These bits should be changed only when PTEN = 0. In addition, when using the SYNCI1 feature, the user
application must program the Period register with a value that is slightly larger than the expected period of
the external synchronization input signal.
2013-2018 Microchip Technology Inc. DS70005144G-page 207
dsPIC33EVXXXGM00X/10X FAMILY
bit 6-4
SYNCSRC<2:0>:
Synchronous Source Selection bits
(1)
111 = Reserved
•
•
•
100 = Reserved
011 = Reserved
010 = Reserved
001 = Reserved
000 = SYNCI1 input from PPS
bit 3-0
SEVTPS<3:0>:
Special Event Trigger Output Postscaler Select bits
(1)
1111 = 1:16 postscaler generates a Special Event Trigger on every sixteenth compare match event
•
•
•
0001 = 1:2 postscaler generates a Special Event Trigger on every second compare match event
0000 = 1:1 postscaler generates a Special Event Trigger on every compare match event
REGISTER 17-1: PTCON: PWMx TIME BASE CONTROL REGISTER (CONTINUED)
Note 1:
These bits should be changed only when PTEN = 0. In addition, when using the SYNCI1 feature, the user
application must program the Period register with a value that is slightly larger than the expected period of
the external synchronization input signal.
REGISTER 17-2: PTCON2: PWMx PRIM ARY MASTER CLOCK DIVIDER SELECT REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
— — — — —PCLKDIV<2:0>
(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-3
Unimplemented:
Read as ‘0’
bit 2-0
PCLKDIV<2:0>:
PWMx Input Clock Prescaler (Divider) Select bits
(1)
111 = Reserved
110 = Divide-by-64
101 = Divide-by-32
100 = Divide-by-16
011 = Divide-by-8
010 = Divide-by-4
001 = Divide-by-2
000 = Divide-by-1, maximum PWMx timing resolution (power-on default)
Note 1:
These bits should be changed only when PTEN = 0. Changing the clock selection during operation will
yield unpredictable results.
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REGISTER 17-3: PTPER: PWMx PRIMARY MASTER TIME BASE PERIOD REGISTER
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
PTPER<15:8>
bit 15 bit 8
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0
PTPER<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
PTPER<15:0>:
Primary Master Time Base (PMTMR) Period Value bits
REGISTER 17-4: SEVTCMP: PWMx PRIMARY SPECIAL EVENT COMPARE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SEVTCMP<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SEVTCMP<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
SEVTCMP<15:0>:
Special Event Compare Count Value bits
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REGISTER 17-5: CHOP: PWMx CHOP CLOCK GENERATOR REGISTER
R/W-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
CHPCLKEN — — — — — CHOPCLK9 CHOPCLK8
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CHOPCLK7 CHOPCLK6 CHOPCLK5 CHOPCLK4 CHOPCLK3 CHOPCLK2 CHOPCLK1 CHOPCLK0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
CHPCLKEN:
Enable Chop Clock Generator bit
1 = Chop clock generator is enabled
0 = Chop clock generator is disabled
bit 14-10
Unimplemented:
Read as ‘0’
bit 9-0
CHOPCLK<9:0>:
Chop Clock Divider bits
The frequency of the chop clock signal is given by the following expression:
Chop Frequency = (F
P
/PCLKDIV<2:0>)/(CHOPCLK<9:0> + 1)
REGISTER 17-6: MDC: PWMx MASTER DUTY CYCLE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MDC<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MDC<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
MDC<15:0>:
PWMx Master Duty Cycle Value bits
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REGISTER 17-7: PWMCONx: PWMx CONTROL REGISTER
HC/HS-0 HC/HS-0 HC/HS-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
FLTSTAT
(1)
CLSTAT
(1)
TRGSTAT FLTIEN CLIEN TRGIEN ITB
(2)
MDCS
(2)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0
DTC1 DTC0 DTCP
(3)
——CAM
(2,4)
XPRES
(5)
IUE
(2)
bit 7 bit 0
Legend:
HC = Hardware Clearable bit HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
FLTSTAT:
Fault Interrupt Status bit
(1)
1 = Fault interrupt is pending
0 = Fault interrupt is not pending
This bit is cleared by setting FLTIEN = 0.
bit 14
CLSTAT:
Current-Limit Interrupt Status bit
(1)
1 = Current-limit interrupt is pending
0 = Current-limit interrupt is not pending
This bit is cleared by setting CLIEN = 0.
bit 13
TRGSTAT:
Trigger Interrupt Status bit
1 = Trigger interrupt is pending
0 = Trigger interrupt is not pending
This bit is cleared by setting TRGIEN = 0.
bit 12
FLTIEN:
Fault Interrupt Enable bit
1 = Fault interrupt is enabled
0 = Fault interrupt is disabled and the FLTSTAT bit is cleared
bit 11
CLIEN:
Current-Limit Interrupt Enable bit
1 = Current-limit interrupt is enabled
0 = Current-limit interrupt is disabled and the CLSTAT bit is cleared
bit 10
TRGIEN:
Trigger Interrupt Enable bit
1 = Trigger event generates an interrupt request
0 = Trigger event interrupts are disabled and the TRGSTAT bit is cleared
bit 9
ITB:
Independent Time Base Mode bit
(2)
1 = PHASEx register provides time base period for this PWM generator
0 = PTPER register provides timing for this PWM generator
bit 8
MDCS:
Master Duty Cycle Register Select bit
(2)
1 = MDC register provides duty cycle information for this PWM generator
0 = PDCx register provides duty cycle information for this PWM generator
Note 1:
Software must clear the interrupt status here and in the corresponding IFSx bit in the interrupt controller.
2:
These bits should not be changed after the PWMx is enabled (PTEN = 1).
3:
DTC<1:0> = 11 for DTCP to be effective; else, DTCP is ignored.
4:
The Independent Time Base (ITB = 1) mode must be enabled to use Center-Aligned mode. If ITB = 0, the
CAM bit is ignored.
5:
To operate in External Period Reset mode, the ITB bit must be ‘1’ and the CLMOD bit in the FCLCONx
register must be ‘0’.
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bit 7-6
DTC<1:0>:
Dead-Time Control bits
11 = Dead-Time Compensation mode
10 = Dead-time function is disabled
01 = Negative dead time is actively applied for Complementary Output mode
00 = Positive dead time is actively applied for all Output modes
bit 5
DTCP:
Dead-Time Compensation Polarity bit
(3)
When Set to ‘1’:
If DTCMPx = 0, PWMxL is shortened and PWMxH is lengthened.
If DTCMPx = 1, PWMxH is shortened and PWMxL is lengthened.
When Set to ‘0’:
If DTCMPx = 0, PWMxH is shortened and PWMxL is lengthened.
If DTCMPx = 1, PWMxL is shortened and PWMxH is lengthened.
bit 4-3
Unimplemented:
Read as ‘0’
bit 2
CAM:
Center-Aligned Mode Enable bit
(2,4)
1 = Center-Aligned mode is enabled
0 = Edge-Aligned mode is enabled
bit 1
XPRES:
External PWMx Reset Control bit
(5)
1 = Current-limit source resets the time base for this PWM generator if it is in Independent Time Base mode
0 = External pins do not affect PWMx time base
bit 0
IUE:
Immediate Update Enable bit
(2)
1 = Updates to the active MDC/PDCx/DTRx/ALTDTRx/PHASEx registers are immediate
0 = Updates to the active MDC/PDCx/DTRx/ALTDTRx/PHASEx registers are synchronized to the
PWMx period boundary
REGISTER 17-7: PWMCONx: PWMx CONTROL REGISTER (CONTIN UED)
Note 1:
Software must clear the interrupt status here and in the corresponding IFSx bit in the interrupt controller.
2:
These bits should not be changed after the PWMx is enabled (PTEN = 1).
3:
DTC<1:0> = 11 for DTCP to be effective; else, DTCP is ignored.
4:
The Independent Time Base (ITB = 1) mode must be enabled to use Center-Aligned mode. If ITB = 0, the
CAM bit is ignored.
5:
To operate in External Period Reset mode, the ITB bit must be ‘1’ and the CLMOD bit in the FCLCONx
register must be ‘0’.
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REGISTER 17-8: PDCx: PWMx GENERATOR DUTY CYCLE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PDCx<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PDCx<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
PDCx<15:0>:
PWMx Generator Duty Cycle Value bits
REGISTER 17-9: PHAS Ex: PWMx PRIMA RY PHASE-SHIFT REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PHASEx<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PHASEx<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
PHASEx<15:0>:
PWMx Phase-Shift Value or Independent Time Base Period for the PWM Generator bits
Note 1:
If ITB (PWMCONx<9>) = 0, the following applies based on the mode of operation:
Complementary, Redundant and Push-Pull Output modes (PMOD<1:0> (IOCONx<11:10>) = 00, 01 or
10), PHASEx<15:0> = Phase-shift value for PWMxH and PWMxL outputs.
2:
If ITB (PWMCONx<9>) = 1, the following applies based on the mode of operation:
Complementary, Redundant and Push-Pull Output modes (PMOD<1:0> (IOCONx<11:10>) = 00, 01 or 10),
PHASEx<15:0> = Independent Time Base period value for PWMxH and PWMxL.
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REGISTER 17-10: DTRx: PWMx DEAD-TIME REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
——DTRx<13:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DTRx<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-0
DTRx<13:0>:
Unsigned 14-Bit Dead-Time Value for PWMx Dead-Time Unit bits
REGISTER 17-11: ALTDTRx: PWMx ALTERNATE DEAD-TIME REGISTER
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— ALTDTRx<13:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ALTDTRx<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-0
ALTDTRx<13:0>:
Unsigned 14-Bit Alternate Dead-Time Value for PWMx Dead-Time Unit bits
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REGISTER 17-12: TRGCONx: PWMx TRIGGER CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0
TRGDIV3 TRGDIV2 TRGDIV1 TRGDIV0 — — — —
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
——TRGSTRT5
(1)
TRGSTRT4
(1)
TRGSTRT3
(1)
TRGSTRT2
(1)
TRGSTRT1
(1)
TRGSTRT0
(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
TRGDIV<3:0>:
Trigger Output Divider bits
1111 = Triggers output for every 16th trigger event
1110 = Triggers output for every 15th trigger event
1101 = Triggers output for every 14th trigger event
1100 = Triggers output for every 13th trigger event
1011 = Triggers output for every 12th trigger event
1010 = Triggers output for every 11th trigger event
1001 = Triggers output for every 10th trigger event
1000 = Triggers output for every 9th trigger event
0111 = Triggers output for every 8th trigger event
0110 = Triggers output for every 7th trigger event
0101 = Triggers output for every 6th trigger event
0100 = Triggers output for every 5th trigger event
0011 = Triggers output for every 4th trigger event
0010 = Triggers output for every 3rd trigger event
0001 = Triggers output for every 2nd trigger event
0000 = Triggers output for every trigger event
bit 11-6
Unimplemented:
Read as ‘0’
bit 5-0
TRGSTRT<5:0>:
Trigger Postscaler Start Enable Select bits
(1)
111111 = Waits 63 PWM cycles before generating the first trigger event after the module is enabled
•
•
•
000010 = Waits 2 PWM cycles before generating the first trigger event after the module is enabled
000001 = Waits 1 PWM cycle before generating the first trigger event after the module is enabled
000000 = Waits 0 PWM cycles before generating the first trigger event after the module is enabled
Note 1:
The secondary PWM generator cannot generate PWMx trigger interrupts.
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REGISTER 17-13: IOCONx: PWMx I/O CONTROL REGISTER
(2)
R/W-1 R/W-1 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
PENH PENL POLH POLL PMOD1
(1)
PMOD0
(1)
OVRENH OVRENL
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
OVRDAT1 OVRDAT0 FLTDAT1 FLTDAT0 CLDAT1 CLDAT0 SWAP OSYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
PENH:
PWMxH Output Pin Ownership bit
1 = PWMx module controls the PWMxH pin
0 = GPIO module controls the PWMxH pin
bit 14
PENL:
PWMxL Output Pin Ownership bit
1 = PWMx module controls the PWMxL pin
0 = GPIO module controls the PWMxL pin
bit 13
POLH:
PWMxH Output Pin Polarity bit
1 = PWMxH pin is active-low
0 = PWMxH pin is active-high
bit 12
POLL:
PWMxL Output Pin Polarity bit
1 = PWMxL pin is active-low
0 = PWMxL pin is active-high
bit 11-10
PMOD<1:0>:
PWMx I/O Pin Mode bits
(1)
11 = Reserved; do not use
10 = PWMx I/O pin pair is in the Push-Pull Output mode
01 = PWMx I/O pin pair is in the Redundant Output mode
00 = PWMx I/O pin pair is in the Complementary Output mode
bit 9
OVRENH:
Override Enable for PWMxH Pin bit
1 = OVRDAT1 controls the output on the PWMxH pin
0 = PWMx generator controls the PWMxH pin
bit 8
OVRENL:
Override Enable for PWMxL Pin bit
1 = OVRDAT0 controls the output on the PWMxL pin
0 = PWMx generator controls the PWMxL pin
bit 7-6
OVRDAT<1:0>:
Data for PWMxH, PWMxL Pins if Override is Enabled bits
If OVERENH = 1, PWMxH is driven to the state specified by OVRDAT1.
If OVERENL = 1, PWMxL is driven to the state specified by OVRDAT0.
bit 5-4
FLTDAT<1:0>:
Data for PWMxH and PWMxL Pins if FLTMOD is Enabled bits
If Fault is active, PWMxH is driven to the state specified by FLTDAT1.
If Fault is active, PWMxL is driven to the state specified by FLTDAT0.
bit 3-2
CLDAT<1:0>:
Data for PWMxH and PWMxL Pins if CLMOD is Enabled bits
If current limit is active, PWMxH is driven to the state specified by CLDAT1.
If current limit is active, PWMxL is driven to the state specified by CLDAT0.
Note 1:
These bits should not be changed after the PWMx module is enabled (PTEN = 1).
2:
If the PWMLOCK Configuration bit (FDEVOPT<0>) is a ‘1’, the IOCONx register can only be written after
the unlock sequence has been executed.
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bit 1
SWAP:
SWAP PWMxH and PWMxL Pins bit
1 = PWMxH output signal is connected to the PWMxL pin; PWMxL output signal is connected to the
PWMxH pin
0 = PWMxH and PWMxL pins are mapped to their respective pins
bit 0
OSYNC:
Output Override Synchronization bit
1 = Output overrides through the OVRDAT<1:0> bits are synchronized to the PWMx time base
0 = Output overrides through the OVRDAT<1:0> bits occur on the next CPU clock boundary
REGISTER 17-13: IOCONx: PWMx I/O CONTROL REGISTER
(2)
(CONT I NUED)
Note 1:
These bits should not be changed after the PWMx module is enabled (PTEN = 1).
2:
If the PWMLOCK Configuration bit (FDEVOPT<0>) is a ‘1’, the IOCONx register can only be written after
the unlock sequence has been executed.
REGISTER 17-14: TRIGx: PWMx PRIMARY TRIGGER COMPARE VALUE REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TRGCMP<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
TRGCMP<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
TRGCMP<15:0>:
Trigger Control Value bits
When the primary PWMx functions in the local time base, this register contains the compare values
that can trigger the ADC module.
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REGISTER 17-15: FCLCONx: PWMx FAULT CURRENT-LIMIT CONTROL REGISTER
(1)
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— CLSRC4 CLSRC3 CLSRC2 CLSRC1 CLSRC0 CLPOL
(2)
CLMOD
bit 15 bit 8
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-0 R/W-0 R/W-0
FLTSRC4 FLTSRC3 FLTSRC2 FLTSRC1 FLTSRC0 FLTPOL
(2)
FLTMOD1 FLTMOD0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
Unimplemented:
Read as ‘0’
bit 14-10
CLSRC<4:0>:
Current-Limit Control Signal Source Select for PWM Generator x bits
11111 = Fault 32
11110 = Reserved
•
•
•
01100 = Op Amp/Comparator 5
01011 = Comparator 4
01010 = Op Amp/Comparator 3
01001 = Op Amp/Comparator 2
01000 = Op Amp/Comparator 1
00111 = Fault 8
00110 = Fault 7
00101 = Fault 6
00100 = Fault 5
00011 = Fault 4
00010 = Fault 3
00001 = Fault 2
00000 = Fault 1
(default)
bit 9
CLPOL:
Current-Limit Polarity for PWM Generator x bit
(2)
1 = The selected current-limit source is active-low
0 = The selected current-limit source is active-high
bit 8
CLMOD:
Current-Limit Mode Enable for PWM Generator x bit
1 = Current-Limit mode is enabled
0 = Current-Limit mode is disabled
Note 1:
If the PWMLOCK Configuration bit (FDEVOPT<0>) is a ‘1’, the FCLCONx register can only be written after
the unlock sequence has been executed.
2:
These bits should be changed only when PTEN = 0. Changing the clock selection during operation will yield
unpredictable results.
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bit 7-3
FLTSRC<4:0>:
Fault Control Signal Source Select for PWM Generator x bits
11111 = Fault 32
(default)
11110 = Reserved
•
•
•
01100 = Op Amp/Comparator 5
01011 = Comparator 4
01010 = Op Amp/Comparator 3
01001 = Op Amp/Comparator 2
01000 = Op Amp/Comparator 1
00111 = Fault 8
00110 = Fault 7
00101 = Fault 6
00100 = Fault 5
00011 = Fault 4
00010 = Fault 3
00001 = Fault 2
00000 = Fault 1
bit 2
FLTPOL:
Fault Polarity for PWM Generator x bit
(2)
1 = The selected Fault source is active-low
0 = The selected Fault source is active-high
bit 1-0
FLTMOD<1:0>:
Fault Mode for PWM Generator x bits
11 = Fault input is disabled
10 = Reserved
01 = The selected Fault source forces the PWMxH, PWMxL pins to FLTDAT<1:0> values (cycle)
00 = The selected Fault source forces the PWMxH, PWMxL pins to FLTDAT<1:0> values (latched condition)
REGISTER 17-15: FCLCONx: PWMx FAULT CURRENT-LIMIT CONTROL REGISTER
(1)
(CONTINUED)
Note 1:
If the PWMLOCK Configuration bit (FDEVOPT<0>) is a ‘1’, the FCLCONx register can only be written after
the unlock sequence has been executed.
2:
These bits should be changed only when PTEN = 0. Changing the clock selection during operation will yield
unpredictable results.
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REGISTER 17-16: LEBCONx: PWMx LEADING-EDGE BLANKING CONTROL REGISTER
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
PHR PHF PLR PLF FLTLEBEN CLLEBEN — —
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
——BCH
(1)
BCL
(1)
BPHH BPHL BPLH BPLL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
PHR:
PWMxH Rising Edge Trigger Enable bit
1 = Rising edge of PWMxH will trigger the Leading-Edge Blanking counter
0 = Leading-Edge Blanking ignores the rising edge of PWMxH
bit 14
PHF:
PWMxH Falling Edge Trigger Enable bit
1 = Falling edge of PWMxH will trigger the Leading-Edge Blanking counter
0 = Leading-Edge Blanking ignores the falling edge of PWMxH
bit 13
PLR:
PWMxL Rising Edge Trigger Enable bit
1 = Rising edge of PWMxL will trigger the Leading-Edge Blanking counter
0 = Leading-Edge Blanking ignores the rising edge of PWMxL
bit 12
PLF:
PWMxL Falling Edge Trigger Enable bit
1 = Falling edge of PWMxL will trigger the Leading-Edge Blanking counter
0 = Leading-Edge Blanking ignores the falling edge of PWMxL
bit 11
FLTLEBEN:
Fault Input Leading-Edge Blanking Enable bit
1 = Leading-Edge Blanking is applied to the selected Fault input
0 = Leading-Edge Blanking is not applied to the selected Fault input
bit 10
CLLEBEN:
Current-Limit Input Leading-Edge Blanking Enable bit
1 = Leading-Edge Blanking is applied to the selected current-limit input
0 = Leading-Edge Blanking is not applied to the selected current-limit input
bit 9-6
Unimplemented:
Read as ‘0’
bit 5
BCH:
Blanking in Selected Blanking Signal High Enable bit
(1)
1 = State blanking (of current-limit and/or Fault input signals) when selected blanking signal is high
0 = No blanking when the selected blanking signal is high
bit 4
BCL:
Blanking in Selected Blanking Signal Low Enable bit
(1)
1 = State blanking (of current-limit and/or Fault input signals) when selected blanking signal is low
0 = No blanking when the selected blanking signal is low
bit 3
BPHH:
Blanking in PWMxH High Enable bit
1 = State blanking (of current-limit and/or Fault input signals) when the PWMxH output is high
0 = No blanking when the PWMxH output is high
bit 2
BPHL:
Blanking in PWMxH Low Enable bit
1 = State blanking (of current-limit and/or Fault input signals) when the PWMxH output is low
0 = No blanking when the PWMxH output is low
bit 1
BPLH:
Blanking in PWMxL High Enable bit
1 = State blanking (of current-limit and/or Fault input signals) when the PWMxL output is high
0 = No blanking when the PWMxL output is high
bit 0
BPLL:
Blanking in PWMxL Low Enable bit
1 = State blanking (of current-limit and/or Fault input signals) when the PWMxL output is low
0 = No blanking when the PWMxL output is low
Note 1:
The blanking signal is selected through the BLANKSEL<3:0> bits in the AUXCONx register.
dsPIC33EVXXXGM00X/10X FAMILY
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REGIST ER 17-17: LEBD LYx: PWMx LE ADI NG-EDGE BLANKING DELAY REGISTER
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — — LEB<11:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
LEB<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
Unimplemented:
Read as ‘0’
bit 11-0
LEB<11:0>:
Leading-Edge Blanking Delay for Current-Limit and Fault Inputs bits
2013-2018 Microchip Technology Inc. DS70005144G-page 221
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REGISTER 17-18: AUXCONx: PWMx AUXILIARY CONTROL REGISTER
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — — BLANKSEL3 BLANKSEL2 BLANKSEL1 BLANKSEL0
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— CHOPSEL3 CHOPSEL2 CHOPSEL1 CHOPSEL0 CHOPHEN CHOPLEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
Unimplemented:
Read as ‘0’
bit 11-8
BLANKSEL<3:0>:
PWMx State Blank Source Select bits
The selected state blank signal will block the current-limit and/or Fault input signals (if enabled through
the BCH and BCL bits in the LEBCONx register).
1001 = Reserved
•
•
•
0100 = Reserved
0011 = PWM3H is selected as the state blank source
0010 = PWM2H is selected as the state blank source
0001 = PWM1H is selected as the state blank source
0000 = No state blanking
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-2
CHOPSEL<3:0>:
PWMx Chop Clock Source Select bits
The selected signal will enable and disable (Chop) the selected PWMx outputs.
1001 = Reserved
•
•
•
0100 = Reserved
0011 = PWM3H is selected as the chop clock source
0010 = PWM2H is selected as the chop clock source
0001 = PWM1H is selected as the chop clock source
0000 = Chop clock generator is selected as the chop clock source
bit 1
CHOPHEN:
PWMxH Output Chopping Enable bit
1 = PWMxH chopping function is enabled
0 = PWMxH chopping function is disabled
bit 0
CHOPLEN:
PWMxL Output Chopping Enable bit
1 = PWMxL chopping function is enabled
0 = PWMxL chopping function is disabled
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NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 223
dsPIC33EVXXXGM00X/10X FAMILY
18.0 SERIAL PERIP H ERAL
INTERFACE (SPI)
The Serial Peripheral Interface (SPI) module is a
synchronous serial interface, useful for communicating
with other peripheral or microcontroller devices. These
peripheral devices can be serial EEPROMs, shift reg-
isters, display drivers, ADC Converters, etc. The SPI
module is compatible with the Motorola
®
SPI and SIOP
interfaces.
The dsPIC33EVXXXGM00X/10X device family offers
two SPI modules on a single device, SPI1 and SPI2,
that are functionally identical. Each SPI module
includes an eight-word FIFO buffer and allows DMA
bus connections. When using the SPI module with
DMA, FIFO operation can be disabled.
The SPI1 module uses dedicated pins which allow for a
higher speed when using SPI1. The SPI2 module takes
advantage of the Peripheral Pin Select (PPS) feature to
allow for greater flexibility in pin configuration of this
module, but results in a lower maximum speed. See
Section 30.0 “Electrical Characteristics”
for more
information.
The SPIx serial interface consists of the following four
pins:
• SDIx: Serial Data Input
• SDOx: Serial Data Output
• SCKx: Shift Clock Input or Output
• SSx/FSYNCx: Active-Low Slave Select or Frame
Synchronization I/O Pulse
The SPIx module can be configured to operate with
two, three or four pins. In 3-pin mode, SSx is not used.
In 2-pin mode, neither SDOx nor SSx is used.
Figure 18-1 illustrates the block diagram of the SPIx
module in Standard and Enhanced modes.
Note 1:
This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to
“Serial Peripheral
Interface (SPI)”
(DS70005185) in the
“dsPIC33/PIC24 Family Reference Man-
ual”, which is available from the Microchip
web site (www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
Note:
In this section, the SPI modules are
referred to together as SPIx, or separately
as SPI1 and SPI2. Special Function
Registers follow a similar notation. For
example, SPIxCON refers to the control
register for the SPI1 and SPI2 modules.
Note:
All four pins of the SPIx serial interface
must be configured as digital in the
ANSELx registers.
Note:
When SPI2 is configured as master, the
SCK2 pin should be configured as both
input and output.
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FIGURE 18-1: SPIx MODULE BLOCK DIAGRAM
Internal Data Bus
SDIx
SDOx
SSx/FSYNCx
SCKx
bit 0
Shift Control
Edge
Select
F
P
Primary
1:1/4/16/64
Enable
Prescaler
Sync
Control
Transfer
Transfer
Write SPIxBUF
Read SPIxBUF
16
SPIxCON1<1:0>
SPIxCON1<4:2>
Master Clock
Note 1:
In Standard mode, the FIFO is only one level deep.
Clock
Control
SPIxSR
Secondary
Prescaler
1:1 to 1:8
8-Level FIFO
Receive Buffer
(1)
8-Level FIFO
Transmit Buffer
(1)
SPIxBUF
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18.1 SPI Helpful Tips
1. In Frame mode, if there is a possibility that the
master may not be initialized before the slave:
a) If FRMPOL (SPIxCON2<13>) = 1, use a
pull-down resistor on SSx.
b) If FRMPOL = 0, use a pull-up resistor on
SSx.
2. In Non-Framed 3-Wire mode (i.e., not using SSx
from a master):
a) If CKP (SPIxCON1<6>) = 1, always place a
pull-up resistor on SSx.
b) If CKP = 0, always place a pull-down
resistor on SSx.
3. FRMEN (SPIxCON2<15>) = 1 and SSEN
(SPIxCON1<7>) = 1 are exclusive and invalid.
In Frame mode, SCKx is continuous and the
Frame Sync pulse is active on the SSx pin,
which indicates the start of a data frame.
4. In Master mode only, set the SMP bit
(SPIxCON1<9>) to a ‘1’ for the fastest SPI data
rate possible. The SMP bit can only be set at the
same time or after the MSTEN bit
(SPIxCON1<5>) is set.
To avoid invalid slave read data to the master, the
user’s master software must ensure enough time for
slave software to fill its write buffer before the user
application initiates a master write/read cycle. It is
always advisable to preload the SPIxBUF Transmit
register in advance of the next master transaction
cycle. SPIxBUF is transferred to the SPIx Shift register
and is empty once the data transmission begins.
Note:
This insures that the first frame transmis-
sion after initialization is not shifted or
corrupted.
Note:
This will insure that during power-up and
initialization, the master/slave will not lose
sync due to an errant SCKx transition that
would cause the slave to accumulate data
shift errors, for both transmit and receive,
appearing as corrupted data.
Note:
Not all third-party devices support Frame
mode timing. For more information, refer
to the SPI specifications in
Section 30.0
“Electrical Characteristics”
.
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18.2 SPI Control Registers
REGISTER 18-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER
R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0
SPIEN — SPISIDL —— SPIBEC2 SPIBEC1 SPIBEC0
bit 15 bit 8
R/W-0 HS/R/C-0 R/W-0 R/W-0 R/W-0 R/W-0 HS/HC/R-0 HS/HC/R-0
SRMPT SPIROV SRXMPT SISEL2 SISEL1 SISEL0 SPITBF SPIRBF
bit 7 bit 0
Legend:
HC = Hardware Clearable bit HS = Hardware Settable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared C = Clearable bit
bit 15
SPIEN:
SPIx Enable bit
1 = Enables the SPIx module and configures SCKx, SDOx, SDIx and SSx as serial port pins
0 = Disables the SPIx module
bit 14
Unimplemented:
Read as ‘0’
bit 13
SPISIDL:
SPIx Stop in Idle Mode bit
1 = Discontinues the SPIx module operation when the device enters Idle mode
0 = Continues the SPIx module operation in Idle mode
bit 12-11
Unimplemented:
Read as ‘0’
bit 10-8
SPIBEC<2:0>:
SPIx Buffer Element Count bits (valid in Enhanced Buffer mode)
Master mode:
Number of SPIx transfers are pending.
Slave mode:
Number of SPIx transfers are unread.
bit 7
SRMPT:
SPIx Shift Register (SPIxSR) Empty bit (valid in Enhanced Buffer mode)
1 = The SPIx Shift register is empty and ready to send or receive the data
0 = The SPIx Shift register is not empty
bit 6
SPIROV:
SPIx Receive Overflow Flag bit
1 = A new byte/word is completely received and discarded; the user application has not read the
previous data in the SPIxBUF register
0 = Overflow has not occurred
bit 5
SRXMPT:
SPIx Receive FIFO Empty bit (valid in Enhanced Buffer mode)
1 = RX FIFO is empty
0 = RX FIFO is not empty
bit 4-2
SISEL<2:0>:
SPIx Buffer Interrupt Mode bits (valid in Enhanced Buffer mode)
111 = Interrupt when the SPIx transmit buffer is full (SPITBF bit is set)
110 = Interrupt when the last bit is shifted into SPIxSR, and as a result, the TX FIFO is empty
101 = Interrupt when the last bit is shifted out of SPIxSR and the transmit is complete
100 = Interrupt when one data is shifted into SPIxSR, and as a result, the TX FIFO has one open
memory location
011 = Interrupt when the SPIx receive buffer is full (SPIRBF bit is set)
010 = Interrupt when the SPIx receive buffer is 3/4 or more full
001 = Interrupt when data is available in the SPIx receive buffer (SRMPT bit is set)
000 = Interrupt when the last data in the SPIx receive buffer is read, and as a result, the buffer is
empty (SRXMPT bit is set)
2013-2018 Microchip Technology Inc. DS70005144G-page 227
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bit 1
SPITBF:
SPIx Transmit Buffer Full Status bit
1 = Transmit has not yet started, the SPIxTXB bit is full
0 = Transmit has started, the SPIxTXB bit is empty
Standard Buffer mode:
Automatically set in hardware when the core writes to the SPIxBUF location, loading SPIxTXB.
Automatically cleared in hardware when the SPIx module transfers data from SPIxTXB to SPIxSR.
Enhanced Buffer mode:
Automatically set in the hardware when the CPU writes to the SPIxBUF location, loading the last avail-
able buffer location. Automatically cleared in hardware when a buffer location is available for a CPU
write operation.
bit 0
SPIRBF:
SPIx Receive Buffer Full Status bit
1 = Receive is complete, the SPIxRXB bit is full
0 = Receive is incomplete, the SPIxRXB bit is empty
Standard Buffer mode:
Automatically set in the hardware when SPIx transfers data from SPIxSR to SPIxRXB. Automatically
cleared in hardware when the core reads the SPIxBUF location, reading SPIxRXB.
Enhanced Buffer mode:
Automatically set in hardware when SPIx transfers data from SPIxSR to the buffer, filling the last
unread buffer location. Automatically cleared in hardware when a buffer location is available for a
transfer from SPIxSR.
REGISTER 18-1: SPIxSTAT: SPIx STATUS AND CONTROL REGISTER (CONTINUED)
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REGISTER 18-2: SPIxCON1: SPIx CONTROL REGISTER 1
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — DISSCK DISSDO MODE16 SMP CKE
(1)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SSEN
(2)
CKP MSTEN SPRE2
(3)
SPRE1
(3)
SPRE0
(3)
PPRE1
(3)
PPRE0
(3)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13
Unimplemented:
Read as ‘0’
bit 12
DISSCK:
Disable SCKx Pin bit (SPI Master modes only)
1 = Internal SPI clock is disabled, pin functions as I/O
0 = Internal SPI clock is enabled
bit 11
DISSDO:
Disable SDOx Pin bit
1 = SDOx pin is not used by the module; pin functions as I/O
0 = SDOx pin is controlled by the module
bit 10
MODE16:
Word/Byte Communication Select bit
1 = Communication is word-wide (16 bits)
0 = Communication is byte-wide (8 bits)
bit 9
SMP:
SPIx Data Input Sample Phase bit
Master mode:
1 = Input data is sampled at the end of data output time
0 = Input data is sampled at the middle of data output time
Slave mode:
SMP must be cleared when SPIx is used in Slave mode.
bit 8
CKE:
Clock Edge Select bit
(1)
1 = Serial output data changes on transition from active clock state to Idle clock state (refer to bit 6)
0 = Serial output data changes on transition from Idle clock state to active clock state (refer to bit 6)
bit 7
SSEN:
Slave Select Enable bit (Slave mode)
(2)
1 = SSx pin is used for Slave mode
0 = SSx pin is not used by the module; pin is controlled by port function
bit 6
CKP:
Clock Polarity Select bit
1 = Idle state for clock is a high level; active state is a low level
0 = Idle state for clock is a low level; active state is a high level
bit 5
MSTEN:
Master Mode Enable bit
1 = Master mode
0 = Slave mode
Note 1:
The CKE bit is not used in Framed SPI modes. Program this bit to ‘0’ for Framed SPI modes
(FRMEN = 1).
2:
This bit must be cleared when FRMEN = 1.
3:
Do not set both primary and secondary prescalers to the value of 1:1.
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bit 4-2
SPRE<2:0>:
Secondary Prescale bits (Master mode)
(3)
111 = Secondary prescale 1:1
110 = Secondary prescale 2:1
•
•
•
000 = Secondary prescale 8:1
bit 1-0
PPRE<1:0>:
Primary Prescale bits (Master mode)
(3)
11 = Primary prescale 1:1
10 = Primary prescale 4:1
01 = Primary prescale 16:1
00 = Primary prescale 64:1
REGISTER 18-2: SPIxCON1: SPIx CONTROL REGISTER 1 (CONTINUED)
Note 1:
The CKE bit is not used in Framed SPI modes. Program this bit to ‘0’ for Framed SPI modes
(FRMEN = 1).
2:
This bit must be cleared when FRMEN = 1.
3:
Do not set both primary and secondary prescalers to the value of 1:1.
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REGISTER 18-3: SPIxCON2: SPIx CONTROL REGISTER 2
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0
FRMEN SPIFSD FRMPOL — — — — —
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
— — — — — — FRMDLY SPIBEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
FRMEN:
Framed SPIx Support bit
1 = Framed SPIx support is enabled (SSx pin is used as the Frame Sync pulse input/output)
0 = Framed SPIx support is disabled
bit 14
SPIFSD:
SPIx Frame Sync Pulse Direction Control bit
1 = Frame Sync pulse input (slave)
0 = Frame Sync pulse output (master)
bit 13
FRMPOL:
Frame Sync Pulse Polarity bit
1 = Frame Sync pulse is active-high
0 = Frame Sync pulse is active-low
bit 12-2
Unimplemented:
Read as ‘0’
bit 1
FRMDLY:
Frame Sync Pulse Edge Select bit
1 = Frame Sync pulse coincides with the first bit clock
0 = Frame Sync pulse precedes the first bit clock
bit 0
SPIBEN:
SPIx Enhanced Buffer Enable bit
1 = Enhanced buffer is enabled
0 = Enhanced buffer is disabled (Standard mode)
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dsPIC33EVXXXGM00X/10X FAMILY
19.0 INTER-INTEGRATED CI RCU IT
(I2C)
The dsPIC33EVXXXGM00X/10X family of devices
contains one Inter-Integrated Circuit (I
2
C) module, I2C1.
The I
2
C module provides complete hardware support
for both Slave and Multi-Master modes of the I
2
C serial
communication standard, with a 16-bit interface.
The I
2
C module has the following 2-pin interface:
• The SCLx pin is clock.
• The SDAx pin is data.
The I
2
C module offers the following key features:
•I
2
C Interface Supporting Both Master and Slave
modes of Operation
•I
2
C Slave mode Supports 7 and 10-Bit Addressing
•I
2
C Master mode Supports 7 and 10-Bit Addressing
•I
2
C Port allows Bidirectional Transfers between
Master and Slaves
• Serial Clock Synchronization for I
2
C Port can be
used as a Handshake Mechanism to Suspend
and Resume Serial Transfer (SCLREL control)
•I
2
C Supports Multi-Master Operation, Detects Bus
Collision and Arbitrates Accordingly
• Support for Address Bit Masking up to Lower
Seven Bits
•I
2
C Slave Enhancements:
- SDAx hold time selection of SMBus
(300 ns or 150 ns)
- Start/Stop bit interrupt enables
Figure 19-1 shows a block diagram of the I
2
C module.
19.1 I
2C Baud Rate Generator
The Baud Rate Generator (BRG) used for I
2
C mode
operation is used to set the SCL clock frequency for
100 kHz, 400 kHz and 1 MHz. The BRG reload value is
contained in the I2CxBRG register. The BRG will
automatically begin counting on a write to the
I2CxTRN
register.
Equation 19-1 and Equation 19-2 provide the BRG
reload formula and F
SCL
frequency, respectively.
EQUATION 19-1: BRG FORMULA
EQUATION 19-2: F
SCL
FREQUENCY
Note 1:
This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To com-
plement the information in this data sheet,
refer to
“Inter-Integrated Circuit (I
2
C)”
(DS70000195) in the “dsPIC33/PIC24
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
Where:
Delay varies from 110 ns to 130 ns.
I2CxBRG = 1
F
SCL
F
CY
2
– Delay
(( ))
x– 2
F
SCL
= F
CY
/((I2CxBRG + 2) * 2)
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FIGURE 19-1: I2Cx BLOCK DIAGRAM (x = 1)
Internal
Data Bus
SCLx/ASCLx
SDAx/ASDAx
Shift
Match Detect
Start and Stop
Bit Detect
Clock
Address Match
Clock
Stretching
I2CxTRN
LSb
Shift Clock
BRG Down Counter
Reload
Control
F
CY
Start, Restart, Stop
Bit Generate
Acknowledge
Generation
Collision
Detect
I2CxCON
I2CxSTAT
Control Logic
Read
LSb
Write
Read
I2CxBRG
I2CxRSR
Write
Read
Write
Read
Write
Read
Write
Read
Write
Read
I2CxMSK
I2CxRCV
I2CxADD
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19.2 I2C Control Registers
REGISTER 19-1: I2CxCON1: I2Cx CONTROL REGISTER 1
R/W-0 U-0 R/W-0 R/S-1 R/W-0 R/W-0 R/W-0 R/W-0
I2CEN — I2CSIDL SCLREL
(1)
STRICT A10M DISSLW SMEN
bit 15 bit 8
R/W-0 R/W-0 R/W-0 HC/R/W-0 HC/R/W-0 HC/R/W-0 HC/R/W-0 HC/R/W-0
GCEN STREN ACKDT ACKEN RCEN PEN RSEN SEN
bit 7 bit 0
Legend:
S = Settable bit HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
I2CEN:
I2Cx Enable bit (writable from SW only)
1 = Enables the I
2
C module and configures the SDAx and SCLx pins as serial port pins
0 = Disables the I
2
C module and all I
2
C pins are controlled by port functions
bit 14
Unimplemented:
Read as ‘0’
bit 13
I2CSIDL:
I2Cx Stop in Idle Mode bit
1 = Discontinues module operation when the device enters Idle mode
0 = Continues module operation in Idle mode
bit 12
SCLREL:
SCLx Release Control bit (I
2
C Slave mode only)
(1)
Module resets and (I2CEN = 0) sets SCLREL = 1.
If STREN = 0:
(2)
1 = Releases clock
0 = Forces clock low (clock stretch)
If STREN = 1:
1 = Releases clock
0 = Holds clock low (clock stretch); user may program this bit to ‘0’, clock stretch at the next SCLx low
bit 11
STRICT:
Strict I
2
C Reserved Address Rule Enable bit
1 = Strict reserved addressing is enforced
In Slave mode, the device does not respond to reserved address space and addresses falling in
that category are NACKed.
0 = Reserved addressing would be Acknowledged
In Slave mode, the device will respond to an address falling in the reserved address space. When
there is a match with any of the reserved addresses, the device will generate an ACK.
bit 10
A10M:
10-Bit Slave Address Flag bit
1 = I2CxADD is a 10-bit slave address
0 = I2CxADD is a 7-bit slave address
bit 9
DISSLW:
Slew Rate Control Disable bit
1 = Slew rate control is disabled for Standard Speed mode (100 kHz, also disabled for 1 MHz mode)
0 = Slew rate control is enabled for High-Speed mode (400 kHz)
bit 8
SMEN:
SMBus Input Levels Enable bit
1 = Enables the input logic so thresholds are compliant with the SMBus specification
0 = Disables the SMBus-specific inputs
Note 1:
Automatically cleared to ‘0’ at the beginning of slave transmission; automatically cleared to ‘0’ at the end
of slave reception.
2:
Automatically cleared to ‘0’ at the beginning of slave transmission.
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bit 7
GCEN:
General Call Enable bit (I
2
C Slave mode only)
1 = Enables interrupt when a general call address is received in I2CxRSR; module is enabled for reception
0 = General call address is disabled.
bit 6
STREN:
SCLx Clock Stretch Enable bit
In I
2
C Slave mode only, used in conjunction with the SCLREL bit.
1 = Enables clock stretching
0 = Disables clock stretching
bit 5
ACKDT:
Acknowledge Data bit
In I
2
C Master mode, during Master Receive mode. The value that will be transmitted when the user
initiates an Acknowledge sequence at the end of a receive.
In I
2
C Slave mode when AHEN = 1 or DHEN = 1. The value that the slave will transmit when it initiates
an Acknowledge sequence at the end of an address or data reception.
1 = NACK is sent
0 = ACK is sent
bit 4
ACKEN:
Acknowledge Sequence Enable bit
In I
2
C Master mode only; applicable during Master Receive mode.
1 = Initiates Acknowledge sequence on SDAx and SCLx pins, and transmits ACKDT data bit
0 = Acknowledge sequence is Idle
bit 3
RCEN:
Receive Enable bit (I
2
C Master mode only)
1 = Enables Receive mode for I
2
C, automatically cleared by hardware at the end of 8-bit receive data byte
0 = Receive sequence is not in progress
bit 2
PEN:
Stop Condition Enable bit (I
2
C Master mode only)
1 = Initiates Stop condition on SDAx and SCLx pins
0 = Stop condition is Idle
bit 1
RSEN:
Restart Condition Enable bit (I
2
C Master mode only)
1 = Initiates Restart condition on SDAx and SCLx pins
0 = Restart condition is Idle
bit 0
SEN:
Start Condition Enable bit (I
2
C Master mode only)
1 = Initiates Start condition on SDAx and SCLx pins
0 = Start condition is Idle
REGISTER 19-1: I2CxCON1: I2Cx CONTROL REGISTER 1 (CONTINUED)
Note 1:
Automatically cleared to ‘0’ at the beginning of slave transmission; automatically cleared to ‘0’ at the end
of slave reception.
2:
Automatically cleared to ‘0’ at the beginning of slave transmission.
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REGISTER 19-2: I2CxCON2: I2Cx CONTROL REGISTER 2
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7
Unimplemented:
Read as ‘0’
bit 6
PCIE:
Stop Condition Interrupt Enable bit (I
2
C Slave mode only)
1 = Enables interrupt on detection of Stop condition
0 = Stop detection interrupts are disabled
bit 5
SCIE:
Start Condition Interrupt Enable bit (I
2
C Slave mode only)
1 = Enables interrupt on detection of Start or Restart conditions
0 = Start detection interrupts are disabled
bit 4
BOEN:
Buffer Overwrite Enable bit (I
2
C Slave mode only)
1 = The I2CxRCV register bit is updated and an ACK is generated for a received address/data byte,
ignoring the state of the I2COV bit only if the RBF bit = 0
0 = The I2CxRCV register bit is only updated when I2COV is clear
bit 3
SDAHT:
SDAx Hold Time Selection bit
1 = Minimum of 300 ns hold time on SDAx after the falling edge of SCLx
0 = Minimum of 100 ns hold time on SDAx after the falling edge of SCLx
bit 2
SBCDE:
Slave Mode Bus Collision Detect Enable bit (I
2
C Slave mode only)
If, on the rising edge of SCLx, SDAx is sampled low when the module is outputting a high state, the
BCL bit is set and the bus goes Idle. This Detection mode is only valid during data and ACK transmit
sequences.
1 = Slave bus collision interrupts are enabled
0 = Slave bus collision interrupts are disabled
bit 1
AHEN:
Address Hold Enable bit (I
2
C Slave mode only)
1 = Following the 8
th
falling edge of SCLx for a matching received address byte; the SCLREL bit
(I2CxCON1<12>) will be cleared and the SCLx will be held low
0 = Address holding is disabled
bit 0
DHEN:
Data Hold Enable bit (I
2
C Slave mode only)
1 = Following the 8
th
falling edge of SCLx for a received data byte; slave hardware clears the SCLREL
bit (I2CxCON1<12>) and the SCLx is held low
0 = Data holding is disabled
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REGISTER 19-3: I2CxSTAT: I2Cx STATUS REGISTER
HSC/R-0 HSC/R-0 HSC/R-0 U-0 U-0 HSC/R/C-0 HSC/R-0 HSC/R-0
ACKSTAT TRSTAT ACKTIM —— BCL GCSTAT ADD10
bit 15 bit 8
HS/R/C-0 HS/R/C-0 HSC/R-0 HSC/R/C-0 HSC/R/C-0 HSC/R-0 HSC/R-0 HSC/R-0
IWCOL I2COV D_A P S R_W RBF TBF
bit 7 bit 0
Legend:
C = Clearable bit HSC = Hardware Settable/Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared HS = Hardware Settable bit
bit 15
ACKSTAT:
Acknowledge Status bit (updated in all Master and Slave modes)
1 = Acknowledge was not received from slave
0 = Acknowledge was received from slave
bit 14
TRSTAT:
Transmit Status bit (when operating as I
2
C master; applicable to master transmit operation)
1 = Master transmit is in progress (8 bits + ACK)
0 = Master transmit is not in progress
bit 13
ACKTIM:
Acknowledge Time Status bit (valid in I
2
C Slave mode only)
1 = Indicates I
2
C bus is in an Acknowledge sequence, set on 8
th
falling edge of SCLx clock
0 = Not an Acknowledge sequence, cleared on 9
th
rising edge of SCLx clock
bit 12-11
Unimplemented:
Read as ‘0’
bit 10
BCL:
Bus Collision Detect bit (Master/Slave mode; cleared when I
2
C module is disabled, I2CEN = 0)
1 = A bus collision has been detected during a master or slave transmit operation
0 = Bus collision has not been detected
bit 9
GCSTAT:
General Call Status bit (cleared after Stop detection)
1 = General call address was received
0 = General call address was not received
bit 8
ADD10:
10-Bit Address Status bit (cleared after Stop detection)
1 = 10-bit address was matched
0 = 10-bit address was not matched
bit 7
IWCOL:
Write Collision Detect bit
1 = An attempt to write to the I2CxTRN register failed because the I
2
C module is busy; must be cleared
in software
0 = Collision has not occurred
bit 6
I2COV:
I2Cx Receive Overflow Flag bit
1 = A byte was received while the I2CxRCV register is still holding the previous byte; I2COV is a “don’t
care” in Transmit mode, must be cleared in software
0 = Overflow has not occurred
bit 5
D_A:
Data/Address bit (when operating as I
2
C slave)
1 = Indicates that the last byte received was data
0 = Indicates that the last byte received or transmitted was an address
bit 4
P:
I2Cx Stop bit
Updated when Start, Reset or Stop is detected; cleared when the I
2
C module is disabled, I2CEN = 0.
1 = Indicates that a Stop bit has been detected last
0 = Indicates that a Stop bit was not detected last
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bit 3
S:
I2Cx Start bit
Updated when Start, Reset or Stop is detected; cleared when the I
2
C module is disabled, I2CEN = 0.
1 = Indicates that a Start (or Repeated Start) bit has been detected last
0 = Indicates that a Start bit was not detected last
bit 2
R_W:
Read/Write Information bit (when operating as I
2
C slave)
1 = Read: Indicates that the data transfer is output from the slave
0 = Write: Indicates that the data transfer is input to the slave
bit 1
RBF:
Receive Buffer Full Status bit
1 = Receive is complete, the I2CxRCV bit is full
0 = Receive is not complete, the I2CxRCV bit is empty
bit 0
TBF:
Transmit Buffer Full Status bit
1 = Transmit is in progress, I2CxTRN is full (8 bits of data)
0 = Transmit is complete, I2CxTRN is empty
REGISTER 19-4: I2CxMSK: I2Cx SLAVE MODE ADDRESS MASK REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0
— — — — — — MSK<9:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
MSK<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10
Unimplemented:
Read as ‘0’
bit 9-0
MSK<9:0>:
I2Cx Mask for Address Bit x Select bits
1 = Enables masking for bit x of the incoming message address; bit match is not required in this position
0 = Disables masking for bit x; bit match is required in this position
REGISTER 19-3: I2CxSTAT: I2Cx STATUS REGISTER (CONTINUED)
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NOTES:
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dsPIC33EVXXXGM00X/10X FAMILY
20.0 SINGLE-EDGE NIBBLE
TRANSMISSION (SEN T)
20.1 Module Introduction
The Single-Edge Nibble Transmission (SENT) module is
based on the SAE J2716, “SENT – Single-Edge Nibble
Transmission for Automotive Applications”. The SENT
protocol is a one-way, single wire time modulated serial
communication, based on successive falling edges. It is
intended for use in applications where high-resolution
sensor data needs to be communicated from a sensor to
an Engine Control Unit (ECU).
The SENTx module has the following major features:
• Selectable Transmit or Receive mode
• Synchronous or Asynchronous Transmit modes
• Automatic Data Rate Synchronization
• Optional Automatic Detection of CRC Errors in
Receive mode
• Optional Hardware Calculation of CRC in
Transmit mode
• Support for Optional Pause Pulse Period
• Data Buffering for One Message Frame
• Selectable Data Length for Transmit/Receive from
Three to Six Nibbles
• Automatic Detection of Framing Errors
SENT protocol timing is based on a predetermined time
unit, T
TICK
. Both the transmitter and receiver must be
preconfigured for T
TICK
, which can vary from 3 to 90 µs.
A SENT message frame starts with a Sync pulse. The
purpose of the Sync pulse is to allow the receiver to cal-
culate the data rate of the message encoded by the
transmitter. The SENT specification allows messages
to be validated with up to a 20% variation in T
TICK
. This
allows for the transmitter and receiver to run from differ-
ent clocks that may be inaccurate, and drift with time
and temperature. The data nibbles are four bits in
length and are encoded as the data value + 12 ticks.
This yields a 0 value of 12 ticks and the maximum
value, 0xF, of 27 ticks.
A SENT message consists of the following:
• A synchronization/calibration period of 56 tick
times
• A status nibble of 12-27 tick times
• Up to six data nibbles of 12-27 tick times
• A CRC nibble of 12-27 tick times
• An optional pause pulse period of 12-768 tick
times
Figure 20-1 shows a block diagram of the SENTx
module.
Figure 20-2 shows the construction of a typical 6-nibble
data frame, with the numbers representing the minimum
or maximum number of tick times for each section.
Note 1:
This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To com-
plement the information in this data sheet,
refer to
“Single-Edge Nibble Transmis-
sion (SENT) Module”
(DS70005145) in
the “dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
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FIGURE 20-1: SENTx MODULE BLOCK DIAGRAM
FIGURE 20-2: SENTx PROTOCOL DATA FRAMES
SENTxCON3
SENTxCON2 SENTxSYNC
Sync Period
Nibble Period
Detector
SENTxDATH/L
Control and
Error Detection
SENTxSTATSENTxCON1
SENTx TX
Edge
Detect Detector
Edge
Timing
Output
Driver
Transmitter OnlyReceiver Only Shared
Legend:
SENTx RX
Tick Period
Generator
SENTx Edge
Control
Sync Period Status Data 1 Data 2 Data 3 Data 4 Data 5 Data 6 CRC Pause (optional)
56 12-27 12-2712-2712-2712-2712-2712-27 12-27 12-768
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20.2 Transmit Mode
By default, the SENTx module is configured for transmit
operation. The module can be configured for continuous
asynchronous message frame transmission, or alterna-
tively, for Synchronous mode triggered by software.
When enabled, the transmitter will send a Sync followed
by the appropriate number of data nibbles, an optional
CRC and optional pause pulse. The tick period used by
the SENTx transmitter is set by writing a value to the
TICKTIME<15:0> (SENTxCON2<15:0>) bits. The tick
period calculations are shown in Equation 20-1.
EQUATION 20- 1: TICK PERIOD
CALCULATION
An optional pause pulse can be used in Asynchronous
mode to provide a fixed message frame time period.
The frame period used by the SENTx transmitter is
set by writing a value to the FRAMETIME<15:0>
(SENTxCON3<15:0>) bits. The formulas used to
calculate the value of frame time are shown in
Equation 20-2.
EQUATION 20-2: FRAME TIME
CALCULATIONS
20.2.1 TRANSMIT MODE
CONFIGURATION
20.2.1.1 Initializing the SENTx Module:
Perform the following steps to initialize the module:
1. Write RCVEN (SENTxCON1<11>) = 0 for
Transmit mode.
2. Write TXM (SENTxCON1<10>) = 0 for
Asynchronous Transmit mode or TXM = 1 for
Synchronous mode.
3. Write NIBCNT<2:0> (SENTxCON1<2:0>) for
the desired data frame length.
4. Write CRCEN (SENTxCON1<8>) for hardware
or software CRC calculation.
5. Write PPP (SENTxCON1<7>) for optional
pause pulse.
6. If PPP = 1, write T
FRAME
to SENTxCON3.
7. Write SENTxCON2 with the appropriate value
for desired tick period.
8. Enable interrupts and set interrupt priority.
9. Write initial status and data values to
SENTxDATH/L.
10. If CRCEN = 0, calculate CRC and write the
value to CRC<3:0> (SENTxDATL<3:0>).
11. Set the SNTEN (SENTxCON1<15>) bit to
enable the module.
User software updates to SENTxDATH/L must be
performed after the completion of the CRC and before
the next message frame’s status nibble. The recom-
mended method is to use the message frame
completion interrupt to trigger data writes.
Note:
The module will not produce a pause
period with less than 12 ticks, regard-
less of the FRAMETIME<15:0> value.
FRAMETIME<15:0> values beyond 2047
will have no effect on the length of a data
frame.
T
TICK
T
CLK
TICKTIME<15:0> =– 1
Where:
T
FRAME
= Total time of the message from ms
N = The number of data nibbles in message, 1-6
FRAMETIME<15:0> = T
TICK
/T
FRAME
FRAMETIME<15:0> 122 + 27N
FRAMETIME<15:0> 848 + 12N
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20.3 Receive Mode
The module can be configured for receive operation
by setting the RCVEN (SENTxCON1<11>) bit.
The time between each falling edge is compared
to SYNCMIN<15:0> (SENTxCON3<15:0>) and
SYNCMAX<15:0> (SENTxCON2<15:0>), and if the
measured time lies between the minimum and maximum
limits, the module begins to receive data. The validated
Sync time is captured in the SENTxSYNC register and
the tick time is calculated. Subsequent falling edges are
verified to be within the valid data width and the data is
stored in the SENTxDATH/L register. An interrupt event
is generated at the completion of the message and the
user software should read the SENTx Data register
before the reception of the next nibble. The equation for
SYNCMIN<15:0> and SYNCMAX<15:0> is shown in
Equation 20-3.
EQUATION 20-3: SYNCMIN<15:0> AND
SYNCMAX<15:0>
CALCULATIONS
For T
TICK
= 3.0 s and F
CLK
= 4 MHz,
SYNCMIN<15:0> = 76.
20.3.1 RECEIVE MODE CONFIGURATION
20.3.1.1 Initializing the SENTx Module:
Perform the following steps to initialize the module:
1. Write RCVEN (SENTxCON1<11>) = 1 for
Receive mode.
2. Write NIBCNT<2:0> (SENTxCON1<2:0>) for
the desired data frame length.
3. Write CRCEN (SENTxCON1<8>) for hardware
or software CRC validation.
4. Write PPP (SENTxCON1<7>) = 1 if pause pulse
is present.
5. Write SENTxCON2 with the value of SYNCMAXx
(Nominal Sync Period + 20%).
6. Write SENTxCON3 with the value of SYNCMINx
(Nominal Sync Period – 20%).
7. Enable interrupts and set interrupt priority.
8. Set the SNTEN (SENTxCON1<15>) bit to
enable the module.
The data should be read from the SENTxDATH/L regis-
ter after the completion of the CRC and before the next
message frame’s status nibble. The recommended
method is to use the message frame completion
interrupt trigger.
Note:
To ensure a Sync period can be identified,
the value written to SYNCMIN<15:0>
must be less than the value written to
SYNCMAX<15:0>.
Where:
T
FRAME
= Total time of the message from ms
N = The number of data nibbles in message, 1-6
F
RCV
= F
CY
x prescaler
T
CLK
= F
CY
/Prescaler
FRAMETIME<15:0> 848 + 12N
T
TICK
= T
CLK
• (TICKTIME<15:0> + 1)
FRAMETIME<15:0> = T
TICK
/T
FRAME
SyncCount = 8 x F
RCV
x T
TICK
SYNCMIN<15:0> = 0.8 x SyncCount
SYNCMAX<15:0> = 1.2 x SyncCount
FRAMETIME<15:0> 122 + 27N
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REGISTER 20-1: SENTxCON1: SENTx CONTROL REGISTER 1
R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
SNTEN — SNTSIDL — RCVEN TXM
(1)
TXPOL
(1)
CRCEN
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0
PPP SPCEN
(2)
—PS— NIBCNT2 NIBCNT1 NIBCNT0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
SNTEN:
SENTx Enable bit
1 = SENTx is enabled
0 = SENTx is disabled
bit 14
Unimplemented:
Read as ‘0’
bit 13
SNTSIDL:
SENTx Stop in Idle Mode bit
1 = Discontinues module operation when the device enters Idle mode
0 = Continues module operation in Idle mode
bit 12
Unimplemented:
Read as ‘0’
bit 11
RCVEN:
SENTx Receive Enable bit
1 = SENTx operates as a receiver
0 = SENTx operates as a transmitter (sensor)
bit 10
TXM:
SENTx Transmit Mode bit
(1)
1 = SENTx transmits data frame only when triggered using the SYNCTXEN status bit
0 = SENTx transmits data frames continuously while SNTEN = 1
bit 9
TXPOL:
SENTx Transmit Polarity bit
(1)
1 = SENTx data output pin is low in the Idle state
0 = SENTx data output pin is high in the Idle state
bit 8
CRCEN:
CRC Enable bit
Module in Receive Mode (RCVEN = 1):
1 = SENTx performs CRC verification on received data using the preferred J2716 method
0 = SENTx does not perform CRC verification on received data
Module in Transmit Mode (RCVEN = 1):
1 = SENTx automatically calculates CRC using the preferred J2716 method
0 = SENTx does not calculate CRC
bit 7
PPP:
Pause Pulse Present bit
1 = SENTx is configured to transmit/receive SENT messages with pause pulse
0 = SENTx is configured to transmit/receive SENT messages without pause pulse
bit 6
SPCEN:
Short PWM Code Enable bit
(2)
1 = SPC control from external source is enabled
0 = SPC control from external source is disabled
bit 5
Unimplemented:
Read as ‘0’
bit 4
PS:
SENTx Module Clock Prescaler (divider) bits
1 = Divide-by-4
0 = Divide-by-1
Note 1:
This bit has no function in Receive mode (RCVEN = 1).
2:
This bit has no function in Transmit mode (RCVEN = 0).
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bit 3
Unimplemented:
Read as ‘0’
bit 2-0
NIBCNT<2:0>:
Nibble Count Control bits
111 = Reserved; do not use
110 = Module transmits/receives six data nibbles in a SENT data pocket
101 = Module transmits/receives five data nibbles in a SENT data pocket
100 = Module transmits/receives four data nibbles in a SENT data pocket
011 = Module transmits/receives three data nibbles in a SENT data pocket
010 = Module transmits/receives two data nibbles in a SENT data pocket
001 = Module transmits/receives one data nibble in a SENT data pocket
000 = Reserved; do not use
REGISTER 20-1: SENTxCON1: SENTx CONTROL REGISTER 1 (CONTINUED)
Note 1:
This bit has no function in Receive mode (RCVEN = 1).
2:
This bit has no function in Transmit mode (RCVEN = 0).
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REGISTER 20-2: SENTxSTAT: SENTx STATUS REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R/C-0 R-0 HC/R/W-0
PAUSE NIB2 NIB1 NIB0 CRCERR FRMERR RXIDLE SYNCTXEN
(1)
bit 7 bit 0
Legend:
C = Clearable bit HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Unimplemented:
Read as ‘0’
bit 7
PAUSE:
Pause Period Status bit
1 = The module is transmitting/receiving a pause period
0 = The module is not transmitting/receiving a pause period
bit 6-4
NIB<2:0>:
Nibble Status bit
Module in Transmit Mode (RCVEN = 0):
111 = Module is transmitting a CRC nibble
110 = Module is transmitting Data Nibble 6
101 = Module is transmitting Data Nibble 5
100 = Module is transmitting Data Nibble 4
011 = Module is transmitting Data Nibble 3
010 = Module is transmitting Data Nibble 2
001 = Module is transmitting Data Nibble 1
000 = Module is transmitting a status nibble or pause period, or is not transmitting
Module in Receive Mode (RCVEN = 1):
111 = Module is receiving a CRC nibble or was receiving this nibble when an error occurred
110 = Module is receiving Data Nibble 6 or was receiving this nibble when an error occurred
101 = Module is receiving Data Nibble 5 or was receiving this nibble when an error occurred
100 = Module is receiving Data Nibble 4 or was receiving this nibble when an error occurred
011 = Module is receiving Data Nibble 3 or was receiving this nibble when an error occurred
010 = Module is receiving Data Nibble 2 or was receiving this nibble when an error occurred
001 = Module is receiving Data Nibble 1 or was receiving this nibble when an error occurred
000 = Module is receiving a status nibble or waiting for Sync
bit 3
CRCERR:
CRC Status bit (Receive mode only)
1 = A CRC error occurred for the 1-6 data nibbles in SENTxDATH/L
0 = A CRC error has not occurred
bit 2
FRMERR:
Framing Error Status bit (Receive mode only)
1 = A data nibble was received with less than 12 tick periods or greater than 27 tick periods
0 = Framing error has not occurred
bit 1
RXIDLE:
SENTx Receiver Idle Status bit (Receive mode only)
1 = The SENTx data bus has been Idle (high) for a period of SYNCMAX<15:0> or greater
0 = The SENTx data bus is not Idle
Note 1:
In Receive mode (RCVEN = 1), the SYNCTXEN bit is read-only.
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bit 0
SYNCTXEN:
SENTx Synchronization Period Status/Transmit Enable bit
(1)
Module in Receive Mode (RCVEN = 1):
1 = A valid synchronization period was detected; the module is receiving nibble data
0 = No synchronization period has been detected; the module is not receiving nibble data
Module in Asynchronous Transmit Mode (RCVEN = 0, TXM = 0):
The bit always reads as ‘1’ when the module is enabled, indicating the module transmits SENTx data
frames continuously. The bit reads ‘0’ when the module is disabled.
Module in Synchronous Transmit Mode (RCVEN = 0, TXM = 1):
1 = The module is transmitting a SENTx data frame
0 = The module is not transmitting a data frame, user software may set SYNCTXEN to start another
data frame transmission
REGISTER 20-2: SENTxSTAT: SENTx STATUS REGISTER (CONTINUED)
Note 1:
In Receive mode (RCVEN = 1), the SYNCTXEN bit is read-only.
2013-2018 Microchip Technology Inc. DS70005144G-page 247
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 20-3: SENTxDATL: SENTx RECEIVE DATA REGISTER LOW
(1)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DATA4<3:0> DATA5<3:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DATA6<3:0> CRC<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
DATA4<3:0>:
Data Nibble 4 Data bits
bit 11-8
DATA5<3:0>:
Data Nibble 5 Data bits
bit 7-4
DATA6<3:0>:
Data Nibble 6 Data bits
bit 3-0
CRC<3:0>:
CRC Nibble Data bits
Note 1:
Register bits are read-only in Receive mode (RCVEN = 1). In Transmit mode, the CRC<3:0> bits are
read-only when automatic CRC calculation is enabled (RCVEN = 0, CRCEN = 1).
REGISTER 20-4: SENTxDATH: SENTx RECEIVE DATA REGISTER HIGH
(1)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
STAT<3:0> DATA1<3:0>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
DATA2<3:0> DATA3<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
STAT<3:0>:
Status Nibble Data bits
bit 11-8
DATA1<3:0>:
Data Nibble 1 Data bits
bit 7-4
DATA2<3:0>:
Data Nibble 2 Data bits
bit 3-0
DATA3<3:0>:
Data Nibble 3 Data bits
Note 1:
Register bits are read-only in Receive mode (RCVEN = 1). In Transmit mode, the CRC<3:0> bits are
read-only when automatic CRC calculation is enabled (RCVEN = 0, CRCEN = 1).
dsPIC33EVXXXGM00X/10X FAMILY
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NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 249
dsPIC33EVXXXGM00X/10X FAMILY
21.0 UNIVERSAL ASYNCHRONOUS
RECEIVER TRANSMITTER
(UART)
The dsPIC33EVXXXGM00X/10X family of devices
contains two UART modules.
The Universal Asynchronous Receiver Transmitter
(UART) module is one of the serial I/O modules
available in the dsPIC33EVXXXGM00X/10X device
family. The UART is a full-duplex, asynchronous
system that can communicate with peripheral devices,
such as personal computers, LIN/J2602, RS-232 and
RS-485 interfaces. The module also supports a
hardware flow control option with the UxCTS and
UxRTS pins, and also includes an IrDA
®
encoder and
decoder.
The primary features of the UARTx module are:
• Full-Duplex, 8 or 9-Bit Data Transmission through
the UxTX and UxRX Pins
• Even, Odd or No Parity Options (for 8-bit data)
• One or Two Stop Bits
• Hardware Flow Control Option with UxCTS and
UxRTS Pins
• Fully Integrated Baud Rate Generator with 16-Bit
Prescaler
• Baud Rates Ranging from 4.375 Mbps to 67 bps at
16x mode at 70 MIPS
• Baud Rates Ranging from 17.5 Mbps to 267 bps at
4x mode at 70 MIPS
• Four-Deep First-In First-Out (FIFO) Transmit Data
Buffer
• Four-Deep FIFO Receive Data Buffer
• Parity, Framing and Buffer Overrun Error Detection
• Support for 9-Bit mode with Address Detect
(9
th
bit = 1)
• Transmit and Receive Interrupts
• A Separate Interrupt for All UART Error Conditions
FIGURE 21-1: UARTx SIMPLIFIED BLOCK DIAGRAM
Note 1:
This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X
family of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to
“Universal Asynchro-
nous Receiver Transmitter (UART)”
(DS70000582) in the “dsPIC33/PIC24
Family Reference Manual”, which is
available from the Microchip web site
(www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
Note:
Hardware flow control using UxRTS and
UxCTS is not available on all pin count
devices. See the
“Pin Diagrams”
section
for availability.
UxRX
UARTx Receiver
UARTx Transmitter UxTX
Baud Rate Generator
UxRTS/BCLKx
UxCTS
IrDA®
Hardware Flow Control
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DS70005144G-page 250 2013-2018 Microchip Technology Inc.
21.1 UART Helpful Tips
1. In multi-node direct connect UART networks,
UART receive inputs react to the complementary
logic level defined by the URXINV bit
(UxMODE<4>), which defines the Idle state, the
default of which is logic high (i.e., URXINV = 0).
Because remote devices do not initialize at the
same time, it is likely that one of the devices,
because the RX line is floating, will trigger a Start
bit detection and will cause the first byte received,
after the device has been initialized, to be invalid.
To avoid this situation, the user should use a pull-
up or pull-down resistor on the RX pin, depending
on the value of the URXINV bit.
a) If URXINV = 0, use a pull-up resistor on the
RX pin.
b) If URXINV = 1, use a pull-down resistor on
the RX pin.
2. The first character received on wake-up from
Sleep mode, caused by activity on the UxRX pin
of the UART module, will be invalid. In Sleep
mode, peripheral clocks are disabled. By the
time the oscillator system has restarted and
stabilized from Sleep mode, the baud rate bit
sampling clock, relative to the incoming UxRX
bit timing, is no longer synchronized, resulting in
the first character being invalid. This is to be
expected.
2013-2018 Microchip Technology Inc. DS70005144G-page 251
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21.2 UART Control Registers
REGISTER 21-1: UxMODE: UART
x
MODE REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0
UARTEN
(1)
— USIDL IREN
(2)
RTSMD — UEN1 UEN0
bit 15 bit 8
HC/R/W-0 R/W-0 HC/R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WAKE LPBACK ABAUD URXINV BRGH PDSEL1 PDSEL0 STSEL
bit 7 bit 0
Legend:
HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
UARTEN:
UARTx Enable bit
(1)
1 = UARTx is enabled; all UARTx pins are controlled by UARTx as defined by UEN<1:0>
0 = UARTx is disabled; all UARTx pins are controlled by PORT latches; UARTx power consumption
is minimal
bit 14
Unimplemented:
Read as ‘0’
bit 13
USIDL:
UARTx Stop in Idle Mode bit
1 = Discontinues module operation when the device enters Idle mode
0 = Continues module operation in Idle mode
bit 12
IREN:
IrDA
®
Encoder and Decoder Enable bit
(2)
1 = IrDA encoder and decoder are enabled
0 = IrDA encoder and decoder are disabled
bit 11
RTSMD:
Mode Selection for UxRTS Pin bit
1 =UxRTS
pin is in Simplex mode
0 =UxRTS
pin is in Flow Control mode
bit 10
Unimplemented:
Read as ‘0’
bit 9-8
UEN<1:0>:
UARTx Pin Enable bits
11 = UxTX, UxRX and BCLKx pins are enabled and used; UxCTS pin is controlled by PORT latches
(3)
10 = UxTX, UxRX, UxCTS and UxRTS pins are enabled and used
(4)
01 = UxTX, UxRX and UxRTS pins are enabled and used; UxCTS pin is controlled by PORT latches
(4)
00 = UxTX and UxRX pins are enabled and used; UxCTS and UxRTS/BCLKx pins are controlled by
PORT latches
bit 7
WAKE:
UARTx Wake-up on Start bit Detect During Sleep Mode Enable bit
1 = UARTx continues to sample the UxRX pin; interrupt is generated on the falling edge, bit is cleared
in hardware on the following rising edge
0 = Wake-up is not enabled
bit 6
LPBACK:
UARTx Loopback Mode Select bit
1 = Loopback mode is enabled
0 = Loopback mode is disabled
Note 1:
Refer to
“Universal Asynchr onou s Receiv er Transmitter (UA RT)”
(DS70000582) in the
“dsPIC33/PIC24 Family Reference Manual” for information on enabling the UART module for receive or
transmit operation.
2:
This feature is only available for the 16x BRG mode (BRGH = 0).
3:
This feature is only available on 44-pin and 64-pin devices.
4:
This feature is only available on 64-pin devices.
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bit 5
ABAUD:
Auto-Baud Enable bit
1 = Baud rate measurement on the next character is enabled – requires reception of a Sync field (55h)
before other data; cleared in hardware upon completion
0 = Baud rate measurement is disabled or has completed
bit 4
URXINV:
UARTx Receive Polarity Inversion bit
1 = UxRX Idle state is ‘0’
0 = UxRX Idle state is ‘1’
bit 3
BRGH:
High Baud Rate Enable bit
1 = BRG generates four clocks per bit period (4x baud clock, High-Speed mode)
0 = BRG generates sixteen clocks per bit period (16x baud clock, Standard mode)
bit 2-1
PDSEL<1:0>:
Parity and Data Selection bits
11 = 9-bit data, no parity
10 = 8-bit data, odd parity
01 = 8-bit data, even parity
00 = 8-bit data, no parity
bit 0
STSEL:
Stop Bit Selection bit
1 = Two Stop bits
0 = One Stop bit
REGISTER 21-1: UxMODE: UART
x
MODE REGISTER (CONTINUED)
Note 1:
Refer to
“Universal Asynchr onou s Receiv er Transmitter (UA RT)”
(DS70000582) in the
“dsPIC33/PIC24 Family Reference Manual” for information on enabling the UART module for receive or
transmit operation.
2:
This feature is only available for the 16x BRG mode (BRGH = 0).
3:
This feature is only available on 44-pin and 64-pin devices.
4:
This feature is only available on 64-pin devices.
2013-2018 Microchip Technology Inc. DS70005144G-page 253
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 21-2: U
x
STA: UART
x
STATUS AND CONTROL REGISTER
R/W-0 R/W-0 R/W-0 U-0 HC/R/W-0 R/W-0 R-0 R-1
UTXISEL1 UTXINV UTXISEL0 — UTXBRK UTXEN
(1)
UTXBF TRMT
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R-1 R-0 R-0 R/C-0 R-0
URXISEL1 URXISEL0 ADDEN RIDLE PERR FERR OERR URXDA
bit 7 bit 0
Legend:
C = Clearable bit HC = Hardware Clearable bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15,13
UTXISEL<1:0>:
UARTx
Transmission Interrupt Mode Selection bits
11 = Reserved; do not use
10 = Interrupt when a character is transferred to the Transmit Shift Register (TSR), and as a result,
the transmit buffer becomes empty
01 = Interrupt when the last character is shifted out of the Transmit Shift Register; all transmit
operations are completed
00 = Interrupt when a character is transferred to the Transmit Shift Register (this implies there is at
least one character open in the transmit buffer)
bit 14
UTXINV:
UARTx Transmit Polarity Inversion bit
If IREN = 0:
1 = UxTX Idle state is ‘0’
0 = UxTX Idle state is ‘1’
If IREN = 1:
1 =IrDA
®
encoded UxTX Idle state is ‘1’
0 = IrDA encoded UxTX Idle state is ‘0’
bit 12
Unimplemented:
Read as ‘0’
bit 11
UTXBRK:
UARTx Transmit Break bit
1 = Sends Sync Break on next transmission – Start bit, followed by twelve ‘0’ bits, followed by Stop
bit; cleared by hardware upon completion
0 = Sync Break transmission is disabled or has completed
bit 10
UTXEN:
UARTx Transmit Enable bit
(1)
1 = Transmit is enabled, UxTX pin is controlled by UARTx
0 = Transmit is disabled, any pending transmission is aborted and the buffer is reset; UxTX pin is
controlled by the PORT
bit 9
UTXBF:
UARTx Transmit Buffer Full Status bit (read-only)
1 = Transmit buffer is full
0 = Transmit buffer is not full, at least one more character can be written
bit 8
TRMT:
Transmit Shift Register (TSR) Empty bit (read-only)
1 = Transmit Shift Register is empty and transmit buffer is empty (the last transmission has completed)
0 = Transmit Shift Register is not empty, a transmission is in progress or queued
bit 7-6
URXISEL<1:0>:
UARTx
Receive Interrupt Mode Selection bits
11 = Interrupt is set on UxRSR transfer, making the receive buffer full (i.e., has four data characters)
10 = Interrupt is set on UxRSR transfer, making the receive buffer 3/4 full (i.e., has three data characters)
0x = Interrupt is set when any character is received and transferred from the UxRSR to the receive
buffer; receive buffer has one or more characters
Note 1:
Refer to
“Universal A synchr onou s Receiv er Transmitter ( UAR T)”
(DS70000582) in the “dsPIC33/
PIC24 Family Reference Manual” for information on enabling the UART module for transmit operation.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 254 2013-2018 Microchip Technology Inc.
bit 5
ADDEN:
Address Character Detect bit (bit 8 of received data = 1)
1 = Address Detect mode is enabled; if 9-bit mode is not selected, this does not take effect
0 = Address Detect mode is disabled
bit 4
RIDLE:
Receiver Idle bit (read-only)
1 = Receiver is Idle
0 = Receiver is active
bit 3
PERR:
Parity Error Status bit (read-only)
1 = Parity error has been detected for the current character (character at the top of the receive FIFO)
0 = Parity error has not been detected
bit 2
FERR:
Framing Error Status bit (read-only)
1 = Framing error has been detected for the current character (character at the top of the receive
FIFO)
0 = Framing error has not been detected
bit 1
OERR:
Receive Buffer Overrun Error Status bit (clear/read-only)
1 = Receive buffer has overflowed
0 = Receive buffer has not overflowed; clearing a previously set OERR bit (10 transition) resets
the receive buffer and the UxRSR to the empty state
bit 0
URXDA:
UARTx Receive Buffer Data Available bit (read-only)
1 = Receive buffer has data, at least one more character can be read
0 = Receive buffer is empty
REGISTER 21-2: U
x
STA: UART
x
STATUS AND CONTROL REGISTER (CONTINUED)
Note 1:
Refer to
“Universal A synchr onou s Receiv er Transmitter (UAR T)”
(DS70000582) in the “dsPIC33/
PIC24 Family Reference Manual” for information on enabling the UART module for transmit operation.
2013-2018 Microchip Technology Inc. DS70005144G-page 255
dsPIC33EVXXXGM00X/10X FAMILY
22.0 CONTROLLER AREA
NETWORK (CAN) MODULE
(dsPIC33EVXXXGM10X
DEVICES ONLY)
22.1 Overview
The Controller Area Network (CAN) module is a serial
interface, useful for communicating with other CAN
modules or microcontroller devices. This interface/
protocol was designed to allow communications within
noisy environments. The dsPIC33EVXXXGM10X
devices contain one CAN module.
The CAN module is a communication controller imple-
menting the CAN 2.0 A/B protocol, as defined in the
BOSCH CAN specification. The module supports
CAN 1.2, CAN 2.0A, CAN 2.0B Passive and CAN 2.0B
Active versions of the protocol. The module implemen-
tation is a full CAN system. The CAN specification is
not covered within this data sheet. The reader can refer
to the BOSCH CAN specification for further details.
The CAN module features are as follows:
• Implementation of the CAN Protocol, CAN 1.2,
CAN2.0A and CAN2.0B
• Standard and Extended Data Frames
• 0 to 8-Byte Data Length
• Programmable Bit Rate, up to 1 Mbit/sec
• Automatic Response to Remote Transmission
Requests
• Up to Eight Transmit Buffers with Application
Specified Prioritization and Abort Capability (each
buffer can contain up to 8 bytes of data)
• Up to 32 Receive Buffers (each buffer can contain
up to 8 bytes of data)
• Up to 16 Full (Standard/Extended Identifier)
Acceptance Filters
• Three Full Acceptance Filter Masks
• DeviceNet™ Addressing Support
• Programmable Wake-up Functionality with
Integrated Low-Pass Filter
• Programmable Loopback Mode Supports
Self-Test Operation
• Signaling through Interrupt Capabilities for All
CAN Receiver and Transmitter Error States
• Programmable Clock Source
• Programmable Link to Input Capture 2 (IC2)
module for Timestamping and Network
Synchronization
• Low-Power Sleep and Idle Modes
The CAN bus module consists of a protocol engine and
message buffering/control. The CAN protocol engine
handles all functions for receiving and transmitting
messages on the CAN bus. Messages are transmitted
by first loading the appropriate data registers. Status
and errors can be checked by reading the appropriate
registers. Any message detected on the CAN bus is
checked for errors, and then matched against filters to
see if it should be received and stored in one of the
Receive registers.
Figure 22-1 shows a block diagram of the CANx
module.
Note 1:
This data sheet summarizes the features of
the dsPIC33EVXXXGM00X/10X family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to
“Enhanced Controller
Area Network (ECAN™)”
(DS70353) in
the “dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 256 2013-2018 Microchip Technology Inc.
FIGURE 22-1: CANx MODULE BLOCK DIAGRAM
22.2 Modes of Operation
The CANx module can operate in one of several
operation modes selected by the user. These modes
include:
• Initialization mode
• Disable mode
• Normal Operation mode
• Listen Only mode
• Listen All Messages mode
• Loopback mode
Modes are requested by setting the REQOP<2:0> bits
(CxCTRL1<10:8>). Entry into a mode is Acknowledged
by monitoring the OPMODE<2:0> bits (CxCTRL1<7:5>).
The module does not change the mode and the
OPMODEx bits until a change in mode is acceptable,
generally during bus Idle time, which is defined as at least
eleven consecutive recessive bits.
Message Assembly
CAN Protocol
Engine
CxTx
Buffer
CxRx
RxF14 Filter
RxF13 Filter
RxF12 Filter
RxF11 Filter
RxF10 Filter
RxF9 Filter
RxF8 Filter
RxF7 Filter
RxF6 Filter
RxF5 Filter
RxF4 Filter
RxF3 Filter
RxF2 Filter
RxF1 Filter
RxF0 Filter
Transmit Byte
Sequencer
RxM1 Mask
RxM0 Mask
Control
Configuration
Logic
CPU
Bus
Interrupts
TRB0 TX/RX Buffer Control Register
RxF15 Filter
RxM2 Mask
TRB7 TX/RX Buffer Control Register
TRB6 TX/RX Buffer Control Register
TRB5 TX/RX Buffer Control Register
TRB4 TX/RX Buffer Control Register
TRB3 TX/RX Buffer Control Register
TRB2 TX/RX Buffer Control Register
TRB1 TX/RX Buffer Control Register
DMA Controller
Control
2013-2018 Microchip Technology Inc. DS70005144G-page 257
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22.3 CAN Control Registers
REGISTER 22-1: CxCTRL1: CANx CONTROL REGISTER 1
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-1 R/W-0 R/W-0
—— CSIDL ABAT CANCKS REQOP2 REQOP1 REQOP0
bit 15 bit 8
R-1 R-0 R-0 U-0 R/W-0 U-0 U-0 R/W-0
OPMODE2 OPMODE1 OPMODE0 — CANCAP ——WIN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13
CSIDL:
CANx Stop in Idle Mode bit
1 = Discontinues module operation when the device enters Idle mode
0 = Continues module operation in Idle mode
bit 12
ABAT:
Abort All Pending Transmissions bit
1 = Signals all transmit buffers to abort transmission
0 = Module will clear this bit when all transmissions are aborted
bit 11
CANCKS:
CANx Module Clock (F
CAN
) Source Select bit
1 = F
CAN
is equal to 2 * F
P
0 = F
CAN
is equal to F
P
bit 10-8
REQOP<2:0>:
Request Operation Mode bits
111 = Sets Listen All Messages mode
110 = Reserved
101 = Reserved
100 = Sets Configuration mode
011 = Sets Listen Only mode
010 = Sets Loopback mode
001 = Sets Disable mode
000 = Sets Normal Operation mode
bit 7-5
OPMODE<2:0>
: Operation Mode bits
111 = Module is in Listen All Messages mode
110 = Reserved
101 = Reserved
100 = Module is in Configuration mode
011 = Module is in Listen Only mode
010 = Module is in Loopback mode
001 = Module is in Disable mode
000 = Module is in Normal Operation mode
bit 4
Unimplemented:
Read as ‘0’
bit 3
CANCAP:
CANx Message Receive Timer Capture Event Enable bit
1 = Enables input capture based on CAN message receive
0 = Disables CAN capture
bit 2-1
Unimplemented:
Read as ‘0’
bit 0
WIN:
SFR Map Window Select
bit
1 = Uses filter window
0 = Uses buffer window
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REGISTER 22-2: CxCTRL2: CANx CONTROL REGISTER 2
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 U-0 U-0 R-0 R-0 R-0 R-0 R-0
— — — DNCNT<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-5
Unimplemented:
Read as ‘0’
bit 4-0
DNCNT<4:0>:
DeviceNet™ Filter Bit Number bits
10010-11111 = Invalid selection
10001 = Compare up to Data Byte 3, bit 6 with EID<17>
•
•
•
00001 = Compare up to Data Byte 1, bit 7 with EID<0>
00000 = Do not compare data bytes
2013-2018 Microchip Technology Inc. DS70005144G-page 259
dsPIC33EVXXXGM00X/10X FAMILY
REGISTER 22-3: CxVEC: CANx INTERRUPT CODE REGISTER
U-0 U-0 U-0 R-0 R-0 R-0 R-0 R-0
— — — FILHIT4 FILHIT3 FILHIT2 FILHIT1 FILHIT0
bit 15 bit 8
U-0 R-1 R-0 R-0 R-0 R-0 R-0 R-0
— ICODE6 ICODE5 ICODE4 ICODE3 ICODE2 ICODE1 ICODE0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13
Unimplemented:
Read as ‘0’
bit 12-8
FILHIT<4:0>:
Filter Hit Number bits
10000-11111 = Reserved
01111 = Filter 15
•
•
•
00001 = Filter 1
00000 = Filter 0
bit 7
Unimplemented:
Read as ‘0’
bit 6-0
ICODE<6:0>:
Interrupt Flag Code bits
1000101-1111111 = Reserved
1000100 = FIFO almost full interrupt
1000011 = Receiver overflow interrupt
1000010 = Wake-up interrupt
1000001 = Error interrupt
1000000 = No interrupt
•
•
•
0010000-0111111 = Reserved
0001111 = RB15 buffer interrupt
•
•
•
0001001 = RB9 buffer interrupt
0001000 = RB8 buffer interrupt
0000111 = TRB7 buffer interrupt
0000110 = TRB6 buffer interrupt
0000101 = TRB5 buffer interrupt
0000100 = TRB4 buffer interrupt
0000011 = TRB3 buffer interrupt
0000010 = TRB2 buffer interrupt
0000001 = TRB1 buffer interrupt
0000000 = TRB0 Buffer interrupt
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REGISTER 22-4: CxFCTRL: CANx FIFO CONTROL REGISTER
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 U-0 U-0
DMABS2 DMABS1 DMABS0 — — — — —
bit 15 bit 8
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— FSA5 FSA4 FSA3 FSA2 FSA1 FSA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13
DMABS<2:0>:
DMA Buffer Size bits
111 = Reserved
110 = 32 buffers in RAM
101 = 24 buffers in RAM
100 = 16 buffers in RAM
011 = 12 buffers in RAM
010 = 8 buffers in RAM
001 = 6 buffers in RAM
000 = 4 buffers in RAM
bit 12-6
Unimplemented:
Read as ‘0’
bit 5-0
FSA<5:0>:
FIFO Area Starts with Buffer bits
11111 = Receive Buffer RB31
11110 = Receive Buffer RB30
•
•
•
00001 = TX/RX Buffer TRB1
00000 = TX/RX Buffer TRB0
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REGISTER 22-5: CxFIFO: CANx FIFO STATUS REGISTER
U-0 U-0 R-0 R-0 R-0 R-0 R-0 R-0
—— FBP5 FBP4 FBP3 FBP2 FBP1 FBP0
bit 15 bit 8
U-0 U-0 R-0 R-0 R-0 R-0 R-0 R-0
—— FNRB5 FNRB4 FNRB3 FNRB2 FNRB1 FNRB0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13-8
FBP<5:0>:
FIFO Buffer Pointer bits
011111 = RB31 buffer
011110 = RB30 buffer
•
•
•
000001 = TRB1 buffer
000000 = TRB0 buffer
bit 7-6
Unimplemented:
Read as ‘0’
bit 5-0
FNRB<5:0>:
FIFO Next Read Buffer Pointer bits
011111 = RB31 buffer
011110 = RB30 buffer
•
•
•
000001 = TRB1 buffer
000000 = TRB0 buffer
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REGISTER 22-6: CxINTF: CANx INTERRUPT FLAG REGISTER
U-0 U-0 R-0 R-0 R-0 R-0 R-0 R-0
—— TXBO TXBP RXBP TXWAR RXWAR EWARN
bit 15 bit 8
R/C-0 R/C-0 R/C-0 U-0 R/C-0 R/C-0 R/C-0 R/C-0
IVRIF WAKIF ERRIF — FIFOIF RBOVIF RBIF TBIF
bit 7 bit 0
Legend:
C = Writable bit, but only ‘0’ can be written to clear the bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
Unimplemented:
Read as ‘0’
bit 13
TXBO:
Transmitter in Error State Bus Off bit
1 = Transmitter is in Bus Off state
0 = Transmitter is not in Bus Off state
bit 12
TXBP:
Transmitter in Error State Bus Passive bit
1 = Transmitter is in Bus Passive state
0 = Transmitter is not in Bus Passive state
bit 11
RXBP:
Receiver in Error State Bus Passive bit
1 = Receiver is in Bus Passive state
0 = Receiver is not in Bus Passive state
bit 10
TXWAR:
Transmitter in Error State Warning bit
1 = Transmitter is in Error Warning state
0 = Transmitter is not in Error Warning state
bit 9
RXWAR:
Receiver in Error State Warning bit
1 = Receiver is in Error Warning state
0 = Receiver is not in Error Warning state
bit 8
EWARN:
Transmitter or Receiver in Error State Warning bit
1 = Transmitter or receiver is in Error Warning state
0 = Transmitter or receiver is not in Error Warning state
bit 7
IVRIF:
Invalid Message Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 6
WAKIF:
Bus Wake-up Activity Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 5
ERRIF:
Error Interrupt Flag bit (multiple sources in CxINTF<13:8> register)
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 4
Unimplemented:
Read as ‘0’
bit 3
FIFOIF:
FIFO Almost Full Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 2
RBOVIF:
RX Buffer Overflow Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
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bit 1
RBIF:
RX Buffer Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
bit 0
TBIF:
TX Buffer Interrupt Flag bit
1 = Interrupt request has occurred
0 = Interrupt request has not occurred
REGISTER 22-6: CxINTF: CANx INTERRUPT FLAG REGISTER (CONTINUED)
REGISTER 22-7: CxINTE: CANx INTERRUPT ENABLE REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
IVRIE WAKIE ERRIE — FIFOIE RBOVIE RBIE TBIE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Unimplemented:
Read as ‘0’
bit 7
IVRIE:
Invalid Message Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 6
WAKIE:
Bus Wake-up Activity Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 5
ERRIE:
Error Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 4
Unimplemented:
Read as ‘0’
bit 3
FIFOIE:
FIFO Almost Full Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 2
RBOVIE:
RX Buffer Overflow Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 1
RBIE:
RX Buffer Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
bit 0
TBIE:
TX Buffer Interrupt Enable bit
1 = Interrupt request is enabled
0 = Interrupt request is not enabled
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REGISTER 22-8: CxEC: CANx TRANSMIT/RECEIVE ERROR COUNT REGISTER
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
TERRCNT<7:0>
bit 15 bit 8
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
RERRCNT<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
TERRCNT<7:0>:
Transmit Error Count bits
bit 7-0
RERRCNT<7:0>:
Receive Error Count bits
REGISTER 22-9: CxCFG1: CANx BAUD RATE CONFIGURATION REGISTER 1
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SJW1 SJW0 BRP5 BRP4 BRP3 BRP2 BRP1 BRP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Unimplemented:
Read as ‘0’
bit 7-6
SJW<1:0>:
Synchronization Jump Width bits
11 = Length is 4 x T
Q
10 = Length is 3 x T
Q
01 = Length is 2 x T
Q
00 = Length is 1 x T
Q
bit 5-0
BRP<5:0>:
Baud Rate Prescaler bits
11 1111 = T
Q
= 2 x 64 x 1/F
CAN
•
•
•
00 0010 = T
Q
= 2 x 3 x 1/F
CAN
00 0001 = T
Q
= 2 x 2 x 1/F
CAN
00 0000 = T
Q
= 2 x 1 x 1/F
CAN
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REGISTER 22-10: CxCFG2: CANx BAUD RATE CONFIGURATION REGISTER 2
U-0 R/W-x U-0 U-0 U-0 R/W-x R/W-x R/W-x
— WAKFIL — — — SEG2PH2 SEG2PH1 SEG2PH0
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
SEG2PHTS SAM SEG1PH2 SEG1PH1 SEG1PH0 PRSEG2 PRSEG1 PRSEG0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
Unimplemented:
Read as ‘0’
bit 14
WAKFIL:
Select CAN Bus Line Filter for Wake-up bit
1 = Uses CAN bus line filter for wake-up
0 = CAN bus line filter is not used for wake-up
bit 13-11
Unimplemented:
Read as ‘0’
bit 10-8
SEG2PH<2:0>:
Phase Segment 2 bits
111 = Length is 8 x T
Q
•
•
•
000 = Length is 1 x T
Q
bit 7
SEG2PHTS:
Phase Segment 2 Time Select bit
1 = Freely programmable
0 = Maximum of SEG1PH<2:0> bits or Information Processing Time (IPT), whichever is greater
bit 6
SAM:
Sample of the CAN Bus Line bit
1 = Bus line is sampled three times at the sample point
0 = Bus line is sampled once at the sample point
bit 5-3
SEG1PH<2:0>:
Phase Segment 1 bits
111 = Length is 8 x T
Q
•
•
•
000 = Length is 1 x T
Q
bit 2-0
PRSEG<2:0>:
Propagation Time Segment bits
111 = Length is 8 x T
Q
•
•
•
000 = Length is 1 x T
Q
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REGISTER 22-11: CxFEN1: CANx ACCEPTANCE FILTER ENABLE REGISTER 1
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
FLTEN<15:8>
bit 15 bit 8
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
FLTEN<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
FLTEN<15:0>:
Enable Filter n to Accept Messages bits
1 = Enables Filter n
0 = Disables Filter n
REGISTER 22-12: CxBUFPNT1: CANx FILTERS 0-3 BUFFER POINTER REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F3BP3 F3BP2 F3BP1 F3BP0 F2BP3 F2BP2 F2BP1 F2BP0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F1BP3 F1BP2 F1BP1 F1BP0 F0BP3 F0BP2 F0BP1 F0BP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
F3BP<3:0>:
RX Buffer Mask for Filter 3 bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 11-8
F2BP<3:0>:
RX Buffer Mask for Filter 2 bits (same values as bits 15-12)
bit 7-4
F1BP<3:0>:
RX Buffer Mask for Filter 1 bits (same values as bits 15-12)
bit 3-0
F0BP<3:0>:
RX Buffer Mask for Filter 0 bits (same values as bits 15-12)
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REGISTER 22-13: CxBUFPNT2: CANx FILTERS 4-7 BUFFER POINTER REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F7BP3 F7BP2 F7BP1 F7BP0 F6BP3 F6BP2 F6BP1 F6BP0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F5BP3 F5BP2 F5BP1 F5BP0 F4BP3 F4BP2 F4BP1 F4BP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
F7BP<3:0>:
RX Buffer Mask for Filter 7 bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 11-8
F6BP<3:0>:
RX Buffer Mask for Filter 6 bits (same values as bits 15-12)
bit 7-4
F5BP<3:0>:
RX Buffer Mask for Filter 5 bits (same values as bits 15-12)
bit 3-0
F4BP<3:0>:
RX Buffer Mask for Filter 4 bits (same values as bits 15-12)
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REGISTER 22-14: CxBUFPNT3: CANx FILTERS 8-11 BUFFER POINTER REGISTER 3
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F11BP3 F11BP2 F11BP1 F11BP0 F10BP3 F10BP2 F10BP1 F10BP0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F9BP3 F9BP2 F9BP1 F9BP0 F8BP3 F8BP2 F8BP1 F8BP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
F11BP<3:0>:
RX Buffer Mask for Filter 11 bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 11-8
F10BP<3:0>:
RX Buffer Mask for Filter 10 bits (same values as bits 15-12)
bit 7-4
F9BP<3:0>:
RX Buffer Mask for Filter 9 bits (same values as bits 15-12)
bit 3-0
F8BP<3:0>:
RX Buffer Mask for Filter 8 bits (same values as bits 15-12)
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REGISTER 22-15: CxBUFPNT4: CANx FILTERS 12-15 BUFFER POINTER REGISTER 4
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F15BP3 F15BP2 F15BP1 F15BP0 F14BP3 F14BP2 F14BP1 F14BP0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F13BP3 F13BP2 F13BP1 F13BP0 F12BP3 F12BP2 F12BP1 F12BP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
F15BP<3:0>:
RX Buffer Mask for Filter 15 bits
1111 = Filter hits received in RX FIFO buffer
1110 = Filter hits received in RX Buffer 14
•
•
•
0001 = Filter hits received in RX Buffer 1
0000 = Filter hits received in RX Buffer 0
bit 11-8
F14BP<3:0>:
RX Buffer Mask for Filter 14 bits (same values as bits 15-12)
bit 7-4
F13BP<3:0>:
RX Buffer Mask for Filter 13 bits (same values as bits 15-12)
bit 3-0
F12BP<3:0>:
RX Buffer Mask for Filter 12 bits (same values as bits 15-12)
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REGISTER 22-16: CxRXFnSID: CANx ACCEPTANCE FILTER n ST ANDARD IDENTIFIER
REGISTER (n = 0-15)
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3
bit 15 bit 8
R/W-x R/W-x R/W-x U-0 R/W-x U-0 R/W-x R/W-x
SID2 SID1 SID0 — EXIDE —EID17EID16
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-5
SID<10:0>:
Standard Identifier bits
1 = Message address bit, SIDx, must be ‘1’ to match filter
0 = Message address bit, SIDx, must be ‘0’ to match filter
bit 4
Unimplemented:
Read as ‘0’
bit 3
EXIDE:
Extended Identifier Enable bit
If MIDE = 1:
1 = Matches only messages with Extended Identifier addresses
0 = Matches only messages with Standard Identifier addresses
If MIDE = 0:
Ignores EXIDE bit.
bit 2
Unimplemented:
Read as ‘0’
bit 1-0
EID<17:16>:
Extended Identifier bits
1 = Message address bit, EIDx, must be ‘1’ to match filter
0 = Message address bit, EIDx, must be ‘0’ to match filter
REGISTER 22-17: CxRXFnEID: CANx ACCEPTANCE FILTER n EXTENDED IDENTIFIER
REGISTER (n = 0-15)
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
EID<15:8>
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
EID<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
EID<15:0>:
Extended Identifier bits
1 = Message address bit, EIDx, must be ‘1’ to match filter
0 = Message address bit, EIDx, must be ‘0’ to match filter
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REGISTER 22-18: CxFMSKSEL1: CANx FILTERS 7-0 MASK SELECTION REGISTER 1
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F7MSK1 F7MSK0 F6MSK1 F6MSK0 F5MSK1 F5MSK0 F4MSK1 F4MSK0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F3MSK1 F3MSK0 F2MSK1 F2MSK0 F1MSK1 F1MSK0 F0MSK1 F0MSK0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
F7MSK<1:0>:
Mask Source for Filter 7 bit
11 = Reserved
10 = Acceptance Mask 2 registers contain the mask
01 = Acceptance Mask 1 registers contain the mask
00 = Acceptance Mask 0 registers contain the mask
bit 13-12
F6MSK<1:0>:
Mask Source for Filter 6 bit (same values as bits 15-14)
bit 11-10
F5MSK<1:0>:
Mask Source for Filter 5 bit (same values as bits 15-14)
bit 9-8
F4MSK<1:0>:
Mask Source for Filter 4 bit (same values as bits 15-14)
bit 7-6
F3MSK<1:0>:
Mask Source for Filter 3 bit (same values as bits 15-14)
bit 5-4
F2MSK<1:0>:
Mask Source for Filter 2 bit (same values as bits 15-14)
bit 3-2
F1MSK<1:0>:
Mask Source for Filter 1 bit (same values as bits 15-14)
bit 1-0
F0MSK<1:0>:
Mask Source for Filter 0 bit (same values as bits 15-14)
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REGISTER 22-19: CxFMSKSEL2: CANx FILTERS 15-8 MASK SELECTION REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F15MSK1 F15MSK0 F14MSK1 F14MSK0 F13MSK‘ F13MSK0 F12MSK1 F12MSK0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
F11MSK1 F11MSK0 F10MSK1 F10MSK0 F9MSK1 F9MSK0 F8MSK1 F8MSK0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-14
F15MSK<1:0>:
Mask Source for Filter 15 bit
11 = Reserved
10 = Acceptance Mask 2 registers contain the mask
01 = Acceptance Mask 1 registers contain the mask
00 = Acceptance Mask 0 registers contain the mask
bit 13-12
F14MSK<1:0>:
Mask Source for Filter 14 bit (same values as bits 15-14)
bit 11-10
F13MSK<1:0>:
Mask Source for Filter 13 bit (same values as bits 15-14)
bit 9-8
F12MSK<1:0>:
Mask Source for Filter 12 bit (same values as bits 15-14)
bit 7-6
F11MSK<1:0>:
Mask Source for Filter 11 bit (same values as bits 15-14)
bit 5-4
F10MSK<1:0>:
Mask Source for Filter 10 bit (same values as bits 15-14)
bit 3-2
F9MSK<1:0>:
Mask Source for Filter 9 bit (same values as bits 15-14)
bit 1-0
F8MSK<1:0>:
Mask Source for Filter 8 bit (same values as bits 15-14)
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REGISTER 22-20: CxRXMnSID: CANx ACCEPT ANCE FILTER MASK n STANDARD IDENTIFIER
REGISTER (n = 0-2)
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
SID10 SID9 SID8 SID7 SID6 SID5 SID4 SID3
bit 15 bit 8
R/W-x R/W-x R/W-x U-0 R/W-x U-0 R/W-x R/W-x
SID2 SID1 SID0 —MIDE —EID17EID16
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-5
SID<10:0>:
Standard Identifier bits
1 = Includes bit, SIDx, in filter comparison
0 = Bit, SIDx, is a don’t care in filter comparison
bit 4
Unimplemented:
Read as ‘0’
bit 3
MIDE:
Identifier Receive Mode bit
1 = Matches only message types (standard or extended address) that correspond to the EXIDE bit in
the filter
0 = Matches either standard or extended address message if filters match, i.e., if:
(Filter SID) = (Message SID) or if (Filter SID/EID) = (Message SID/EID)
bit 2
Unimplemented:
Read as ‘0’
bit 1-0
EID<17:16>:
Extended Identifier bits
1 = Includes bit, EIDx, in filter comparison
0 = Bit, EIDx, is a don’t care in filter comparison
REGISTER 22-21: CxRXMnEID: CANx ACCEPTANCE FILTER MASK n EXTENDED IDENTIFIER
REGISTER (n = 0-2)
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
EID<15:8>
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
EID<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
EID<15:0>:
Extended Identifier bits
1 = Includes bit, EIDx, in filter comparison
0 = Bit, EIDx, is a don’t care in filter comparison
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REGISTER 22-22: CxRXFUL1: CANx RECEIVE BUFFER FULL REGISTER 1
R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0
RXFUL<15:8>
bit 15 bit 8
R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0
RXFUL<7:0>
bit 7 bit 0
Legend:
C = Writable bit, but only ‘0’ can be written to clear the bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
RXFUL<15:0>:
Receive Buffer n Full bits
1 = Buffer is full (set by module)
0 = Buffer is empty (cleared by user software)
REGISTER 22-23: CxRXFUL2: CANx RECEIVE BUFFER FULL REGISTER 2
R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0
RXFUL<31:24>
bit 15 bit 8
R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0
RXFUL<23:16>
bit 7 bit 0
Legend:
C = Writable bit, but only ‘0’ can be written to clear the bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
RXFUL<31:16>:
Receive Buffer n Full bits
1 = Buffer is full (set by module)
0 = Buffer is empty (cleared by user software)
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REGISTER 22-2 4: Cx RXOVF1: CANx RECEIV E BUFFER OVERFLOW REGISTER 1
R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0
RXOVF<15:8>
bit 15 bit 8
R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0
RXOVF<7:0>
bit 7 bit 0
Legend:
C = Writable bit, but only ‘0’ can be written to clear the bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
RXOVF<15:0>:
Receive Buffer n Overflow bits
1 = Module attempted to write to a full buffer (set by module)
0 = No overflow condition (cleared by user software)
REGISTER 22-2 5: Cx RXOVF2: CANx RECEIV E BUFFER OVERFLOW REGISTER 2
R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0
RXOVF<31:24>
bit 15 bit 8
R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0 R/C-0
RXOVF<23:16>
bit 7 bit 0
Legend:
C = Writable bit, but only ‘0’ can be written to clear the bit
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
RXOVF<31:16>:
Receive Buffer n Overflow bits
1 = Module attempted to write to a full buffer (set by module)
0 = No overflow condition (cleared by user software)
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RE GISTER 22-2 6: CxTRmnC ON: CANx TX/RX BUFFER mn CONTROL REGISTER
(m = 0,2,4,6; n = 1,3,5,7)
R/W-0 R-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
TXENn TXABTn TXLARBn TXERRn TXREQn RTRENn TXnPRI1 TXnPRI0
bit 15 bit 8
R/W-0 R-0 R-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0
TXENm TXABTm
(1)
TXLARBm
(1)
TXERRm
(1)
TXREQm RTRENm TXmPRI1 TXmPRI0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8 See Definition for bits 7-0, controls Buffer n.
bit 7
TXENm:
TX/RX Buffer Selection bit
1 = Buffer, TRBm, is a transmit buffer
0 = Buffer, TRBm, is a receive buffer
bit 6
TXABTm:
Message Aborted bit
(1)
1 = Message was aborted
0 = Message completed transmission successfully
bit 5
TXLARBm:
Message Lost Arbitration bit
(1)
1 = Message lost arbitration while being sent
0 = Message did not lose arbitration while being sent
bit 4
TXERRm:
Error Detected During Transmission bit
(1)
1 = A bus error occurred while the message was being sent
0 = A bus error did not occur while the message was being sent
bit 3
TXREQm:
Message Send Request bit
1 = Requests that a message be sent; the bit automatically clears when the message is successfully
sent
0 = Clearing the bit to ‘0’ while set requests a message abort
bit 2
RTRENm:
Auto-Remote Transmit Enable bit
1 = When a remote transmit is received, TXREQ will be set
0 = When a remote transmit is received, TXREQ will be unaffected
bit 1-0
TXmPRI<1:0>:
Message Transmission Priority bits
11 = Highest message priority
10 = High intermediate message priority
01 = Low intermediate message priority
00 = Lowest message priority
Note 1:
This bit is cleared when TXREQm is set.
Note:
The buffers, SID, EID, DLC, Data Field and Receive Status registers, are located in DMA RAM.
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22.4 CAN Message Buffers
CAN Message Buffers are part of RAM memory. They
are not CAN Special Function Registers. The user appli-
cation must directly write into the RAM area that is
configured for CAN Message Buffers. The location and
size of the buffer area is defined by the user application.
BUFFER 22-1: CA Nx MESSAGE BUFFER WORD 0
U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x
— — — SID10 SID9 SID8 SID7 SID6
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
SID5 SID4 SID3 SID2 SID1 SID0 SRR IDE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13
Unimplemented:
Read as ‘0’
bit 12-2
SID<10:0>:
Standard Identifier bits
bit 1
SRR:
Substitute Remote Request bit
When IDE = 0:
1 = Message will request remote transmission
0 = Normal message
When IDE = 1:
The SRR bit must be set to ‘1’.
bit 0
IDE:
Extended Identifier bit
1 = Message will transmit an Extended Identifier
0 = Message will transmit a Standard Identifier
BUFFER 22-2: CA Nx MESSAGE BUFFER WORD 1
U-0 U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x
— — — — EID<17:14>
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
EID<13:6>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
Unimplemented:
Read as ‘0’
bit 11-0
EID<17:6>:
Extended Identifier bits
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(
BUFFER 22-3: CA Nx MESSAGE BUFFER WORD 2
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
EID5 EID4 EID3 EID2 EID1 EID0 RTR RB1
bit 15 bit 8
U-x U-x U-x R/W-x R/W-x R/W-x R/W-x R/W-x
— — — RB0 DLC3 DLC2 DLC1 DLC0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10
EID<5:0>:
Extended Identifier bits
bit 9
RTR:
Remote Transmission Request bit
When IDE = 1:
1 = Message will request remote transmission
0 = Normal message
When IDE = 0:
The RTR bit is ignored.
bit 8
RB1:
Reserved Bit 1
User must set this bit to ‘0’ per CAN protocol.
bit 7-5
Unimplemented:
Read as ‘0’
bit 4
RB0:
Reserved Bit 0
User must set this bit to ‘0’ per CAN protocol.
bit 3-0
DLC<3:0>:
Data Length Code bits
BUFFER 22-4: CANx MESSAGE BUFFER WORD 3
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
Byte 1<15:8>
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
Byte 0<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Byte 1<15:8>:
CANx Message Byte 1 bits
bit 7-0
Byte 0<7:0>:
CANx Message Byte 0 bits
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BUFFER 22-5: CANx MESSAGE BUFFER WORD
4
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
Byte 3<15:8>
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
Byte 2<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Byte 3<15:8>:
CANx Message Byte 3 bits
bit 7-0
Byte 2<7:0>:
CANx Message Byte 2 bits
BUFFER 22-6: CANx MESSAGE BUFFER WORD 5
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
Byte 5<15:8>
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
Byte 4<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Byte 5<15:8>:
CANx Message Byte 5 bits
bit 7-0
Byte 4<7:0>:
CANx Message Byte 4 bits
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BUFFER 22-7: CANx MESSAGE BUFFER WORD 6
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
Byte 7<15:8>
bit 15 bit 8
R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x R/W-x
Byte 6<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-8
Byte 7<15:8>:
CANx Message Byte 7 bits
bit 7-0
Byte 6<7:0>:
CANx Message Byte 6 bits
BUFFER 22-8: CA Nx MESSAGE BUFFER WORD 7
U-0 U-0 U-0 R/W-x R/W-x R/W-x R/W-x R/W-x
— — — FILHIT<4:0>
(1)
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13
Unimplemented:
Read as ‘0’
bit 12-8
FILHIT<4:0>:
Filter Hit Code bits
(1)
Encodes number of filter that resulted in writing this buffer.
bit 7-0
Unimplemented:
Read as ‘0’
Note 1:
Only written by module for receive buffers, unused for transmit buffers.
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23.0 CHARGE TIME
MEASUREMENT UNIT (CTMU)
The Charge Time Measurement Unit (CTMU) is a flexible
analog module that provides accurate differential time
measurement between pulse sources, as well as
asynchronous pulse generation. Its key features include:
• Nine Edge Input Trigger Sources
• Polarity Control for Each Edge Source
• Control of Edge Sequence
• Control of Response to Edges
• Time Measurement Resolution Down to 200 ps
• Accurate Current Source Suitable for Capacitive
Measurement
• On-Chip Temperature Measurement using a
Built-in
Diode
• Pulse Generation Generates a Pulse using the
C1INB Comparator Input and Outputs the Pulse
onto the CTPLS Remappable Output
Together with other on-chip analog modules, the CTMU
can be used to precisely measure time, measure
capacitance, measure relative changes in capacitance
or generate output pulses that are independent of the
system clock.
The CTMU module is ideal for interfacing with
capacitive-based sensors. The CTMU is controlled
through three registers: CTMUCON1, CTMUCON2
and CTMUICON. CTMUCON1 and CTMUCON2
enable the module and control edge source selection,
edge source polarity selection and edge sequencing.
The CTMUICON register controls the selection and
trim of the current source.
Note 1:
This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X
family of devices. It is not intended to
be a comprehensive reference source.
To complement the information in this
data sheet, refer to
“Charge Time
Measurement Unit (CTMU) and CTMU
Operation with Threshold Detect”
(DS30009743) in the “dsPIC33/PIC24
Family Reference Manual”, which is
available on the Microchip web site
(www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
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FIGURE 23-1: CTMU BLOCK DIAGRAM
CTED1
CTED2 Current Source
Edge
CTMUCON1 or CTMUCON2
Pulse
Generator
CTMUI to ADC
(1)
CMP1
Timer1
OC1
Current
Control
ITRIM<5:0>
IRNG<1:0>
CTMUICON
CTMU
Control
Logic
EDG1STAT
EDG2STAT Analog-to-Digital
CTPLS
IC1
CMP1
C1IN1-
CDelay
CTMU TEMP
CTMU
Temperature
Sensor
Current Control Selection TGEN EDG1STAT, EDG2STAT
CTMU TEMP
0
EDG1STAT = EDG2STAT
CTMUI to ADC
0
EDG1STAT
EDG2STAT
CTMUP
1
EDG1STAT
EDG2STAT
No Connect
1
EDG1STAT = EDG2STAT
Trigger
TGEN
CTMUP
External Capacitor
for Pulse Generation
Note 1:
Current source to particular ANx pins is provided only when 10-Bit ADC mode is chosen.
Control
Logic
F
OSC
OSCI Pin
FRC
BFRC
LPRC
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23.1 CTMU Control Registers
REGISTER 23-1: CTMUCON1: CTMU CONTROL REGISTER 1
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CTMUEN —CTMUSIDLTGEN
(2)
EDGEN EDGSEQEN IDISSEN
(1)
CTTRIG
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
CTMUEN:
CTMU Enable
bit
1 = Module is enabled
0 = Module is disabled
bit 14
Unimplemented:
Read as ‘0’
bit 13
CTMUSIDL:
CTMU Stop in Idle Mode bit
1 = Discontinues module operation when the device enters Idle mode
0 = Continues module operation in Idle mode
bit 12
TGEN:
Time Generation Enable bit
(2)
1 = Edge delay generation is enabled
0 = Edge delay generation is disabled
bit 11
EDGEN:
Edge Enable bit
1 = Hardware modules are used to trigger edges (TMRx, CTEDx, etc.)
0 = Software is used to trigger edges (manual set of EDGxSTAT)
bit 10
EDGSEQEN:
Edge Sequence Enable bit
1 = Edge 1 event must occur before Edge 2 event can occur
0 = No edge sequence is needed
bit 9
IDISSEN:
Analog Current Source Control bit
(1)
1 = Analog current source output is grounded
0 = Analog current source output is not grounded
bit 8
CTTRIG:
ADC Trigger
Control bit
1 = CTMU triggers the ADC start of conversion
0 = CTMU does not trigger the ADC start of conversion
bit 7-0
Unimplemented:
Read as ‘0’
Note 1:
The ADC module Sample-and-Hold (S&H) capacitor is not automatically discharged between sample/
conversion cycles. Any software using the ADC as part of a capacitance measurement must discharge the
ADC capacitor before conducting the measurement. The IDISSEN bit, when set to ‘1’, performs this func-
tion. The ADC must be sampling while the IDISSEN bit is active to connect the discharge sink to the
capacitor array.
2:
If the TGEN bit is set to ‘1’, then the CMP1 module should be selected as the Edge 2 source in the
EDG2SELx bits field; otherwise, the module will not function.
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REGISTER 23-2: CTMUCON2: CTMU CONTROL REGISTER 2
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
EDG1MOD EDG1POL EDG1SEL3 EDG1SEL2 EDG1SEL1 EDG1SEL0 EDG2STAT EDG1STAT
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0
EDG2MOD EDG2POL EDG2SEL3 EDG2SEL2 EDG2SEL1 EDG2SEL0 — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
EDG1MOD:
Edge 1 Edge Sampling Mode Selection
bit
1 = Edge 1 is edge-sensitive
0 = Edge 1 is level-sensitive
bit 14
EDG1POL:
Edge 1 Polarity Select bit
1 = Edge 1 is programmed for a positive edge response
0 = Edge 1 is programmed for a negative edge response
bit 13-10
EDG1SEL<3:0>:
Edge 1 Source Select bits
1111 = F
CY
1110 = OSCI pin
1101 = FRC Oscillator
1100 = BFRC Oscillator
1011 = Internal LPRC Oscillator
1010 = Reserved
1001 = Reserved
1000 = Reserved
0111 = Reserved
0110 = Reserved
0101 = Reserved
0100 = Reserved
0011 = CTED1 pin
0010 = CTED2 pin
0001 = OC1 module
0000 = TMR1 module
bit 9
EDG2STAT:
Edge 2 Status bit
Indicates the status of Edge 2 and can be written to control the edge source.
1 = Edge 2 has occurred
0 = Edge 2 has not occurred
bit 8
EDG1STAT:
Edge 1 Status bit
Indicates the status of Edge 1 and can be written to control the edge source.
1 = Edge 1 has occurred
0 = Edge 1 has not occurred
bit 7
EDG2MOD:
Edge 2 Edge Sampling Mode Selection bit
1 = Edge 2 is edge-sensitive
0 = Edge 2 is level-sensitive
bit 6
EDG2POL:
Edge 2 Polarity Select bit
1 = Edge 2 is programmed for a positive edge response
0 = Edge 2 is programmed for a negative edge response
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bit 5-2
EDG2SEL<3:0>:
Edge 2 Source Select bits
1111 = F
CY
1110 = OSCI pin
1101 = FRC Oscillator
1100 = BFRC Oscillator
1011 = Internal LPRC Oscillator
1010 = Reserved
1001 = Reserved
1000 = Reserved
0111 = Reserved
0110 = Reserved
0101 = Reserved
0100 = CMP1 module
0011 = CTED2 pin
0010 = CTED1 pin
0001 = OCMP1 module
0000 = IC1 module
bit 1-0
Unimplemented:
Read as ‘0’
REGISTER 23-2: CTMUCON2: CTMU CONTROL REGISTER 2 (CONTINUED)
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RE GISTER 23-3: CTM UICON: CTMU CURRE NT CONT ROL REGISTER
(3)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ITRIM5
(4)
ITRIM4
(4)
ITRIM3
(4)
ITRIM2
(4)
ITRIM1
(4)
ITRIM0
(4)
IRNG1
(2)
IRNG0
(2)
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-10
ITRIM<5:0>:
Current Source Trim bits
(4)
011111 = Maximum positive change from nominal current + 62%
011110 = Maximum positive change from nominal current + 60%
•
•
•
000010 = Minimum positive change from nominal current + 4%
000001 = Minimum positive change from nominal current + 2%
000000 = Nominal current output specified by IRNG<1:0>
111111 = Minimum negative change from nominal current – 2%
111110 = Minimum negative change from nominal current – 4%
•
•
•
100010 = Maximum negative change from nominal current – 60%
100001 = Maximum negative change from nominal current – 62%
bit 9-8
IRNG<1:0>:
Current Source Range Select bits
(2)
11 = 100 Base Current
10 = 10 Base Current
01 = Base Current Level
00 = 1000 Base Current
(1)
bit 7-0
Unimplemented:
Read as ‘0’
Note 1:
This current range is not available for use with the internal temperature measurement diode.
2:
Refer to the CTMU Current Source Specifications (Table 30-53) in
Sectio n 30.0 “Ele ctrical Ch aracteris tics”
for the current range selection values.
3:
Current sources are not generated when 12-Bit ADC mode is chosen. Current sources are active only
when 10-Bit ADC mode is chosen.
4:
The current step generated by the Current Source Trim bits is not always linear.
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24.0 10-BIT/12-BIT
ANALOG-TO-DIGITAL
CONVERTER (ADC)
The Analog-to-Digital (ADC) module in the
dsPIC33EVXXXGM00X/10X family devices supports
up to 36 analog input channels.
The ADC module can be configured by the user as
either a 10-bit, four Sample-and-Hold (S&H) ADC
(default configuration) or a 12-bit, one S&H ADC.
24.1 Key Features
24.1.1 10-BIT ADC CONFIGURATION
The 10-bit ADC configuration has the following key
features:
• Successive Approximation (SAR) Conversion
• Conversion Speeds of up to 1.1 Msps
• Up to 36 Analog Input Pins
• Connections to Four Internal Op Amps
• Connections to the Charge Time Measurement Unit
(CTMU) and Temperature Measurement Diode
• Simultaneous Sampling of:
- Up to four analog input pins
- Four op amp outputs
• Combinations of Analog Inputs and Op Amp Outputs
• Automatic Channel Scan mode
• Selectable Conversion Trigger Source
• Selectable Buffer Fill modes
• Four Result Alignment Options (signed/unsigned,
fractional/integer)
• Operation during CPU Sleep and Idle Modes
24.1.2 12-BIT ADC CONFIGURATION
The 12-bit ADC configuration supports all the features
listed previously, with the exception of the following:
• In the 12-bit configuration, conversion speeds of
up to 500 ksps are supported
• There is only one S&H amplifier in the 12-bit
configuration. Therefore, simultaneous sampling
of multiple channels is not supported.
The ADC has up to 36 analog inputs. The analog
inputs, AN32 through AN63, are multiplexed, thus
providing flexibility in using any of these analog inputs
in addition to the analog inputs, AN0 through AN31.
Since AN32 through AN63 are multiplexed, do not use
two channels simultaneously, since it may result in
erroneous output from the module. These analog
inputs are shared with op amp inputs and outputs, com-
parator inputs and external voltage references. When
op amp/comparator functionality is enabled, the analog
input that shares that pin is no longer available. The
actual number of analog input pins and op amps
depends on the specific device.
A block diagram of the ADC module with connection
options is shown in Figure 24-1. Figure 24-2 shows a
block diagram of the ADC conversion clock period.
Note 1:
This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this
data sheet, refer to
“Analog-to-Digital
Converter (ADC)”
(DS70621) in the
“dsPIC33/PIC24 Family Reference
Manual”, which is available from the
Microchip web site (www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
Note:
The ADC module needs to be disabled
before modifying the AD12B bit.
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FIGURE 24-1: ADCx MODULE BLOCK DIAGRAM WITH CONNECTION OPTIONS FOR ANx PINS AND OP AMPS
+
–
CMP1
/OA1
V
REFL
V
REFL
V
REFL
+
–
CH0
0
1
V
REFL
AN0-AN31
OA1-OA3, OA5
CH0Sx
CH0Nx
CH123Nx
000000
111111
A
B
1
0
CH0SA<5:0>
(1)
CH0SB<5:0>
(1)
CH0Sx
CH0Nx
CH0NA
(1)
CH0NB
(1)
CSCNA
CH123Sx
CH123Nx
CH123SA<2:0>
CH123SB<2:0>
CH123NA<1:0>
CH123NB<1:0>
S&H1
Alternate Input
Selection
Channel Scan
This diagram depicts all of the available
ADC connection options to the four S&H
amplifiers, which are designated: CH0,
CH1, CH2 and CH3.
The ANx analog pins or op amp outputs are
connected to the CH0-CH3 amplifiers
through the multiplexers, controlled by the
SFR control bits, CH0Sx, CH0Nx, CH123Sx
and CH123Nx.
A
B
A
B
A
B
+
–
CH1
+
–
CH2
+
–
CH3
CH123Sx
+
–OA2 CH123Sx
0x
10
11
CH123Nx
0x
10
11
CH123Nx
+
–OA3
CH123Sx
AN0/OA2OUT/RA0
PGEC1/AN4/C1IN1+/RPI34/RB2
PGED1/AN5/C1IN1-/RP35/RB3
PGEC3/AN3/OA1OUT/RPI33/CTED1/RB1
AN9/RPI27/RA11
AN1/C2IN1+/RA1
AN10/RPI28/RA12
PGED3/AN2/C2IN1-/SS1/RPI32/CTED2/RB0
AN8/C3IN1+/U1RTS/BCLK1/RC2
AN6/OA3OUT/C4IN1+/RC0
AN7/C3IN1-/C4IN1-/RC1
AN11/C1IN2-/U1CTS/RC11
+
–OA1
AV
SS
ADC1BUF0
(2,3)
ADC1BUF1
(3)
ADC1BUF2
(3)
ADC1BUFF
(3)
ADC1BUFE
(3)
From CTMU
Current Source (CTMUI)
S&H2
S&H3
S&H0
Note 1: Channels 1, 2 and 3 are not applicable for the 12-bit mode of operation.
2: When ADDMAEN (ADxCON4<8>) =
0
, ADC1BUF0-ADC1BUFF are used.
3: When ADDMAEN (ADxCON4<8>) =
1
enabling DMA, only ADC1BUF0 is used.
ALTS (MUX A/MUX B)
OA5
OA5IN+/AN24/C5IN3-/C5IN1+/SDO1/RP20/T1CK/RA4
OA5IN-/AN27/C5IN1-/RP41/RB9
OA5OUT/AN25/C5IN4-/RP39/INT0/RB7
SAR ADC
V
REFH
V
REFL
AV
DD
000
001
010
011
1xx
0x
10
11
000
001
010
011
1xx
000
001
010
011
1xx
+
–
100000
111111
AN32-AN63
(AN61-Band Gap Voltage
AN62-CTMU Temp Diode
AN63-Not Connected)
2013-2018 Microchip Technology Inc. DS70005144G-page 289
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FIGURE 24-2: ADCx CONVERSION CLOCK PERIOD BLOCK DIAGRAM
1
0
ADC Conversion
Clock Multiplier
1, 2, 3, 4, 5,..., 256
ADxCON3<15>
T
P(1)
T
AD
6
ADxCON3<7:0>
Note 1:
T
P
= 1/F
P
.
2:
Refer to the ADC electrical specifications in
Section 30.0 “Electrical Characteristics”
for
the exact RC clock value.
ADC Internal
RC Clock
(2)
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24.2 ADC Helpful Tips
1. The SMPIx control bits in the ADxCON2 registers:
a) Determine when the ADC interrupt flag is
set and an interrupt is generated, if
enabled.
b) When the CSCNA bit in the ADxCON2 reg-
ister is set to ‘1’, this determines when the
ADC analog scan channel list, defined in
the ADxCSSL/ADxCSSH registers, starts
over from the beginning.
c) When the DMA peripheral is not used
(ADDMAEN = 0), this determines when
the ADC Result Buffer Pointer to
ADC1BUF0-ADC1BUFF gets reset back
to the beginning at ADC1BUF0.
d) When the DMA peripheral is used
(ADDMAEN = 1), this determines when the
DMA Address Pointer is incremented after a
sample/conversion operation. ADC1BUF0 is
the only ADC buffer used in this mode. The
ADC Result Buffer Pointer to ADC1BUF0-
ADC1BUFF gets reset back to the beginning
at ADC1BUF0. The DMA address is
incremented after completion of every 32nd
sample/conversion operation. Conversion
results are stored in the ADC1BUF0 register
for transfer to RAM using the DMA peripheral.
2. When the DMA module is disabled
(ADDMAEN = 0), the ADC has 16 result buffers.
ADC conversion results are stored sequentially
in ADC1BUF0-ADC1BUFF, regardless of which
analog inputs are being used subject to the
SMPIx bits and the condition described in 1.c)
above. There is no relationship between the
ANx input being measured and which ADC
buffer (ADC1BUF0-ADC1BUFF) that the
conversion results will be placed in.
3. When the DMA module is enabled
(ADDMAEN = 1), the ADC module has only
1 ADC result buffer (i.e., ADCxBUF0) per ADC
peripheral and the ADC conversion result must
be read, either by the CPU or DMA Controller,
before the next ADC conversion is complete to
avoid overwriting the previous value.
4. The DONE bit (ADxCON1<0>) is only cleared at
the start of each conversion and is set at the
completion of the conversion, but remains set
indefinitely, even through the next sample phase
until the next conversion begins. If application
code is monitoring the DONE bit in any kind of
software loop, the user must consider this
behavior because the CPU code execution is
faster than the ADC. As a result, in Manual
Sample mode, particularly where the user’s
code is setting the SAMP bit (ADxCON1<1>),
the DONE bit should also be cleared by the user
application just before setting the SAMP bit.
5. Enabling op amps, comparator inputs and exter-
nal voltage references can limit the availability of
analog inputs (ANx pins). For example, when
Op Amp 2 is enabled, the pins for AN0, AN1 and
AN2 are used by the op amp’s inputs and output.
This negates the usefulness of Alternate Input
mode since the MUX A selections use AN0-AN2.
Carefully study the ADC block diagram to
determine the configuration that will best suit
your application. For configuration examples,
refer to
“Analog-to-Digital Converter (ADC)”
(DS70621) in the “dsPIC33/PIC24 Family
Reference Manual”.
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24.3 ADC Control Registers
REGISTER 24-1: ADxCON1: ADCx CONTROL REGISTER 1
R/W-0 U-0 R/W-0 R/W-0 U-0 R/W-0 R/W-0 R/W-0
ADON — ADSIDL ADDMABM — AD12B FORM1 FORM0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 HC/HS/R/W-0 HC/HS/R/C-0
SSRC2 SSRC1 SSRC0 SSRCG SIMSAM ASAM SAMP DONE
(1)
bit 7 bit 0
Legend:
C = Clearable bit U = Unimplemented bit, read as ‘0’
R = Readable bit W = Writable bit HS = Hardware Settable bit HC = Hardware Clearable bit
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
ADON:
ADCx Operating Mode bit
1 = ADCx module is operating
0 = ADCx is off
bit 14
Unimplemented:
Read as ‘0’
bit 13
ADSIDL:
ADCx Stop in Idle Mode bit
1 = Discontinues module operation when the device enters Idle mode
0 = Continues module operation in Idle mode
bit 12
ADDMABM:
ADCx DMA Buffer Build Mode bit
1 = DMA buffers are written in the order of conversion; the module provides an address to the DMA
channel that is the same as the address used for the non-DMA stand-alone buffer
0 = DMA buffers are written in Scatter/Gather mode; the module provides a Scatter/Gather mode
address to the DMA channel based on the index of the analog input and the size of the DMA buffer
bit 11
Unimplemented:
Read as ‘0’
bit 10
AD12B:
ADCx 10-Bit or 12-Bit Operation Mode bit
1 = 12-bit, 1-channel ADC operation
0 = 10-bit, 4-channel ADC operation
bit 9-8
FORM<1:0>:
Data Output Format bits
For 10-Bit Operation:
11 = Signed fractional (D
OUT
= sddd dddd dd00 0000, where s = .NOT.d<9>)
10 = Fractional (D
OUT
= dddd dddd dd00 0000)
01 = Signed integer (D
OUT
= ssss sssd dddd dddd, where s = .NOT.d<9>)
00 = Integer (D
OUT
= 0000 00dd dddd dddd)
For 12-Bit Operation:
11 = Signed fractional (D
OUT
= sddd dddd dddd 0000, where s = .NOT.d<11>)
10 = Fractional (D
OUT
= dddd dddd dddd 0000)
01 = Signed integer (D
OUT
= ssss sddd dddd dddd, where s = .NOT.d<11>)
00 = Integer (D
OUT
= 0000 dddd dddd dddd)
Note 1:
Do not clear the DONE bit in software if auto-sample is enabled (ASAM = 1).
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bit 7-5
SSRC<2:0>:
Sample Clock Source Select bits
If SSRCG = 1:
111 = Reserved
110 = Reserved
101 = Reserved
100 = Reserved
011 = Reserved
010 = PWM Generator 3 primary trigger compare ends sampling and starts conversion
001 = PWM Generator 2 primary trigger compare ends sampling and starts conversion
000 = PWM Generator 1 primary trigger compare ends sampling and starts conversion
If SSRCG = 0:
111 = Internal counter ends sampling and starts conversion (auto-convert)
110 = CTMU ends sampling and starts conversion
101 = Reserved
100 = Timer5 compare ends sampling and starts conversion
011 = PWM primary Special Event Trigger ends sampling and starts conversion
010 = Timer3 compare ends sampling and starts conversion
001 = Active transition on the INT0 pin ends sampling and starts conversion
000 = Clearing the Sample bit (SAMP) ends sampling and starts conversion (Manual mode)
bit 4
SSRCG:
Sample Trigger Source Group bit
See SSRC<2:0> for details.
bit 3
SIMSAM:
Simultaneous Sample Select bit (only applicable when CHPS<1:0> = 01 or 1x)
In 12-Bit Mode (AD12B = 1), SIMSAM is Unimplemented and is Read as ‘0’:
1 = Samples CH0, CH1, CH2, CH3 simultaneously (when CHPS<1:0> = 1x) or samples CH0 and CH1
simultaneously (when CHPS<1:0> = 01)
0 = Samples multiple channels individually in sequence
bit 2
ASAM:
ADCx Sample Auto-Start bit
1 = Sampling begins immediately after last conversion; SAMP bit is auto-set
0 = Sampling begins when SAMP bit is set
bit 1
SAMP:
ADCx Sample Enable bit
1 = ADCx Sample-and-Hold amplifiers are sampling
0 = ADCx Sample-and-Hold amplifiers are holding
If ASAM = 0, software can write ‘1’ to begin sampling. Automatically set by hardware if ASAM = 1. If
SSRC<2:0> = 000, software can write ‘0’ to end sampling and start conversion. If SSRC<2:0> 000,
automatically cleared by hardware to end sampling and start conversion.
bit 0
DONE:
ADCx Conversion Status bit
(1)
1 = ADCx conversion cycle is completed.
0 = ADCx conversion has not started or is in progress
Automatically set by hardware when conversion is complete. Software can write ‘0’ to clear DONE bit
status (software not allowed to write ‘1’). Clearing this bit does NOT affect any operation in progress.
Automatically cleared by hardware at the start of a new conversion.
REGISTER 24-1: ADxCON1: ADCx CONTROL REGISTER 1 (CONTINUED)
Note 1:
Do not clear the DONE bit in software if auto-sample is enabled (ASAM = 1).
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REGISTER 24-2: ADxCON2: ADCx CONTROL REGISTER 2
R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0
VCFG2
(1)
VCFG1
(1)
VCFG0
(1)
—— CSCNA CHPS1 CHPS0
bit 15 bit 8
R-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
BUFS SMPI4 SMPI3 SMPI2 SMPI1 SMPI0 BUFM ALTS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13
VCFG<2:0>:
Converter Voltage Reference Configuration bits
(1)
bit 12-11
Unimplemented:
Read as ‘0’
bit 10
CSCNA:
Input Scan Select bit
1 = Scans inputs for CH0+ during Sample MUX A
0 = Does not scan inputs
bit 9-8
CHPS<1:0>:
Channel Select bits
In 12-Bit Mode (AD21B = 1), CHPS<1:0> bits are Unimplemented and are Read as ‘0’:
1x = Converts CH0, CH1, CH2 and CH3
01 = Converts CH0 and CH1
00 = Converts CH0
bit 7
BUFS:
Buffer Fill Status bit (only valid when BUFM = 1)
1 = ADCx is currently filling the second half of the buffer; the user application should access data in the
first half of the buffer
0 = ADCx is currently filling the first half of the buffer; the user application should access data in the
second half of the buffer
bit 6-2
SMPI<4:0>:
Increment Rate bits
When ADDMAEN = 0:
x1111 = Generates interrupt after completion of every 16th sample/conversion operation
x1110 = Generates interrupt after completion of every 15th sample/conversion operation
•
•
•
x0001 = Generates interrupt after completion of every 2nd sample/conversion operation
x0000 = Generates interrupt after completion of every sample/conversion operation
When ADDMAEN = 1:
11111 = Increments the DMA address after completion of every 32nd sample/conversion operation
11110 = Increments the DMA address after completion of every 31st sample/conversion operation
•
•
•
00001 = Increments the DMA address after completion of every 2nd sample/conversion operation
00000 = Increments the DMA address after completion of every sample/conversion operation
Note 1:
The ADCx V
REFH
Input is connected to AV
DD
and the V
REFL
input is connected to AV
SS
.
Value V
REFH
V
REFL
xxx AV
DD
AV
SS
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bit 1
BUFM:
Buffer Fill Mode Select bit
1 = Starts buffer filling the first half of the buffer on the first interrupt and the second half of the buffer
on the next interrupt
0 = Always starts filling the buffer from the Start address
bit 0
ALTS:
Alternate Input Sample Mode Select bit
1 =
Uses channel input selects for Sample MUX A on the first sample and Sample MUX B on the next sample
0 = Always uses channel input selects for Sample MUX A
REGISTER 24-2: ADxCON2: ADCx CONTROL REGISTER 2 (CONTINUED)
Note 1:
The ADCx V
REFH
Input is connected to AV
DD
and the V
REFL
input is connected to AV
SS
.
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REGISTER 24-3: ADxCON3: ADCx CONTROL REGISTER 3
R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADRC —— SAMC4
(1)
SAMC3
(1)
SAMC2
(1)
SAMC1
(1)
SAMC0
(1)
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
ADCS7
(2)
ADCS6
(2)
ADCS5
(2)
ADCS4
(2)
ADCS3
(2)
ADCS2
(2)
ADCS1
(2)
ADCS0
(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
ADRC:
ADCx Conversion Clock Source bit
1 = ADCx internal RC clock
0 = Clock derived from system clock
bit 14-13
Unimplemented:
Read as ‘0’
bit 12-8
SAMC<4:0>:
Auto-Sample Time bits
(1)
11111 = 31 T
AD
•
•
•
00001 = 1 T
AD
00000 = 0 T
AD
bit 7-0
ADCS<7:0>:
ADCx Conversion Clock Select bits
(2)
11111111 = T
P
• (ADCS<7:0> + 1) = T
P
• 256 = T
AD
•
•
•
00000010 = T
P
• (ADCS<7:0> + 1) = T
P
• 3 = T
AD
00000001 = T
P
• (ADCS<7:0> + 1) = T
P
• 2 = T
AD
00000000 = T
P
• (ADCS<7:0> + 1) = T
P
• 1 = T
AD
Note 1:
These bits are only used if SSRC<2:0> (ADxCON1<7:5>) = 111 and SSRCG (ADxCON1<4>) = 0.
2:
These bits are not used if ADRC (ADxCON3<15>) = 1.
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REGISTER 24-4: ADxCON4: ADCx CONTROL REGISTER 4
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R/W-0
— — — — — — — ADDMAEN
bit 15 bit 8
U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0
— — — — — DMABL2 DMABL1 DMABL0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-9
Unimplemented:
Read as ‘0’
bit 8
ADDMAEN:
ADCx DMA Enable bit
1 = Conversion results are stored in the ADC1BUF0 register for transfer to RAM using DMA
0 = Conversion results are stored in the ADC1BUF0 through ADC1BUFF registers; DMA will not be used
bit 7-3
Unimplemented:
Read as ‘0’
bit 2-0
DMABL<2:0>:
Selects Number of DMA Buffer Locations per Analog Input bits
111 = Allocates 128 words of buffer to each analog input
110 = Allocates 64 words of buffer to each analog input
101 = Allocates 32 words of buffer to each analog input
100 = Allocates 16 words of buffer to each analog input
011 = Allocates 8 words of buffer to each analog input
010 = Allocates 4 words of buffer to each analog input
001 = Allocates 2 words of buffer to each analog input
000 = Allocates 1 word of buffer to each analog input
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REGISTER 24-5: ADxCHS123: ADCx INPUT CHANNELS 1, 2, 3 SELECT REGISTER
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — CH123SB2 CH123SB1 CH123NB1 CH123NB0 CH123SB0
bit 15 bit 8
U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — CH123SA2 CH123SA1 CH123NA1 CH123NA0 CH123SA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-13
Unimplemented:
Read as ‘0’
bit 12-11
CH123SB<2:1>:
Channels 1, 2, 3 Positive Input Select for Sample B bits
1xx = CH1 positive input is AN0 (Op Amp 2), CH2 positive input is AN25 (Op Amp 5), CH3 positive
input is AN6 (Op Amp 3)
011 = CH1 positive input is AN3 (Op Amp 1), CH2 positive input is AN0 (Op Amp 2), CH3 positive input
is AN25 (Op Amp 5)
010 = CH1 positive input is AN3 (Op Amp 1), CH2 positive input is AN0 (Op Amp 2), CH3 positive input
is AN6 (Op Amp 3)
001 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5
000 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2
bit 10-9
CH123NB<1:0>:
Channels 1, 2, 3 Negative Input Select for Sample B bits
11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11
10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8
0x = CH1, CH2, CH3 negative inputs are V
REFL
bit 8
CH123SB0:
Channels 1, 2, 3 Positive Input Select for Sample B bit
See bits<12:11> for bit selections.
bit 7-5
Unimplemented:
Read as ‘0’
bit 4-3
CH123SA<2:1>:
Channels 1, 2, 3 Positive Input Select for Sample A bits
1xx = CH1 positive input is AN0 (Op Amp 2), CH2 positive input is AN25 (Op Amp 5), CH3 positive
input is AN6 (Op Amp 3)
011 = CH1 positive input is AN3 (Op Amp 1), CH2 positive input is AN0 (Op Amp 2), CH3 positive input
is AN25 (Op Amp 5)
010 = CH1 positive input is AN3 (Op Amp 1), CH2 positive input is AN0 (Op Amp 2), CH3 positive input
is AN6 (Op Amp 3)
001 = CH1 positive input is AN3, CH2 positive input is AN4, CH3 positive input is AN5
000 = CH1 positive input is AN0, CH2 positive input is AN1, CH3 positive input is AN2
bit 2-1
CH123NA<1:0>:
Channels 1, 2, 3 Negative Input Select for Sample A bits
11 = CH1 negative input is AN9, CH2 negative input is AN10, CH3 negative input is AN11
10 = CH1 negative input is AN6, CH2 negative input is AN7, CH3 negative input is AN8
0x = CH1, CH2, CH3 negative inputs are V
REFL
bit 0
CH123SA0:
Channels 1, 2, 3 Positive Input Select for Sample A bit
See bits<4:3> for bit selections.
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REGISTER 24-6: ADxCHS0: ADCx INPUT CHANNEL 0 SELECT REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CH0NB — CH0SB5
(1,3)
CH0SB4
(1,3)
CH0SB3
(1,3)
CH0SB2
(1,3)
CH0SB1
(1,3)
CH0SB0
(1,3)
bit 15 bit 8
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CH0NA — CH0SA5
(1,3)
CH0SA4
(1,3)
CH0SA3
(1,3)
CH0SA2
(1,3)
CH0SA1
(1,3)
CH0SA0
(1,3)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
CH0NB:
Channel 0 Negative Input Select for Sample MUX B bit
1 = Channel 0 negative input is AN1
(1)
0 = Channel 0 negative input is V
REFL
bit 14
Unimplemented:
Read as ‘0’
bit 13-8
CH0SB<5:0>:
Channel 0 Positive Input Select for Sample MUX B bits
(1,3)
111111 = Channel 0 positive input is AN63 (unconnected)
111110 = Channel 0 positive input is AN62 (CTMU temperature diode)
111101 = Channel 0 positive input is AN61 (internal band gap voltage)
•
•
•
011111 = Channel 0 positive input is AN31
011110 = Channel 0 positive input is AN30
•
•
•
000001 = Channel 0 positive input is AN1
000000 = Channel 0 positive input is AN0 (Op Amp 2)
(2)
bit 7
CH0NA:
Channel 0 Negative Input Select for Sample MUX A bit
1 = Channel 0 negative input is AN1
(1)
0 = Channel 0 negative input is V
REFL
bit 6
Unimplemented:
Read as ‘0’
Note 1:
AN0 to AN7 are repurposed when comparator and op amp functionality are enabled. See Figure 24-1 to
determine how enabling a particular op amp or comparator affects selection choices for Channels 1, 2 and 3.
2:
If the op amp is selected (OPAEN bit (CMxCON<10>) = 1), the OAx input is used; otherwise, the ANx
input is used.
3:
See the
“Pin Diagrams”
section for the available analog channels for each device.
2013-2018 Microchip Technology Inc. DS70005144G-page 299
dsPIC33EVXXXGM00X/10X FAMILY
bit 5-0
CH0SA<5:0>:
Channel 0 Positive Input Select for Sample MUX A bits
(1,3)
111111 = Channel 0 positive input is AN63 (Unconnected)
111110 = Channel 0 positive input is AN62 (CTMU temperature diode)
111101 = Channel 0 positive input is AN61 (internal band gap voltage)
•
•
•
011111 = Channel 0 positive input is AN31
011110 = Channel 0 positive input is AN30
•
•
•
000001 = Channel 0 positive input is AN1
000000 = Channel 0 positive input is AN0 (Op Amp 2)
(2)
REGISTER 24-6: ADxCHS0: ADCx INPUT CHANNEL 0 SELECT REGISTER (CONTINUED)
Note 1:
AN0 to AN7 are repurposed when comparator and op amp functionality are enabled. See Figure 24-1 to
determine how enabling a particular op amp or comparator affects selection choices for Channels 1, 2 and 3.
2:
If the op amp is selected (OPAEN bit (CMxCON<10>) = 1), the OAx input is used; otherwise, the ANx
input is used.
3:
See the
“Pin Diagrams”
section for the available analog channels for each device.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 300 2013-2018 Microchip Technology Inc.
REGISTER 24-7: ADxCSSH: ADCx INPUT SCAN SELECT REGISTER HIGH
(2)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CSS31 CSS30 CSS29 CSS28 CSS27 CSS26
(1)
CSS25
(1)
CSS24
(1)
bit 15 bit 8
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
— — — — CSS19 CSS18 CSS17 CSS16
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
CSS31:
ADCx Input Scan Selection bit
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 14
CSS30:
ADCx Input Scan Selection bit
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 13
CSS29:
ADCx Input Scan Selection bits
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 12
CSS28:
ADCx Input Scan Selection bit
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 11
CSS27:
ADCx Input Scan Selection bit
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 10
CSS26:
ADCx Input Scan Selection bit
(1)
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 9
CSS25:
ADCx Input Scan Selection bit
(1)
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 8
CSS24:
ADCx Input Scan Selection bit
(1)
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 7-4
Unimplemented:
Read as ‘0’
bit 3
CSS19:
ADCx Input Scan Selection bit
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 2
CSS18:
ADCx Input Scan Selection bit
1 = Selects ANx for input scan
0 = Skips ANx for input scan
Note 1:
If the op amp is selected (OPAEN bit (CMxCON<10>) = 1), the OAx input is used; otherwise, the ANx
input is used.
2:
All bits in this register can be selected by the user application. However, inputs selected for scan without a
corresponding input on the device convert V
REFL
.
2013-2018 Microchip Technology Inc. DS70005144G-page 301
dsPIC33EVXXXGM00X/10X FAMILY
bit 1
CSS17:
ADCx Input Scan Selection bit
1 = Selects ANx for input scan
0 = Skips ANx for input scan
bit 0
CSS16:
ADCx Input Scan Selection bit
1 = Selects ANx for input scan
0 = Skips ANx for input scan
REGISTER 24-7: ADxCSSH: ADCx INPUT SCAN SELECT REGISTER HIGH
(2)
(CONTINUED)
Note 1:
If the op amp is selected (OPAEN bit (CMxCON<10>) = 1), the OAx input is used; otherwise, the ANx
input is used.
2:
All bits in this register can be selected by the user application. However, inputs selected for scan without a
corresponding input on the device convert V
REFL
.
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REGISTER 24-8: ADxCSSL: ADCx INPUT SCAN SELECT REGISTER LOW
(1,2)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CSS<15:8>
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
CSS<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-0
CSS<15:0>:
ADCx Input Scan Selection bits
1 = Selects ANx for input scan
0 = Skips ANx for input scan
Note 1:
On devices with less than 16 analog inputs, all bits in this register can be selected by the user application.
However, inputs selected for scan without a corresponding input on the device convert V
REFL
.
2:
CSSx = ANx, where x = 0-5.
2013-2018 Microchip Technology Inc. DS70005144G-page 303
dsPIC33EVXXXGM00X/10X FAMILY
25.0 OP AMP/COMPARATOR
MODULE
The dsPIC33EVXXXGM00X/10X family devices contain
up to five comparators that can be configured in various
ways. CMP1, CMP2, CMP3 and CMP5 also have the
option to be configured as op amps, with the output
being brought to an external pin for gain/filtering connec-
tions. As shown in Figure 25-1, individual comparator
options are specified by the comparator module’s
Special Function Register (SFR) control bits.
The following options allow users to:
• Select the Edge for Trigger and Interrupt Generation
• Configure the Comparator Voltage Reference
• Configure Output Blanking and Masking
• Configure as a Comparator or Op Amp
(CMP1, CMP2, CMP3 and CMP5 only)
FIGURE 25-1: OP AMP/COMPARATOR x MODULE BLOCK DIAGRAM
Note 1:
This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to
“Op Amp/Comparator”
(DS70000357) in the “dsPIC33/PIC24
Family Referenc e Ma nual”, which is avail-
able from the Microchip web site
(www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
Note:
Not all op amp/comparator input/output
connections are available on all devices.
See the
“Pin Diagrams”
section for
available connections.
Blanking
Function
Digital
Filter CxOUT
(1)
(see Figure 25-2)(see Figure 25-3)
CMP4
Blanking
Function
Digital
Filter
(see Figure 25-2)(see Figure 25-3)
–
+
V
IN
+
C4OUT
(1)
Trigger
Output
0
1
00
10
Op Amp/Comparator 1, 2, 3, 5
Comparator 4
C4IN1+
CV
REFIN
V
IN
-
0
1
11
00
CCH<1:0> (CM4CON<1:0>)
OA3/AN6/C4IN4-
C4IN1-
CREF (CMxCON<4>)
01
10
OA1/AN3/C4IN2-
OA2/AN0/C4IN3-
(x = 1, 2, 3, 5)
CxIN1+
CV
REFIN
CxIN1-
C
X
IN3-
CMPx
–
+
V
IN
-
V
IN
+
CCH<1:0> (CMxCON<1:0>)
CREF (CMxCON<4>)
Op Amp/Comparator
Op Amp x
–
+
OAx
OAxOUT
OPAEN (CMxCON<10>)
(to ADC)
01
CxIN2-
11
C
X
IN4-
Note 1:
The CxOUT pin is not a dedicated output pin on the device. This must be mapped to a physical pin using
Peripheral Pin Select (PPS). Refer to
Section 11.0 “I/O Ports”
for more information.
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Figure 25-2, shows the user-programmable blanking
function block diagram.
FIGURE 25-2: USER-PROGRAMMAB LE BLANKING FUNCTION BLOCK DIAGRAM
Figure 25-3, shows the digital filter interconnect block
diagram.
FIGURE 25-3: DIGITAL FILTER INTERCONNECT BLOCK DIAGRAM
SELSRCA<3:0>
SELSRCB<3:0>
SELSRCC<3:0>
AND
CMxMSKCON
MUX A
MAI
MBI
MCI
Comparator Output
To Di g i t al
Signals
Filter
OR
Blanking
Blanking
Blanking
Signals
Signals
ANDI
Mask
“AND-OR” Function
HLMS
MUX BMUX C
Blanking
Logic
(CMxMSKCON<15>)
(CMxMSKSRC<11:8>)
(CMxMSKSRC<7:4>)
(CMxMSKSRC<3:0>)
MBI
MCI
MAI
MBI
MCI
MAI
CxOUT
CFLTREN
Digital Filter
TX Timer Match
(1,2)
SYNCO1
(3)
F
P(4)
F
OSC(4)
CFSEL<2:0>
CFDIV
Note 1:
See the Type C Timer Block Diagram (Figure 13-2).
2:
See the Type B Timer Block Diagram (Figure 13-1).
3:
See the PWMx Module Register Interconnect Diagram (Figure 17-2).
4:
See the Oscillator System Diagram (Figure 9-1).
From Blanking Logic
1xx
010
000
001
1
0
(CMxFLTR<6:4>) (CMxFLTR<3>)
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dsPIC33EVXXXGM00X/10X FAMILY
25.1 Op Amp/Comp arator Control
Registers
REGISTER 25-1: CMSTAT: OP AMP/COMPARATOR STATUS REGISTER
R/W-0 U-0 U-0 R-0 R-0 R-0 R-0 R-0
PSIDL ——C5EVT
(1)
C4EVT
(1)
C3EVT
(1)
C2EVT
(1)
C1EVT
(1)
bit 15 bit 8
U-0 U-0 U-0 R-0 R-0 R-0 R-0 R-0
— — —C5OUT
(2)
C4OUT
(2)
C3OUT
(2)
C2OUT
(2)
C1OUT
(2)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
PSIDL:
Op Amp/Comparator Stop in Idle Mode bit
1 = Discontinues operation of all op amps/comparators when device enters Idle mode
0 = Continues operation of all op amps/comparators in Idle mode
bit 14-13
Unimplemented:
Read as ‘0’
bit 12-8
C<5:1>EVT:
Op Amp/Comparator 1-5 Event Status bits
(1)
1 = Op amp/comparator event occurred
0 = Op amp/comparator event did not occur
bit 7-5
Unimplemented:
Read as ‘0’
bit 4-0
C<5:1>OUT:
Op Amp/Comparator 1-5 Output Status bits
(2)
When CPOL = 0:
1 = V
IN
+ > V
IN
-
0 = V
IN
+ < V
IN
-
When CPOL = 1:
1 = V
IN
+ < V
IN
-
0 = V
IN
+ > V
IN
-
Note 1:
Reflects the value of the of the CEVT bit in the respective Op Amp/Comparator Control register,
CMxCON<9>.
2:
Reflects the value of the COUT bit in the respective Op Amp/Comparator Control register, CMxCON<8>.
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REGISTER 25-2: CMxCON: COMP ARAT OR x CONTRO L REG ISTER (x = 1, 2, 3 OR 5)
R/W-0 R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R-0
CON COE CPOL —— OPAEN
(2)
CEVT COUT
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0
EVPOL1
(3)
EVPOL0
(3)
—CREF
(1)
—— CCH1
(1)
CCH0
(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
CON:
Op Amp/Comparator x Enable bit
1 = Op Amp/Comparator x is enabled
0 = Op Amp/Comparator x is disabled
bit 14
COE:
Comparator x Output Enable bit
1 = Comparator output is present on the CxOUT pin
0 = Comparator output is internal only
bit 13
CPOL:
Comparator x Output Polarity Select bit
1 = Comparator output is inverted
0 = Comparator output is not inverted
bit 12-11
Unimplemented:
Read as ‘0’
bit 10
OPAEN:
Op Amp x Enable bit
(2)
1 = Op Amp x is enabled
0 = Op Amp x is disabled
bit 9
CEVT:
Comparator x Event bit
1 = Comparator event, according to EVPOL<1:0> settings, occurred; disables future triggers and
interrupts until the bit is cleared
0 = Comparator event did not occur
bit 8
COUT:
Comparator x Output bit
When CPOL = 0 (non-inverted polarity):
1 = V
IN
+ > V
IN
-
0 = V
IN
+ < V
IN
-
When CPOL = 1 (inverted polarity):
1 = V
IN
+ < V
IN
-
0 = V
IN
+ > V
IN
-
Note 1:
Inputs that are selected and not available will be tied to V
SS
. See the
“Pin Diagrams”
section for available
inputs for each package.
2:
The op amp and the comparator can be used simultaneously in these devices. The OPAEN bit only
enables the op amp while the comparator is still functional.
3:
After configuring the comparator, either for a high-to-low or low-to-high COUT transition
(EVPOL<1:0> (CMxCON<7:6>) = 10 or 01), the Comparator x Event bit, CEVT (CMxCON<9>), and the
Comparator Interrupt Flag, CMPIF (IFS1<2>), must be cleared before enabling the Comparator Interrupt
Enable bit, CMPIE (IEC1<2>).
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dsPIC33EVXXXGM00X/10X FAMILY
bit 7-6
EVPOL<1:0>:
Trigger/Event/Interrupt Polarity Select bits
(3)
11 = Trigger/event/interrupt generated on any change of the comparator output (while CEVT = 0)
10 = Trigger/event/interrupt generated only on high-to-low transition of the polarity selected comparator
output (while CEVT = 0)
If CPOL = 1 (inverted polarity):
Low-to-high transition of the comparator output.
If CPOL = 0 (non-inverted polarity):
High-to-low transition of the comparator output.
01 = Trigger/event/interrupt generated only on low-to-high transition of the polarity selected comparator
output (while CEVT = 0)
If CPOL = 1 (inverted polarity):
High-to-low transition of the comparator output.
If CPOL = 0 (non-inverted polarity):
Low-to-high transition of the comparator output.
00 = Trigger/event/interrupt generation is disabled
bit 5
Unimplemented:
Read as ‘0’
bit 4
CREF:
Comparator x Reference Select bit (V
IN
+ input)
(1)
1 = V
IN
+ input connects to the internal CV
REFIN
voltage
0 = V
IN
+ input connects to the CxIN1+ pin
bit 3-2
Unimplemented:
Read as ‘0’
bit 1-0
CCH<1:0>:
Op Amp/Comparator x Channel Select bits
(1)
11 = Inverting input of op amp/comparator connects to the CxIN4- pin
10 = Inverting input of op amp/comparator connects to the CxIN3- pin
01 = Inverting input of op amp/comparator connects to the CxIN2- pin
00 = Inverting input of op amp/comparator connects to the CxIN1- pin
REGISTER 25-2: CMxCON: COMPARATOR x CONTROL REGISTER (x = 1, 2, 3 O R 5) (CONTINUED)
Note 1:
Inputs that are selected and not available will be tied to V
SS
. See the
“Pin Diagrams”
section for available
inputs for each package.
2:
The op amp and the comparator can be used simultaneously in these devices. The OPAEN bit only
enables the op amp while the comparator is still functional.
3:
After configuring the comparator, either for a high-to-low or low-to-high COUT transition
(EVPOL<1:0> (CMxCON<7:6>) = 10 or 01), the Comparator x Event bit, CEVT (CMxCON<9>), and the
Comparator Interrupt Flag, CMPIF (IFS1<2>), must be cleared before enabling the Comparator Interrupt
Enable bit, CMPIE (IEC1<2>).
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REGISTER 25-3: CM4CON: COMPARATOR 4 CONTROL REGISTER
R/W-0 R/W-0 R/W-0 U-0 U-0 U-0 R/W-0 R-0
CON COE CPOL — — —CEVTCOUT
bit 15 bit 8
R/W-0 R/W-0 U-0 R/W-0 U-0 U-0 R/W-0 R/W-0
EVPOL1
(2)
EVPOL0
(2)
—CREF
(1)
—— CCH1
(1)
CCH0
(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
CON:
Op Amp/Comparator 4 Enable bit
1 = Comparator is enabled
0 = Comparator is disabled
bit 14
COE:
Comparator 4 Output Enable bit
1 = Comparator output is present on the C4OUT pin
0 = Comparator output is internal only
bit 13
CPOL:
Comparator 4 Output Polarity Select bit
1 = Comparator output is inverted
0 = Comparator output is not inverted
bit 12-10
Unimplemented:
Read as ‘0’
bit 9
CEVT:
Comparator 4 Event bit
1 = Comparator event, according to EVPOL<1:0> settings, occurred; disables future triggers and
interrupts until the bit is cleared
0 = Comparator event did not occur
bit 8
COUT:
Comparator 4 Output bit
When CPOL = 0 (non-inverted polarity):
1 = V
IN
+ > V
IN
-
0 = V
IN
+ < V
IN
-
When CPOL = 1 (inverted polarity):
1 = V
IN
+ < V
IN
-
0 = V
IN
+ > V
IN
-
Note 1:
Inputs that are selected and not available will be tied to V
SS
. See the
“Pin Diagrams”
section for available
inputs for each package.
2:
After configuring the comparator, either for a high-to-low or low-to-high COUT transition
(EVPOL<1:0> (CMxCON<7:6>) = 10 or 01), the comparator Event bit, CEVT (CMxCON<9>), and the
Comparator Combined Interrupt Flag, CMPIF (IFS1<2>), must be cleared before enabling the Comparator
Interrupt Enable bit, CMPIE (IEC1<2>).
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bit 7-6
EVPOL<1:0>:
Trigger/Event/Interrupt Polarity Select bits
(2)
11 = Trigger/event/interrupt generated on any change of the comparator output (while CEVT = 0)
10 = Trigger/event/interrupt generated only on high-to-low transition of the polarity selected comparator
output (while CEVT = 0)
If CPOL = 1 (inverted polarity):
Low-to-high transition of the comparator output.
If CPOL = 0 (non-inverted polarity):
High-to-low transition of the comparator output.
01 = Trigger/event/interrupt generated only on low-to-high transition of the polarity selected comparator
output (while CEVT = 0)
If CPOL = 1 (inverted polarity):
High-to-low transition of the comparator output.
If CPOL = 0 (non-inverted polarity):
Low-to-high transition of the comparator output.
00 = Trigger/event/interrupt generation is disabled
bit 5
Unimplemented:
Read as ‘0’
bit 4
CREF:
Comparator 4 Reference Select bit (V
IN
+ input)
(1)
1 = V
IN
+ input connects to the internal CV
REFIN
voltage
0 = V
IN
+ input connects to the C4IN1+ pin
bit 3-2
Unimplemented:
Read as ‘0’
bit 1-0
CCH<1:0>:
Comparator 4 Channel Select bits
(1)
11 = V
IN
- input of comparator connects to the C4IN4- pin
10 = V
IN
- input of comparator connects to the C4IN3- pin
01 = V
IN
- input of comparator connects to the C4IN2- pin
00 = V
IN
- input of comparator connects to the C4IN1- pin
REGISTER 25-3: CM4CON: COMPARATOR 4 CONTROL REGISTER (CONTINUED)
Note 1:
Inputs that are selected and not available will be tied to V
SS
. See the
“Pin Diagrams”
section for available
inputs for each package.
2:
After configuring the comparator, either for a high-to-low or low-to-high COUT transition
(EVPOL<1:0> (CMxCON<7:6>) = 10 or 01), the comparator Event bit, CEVT (CMxCON<9>), and the
Comparator Combined Interrupt Flag, CMPIF (IFS1<2>), must be cleared before enabling the Comparator
Interrupt Enable bit, CMPIE (IEC1<2>).
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REGISTER 25-4: CMxMSKSRC: COMPARATOR x MASK SOURCE SELECT
CONTROL REGISTER
U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 RW-0
— — — — SELSRCC3 SELSRCC2 SELSRCC1 SELSRCC0
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
SELSRCB3 SELSRCB2 SELSRCB1 SELSRCB0 SELSRCA3 SELSRCA2 SELSRCA1 SELSRCA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-12
Unimplemented:
Read as ‘0’
bit 11-8
SELSRCC<3:0>:
Mask C Input Select bits
1111 = FLT4
1110 = FLT2
1101 = Reserved
1100 = Reserved
1011 = Reserved
1010 = Reserved
1001 = Reserved
1000 = Reserved
0111 = Reserved
0110 = Reserved
0101 = PWM3H
0100 = PWM3L
0011 = PWM2H
0010 = PWM2L
0001 = PWM1H
0000 = PWM1L
bit 7-4
SELSRCB<3:0>:
Mask B Input Select bits
1111 = FLT4
1110 = FLT2
1101 = Reserved
1100 = Reserved
1011 = Reserved
1010 = Reserved
1001 = Reserved
1000 = Reserved
0111 = Reserved
0110 = Reserved
0101 = PWM3H
0100 = PWM3L
0011 = PWM2H
0010 = PWM2L
0001 = PWM1H
0000 = PWM1L
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bit 3-0
SELSRCA<3:0>:
Mask A Input Select bits
1111 = FLT4
1110 = FLT2
1101 = Reserved
1100 = Reserved
1011 = Reserved
1010 = Reserved
1001 = Reserved
1000 = Reserved
0111 = Reserved
0110 = Reserved
0101 = PWM3H
0100 = PWM3L
0011 = PWM2H
0010 = PWM2L
0001 = PWM1H
0000 = PWM1L
REGISTER 25-4: CMxMSKSRC: COMPARATOR x MASK SOURCE SELECT
CONTROL REGISTER (CONTINUED)
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REGISTER 25-5: CMxMSKCON: COMPARATOR x MASK GATING CONTROL
REGISTER
R/W-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
HLMS — OCEN OCNEN OBEN OBNEN OAEN OANEN
bit 15 bit 8
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
NAGS PAGS ACEN ACNEN ABEN ABNEN AAEN AANEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
HLMS:
High or Low-Level Masking Select bit
1 = The masking (blanking) function will prevent any asserted (‘0’) comparator signal from propagating
0 = The masking (blanking) function will prevent any asserted (‘1’) comparator signal from propagating
bit 14
Unimplemented:
Read as ‘0’
bit 13
OCEN:
OR Gate C Input Enable bit
1 = MCI is connected to OR gate
0 = MCI is not connected to OR gate
bit 12
OCNEN:
OR Gate C Input Inverted Enable bit
1 = Inverted MCI is connected to OR gate
0 = Inverted MCI is not connected to OR gate
bit 11
OBEN:
OR Gate B Input Enable bit
1 = MBI is connected to OR gate
0 = MBI is not connected to OR gate
bit 10
OBNEN:
OR Gate B Input Inverted Enable bit
1 = Inverted MBI is connected to OR gate
0 = Inverted MBI is not connected to OR gate
bit 9
OAEN:
OR Gate A Input Enable bit
1 = MAI is connected to OR gate
0 = MAI is not connected to OR gate
bit 8
OANEN:
OR Gate A Input Inverted Enable bit
1 = Inverted MAI is connected to OR gate
0 = Inverted MAI is not connected to OR gate
bit 7
NAGS:
AND Gate Output Inverted Enable bit
1 = Inverted ANDI is connected to OR gate
0 = Inverted ANDI is not connected to OR gate
bit 6
PAGS:
AND Gate Output Enable bit
1 = ANDI is connected to OR gate
0 = ANDI is not connected to OR gate
bit 5
ACEN:
AND Gate C Input Enable bit
1 = MCI is connected to AND gate
0 = MCI is not connected to AND gate
bit 4
ACNEN:
AND Gate C Input Inverted Enable bit
1 = Inverted MCI is connected to AND gate
0 = Inverted MCI is not connected to AND gate
2013-2018 Microchip Technology Inc. DS70005144G-page 313
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bit 3
ABEN:
AND Gate B Input Enable bit
1 = MBI is connected to AND gate
0 = MBI is not connected to AND gate
bit 2
ABNEN:
AND Gate B Input Inverted Enable bit
1 = Inverted MBI is connected to AND gate
0 = Inverted MBI is not connected to AND gate
bit 1
AAEN:
AND Gate A Input Enable bit
1 = MAI is connected to AND gate
0 = MAI is not connected to AND gate
bit 0
AANEN:
AND Gate A Input Inverted Enable bit
1 = Inverted MAI is connected to AND gate
0 = Inverted MAI is not connected to AND gate
REGISTER 25-5: CMxMSKCON: COMPARATOR x MASK GATING CONTROL
REGISTER (CONTINUED)
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REGISTER 25-6: CMxFLTR: COMPARATOR x FILTER CONTROL REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0
— — — — — — — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— CFSEL2 CFSEL1 CFSEL0 CFLTREN CFDIV2 CFDIV1 CFDIV0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15-7
Unimplemented:
Read as ‘0’
bit 6-4
CFSEL<2:0>:
Comparator x Filter Input Clock Select bits
111 = T5CLK
(1)
110 = T4CLK
(2)
101 = T3CLK
(1)
100 = T2CLK
(2)
011 = Reserved
010 = SYNCO1
(3)
001 = F
OSC(4)
000 = F
P(4)
bit 3
CFLTREN:
Comparator x Filter Enable bit
1 = Digital filter is enabled
0 = Digital filter is disabled
bit 2-0
CFDIV<2:0>:
Comparator x Filter Clock Divide Select bits
111 = Clock divide 1:128
110 = Clock divide 1:64
101 = Clock divide 1:32
100 = Clock divide 1:16
011 = Clock divide 1:8
010 = Clock divide 1:4
001 = Clock divide 1:2
000 = Clock divide 1:1
Note 1:
See the Type C Timer Block Diagram (Figure 13-2).
2:
See the Type B Timer Block Diagram (Figure 13-1).
3:
See the High-Speed PWMx Module Register Interconnection Diagram (Figure 17-2).
4:
See the Oscillator System Diagram (Figure 9-1).
2013-2018 Microchip Technology Inc. DS70005144G-page 315
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26.0 COMPARATOR VO LTAGE
REFERENCE
26.1 Configuring the Comparator
Voltage Reference
The comparator voltage reference module is controlled
through the CVRxCON registers (Register 26-1 and
Register 26-2). The comparator voltage reference
provides a range of output voltages with 128 distinct
levels. The comparator reference supply voltage can
come from either V
DD
and V
SS
, or the external CV
REF
+
and AV
SS
pins. The voltage source is selected by the
CVRSS bit (CVRxCON<11>). The settling time of the
comparator voltage reference must be considered
when changing the CV
REF
output.
Note 1:
This data sheet summarizes the features
of the dsPIC33EVXXXGM00X/10X family
of devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to
“Op Amp/Comparator”
(DS70000357) in the “dsPIC33/PIC24
Family Referenc e Ma nual”, which is avail-
able from the Microchip web site
(www.microchip.com).
2:
Some registers and associated bits
described in this section may not be
available on all devices. Refer to
Section 4.0 “Memory Organization”
in
this data sheet for device-specific register
and bit information.
dsPIC33EVXXXGM00X/10X FAMILY
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FIGURE 26-1: COMP ARATOR VOLTAGE REFERENCE BLOCK DIAGRAM
R
CVREN
CVRSS =
0
AV
DD
CV
REF
+
CVRSS =
1
R
R
R
R
R
R
128 Steps CV
REF1O
CVR3
CVR2
CVR1
CVR0
CVR1CON<6:0>
CV
RSRC
CV
REFIN
VREFSEL
1
0
R
CVREN
CVRSS =
0
AV
DD
CV
REF
+
CVRSS =
1
R
R
R
R
R
R
128 Steps CV
REF2O
CVROE
VREFSEL
0
1
AV
SS
AV
SS
CVROE
(CVR1CON<11>)
(CVR1CON<11>)
(CVR1CON<15>)
(CVR2CON<11>)
(CVR2CON<11>)
(CVR2CON<15>)
(CVR1CON<14>)
(CVR2CON<10>)
(CVR2CON<14>)
(CVR1CON<10>)
CVR4
CVR5
CVR6
CV
RSRC
128-to-1 MUX
CVR3
CVR2
CVR1
CVR0
CVR2CON<6:0>
CVR4
CVR5
CVR6
128-to-1 MUX
Note 1:
CV
REF2O
and CVROE (CVR2CON<14>) is not available on the 28-pin and 36-pin devices.
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26.2 Compar ator Volt age Reference Registers
REGISTER 26-1: CVR1CON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER 1
R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 U-0 U-0
CVREN CVROE —— CVRSS VREFSEL — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— CVR6 CVR5 CVR4 CVR3 CVR2 CVR1 CVR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
CVREN:
Comparator Voltage Reference Enable bit
1 = Comparator voltage reference circuit is powered on
0 = Comparator voltage reference circuit is powered down
bit 14
CVROE:
Comparator Voltage Reference Output Enable (CV
REF1O
Pin) bit
1 = Voltage level is output on the CV
REF1O
pin
0 = Voltage level is disconnected from the CV
REF1O
pin
bit 13-12
Unimplemented:
Read as ‘0’
bit 11
CVRSS:
Comparator Voltage Reference Source Selection bit
1 = Comparator reference source, CV
RSRC
= CV
REF
+ – AV
SS
0 = Comparator reference source, CV
RSRC
= AV
DD
– AV
SS
bit 10
VREFSEL:
Voltage Reference Select bit
1 = CV
REFIN
= CV
REF
+
0 = CV
REFIN
is generated by the resistor network
bit 9-7
Unimplemented:
Read as ‘0’
bit 6-0
CVR<6:0>:
Comparator Voltage Reference Value Selection bits
1111111 = 127/128 x V
REF
input voltage
•
•
•
0000000 = 0.0 volts
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REGISTER 26-2: CVR2CON: COMPARATOR VOLTAGE REFERENCE CONTROL REGISTER 2
R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 U-0 U-0
CVREN CVROE
(1)
—— CVRSS VREFSEL — —
bit 15 bit 8
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— CVR6 CVR5 CVR4 CVR3 CVR2 CVR1 CVR0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15
CVREN:
Comparator Voltage Reference Enable bit
1 = Comparator voltage reference circuit is powered on
0 = Comparator voltage reference circuit is powered down
bit 14
CVROE:
Comparator Voltage Reference Output Enable (CV
REF2O
Pin) bit
(1)
1 = Voltage level is output on the CV
REF2O
pin
0 = Voltage level is disconnected from the CV
REF2O
pin
bit 13-12
Unimplemented:
Read as ‘0’
bit 11
CVRSS:
Comparator Voltage Reference Source Selection bit
1 = Comparator reference source, CV
RSRC
= CV
REF
+ – AV
SS
0 = Comparator reference source, CV
RSRC
= AV
DD
– AV
SS
bit 10
VREFSEL:
Voltage Reference Select bit
1 = Comparator Reference Source 2 (CVR2) provides inverting input voltage when VREFSEL
(CVR1CON<10>) = 0
0 = Comparator Reference Source 1 (CVR1) provides inverting input voltage when VREFSEL
(CVR1CON<10>) = 0
bit 9-7
Unimplemented:
Read as ‘0’
bit 6-0
CVR<6:0>:
Comparator Voltage Reference Value Selection bits
1111111 = 127/128 x V
REF
input voltage
•
•
•
0000000 = 0.0 volts
Note 1:
CVROE (CVR2CON<14>) is not available on the 28-pin and 36-pin devices.
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27.0 SPECIAL FEATURES
The dsPIC33EVXXXGM00X/10X family devices
include several features intended to maximize
application flexibility and reliability, and minimize cost
through elimination of external components. These are:
• Flexible Configuration
• Watchdog Timer (WDT)
• Code Protection and CodeGuard™ Security
• In-Circuit Serial Programming™ (ICSP™)
• In-Circuit Emulation
27.1 Configuration Bits
In dsPIC33EVXXXGM00X/10X family devices, the
Configuration bytes are implemented as volatile
memory. This means that configuration data must be
programmed each time the device is powered up.
Configuration data is stored at the top of the on-chip
program memory space, known as the Flash Configu-
ration bytes. Their specific locations are shown in
Table 27-1. The configuration data is automatically
loaded from the Flash Configuration bytes to the proper
Configuration Shadow registers during device Resets.
When creating applications for these devices, users
should always specifically allocate the location of the
Flash Configuration bytes for configuration data in their
code for the compiler. This is to ensure that program
code is not stored in this address when the code is
compiled.
The upper two bytes of all Flash Configuration
Words in program memory should always be
‘1111 1111 1111 1111’. This makes them appear to
be NOP instructions in the remote event that their
locations are ever executed by accident. Since Config-
uration bits are not implemented in the corresponding
locations, writing ‘1’s to these locations has no effect on
device operation.
The Configuration Flash bytes map is shown in
Table 27-1.
Note:
This data sheet summarizes the features of
the dsPIC33EVXXXGM00X/10X family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the related section of the
“dsPIC33/PIC24 Family Reference Manual”,
which is available from the Microchip
web site (www.microchip.com).
Note:
Configuration data is reloaded on all types
of device Resets.
Note:
Performing a page erase operation on the
last page of program memory clears the
Flash Configuration bytes, enabling code
protection as a result. Therefore, users
should avoid performing page erase
operations on the last page of program
memory.
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TABLE 27-1: CONFIGURATION WORD REGISTER MAP
File N ame Address
Devi ce
Memory
Size
(Kbytes)
Bits
23-16 Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
FSEC 005780 32
— AIVTDIS — — — CSS2 CSS1 CSS0 CWRP GSS1 GSS0 GWRP — BSEN BSS1 BSS0 BWRP
00AB80 64
015780 128
02AB80 256
FBSLIM 005790 32
— — — — BSLIM<12:0>
00AB90 64
015790 128
02AB90 256
Reserved 005794 32
— Reserved
(1)
— — — — — — — — — — — — — — —
00AB94 64
015794 128
02AB94 256
FOSCSEL 005798 32
— — — — — — — — — IESO — — — — FNOSC2 FNOSC1 FNOSC0
00AB98 64
015798 128
02AB98 256
FOSC 00579C 32
— — — — — — — — PLLKEN FCKSM1 FCKSM0 IOL1WAY —— OSCIOFNC POSCMD1 POSCMD0
00AB9C 64
01579C 128
02AB9C 256
FWDT 0057A0 32
— — — — — — — WDTWIN1 WDTWIN0 WINDIS FWDTEN1 FWDTEN0 WDTPRE WDTPS3 WDTPS2 WDTPS1 WDTPS0
00ABA0 64
0157A0 128
02ABA0 256
FPOR 0057A4 32
— — — — — — — — — — — — — — — —BOREN
00ABA4 64
0157A4 128
02ABA4 256
FICD 0057A8 32
— — — — — — — — —Reserved
(2)
— — — — — ICS1 ICS0
00ABA8 64
0157A8 128
02ABA8 256
Legend:
— = unimplemented, read as ‘
1
’.
Note 1:
This bit is reserved and must be programmed as ‘
0
’.
2:
This bit is reserved and must be programmed as ‘
1
’.
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dsPIC33EVXXXGM00X/10X FAMILY
FDMTINTVL 0057AC 32
—DMTIVT<15:0>
00ABAC 64
0157AC 128
02ABAC 256
FDMTINTVH 0057B0 32
—DMTIVT<31:16>
00ABB0 64
0157B0 128
02ABB0 256
FDMTCNTL 0057B4 32
—DMTCNT<15:0>
00ABB4 64
0157B4 128
02ABB4 256
FDMTCNTH 0057B8 32
—DMTCNT<31:16>
00AB8 64
0157B8 128
02ABB8 256
FDMT 0057BC 32
— — — — — — — — — — — — — — — —DMTEN
00ABBC 64
0157BC 128
02ABBC 256
FDEVOPT 0057C0 32
— — — — — — — — — — — — — ALTI2C1 Reserved
(2)
—PWMLOCK
00ABC0 64
0157C0 128
02ABC0 256
FALTREG 0057C4 32
— — — — — — — — — — CTXT2<2:0> — CTXT1<2:0>
00ABC4 64
0157C4 128
02ABC4 256
TABLE 27-1: CONFIGURATION WORD REGISTER MAP (CONTINUED)
File N ame Address
Devi ce
Memory
Size
(Kbytes)
Bits
23-16 Bit 15 Bit 14 Bit 13 Bit 12 Bit 1 1 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Legend:
— = unimplemented, read as ‘
1
’.
Note 1:
This bit is reserved and must be programmed as ‘
0
’.
2:
This bit is reserved and must be programmed as ‘
1
’.
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TABLE 27-2: dsPIC33EVXXXGM00X/10X CONFIGURATION BITS DESCRIPTION
Bit Field Regis ter Description
BWRP FSEC Boot Segment Write-Protect bit
1 = User program memory is not write-protected
0 = User program memory is write-protected
BSS<1:0> FSEC Boot Segment Code Flash Protection Level bits
11 = No protection (other than BWRP write protection)
10 = Standard security
0x = High security
BSEN FSEC Boot Segment Control bit
1 = No Boot Segment
0 = Boot Segment size is determined by BSLIM<12:0>
GWRP FSEC General Segment Write-Protect bit
1 = User program memory is not write-protected
0 = User program memory is write-protected
GSS<1:0> FSEC General Segment Code Flash Protection Level bits
11 = No protection (other than GWRP write protection)
10 = Standard security
0x = High security
CWRP FSEC Configuration Segment Write-Protect bit
1 = Configuration Segment is not write-protected
0 = Configuration Segment is write-protected
CSS<2:0> FSEC Configuration Segment Code Flash Protection Level bits
111 = No protection (other than CWRP write protection)
110 = Standard security
10x = Enhanced security
0xx = High security
AIVTDIS FSEC Alternate Interrupt Vector Table Disable bit
1 = Disables AIVT
0 = Enables AIVT
BSLIM<12:0> FBSLIM Boot Segment Code Flash Page Address Limit bits
Contains the page address of the first active General Segment page. The
value to be programmed is the inverted page address, such that
programming additional ‘0’s can only increase the Boot Segment size.
For example, 0x1FFD = 2 pages or 1024 instruction words.
FNOSC<2:0> FOSCSEL Initial Oscillator Source Selection bits
111 = Internal Fast RC (FRC) Oscillator with Postscaler
110 = Internal Fast RC (FRC) Oscillator with Divide-by-16
101 = LPRC Oscillator
100 = Reserved
011 = Primary (XT, HS, EC) Oscillator with PLL
010 = Primary (XT, HS, EC) Oscillator
001 = Internal Fast RC (FRC) Oscillator with PLL
000 = FRC Oscillator
IESO FOSCSEL Two-Speed Oscillator Start-up Enable bit
1 = Starts up device with FRC, then automatically switches to the
user-selected oscillator source when ready
0 = Starts up device with user-selected oscillator source
POSCMD<1:0> FOSC Primary Oscillator Mode Select bits
11 = Primary Oscillator is disabled
10 = HS Crystal Oscillator mode
01 = XT Crystal Oscillator mode
00 = EC (External Clock) mode
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OSCIOFNC FOSC OSC2 Pin Function bit (except in XT and HS modes)
1 = OSC2 is the clock output
0 = OSC2 is the general purpose digital I/O pin
IOL1WAY FOSC Peripheral Pin Select Configuration bit
1 = Allows only one reconfiguration
0 = Allows multiple reconfigurations
FCKSM<1:0> FOSC Clock Switching Mode bits
1x = Clock switching is disabled, Fail-Safe Clock Monitor is disabled
01 = Clock switching is enabled, Fail-Safe Clock Monitor is disabled
00 = Clock switching is enabled, Fail-Safe Clock Monitor is enabled
PLLKEN FOSC PLL Lock Wait Enable bit
1 = Clock switches to the PLL source; will wait until the PLL lock signal is valid
0 = Clock switch will not wait for PLL lock
WDTPS<3:0> FWDT Watchdog Timer Postscaler bits
1111 = 1:32,768
1110 = 1:16,384
•
•
•
0001 = 1:2
0000 = 1:1
WDTPRE FWDT Watchdog Timer Prescaler bit
1 = 1:128
0 = 1:32
FWDTEN<1:0> FWDT Watchdog Timer Enable bits
11 = WDT is enabled in hardware
10 = WDT is controlled through the SWDTEN bit
01 = WDT is enabled only while device is active and disabled in Sleep; the
SWDTEN bit is disabled
00 = WDT and the SWDTEN bit are disabled
WINDIS FWDT Watchdog Timer Window Enable bit
1 = Watchdog Timer is in Non-Window mode
0 = Watchdog Timer is in Window mode
WDTWIN<1:0> FWDT Watchdog Timer Window Select bits
11 = WDT window is 25% of WDT period
10 = WDT window is 37.5% of WDT period
01 = WDT window is 50% of WDT period
00 = WDT window is 75% of WDT period
BOREN FPOR Brown-out Reset (BOR) Detection Enable bit
1 = BOR is enabled
0 = BOR is disabled
ICS<1:0> FICD ICD Communication Channel Select bits
11 = Communicates on PGEC1 and PGED1
10 = Communicates on PGEC2 and PGED2
01 = Communicates on PGEC3 and PGED3
00 = Reserved, do not use
DMTIVT<15:0> FDMTINTVL Lower 16 Bits of 32-Bit Field that Configures the DMT Window Interval bits
DMTIVT<31:16> FDMTINTVH Upper 16 Bits of 32-Bit Field that Configures the DMT Window Interval bits
DMTCNT<15:0> FDMTCNTL Lower 16 Bits of 32-Bit Field that Configures the DMT Instruction Count
Time-out Value bits
TABLE 27-2: dsPIC33EVXXXGM00X/10X CONFIGURATION BITS DESCRIPTION (CONTINUED)
Bit Field Regis ter Description
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DMTCNT<31:16> FDMCNTH Upper 16 Bits of 32-Bit Field that Configures the DMT Instruction Count
Time-out Value bits
DMTEN FDMT Deadman Timer Enable bit
1 = Deadman Timer is enabled and cannot be disabled by software
0 = Deadman Timer is disabled and can be enabled by software
PWMLOCK FDEVOPT PWM Lock Enable bit
1 = Certain PWM registers may only be written after a key sequence
0 = PWM registers may be written without a key sequence
ALTI2C1 FDEVOPT Alternate I
2
C Pins for I2C1 bit
1 = I2C1 is mapped to the SDA1/SCL1 pins
0 = I2C1 is mapped to the ASDA1/ASCL1 pins
CTXT1<2:0> FALTREG Specifies the Alternate Working Register Set 1 Association with
Interrupt Priority Level (IPL) bits
111 = Not assigned
110 = Alternate Register Set 1 is assigned to IPL Level 7
101 = Alternate Register Set 1 is assigned to IPL Level 6
100 = Alternate Register Set 1 is assigned to IPL Level 5
011 = Alternate Register Set 1 is assigned to IPL Level 4
010 = Alternate Register Set 1 is assigned to IPL Level 3
001 = Alternate Register Set 1 is assigned to IPL Level 2
000 = Alternate Register Set 1 is assigned to IPL Level 1
CTXT2<2:0> FALTREG Specifies the Alternate Working Register Set 2 Association with
Interrupt Priority Level (IPL) bits
111 = Not assigned
110 = Alternate Register Set 2 is assigned to IPL Level 7
101 = Alternate Register Set 2 is assigned to IPL Level 6
100 = Alternate Register Set 2 is assigned to IPL Level 5
011 = Alternate Register Set 2 is assigned to IPL Level 4
010 = Alternate Register Set 2 is assigned to IPL Level 3
001 = Alternate Register Set 2 is assigned to IPL Level 2
000 = Alternate Register Set 2 is assigned to IPL Level 1
TABLE 27-2: dsPIC33EVXXXGM00X/10X CONFIGURATION BITS DESCRIPTION (CONTINUED)
Bit Field Regis ter Description
2013-2018 Microchip Technology Inc. DS70005144G-page 325
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REGISTER 27-1: DEVID: DEVICE ID REGISTER
RRRRRRRR
DEVID<23:16>
(1)
bit 23 bit 16
RRRRRRRR
DEVID<15:8>
(1)
bit 15 bit 8
RRRRRRRR
DEVID<7:0>
(1)
bit 7 bit 0
Legend:
R = Read-Only bit U = Unimplemented bit
bit 23-0
DEVID<23:0>:
Device Identifier bits
(1)
Note 1:
Refer to “dsPIC33EVXXXGM0 0X/1 0X Famili es Flash Progr am ming Specifi cation ” (DS70005137) for the
list of Device ID values.
REGISTER 27-2: DEVREV: DEVICE REVISION REGISTER
RRRRRRRR
DEVREV<23:16>
(1)
bit 23 bit 16
RRRRRRRR
DEVREV<15:8>
(1)
bit 15 bit 8
RRRRRRRR
DEVREV<7:0>
(1)
bit 7 bit 0
Legend:
R = Read-only bit U = Unimplemented bit
bit 23-0
DEVREV<23:0>:
Device Revision bits
(1)
Note 1:
Refer to “dsPIC33EVXXXGM0 0X/1 0X Famili es Flash Progr am ming Specifi cation ” (DS70005137) for the
list of device revision values.
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27.2 User OTP Memory
Locations, 800F80h-800FFEh, are a One-Time-
Programmable (OTP) memory area. The user OTP
words can be used for storing product information, such
as serial numbers, system manufacturing dates, manu-
facturing lot numbers and other application-specific
information.
27.3 On-Chip Voltage Regulator
All of the dsPIC33EVXXXGM00X/10X family devices
power their core digital logic at a nominal 1.8V. This can
create a conflict for designs that are required to operate at
a higher typical voltage, such as 5.0V. To simplify system
design, all devices in the dsPIC33EVXXXGM00X/10X
family incorporate an on-chip regulator that allows the
device to run its core logic from V
DD
.
The regulator provides power to the core from the other
V
DD
pins. A low-ESR (less than 1 Ohm) capacitor (such
as tantalum or ceramic) must be connected to the V
CAP
pin (see Figure 27-1). This helps to maintain the stability
of the regulator. The recommended value for the filter
capacitor is provided in Table 30-5, located in
Section 30.0 “Electrical Characteristics”
.
FIGURE 27-1: CONNECTIONS FOR THE
ON-CHIP VO LTAGE
REGULATOR
(1,2,3)
27.4 Brown-out Reset (BOR)
The Brown-out Reset (BOR) module is based on an
internal voltage reference circuit that monitors the reg-
ulated supply voltage, V
CAP
. The main purpose of the
BOR module is to generate a device Reset when a
brown-out condition occurs. Brown-out conditions are
generally caused by glitches on the AC mains (for
example, missing portions of the AC cycle waveform
due to bad power transmission lines or voltage sags
due to excessive current draw when a large inductive
load is turned on).
A BOR generates a Reset pulse, which resets the
device. The BOR selects the clock source based on the
device Configuration bit values (FNOSC<2:0> and
POSCMD<1:0>).
If an oscillator mode is selected, the BOR activates the
Oscillator Start-up Timer (OST). The system clock is
held until OST expires. If the PLL is used, the clock is
held until the LOCK bit (OSCCON<5>) is ‘1’.
Concurrently, the Power-up Timer (PWRT) Time-out
(T
PWRT
) is applied before the internal Reset is released.
If T
PWRT
= 0 and a crystal oscillator is being used, then a
nominal delay of T
FSCM
is applied. The total delay in this
case is T
FSCM
. Refer to Parameter SY35 in Table 30-22
of
Section 30.0 “Electrical Characteristics”
for specific
T
FSCM
values.
The BOR status bit (RCON<1>) is set to indicate that a
BOR has occurred. The BOR circuit continues to oper-
ate while in Sleep or Idle mode and resets the device
should V
DD
fall below the BOR threshold voltage.
Note:
It is important for the low-ESR capacitor to
be placed as close as possible to the V
CAP
pin.
Note 1:
These are typical operating voltages.
Refer to Tab le 3 0- 4 located in
Section 30.1 “DC Characteristics”
for
the full operating ranges of V
DD
and V
CAP
.
2:
It is important for the low-ESR capacitor to
be placed as close as possible to the
V
CAP
pin.
3:
Typical V
CAP
pin voltage = 1.8V when
V
DD
≥ V
DDMIN
.
AV
DD
V
CAP
V
SS
dsPIC33EV
5.0V
C
EFC
V
DD
AV
SS
2013-2018 Microchip Technology Inc. DS70005144G-page 327
dsPIC33EVXXXGM00X/10X FAMILY
27.5 W atchdog Ti mer (WDT)
For dsPIC33EVXXXGM00X/10X family devices, the
WDT is driven by the LPRC oscillator. When the WDT
is enabled, the clock source is also enabled.
27.5.1 PRESCALER/POSTSCALER
The nominal WDT clock source from LPRC is 32 kHz.
This feeds a prescaler that can be configured for either
5-bit (divide-by-32) or 7-bit (divide-by-128) operation. The
prescaler is set by the WDTPRE Configuration bit. With a
32 kHz input, the prescaler yields a WDT Time-out Period
(T
WDT
), as shown in Parameter SY12 in Table 30-22.
A variable postscaler divides down the WDT prescaler
output and allows for a wide range of time-out periods.
The postscaler is controlled by the WDTPOST<3:0>
Configuration bits (FWDT<3:0>), which allow the
selection of 16 settings, from 1:1 to 1:32,768. Using the
prescaler and postscaler, time-out periods ranging from
1 ms to 131 seconds can be achieved.
The WDT, prescaler and postscaler are reset:
• On any device Reset
• On the completion of a clock switch, whether
invoked by software (i.e., setting the OSWEN bit
after changing the NOSCx bits) or by hardware
(i.e., Fail-Safe Clock Monitor)
• When a PWRSAV instruction is executed
(i.e., Sleep or Idle mode is entered)
• When the device exits Sleep or Idle mode to
resume normal operation
•By a CLRWDT instruction during normal execution
27.5.2 SLEEP AND IDLE MODES
If the WDT is enabled, it continues to run during Sleep or
Idle modes. When the WDT time-out occurs, the device
wakes the device and code execution continues from
where the PWRSAV instruction was executed. The corre-
sponding SLEEP or IDLE bit (RCON<3:2>) needs to be
cleared in software after the device wakes up.
27.5.3 ENABLING WDT
The WDT is enabled or disabled by the FWDTEN<1:0>
Configuration bits in the FWDT Configuration register.
When the FWDTEN<1:0> Configuration bits are set,
the WDT is always enabled.
The WDT can be optionally controlled in software
when the FWDTENx Configuration bits have been
programmed to ‘00’. The WDT is enabled in software
by setting the SWDTEN control bit (RCON<5>). The
SWDTEN control bit is cleared on any device Reset.
The software WDT option allows the user application
to enable the WDT for critical code segments and
disable the WDT during non-critical segments for
maximum power savings.
The WDT flag bit, WDTO (RCON<4>), is not automatically
cleared following a WDT time-out. To detect subsequent
WDT events, the flag must be cleared in software.
27.5.4 WDT WINDOW
The Watchdog Timer has an optional Windowed mode
enabled by programming the WINDIS bit in the WDT
Configuration register (FWDT<7>). In the Windowed
mode (WINDIS = 0), the WDT should be cleared based
on the settings in the programmable Watchdog Timer
Window (WDTWIN<1:0>) select bits.
FIGURE 27-2: WDT BLOCK DIAGRAM
Note:
The CLRWDT and PWRSAV instructions
clear the prescaler and postscaler counts
when executed.
0
1
WDTPRE WDTPOST<3:0>
Watchdog Timer
Prescaler
(Divide-by-N1)
Postscaler
(Divide-by-N2)
Sleep/Idle
WDT
WDT Window Select
WINDIS
WDT
CLRWDT
Instruction
SWDTEN
FWDTEN<1:0>
LPRC Clock
RS RS
Wake-up
Reset
WDTWIN<1:0>
All Device Resets
Transition to New Clock Source
Exit Sleep or Idle Mode
PWRSAV
Instruction
CLRWDT
Instruction
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 328 2013-2018 Microchip Technology Inc.
27.6 In-Circuit Serial Programming
The dsPIC33EVXXXGM00X/10X family devices can be
serially programmed while in the end application circuit.
This is done with two lines for clock and data, and three
other lines for power, ground and the programming
sequence. Serial programming allows customers to
manufacture boards with unprogrammed devices and
then program the device just before shipping the
product. Serial programming also allows the most recent
firmware or a custom firmware to be programmed.
Refer to “dsPIC33EVXXXGM00X/10X Families Flash
Programming Specification” (DS70005137) for details
about In-Circuit Serial Programming™ (ICSP™).
Any of the following three pairs of programming clock/
data pins can be used:
• PGEC1 and PGED1
• PGEC2 and PGED2
• PGEC3 and PGED3
27.7 In-Circuit Debugger
When MPLAB
®
ICD 3 or REAL ICE™ is selected as a
debugger, the in-circuit debugging functionality is
enabled. This function allows simple debugging functions
when used with MPLAB X IDE. Debugging functionality
is controlled through the PGECx (Emulation/Debug
Clock) and PGEDx (Emulation/Debug Data) pin
functions.
Any of the following three pairs of debugging clock/data
pins can be used:
• PGEC1 and PGED1
• PGEC2 and PGED2
• PGEC3 and PGED3
To use the in-circuit debugger function of the device,
the design must implement ICSP connections to
MCLR, V
DD
, V
SS
and the PGECx/PGEDx pin pair. In
addition, when the feature is enabled, some of the
resources are not available for general use. These
resources include the first 80 bytes of data RAM and
two I/O pins (PGECx and PGEDx).
27.8 Code Protection and
CodeGuard™ Security
The dsPIC33EVXXXGM00X/10X family devices offer
Intermediate CodeGuard Security that supports
General Segment (GS) security, Boot Segment (BS)
security and Configuration Segment (CS) security. This
feature helps protect individual Intellectual Properties.
Note:
Refer to
“CodeGuard™ Intermediate
Security”
(DS70005182) in the “dsPIC33/
PIC24 Family Reference Manual” for
further information on usage, configuration
and operation of CodeGuard Security.
2013-2018 Microchip Technology Inc. DS70005144G-page 329
dsPIC33EVXXXGM00X/10X FAMILY
28.0 INSTRUCTION SET SUMMARY
The dsPIC33EV instruction set is almost identical to
that of the dsPIC30F and dsPIC33F.
Most instructions are a single program memory word
(24 bits). Only three instructions require two program
memory locations.
Each single-word instruction is a 24-bit word, divided
into an 8-bit opcode, which specifies the instruction
type and one or more operands, which further specify
the operation of the instruction.
The instruction set is highly orthogonal and is grouped
into following five basic categories:
• Word or byte-oriented operations
• Bit-oriented operations
• Literal operations
• DSP operations
• Control operations
Table 28-1 lists the general symbols used in describing
the instructions.
The dsPIC33E instruction set summary in Tab le 2 8-2
lists all the instructions, along with the Status Flags
affected by each instruction.
Most word or byte-oriented W register instructions
(including barrel shift instructions) have the following
three operands:
• The first source operand, which is typically a
register ‘Wb’ without any address modifier
• The second source operand, which is typically a
register ‘Ws’ with or without an address modifier
• The destination of the result, which is typically a
register ‘Wd’ with or without an address modifier
However, word or byte-oriented file register instructions
have two operands:
• The file register specified by the value ‘f’
• The destination, which could be either the file
register ‘f’ or the W0 register, which is denoted as
‘WREG’
Most bit-oriented instructions (including simple rotate/
shift instructions) have two operands:
• The W register (with or without an address
modifier) or file register (specified by the value of
‘Ws’ or ‘f’)
• The bit in the W register or file register (specified
by a literal value or indirectly by the contents of
register ‘Wb’)
The literal instructions that involve data movement can
use some of the following operands:
• A literal value to be loaded into a W register or file
register (specified by ‘k’)
• The W register or file register where the literal
value is to be loaded (specified by ‘Wb’ or ‘f’)
However, literal instructions that involve arithmetic or
logical operations use some of the following operands:
• The first source operand, which is a register ‘Wb’
without any address modifier
• The second source operand, which is a literal
value
• The destination of the result (only if not the same
as the first source operand), which is typically a
register ‘Wd’ with or without an address modifier
The MAC class of DSP instructions can use some of the
following operands:
• The accumulator (A or B) to be used (required
operand)
• The W registers to be used as the two operands
• The X and Y address space prefetch operations
• The X and Y address space prefetch destinations
• The accumulator write-back destination
The other DSP instructions do not involve any
multiplication and can include:
• The accumulator to be used (required)
• The source or destination operand (designated as
Wso or Wdo, respectively) with or without an
address modifier
• The amount of shift specified by a W register ‘Wn’
or a literal value
The control instructions can use some of the following
operands:
• A program memory address
• The mode of the Table Read and Table Write
instructions
Note:
This data sheet summarizes the features of
the dsPIC33EVXXXGM00X/10X family of
devices. It is not intended to be a
comprehensive reference source. To
complement the information in this data
sheet, refer to the related section of the
“dsPIC33/PIC24 Family Reference Manual”,
which is available from the Microchip
web site (www.microchip.com).
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 330 2013-2018 Microchip Technology Inc.
Most instructions are a single word. Certain double-word
instructions are designed to provide all the required
information in these 48 bits. In the second word, the
eight MSbs are ‘0’s. If this second word is executed as
an instruction (by itself), it executes as a NOP.
The double-word instructions execute in two instruction
cycles.
Most single-word instructions are executed in a single
instruction cycle, unless a conditional test is true, or the
Program Counter is changed as a result of the
instruction, or a PSV or Table Read is performed. In
these cases, the execution takes multiple instruction
cycles with the additional instruction cycle(s) executed
as a NOP. Certain instructions that involve skipping over
the subsequent instruction require either two or three
cycles if the skip is performed, depending on whether
the instruction being skipped is a single-word or two-
word instruction. Moreover, double-word moves require
two cycles.
Note:
For more details on the instruction set, refer
to the “16-Bit MCU and DSC Programmer’s
Reference Manual” (DS70000157).
TABLE 28-1: SYMBOLS USED IN OPCODE DESCRIPTIONS
Field Description
#text Means literal defined by “
text
”
(text) Means “content of
text
”
[text] Means “the location addressed by
text
”
{ } Optional field or operation
a {b, c, d} a is selected from the set of values b, c, d
<n:m> Register bit field
.b Byte mode selection
.d Double-Word mode selection
.S Shadow register select
.w Word mode selection (default)
Acc One of two accumulators {A, B}
AWB Accumulator Write-Back Destination Address register {W13, [W13]+ = 2}
bit4 4-bit bit selection field (used in word-addressed instructions) {0...15}
C, DC, N, OV, Z MCU Status bits: Carry, Digit Carry, Negative, Overflow, Sticky Zero
Expr Absolute address, label or expression (resolved by the linker)
f File register address {0x0000...0x1FFF}
lit1 1-bit unsigned literal {0,1}
lit4 4-bit unsigned literal {0...15}
lit5 5-bit unsigned literal {0...31}
lit8 8-bit unsigned literal {0...255}
lit10 10-bit unsigned literal {0...255} for Byte mode, {0:1023} for Word mode
lit14 14-bit unsigned literal {0...16384}
lit16 16-bit unsigned literal {0...65535}
lit23 23-bit unsigned literal {0...8388608}; LSb must be ‘
0
’
None Field does not require an entry, can be blank
OA, OB, SA, SB DSP Status bits: ACCA Overflow, ACCB Overflow, ACCA Saturate, ACCB Saturate
PC Program Counter
Slit10 10-bit signed literal {-512...511}
Slit16 16-bit signed literal {-32768...32767}
Slit6 6-bit signed literal {-16...16}
Wb Base W register {W0...W15}
Wd Destination W register { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] }
Wdo Destination W register
{ Wnd, [Wnd], [Wnd++], [Wnd--], [++Wnd], [--Wnd], [Wnd+Wb] }
Wm,Wn Dividend, Divisor Working register pair (Direct Addressing)
2013-2018 Microchip Technology Inc. DS70005144G-page 331
dsPIC33EVXXXGM00X/10X FAMILY
Wm*Wm Multiplicand and Multiplier Working register pair for Square instructions
{W4 * W4,W5 * W5,W6 * W6,W7 * W7}
Wm*Wn Multiplicand and Multiplier Working register pair for DSP instructions
{W4 * W5,W4 * W6,W4 * W7,W5 * W6,W5 * W7,W6 * W7}
Wn One of 16 Working registers {W0...W15}
Wnd One of 16 Destination Working registers {W0...W15}
Wns One of 16 Source Working registers {W0...W15}
WREG W0 (Working register used in file register instructions)
Ws Source W register { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] }
Wso Source W register
{ Wns, [Wns], [Wns++], [Wns--], [++Wns], [--Wns], [Wns+Wb] }
Wx X Data Space Prefetch Address register for DSP instructions
{[W8] + = 6, [W8] + = 4, [W8] + = 2, [W8], [W8] - = 6, [W8] - = 4, [W8] - = 2,
[W9] + = 6, [W9] + = 4, [W9] + = 2, [W9], [W9] - = 6, [W9] - = 4, [W9] - = 2,
[W9 + W12], none}
Wxd X Data Space Prefetch Destination register for DSP instructions {W4...W7}
Wy Y Data Space Prefetch Address register for DSP instructions
{[W10] + = 6, [W10] + = 4, [W10] + = 2, [W10], [W10] - = 6, [W10] - = 4, [W10] - = 2,
[W11] + = 6, [W11] + = 4, [W11] + = 2, [W11], [W11] - = 6, [W11] - = 4, [W11] - = 2,
[W11 + W12], none}
Wyd Y Data Space Prefetch Destination register for DSP instructions {W4...W7}
TABLE 28-1: SYMBOLS USED IN OPCODE DESCRIPTIONS (CONTINUED)
Field Description
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 332 2013-2018 Microchip Technology Inc.
TABLE 28-2: INSTRUCTION SET OVERVIEW
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
Words # of
Cycles
(1)
Status Flags
Affected
1
ADD ADD Acc
Add Accumulators 1 1 OA,OB,SA,
SB
ADD f
f = f + WREG 1 1 C,DC,N,OV,Z
ADD f,WREG
WREG = f + WREG 1 1 C,DC,N,OV,Z
ADD #lit10,Wn
Wd = lit10 + Wd 1 1 C,DC,N,OV,Z
ADD Wb,Ws,Wd
Wd = Wb + Ws 1 1 C,DC,N,OV,Z
ADD Wb,#lit5,Wd
Wd = Wb + lit5 1 1 C,DC,N,OV,Z
ADD Wso,#Slit4,Acc
16-bit Signed Add to Accumulator 1 1 OA,OB,SA,
SB
2
ADDC ADDC f
f = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC f,WREG
WREG = f + WREG + (C) 1 1 C,DC,N,OV,Z
ADDC #lit10,Wn
Wd = lit10 + Wd + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,Ws,Wd
Wd = Wb + Ws + (C) 1 1 C,DC,N,OV,Z
ADDC Wb,#lit5,Wd
Wd = Wb + lit5 + (C) 1 1 C,DC,N,OV,Z
3
AND AND f
f = f .AND. WREG 1 1 N,Z
AND f,WREG
WREG = f .AND. WREG 1 1 N,Z
AND #lit10,Wn
Wd = lit10 .AND. Wd 1 1 N,Z
AND Wb,Ws,Wd
Wd = Wb .AND. Ws 1 1 N,Z
AND Wb,#lit5,Wd
Wd = Wb .AND. lit5 1 1 N,Z
4
ASR ASR f
f = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR f,WREG
WREG = Arithmetic Right Shift f 1 1 C,N,OV,Z
ASR Ws,Wd
Wd = Arithmetic Right Shift Ws 1 1 C,N,OV,Z
ASR Wb,Wns,Wnd
Wnd = Arithmetic Right Shift Wb by Wns 1 1 N,Z
ASR Wb,#lit5,Wnd
Wnd = Arithmetic Right Shift Wb by lit5 1 1 N,Z
5
BCLR BCLR f,#bit4
Bit Clear f 1 1 None
BCLR Ws,#bit4
Bit Clear Ws 1 1 None
6
BRA BRA C,Expr
Branch if Carry 1 1 (4) None
BRA GE,Expr
Branch if greater than or equal 1 1 (4) None
BRA GEU,Expr
Branch if unsigned greater than or equal 1 1 (4) None
BRA GT,Expr
Branch if greater than 1 1 (4) None
BRA GTU,Expr
Branch if unsigned greater than 1 1 (4) None
BRA LE,Expr
Branch if less than or equal 1 1 (4) None
BRA LEU,Expr
Branch if unsigned less than or equal 1 1 (4) None
BRA LT,Expr
Branch if less than 1 1 (4) None
BRA LTU,Expr
Branch if unsigned less than 1 1 (4) None
BRA N,Expr
Branch if Negative 1 1 (4) None
BRA NC,Expr
Branch if Not Carry 1 1 (4) None
BRA NN,Expr
Branch if Not Negative 1 1 (4) None
BRA NOV,Expr
Branch if Not Overflow 1 1 (4) None
BRA NZ,Expr
Branch if Not Zero 1 1 (4) None
BRA OA,Expr
Branch if Accumulator A overflow 1 1 (4) None
BRA OB,Expr
Branch if Accumulator B overflow 1 1 (4) None
BRA OV,Expr
Branch if Overflow 1 1 (4) None
BRA SA,Expr
Branch if Accumulator A saturated 1 1 (4) None
BRA SB,Expr
Branch if Accumulator B saturated 1 1 (4) None
BRA Expr
Branch Unconditionally 1 4 None
BRA Z,Expr
Branch if Zero 1 1 (4) None
BRA Wn
Computed Branch 1 4 None
7
BSET BSET f,#bit4
Bit Set f 1 1 None
BSET Ws,#bit4
Bit Set Ws 1 1 None
Note 1:
Read and Read-Modify-Write (e.g., bit operations and logical operations) on non-CPU SFRs incur an additional instruction cycle.
2013-2018 Microchip Technology Inc. DS70005144G-page 333
dsPIC33EVXXXGM00X/10X FAMILY
8
BSW BSW.C Ws,Wb
Write C bit to Ws<Wb> 1 1 None
BSW.Z Ws,Wb
Write Z bit to Ws<Wb> 1 1 None
9
BTG BTG f,#bit4
Bit Toggle f 1 1 None
BTG Ws,#bit4
Bit Toggle Ws 1 1 None
10
BTSC BTSC f,#bit4
Bit Test f, Skip if Clear 1 1
(2 or 3)
None
BTSC Ws,#bit4
Bit Test Ws, Skip if Clear 1 1
(2 or 3)
None
11
BTSS BTSS f,#bit4
Bit Test f, Skip if Set 1 1
(2 or 3)
None
BTSS Ws,#bit4
Bit Test Ws, Skip if Set 1 1
(2 or 3)
None
12
BTST BTST f,#bit4
Bit Test f 1 1 Z
BTST.C Ws,#bit4
Bit Test Ws to C 1 1 C
BTST.Z Ws,#bit4
Bit Test Ws to Z 1 1 Z
BTST.C Ws,Wb
Bit Test Ws<Wb> to C 1 1 C
BTST.Z Ws,Wb
Bit Test Ws<Wb> to Z 1 1 Z
13
BTSTS BTSTS f,#bit4
Bit Test then Set f 1 1 Z
BTSTS.C Ws,#bit4
Bit Test Ws to C, then Set 1 1 C
BTSTS.Z Ws,#bit4
Bit Test Ws to Z, then Set 1 1 Z
14
CALL CALL lit23
Call subroutine 2 4 SFA
CALL Wn
Call indirect subroutine 1 4 SFA
CALL.L Wn
Call indirect subroutine (long address) 1 4 SFA
15
CLR CLR f
f = 0x0000 1 1 None
CLR WREG
WREG = 0x0000 1 1 None
CLR Ws
Ws = 0x0000 1 1 None
CLR Acc,Wx,Wxd,Wy,Wyd,AWB
Clear Accumulator 1 1 OA,OB,SA,
SB
16
CLRWDT CLRWDT
Clear Watchdog Timer 1 1 WDTO,Sleep
17
COM COM f
f = f 11 N,Z
COM f,WREG
WREG = f 11 N,Z
COM Ws,Wd
Wd = Ws 11 N,Z
18
CP CP f
Compare f with WREG 1 1 C,DC,N,OV,Z
CP Wb,#lit8
Compare Wb with lit8 1 1 C,DC,N,OV,Z
CP Wb,Ws
Compare Wb with Ws (Wb – Ws) 1 1 C,DC,N,OV,Z
19
CP0 CP0 f
Compare f with 0x0000 1 1 C,DC,N,OV,Z
CP0 Ws
Compare Ws with 0x0000 1 1 C,DC,N,OV,Z
20
CPB CPB f
Compare f with WREG, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,#lit8
Compare Wb with lit8, with Borrow 1 1 C,DC,N,OV,Z
CPB Wb,Ws
Compare Wb with Ws, with Borrow
(Wb – Ws – C)
1 1 C,DC,N,OV,Z
21
CPSEQ CPSEQ Wb,Wn
Compare Wb with Wn, skip if = 1 1
(2 or 3)
None
CPBEQ CPBEQ Wb,Wn,Expr
Compare Wb with Wn, branch if = 1 1 (5) None
22
CPSGT CPSGT Wb,Wn
Compare Wb with Wn, skip if > 1 1
(2 or 3)
None
CPBGT CPBGT Wb,Wn,Expr
Compare Wb with Wn, branch if > 1 1 (5) None
23
CPSLT CPSLT Wb,Wn
Compare Wb with Wn, skip if < 1 1
(2 or 3)
None
CPBLT CPBLT Wb,Wn,Expr
Compare Wb with Wn, branch if < 1 1 (5) None
24
CPSNE CPSNE Wb,Wn
Compare Wb with Wn, skip if
11
(2 or 3)
None
CPBNE CPBNE Wb,Wn,Expr
Compare Wb with Wn, branch if
11 (5) None
TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
Words # of
Cycles
(1)
Status Flags
Affected
Note 1:
Read and Read-Modify-Write (e.g., bit operations and logical operations) on non-CPU SFRs incur an additional instruction cycle.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 334 2013-2018 Microchip Technology Inc.
25
CTXTSWP CTXTSWP #lit3
Switch CPU register context to context
defined by lit3
12 None
CTXTSWP Wn
Switch CPU register context to context
defined by Wn
12 None
26
DAW DAW Wn
Wn = decimal adjust Wn 1 1 C
27
DEC DEC f
f = f – 1 1 1 C,DC,N,OV,Z
DEC f,WREG
WREG = f – 1 1 1 C,DC,N,OV,Z
DEC Ws,Wd
Wd = Ws – 1 1 1 C,DC,N,OV,Z
28
DEC2 DEC2 f
f = f – 2 1 1 C,DC,N,OV,Z
DEC2 f,WREG
WREG = f – 2 1 1 C,DC,N,OV,Z
DEC2 Ws,Wd
Wd = Ws – 2 1 1 C,DC,N,OV,Z
29
DISI DISI #lit14
Disable Interrupts for k instruction cycles 1 1 None
30
DIV DIV.S Wm,Wn
Signed 16/16-bit Integer Divide 1 18 N,Z,C,OV
DIV.SD Wm,Wn
Signed 32/16-bit Integer Divide 1 18 N,Z,C,OV
DIV.U Wm,Wn
Unsigned 16/16-bit Integer Divide 1 18 N,Z,C,OV
DIV.UD Wm,Wn
Unsigned 32/16-bit Integer Divide 1 18 N,Z,C,OV
31
DIVF DIVF Wm,Wn
Signed 16/16-bit Fractional Divide 1 18 N,Z,C,OV
32
DO DO #lit15,Expr
Do code to PC + Expr, lit15 + 1 times 2 2 None
DO Wn,Expr
Do code to PC + Expr, (Wn) + 1 times 2 2 None
33
ED ED Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance (no accumulate) 1 1 OA,OB,OAB,
SA,SB,SAB
34
EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd
Euclidean Distance 1 1 OA,OB,OAB,
SA,SB,SAB
35
EXCH EXCH Wns,Wnd
Swap Wns with Wnd 1 1 None
36
FBCL FBCL Ws,Wnd
Find Bit Change from Left (MSb) Side 1 1 C
37
FF1L FF1L Ws,Wnd
Find First One from Left (MSb) Side 1 1 C
38
FF1R FF1R Ws,Wnd
Find First One from Right (LSb) Side 1 1 C
39
GOTO GOTO Expr
Go to address 2 4 None
GOTO Wn
Go to indirect 1 4 None
GOTO.L Wn
Go to indirect (long address) 1 4 None
40
INC INC f
f = f + 1 1 1 C,DC,N,OV,Z
INC f,WREG
WREG = f + 1 1 1 C,DC,N,OV,Z
INC Ws,Wd
Wd = Ws + 1 1 1 C,DC,N,OV,Z
41
INC2 INC2 f
f = f + 2 1 1 C,DC,N,OV,Z
INC2 f,WREG
WREG = f + 2 1 1 C,DC,N,OV,Z
INC2 Ws,Wd
Wd = Ws + 2 1 1 C,DC,N,OV,Z
42
IOR IOR f
f = f .IOR. WREG 1 1 N,Z
IOR f,WREG
WREG = f .IOR. WREG 1 1 N,Z
IOR #lit10,Wn
Wd = lit10 .IOR. Wd 1 1 N,Z
IOR Wb,Ws,Wd
Wd = Wb .IOR. Ws 1 1 N,Z
IOR Wb,#lit5,Wd
Wd = Wb .IOR. lit5 1 1 N,Z
43
LAC LAC Wso,#Slit4,Acc
Load Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
44
LNK LNK #lit14
Link Frame Pointer 1 1 SFA
45
LSR LSR f
f = Logical Right Shift f 1 1 C,N,OV,Z
LSR f,WREG
WREG = Logical Right Shift f 1 1 C,N,OV,Z
LSR Ws,Wd
Wd = Logical Right Shift Ws 1 1 C,N,OV,Z
LSR Wb,Wns,Wnd
Wnd = Logical Right Shift Wb by Wns 1 1 N,Z
LSR Wb,#lit5,Wnd
Wnd = Logical Right Shift Wb by lit5 1 1 N,Z
TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
Words # of
Cycles
(1)
Status Flags
Affected
Note 1:
Read and Read-Modify-Write (e.g., bit operations and logical operations) on non-CPU SFRs incur an additional instruction cycle.
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46
MAC MAC Wm*Wn,Acc,Wx,Wxd,Wy,Wyd,AWB
Multiply and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
MAC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square and Accumulate 1 1 OA,OB,OAB,
SA,SB,SAB
47
MOV MOV f,Wn
Move f to Wn 1 1 None
MOV f
Move f to f 1 1 None
MOV f,WREG
Move f to WREG 1 1 None
MOV #lit16,Wn
Move 16-bit literal to Wn 1 1 None
MOV.b #lit8,Wn
Move 8-bit literal to Wn 1 1 None
MOV Wn,f
Move Wn to f 1 1 None
MOV Wso,Wdo
Move Ws to Wd 1 1 None
MOV WREG,f
Move WREG to f 1 1 None
MOV.D Wns,Wd
Move Double from W(ns):W(ns + 1) to Wd 1 2 None
MOV.D Ws,Wnd
Move Double from Ws to W(nd + 1):W(nd) 1 2 None
48
MOVPAG MOVPAG #lit10,DSRPAG
Move 10-bit literal to DSRPAG 1 1 None
MOVPAG #lit9,DSWPAG
Move 9-bit literal to DSWPAG 1 1 None
MOVPAG #lit8,TBLPAG
Move 8-bit literal to TBLPAG 1 1 None
MOVPAGW Ws, DSRPAG
Move Ws<9:0> to DSRPAG 1 1 None
MOVPAGW Ws, DSWPAG
Move Ws<8:0> to DSWPAG 1 1 None
MOVPAGW Ws, TBLPAG
Move Ws<7:0> to TBLPAG 1 1 None
49
MOVSAC MOVSAC Acc,Wx,Wxd,Wy,Wyd,AWB
Prefetch and store accumulator 1 1 None
50
MPY MPY Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
Multiply Wm by Wn to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
MPY Wm*Wm,Acc,Wx,Wxd,Wy,Wyd
Square Wm to Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
51
MPY.N MPY.N Wm*Wn,Acc,Wx,Wxd,Wy,Wyd
-(Multiply Wm by Wn) to Accumulator 1 1 None
52
MSC MSC Wm*Wm,Acc,Wx,Wxd,Wy,Wyd,AWB
Multiply and Subtract from Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
Words # of
Cycles
(1)
Status Flags
Affected
Note 1:
Read and Read-Modify-Write (e.g., bit operations and logical operations) on non-CPU SFRs incur an additional instruction cycle.
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53
MUL MUL.SS Wb,Ws,Wnd
{Wnd + 1, Wnd} = signed(Wb) *
signed(Ws)
11 None
MUL.SS Wb,Ws,Acc
Accumulator = signed(Wb) * signed(Ws) 1 1 None
MUL.SU Wb,Ws,Wnd
{Wnd + 1, Wnd} = signed(Wb) *
unsigned(Ws)
11 None
MUL.SU Wb,Ws,Acc
Accumulator = signed(Wb) *
unsigned(Ws)
11 None
MUL.SU Wb,#lit5,Acc
Accumulator = signed(Wb) * unsigned(lit5) 1 1 None
MUL.US Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) *
signed(Ws)
11 None
MUL.US Wb,Ws,Acc
Accumulator = unsigned(Wb) *
signed(Ws)
11 None
MUL.UU Wb,Ws,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) *
unsigned(Ws)
11 None
MUL.UU Wb,#lit5,Acc
Accumulator = unsigned(Wb) *
unsigned(lit5)
11 None
MUL.UU Wb,Ws,Acc
Accumulator = unsigned(Wb) *
unsigned(Ws)
11 None
MULW.SS Wb,Ws,Wnd
Wnd = signed(Wb) * signed(Ws) 1 1 None
MULW.SU Wb,Ws,Wnd
Wnd = signed(Wb) * unsigned(Ws) 1 1 None
MULW.US Wb,Ws,Wnd
Wnd = unsigned(Wb) * signed(Ws) 1 1 None
MULW.UU Wb,Ws,Wnd
Wnd = unsigned(Wb) * unsigned(Ws) 1 1 None
MUL.SU Wb,#lit5,Wnd
{Wnd + 1, Wnd} = signed(Wb) *
unsigned(lit5)
11 None
MUL.SU Wb,#lit5,Wnd
Wnd = signed(Wb) * unsigned(lit5) 1 1 None
MUL.UU Wb,#lit5,Wnd
{Wnd + 1, Wnd} = unsigned(Wb) *
unsigned(lit5)
11 None
MUL.UU Wb,#lit5,Wnd
Wnd = unsigned(Wb) * unsigned(lit5) 1 1 None
MUL f
W3:W2 = f * WREG 1 1 None
54
NEG NEG Acc
Negate Accumulator 1 1 OA,OB,OAB,
SA,SB,SAB
NEG f
f = f + 1 1 1 C,DC,N,OV,Z
NEG f,WREG
WREG = f + 1 1 1 C,DC,N,OV,Z
NEG Ws,Wd
Wd = Ws + 1 1 1 C,DC,N,OV,Z
55
NOP NOP
No Operation 1 1 None
NOPR
No Operation 1 1 None
56
POP POP f
Pop f from Top-of-Stack (TOS) 1 1 None
POP Wdo
Pop from Top-of-Stack (TOS) to Wdo 1 1 None
POP.D Wnd
Pop from Top-of-Stack (TOS) to
W(nd):W(nd + 1)
12 None
POP.S
Pop Shadow Registers 1 1 All
57
PUSH PUSH f
Push f to Top-of-Stack (TOS) 1 1 None
PUSH Wso
Push Wso to Top-of-Stack (TOS) 1 1 None
PUSH.D Wns
Push W(ns):W(ns + 1) to Top-of-Stack
(TOS)
12 None
PUSH.S
Push Shadow Registers 1 1 None
58
PWRSAV PWRSAV #lit1
Go into Sleep or Idle mode 1 1 WDTO,Sleep
59
RCALL RCALL Expr
Relative Call 1 4 SFA
RCALL Wn
Computed Call 1 4 SFA
60
REPEAT REPEAT #lit15
Repeat Next Instruction lit15 + 1 times 1 1 None
REPEAT Wn
Repeat Next Instruction (Wn) + 1 times 1 1 None
61
RESET RESET
Software device Reset 1 1 None
62
RETFIE RETFIE
Return from interrupt 1 6 (5) SFA
TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
Words # of
Cycles
(1)
Status Flags
Affected
Note 1:
Read and Read-Modify-Write (e.g., bit operations and logical operations) on non-CPU SFRs incur an additional instruction cycle.
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63
RETLW RETLW #lit10,Wn
Return with literal in Wn 1 6 (5) SFA
64
RETURN RETURN
Return from Subroutine 1 6 (5) SFA
65
RLC RLC f
f = Rotate Left through Carry f 1 1 C,N,Z
RLC f,WREG
WREG = Rotate Left through Carry f 1 1 C,N,Z
RLC Ws,Wd
Wd = Rotate Left through Carry Ws 1 1 C,N,Z
66
RLNC RLNC f
f = Rotate Left (No Carry) f 1 1 N,Z
RLNC f,WREG
WREG = Rotate Left (No Carry) f 1 1 N,Z
RLNC Ws,Wd
Wd = Rotate Left (No Carry) Ws 1 1 N,Z
67
RRC RRC f
f = Rotate Right through Carry f 1 1 C,N,Z
RRC f,WREG
WREG = Rotate Right through Carry f 1 1 C,N,Z
RRC Ws,Wd
Wd = Rotate Right through Carry Ws 1 1 C,N,Z
68
RRNC RRNC f
f = Rotate Right (No Carry) f 1 1 N,Z
RRNC f,WREG
WREG = Rotate Right (No Carry) f 1 1 N,Z
RRNC Ws,Wd
Wd = Rotate Right (No Carry) Ws 1 1 N,Z
69
SAC SAC Acc,#Slit4,Wdo
Store Accumulator 1 1 None
SAC.R Acc,#Slit4,Wdo
Store Rounded Accumulator 1 1 None
70
SE SE Ws,Wnd
Wnd = sign-extended Ws 1 1 C,N,Z
71
SETM SETM f
f = 0xFFFF 1 1 None
SETM WREG
WREG = 0xFFFF 1 1 None
SETM Ws
Ws = 0xFFFF 1 1 None
72
SFTAC SFTAC Acc,Wn
Arithmetic Shift Accumulator by (Wn) 1 1 OA,OB,OAB,
SA,SB,SAB
SFTAC Acc,#Slit6
Arithmetic Shift Accumulator by Slit6 1 1 OA,OB,OAB,
SA,SB,SAB
73
SL SL f
f = Left Shift f 1 1 C,N,OV,Z
SL f,WREG
WREG = Left Shift f 1 1 C,N,OV,Z
SL Ws,Wd
Wd = Left Shift Ws 1 1 C,N,OV,Z
SL Wb,Wns,Wnd
Wnd = Left Shift Wb by Wns 1 1 N,Z
SL Wb,#lit5,Wnd
Wnd = Left Shift Wb by lit5 1 1 N,Z
74
SUB SUB Acc
Subtract Accumulators 1 1 OA,OB,OAB,
SA,SB,SAB
SUB f
f = f – WREG 1 1 C,DC,N,OV,Z
SUB f,WREG
WREG = f – WREG 1 1 C,DC,N,OV,Z
SUB #lit10,Wn
Wn = Wn – lit10 1 1 C,DC,N,OV,Z
SUB Wb,Ws,Wd
Wd = Wb – Ws 1 1 C,DC,N,OV,Z
SUB Wb,#lit5,Wd
Wd = Wb – lit5 1 1 C,DC,N,OV,Z
75
SUBB SUBB f
f = f – WREG – (C) 1 1 C,DC,N,OV,Z
SUBB f,WREG
WREG = f – WREG – (C) 1 1 C,DC,N,OV,Z
SUBB #lit10,Wn
Wn = Wn – lit10 – (C) 1 1 C,DC,N,OV,Z
SUBB Wb,Ws,Wd
Wd = Wb – Ws – (C) 1 1 C,DC,N,OV,Z
SUBB Wb,#lit5,Wd
Wd = Wb – lit5 – (C) 1 1 C,DC,N,OV,Z
76
SUBR SUBR f
f = WREG – f 1 1 C,DC,N,OV,Z
SUBR f,WREG
WREG = WREG – f 1 1 C,DC,N,OV,Z
SUBR Wb,Ws,Wd
Wd = Ws – Wb 1 1 C,DC,N,OV,Z
SUBR Wb,#lit5,Wd
Wd = lit5 – Wb 1 1 C,DC,N,OV,Z
77
SUBBR SUBBR f
f = WREG – f – (C) 1 1 C,DC,N,OV,Z
SUBBR f,WREG
WREG = WREG – f – (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,Ws,Wd
Wd = Ws – Wb – (C) 1 1 C,DC,N,OV,Z
SUBBR Wb,#lit5,Wd
Wd = lit5 – Wb – (C) 1 1 C,DC,N,OV,Z
TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
Words # of
Cycles
(1)
Status Flags
Affected
Note 1:
Read and Read-Modify-Write (e.g., bit operations and logical operations) on non-CPU SFRs incur an additional instruction cycle.
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78
SWAP SWAP.b Wn
Wn = nibble swap Wn 1 1 None
SWAP Wn
Wn = byte swap Wn 1 1 None
79
TBLRDH TBLRDH Ws,Wd
Read Prog<23:16> to Wd<7:0> 1 5 None
80
TBLRDL TBLRDL Ws,Wd
Read Prog<15:0> to Wd 1 5 None
81
TBLWTH TBLWTH Ws,Wd
Write Ws<7:0> to Prog<23:16> 1 2 None
82
TBLWTL TBLWTL Ws,Wd
Write Ws to Prog<15:0> 1 2 None
83
ULNK ULNK
Unlink Frame Pointer 1 1 SFA
84
XOR XOR f
f = f .XOR. WREG 1 1 N,Z
XOR f,WREG
WREG = f .XOR. WREG 1 1 N,Z
XOR #lit10,Wn
Wd = lit10 .XOR. Wd 1 1 N,Z
XOR Wb,Ws,Wd
Wd = Wb .XOR. Ws 1 1 N,Z
XOR Wb,#lit5,Wd
Wd = Wb .XOR. lit5 1 1 N,Z
85
ZE ZE Ws,Wnd
Wnd = Zero-extend Ws 1 1 C,Z,N
TABLE 28-2: INSTRUCTION SET OVERVIEW (CONTINUED)
Base
Instr
#
Assembly
Mnemonic Assembly Syntax Description # of
Words # of
Cycles
(1)
Status Flags
Affected
Note 1:
Read and Read-Modify-Write (e.g., bit operations and logical operations) on non-CPU SFRs incur an additional instruction cycle.
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29.0 DEVELOPMENT SUPPORT
The PIC
®
microcontrollers (MCU) and dsPIC
®
digital
signal controllers (DSC) are supported with a full range
of software and hardware development tools:
• Integrated Development Environment
- MPLAB
®
X IDE Software
• Compilers/Assemblers/Linkers
- MPLAB XC Compiler
- MPASM
TM
Assembler
-MPLINK
TM
Object Linker/
MPLIB
TM
Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB X SIM Software Simulator
•Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers/Programmers
- MPLAB ICD 3
- PICkit™ 3
• Device Programmers
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits and Starter Kits
• Third-party development tools
29.1 MPLAB X Integrated Development
Environment Software
The MPLAB X IDE is a single, unified graphical user
interface for Microchip and third-party software, and
hardware development tool that runs on Windows
®
,
Linux and Mac OS
®
X. Based on the NetBeans IDE,
MPLAB X IDE is an entirely new IDE with a host of free
software components and plug-ins for high-
performance application development and debugging.
Moving between tools and upgrading from software
simulators to hardware debugging and programming
tools is simple with the seamless user interface.
With complete project management, visual call graphs,
a configurable watch window and a feature-rich editor
that includes code completion and context menus,
MPLAB X IDE is flexible and friendly enough for new
users. With the ability to support multiple tools on
multiple projects with simultaneous debugging, MPLAB
X IDE is also suitable for the needs of experienced
users.
Feature-Rich Editor:
• Color syntax highlighting
• Smart code completion makes suggestions and
provides hints as you type
• Automatic code formatting based on user-defined
rules
• Live parsing
User-Friendly, Customizable Interface:
• Fully customizable interface: toolbars, toolbar
buttons, windows, window placement, etc.
• Call graph window
Project-Based Workspaces:
• Multiple projects
• Multiple tools
• Multiple configurations
• Simultaneous debugging sessions
File History and Bug Tracking:
• Local file history feature
• Built-in support for Bugzilla issue tracker
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29.2 MPLAB XC Compilers
The MPLAB XC Compilers are complete ANSI C
compilers for all of Microchip’s 8, 16, and 32-bit MCU
and DSC devices. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use. MPLAB XC Compilers run on Windows,
Linux or MAC OS X.
For easy source level debugging, the compilers provide
debug information that is optimized to the MPLAB X
IDE.
The free MPLAB XC Compiler editions support all
devices and commands, with no time or memory
restrictions, and offer sufficient code optimization for
most applications.
MPLAB XC Compilers include an assembler, linker and
utilities. The assembler generates relocatable object
files that can then be archived or linked with other relo-
catable object files and archives to create an execut-
able file. MPLAB XC Compiler uses the assembler to
produce its object file. Notable features of the assem-
bler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command-line interface
• Rich directive set
• Flexible macro language
• MPLAB X IDE compatibility
29.3 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel
®
standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code, and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB X IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multipurpose
source files
• Directives that allow complete control over the
assembly process
29.4 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler. It can link
relocatable objects from precompiled libraries, using
directives from a linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
29.5 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC DSC devices. MPLAB XC Compiler
uses the assembler to produce its object file. The
assembler generates relocatable object files that can
then be archived or linked with other relocatable object
files and archives to create an executable file. Notable
features of the assembler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command-line interface
• Rich directive set
• Flexible macro language
• MPLAB X IDE compatibility
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29.6 MPLAB X SIM Software Simulator
The MPLAB X SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB X SIM Software Simulator fully supports
symbolic debugging using the MPLAB XC Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
development tool.
29.7 MPLAB REAL ICE In-Circ u it
Emulator System
The MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs all 8, 16 and 32-bit MCU, and DSC devices
with the easy-to-use, powerful graphical user interface of
the MPLAB X IDE.
The emulator is connected to the design engineer’s
PC using a high-speed USB 2.0 interface and is
connected to the target with either a connector
compatible with in-circuit debugger systems (RJ-11)
or with the new high-speed, noise tolerant, Low-
Voltage Differential Signal (LVDS) interconnection
(CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB X IDE. MPLAB REAL ICE offers
significant advantages over competitive emulators
including full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, logic
probes, a ruggedized probe interface and long (up to
three meters) interconnection cables.
29.8 MPLAB ICD 3 In-Circuit Debugger
System
The MPLAB ICD 3 In-Circuit Debugger System is
Microchip’s most cost-effective, high-speed hardware
debugger/programmer for Microchip Flash DSC and
MCU devices. It debugs and programs PIC Flash
microcontrollers and dsPIC DSCs with the powerful,
yet easy-to-use graphical user interface of the MPLAB
IDE.
The MPLAB ICD 3 In-Circuit Debugger probe is
connected to the design engineer’s PC using a high-
speed USB 2.0 interface and is connected to the target
with a connector compatible with the MPLAB ICD 2 or
MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3
supports all MPLAB ICD 2 headers.
29.9 PICkit 3 In-Circuit Debugger/
Programmer
The MPLAB PICkit 3 allows debugging and program-
ming of PIC and dsPIC Flash microcontrollers at a most
affordable price point using the powerful graphical user
interface of the MPLAB IDE. The MPLAB PICkit 3 is
connected to the design engineer’s PC using a full-
speed USB interface and can be connected to the tar-
get via a Microchip debug (RJ-11) connector (compati-
ble with MPLAB ICD 3 and MPLAB REAL ICE). The
connector uses two device I/O pins and the Reset line
to implement in-circuit debugging and In-Circuit Serial
Programming™ (ICSP™).
29.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at V
DDMIN
and V
DDMAX
for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages, and a mod-
ular, detachable socket assembly to support various
package types. The ICSP cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices, and incorporates an MMC card for file
storage and data applications.
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29.11 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully
functional systems. Most boards include prototyping
areas for adding custom circuitry and provide applica-
tion firmware and source code for examination and
modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™
demonstration/development board series of circuits,
Microchip has a line of evaluation kits and demonstra-
tion software for analog filter design, K
EE
L
OQ
®
security
ICs, CAN, IrDA
®
, PowerSmart battery management,
SEEVAL
®
evaluation system, Sigma-Delta ADC, flow
rate sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
29.12 Third-Party Development Tools
Microchip also offers a great collection of tools from
third-party vendors. These tools are carefully selected
to offer good value and unique functionality.
• Device Programmers and Gang Programmers
from companies, such as SoftLog and CCS
• Software Tools from companies, such as Gimpel
and Trace Systems
• Protocol Analyzers from companies, such as
Saleae and Total Phase
• Demonstration Boards from companies, such as
MikroElektronika, Digilent
®
and Olimex
• Embedded Ethernet Solutions from companies,
such as EZ Web Lynx, WIZnet and IPLogika
®
2013-2018 Microchip Technology Inc. DS70005144G-page 343
dsPIC33EVXXXGM00X/10X FAMILY
30.0 ELECTRICAL CHARACTERI STICS
This section provides an overview of dsPIC33EVXXXGM00X/10X family electrical characteristics. Additional
information will be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the dsPIC33EVXXXGM00X/10X family are listed below. Exposure to these maximum
rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any
other conditions above the parameters indicated in the operation listings of this specification is not implied.
Absolute Maximum Ratings
(1)
Ambient temperature under bias.............................................................................................................-40°C to +125°C
Storage temperature .............................................................................................................................. -65°C to +160°C
Voltage on V
DD
with respect to V
SS
.......................................................................................................... -0.3V to +6.0V
Voltage on V
CAP
with respect to V
SS
........................................................................................................ 1.62V to 1.98V
Maximum current out of V
SS
pin ...........................................................................................................................350 mA
Maximum current into V
DD
pin
(2)
...........................................................................................................................350 mA
Maximum current sunk by any I/O pin.....................................................................................................................20 mA
Maximum current sourced by I/O pin ......................................................................................................................18 mA
Maximum current sourced/sunk by all ports
(2)
......................................................................................................200 mA
Note 1:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2:
Maximum allowable current is a function of device maximum power dissipation (see Tab le 3 0-2 ).
dsPIC33EVXXXGM00X/10X FAMILY
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30.1 DC Characteristics
TABLE 30-1: OPERATING MIPS vs. VOLTAGE
Characteristic V
DD
Range
(in Volts) Temperature Range
(in °C)
Maxim um MIPS
dsPIC33EVXXXGM00X /10X Fam ily
I-Temp 4.5V to 5.5V
(1,2)
-40°C to 0°C 60
0°C to +85°C 70
E-Temp 4.5V to 5.5V
(1,2)
-40°C to +125°C 60
Note 1:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
. Analog modules: ADC, op amp/comparator and
comparator voltage reference will have degraded performance. Device functionality is tested but not
characterized. Refer to Parameter BO10 in Table 30-12 for the minimum and maximum BOR values.
2:
When BOR is enabled, the device will work from 4.7V to 5.5V.
Note 1:
Customer operating voltage range is specified as: 4.5V to 5.5V.
TABLE 30-2: THERMAL OPERATING CONDITIONS
Rating Symbol Min. Typ. Max. Unit
Industrial Temperature Devices:
Operating Junction Temperature Range T
J
-40 — +125 °C
Operating Ambient Temperature Range T
A
-40 — +85 °C
Extended Temperature Devices:
Operating Junction Temperature Range T
J
-40 — +140 °C
Operating Ambient Temperature Range T
A
-40 — +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
P
INT
= V
DD
x (I
DD
– I
OH
) P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
I/O = ({V
DD
– V
OH
} x I
OH
) + (V
OL
x I
OL
)
Maximum Allowed Power Dissipation P
DMAX
(T
J
– T
A
)/
JA
W
TABLE 30-3: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ. Max. Unit Notes
Package Thermal Resistance, 64-Pin QFN, 9x9x0.9 mm
JA
28.0 — °C/W
1
Package Thermal Resistance, 64-Pin TQFP, 10x10x1 mm
JA
48.3 — °C/W
1
Package Thermal Resistance, 44-Pin QFN, 8x8 mm
JA
29.0 — °C/W
1
Package Thermal Resistance, 44-Pin TQFP, 10x10x1 mm
JA
49.8 — °C/W
1
Package Thermal Resistance, 36-Pin UQFN, 5x5 mm
JA
29.2 — °C/W
1
Package Thermal Resistance, 28-Pin QFN-S, 6x6x0.9 mm
JA
30.0 — °C/W
1
Package Thermal Resistance, 28-Pin SOIC, 7.50 mm
JA
69.7 — °C/W
1
Package Thermal Resistance, 28-Pin SSOP, 5.30 mm
JA
71.0 — °C/W
1
Package Thermal Resistance, 28-Pin SPDIP, 300 mil
JA
60.0 — °C/W
1
Note 1:
Junction to ambient thermal resistance, Theta-
JA
(
JA
) numbers are achieved by package simulations.
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TABLE 30-5: FILTER CAPACITOR (C
EFC
) SPECIFICATIONS
TABLE 30-4: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions (see Note 3): 4.5V to 5.5V
(unless othe rwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ.
(1)
Max. Units Conditions
Operating Voltage
DC10 V
DD
Supply Voltage
(3)
V
BOR
—5.5V
DC12 V
DR
RAM Data Retention Voltage
(2)
1.8 — — V
DC16 V
POR
V
DD
Start Voltage
to Ensure Internal
Power-on Reset Signal
——V
SS
V
DC17 S
VDD
V
DD
Rise Rate
to Ensure Internal
Power-on Reset Signal
1.0 — — V/ms 0V-5.0V in 5 ms
DC18 V
CORE
V
DD
Core
Internal Regulator Voltage
1.62 1.8 1.98 V Voltage is dependent on
load, temperature and
V
DD
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
2:
This is the limit to which V
DD
may be lowered without losing RAM data.
3:
V
DD
voltage must remain at V
SS
for a minimum of 200 s to ensure POR.
Standard Operating Conditions (unless otherwise stated):
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristics Min. Typ. Max. Units Comments
C
EFC
External Filter Capacitor
Value
(1)
4.7 10 — F Capacitor must have a low
series resistance (< 1)
Note 1:
Typical V
CAP
Voltage = 1.8 volts when V
DD
V
DDMIN
.
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TABLE 30-6: DC CHARACTERISTICS: OPERATING CURRENT (I
DD
)
DC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Typ.
(2)
Max. Units Conditions
Operating Current (I
DD
)
(1)
DC20d 4.5 5.5 mA -40°C
5.0V 10 MIPS
DC20a 4.65 5.6 mA +25°C
DC20b 4.85 6.0 mA +85°C
DC20c 5.6 7.2 mA +125°C
DC22d 8.6 10.6 mA -40°C
5.0V 20 MIPS
DC22a 8.8 10.8 mA +25°C
DC22b 9.1 11.1 mA +85°C
DC22c 9.8 12.6 mA +125°C
DC23d 16.8 18.5 mA -40°C
5.0V 40 MIPS
DC23a 17.2 19.0 mA +25°C
DC23b 17.55 19.2 mA +85°C
DC23c 18.3 21.0 mA +125°C
DC24d 25.15 28.0 mA -40°C
5.0V 60 MIPS
DC24a 25.5 28.0 mA +25°C
DC24b 25.5 28.0 mA +85°C
DC24c 25.55 28.5 mA +125°C
DC25d 29.0 31.0 mA -40°C
5.0V 70 MIPSDC25a 28.5 31.0 mA +25°C
DC25b 28.3 31.0 mA +85°C
Note 1:
I
DD
is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact
on the current consumption. The test conditions for all I
DD
measurements are as follows:
• Oscillator is configured in EC mode and external clock is active, OSC1 is driven with external square
wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
• CLKO is configured as an I/O input pin in the Configuration Word
• All I/O pins are configured as outputs and driving low
•MCLR
= V
DD
, WDT and FSCM are disabled
• CPU, SRAM, program memory and data memory are operational
• No peripheral modules are operating or being clocked (defined PMDx bits are all ones)
• CPU executing
while(1)
{
NOP();
}
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
2013-2018 Microchip Technology Inc. DS70005144G-page 347
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TABLE 30-7: DC CHARACTERISTICS: IDLE CURRENT (I
IDLE
)
DC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Parameter
No. Typ.
(2)
Max. Units Conditions
Idle Current (I
IDLE
)
(1)
DC40d 1.25 2 mA -40°C
5.0V 10 MIPS
DC40a 1.25 2 mA +25°C
DC40b 1.5 2.6 mA +85°C
DC40c 1.5 2.6 mA +125°C
DC42d 2.3 3 mA -40°C
5.0V 20 MIPS
DC42a 2.3 3 mA +25°C
DC42b 2.6 3.45 mA +85°C
DC42c 2.6 3.85 mA +125°C
DC44d 6.9 8 mA -40°C
5.0V 70 MIPSDC44a 6.9 8 mA +25°C
DC44b 7.25 8.6 mA +85°C
Note 1:
Base Idle current (I
IDLE
) is measured as follows:
• CPU core is off, oscillator is configured in EC mode and external clock is active, OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
• CLKO is configured as an I/O input pin in the Configuration Word
• All I/O pins are configured as outputs and driving low
•MCLR = V
DD
, WDT and FSCM are disabled
• No peripheral modules are operating or being clocked (defined PMDx bits are all ones)
• The NVMSIDL bit (NVMCON<12>) = 1 (i.e., Flash regulator is set to standby while the device is in
Idle mode)
• The VREGSF bit (RCON<11>) = 0 (i.e., Flash regulator is set to standby while the device is in
Sleep mode)
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
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TABLE 30-8: DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
)
DC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Parameter
No. Typ.
(2)
Max. Units Conditions
Power-Down Current (I
PD
)
– dsPIC33EVXXXGM00X/ 10X
(1)
DC60d 9.25 90 A-40°C
5.0V Base Power-Down Current
DC60a 15.75 100 A+25°C
DC60b 67.75 465 A+85°C
DC60c 270 860 A +125°C
DC61d 1 7 A-40°C
5.0V Watchdog Timer Current: I
WDT(3)
DC61a 1.25 8 A+25°C
DC61b 3.5 12 A+85°C
DC61c 5 15 A +125°C
Note 1:
I
PD
(Sleep) current is measured as follows:
• CPU core is off, oscillator is configured in EC mode and external clock is active, OSC1 is driven with
external square wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
• CLKO is configured as an I/O input pin in the Configuration Word
• All I/O pins are configured as outputs and driving low
•MCLR = V
DD
, WDT and FSCM are disabled
• All peripheral modules are disabled (PMDx bits are all ones)
• The VREGS bit (RCON<8>) = 0 (i.e., core regulator is set to standby while the device is in Sleep mode)
• The VREGSF bit (RCON<11>) = 0 (i.e., Flash regulator is set to standby while the device is in
Sleep mode)
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The current is the additional current consumed when the module is enabled. This current should be
added to the base I
PD
current.
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TABLE 30-9: DC CHARACTERISTICS: DOZE CURRENT (I
DOZE
)
DC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Parameter No. Typ.
(2)
Max. Doze
Ratio Units Conditions
Doze Current (I
DOZE
)
(1)
DC73a 16.0 18.25 1:2 mA -40°C 5.0V 70 MIPS
DC73g 7.1 8.0 1:128 mA
DC70a 16.25 18.5 1:2 mA +25°C 5.0V 70 MIPS
DC70g 7.3 8.2 1:128 mA
DC71a 17.0 19.0 1:2 mA +85°C 5.0V 70 MIPS
DC71g 7.5 8.9 1:128 mA
DC72a 17.75 19.95 1:2 mA +125°C 5.0V 60 MIPS
DC72g 8.25 9.32 1:128 mA
Note 1:
I
DOZE
is primarily a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact
on the current consumption. The test conditions for all I
DOZE
measurements are as follows:
• Oscillator is configured in EC mode and external clock is active, OSC1 is driven with external square
wave from rail-to-rail (EC clock overshoot/undershoot < 250 mV required)
• CLKO is configured as an I/O input pin in the Configuration Word
• All I/O pins are configured as outputs and driving low
•MCLR
= V
DD
, WDT and FSCM are disabled
• CPU, SRAM, program memory and data memory are operational
• No peripheral modules are operating or being clocked (defined PMDx bits are all ones)
• CPU executing
while(1)
{
NOP();
}
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
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TABLE 30-10: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ.
(1)
Max. Units Conditions
V
IL
Input Low Voltage
DI10 I/O Pins V
SS
—0.2V
DD
V
V
IH
Input High Voltage
DI20 I/O Pins 0.75 V
DD
—5.5V
DI30 I
CNPU
Change Notification Pull-up
Current
200 375 600 AV
DD
= 5.0V, V
PIN
= V
SS
DI31 I
CNPD
Change Notification
Pull-Down Current
(7)
175 400 625 AV
DD
= 5.0V, V
PIN
= V
DD
I
IL
Input Leakage Current
(2,3)
DI50 I/O Pins -100 — 100 nA V
SS
V
PIN
V
DD
,
pin at high-impedance
DI55 MCLR -700 — 700 nA V
SS
V
PIN
V
DD
DI56 OSC1 -200 — 200 nA V
SS
V
PIN
V
DD
,
XT and HS modes
DI60a I
ICL
Input Low Injection Current
0—-5
(4,6)
All pins except V
DD
, V
SS
,
AV
DD
, AV
SS
, MCLR,
V
CAP
and RB7
DI60b I
ICH
Input High Injection Current
0—+5
(5,6)
mA All pins except V
DD
, V
SS
,
AV
DD
, AV
SS
, MCLR,
V
CAP
, RB7 and all 5V
tolerant pins
(5)
DI60c I
ICT
Total Input Injection Current
(sum of all I/O and control
pins)
-20
(7)
—+20
(7)
Absolute instantaneous
sum of all ± input
injection currents from all
I/O pins
( | II
CL
|+ | I
ICH
|) I
ICT
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
2:
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current can be measured at different input
voltages.
3:
Negative current is defined as current sourced by the pin.
4:
V
IL
source < (V
SS
– 0.3). Characterized but not tested.
5:
Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.
6:
Non-zero injection currents can affect the ADC results by approximately 4-6 counts.
7:
Any number and/or combination of I/O pins not excluded under I
ICL
or I
ICH
conditions are permitted,
provided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not
exceed the specified limit. Characterized but not tested.
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TABLE 30-11: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless othe rwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic Min.
(1)
Typ. Max. Units Conditions
DO16 V
OL
Output Low Voltage
4x Sink Driver Pins
(2)
——0.4VI
OL
= 8.8 mA, V
DD
= 5.0V
DO10 V
OL
Output Low Voltage
8x Sink Driver Pins
(3)
——0.4VI
OL
= 10.8 mA, V
DD
= 5.0V
DO26 V
OH
Output High Voltage
4x Sink Driver Pins
(2)
V
DD
– 0.6 — — V I
OH
= -8.3 mA, V
DD
= 5.0V
DO20 V
OH
Output High Voltage
8x Sink Driver Pins V
DD
– 0.6 — — V I
OH
= -12.3 mA, V
DD
= 5.0V
Note 1:
Parameters are characterized, but not tested.
2:
Includes all I/O pins that are not 8x sink driver pins (see below).
3:
Includes pins, such as RA3, RA4 and RB<15:10> for 28-pin and 36-pin devices, RA3, RA4, RA9 and
RB<15:10> for 44-pin devices, RA4, RA7, RA9, RB<15:10> and RC15 for 64-pin devices.
TABLE 30-12: ELECTRICAL CHARACTERISTICS: BOR
DC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless othe rwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min.
(1)
Typ. Max. Units Conditions
BO10 V
BOR
BOR Event on V
DD
Transition
High-to-Low
4.15 4.285 4.4 V V
DD
(see
Note 2, Note 3
and
Note 4)
Note 1:
Parameters are for design guidance only and are not tested in manufacturing.
2:
The V
BOR
specification is relative to the V
DD
.
3:
The device is functional at V
BORMIN
< V
DD
< V
DDMIN
. Analog modules: ADC, op amp/comparator and
comparator voltage reference will have degraded performance. Device functionality is tested but not
characterized.
4: The start-u p V
DD
must rise above 4.6V.
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TABLE 30-13: DC CHARACTERISTICS: PROGRAM MEMORY
DC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ.
(1)
Max. Units Conditions
Program Flash Memory
D130 E
P
Cell Endurance 10,000 — — E/W -40C to +125C
D131 V
PR
V
DD
for Read 4.5 — 5.5 V
D132b V
PEW
V
DD
for Self-Timed Write 4.5 — 5.5 V
D134 T
RETD
Characteristic Retention 20 — — Year Provided no other specifications
are violated, -40C to +125C
D135 I
DDP
Supply Current During
Programming
—10—mA
D136a T
RW
Row Write Cycle Time 0.657 — 0.691 ms T
RW
= 4965 FRC cycles,
T
A
= +85°C (see
Note 2)
D136b T
RW
Row Write Cycle Time 0.651 — 0.698 ms T
RW
= 4965 FRC cycles,
T
A
= +125°C (see
Note 2)
D137a T
PE
Page Erase Time 19.44 — 20.44 ms T
PE
= 146893 FRC cycles,
T
A
= +85°C (see
Note 2)
D137b T
PE
Page Erase Time 19.24 — 20.65 ms T
PE
= 146893 FRC cycles,
T
A
= +125°C (see
Note 2)
D138a T
WW
Word Write Cycle Time 45.78 — 48.15 µs T
WW
= 346 FRC cycles,
T
A
= +85°C (see
Note 2)
D138b T
WW
Word Write Cycle Time 45.33 — 48.64 µs T
WW
= 346 FRC cycles,
T
A
= +125°C (see
Note 2)
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
2:
Other conditions: FRC = 7.3728 MHz, TUN<5:0> = b'011111 (for Min), TUN<5:0> = b'100000 (for Max).
This parameter depends on the FRC accuracy (see Table 30-20) and the value of the FRC Oscillator
Tuning register.
TABLE 30-14: ELECTRICAL CHARACTERISTICS: INTERNAL BAND GAP REFERENCE VOLTAGE
DC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless othe rwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
DVR10 V
BG
Internal Band Gap Reference
Voltage
1.14 1.2 1.26 V
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30.2 AC Characteristics and T iming
Parameters
This section defines the dsPIC33EVXXXGM00X/10X family AC characteristics and timing parameters.
TABLE 30-15: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
FIGURE 30-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
TABLE 30-16: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Operating voltage V
DD
range as described in
Section 30.1 “DC
Characteristics”
.
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
DO50 C
OSCO
OSC2 Pin — — 15 pF In XT and HS modes, when
external clock is used to drive
OSC1
DO56 C
IO
All I/O Pins and OSC2 — — 50 pF EC mode
DO58 C
B
SCLx, SDAx — — 400 pF In I
2
C mode
V
DD
/2
C
L
R
L
Pin
Pin
V
SS
V
SS
C
L
R
L
=464
C
L
= 50 pF for all pins except OSC2
15 pF for OSC2 output
Load Condition 1 – for All Pins except OSC2 Load Condition 2 – for OSC2
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FIGURE 30-2: EXTERNAL CLOCK TIMING
Q1 Q2 Q3 Q4
OSC1
CLKO
Q1 Q2 Q3 Q4
OS20 OS30 OS30
OS40
OS41
OS31 OS31
OS25
TABLE 30-17: EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Sym Characteristic Min. Typ.
(1)
Max. Units Conditions
OS10 F
IN
External CLKI Frequency
(External clocks allowed only
in EC and ECPLL modes)
DC — 40 MHz EC
Oscillator Crystal Frequency 3.5
10
—
—
10
25
MHz
MHz
XT
HS
OS20 T
OSC
T
OSC
= 1/F
OSC
12.5 — DC ns T
A
= +125°C
OS25 T
CY
Instruction Cycle Time
(2)
25 — DC ns T
A
= +125°C
OS30 TosL,
To s H
External Clock
in (OSC1)
High or Low Time
0.375 x T
OSC
— 0.625 x T
OSC
ns EC
OS31 TosR,
To s F
External Clock
in (OSC1)
Rise or Fall Time
— — 20 ns EC
OS40 TckR CLKO Rise Time
(3)
—5.2—ns
OS41 TckF CLKO Fall Time
(3)
—5.2—ns
OS42 G
M
External Oscillator
Transconductance
(4)
— 12 — mA/V HS, V
DD
= 5.0V,
T
A
= +25°C
—6—mA/VXT, V
DD
= 5.0V,
T
A
= +25°C
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
2:
Instruction cycle period (T
CY
) equals two times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type, under standard operating conditions,
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at
“Minimum” values with an external clock applied to the OSC1 pin. When an external clock input is used,
the “Maximum” cycle time limit is “DC” (no clock) for all devices.
3:
Measurements are taken in EC mode. The CLKO signal is measured on the OSC2 pin.
4:
This parameter is characterized but not tested in manufacturing.
2013-2018 Microchip Technology Inc. DS70005144G-page 355
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TABLE 30-18: PLL CLOCK TIMING SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ.
(1)
Max. Units Conditions
OS50 F
PLLI
PLL Voltage Controlled
Oscillator (VCO) Input
Frequency Range
0.8 — 8.0 MHz ECPLL, XTPLL modes
OS51 F
SYS
On-Chip VCO System
Frequency
120 — 340 MHz
OS52 T
LOCK
PLL Start-up Time (Lock Time) 0.9 1.5 3.1 ms
OS53 D
CLK
CLKO Stability (Jitter)
(2)
-3 0.5 3 %
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2:
This jitter specification is based on clock cycle-by-clock cycle measurements. To get the effective jitter for
individual time bases or communication clocks used by the application, use the following formula:
For example, if F
OSC
= 120 MHz and the SPI bit rate = 10 MHz, the effective jitter is as follows:
Effective Jitter D
CLK
F
OSC
Time Base or Communication Cl ock
---------------------------------------------------------------------------------------
-------------------------------------------------------------------------------------------=
Effective Jitter D
CLK
120
10
---------
--------------D
CLK
12
--------------D
CLK
3.464
--------------
===
TABLE 30-19: INTERNAL FRC ACCURACY
AC CHARACTERISTICS Standard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Characteristic Min. Typ. Max. Units Conditions
Internal FRC Accuracy @ FR C Frequency = 7.37 MHz
(1)
F20a FRC -1 0.5 +1 % -40°C T
A
+85°C V
DD
= 4.5-5.5V
F20b FRC -2 1 +2 % -40°C T
A
+125°C V
DD
= 4.5-5.5V
Note 1:
Frequency calibrated at +25°C and 5.0V. TUN<5:0> bits can be used to compensate for temperature drift.
TABLE 30-20: INTERNAL LPRC ACCURACY
AC CHARACTERISTICS Standard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Characteristic Min. Typ. Max. Units Conditions
LPRC @ 32.768 kHz
(1)
F21a LPRC -15 5 +15 % -40°C T
A
+85°C V
DD
= 4.5-5.5V
F21b LPRC -30 10 +30 % -40°C T
A
+125°C V
DD
= 4.5-5.5V
Note 1:
Change of LPRC frequency as V
DD
changes.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 356 2013-2018 Microchip Technology Inc.
FIGURE 30-3: I/O TIMING CHARACTERISTICS
FIGURE 30-4: BOR AND MASTER CLEAR RESET TIMING CHARACTERISTICS
Note:
Refer to Figure 30-1 for load conditions.
I/O Pin
(Input)
I/O Pin
(Output)
DI35
Old Value New Value
DI40
DO31
DO32
TABLE 30-21: I/O TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ.
(1)
Max. Units Conditions
DO31 T
IO
R Port Output Rise Time — 5 10 ns
DO32 T
IO
F Port Output Fall Time — 5 10 ns
DI35 T
INP
INTx Pin High or Low Time (input) 20 — — ns
DI40 T
RBP
CNx High or Low Time (input) 2 — — T
CY
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
MCLR
(SY20)
BOR
(SY30)
T
MCLR
T
BOR
Reset Sequence
CPU Starts Fetching Code
Various Delays (depending on configuration)
2013-2018 Microchip Technology Inc. DS70005144G-page 357
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FIGURE 30-5: POWER-ON RESET TIMING CHARACTERISTICS
Note 1:
The power-up period will be extended if the power-up sequence completes before the device exits from
BOR (V
DD
< V
BOR
).
2:
The power-up period includes internal voltage regulator stabilization delay.
V
DD
V
POR
SY11
Power-up Sequence
(Notes 1,2)
CPU Starts Fetching Code
(T
PWRT
)
Power-up Timer – Clock Sources = (FRC, FRCDIVN, FRCDIV16, FRCPLL, EC, ECPLL and LPRC)
SY00
(T
PU
)
V
DD
V
POR
Greater of
Power-up Sequence
(Notes 1,2)
CPU Starts Fetching Code
Power-up Timer – Clock Sources = (HS, HSPLL, XT and XTPLL)
SY00
(T
PU
)
SY11
(T
PWRT
)
SY10
(T
OST
)
or
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DS70005144G-page 358 2013-2018 Microchip Technology Inc.
TABLE 30-22: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TI MING R EQ UIRE ME NTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SY00 T
PU
Power-up Period — 400 600 µs
SY10 T
OST
Oscillator Start-up
Time
—1024T
OSC
——T
OSC
= OSC1 period
SY11 T
PWRT
Power-up Timer
Period
— 1 — ms Using LPRC parameters indicated in
F21a/F21b (see Table 30-20)
SY12 T
WDT
Watchdog Timer
Time-out Period
0.8 — 1.2 ms WDTPRE = 0, WDTPS<3:0> = 0000,
using LPRC tolerances indicated in
F21a/F21b (see Table 30-20) at
+85°C
3.2 — 4.8 ms WDTPRE = 1, WDTPS<3:0> = 0000,
using LPRC tolerances indicated in
F21a/F21b (see Table 30-20) at
+85°C
SY13 T
IOZ
I/O High-Impedance
from MCLR Low or
Watchdog Timer Reset
0.68 0.72 1.2 µs
SY20 T
MCLR
MCLR Pulse Width
(low)
2——µs
SY30 T
BOR
BOR Pulse Width
(low)
1——ms
SY35 T
FSCM
Fail-Safe Clock
Monitor Delay
— 500 900 µs -40°C to +85°C
SY36 T
VREG
Voltage Regulator
Standby-to-Active
mode Transition Time
——30µs
SY37 T
OSCDFRC
FRC Oscillator
Start-up Delay
46 48 54 µs
SY38 T
OSCDLPRC
LPRC Oscillator
Start-up Delay
——70µs
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
2013-2018 Microchip Technology Inc. DS70005144G-page 359
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FIGURE 30-6: TIMER1-TIMER5 EXTERNA L CLOCK TIMING CHARACTERISTICS
Note:
Refer to Figure 30-1 for load conditions.
OS60
TxCK
TMRx
Tx10 Tx11
Tx15 Tx20
TABLE 30-23: TIMER1 EXTERNAL CLOCK TIMING REQUIREMENTS
(1)
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic
(2)
Min. Typ. Max. Units Conditions
TA10 T
TX
H T1CK High
Time
Synchronous
mode
Greater of:
20 or
(T
CY
+ 20)/N
— — ns Must also meet
Parameter TA15,
N = Prescaler Value
(1, 8, 64, 256)
Asynchronous
mode
35 — — ns
TA11 T
TX
LT1CK Low
Time
Synchronous
mode
Greater of:
20 or
(T
CY
+ 20)/N
— — ns Must also meet
Parameter TA15,
N = Prescaler Value
(1, 8, 64, 256)
Asynchronous
mode
10 — — ns
TA15 T
TX
P T1CK Input
Period
Synchronous
mode
Greater of:
40 or
(2 T
CY
+ 40)/N
— — ns N = Prescaler Value
(1, 8, 64, 256)
OS60 Ft1 T1CK Oscillator Input
Frequency Range (oscillator
enabled by setting TCS
(T1CON<1>) bit)
DC — 50 kHz
TA20 T
CKEXTMRL
Delay from External T1CK
Clock Edge to Timer
Increment
0.75 T
CY
+ 40 — 1.75 T
CY
+ 40 ns
Note 1:
Timer1 is a Type A.
2:
These parameters are characterized but not tested in manufacturing.
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DS70005144G-page 360 2013-2018 Microchip Technology Inc.
TABLE 30-24: TIMER2 AND TIMER4 (TYPE B TIMER) EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic
(1)
Min. Typ. Max. Units Conditions
TB10 T
TX
HTxCK High
Time
Synchronous
mode
Greater of:
20 or
(T
CY
+ 20)/N
— — ns Must also meet
Parameter TB15,
N = Prescaler Value
(1, 8, 64, 256)
TB11 T
TX
LTxCK Low
Time
Synchronous
mode
Greater of:
20 or
(T
CY
+ 20)/N
— — ns Must also meet
Parameter TB15,
N = Prescaler Value
(1, 8, 64, 256)
TB15 T
TX
P TxCK Input
Period
Synchronous
mode
Greater of:
40 or
(2 T
CY
+ 40)/N
— — ns N = Prescaler Value
(1, 8, 64, 256)
TB20 T
CKEXTMRL
Delay from External TxCK
Clock Edge to Timer
Increment
0.75 T
CY
+ 40 — 1.75 T
CY
+ 40 ns
Note 1:
These parameters are characterized but not tested in manufacturing.
TABLE 30-25: TIMER3 AND TIMER5 (TYPE C TIMER) EXTERNAL CLOCK TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless othe rwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic
(1)
Min. Typ. Max. Units Conditions
TC10 T
TX
HTxCK High
Time
Synchronous T
CY
+ 20 — — ns Must also meet
Parameter TC15
TC11 T
TX
L TxCK Low
Time
Synchronous T
CY
+ 20 — — ns Must also meet
Parameter TC15
TC15 T
TX
P TxCK Input
Period
Synchronous,
with Prescaler
2 T
CY
+ 40 — — ns N = Prescaler Value
(1, 8, 64, 256)
TC20 T
CKEXTMRL
Delay from External TxCK
Clock Edge to Timer
Increment
0.75 T
CY
+ 40 — 1.75 T
CY
+ 40 ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2013-2018 Microchip Technology Inc. DS70005144G-page 361
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FIGURE 30-7: INPUT CAPTURE x (ICx) TIMING CHARACTERISTICS
ICx
IC10 IC11
IC15
Note 1:
Refer to Figure 30-1 for load conditions.
TABLE 30-26: INPUT CAPTURE x (ICx) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param.
No. Symbol Characteristics
(1)
Min. Max. Units Conditions
IC10 T
CC
L ICx Input Low Time Greater of:
12.5 + 25 or
(0.5 T
CY
/N) + 25
— ns Must also meet
Parameter IC15
N = Prescaler
Value (1, 4, 16)
IC11 T
CC
H ICx Input High Time Greater of:
12.5 + 25 or
(0.5 T
CY
/N) + 25
— ns Must also meet
Parameter IC15
IC15 T
CC
P ICx Input Period Greater of:
25 + 50 or
(1 T
CY
/N) + 50
—ns
Note 1:
These parameters are characterized but not tested in manufacturing.
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FIGURE 30-8: OUTPUT COMPARE x (OCx) TIMING CHARACTERISTICS
FIGURE 30-9: OCx/PWMx MODULE TIMING CHARACTERISTICS
OCx
OC11 OC10
(Output Compare
Note:
Refer to Figure 30-1 for load conditions.
or PWM Mode)
TABLE 30-27: OUTPUT COMPARE x (OCx) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwis e stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic
(1)
Min. Typ. Max. Units Conditions
OC10 T
CC
F OCx Output Fall Time — — — ns See Parameter DO32
OC11 T
CC
R OCx Output Rise Time — — — ns See Parameter DO31
Note 1:
These parameters are characterized but not tested in manufacturing.
OCFA
OCx
OC20
OC15
TABLE 30 -28: OCx/PWMx MODE TIMING REQUIR EMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwis e stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic
(1)
Min. Typ. Max. Units Conditions
OC15 T
FD
Fault Input to PWMx I/O
Change
——T
CY
+ 20 ns
OC20 T
FLT
Fault Input Pulse Width T
CY
+ 20 — — ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2013-2018 Microchip Technology Inc. DS70005144G-page 363
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FIGURE 30-10: HIGH-SPEED PWMx MODULE FAULT TIMING CHARACTERISTICS
FIGURE 30-11: HIGH-SPEED PWMx MODULE TIMING CHARACTERISTICS
Fault Input
PWMx
MP30
MP20
(active-low)
PWMx
MP11 MP10
Note:
Refer to Figure 30-1 for load conditions.
TABLE 30-29: HIGH-SPEED PWMx MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwis e stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic
(1)
Min. Typ. Max. Units Conditions
MP10 T
FPWM
PWMx Output Fall Time — — — ns See Parameter DO32
MP11 T
RPWM
PWMx Output Rise Time — — — ns See Parameter DO31
MP20 T
FD
Fault Input to PWMx
I/O Change
——15ns
MP30 T
FH
Fault Input Pulse Width 15 — — ns
Note 1:
These parameters are characterized but not tested in manufacturing.
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TABLE 30-30: SPI2 MAXIMUM DATA/CLOCK RATE SUMMARY
FIGURE 30-12: SPI2 MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY, CKE =
0
) T IM ING
CHARACTERISTICS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Maximum
Data Rate
Master
Transmit Only
(Half-Duplex)
Master
Transmit/Receive
(Full-Duplex)
Slave
Transmit/Receive
(Full-Duplex) CKE CKP SMP
15 MHz Table 30-31 ——0,10,10,1
9 MHz — Table 30-32 —10,11
9 MHz — Table 30-33 —00,11
15 MHz — — Table 30-34 100
11 MHz — — Table 30-35 110
15 MHz — — Table 30-36 010
11 MHz — — Table 30-37 000
SCK2
(CKP =
0
)
SCK2
(CKP =
1
)
SDO2
SP10
SP21SP20
SP35
SP20SP21
MSb LSbBit 14 - - - - - -1
SP30, SP31SP30, SP31
Note:
Refer to Figure 30-1 for load conditions.
2013-2018 Microchip Technology Inc. DS70005144G-page 365
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FIGURE 30-13: SPI2 MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY, CKE =
1
) T IM ING
CHARACTERISTICS
TABLE 30-31: SPI2 MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwis e stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP10 FscP Maximum SCK2 Frequency — — 15 MHz See
Note 3
SP20 TscF SCK2 Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP21 TscR SCK2 Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO2 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO2 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO2 Data Output Valid after
SCK2 Edge
—620ns
SP36 TdiV2scH,
TdiV2scL
SDO2 Data Output Setup to
First SCK2 Edge
30 — — ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK2 is 66.7 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4:
Assumes 50 pF load on all SPI2 pins.
SCK2
(CKP =
0
)
SCK2
(CKP =
1
)
SDO2
SP21SP20
SP35
SP20SP21
MSb LSbBit 14 - - - - - -1
SP30, SP31
Note:
Refer to Figure 30-1 for load conditions.
SP36
SP10
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DS70005144G-page 366 2013-2018 Microchip Technology Inc.
FIGURE 30-14: SPI2 MASTER MODE (FULL-DUPLEX, CKE =
1
, CKP =
x
, SMP =
1
) TIMING
CHARACTERISTICS
TABLE 30-32: SPI2 MASTER MODE (FULL-DUPLEX, CKE =
1
, CKP =
x
, SMP =
1
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP10 FscP Maximum SCK2 Frequency — — 9 MHz See
Note 3
SP20 TscF SCK2 Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP21 TscR SCK2 Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO2 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO2 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO2 Data Output Valid after
SCK2 Edge
—620ns
SP36 TdoV2sc,
TdoV2scL
SDO2 Data Output Setup to
First SCK2 Edge
30 ——ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI2 Data
Input to SCK2 Edge
30 ——ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI2 Data Input
to SCK2 Edge
30 ——ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK2 is 111 ns. The clock generated in Master mode must not violate this
specification.
4:
Assumes 50 pF load on all SPI2 pins.
SCK2
(CKP =
0
)
SCK2
(CKP =
1
)
SDO2
SP21SP20
SP35
SP20SP21
MSb LSbBit 14 - - - - - -1
SP30, SP31
Note:
Refer to Figure 30-1 for load conditions.
SP36
SP41
LSb InBit 14 - - - -1
SDI2
SP40
MSb In
SP10
2013-2018 Microchip Technology Inc. DS70005144G-page 367
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FIGURE 30-15: SPI2 MASTER MODE (FULL-DUPLEX, CKE =
0
, CKP =
x
, SMP =
1
) TIMING
CHARACTERISTICS
TABLE 30-33: SPI2 MASTER MODE (FULL-DUPLEX, CKE =
0
, CKP =
x
, SMP =
1
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP10 FscP Maximum SCK2 Frequency — — 9 MHz -40ºC to +125ºC and
see
Note 3
SP20 TscF SCK2 Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP21 TscR SCK2 Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO2 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO2 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO2 Data Output Valid after
SCK2 Edge
—620ns
SP36 TdoV2scH,
TdoV2scL
SDO2 Data Output Setup to
First SCK2 Edge
30 ——ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI2 Data
Input to SCK2 Edge
30 ——ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI2 Data Input
to SCK2 Edge
30 ——ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK2 is 111 ns. The clock generated in Master mode must not violate this
specification.
4:
Assumes 50 pF load on all SPI2 pins.
SCK2
(CKP =
0
)
SCK2
(CKP =
1
)
SDO2
SDI2
SP40 SP41
SP21SP20
SP35
SP20SP21
MSb LSbBit 14 - - - - - -1
LSb InBit 14 - - - -1
SP30, SP31SP30, SP31
Note:
Refer to Figure 30-1 for load conditions.
SP36
SP10
MSb In
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 368 2013-2018 Microchip Technology Inc.
FIGURE 30-16: SPI2 SLAVE MODE (FULL-DUPLEX, CKE =
1
, CKP =
0
, SMP =
0
) TIMING
CHARACTERISTICS
SS2
SCK2
(CKP =
0
)
SCK2
(CKP =
1
)
SDO2
SP60
SDI2
SP30, SP31
MSb Bit 14 - - - - - -1 LSb
SP51
Bit 14 - - - -1 LSb In
SP35
SP52
SP73SP72
SP72SP73
SP40
SP41
Note:
Refer to Figure 30-1 for load conditions.
SP36
SP50
MSb In
SP70
2013-2018 Microchip Technology Inc. DS70005144G-page 369
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 30-34: SPI2 SLAVE MODE (FULL-DUPLEX, CKE =
1
, CKP =
0
, SMP =
0
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP70 FscP Maximum SCK2 Input Frequency — — 15 MHz See
Note 3
SP72 TscF SCK2 Input Fall Time — — — ns See Parameter DO32
and
Note 4
SP73 TscR SCK2 Input Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO2 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO2 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO2 Data Output Valid after
SCK2 Edge
— 6 20 ns
SP36 TdoV2scH,
TdoV2scL
SDO2 Data Output Setup to
First SCK2 Edge
30 — — ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI2 Data Input
to SCK2 Edge
30 — — ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI2 Data Input
to SCK2 Edge
30 — — ns
SP50 TssL2scH,
TssL2scL
SS2 to SCK2 or SCK2
Input
120 — — ns
SP51 TssH2doZ SS2 to SDO2 Output
High-Impedance
10 — 50 ns See
Note 4
SP52 TscH2ssH
TscL2ssH
SS2 after SCK2 Edge 1.5 T
CY
+ 40 — — ns See
Note 4
SP60 TssL2doV SDO2 Data Output Valid after
SS2 Edge
— — 50 ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK2 is 66.7 ns. Therefore, the SCK2 clock generated by the master must
not violate this specification.
4:
Assumes 50 pF load on all SPI2 pins.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 370 2013-2018 Microchip Technology Inc.
FIGURE 30-17: SPI2 SLAVE MODE (FULL-DUPLEX, CKE =
1
, CKP =
1
, SMP =
0
) TIMING
CHARACTERISTICS
SS2
SCK2
(CKP =
0
)
SCK2
(CKP =
1
)
SDO2
SDI2
SP60
SP30, SP31
MSb Bit 14 - - - - - -1 LSb
SP51
Bit 14 - - - -1 LSb In
SP35
SP52
SP73SP72
SP72SP73
SP70
SP40
SP41
Note:
Refer to Figure 30-1 for load conditions.
SP36
SP50
MSb In
2013-2018 Microchip Technology Inc. DS70005144G-page 371
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 30-35: SPI2 SLAVE MODE (FULL-DUPLEX, CKE =
1
, CKP =
1
, SMP =
0
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP70 FscP Maximum SCK2 Input Frequency — — 11 MHz See
Note 3
SP72 TscF SCK2 Input Fall Time — — — ns See Parameter DO32
and
Note 4
SP73 TscR SCK2 Input Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO2 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO2 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO2 Data Output Valid after
SCK2 Edge
— 6 20 ns
SP36 TdoV2scH,
TdoV2scL
SDO2 Data Output Setup to
First SCK2 Edge
30 — — ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI2 Data Input
to SCK2 Edge
30 — — ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI2 Data Input
to SCK2 Edge
30 — — ns
SP50 TssL2scH,
TssL2scL
SS2 to SCK2 or SCK2
Input
120 — — ns
SP51 TssH2doZ SS2 to SDO2 Output
High-Impedance
10 — 50 ns See
Note 4
SP52 TscH2ssH
TscL2ssH
SS2 after SCK2 Edge 1.5 T
CY
+ 40 — — ns See
Note 4
SP60 TssL2doV SDO2 Data Output Valid after
SS2 Edge
— — 50 ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK2 is 91 ns. Therefore, the SCK2 clock generated by the master must
not violate this specification.
4:
Assumes 50 pF load on all SPI2 pins.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 372 2013-2018 Microchip Technology Inc.
FIGURE 30-18: SPI2 SLAVE MODE (FULL-DUPLEX, CKE =
0
, CKP =
1
, SMP =
0
) TIMING
CHARACTERISTICS
SS2
SCK2
(CKP =
0
)
SCK2
(CKP =
1
)
SDO2
SP50
SP40
SP41
SP30, SP31 SP51
SP35
MSb LSbBit 14 - - - - - -1
Bit 14 - - - -1 LSb In
SP52
SP73SP72
SP72
SP73
Note:
Refer to Figure 30-1 for load conditions.
SDI2
SP70
SP36
MSb In
2013-2018 Microchip Technology Inc. DS70005144G-page 373
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 30-36: SPI2 SLAVE MODE (FULL-DUPLEX, CKE =
0
, CKP =
1
, SMP =
0
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP70 FscP Maximum SCK2 Input Frequency — — 15 MHz See
Note 3
SP72 TscF SCK2 Input Fall Time — — — ns See Parameter DO32
and
Note 4
SP73 TscR SCK2 Input Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO2 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO2 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO2 Data Output Valid after
SCK2 Edge
— 6 20 ns
SP36 TdoV2scH,
TdoV2scL
SDO2 Data Output Setup to
First SCK2 Edge
30 — — ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI2 Data Input
to SCK2 Edge
30 — — ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI2 Data Input
to SCK2 Edge
30 — — ns
SP50 TssL2scH,
TssL2scL
SS2 to SCK2 or SCK2
Input
120 — — ns
SP51 TssH2doZ SS2 to SDO2 Output
High-Impedance
10 — 50 ns See
Note 4
SP52 TscH2ssH
TscL2ssH
SS2 after SCK2 Edge 1.5 T
CY
+ 40 — — ns See
Note 4
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK2 is 66.7 ns. Therefore, the SCK2 clock generated by the master must
not violate this specification.
4:
Assumes 50 pF load on all SPI2 pins.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 374 2013-2018 Microchip Technology Inc.
FIGURE 30-19: SPI2 SLAVE MODE (FULL-DUPLEX, CKE =
0
, CKP =
0
, SMP =
0
) TIMING
CHARACTERISTICS
SS2
SCK2
(CKP =
0
)
SCK2
(CKP =
1
)
SDO2
SP50
SP40
SP41
SP30, SP31 SP51
SP35
MSb LSbBit 14 - - - - - -1
Bit 14 - - - -1 LSb In
SP52
SP73SP72
SP72SP73
Note:
Refer to Figure 30-1 for load conditions.
SDI2
SP70
SP36
MSb In
2013-2018 Microchip Technology Inc. DS70005144G-page 375
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 30-37: SPI2 SLAVE MODE (FULL-DUPLEX, CKE =
0
, CKP =
0
, SMP =
0
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP70 FscP Maximum SCK2 Input Frequency — — 11 MHz See
Note 3
SP72 TscF SCK2 Input Fall Time — — — ns See Parameter DO32
and
Note 4
SP73 TscR SCK2 Input Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO2 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO2 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO2 Data Output Valid after
SCK2 Edge
— 6 20 ns
SP36 TdoV2scH,
TdoV2scL
SDO2 Data Output Setup to
First SCK2 Edge
30 — — ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI2 Data Input
to SCK2 Edge
30 — — ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI2 Data Input
to SCK2 Edge
30 — — ns
SP50 TssL2scH,
TssL2scL
SS2 to SCK2 or SCK2
Input
120 — — ns
SP51 TssH2doZ SS2 to SDO2 Output
High-Impedance
10 — 50 ns See
Note 4
SP52 TscH2ssH
TscL2ssH
SS2 after SCK2 Edge 1.5 T
CY
+ 40 — — ns See
Note 4
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK2 is 91 ns. Therefore, the SCK2 clock generated by the master must
not violate this specification.
4:
Assumes 50 pF load on all SPI2 pins.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 376 2013-2018 Microchip Technology Inc.
TABLE 30-38: SPI1 MAXIMUM DATA/CLOCK RATE SUMMARY
FIGURE 30-20: SPI1 MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY, CKE =
0
)
TIMING CHARACTERISTICS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Maximum
Data Rate
Master
Transmit Only
(Half-Duplex)
Master
Transmit/Receive
(Full-Duplex)
Slave
Transmit/Receive
(Full-Duplex) CKE CKP SMP
25 MHz Table 30-39 ——0,10,10,1
25 MHz — Table 30-40 —10,11
25 MHz — Table 30-41 —00,11
25 MHz — — Table 30-42 100
25 MHz — — Table 30-43 110
25 MHz — — Table 30-44 010
25 MHz — — Table 30-45 000
SCK1
(CKP =
0
)
SCK1
(CKP =
1
)
SDO1
SP10
SP21SP20
SP35
SP20SP21
MSb LSbBit 14 - - - - - -1
SP30, SP31SP30, SP31
Note:
Refer to Figure 30-1 for load conditions.
2013-2018 Microchip Technology Inc. DS70005144G-page 377
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 30-21: SPI1 MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY, CKE =
1
)
TIMING CHARACTERISTICS
TABLE 30-39: SPI1 MASTER MODE (HALF-DUPLEX, TRANSMIT ONLY) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwis e stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP10 FscP Maximum SCK1 Frequency — — 25 MHz See
Note 3
SP20 TscF SCK1 Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP21 TscR SCK1 Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO1 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO1 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO1 Data Output Valid after
SCK1 Edge
—620ns
SP36 TdiV2scH,
TdiV2scL
SDO1 Data Output Setup to
First SCK1 Edge
20 — — ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK1 is 40 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4:
Assumes 50 pF load on all SPI1 pins.
SCK1
(CKP =
0
)
SCK1
(CKP =
1
)
SDO1
SP21SP20
SP35
SP20SP21
MSb LSbBit 14 - - - - - -1
SP30, SP31
Note:
Refer to Figure 30-1 for load conditions.
SP36
SP10
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 378 2013-2018 Microchip Technology Inc.
FIGURE 30-22: SPI1 MASTER MODE (FULL-DUPLEX, CKE =
1
, CKP =
x
, SMP =
1
)
TIMING CHARACTERISTICS
SCK1
(CKP =
0
)
SCK1
(CKP =
1
)
SDO1
SP21SP20
SP35
SP20SP21
MSb LSbBit 14 - - - - - -1
SP30, SP31
Note:
Refer to Figure 30-1 for load conditions.
SP36
SP41
LSb InBit 14 - - - -1
SDI1
SP40
SP10
MSb In
TABLE 30-40: SPI1 MASTER MODE (FULL-DUPLEX, CKE =
1
, CKP =
x
, SMP =
1
) TIMING
REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP10 FscP Maximum SCK1 Frequency — — 25 MHz See
Note 3
SP20 TscF SCK1 Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP21 TscR SCK1 Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO1 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO1 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO1 Data Output Valid after
SCK1 Edge
—620ns
SP36 TdoV2sc,
TdoV2scL
SDO1 Data Output Setup to
First SCK1 Edge
20 ——ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI1 Data
Input to SCK1 Edge
20 ——ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI1 Data Input
to SCK1 Edge
15 ——ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK1 is 40 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4:
Assumes 50 pF load on all SPI1 pins.
2013-2018 Microchip Technology Inc. DS70005144G-page 379
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 30-23: SPI1 MASTER MODE (FULL-DUPLEX, CKE =
0
, CKP =
x
, SMP =
1
)
TIMING CHARACTERISTICS
SCK1
(CKP =
0
)
SCK1
(CKP =
1
)
SDO1
SD1
SP40 SP41
SP21SP20
SP35
SP20SP21
MSb LSbBit 14 - - - - - -1
LSb InBit 14 - - - -1
SP30, SP31
SP30, SP31
Note:
Refer to Figure 30-1 for load conditions.
SP36
SP10
MSb In
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 380 2013-2018 Microchip Technology Inc.
TABLE 30-41: SPI1 MASTER MODE (FULL-DUPLEX, CKE =
0
, CKP =
x
, SMP =
1
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP10 FscP Maximum SCK1 Frequency — — 25 MHz -40°C to +125°C and
see
Note 3
SP20 TscF SCK1 Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP21 TscR SCK1 Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO1 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO1 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO1 Data Output Valid after
SCK1 Edge
—620ns
SP36 TdoV2scH,
TdoV2scL
SDO1 Data Output Setup to
First SCK1 Edge
20 ——ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI1 Data
Input to SCK1 Edge
20 ——ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI1 Data Input
to SCK1 Edge
20 ——ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK1 is 40 ns. Therefore, the clock generated in Master mode must not
violate this specification.
4:
Assumes 50 pF load on all SPI1 pins.
2013-2018 Microchip Technology Inc. DS70005144G-page 381
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 30-24: SPI1 SLAVE MODE (FULL-DUPLEX, CKE =
1
, CKP =
0
, SMP =
0
)
TIMING CHARACTERISTICS
SS1
SCK1
(CKP =
0
)
SCK1
(CKP =
1
)
SDO1
SP60
SDI1
SP30, SP31
MSb Bit 14 - - - - - -1 LSb
SP51
Bit 14 - - - -1 LSb In
SP35
SP52
SP73SP72
SP72SP73
SP40
SP41
Note:
Refer to Figure 30-1 for load conditions.
SP36
SP50
MSb In
SP70
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 382 2013-2018 Microchip Technology Inc.
TABLE 30-42: SPI1 SLAVE MODE (FULL-DUPLEX, CKE =
1
, CKP =
0
, SMP =
0
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP70 FscP Maximum SCK1 Input Frequency — — 25 MHz See
Note 3
SP72 TscF SCK1 Input Fall Time — — — ns See Parameter DO32
and
Note 4
SP73 TscR SCK1 Input Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO1 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO1 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO1 Data Output Valid after
SCK1 Edge
— 6 20 ns
SP36 TdoV2scH,
TdoV2scL
SDO1 Data Output Setup to
First SCK1 Edge
20 — — ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDIx Data Input
to SCK1 Edge
20 — — ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI1 Data Input
to SCK1 Edge
15 — — ns
SP50 TssL2scH,
TssL2scL
SS1 to SCK1 or SCK1
Input
120 — — ns
SP51 TssH2doZ SS1 to SDO1 Output
High-Impedance
10 — 50 ns See
Note 4
SP52 TscH2ssH
TscL2ssH
SS1 after SCK1 Edge 1.5 T
CY
+ 40 — — ns See
Note 4
SP60 TssL2doV SDO1 Data Output Valid after
SS1 Edge
— — 50 ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK1 is 40 ns. Therefore, the SCK1 clock generated by the master must
not violate this specification.
4:
Assumes 50 pF load on all SPI1 pins.
2013-2018 Microchip Technology Inc. DS70005144G-page 383
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 30-25: SPI1 SLAVE MODE (FULL-DUPLEX, CKE =
1
, CKP =
1
, SMP =
0
)
TIMING CHARACTERISTICS
SS1
SCK1
(CKP =
0
)
SCK1
(CKP =
1
)
SDO1
SP60
SDI1
SP30, SP31
MSb Bit 14 - - - - - -1 LSb
SP51
Bit 14 - - - -1 LSb In
SP35
SP52
SP73SP72
SP72SP73
SP70
SP40
SP41
Note:
Refer to Figure 30-1 for load conditions.
SP36
SP50
MSb In
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 384 2013-2018 Microchip Technology Inc.
TABLE 30-43: SPI1 SLAVE MODE (FULL-DUPLEX, CKE =
1
, CKP =
1
, SMP =
0
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP70 FscP Maximum SCK1 Input Frequency — — 25 MHz See
Note 3
SP72 TscF SCK1 Input Fall Time — — — ns See Parameter DO32
and
Note 4
SP73 TscR SCK1 Input Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO1 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO1 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO1 Data Output Valid after
SCK1 Edge
— 6 20 ns
SP36 TdoV2scH,
TdoV2scL
SDO1 Data Output Setup to
First SCK1 Edge
20 — — ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI1 Data Input
to SCK1 Edge
20 — — ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI1 Data Input
to SCK1 Edge
15 — — ns
SP50 TssL2scH,
TssL2scL
SS1 to SCK1 or SCK1
Input
120 — — ns
SP51 TssH2doZ SS1 to SDO1 Output
High-Impedance
10 — 50 ns See
Note 4
SP52 TscH2ssH,
TscL2ssH
SS1 after SCK1 Edge 1.5 T
CY
+ 40 — — ns See
Note 4
SP60 TssL2doV SDO1 Data Output Valid after
SS1 Edge
— — 50 ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK1 is 40 ns. Therefore, the SCK1 clock generated by the master must
not violate this specification.
4:
Assumes 50 pF load on all SPI1 pins.
2013-2018 Microchip Technology Inc. DS70005144G-page 385
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 30-26: SPI1 SLAVE MODE (FULL-DUPLEX, CKE =
0
, CKP =
1
, SMP =
0
)
TIMING CHARACTERISTICS
SS1
SCK1
(CKP =
0
)
SCK1
(CKP =
1
)
SDO1
SP50
SP40
SP41
SP30, SP31 SP51
SP35
MSb LSbBit 14 - - - - - -1
Bit 14 - - - -1 LSb In
SP52
SP73SP72
SP72SP73
Note:
Refer to Figure 30-1 for load conditions.
SDI1
SP70
SP36
MSb In
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 386 2013-2018 Microchip Technology Inc.
TABLE 30-44: SPI1 SLAVE MODE (FULL-DUPLEX, CKE =
0
, CKP =
1
, SMP =
0
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP70 FscP Maximum SCK1 Input Frequency — — 25 MHz See
Note 3
SP72 TscF SCK1 Input Fall Time — — — ns See Parameter DO32
and
Note 4
SP73 TscR SCK1 Input Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO1 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO1 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO1 Data Output Valid after
SCK1 Edge
— 6 20 ns
SP36 TdoV2scH,
TdoV2scL
SDO1 Data Output Setup to
First SCK1 Edge
20 — — ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI1 Data Input
to SCK1 Edge
20 — — ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI1 Data Input
to SCK1 Edge
15 — — ns
SP50 TssL2scH,
TssL2scL
SS1 to SCK1 or SCK1
Input
120 — — ns
SP51 TssH2doZ SS1 to SDO1 Output
High-Impedance
10 — 50 ns See
Note 4
SP52 TscH2ssH,
TscL2ssH
SS1 after SCK1 Edge 1.5 T
CY
+ 40 — — ns See
Note 4
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK1 is 40 ns. Therefore, the SCK1 clock generated by the master must
not violate this specification.
4:
Assumes 50 pF load on all SPI1 pins.
2013-2018 Microchip Technology Inc. DS70005144G-page 387
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 30-27: SPI1 SLAVE MODE (FULL-DUPLEX, CKE =
0
, CKP =
0
, SMP =
0
)
TIMING CHARACTERISTICS
SS1
SCK1
(CKP =
0
)
SCK1
(CKP =
1
)
SDO1
SP50
SP40
SP41
SP30, SP31 SP51
SP35
MSb LSbBit 14 - - - - - -1
Bit 14 - - - -1 LSb In
SP52
SP73SP72
SP72SP73
Note:
Refer to Figure 30-1 for load conditions.
SDI1
SP70
SP36
MSb In
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 388 2013-2018 Microchip Technology Inc.
TABLE 30-45: SPI1 SLAVE MODE (FULL-DUPLEX, CKE =
0
, CKP =
0
, SMP =
0
)
TIMING REQUIREMENT S
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
SP70 FscP Maximum SCK1 Input Frequency — — 25 MHz See
Note 3
SP72 TscF SCK1 Input Fall Time — — — ns See Parameter DO32
and
Note 4
SP73 TscR SCK1 Input Rise Time — — — ns See Parameter DO31
and
Note 4
SP30 TdoF SDO1 Data Output Fall Time — — — ns See Parameter DO32
and
Note 4
SP31 TdoR SDO1 Data Output Rise Time — — — ns See Parameter DO31
and
Note 4
SP35 TscH2doV,
TscL2doV
SDO1 Data Output Valid after
SCK1 Edge
— 6 20 ns
SP36 TdoV2scH,
TdoV2scL
SDO1 Data Output Setup to
First SCK1 Edge
20 — — ns
SP40 TdiV2scH,
TdiV2scL
Setup Time of SDI1 Data Input
to SCK1 Edge
20 — — ns
SP41 TscH2diL,
Ts c L 2 d i L
Hold Time of SDI1 Data Input
to SCK1 Edge
15 — — ns
SP50 TssL2scH,
TssL2scL
SS1 to SCK1 or SCK1
Input
120 — — ns
SP51 TssH2doZ SS1 to SDO1 Output
High-Impedance
10 — 50 ns See
Note 4
SP52 TscH2ssH,
TscL2ssH
SS1 after SCK1 Edge 1.5 T
CY
+ 40 — — ns See
Note 4
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
3:
The minimum clock period for SCK1 is 40 ns. Therefore, the SCK1 clock generated by the master must
not violate this specification.
4:
Assumes 50 pF load on all SPI1 pins.
2013-2018 Microchip Technology Inc. DS70005144G-page 389
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 30-28: I2Cx BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE)
FIGURE 30-29: I2Cx BUS DATA TIMING CHARACTERISTICS (MASTER MODE)
SCLx
SDAx
Start
Condition
Stop
Condition
Note:
Refer to Figure 30-1 for load conditions.
IM31
IM30
IM34
IM33
IM11
IM10 IM33
IM11
IM10
IM20
IM26
IM25
IM40 IM40 IM45
IM21
SCLx
SDAx
In
SDAx
Out
Note:
Refer to Figure 30-1 for load conditions.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 390 2013-2018 Microchip Technology Inc.
TABLE 30-46: I2Cx BUS DATA TIMING REQUIREMENTS (MASTER MODE)
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic
(4)
Min.
(1)
Max. Units Conditions
IM10 T
LO
:
SCL
Clock Low Time 100 kHz mode T
CY
/2 (BRG + 2) — s
400 kHz mode T
CY
/2 (BRG + 2) — s
1 MHz mode
(2)
T
CY
/2 (BRG + 2) — s
IM11 T
HI
:
SCL
Clock High Time 100 kHz mode T
CY
/2 (BRG + 2) — s
400 kHz mode T
CY
/2 (BRG + 2) — s
1 MHz mode
(2)
T
CY
/2 (BRG + 2) — s
IM20 T
F
:
SCL
SDAx and SCLx
Fall Time
100 kHz mode — 300 ns C
B
is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 C
B
300 ns
1 MHz mode
(2)
— 100 ns
IM21 T
R
:
SCL
SDAx and SCLx
Rise Time
100 kHz mode — 1000 ns C
B
is specified to be
from 10 to 400 pF
400 kHz mode 20 + 0.1 C
B
300 ns
1 MHz mode
(2)
— 300 ns
IM25 T
SU
:
DAT
Data Input
Setup Time
100 kHz mode 250 — ns
400 kHz mode 100 — ns
1 MHz mode
(2)
40 — ns
IM26 T
HD
:
DAT
Data Input
Hold Time
100 kHz mode 0 — s
400 kHz mode 0 0.9 s
1 MHz mode
(2)
0.2 — s
IM30 T
SU
:
STA
Start Condition
Setup Time
100 kHz mode T
CY
/2 (BRG + 2) — s Only relevant for
Repeated Start
condition
400 kHz mode T
CY
/2 (BRG + 2) — s
1 MHz mode
(2)
T
CY
/2 (BRG + 2) — s
IM31 T
HD
:
STA
Start Condition
Hold Time
100 kHz mode T
CY
/2 (BRG + 2) — s After this period, the
first clock pulse is
generated
400 kHz mode T
CY
/2 (BRG +2) — s
1 MHz mode
(2)
T
CY
/2 (BRG + 2) — s
IM33 T
SU
:
STO
Stop Condition
Setup Time
100 kHz mode T
CY
/2 (BRG + 2) — s
400 kHz mode T
CY
/2 (BRG + 2) — s
1 MHz mode
(2)
T
CY
/2 (BRG + 2) — s
IM34 T
HD
:
STO
Stop Condition
Hold Time
100 kHz mode T
CY
/2 (BRG + 2) — s
400 kHz mode T
CY
/2 (BRG + 2) — s
1 MHz mode
(2)
T
CY
/2 (BRG + 2) — s
IM40 T
AA
:
SCL
Output Valid
From Clock
100 kHz mode — 3500 ns
400 kHz mode — 1000 ns
1 MHz mode
(2)
— 400 ns
IM45 T
BF
:
SDA
Bus Free Time 100 kHz mode 4.7 — s Time the bus must be
free before a new
transmission can start
400 kHz mode 1.3 — s
1 MHz mode
(2)
0.5 — s
IM50 C
B
Bus Capacitive Loading — 400 pF
IM51 T
PGD
Pulse Gobbler Delay 65 390 ns See
Note 3
Note 1:
BRG is the value of the I
2
C Baud Rate Generator. Refer to
“Inter-Integrated Circuit™ (I
2
C™)”
(DS70000195) in the “dsPIC33/PIC24 Family Reference Manual”. Please see the Microchip web site for
the latest “dsPIC33/PIC24 Family Reference Manual” sections.
2:
Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
3:
Typical value for this parameter is 130 ns.
4:
These parameters are characterized but not tested in manufacturing.
2013-2018 Microchip Technology Inc. DS70005144G-page 391
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 30-30: I2Cx BUS START/STOP BIT S TIMING CHARACTERISTICS (SLAVE MODE)
FIGURE 30-31: I2Cx BUS DATA TIMING CHARACTERISTICS (SLAVE MODE)
SCLx
SDAx
Start
Condition
Stop
Condition
IS34
IS33
IS31
IS30
IS30
IS31 IS33
IS11
IS10
IS20
IS25
IS40 IS40 IS45
IS21
SCLx
SDAx
In
SDAx
Out
IS26
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 392 2013-2018 Microchip Technology Inc.
TABLE 30-47: I2Cx BUS DATA TIMING REQUIREMENTS (SLAVE MODE)
AC CHARACTERISTICS
St andard Operating Conditions: 4.5V to 5.5V
(unless otherwise st ated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param.
No. Symbol Characteristic
(3)
Min. Max. Units Conditions
IS10 T
LO
:
SCL
Clock Low Time 100 kHz mode 4.7 — s
400 kHz mode 1.3 — s
1 MHz mode
(1)
0.5 — s
IS11 T
HI
:
SCL
Clock High Time 100 kHz mode 4.0 — s Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 — s Device must operate at a
minimum of 10 MHz
1 MHz mode
(1)
0.5 — s
IS20 T
F
:
SCL
SDAx and SCLx
Fall Time
100 kHz mode — 300 ns C
B
is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 C
B
300 ns
1 MHz mode
(1)
—100ns
IS21 T
R
:
SCL
SDAx and SCLx
Rise Time
100 kHz mode — 1000 ns C
B
is specified to be from
10 to 400 pF
400 kHz mode 20 + 0.1 C
B
300 ns
1 MHz mode
(1)
—300ns
IS25 T
SU
:
DAT
Data Input
Setup Time
100 kHz mode 250 — ns
400 kHz mode 100 — ns
1 MHz mode
(1)
100 — ns
IS26 T
HD
:
DAT
Data Input
Hold Time
100 kHz mode 0 — s
400 kHz mode 0 0.9 s
1 MHz mode
(1)
00.3s
IS30 T
SU
:
STA
Start Condition
Setup Time
100 kHz mode 4.7 — s Only relevant for Repeated
Start condition
400 kHz mode 0.6 — s
1 MHz mode
(1)
0.25 — s
IS31 T
HD
:
STA
Start Condition
Hold Time
100 kHz mode 4.0 — s After this period, the first
clock pulse is generated
400 kHz mode 0.6 — s
1 MHz mode
(1)
0.25 — s
IS33 T
SU
:
STO
Stop Condition
Setup Time
100 kHz mode 4.7 — s
400 kHz mode 0.6 — s
1 MHz mode
(1)
0.6 — s
IS34 T
HD
:
STO
Stop Condition
Hold Time
100 kHz mode 4 — s
400 kHz mode 0.6 — s
1 MHz mode
(1)
0.25 s
IS40 T
AA
:
SCL
Output Valid
From Clock
100 kHz mode 0 3500 ns
400 kHz mode 0 1000 ns
1 MHz mode
(1)
0350ns
IS45 T
BF
:
SDA
Bus Free Time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 — s
1 MHz mode
(1)
0.5 — s
IS50 C
B
Bus Capacitive Loading — 400 pF
IS51 T
PGD
Pulse Gobbler Delay 65 390 ns See
Note 2
Note 1:
Maximum pin capacitance = 10 pF for all I2Cx pins (for 1 MHz mode only).
2:
The typical value for this parameter is 130 ns.
3:
These parameters are characterized but not tested in manufacturing.
2013-2018 Microchip Technology Inc. DS70005144G-page 393
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 30-32: CANx MODULE I/O TIMING CHARACTERISTICS
TABLE 30-48: CANx MODULE I/O TIMING REQUIREMENTS
FIGURE 30-33: UARTx MODULE I/O TIMING CHARACTERISTICS
TABLE 30-49: UARTx MODULE I/O TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwis e stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
CA10 T
IO
F Port Output Fall Time — — — ns See Parameter DO32
CA11 T
IO
R Port Output Rise Time — — — ns See Parameter DO31
CA20 T
CWF
Pulse Width to Trigger
CAN Wake-up Filter
120 — — ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
AC CHARACTERISTICS Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+125°C
Param
No. Symbol Characteristic
(1)
Min. Typ.
(2)
Max. Units Conditions
UA10 T
UABAUD
UARTx Baud Time 66.67 — — ns
UA11 F
BAUD
UARTx Baud Frequency — — 15 Mbps
UA20 T
CWF
Start Bit Pulse Width to Trigger
UARTx Wake-up
500 — — ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
CxTX Pin
(output)
CA10, CA11
Old Value New Value
CA20
CxRX Pin
(input)
UA20
UxRX MSb In LSb InBits 6-1
UA10
UxTX
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 394 2013-2018 Microchip Technology Inc.
TABLE 30-50: OP AMP/COMPARATOR x SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions (see Note 3): 4.5V to 5.5 V
(unless otherwis e stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ.
(1)
Max. Units Conditions
Comparator A C Characteristics
CM10 T
RESP
Response Time — 19 80 ns V+ input step of 100 mV,
V- input held at V
DD
/2
CM11 T
MC
2
OV
Comparator Mode
Change to Output Valid
——10µs
Comparator D C Characteristics
CM30 V
OFFSET
Comparator Offset
Voltage
-80 ±60 80 mV
CM31 V
HYST
Input Hysteresis Voltage — 30 — mV
CM32 T
RISE
/
T
FALL
Comparator Output
Rise/Fall Time
— 20 — ns 1 pF load capacitance
on input
CM33 V
GAIN
Open-Loop Voltage Gain — 90 — db
CM34 V
ICM
Input Common-Mode
Voltage
AV
SS
—AV
DD
V
Op Amp AC Characteristics
CM20 S
R
Slew Rate — 9 — V/µs 10 pF load
CM21 P
M
Phase Margin — 35 — °C G = 100V/V, 10 pF load
CM22 G
M
Gain Margin — 20 — db G = 100V/V, 10 pF load
CM23 G
BW
Gain Bandwidth — 10 — MHz 10 pF load
Op Amp DC Characteristics
CM40 V
CMR
Common-Mode Input
Voltage Range
AV
SS
— AV
DD
V
CM41 C
MRR
Common-Mode
Rejection Ratio
—45— dbV
CM
= AV
DD
/2
CM42 V
OFFSET
Op Amp Offset Voltage -50 ±6 50 mV
CM43 V
GAIN
Open-Loop Voltage Gain — 90 — db
CM44 I
OS
Input Offset Current — — — — See pad leakage
currents in Table 30-10
CM45 I
B
Input Bias Current — — — — See pad leakage
currents in Table 30-10
CM46 I
OUT
Output Current — — 420 µA With minimum value of
R
FEEDBACK
(CM48)
CM48 R
FEEDBACK
Feedback Resistance
Value
8——kSee
Note 2
CM49a V
OUT
Output Voltage AV
SS
+ 0.075 — AV
DD
– 0.075 V I
OUT
= 420 µA
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
2:
Resistances can vary by ±10% between op amps.
3:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter BO10 in Table 30-12 for the minimum and
maximum BOR values.
2013-2018 Microchip Technology Inc. DS70005144G-page 395
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 30-52: OP AMP/COMPARATOR x VOLTAGE REFERENCE SPECIFICATIONS
TABLE 30-51: OP AMP/COMPARATOR x VOLTAGE REFERENCE SETTLING TIME SPECIFICATIONS
AC CHARACTERISTICS
Standard Operating Cond ition s (se e Note 2): 4 .5V t o 5.5 V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param. Symbol Characteristic Min. Typ. Max. Units Conditions
VRD310 T
SET
Settling Time — 1 10 sSee
Note 1
Note 1:
Settling time measured while CVRSS = 1 and the CVR<6:0> bits transition from ‘0000000’ to ‘1111111’.
2:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter BO10 in Table 30-12 for the minimum and
maximum BOR values.
DC CHARACTERISTICS
Standard Operating Conditions (see Note 1): 4.5V to 5.5V
(unless otherwis e stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristics Min. Typ. Max. Units Conditions
VRD311 CVR
AA
Absolute Accuracy of
Internal DAC Input to
Comparators
—±25—mVAV
DD
= CV
RSRC
= 5.0V
VRD312 CVR
AA
1 Absolute Accuracy of
CV
REF
x
O
Pins
— — +35/-65 mV AV
DD
= CV
RSRC
= 5.0V
VRD313 CV
RSRC
Input Reference Voltage 0 — AV
DD
+ 0.3 V
VRD314 CVR
OUT
Buffer Output Resistance — 1.5k —
VRD315 CV
CL
Permissible Capacitive
Load (CV
REF
x
O
pins)
——25pF
VRD316 I
OCVR
Permissible Current
Output (CV
REF
x
O
pins)
—— 1mA
VRD317 I
ON
Current Consumed when
Module is Enabled
——500µAAV
DD
= 5.0V
VRD318 I
OFF
Current Consumed when
Module is Disabled
—— 1nAAV
DD
= 5.0V
Note 1:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter BO10 in Table 30-12 for the minimum and
maximum BOR values.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 396 2013-2018 Microchip Technology Inc.
TABLE 30-53: CTMU CURRENT SOURCE SPECIFICATIONS
DC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic
(1)
Min. Typ. Max. Units Conditions
CTMU Current Source
CTMUI1 I
OUT
1 Base Range — 550 — nA CTMUICON<9:8> = 01
CTMUI2 I
OUT
2 10x Range — 5.5 — µA CTMUICON<9:8> = 10
CTMUI3 I
OUT
3 100x Range — 55 — µA CTMUICON<9:8> = 11
CTMUI4 I
OUT
4 1000x Range — 550 — µA CTMUICON<9:8> = 00
CTMUFV1 V
F
Temperature Diode Forward
Voltage
(1,2)
—0.525— VT
A
= +25°C,
CTMUICON<9:8> = 01
—0.585— VT
A
= +25°C,
CTMUICON<9:8> = 10
—0.645— VT
A
= +25°C,
CTMUICON<9:8> = 11
CTMUFV2 V
FVR
Temperature Diode Rate of
Change
(1,2)
— -1.92 — mV/°C CTMUICON<9.8> = 01
— -1.74 — mV/°C CTMUICON<9:8> = 10
— -1.56 — mV/°C CTMUICON<9:8> = 11
Note 1:
Nominal value at center point of current trim range (CTMUICON<15:10> = 000000).
2:
Parameters are characterized but not tested in manufacturing. Measurements are taken with the following
conditions:
•V
REF
= AV
DD
= 5.0V
• ADC configured for 10-bit mode
• ADC configured for conversion speed of 500 ksps
• All PMDx bits are cleared (PMDx = 0)
• CPU executing
while(1)
{
NOP();
}
• Device operating from the FRC with no PLL
2013-2018 Microchip Technology Inc. DS70005144G-page 397
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 30-54: ADC MODULE SPE CIFICATIONS
AC CHARACTERISTICS
Standard Operating Conditions (see Note 1): 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
Device Supply
AD01 AV
DD
Module V
DD
Supply Greater of:
V
DD
– 0.3
or V
BOR
— Lesser of:
V
DD
+ 0.3
or 5.5
V
AD02 AV
SS
Module V
SS
Supply V
SS
– 0.3 — V
SS
+ 0.3 V
Reference Inputs
AD05 V
REFH
Reference Voltage High 4.5 — 5.5 V V
REFH
= AV
DD
,
V
REFL
= AV
SS
= 0
AD06 V
REFL
Reference Voltage Low AV
SS
—AV
DD
– V
BORMIN
VSee
Note 1
AD06a 0 — 0 V V
REFH
= AV
DD
,
V
REFL
= AV
SS
= 0
AD07 V
REF
Absolute Reference
Voltage
4.5 — 5.5 V V
REF
= V
REFH
– V
REFL
AD08 I
REF
Current Drain —
—
—
—
10
600
A
A
ADC off
ADC on
AD09 I
AD
Operating Current —
—
5
2
—
—
mA
mA
ADC operating in 10-bit
mode (see
Note 1
)
ADC operating in 12-bit
mode (see
Note 1
)
Analog Input
AD12 V
INH
Input Voltage Range V
INH
V
INL
—V
REFH
V This voltage reflects
Sample-and-Hold
Channels 0, 1, 2 and 3
(CH0-CH3), positive input
AD13 V
INL
Input Voltage Range V
INL
V
REFL
—AV
SS
+ 1V V This voltage reflects
Sample-and-Hold
Channels 0, 1, 2 and 3
(CH0-CH3), negative input
AD17 R
IN
Recommended
Impedance of Analog
Voltage Source
—— 200 Impedance to achieve
maximum performance of
ADC
Note 1:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but is not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter BO10 in Table 30-12 for the minimum and
maximum BOR values.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 398 2013-2018 Microchip Technology Inc.
TABLE 30-55: ADC MODULE SPECIFICATIONS (12-BIT MODE)
AC CHARACTERISTICS
Standard Operating Conditions (see Note 1): 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
ADC Accuracy (12-Bit Mode)
AD20a Nr Resolution 12 data bits bits
AD21a INL Integral Nonlinearity -2 — +2 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
AD22a DNL Differential Nonlinearity -1 — < 1 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
AD23a G
ERR
Gain Error -10 4 10 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
AD24a E
OFF
Offset Error -10 1.75 10 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
AD25a — Monotonicity
(2)
— — — — Guaranteed
Dynamic Performance (12-Bit Mode)
AD30a THD Total Harmonic Distortion — — -75 dB
AD31a SINAD Signal to Noise and
Distortion
68.5 69.5 — dB
AD32a SFDR Spurious Free Dynamic
Range
80 — — dB
AD33a F
NYQ
Input Signal Bandwidth — — 250 kHz
AD34a ENOB Effective Number of Bits 11.09 11.3 — bits
Note 1:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter BO10 in Table 30-12 for the minimum and
maximum BOR values.
2:
The conversion result never decreases with an increase in the input voltage.
2013-2018 Microchip Technology Inc. DS70005144G-page 399
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 30-56: ADC MODULE SPECIFICATIONS (10-BIT MODE)
AC CHARACTERISTICS
Standard Operating Conditions (see Note 1): 4.5V to 5.5V
(unless otherwis e stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
ADC Accuracy (10-Bit Mode)
AD20b Nr Resolution 10 data bits bits
AD21b INL Integral Nonlinearity -1.5 — +1.5 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
AD22b DNL Differential Nonlinearity 1—< 1LSbV
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
AD23b G
ERR
Gain Error 1 3 6 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
AD24b E
OFF
Offset Error 1 2 4 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
AD25b — Monotonicity
(2)
— — — — Guaranteed
Dynamic Performance (10-Bit Mode)
AD30b THD Total Harmonic Distortion — — -64 dB
AD31b SINAD Signal to Noise and
Distortion
57 58.5 — dB
AD32b SFDR Spurious Free Dynamic
Range
72 — — dB
AD33b F
NYQ
Input Signal Bandwidth — — 550 kHz
AD34b ENOB Effective Number of Bits 9.16 9.4 — bits
Note 1:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but is not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter BO10 in Table 30-12 for the minimum and
maximum BOR values.
2:
The conversion result never decreases with an increase in the input voltage.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 400 2013-2018 Microchip Technology Inc.
FIGURE 30-34: ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS
(ASA M =
0
, SSRC<2:0> =
000
, SSRCG =
0
)
AD55
T
SAMP
Set SAMP
AD61
ADCLK
Instruction
SAMP
AD60
DONE
AD1IF
1 2 3 4 5 6 87
1 – Software sets ADxCON1. SAMP to start sampling.
2 – Sampling starts after discharge period. T
SAMP
is described in
3 – Software clears ADxCON1. SAMP to start conversion.
4 – Sampling ends, conversion sequence starts.
5 – Convert bit 11.
9– One T
AD
for end of conversion.
AD50
9
6– Convert bit 10.
7 – Convert bit 1.
8 – Convert bit 0.
Execution
“dsPIC33/PIC24 Family Reference Manual” .
“Analog-to-Digital Converter (ADC)”
(DS70621) of the
Clear SAMP
2013-2018 Microchip Technology Inc. DS70005144G-page 401
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 30-57: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions (see Note 2): 4.5V to 5.5V
(unless othe rwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ.
(4)
Max. Units Conditions
Clock Parameters
AD50 T
AD
ADC Clock Period 117.6 — — ns
AD51 t
RC
ADC Internal RC Oscillator Period — 250 — ns
Conversion Rate
AD55 t
CONV
Conversion Time — 14 — T
AD
AD56 F
CNV
Throughput Rate — — 500 ksps
AD57a T
SAMP
Sample Time when Sampling Any
ANx Input
3——T
AD
AD57b T
SAMP
Sample Time when Sampling the
Op Amp Outputs
3——T
AD
Timing Parameters
AD60 t
PCS
Conversion Start from Sample
Trigger
(1)
2—3T
AD
Auto-convert trigger is
not selected
AD61 t
PSS
Sample Start from Setting
Sample (SAMP) bit
(1)
2—3T
AD
AD62 t
CSS
Conversion Completion to
Sample Start (ASAM = 1)
(1)
—0.5—T
AD
AD63 t
DPU
Time to Stabilize Analog Stage
from ADC Off to ADC On
(1)
——20sSee
Note 3
Note 1:
Because the sample caps will eventually lose charge, clock rates below 10 kHz may affect linearity
performance, especially at elevated temperatures.
2:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but is not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter BO10 in Table 30-12 for the minimum and
maximum BOR values.
3:
The parameter, t
DPU
, is the time required for the ADC module to stabilize at the appropriate level when the
module is turned on (ADON (ADxCON1<15>) = 1). During this time, the ADC result is indeterminate.
4:
These parameters are characterized but not tested in manufacturing.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 402 2013-2018 Microchip Technology Inc.
FIGURE 30-35: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS
(CHPS<1:0> =
01
, SI MSAM =
0
, ASAM =
0
, SSRC<2:0> =
000
, SSRCG =
0
)
FIGURE 30-36: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> =
01
,
SIMSAM =
0
, AS AM =
1
, SSRC<2:0> =
111
, SSRCG =
0
, SAMC<4:0> =
00010
)
T
SAMP
Set SAMP
AD61
ADCLK
Instruction
SAMP
AD60
DONE
AD1IF
1 2 3 4 5 6 8 5 6 7
1 – Software sets ADxCON1. SAMP to start sampling.
2 – Sampling starts after discharge period. T
SAMP
is described in
3 – Software clears ADxCON1. SAMP to start conversion.
4 – Sampling ends, conversion sequence starts.
5 – Convert bit 9.
8 – One T
AD
for end of conversion.
AD50
7 8
6 – Convert bit 8.
7 – Convert bit 0.
Execution
“dsPIC33/PIC24 Family Reference Manual” .
“Analog-to-Digital Converter (ADC)”
(DS70621) of the
Clear SAMP
AD55 AD55
1 2 3 4 5 6 4 5 6 8
1 – Software sets ADxCON1. ADON to start ADC operation.
2– Sampling starts after discharge period. T
SAMP
is described in
3– Convert bit 9.
4– Convert bit 8.
5 – Convert bit 0.
7 3
6– One T
AD
for end of conversion.
7– Begin conversion of next channel.
8– Sample for time specified by SAMC<4:0>.
ADCLK
Instruction Set ADON
Execution
SAMP
T
SAMP
AD1IF
DONE
AD55 AD55 T
SAMP
AD55
AD50
“Analog-to-Digital Converter (ADC)”
(DS70621)
of the “dsPIC33/PIC24 Family Reference Manual”.
AD62
2013-2018 Microchip Technology Inc. DS70005144G-page 403
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 30-58: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions (see Note 1): 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Symbol Characteristic Min. Typ.
(4)
Max. Units Conditions
Clock Parameters
AD50 T
AD
ADC Clock Period 75 — — ns
AD51 t
RC
ADC Internal RC Oscillator Period — 250 — ns
Conversion Rate
AD55 t
CONV
Conversion Time — 12 — T
AD
AD56 F
CNV
Throughput Rate — — 1.1 Msps Using simultaneous
sampling
AD57a T
SAMP
Sample Time When Sampling Any
ANx Input
2——T
AD
AD57b T
SAMP
Sample Time When Sampling the
Op Amp Outputs
4——T
AD
Timing Parameters
AD60 t
PCS
Conversion Start from Sample
Trigger
(2)
2—3T
AD
Auto-convert trigger is
not selected
AD61 t
PSS
Sample Start from Setting
Sample (SAMP) bit
(2)
2—3T
AD
AD62 t
CSS
Conversion Completion to
Sample Start (ASAM = 1)
(2)
—0.5—T
AD
AD63 t
DPU
Time to Stabilize Analog Stage
from ADC Off to ADC On
(2)
——20s See
Note 3
Note 1:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but is not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter BO10 in Table 30-12 for the minimum and
maximum BOR values.
2:
Because the sample caps will eventually lose charge, clock rates below 10 kHz may affect linearity
performance, especially at elevated temperatures.
3:
The parameter, t
DPU
, is the time required for the ADC module to stabilize at the appropriate level when the
module is turned on (ADON (ADxCON1<15>) = 1). During this time, the ADC result is indeterminate.
4:
These parameters are characterized but not tested in manufacturing.
TABLE 30-59: DMA MODULE TIMING REQUIREMENTS
AC CHARACTERISTICS
Standard Operating Conditions: 4.5V to 5.5V
(unless otherwis e stated)
Operating temperature -40°C T
A
+85°C for Industrial
-40°C T
A
+125°C for Extended
Param
No. Characteristic Min. Typ.
(1)
Max. Units Conditions
DM1 DMA Byte/Word Transfer Latency 1 T
CY(2)
——ns
Note 1:
These parameters are characterized but not tested in manufacturing.
2:
Because DMA transfers use the CPU data bus, this time is dependent on other functions on the bus.
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 404 2013-2018 Microchip Technology Inc.
NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 405
dsPIC33EVXXXGM00X/10X FAMILY
31.0 HIGH-TEMPERATURE ELECTRICAL CHARACTERISTICS
This section provides an overview of the dsPIC33EVXXXGM00X/10X family electrical characteristics for devices
operating in an ambient temperature range of -40°C to +150°C.
The specifications between -40°C to +150°C are identical to those shown in
Section 30.0 “Electr ical Char acteristics”
for operation between -40°C to +125°C, with the exception of the parameters listed in this section.
Parameters in this section begin with an H, which denotes High temperature. For example, Parameter DC10 in
Section 30.0 “Electrical Characteristics”
is the Industrial and Extended temperature equivalent of HDC10.
Absolute maximum ratings for the dsPIC33EVXXXGM00X/10X family high-temperature devices are listed below.
Exposure to these maximum rating conditions for extended periods can affect device reliability. Functional operation of
the device at these, or any other conditions above the parameters indicated in the operation listings of this specification,
is not implied.
Absolute Maximum Ratings
(1)
Ambient temperature under bias
(2)
.........................................................................................................-40°C to +150°C
Storage temperature .............................................................................................................................. -65°C to +160°C
Voltage on V
DD
with respect to V
SS
......................................................................................................... -0.3V to +6.0V
Maximum current out of V
SS
pin ...........................................................................................................................350 mA
Maximum current into V
DD
pin
(3)
...........................................................................................................................350 mA
Maximum junction temperature............................................................................................................................. +155°C
Maximum current sunk by any I/O pin.....................................................................................................................20 mA
Maximum current sourced by I/O pin ......................................................................................................................18 mA
Maximum current sunk by all ports combined ......................................................................................................200 mA
Maximum current sourced by all ports combined
(3)
..............................................................................................200 mA
Note 1:
Stresses above those listed under “Absolute Maximum Ratings” can cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure to maximum
rating conditions for extended periods can affect device reliability.
2:
AEC-Q100 reliability testing for devices intended to operate at +150°C is 1,000 hours. Any design in which
the total operating time from +125°C to +150°C will be greater than 1,000 hours is not warranted without
prior written approval from Microchip Technology Inc.
3:
Maximum allowable current is a function of device maximum power dissipation (see Tab le 3 1-2 ).
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 406 2013-2018 Microchip Technology Inc.
31.1 High-Temperature DC Characteristics
TABLE 31-1: OPERATING MIPS vs. VOLTAGE
TABLE 31-2: THERMAL OPERATING CONDITIONS
Characteristic V
DD
Range
(in Volts) Temperature Range
(in °C)
Max MIPS
dsPIC33EVXXXGM00 X/10X Fam ily
HDC5 4.5V to 5.5V
(1,2)
-40°C to +150°C 40
Note 1:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
. Analog modules, such as the ADC, op amp/comparator
and comparator voltage reference, will have degraded performance. Device functionality is tested but is
not characterized. Refer to Parameter BO10 in Table 30-12 for the minimum and maximum BOR values.
2:
When BOR is enabled, the device will work from 4.7V to 5.5V.
Rating Symbol Min Typ Max Unit
High-Temperature Devices
Operating Junction Temperature Range T
J
-40 — +155 °C
Operating Ambient Temperature Range T
A
-40 — +150 °C
Power Dissipation:
Internal Chip Power Dissipation:
P
INT
= V
DD
x (I
DD
– I
OH
) P
D
P
INT
+ P
I
/
O
W
I/O Pin Power Dissipation:
I/O = ({V
DD
– V
OH
} x I
OH
) + (V
OL
x I
OL
)
Maximum Allowed Power Dissipation P
DMAX
(T
J
– T
A
)/
JA
W
TABLE 31-3: DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS Standard Operating Conditions (see Note 3): 4.5V to 5.5V
(unless othe rwise stated)
Operating temperature -40°C T
A
+150°C for High Temperature
Param
No. Symbol Characteristic Min. Typ.
(1)
Max. Units Conditions
Operating Voltage
HDC10 V
DD
Supply Voltage
(3)
V
BOR
—5.5V
HDC12 V
DR
RAM Data Retention
Voltage
(2)
1.8 — — V
HDC16 V
POR
V
DD
Start Voltage
to Ensure Internal
Power-on Reset Signal
——V
SS
V
HDC17 S
VDD
V
DD
Rise Rate
to Ensure Internal
Power-on Reset Signal
1.0 — — V/ms 0V-5.0V in 5 ms
HDC18 V
CORE
V
DD
Core
Internal Regulator Voltage
1.62 1.8 1.98 V Voltage is dependent on
load, temperature and V
DD
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
2:
This is the limit to which V
DD
may be lowered without losing RAM data.
3:
V
DD
voltage must remain at V
SS
for a minimum of 200 s to ensure POR.
2013-2018 Microchip Technology Inc. DS70005144G-page 407
dsPIC33EVXXXGM00X/10X FAMILY
TABLE 31-4: DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
)
TABLE 31-5: DC CHARACTERISTICS: IDLE CURRENT (I
IDLE
)
TABLE 31-6: DC CHARACTERISTICS: OPERATING CURRENT (I
DD
)
TABLE 31-7: DC CHARACTERISTICS: DOZE CURRENT (I
DOZE
)
DC CHARACTERISTICS Standard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+150°C for High Temperature
Parameter
No. Typical Max Units Conditions
Power-Down Current (I
PD
)
HDC60e 1300 2500 A +150°C 5V Base Power-Down Current
HDC61c 10 50 A +150°C 5V Watchdog Timer Current: I
WDT
DC CHARACTERISTICS St andard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+150°C for High Temperature
Parameter
No. Typical Max Units Conditions
HDC40e 2.6 5.0 mA +150°C 5V 10 MIPS
HDC42e 3.6 7.0 mA +150°C 5V 20 MIPS
DC CHARACTERISTICS St andard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+150°C for High Temperature
Parameter
No. Typical Max Units Conditions
HDC20e 5.9 8.0 mA +150°C 5V 10 MIPS
HDC22e 10.3 15.0 mA +150°C 5V 20 MIPS
HDC23e 19.0 25.0 mA +150°C 5V 40 MIPS
DC CHARACTERISTICS St andard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+150°C for High Temperature
Parameter
No. Typical Max Doze Ratio Units Conditions
HDC73a 18.5 22.0 1:2 mA +150°C 5V 40 MIPS
HDC73g 8.35 12.0 1:128 mA
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 408 2013-2018 Microchip Technology Inc.
TABLE 31-8: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS
DC CHARACTERISTICS Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+150°C for High Temperature
Param
No. Symbol Characteristic Min. Typ.
(1)
Max. Units Conditions
V
IL
Input Low Voltage
DI10 Any I/O Pins V
SS
—0.2V
DD
V
V
IH
Input High Voltage
DI20 I/O Pins 0.75 V
DD
—5.5V
DI30 I
CNPU
Change Notification Pull-up
Current
200 375 600 AV
DD
= 5.0V, V
PIN
= V
SS
DI31 I
CNPD
Change Notification
Pull-Down Current
(7)
175 400 625 AV
DD
= 5.0V, V
PIN
= V
DD
I
IL
Input Leakage Current
(2,3)
DI50 I/O Pins -200 — 200 nA V
SS
V
PIN
V
DD
,
pin at high-impedance
DI55 MCLR -1.5 — 1.5 AV
SS
V
PIN
V
DD
DI56 OSC1 -300 — 300 nA V
SS
V
PIN
V
DD
,
XT and HS modes
DI60a I
ICL
Input Low Injection Current
0—-5
(4,6)
mA All pins except V
DD
, V
SS
,
AV
DD
, AV
SS
, MCLR, V
CAP
and RB7
DI60b I
ICH
Input High Injection Current
0—+5
(5,6)
mA All pins except V
DD
, V
SS
,
AV
DD
, AV
SS
, MCLR,
V
CAP
, RB7 and all 5V
tolerant pins
(5)
DI60c I
ICT
Total Input Injection Current
(sum of all I/O and control
pins)
-20
(7)
—+20
(7)
mA Absolute instantaneous
sum of all ± input injection
currents from all I/O pins
( | II
CL
| + | I
ICH
|) I
ICT
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
2:
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified
levels represent normal operating conditions. Higher leakage current can be measured at different input
voltages.
3:
Negative current is defined as current sourced by the pin.
4:
V
IL
source < (V
SS
– 0.3). Characterized but not tested.
5:
Digital 5V tolerant pins cannot tolerate any “positive” input injection current from input sources > 5.5V.
6:
Non-zero injection currents can affect the ADC results by approximately four to six counts.
7:
Any number and/or combination of I/O pins not excluded under I
ICL
or I
ICH
conditions are permitted,
provided the mathematical “absolute instantaneous” sum of the input injection currents from all pins do not
exceed the specified limit. Characterized but not tested.
2013-2018 Microchip Technology Inc. DS70005144G-page 409
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TABLE 31-9: DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS St andard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+150°C for High Temperature
Param
No. Symbol Characteristic Min.
(1)
Typ. Max. Units Conditions
HDO16 V
OL
Output Low Voltage
4x Sink Driver Pins
(2)
——0.4VI
OL
= 8.8 mA, V
DD
= 5.0V
HDO10 V
OL
Output Low Voltage
8x Sink Driver Pins
(3)
——0.4VI
OL
= 10.8 mA, V
DD
= 5.0V
HDO26 V
OH
Output High Voltage
4x Sink Driver Pins
(2)
V
DD
– 0.6 — — V I
OH
= -8.3 mA, V
DD
= 5.0V
HDO20 V
OH
Output High Voltage
8x Sink Driver Pins V
DD
– 0.6 — — V I
OH
= -12.3 mA, V
DD
= 5.0V
Note 1:
Parameters are characterized but not tested.
2:
Includes all I/O pins that are not 8x sink driver pins (see below).
3:
Includes pins, such as RA3, RA4 and RB<15:10> for 28-pin and 36-pin devices, RA3, RA4, RA9 and
RB<15:10> for 44-pin devices, RA4, RA7, RA9, RB<15:10> and RC15 for 64-pin devices.
TABLE 31-10: ELECTRICAL CHARACTERISTICS: BOR
DC CHARACTERISTICS St andard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+150°C for High Temperature
Param
No. Symbol Characteristic Min.
(1)
Typ. Max. Units Conditions
HBO10 V
BOR
BOR Event on V
DD
Transition High-to-Low
4.15 4.285 4.4 V V
DD
(see
Note 2, Note 3
and
Note 4
)
Note 1:
Parameters are for design guidance only and are not tested in manufacturing.
2:
The V
BOR
specification is relative to the V
DD
.
3:
The device is functional at V
BORMIN
< V
DD
< V
DDMIN
. Analog modules: ADC, op amp/comparator and
comparator voltage reference will have degraded performance. Device functionality is tested but is not
characterized.
4: The start-u p V
DD
must rise above 4.6V.
TABLE 31-11: DC CHARACTERISTICS: PROGRAM MEMORY
DC CHARACTERISTICS S t andard Operating Conditions: 4.5V to 5.5V (unless otherwise st ated)
Operating temperature -40°C T
A
+150°C for High Temperature
Param
No. Symbol Characteristic
(1)
Min. Typ. Max. Units Conditions
Program Fla sh Memory
HD130 E
P
Cell Endurance 10,000 — — E/W -40°C to +150°C
(2)
HD134 T
RETD
Characteristic Retention 20 — — Year 1000 E/W cycles or less and no
other specifications are violated
Note 1:
These parameters are assured by design, but are not characterized or tested in manufacturing.
2:
Programming of the Flash memory is allowed up to +150°C.
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31.2 AC Characteristics and T iming
Parameters
The information contained in this section defines the
dsPIC33EVXXXGM00X/10X family AC characteristics
and timing parameters for high-temperature devices.
However, all AC timing specifications in this section are
the same as those in
Sectio n 30.2 “AC Ch aracteristic s
and Timing Parameters”
, with the exception of the
parameters listed in this section.
Parameters in this section begin with an H, which denotes
High temperature. For example, Parameter OS53 in
Section 30.2 “AC Characteristics and Timing
Parameters”
is the Industrial and Extended temperature
equivalent of HOS53.
TABLE 31-12: TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
FIGURE 31-1: LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
AC CHARACTERISTICS Standard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+150°C
Operating voltage V
DD
range as described in Table 31-1.
V
DD
/2
C
L
R
L
Pin
Pin
V
SS
V
SS
C
L
R
L
=464
C
L
= 50 pF for all pins except OSC2
15 pF for OSC2 output
Load Condition 1 – for All Pins except OSC2 Load Condition 2 – for OSC2
2013-2018 Microchip Technology Inc. DS70005144G-page 411
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TABLE 31-13: PLL CLOCK TIMING SPECIFICATIONS
AC CHARACTERISTICS Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+150°C
Param
No. Symbol Characteristic Min. Typ.
(1)
Max. Units Conditions
HOS50 F
PLLI
PLL Voltage Controlled
Oscillator (VCO) Input
Frequency Range
0.8 — 8.0 MHz ECPLL, XTPLL modes
HOS51 F
SYS
On-Chip VCO System
Frequency
120 — 340 MHz
HOS52 T
LOCK
PLL Start-up Time (Lock Time) 0.9 1.5 3.1 ms
HOS53 D
CLK
CLKO Stability (Jitter)
(2)
-3 0.5 3 %
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
2:
This jitter specification is based on clock cycle-by-clock cycle measurements. To get the effective jitter for
individual time bases or communication clocks used by the application, use the following formula:
For example, if F
OSC
= 120 MHz and the SPI bit rate = 10 MHz, the effective jitter is as follows:
Effective Jitter D
CLK
F
OSC
Time Base or Communication Cl ock
---------------------------------------------------------------------------------------
-------------------------------------------------------------------------------------------=
Effective Jitter D
CLK
120
10
---------
--------------D
CLK
12
--------------D
CLK
3.464
--------------
===
TABLE 31-14: INTERNAL FRC ACCURACY
AC CHARACTERISTICS Standard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+150°C
Param
No. Characteristic Min Typ Max Units Conditions
Internal FRC Accuracy @ FRC Frequency = 7.3728 MHz
HF20C FRC -3 1 +3 % -40°C T
A
+150°C V
DD
= 4.5V to 5.5V
TABLE 31-15: INTERNAL LPRC ACCURACY
AC CHARACTERISTICS Standard Operating Conditions: 4.5V to 5.5V (unless otherwise stated)
Operating temperature -40°C T
A
+150°C
Param
No. Characteristic Min Typ Max Units Conditions
LPRC @ 32.768 kHz
(1,2)
HF21C LPRC -30 10 +30 % -40°C T
A
+150°C V
DD
= 4.5V to 5.5V
Note 1:
Change of LPRC frequency as V
DD
changes.
2:
LPRC accuracy impacts the Watchdog Timer Time-out Period (T
WDT
1). See
Section 27.5 “W a tchdo g
Timer (WDT)”
for more information.
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TABLE 31-16: CTMU CURRENT SOURCE SPECIFICATIONS
DC CHARACTERISTICS Standard Operating Conditions: 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+150°C
Param No. Symbol Characteristic
(1)
Min. Typ. Max. Units Conditions
CTMU Current Source
HCTMUl1 l
OUT
1 Base Range — 550 — nA CTMUICON<9.8> = 01
HCTMUl2 l
OUT
2 10x Range — 5.5 — A CTMUICON<9.8> = 10
HCTMUl3 l
OUT
3 100x Range — 55 — A CTMUICON<9.8> = 11
HCTMUl0 l
OUT
4 1000x Range — 550 — A CTMUICON<9.8> = 00
HCTMUFV1 V
F
Temperature Diode
Forward Voltage
(2)
—0.525— VT
A
= +25°C,
CTMUICON<9.8> = 01
—0.585— VT
A
= +25°C,
CTMUICON<9.8> = 10
—0.645— VT
A
= +25°C,
CTMUICON<9.8> = 11
Note 1:
Normal value at center point of current trim range (CTMUICON<15:10> = 000000).
2:
Parameters are characterized but not tested in manufacturing. Measurements are taken with the following
conditions:
•V
REF
= AV
DD
= 5.0V
• ADC module configured for 10-bit mode
• ADC module configured for conversion speed of 500 ksps
• All PMDx bits are cleared (PMDx = 0)
• CPU executing
while(1)
{
NOP();
}
• Device operating from the FRC with no PLL
2013-2018 Microchip Technology Inc. DS70005144G-page 413
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TABLE 31-17: OP AMP/COMPARATOR x SPECIFICATIONS
DC CHARACTERISTICS Standard Operating Conditions (see Note 3): 4.5V to 5.5 V
(unless otherwis e stated)
Operating temperature -40°C T
A
+150°C
Param
No. Symbol Characteristic Min. Typ.
(1)
Max. Units Conditions
Comparator DC Characteristics
HCM30 V
OFFSET
Comparator Offset Voltage -80 ±60 80 mV
HCM31 V
HYST
Input Hysteresis Voltage — 30 — mV
HCM34 V
ICM
Input Common-Mode Voltage AV
SS
—AV
DD
V
Op Amp DC Characteristics
(2)
HCM40 V
CMR
Common-Mode Input
Voltage Range
AV
SS
—AV
DD
V
HCM42 V
OFFSET
Op Amp Offset Voltage -50 ±6 50 mV
Note 1:
Data in “Typ.” column is at 5.0V, +25°C unless otherwise stated.
2:
Resistances can vary by ±10% between op amps.
3:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but is not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter HBO10 in Table 31-10 for the minimum
and maximum BOR values.
TABLE 31-18: ADC MODULE SPECIFICATIONS (12-BIT MODE)
AC CHARACTERISTICS Standard Operating Conditions (see Note 1): 4.5V to 5.5V
(unless otherwise stated)
Operating temperature -40°C T
A
+150°C
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
ADC Accuracy (12-Bit Mode)
HAD20a Nr Resolution 12 data bits bits
HAD21a INL Integral Nonlinearity -2 — +2 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
HAD22a DNL Differential Nonlinearity -1 — < 1 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
HAD23a G
ERR
Gain Error -10 4 10 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
HAD24a E
OFF
Offset Error -10 1.75 10 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
Note 1:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but is not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter BO10 in Table 30-12 for the minimum and
maximum BOR values.
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TABLE 31-19: ADC MODULE SPECIFICATIONS (10-BIT MODE)
AC CHARACTERISTICS Standard Operating Conditions (see Note 1): 4.5V to 5.5V
(unless otherwis e stated)
Operating temperature -40°C T
A
+150°C
Param
No. Symbol Characteristic Min. Typ. Max. Units Conditions
ADC Accuracy (10-Bit Mode)
HAD20b Nr Resolution 10 data bits bits
HAD21b INL Integral Nonlinearity -1.5 — +1.5 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
HAD22b DNL Differential Nonlinearity 1—< 1LSbV
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
HAD23b G
ERR
Gain Error 1 3 6 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
HAD24b E
OFF
Offset Error 1 2 4 LSb V
INL
= AV
SS
= V
REFL
= 0V,
AV
DD
= V
REFH
= 5.5V
Note 1:
Device is functional at V
BORMIN
< V
DD
< V
DDMIN
, but will have degraded performance. Device functionality
is tested, but is not characterized. Analog modules: ADC, op amp/comparator and comparator voltage
reference, will have degraded performance. Refer to Parameter HBO10 in Table 31-10 for the minimum
and maximum BOR values.
2013-2018 Microchip Technology Inc. DS70005144G-page 415
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32.0 CHARACTERISTICS FOR INDUSTRIAL/EXTENDED TEMPERATURE
DEVICES (-40°C TO +125°C)
32.1 IDD
FIGURE 32-1: TYPICAL/MA XIMUM I
DD
vs. F
OSC
(EC MODE, 10 MHz TO 70 MHz, 5.5V MAX)
FIGURE 32-2: TYPICAL I
DD
vs. V
DD
(EC MODE, 10 MIPS)
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
5 15253545556575
IDD (mA)
Frequency (MIPS)
-40C Max
-40C Typ
25C Max
25C Typ
85C Max
85C Typ
125C Max
125C Typ
4.2
4.4
4.6
4.8
5
5.2
5.4
5.6
4.4 4.6 4.8 5 5.2 5.4 5.6
IDD (mA)
VDD (V)
-40C
25C
85C
125C
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FIGURE 32-3: TYPICAL I
DD
vs. V
DD
(EC MODE, 20 MIPS)
FIGURE 32-4: TYPICAL I
DD
vs. V
DD
(EC MODE, 40 MIPS)
8.2
8.4
8.6
8.8
9
9.2
9.4
9.6
9.8
4.4 4.6 4.8 5 5.2 5.4 5.6
IDD (mA)
VDD (V)
-40C
25C
85C
125C
16.3
16.5
16.7
16.9
17.1
17.3
17.5
17.7
17.9
18.1
18.3
4.4 4.6 4.8 5 5.2 5.4 5.6
IDD (mA)
VDD (V)
-40C
25C
85C
125C
2013-2018 Microchip Technology Inc. DS70005144G-page 417
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FIGURE 32-5: TYPICAL I
DD
vs. V
DD
(EC MODE, 60 MIPS)
FIGURE 32-6: TYPICAL I
DD
vs. V
DD
(EC MODE, 70 MIPS)
24
24.2
24.4
24.6
24.8
25
25.2
25.4
25.6
25.8
26
4.4 4.6 4.8 5 5.2 5.4 5.6
IDD (mA)
VDD (V)
-40C
25C
85C
125C
27.8
28
28.2
28.4
28.6
28.8
29
29.2
4.4 4.6 4.8 5 5.2 5.4 5.6
IDD (mA)
VDD (V)
-40C
25C
85C
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32.2 IIDLE
FIGURE 32-7: TYPICAL/MA XIMUM I
IDLE
vs. F
OSC
(EC MODE 10 MHz TO 70 MHz, 5.5V MAX)
FIGURE 32-8: TYPICAL I
IDLE
vs. V
DD
(EC MODE, 10 MIPS)
0
1
2
3
4
5
6
7
8
5 15253545556575
IIDLE (mA)
Frequency (MIPS)
Max -40C
Typ -40C
Max 25C
Typ 25C
Max 85C
Typ 85C
Max 125C
Typ 125C
1.2
1.3
1.4
1.5
1.6
1.7
1.8
4.4 4.6 4.8 5 5.2 5.4 5.6
IIDLE (mA)
VDD (V)
-40C
25C
85C
125C
2013-2018 Microchip Technology Inc. DS70005144G-page 419
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FIGURE 32-9: TYPICAL I
IDLE
vs. V
DD
(EC MODE, 20 MIPS)
FIGURE 32-10: TYPICAL I
IDLE
vs. V
DD
(EC MODE, 40 MIPS)
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
4.4 4.6 4.8 5 5.2 5.4 5.6
IIDLE (mA)
VDD (V)
-40C
25C
85C
125C
4
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.4 4.6 4.8 5 5.2 5.4 5.6
IIDLE (mA)
VDD (V)
-40C
25C
85C
125C
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FIGURE 32-11: TYPICAL I
IDLE
vs. V
DD
(EC MODE, 60 MIPS)
FIGURE 32-12: TYPICAL I
IDLE
vs. V
DD
(EC MODE, 70 MIPS)
5.8
5.9
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4.4 4.6 4.8 5 5.2 5.4 5.6
IIDLE (mA)
VDD (V)
-40C
25C
85C
125C
6.8
6.85
6.9
6.95
7
7.05
7.1
4.4 4.6 4.8 5 5.2 5.4 5.6
IIDLE (mA)
VDD (V)
-40C
25C
85C
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32.3 IDOZE
FIGURE 32-13: TYPICAL I
DOZE
vs. V
DD
(DOZE 1:2, 70 MIPS)
FIGURE 32-14: TYPICAL/MA XIM UM I
DOZE
vs. TEMPERATURE (DOZE 1:2, 70 MIPS)
15.8
16.2
16.6
17
17.4
17.8
4.4 4.6 4.8 5 5.2 5.4 5.6
IDOZE (mA)
VDD (V)
-40C
25C
85C
125C
15
16
17
18
19
20
-50 0 50 100 150
IDOZE (mA)
Temperature (C)
5.5V Max (1:2)
5.5V Typ (1:2)
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FIGURE 32-15: TYPICAL I
DOZE
vs. V
DD
(DOZE 1:128, 70 MIPS)
FIGURE 32-16: TYPICAL/MAXIMUM I
DOZE
vs. TEMPERATURE (DOZE 1:128, 70 MIPS)
7
7.2
7.4
7.6
7.8
8
8.2
4.4 4.6 4.8 5 5.2 5.4 5.6
IDOZE (mA)
VDD (V)
-40C
25C
85C
125C
7
7.5
8
8.5
9
9.5
-50 0 50 100 150
IDOZE (mA)
Temperature (C)
5.5V Max
(1:128)
5.5V Typ
(1:128)
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32.4 IPD
FIGURE 32-17: TYPICAL I
PD
vs. V
DD
FIGURE 32-18: TYPICAL/MAXIMUM I
PD
vs. TEMPERATURE
0
50
100
150
200
250
4.4 4.6 4.8 5 5.2 5.4 5.6
IPD (uA)
VDD(V)
-40C
25C
85C
125C
0
200
400
600
800
1000
1200
1400
1600
-50 0 50 100 150
IPD (uA)
Temperature (C)
5.5V Max
5.5V Typ
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FIGURE 32-19: TYPICAL/MAXIMUM
I
WDT
vs. TEMPERATURE
32.5 FRC
FIGURE 32-20: TYPICAL FRC ACCURACY vs. V
DD
0
2
4
6
8
10
12
-50 0 50 100 150
IPD (uA)
Temperature (C)
5.5V Max
5.5V Typ
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
4.4 4.6 4.8 5 5.2 5.4 5.6
FRC Accuracy (%)
VDD (V)
-40C
25C
85C
125C
2013-2018 Microchip Technology Inc. DS70005144G-page 425
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FIGURE 32-21: TYPICAL FRC ACCURACY vs. TEMPERATURE (5.5V V
DD
)
32.6 LPRC
FIGURE 32-22: TYPICAL LPRC ACCURACY vs. V
DD
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
-50 0 50 100 150
FRC Accuracy (%)
Temperature (C)
Typical FRC Accuracy V/S Temperature
-2
-1
0
1
2
3
4
4.4 4.6 4.8 5 5.2 5.4 5.6
LPRC Accuracy (%)
VDD (V)
-40C
25C
85C
125C
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FIGURE 32-23: TYPICAL LPRC ACCURACY vs. TEMPERATURE (5.5V V
DD
)
32.7 Leakage Current
FIGURE 32-24: TYPICAL I
IL
vs. TEMPERATURE (MCLR)
-3
-2
-1
0
1
2
3
-50 0 50 100 150
LPRC Accuracy (%)
Temperature (C)
-600
-400
-200
0
200
400
600
-50 0 50 100 150
Leakage Current (nA)
Temperature (C)
V
PIN
= 5.5V
V
PIN
= 0V
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FIGURE 32-25: TYPICAL I
IL
vs. TEMPER ATURE (O SC 1)
FIGURE 32-26: TYPICAL I
IL
vs. TEMPERATURE (GENERAL PURPOSE I/Os)
-25
-20
-15
-10
-5
0
5
10
15
20
25
-50 0 50 100 150
Leakage Current (nA)
Temperature (C)
V
PIN
= 5.5V
V
PIN
= 0V
-15
-10
-5
0
5
10
15
20
-50 0 50 100 150
Leakage Current (nA)
Temperature (C)
VPIN = 5.5V
VPIN = 0V
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32.8 Pull-up and Pull-Down Current
FIGURE 32-27: TYPICAL PULL-UP CURRENT (V
PIN
= V
SS
) vs. TEMPERATURE
FIGURE 32-28: TYPICAL PULL-DOWN CURRENT (V
PIN
= 5.5V) vs. TEMPERATURE
-500
-450
-400
-350
-300
-50 0 50 100 150
Pull-up Current (uA)
Temperature (C)
250
300
350
400
450
500
550
-50 0 50 100 150
Pull-down Current (uA)
Temperature (C)
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32.9 Voltage Input Low (VIL) – Voltage Input High (VIH)
FIGURE 32-29: TYPICAL V
IH
/V
IL
vs. TEMPERATURE (GENERAL PURPOSE I/Os)
32.10 Voltage Output Low (VOL) – Volt age Ou tput High (VOH)
FIGURE 32-30: TYPICAL V
OH
8x DRIVER PINS vs. I
OH
(GENERAL PURPOSE I/Os,
TEMPERATURES AS NOTED)
1.5
2
2.5
3
3.5
4
4.5
5
-50 0 50 100 150
Voltage (V)
Temperature (C)
Ensured Logic High
Ensured Logic Low
Indeterminate Logic
4.6
4.7
4.8
4.9
5
7.5 8.5 9.5 10.5 11.5 12.5 13.5
V
OH
(V)
I
OH
(mA)
-40C
25C
85C
125C
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 430 2013-2018 Microchip Technology Inc.
FIGURE 32-31: TYPICAL V
OH
4x DRIVER PINS vs. I
OH
(GENERAL PURPOSE I/Os,
TEMPERATURES AS NOTED)
FIGURE 32-32: TYPICAL V
OL
8x DRIVER PINS vs. I
OL
(GENERAL PURPOSE I/Os,
TEMPERATURES AS NOTED)
4.35
4.4
4.45
4.5
4.55
4.6
4.65
4.7
4.75
4.8
7.5 8.5 9.5 10.5 11.5 12.5 13.5
VOH (V)
IOH (mA)
-40C
25C
85C
125C
80
100
120
140
160
180
200
7.5 8.5 9.5 10.5 11.5 12.5
VOL (mV)
IOL (mA)
-40C
25C
85C
125C
2013-2018 Microchip Technology Inc. DS70005144G-page 431
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 32-33: TYPICAL V
OL
4x DRIVER PINS vs. I
OL
(GENERAL PURPOSE I/Os,
TEMPERATURES AS NOTED)
32.11 VREG
FIGURE 32-34: TYPICAL REGULATOR VOLTAGE vs. TEMPERATURE
100
150
200
250
300
350
7.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
VOL (mV)
IOL (mA)
-40C
25C
85C
125C
1.84
1.845
1.85
1.855
1.86
1.865
1.87
-50 0 50 100 150
VREG Voltage (V)
Temperature (C)
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 432 2013-2018 Microchip Technology Inc.
32.12 VBOR
FIGURE 32-35: TYPICAL BOR TRIP RANGE vs. TEMPERA TU RE
32.13 RAM Retention
FIGURE 32-36: TYPICAL RAM RETENTION VOLTAGE vs. TEMPERATURE
4.25
4.255
4.26
4.265
4.27
4.275
4.28
4.285
4.29
-50 0 50 100 150
BOR Trip Voltage (V)
Temperature (C)
1.7
1.702
1.704
1.706
1.708
1.71
1.712
1.714
1.716
-50 0 50 100 150
RAM Retention Voltage (V)
Temperature (C)
2013-2018 Microchip Technology Inc. DS70005144G-page 433
dsPIC33EVXXXGM00X/10X FAMILY
32.14 Comparator Op Amp Offset
FIGURE 32-37: TYPICAL COMPARATOR OFFSET vs. V
CM
FIGURE 32-38: TYPICAL OP AMP OFFSET vs. V
CM
OP AMP OFFSET
-65
-60
-55
-50
-45
-40
-35
-30
-25
-20
-15
0123456
V
OFFSET
(mV)
V
CM
(V)
-40C
25C
85C
125C
-7
-6
-5
-4
-3
-2
-1
0
0123456
V
OFFSET
(mV)
V
CM
(V)
T
yp
i
ca
l
OPAMP
Off
se
t
V/S
V
CM
-40C
25C
85C
125C
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 434 2013-2018 Microchip Technology Inc.
32.15 CTMU Current vs. Temperature
FIGURE 32-39: TYPICAL CTMU CURRENT (IRNG) vs. TEMPERATURE
32.16 CTMU Temperature Forward Diode
FIGURE 32-40: T YPICAL CTMU T EMPERATURE DIODE FORWARD V OLTAGE vs. T EMPERATURE
-600
-500
-400
-300
-200
-100
0
100
-50 0 50 100 150
CTMU Range Current (uA)
Temperature (C)
Base Range
10X Base Current
100X Base Range
1000X Base Range
300
400
500
600
700
800
900
-50 0 50 100 150
Forward Voltage (mV)
Temperature (C)
Base Range
10x Range
100x Range
2013-2018 Microchip Technology Inc. DS70005144G-page 435
dsPIC33EVXXXGM00X/10X FAMILY
32.17 ADC DNL
FIGURE 32-41: TYPICAL DNL (V
DD
= 5.5V, -40°C)
FIGURE 32-42: TYPICAL DNL (V
DD
= 5.5V, +25°C)
-0.2
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
0.2
0.25
0.3
0 500 1000 1500 2000 2500 3000 3500 4000
DNL (LSBs)
Codes
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0 500 1000 1500 2000 2500 3000 3500 4000
DNL (LSBs)
Codes
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 436 2013-2018 Microchip Technology Inc.
FIGURE 32-43: TYPICAL DNL (V
DD
= 5.5V, +85°C)
FIGURE 32-44: TYPICAL DNL (V
DD
= 5.5V, +125°C)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0 500 1000 1500 2000 2500 3000 3500 4000
DNL (LSBs)
Codes
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0 500 1000 1500 2000 2500 3000 3500 4000
DNL (LSBs)
Codes
2013-2018 Microchip Technology Inc. DS70005144G-page 437
dsPIC33EVXXXGM00X/10X FAMILY
32.18 ADC INL
FIGURE 32-45: TYPICAL INL (V
DD
= 5.5V, -40°C)
FIGURE 32-46: TYPICAL INL (V
DD
= 5.5V, +25°C)
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0 500 1000 1500 2000 2500 3000 3500 4000
INL (LSBs)
Codes
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0 500 1000 1500 2000 2500 3000 3500 4000
INL (LSBs)
Codes
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 438 2013-2018 Microchip Technology Inc.
FIGURE 32-47: TYPICAL INL (V
DD
= 5.5V, +85°C)
FIGURE 32-48: TYPICAL INL (V
DD
= 5.5V, +125°C)
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0 500 1000 1500 2000 2500 3000 3500 4000
INL (LSBs)
Codes
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0 500 1000 1500 2000 2500 3000 3500 4000
INL (LSBs)
Codes
2013-2018 Microchip Technology Inc. DS70005144G-page 439
dsPIC33EVXXXGM00X/10X FAMILY
32.19 ADC Gain Offset Error
FIGURE 32-49: TYPICAL ADC GAIN ERROR vs. TEMPERATURE
FIGURE 32-50: TYPICAL ADC OFFSET ERROR vs. TEMPERATURE
5
5.2
5.4
5.6
5.8
6
6.2
6.4
6.6
6.8
7
-50 0 50 100 150
Gain Error (LSBs)
Temperature
2.95
3
3.05
3.1
3.15
3.2
3.25
3.3
3.35
-50 0 50 100 150
Offset Error (LSBs)
Temperature
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 440 2013-2018 Microchip Technology Inc.
NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 441
dsPIC33EVXXXGM00X/10X FAMILY
33.0 CHARA CTERISTICS FOR HIGH-TEMPERATURE DEVICES (+150°C)
33.1 IDD
FIGURE 33-1: TYPICAL/MA XIMUM I
DD
vs. F
OSC
(EC MODE 10 MHz TO 40 MHz, 5.5V MAX)
FIGURE 33-2: TYPICAL I
DD
vs. V
DD
(EC MODE, 10 MIPS)
0.0
5.0
10.0
15.0
20.0
25.0
5 1015202530354045
IDD (mA)
Frequency (MIPS)
150C Max
150C Typ
5.2
5.7
6.2
6.7
7.2
4.4 4.6 4.8 5 5.2 5.4 5.6
IDD (mA)
VDD (V)
150C
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 442 2013-2018 Microchip Technology Inc.
FIGURE 33-3: TYPICAL I
DD
vs. V
DD
(EC MODE, 20 MIPS)
FIGURE 33-4: TYPICAL I
DD
vs. V
DD
(EC MODE, 40 MIPS)
10.2
10.5
10.8
11.1
11.4
11.7
4.4 4.6 4.8 5 5.2 5.4 5.6
IDD (mA)
VDD (V)
150C
18.3
18.6
18.9
19.2
19.5
19.8
20.1
20.4
4.4 4.6 4.8 5 5.2 5.4 5.6
IDD (mA)
VDD (V)
150C
2013-2018 Microchip Technology Inc. DS70005144G-page 443
dsPIC33EVXXXGM00X/10X FAMILY
33.2 IIDLE
FIGURE 33-5: TYPICAL/MAXI MUM I
IDLE
vs. F
OSC
(EC MODE 10 MHz TO 40 MHz, 5.5V MAX)
FIGURE 33-6: TYPICAL I
IDLE
vs. V
DD
(EC MODE, 10 MIPS)
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
5 1015202530354045
IIDLE (mA)
Frequency (MIPS)
Max 150C
Typ 150C
1.2
1.4
1.6
1.8
2
2.2
2.4
2.6
4.4 4.6 4.8 5 5.2 5.4 5.6
IIDLE (mA)
VDD (V)
150C
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 444 2013-2018 Microchip Technology Inc.
FIGURE 33-7: TYPICAL I
IDLE
vs. V
DD
(EC MODE, 20 MIPS)
FIGURE 33-8: TYPICAL I
IDLE
vs. V
DD
(EC MODE, 40 MIPS)
2.1
2.3
2.5
2.7
2.9
3.1
3.3
3.5
3.7
4.4 4.6 4.8 5 5.2 5.4 5.6
IIDLE (mA)
VDD (V)
150C
4
4.2
4.4
4.6
4.8
5
5.2
5.4
5.6
4.4 4.6 4.8 5 5.2 5.4 5.6
IIDLE (mA)
VDD (V)
150C
2013-2018 Microchip Technology Inc. DS70005144G-page 445
dsPIC33EVXXXGM00X/10X FAMILY
33.3 IDOZE
FIGURE 33-9: TYPICAL I
DOZE
vs. V
DD
(DOZE 1:2, 70 MIPS)
FIGURE 33-10: TYPICAL/MA XIM UM I
DOZE
vs. TEMPERATURE (DOZE 1:2, 70 MIPS)
15.8
16.3
16.8
17.3
17.8
18.3
18.8
4.4 4.6 4.8 5 5.2 5.4 5.6
IDOZE (mA)
VDD (V)
150C
15
16
17
18
19
20
-50 0 50 100 150
IDOZE (mA)
Temperature (C)
Typical/Maximum IDoze V/S Temperature (DOZE<2:0>=001; 70 MIPS)
5.5V
Max
(1:2)
5.5V Typ
(1:2)
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 446 2013-2018 Microchip Technology Inc.
FIGURE 33-11: TYPICAL I
DOZE
vs. V
DD
(DOZE 1:128, 70 MIPS)
FIGURE 33-12: TYPICAL/MA XIM UM I
DOZE
vs. TEMPERATURE (DOZE 1:128, 70 MIPS)
7
7.4
7.8
8.2
8.6
9
4.4 4.6 4.8 5 5.2 5.4 5.6
IDOZE (mA)
VDD (V)
150C
7
7.5
8
8.5
9
9.5
-50 0 50 100 150
IDOZE (mA)
Temperature (C)
5.5V Max
(1:128)
5.5V Typ
(1:128)
2013-2018 Microchip Technology Inc. DS70005144G-page 447
dsPIC33EVXXXGM00X/10X FAMILY
33.4 IPD
FIGURE 33-13: TYPICAL I
PD
vs. V
DD
FIGURE 33-14: TYPICAL/MA XIM UM I
PD
vs. TEMPERATURE
500
700
900
1100
1300
1500
4.4 4.6 4.8 5 5.2 5.4 5.6
I
PD
(uA)
V
DD
(V)
150C
0
200
400
600
800
1000
1200
1400
1600
-50 0 50 100 150
IPD (uA)
Temperature (C)
Typical/Maximum I
PD
V/S Temperature
5.5V Max
5.5V Typ
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 448 2013-2018 Microchip Technology Inc.
FIGURE 33-15: TYPICAL/MA XIM UM
I
WDT
vs. TEMPERATURE
33.5 FRC
FIGURE 33-16: TYPICAL FRC ACCURACY vs. V
DD
0
2
4
6
8
10
12
-50 0 50 100 150
IPD (uA)
Temperature (C)
5.5V Max
5.5V Typ
-0.4
-0.2
0
0.2
0.4
4.4 4.6 4.8 5 5.2 5.4 5.6
FRC Accuracy (%)
V
DD
(V)
150C
2013-2018 Microchip Technology Inc. DS70005144G-page 449
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 33-17: TYPICAL FRC ACCURACY vs. TEMPERATURE (5.5V V
DD
)
33.6 LPRC
FIGURE 33-18: TYPICAL LPRC ACCURACY vs. V
DD
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
-50 0 50 100 150
FRC Accuracy (%)
Temperature (C)
Typical FRC Accuracy V/S Temperature
-2.5
-2
-1.5
-1
-0.5
0
4.4 4.6 4.8 5 5.2 5.4 5.6
LPRC Accuracy (%)
VDD (V)
150C
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 450 2013-2018 Microchip Technology Inc.
FIGURE 33-19: TYPICAL LPRC ACCURACY vs. TEMPERATURE (5.5V V
DD
)
33.7 Leakage Current
FIGURE 33-20: TYPICAL I
IL
vs. TEMPERA T URE (MCLR)
-3
-2
-1
0
1
2
3
-50 0 50 100 150
LPRC Accuracy (%)
Temperature (C)
-600
-400
-200
0
200
400
600
-50 0 50 100 150
Leakage Current (nA)
Temperature (C)
Typical IIL V/S Temperature (MCLR)
VPIN = 5.5V
VPIN = 0V
2013-2018 Microchip Technology Inc. DS70005144G-page 451
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 33-21: TYPICAL I
IL
vs. TEMPER ATURE (O SC 1)
FIGURE 33-22: TYPICAL I
IL
vs. TEMPER ATURE (GE NERA L PURP OSE I/Os)
-25
-20
-15
-10
-5
0
5
10
15
20
25
-50 0 50 100 150
Leakage Current (nA)
Temperature (C)
VPIN = 5.5V
VPIN = 0V
-15
-10
-5
0
5
10
15
20
-50 0 50 100 150
Leakage Current (nA)
Temperature (C)
Typical IIL V/S Temperature (General Purpose I/Os)
VPIN = 5.5V
VPIN = 0V
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 452 2013-2018 Microchip Technology Inc.
33.8 Pull-up/Pull-Down Current
FIGURE 33-23: TYPICAL PULL-DOWN CURRENT (V
PIN
= 5.5V) vs. TEMPERATURE
FIGURE 33-24: TYPICAL PULL-DOWN CURRENT (V
PIN
= 5.5V) vs. TEMPERATURE
-500
-450
-400
-350
-300
-50 0 50 100 150
Pull-up Current (uA)
Temperature (C)
250
300
350
400
450
500
550
-50 0 50 100 150
Pull-down Current (uA)
Temperature (C)
yp ( )/ p
2013-2018 Microchip Technology Inc. DS70005144G-page 453
dsPIC33EVXXXGM00X/10X FAMILY
33.9 Voltage Input High (VIH) – Voltage Input Low (VIL)
FIGURE 33-25: TYPICAL V
IH
/V
IL
vs. TEMPERATURE (GENERAL PURPOSE I/Os)
1.5
2
2.5
3
3.5
4
4.5
5
-50 0 50 100 150
Voltage (V)
Temperature (C)
Typical VIH/VIL V/S Temperature
Ensured Logic High
Ensured Logic Low
Indeterminate Logic
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 454 2013-2018 Microchip Technology Inc.
33.10 Voltage Output Low (VOL) – Volt age Ou tput High (VOH)
FIGURE 33-26: TYPICAL V
OH
8x DRIVER PINS vs. I
OH
(GENERAL PURPOSE I/Os,
TEMPERATURES AS NOTED)
4.65
4.7
4.75
4.8
4.85
7.5 8.5 9.5 10.5 11.5 12.5 13.5
VOH (V)
IOH (mA)
150C
2013-2018 Microchip Technology Inc. DS70005144G-page 455
dsPIC33EVXXXGM00X/10X FAMILY
FIGURE 33-27: TYPICAL V
OH
4x DRIVER PINS vs. I
OH
(GENERAL PURPOSE I/Os,
TEMPERATURES AS NOTED)
FIGURE 33-28: TYPICAL V
OL
8x DRIVER PINS vs. I
OL
(GENERAL PURPOSE I/Os,
TEMPERATURES AS NOTED)
4.35
4.4
4.45
4.5
4.55
4.6
4.65
4.7
7.5 8.5 9.5 10.5 11.5 12.5 13.5
VOH (V)
IOH (mA)
150C
100
120
140
160
180
200
220
7.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
VOL (mV)
IOL (mA)
150C
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 456 2013-2018 Microchip Technology Inc.
FIGURE 33-29: TYPICAL V
OL
4x DRIVER PINS vs. I
OL
(GENERAL PURPOSE I/Os,
TEMPERATURES AS NOTED)
33.11 VREG
FIGURE 33-30: TYPICAL REGULATOR VOLTAGE vs. TEMPERATURE
200
250
300
350
400
7.5 8 8.5 9 9.5 10 10.5 11 11.5 12 12.5
VOL (mV)
IOL (mA)
150C
1.84
1.845
1.85
1.855
1.86
1.865
1.87
-50 0 50 100 150
VREG Voltage (V)
Temperature (C)
2013-2018 Microchip Technology Inc. DS70005144G-page 457
dsPIC33EVXXXGM00X/10X FAMILY
33.12 VBOR
FIGURE 33-31: TYPICAL BOR TRIP RANGE vs. TE MP ERA TU RE
33.13 RAM Retention
FIGURE 33-32: TYPICAL RAM RETENTION VOLTAGE vs. TEMP ERA TU RE
4.25
4.255
4.26
4.265
4.27
4.275
4.28
4.285
4.29
-50 0 50 100 150
BOR Trip Voltage (V)
Temperature (C)
1.7
1.702
1.704
1.706
1.708
1.71
1.712
1.714
1.716
-50 0 50 100 150
RAM Retention Voltage (V)
Temperature (C)
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 458 2013-2018 Microchip Technology Inc.
33.14 Comparator Op Amp Offset
FIGURE 33-33: TYPICAL COMPARATOR OFFSET vs. V
CM
FIGURE 33-34: TYPICAL OP AMP OFFSET vs. V
CM
-75
-65
-55
-45
-35
-25
-15
0123456
V
OFFSET
(mV)
VCM (V)
150C
-12
-10
-8
-6
-4
-2
0
0123456
V
OFFSET
(mV)
V
CM
(V)
Typ
i
ca
l
OPAMP O
ff
set V
/
S V
CM
150C
2013-2018 Microchip Technology Inc. DS70005144G-page 459
dsPIC33EVXXXGM00X/10X FAMILY
33.15 CTMU Current V/S Temperature
FIGURE 33-35: TYPICAL CTMU CURRENT (IRNG) vs. TEMPERATURE
33.16 CTMU Temperature Forward Diode (V)
FIGURE 33-36: TYPICAL CTMU TEMPERATURE DIODE FORWARD V OLT AGE vs. TEMPERATURE
-600
-500
-400
-300
-200
-100
0
100
-50 0 50 100 150
CTMU Range Current (uA)
Temperature (C)
Base Range
10X Base
Current
100X Base
Range
1000X Base
Range
300
400
500
600
700
800
900
-50 0 50 100 150
Forward Voltage (mV)
Temperature (C)
Base Range
10x Range
100x Range
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 460 2013-2018 Microchip Technology Inc.
33.17 ADC DNL
FIGURE 33-37: TYPICAL DNL (V
DD
= 5.5V, +150°C)
33.18 ADC INL
FIGURE 33-38: TYPICAL INL (V
DD
= 5.5V, +150°C)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0 500 1000 1500 2000 2500 3000 3500 4000
DNL (LSBs)
Codes
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0 500 1000 1500 2000 2500 3000 3500 4000
INL (LSBs)
Codes
2013-2018 Microchip Technology Inc. DS70005144G-page 461
dsPIC33EVXXXGM00X/10X FAMILY
33.19 ADC Gain Offset Error
FIGURE 33-39: TYPICAL ADC GAIN ERROR vs. TEMPERATURE
FIGURE 33-40: TYPICAL ADC OFFSET ERROR vs. TEMPERATURE
5
5.2
5.4
5.6
5.8
6
6.2
6.4
6.6
6.8
7
-50 0 50 100 150
Gain Error (LSBs)
Temperature
Typical ADC Gain Error V/S Temperature
2.95
3
3.05
3.1
3.15
3.2
3.25
3.3
3.35
-50 0 50 100 150
Offset Error (LSBs)
Temperature
Typical ADC Offset Error V/S Temperature
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 462 2013-2018 Microchip Technology Inc.
NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 463
dsPIC33EVXXXGM00X/10X FAMILY
34.0 PACKAGING INFORMATION
34.1 Package Marking Information
28-Lead SPDIP (.300”)
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
Example
dsPIC33EV256GM002
1810017
28-Lead SOIC (.300”)
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXXXXX
YYWWNNN
Example
28-Lead QFN-S (6x6x0.9 mm)
XXXXXXXX
XXXXXXXX
YYWWNNN
Example
dsPIC33EV256GM002
1810017
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
Example
dsPIC
1810017
Legend:
XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
36-Lead UQFN (5x5 mm) Example
33EV256GM002
1810017
33EV256
GM002
dsPIC
33EV256
GM003
1810017
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 464 2013-2018 Microchip Technology Inc.
34.1 Package Marking Information (Continued)
44-Lead TQFP (10x10x1 mm)
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
dsPIC33
PIN 1
XXXXXXXXXX
44-Lead QFN (8x8 mm)
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
PIN 1
Example
1810017
1810017
64-Lead QFN (9x9x0.9 mm) Example
XXXXXXXXXXX
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
dsPIC33
EV256GM006
64-Lead TQFP (10x10x1 mm)
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
Example
dsPIC33
EV256GM006
1810017
1810017
EV256M004
dsPIC33
EV256M004
2013-2018 Microchip Technology Inc. DS70005144G-page 465
dsPIC33EVXXXGM00X/10X FAMILY
34.2 Package Details
The following sections give the technical details of the packages.
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Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2013-2018 Microchip Technology Inc. DS70005144G-page 467
dsPIC33EVXXXGM00X/10X FAMILY
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 468 2013-2018 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2013-2018 Microchip Technology Inc. DS70005144G-page 469
dsPIC33EVXXXGM00X/10X FAMILY
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L1
c
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A1
A
E
E1
D
N
12
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e
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DS70005144G-page 470 2013-2018 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2013-2018 Microchip Technology Inc. DS70005144G-page 471
dsPIC33EVXXXGM00X/10X FAMILY
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 472 2013-2018 Microchip Technology Inc.
2013-2018 Microchip Technology Inc. DS70005144G-page 473
dsPIC33EVXXXGM00X/10X FAMILY
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DS70005144G-page 474 2013-2018 Microchip Technology Inc.
B
A
0.10 C
0.10 C
0..07 C A B
0.05 C
(DATUM B)
(DATUM A)
CSEATING
PLANE
NOTE 1
1
2
N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
1
2
N
0.10 C A B
0.10 C A B
0.10 C
0.08 C
Microchip Technology Drawing C04-436A–M5 Sheet 1 of 2
D
E
A
16X b
e
2X
D2
E2
K
L
36X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
36-Lead Ultra Thin Plastic Quad Flat, No Lead Package (M5) - 5x5 mm Body [UQFN]
With Corner Anchors
SEE
DETAIL A
2013-2018 Microchip Technology Inc. DS70005144G-page 475
dsPIC33EVXXXGM00X/10X FAMILY
Microchip Technology Drawing C04-436A–M5 Sheet 2 of 2
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
A3
e
L
E
N
0.40 BSC
0.152 REF
3.60
0.30
0.15
0.50
0.00
0.20
0.40
3.70
0.55
0.02
5.00 BSC
MILLIMETERS
MIN NOM
36
3.80
0.50
0.25
0.60
0.05
MAX
K0.25 REF
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
36-Lead Ultra Thin Plastic Quad Flat, No Lead Package (M5) - 5x5 mm Body [UQFN]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
With Corner Anchors
Overall Length
Exposed Pad Length
D
D2 3.60
5.00 BSC
3.70 3.80
C
SEATING
PLANE
(A3)
A1
A
DETAIL A
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 476 2013-2018 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
3.80
3.80
MILLIMETERS
0.40 BSC
MIN
E
MAX
5.00
Contact Pad Length (X36)
Contact Pad Width (X36)
Y1
X1
0.80
0.20
Microchip Technology Drawing C04-2436A–M5
NOM
36-Lead Ultra Thin Plastic Quad Flat, No Lead Package (M5) - 5x5 mm Body [UQFN]
SILK SCREEN
1
2
36
C2
E
X1
Y1
G1
Y2
X2
C1Contact Pad Spacing 5.00
Contact Pad to Center Pad (X36) G1 0.20
Thermal Via Diameter V
Thermal Via Pitch EV
0.30
1.00
EV
EV
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
With Corner Anchors
C1
Y3
X3
R1
Corner Pad Length (X36)
Corner Pad Width (X4)
Y3
X3
0.85
0.20
Corner Pad Radius R1 0.10
ØV
2013-2018 Microchip Technology Inc. DS70005144G-page 477
dsPIC33EVXXXGM00X/10X FAMILY
B
A
0.20 H A B
0.20 H A B
44 X b
0.20 C A B
(DATUM B)
(DATUM A)
C
SEATING PLANE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Microchip Technology Drawing C04-076C Sheet 1 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
e
NOTE 1
12
N
D
D1
EE1
2X
A2
A1
A
0.10 C
3
N
AA
0.20 C A B
4X 11 TIPS
123
44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP]
NOTE 1
NOTE 2
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 478 2013-2018 Microchip Technology Inc.
Microchip Technology Drawing C04-076C Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
L
(L1)
c
θ
SECTION A-A
H
Number of Leads
Overall Height
Lead Width
Overall Width
Overall Length
Lead Length
Molded Package Width
Molded Package Length
Molded Package Thickness
Lead Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E1
D1
A2
e
L
E
N
0.80 BSC
0.45
0.30
-
0.05
0.37
12.00 BSC
0.60
10.00 BSC
10.00 BSC
-
-
12.00 BSC
MILLIMETERS
MIN NOM
44
0.75
0.45
1.20
0.15
MAX
0.95 1.00 1.05
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Exact shape of each corner is optional.
Dimensioning and tolerancing per ASME Y14.5M
Footprint L1 1.00 REF
θ3.5°0° 7°Foot Angle
Lead Thickness c0.09 - 0.20
44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [TQFP]
2013-2018 Microchip Technology Inc. DS70005144G-page 479
dsPIC33EVXXXGM00X/10X FAMILY
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 480 2013-2018 Microchip Technology Inc.
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Microchip Technology Drawing C04-103D Sheet 1 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN or VQFN]
B
A
0.20 C
0.20 C
0.07 C A B
0.05 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
1
2
N
2X
NOTE 1
1
2
N
0.10 C A B
0.10 C A B
0.10 C
0.08 C
2X
44X
D
E
A3
A
A1
D2
E2
L
44X b
K
e
2013-2018 Microchip Technology Inc. DS70005144G-page 481
dsPIC33EVXXXGM00X/10X FAMILY
Microchip Technology Drawing C04-103D Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Pins
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
A3
e
L
E
N
0.65 BSC
0.20 REF
6.25
6.25
0.30
0.20
0.80
0.00
0.30
8.00 BSC
0.40
6.45
6.45
0.90
0.02
8.00 BSC
MILLIMETERS
MIN NOM
44
6.60
6.60
0.50
0.35
1.00
0.05
MAX
K-0.20 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN or VQFN]
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 482 2013-2018 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
6.60
6.60
MILLIMETERS
0.65 BSC
MIN
E
MAX
8.00
Contact Pad Length (X44)
Contact Pad Width (X44)
Y1
X1
0.85
0.35
Microchip Technology Drawing No. C04-2103C
NOM
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN or VQFN]
SILK SCREEN
1
2
44
C1Contact Pad Spacing 8.00
Contact Pad to Contact Pad (X40) G1 0.30
Thermal Via Diameter V
Thermal Via Pitch EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C1
C2
EV
EV
X2
Y2
E
X1
Y1
Contact Pad to Center Pad (X44) G2 0.28
G2
ØV
G1
2013-2018 Microchip Technology Inc. DS70005144G-page 483
dsPIC33EVXXXGM00X/10X FAMILY
0.20 CA-B D
64 X b
0.08 CA-B D
C
SEATING
PLANE
4X N/4 TIPS
TOP VIEW
SIDE VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-085C Sheet 1 of 2
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
D
EE1
D1
D
A B
0.20 HA-B D
4X
D1/2
e
A
0.08 C
A1
A2
SEE DETAIL 1
AA
E1/2
NOTE 1
NOTE 2
123
N
0.05
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 484 2013-2018 Microchip Technology Inc.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
13°12°11°
E
Mold Draft Angle Bottom
13°12°11°
D
Mold Draft Angle Top
0.270.220.17
b
Lead Width
0.20-0.09
c
Lead Thickness
10.00 BSC
D1
Molded Package Length
10.00 BSCE1Molded Package Width
12.00 BSCDOverall Length
12.00 BSCEOverall Width
7°3.5°0°
I
Foot Angle
0.750.600.45LFoot Length
0.15-0.05A1Standoff
1.051.000.95A2Molded Package Thickness
1.20--AOverall Height
0.50 BSC
e
Lead Pitch
64NNumber of Leads
MAXNOMMINDimension Limits
MILLIMETERSUnits
Footprint L1 1.00 REF
2. Chamfers at corners are optional; size may vary.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
Notes:
Microchip Technology Drawing C04-085C Sheet 2 of 2
L
(L1)
E
c
H
X
X=A—B OR D
e/2
DETAIL 1
SECTION A-A
T
2013-2018 Microchip Technology Inc. DS70005144G-page 485
dsPIC33EVXXXGM00X/10X FAMILY
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C1Contact Pad Spacing
Contact Pad Spacing
Contact Pitch
C2
MILLIMETERS
0.50 BSC
MIN
E
MAX
11.40
11.40
Contact Pad Length (X28)
Contact Pad Width (X28)
Y1
X1
1.50
0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2085B Sheet 1 of 1
GDistance Between Pads 0.20
NOM
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
C2
C1
E
G
Y1
X1
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 486 2013-2018 Microchip Technology Inc.
B
A
0.25 C
0.25 C
0.10 C A B
0.05 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
1
2
N
2X TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
1
2
N
0.10 C A B
0.10 C A B
0.10 C
0.08 C
Microchip Technology Drawing C04-149D [MR] Sheet 1 of 2
2X
64X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
64-Lead Very Thin Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [VQFN]
With 7.15 x 7.15 Exposed Pad [Also called QFN]
9.00
9.00
D2
E2
e
e
2
64X b
K
L
A
(A3)
A1
2013-2018 Microchip Technology Inc. DS70005144G-page 487
dsPIC33EVXXXGM00X/10X FAMILY
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
0.500.30 0.40Contact Length L
Contact-to-Exposed Pad K -0.20 -
Overall Height
Overall Length
Exposed Pad Width
Contact Thickness
Number of Pins
Contact Width
Exposed Pad Length
Overall Width
Standoff
Pitch
E2
D2
b
D
A3
E
A1
7.257.05 7.15
9.00 BSC
0.25
7.157.05
0.18
7.25
0.30
0.02
9.00 BSC
0.20 REF
0.00 0.05
Dimension Limits
e
A
N
Units
MAX
MIN NOM
0.50 BSC
0.90
64
0.80 1.00
MILLIMETERS
Microchip Technology Drawing C04-149D [MR] Sheet 2 of 2
64-Lead Very Thin Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [VQFN]
With 7.15 x 7.15 Exposed Pad [Also called QFN]
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 488 2013-2018 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
7.25
7.25
MILLIMETERS
0.50 BSC
MIN
E
MAX
9.00
Contact Pad Length (X64)
Contact Pad Width (X64)
Y1
X1
0.95
0.30
Microchip Technology Drawing C04-149C [MR]
NOM
1
2
20
C1Contact Pad Spacing 9.00
Contact Pad to Center Pad (X64) G1 0.40
Thermal Via Diameter V
Thermal Via Pitch EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Y1
C1
C2
Y2
E
E
2
X1
Y1
G2
EV
EV
Spacing Between Contact Pads (X60) G2 0.20
G1
ØV
SILK SCREEN
64-Lead Very Thin Plastic Quad Flat, No Lead Package (MR) – 9x9x0.9 mm Body [VQFN]
With 7.15 x 7.15 Exposed Pad [Also called QFN]
2013-2018 Microchip Technology Inc. DS70005144G-page 489
dsPIC33EVXXXGM00X/10X FAMILY
APPENDIX A: REVIS ION HISTORY
Revision A (December 2013)
This is the initial version of this document.
Revision B (June 2014)
This revision incorporates the following updates:
• Sections:
- Added
Section 31.0 “Hig h-Temperature
Electrica l C haract eris tics”
- Updated the
“Power Management”
section,
the
“Input/Output”
section,
Section 3.3
“Data Space Addressing”
,
Section 4.2
“Data Address Space”
,
Section 4.3.2
“Extended X Data Space”
,
Section 4.6. 1
“Bit-Reversed Addr essing I mplem enta-
tion”
,
Section 7.4.1 “I NT CON1 th rou gh
INTCON4”
,
Section 11.7 “I/O Helpful Tips”
- Updated note in
Section 17.0 “High-Speed
PWM Module”
,
Section 18.0 “Serial
Peripheral Interface (SPI)”
,
Section 27.8
“Code Protection and CodeGuar d™
Security”
- Updated title of
Section 20.0 “Single-Edge
Nibble Transmission (SENT)”
- Updated
Section 34.0 “Packaging Informa-
tion”
. Deleted e3, Pb-free and Industrial (I)
temperature range indication throughout the
section, and updated the packaging diagrams
- Updated the
“Product Identification System”
section
•Registers:
- Updated Register 3-2, Register 7-2,
Register 7-6, Register 9-2, Register 11-3,
Register 14-1, Register 14-3, Register 14-11,
Register 15-1, Register 22-4
•Figures:
- Added Figure 4-6, Figure 4-8, Figure 4-14,
Figure 4-15, Figure 14-1, Figure 16-1,
Figure 17-2, Figure 23-1, Figure 24-1
• Tables:
- Updated Ta bl e 1, Table 27-1, Tabl e 27- 2,
Table 30-6, Table 30-7, Ta b l e 3 0 - 8,
Table 30-9, Table 30-10, Tab le 3 0-11,
Table 30-12, Table 30-38, Table 30-50,
Table 30-53 and added Ta bl e 3 1 - 11
• Changes to text and formatting were incorporated
throughout the document
Revision C (November 2014)
This revision incorporates the following updates:
• Sections:
- Added note in
Section 5.2 “RTSP
Operation”
- Updated “
Section 5.4 “Error Correcting
Code (ECC)”
- Deleted 44-Terminal Very Thin Leadless
Array Package (TL) - 6x6x0.9 mm Body With
Exposed Pad (VTLA).
•Registers
- Updated Register 7-6
• Figures:
- Updated Figure 4-1, Figure 4-3, Figure 4-4
• Tables:
- Updated Table 27-2, Table 31-13, Table 31-14,
Table 31-15
- Added Table 31-16, Table 31-17
Revision D (April 2015)
This revision incorporates the following updates:
• Sections:
- Updated the Clock Management, Timers/
Output Compare/Input Capture, Communica-
tion Interfaces and Input/Output sections at
the beginning of the data sheet
(Page 1 and Page 2).
- Updated all pin diagrams at the beginning of
the data sheet (Page 5 through Page 11).
- Added
Section 11.6 “High-Voltage Detect
(HVD)”
- Updated
Section 13.0 “Timer2/3 and
Timer4/5”
- Corrects all Buffer heading numbers in
Section 22.4 “CAN Message Buffers”
•Registers
- Updated Register 3-2, Register 25-2,
Register 26-2
• Figures
- Updated Figure 26-1, Figure 30-5, Figure 30-32
• Tables
- Updated Table 1, Table 4-25, Table 30-10,
Table 30-22, Table 30-53 and Table 31-8
• Changes to text and formatting were incorporated
throughout the document
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 490 2013-2018 Microchip Technology Inc.
Revision E (September 2016)
This revision incorporates the following updates:
• Sections:
- Added new
Section 32.0 “Characteristics for
Industrial/Extended T emperature Devices (-40°C
to +125 °C)”
and
Section 33.0 “Characteristics
for High-Temperature Devices (+150°C)”
.
- Updated the
“Qualification and Class B
Support”
section.
- Updated
Section 27.6 “In-Circuit Serial
Programming”
.
- Updated
Section 34.0 “Packaging Informa-
tion”
with the addition of the 28-Lead SSOP
package information and new packaging
diagram revisions.
- Updated the
“Product Identification
System”
section with the addition of the
28-Lead SSOP package.
•Figures:
- Updated Figure 4-6
•Registers:
- Updated Register 25-2, Register 25-3,
Register 27-1 and Register 27-2
• Tables:
- Updated Table 30-7, Tabl e 30- 9, Table 30-39,
Table 30-40, Table 30-41, Table 30-42,
Table 30-43, Table 30-44 and Table 30-45
Revision F (March 2018)
This revision incorporates the following updates:
• Sections:
-
“Pin Diagrams”
-
Section 16.0 “Output Compare”
-
Section 17.1 “PWM Faults”
-
Section 18.0 “Serial Peripheral Interface
(SPI)”
-
Section 23.0 “Charge Time Measurement
Unit (CTMU)”
-
Section 31.0 “High-Temperature Electrical
Characteristics”
-
Section 34.0 “Packaging Information”
-
“Product Identification System”
• Figures:
-Figure 26-1
• Tables:
-Table 4-1
-Table 4-25
-Table 27-2
-Table 28-2
-Table 30-3
-Table 30-8
-Table 30-11
-Table 31-9
•Registers:
-Register 23-2
-Register 23-3
-Register 24-6
-Register 24-7
-Register 26-2
Revision G (May 2018)
This revision incorporates the following updates:
• Sections:
-
“Operating Conditions”
• Tables:
-Table 30-1
2013-2018 Microchip Technology Inc. DS70005144G-page 491
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INDEX
A
Absolute Maximum Ratings .............................................. 343
AC Characteristics ............................................................ 353
10-Bit ADC Conversion Requirements ..................... 403
12-Bit ADC Conversion Requirements ..................... 401
12Cx Bus Data Requirements (Master Mode) .......... 390
ADC Module.............................................................. 397
ADC Module (10-Bit Mode)....................................... 399
ADC Module (12-Bit Mode)....................................... 398
CANx I/O Requirements ........................................... 393
Capacitive Loading Requirements on
Output Pins ....................................................... 353
DMA Module Requirements...................................... 403
External Clock Requirements ................................... 354
High Temperature ..................................................... 410
ADC Module (10-Bit Mode)............................... 414
ADC Module (12-Bit Mode)............................... 413
Internal FRC Accuracy...................................... 411
Internal LPRC Accuracy ................................... 411
PLL Clock ......................................................... 411
High-Speed PWMx Requirements ............................ 363
I/O Requirements...................................................... 356
I2Cx Bus Data Requirements (Slave Mode) ............. 392
Input Capture x (ICx) Requirements ......................... 361
Internal FRC Accuracy.............................................. 355
Internal LPRC Accuracy............................................ 355
Load Conditions ................................................ 353, 410
OCx/PWMx Mode Requirements.............................. 362
Op Amp/Comparator x Voltage Reference
Settling Time..................................................... 395
Output Compare x (OCx) Requirements................... 362
PLL Clock.................................................................. 355
Reset, Watchdog Timer, Oscillator Start-up Timer
and Power-up Timer Requirements .................. 358
SPI1 Master Mode (Full-Duplex, CKE = 0,
CKP = x, SMP = 1) Requirements .................... 380
SPI1 Master Mode (Full-Duplex, CKE = 1,
CKP = x, SMP = 1) ........................................... 378
SPI1 Master Mode (Half-Duplex, Transmit Only)
Requirements ................................................... 377
SPI1 Slave Mode (Full-Duplex, CKE = 0,
CKP = 0, SMP = 0) Requirements.................... 388
SPI1 Slave Mode (Full-Duplex, CKE = 0,
CKP = 1, SMP = 0) Requirements.................... 386
SPI1 Slave Mode (Full-Duplex, CKE = 1,
CKP = 0, SMP = 0) Requirements.................... 382
SPI1 Slave Mode (Full-Duplex, CKE = 1,
CKP = 1, SMP = 0) Requirements.................... 384
SPI2 Master Mode (Full-Duplex, CKE = 0,
CKP = x, SMP = 1) Requirements .................... 367
SPI2 Master Mode (Full-Duplex, CKE = 1,
CKP = x, SMP = 1) Requirements .................... 366
SPI2 Master Mode (Half-Duplex, Transmit Only)
Requirements ................................................... 365
SPI2 Slave Mode (Full-Duplex, CKE = 0,
CKP = 0, SMP = 0) Requirements.................... 375
SPI2 Slave Mode (Full-Duplex, CKE = 0,
CKP = 1, SMP = 0) Requirements.................... 373
SPI2 Slave Mode (Full-Duplex, CKE = 1,
CKP = 0, SMP = 0) Requirements.................... 369
SPI2 Slave Mode (Full-Duplex, CKE = 1,
CKP = 1, SMP = 0) Requirements.................... 371
Timer1 External Clock Requirements ....................... 359
Timer2 and Timer4 (Type B) External
Clock Requirements ......................................... 360
Timer3 and Timer5 (Type C) External
Clock Requirements ......................................... 360
UARTx I/O Requirements......................................... 393
ADC
10-Bit Configuration.................................................. 287
12-Bit Configuration.................................................. 287
Control Registers...................................................... 291
Helpful Tips............................................................... 290
Key Features ............................................................ 287
Alternate Interrupt Vector Table (AIVT) .............................. 97
Analog-to-Digital Converter. See ADC.
Assemblers
MPASM Assembler .................................................. 340
MPLAB Assembler, Linker, Librarian........................ 340
B
Bit-Reversed Addressing
Example...................................................................... 80
Implementation ........................................................... 79
Sequence Table (16-Entry) ........................................ 80
Block Diagrams
16-Bit Timer1 Module ............................................... 175
Accessing Program Memory with
Table Instructions ............................................... 83
ADCx Conversion Clock Period................................ 289
ADCx with Connection Options for ANx Pins
and Op Amps ................................................... 288
Addressing for Table Registers .................................. 85
Arbiter Architecture..................................................... 75
CALL Stack Frame ..................................................... 76
CANx Module ........................................................... 256
Comparator Voltage Reference Module ................... 316
Connections for On-Chip Voltage Regulator ............ 326
CPU Core ................................................................... 24
CTMU Module .......................................................... 282
Data Access from Program Space
Address Generation............................................ 82
Deadman Timer Module ........................................... 183
Digital Filter Interconnect.......................................... 304
DMA Controller ......................................................... 113
dsPIC33EVXXXGM00X/10X Family........................... 15
EDS Read Address Generation.................................. 70
EDS Write Address Generation.................................. 71
High-Speed PWMx Architectural Overview .............. 203
High-Speed PWMx Register Interconnection ........... 204
I2Cx Module ............................................................. 232
Input Capture x Module ............................................ 191
MCLR Pin Connections .............................................. 20
Multiplexing Remappable Output for RPn ................ 151
Op Amp/Comparator x Module................................. 303
Oscillator Circuit Placement ....................................... 21
Oscillator System...................................................... 125
Output Compare x Module ....................................... 195
Paged Data Memory Space ....................................... 72
Peripheral to DMA Controller.................................... 111
PLL Module .............................................................. 126
Recommended Minimum Connection ........................ 20
Remappable Input for U1RX .................................... 148
Reset System ............................................................. 94
SENTx Module ......................................................... 240
Shared I/O Port Structure ......................................... 145
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SPIx Module.............................................................. 224
Type B Timer (Timer2 and Timer4)........................... 178
Type B/Type C Timer Pair (32-Bit Timer).................. 179
Type C Timer (Timer3 and Timer5) .......................... 178
UARTx Module.......................................................... 249
User-Programmable Blanking Function .................... 304
Watchdog Timer (WDT) ............................................ 327
Brown-out Reset (BOR) .................................................... 326
C
C Compilers
MPLAB XC................................................................ 340
CAN Module
Control Registers ...................................................... 257
Message Buffers ....................................................... 277
Word 0 .............................................................. 277
Word 1 .............................................................. 277
Word 2 .............................................................. 278
Word 3 .............................................................. 278
Word 4 .............................................................. 279
Word 5 .............................................................. 279
Word 6 .............................................................. 280
Word 7 .............................................................. 280
Modes of Operation .................................................. 256
Overview ................................................................... 255
Characteristics for High-Temperature
Devices (+150°C)...................................................... 441
Characteristics for Industrial/Extended Temperature
Devices (-40°C to +125°C)........................................ 415
Charge Time Measurement Unit (CTMU) ......................... 281
Charge Time Measurement Unit. See CTMU.
Code Examples
Port Write/Read ........................................................146
PORTA Slew Selections ........................................... 147
PWM1 Write-Protected Register
Unlock Sequence..............................................202
PWRSAV
Instruction Syntax........................................ 135
Code Protection ........................................................ 319, 328
CodeGuard Security.................................................. 319, 328
Comparator Voltage Reference
Configuring................................................................ 315
Control Registers ...................................................... 317
Configuration Bits.............................................................. 319
Description ................................................................ 322
Controller Area Network (CAN).........................................255
Controller Area Network. See CAN.
CPU..................................................................................... 23
Addressing Modes ...................................................... 23
Arithmetic Logic Unit (ALU)......................................... 32
Control Registers ........................................................ 27
Data Space Addressing .............................................. 23
DSP Engine ................................................................32
Instruction Set ............................................................. 23
Programmer’s Model................................................... 25
CTMU
Control Registers ...................................................... 283
Customer Change Notification Service ............................. 497
Customer Notification Service...........................................497
Customer Support ............................................................. 497
D
Data Address Space ........................................................... 38
Alignment .................................................................... 38
Memory Map for 256-Kbyte Devices........................... 41
Memory Map for 32-Kbyte Devices.............................39
Memory Map for 64/128-Kbyte Devices ..................... 40
Near Data Space ........................................................ 38
SFR Space ................................................................. 38
Width .......................................................................... 38
Data Space
Extended X ................................................................. 74
Memory Arbitration, Bus Master Priority..................... 75
Paged Memory Scheme ............................................. 70
DC Characteristics............................................................ 344
Brown-out Reset (BOR)............................................ 351
CTMU Current Source.............................................. 396
Doze Current (I
DOZE
)................................................ 349
Filter Capacitor (C
EFC
) Specifications ...................... 345
High Temperature..................................................... 406
Brown-out Reset (BOR).................................... 409
CTMU Current Source...................................... 412
I/O Pin Input Specifications .............................. 408
I/O Pin Output Specifications............................ 409
Idle Current (I
IDLE
) ............................................ 407
Op Amp/ Comparator x..................................... 413
Operating Current (I
DD
) .................................... 407
Operating MIPS vs. Voltage ............................. 406
Power-Down Current (I
PD
)................................ 407
Program Memory.............................................. 409
Temperature and Voltage Specifications.......... 406
High-Temperature
Doze Current (I
DOZE
)........................................ 407
I/O Pin Input Specifications....................................... 350
I/O Pin Output Specifications.................................... 351
Idle Current (I
IDLE
) .................................................... 347
Internal Band Gap Reference Voltage...................... 352
Op Amp/Comparator x Specifications....................... 394
Op Amp/Comparator x
Voltage Reference Specifications..................... 395
Operating Current (I
DD
) ............................................ 346
Operating MIPS vs. Voltage ..................................... 344
Power-Down Current (I
PD
)........................................ 348
Program Memory...................................................... 352
Temperature and Voltage Specifications.................. 345
Thermal Operating Conditions.................................. 344
Deadman Timer (DMT)..................................................... 183
Control Registers...................................................... 184
Deadman Timer. See DMT.
Development Support....................................................... 339
Direct Memory Access. S ee DMA.
DMA Controller
Channel to Peripheral Associations.......................... 112
Control Registers...................................................... 113
Supported Peripherals .............................................. 111
DMAC Registers
DMAxCNT................................................................. 113
DMAxCON................................................................ 113
DMAxPAD................................................................. 113
DMAxREQ ................................................................ 113
DMAxSTAH/L ........................................................... 113
DMAxSTBH/L ........................................................... 113
Doze Mode ....................................................................... 137
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E
Electrical Characteristics................................................... 343
AC ..................................................................... 353, 410
Equations
BRG Formula............................................................ 231
Device Operating Frequency .................................... 126
F
OSC
Calculation....................................................... 126
Frame Time Calculations.......................................... 241
F
SCL
Frequency ........................................................ 231
F
VCO
Calculation....................................................... 126
SYNCMIN and SYNCMAX Calculations ................... 242
Tick Period Calculation ............................................. 241
Errata .................................................................................. 13
F
Flash Program Memory ...................................................... 85
Control Registers ........................................................ 87
Error Correcting Code (ECC)...................................... 87
Operations .................................................................. 86
Resources................................................................... 87
RTSP Operation.......................................................... 86
Table Instructions........................................................ 85
Flexible Configuration ....................................................... 319
G
Getting Started with 16-Bit DSCs........................................ 19
Connection Requirements .......................................... 19
CPU Logic Filter Capacitor Connection (V
CAP
) .......... 20
Decoupling Capacitors................................................ 19
External Oscillator Pins............................................... 21
ICSP Pins.................................................................... 21
Master Clear (MCLR) Pin............................................ 20
Oscillator Value Conditions on Device Start-up .......... 21
Unused I/Os................................................................ 21
H
High Temperature
Thermal Operating Conditions .................................. 406
High-Speed PWM ............................................................. 201
Control Registers ...................................................... 206
Faults ........................................................................ 201
Resources................................................................. 205
High-Temperature Electrical Characteristics..................... 405
Absolute Maximum Ratings ...................................... 405
I
I/O Ports............................................................................ 145
Configuring Analog/Digital Port Pins......................... 146
Helpful Tips............................................................... 153
High-Voltage Detect (HVD)....................................... 153
Open-Drain Configuration ......................................... 146
Parallel I/O (PIO)....................................................... 145
Peripheral Pin Select (PPS)...................................... 147
Slew Rate Selection.................................................. 147
Write/Read Timing .................................................... 146
In-Circuit Debugger........................................................... 328
MPLAB ICD 3............................................................ 341
PICkit 3 Programmer ................................................ 341
In-Circuit Emulation........................................................... 319
In-Circuit Serial Programming (ICSP) ....................... 319, 328
Input Capture .................................................................... 191
Control Registers ...................................................... 192
Input Change Notification (ICN) ........................................ 146
Instruction Addressing Modes ............................................ 76
File Register Instructions ............................................ 76
Fundamental Modes Supported ................................. 77
MAC Instructions ........................................................ 77
MCU Instructions ........................................................ 76
Move and Accumulator Instructions ........................... 77
Other Instructions ....................................................... 77
Instruction Set
Overview................................................................... 332
Summary .................................................................. 329
Symbols Used in Opcode ......................................... 330
Interfacing Program and Data Memory Spaces.................. 81
Inter-Integrated Circuit (I
2
C) ............................................. 231
Baud Rate Generator ............................................... 231
Control Registers...................................................... 233
Inter-Integrated Circuit. See I
2
C.
Internal LPRC Oscillator
Use with WDT........................................................... 327
Internet Address ............................................................... 497
Interrupt Controller
Control and Status Registers.................................... 102
IECx.................................................................. 102
IFSx .................................................................. 102
INTCON1.......................................................... 102
INTCON2.......................................................... 102
INTCON3.......................................................... 102
INTCON4.......................................................... 102
INTTREG.......................................................... 102
IPCx.................................................................. 102
Reset Sequence ....................................................... 102
Interrupt Vector Table (IVT)................................................ 97
Details....................................................................... 100
M
Memory Maps
EDS ............................................................................ 74
Memory Organization ......................................................... 33
Microchip Internet Web Site.............................................. 497
Modulo Addressing............................................................. 78
Applicability................................................................. 79
Operation Example..................................................... 78
Start and End Address ............................................... 78
W Address Register Selection.................................... 78
MPLAB PM3 Device Programmer .................................... 341
MPLAB REAL ICE In-Circuit Emulator System ................ 341
MPLAB X Integrated Development
Environment Software .............................................. 339
MPLINK Object Linker/MPLIB Object Librarian ................ 340
O
Op Amp/Comparator......................................................... 303
Control Registers...................................................... 305
Oscillator Configuration .................................................... 125
Bit Values for Clock Selection .................................. 127
CPU Clocking System .............................................. 126
Output Compare ............................................................... 195
Control Registers...................................................... 196
P
Packaging......................................................................... 463
Details....................................................................... 465
Marking............................................................. 463, 464
Peripheral Module Disable (PMD) .................................... 137
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Peripheral Pin Select (PPS)
Control Registers ...................................................... 155
Input Sources, Maps Input to Function ..................... 149
Output Selection for Remappable Pins..................... 152
Pinout I/O Descriptions (table) ............................................ 16
Power-Saving Features.....................................................135
Clock Frequency and Switching................................ 135
Instruction-Based Modes .......................................... 135
Idle .................................................................... 136
Sleep................................................................. 136
Interrupts Coincident with
Power Save Instructions ................................... 136
Program Address Space .....................................................33
Construction................................................................ 81
Data Access from Program Memory Using
Table Instructions................................................83
Memory Map for dsPIC33EV128GM00X/10X
Devices ............................................................... 35
Memory Map for dsPIC33EV256GM00X/10X
Devices ............................................................... 36
Memory Map for dsPIC33EV32GM00X/10X
Devices ............................................................... 33
Memory Map for dsPIC33EV64GM00X/10X
Devices ............................................................... 34
Table Read Instructions
TBLRDH
............................................................... 83
TBLRDL
............................................................... 83
Program Memory
Interrupt/Trap Vectors ................................................. 37
Organization................................................................ 37
Reset Vector ............................................................... 37
Programmer’s Model
Register Descriptions.................................................. 25
R
Referenced Sources ........................................................... 14
Register Maps
ADC1 .......................................................................... 48
CAN1 (WIN (C1CTRL) = 0 or 1) .................................49
CAN1 (WIN (C1CTRL) = 0).........................................49
CAN1 (WIN (C1CTRL) = 1).........................................50
Configuration Words .................................................320
CPU Core....................................................................43
CTMU.......................................................................... 48
DMAC ......................................................................... 61
DMT ............................................................................ 54
I2C1 ............................................................................ 46
Input Capture 1 through Input Capture 4 .................... 46
Interrupt Controller ......................................................57
NVM ............................................................................ 55
Op Amp/Comparator................................................... 60
Output Compare ......................................................... 59
Peripheral Input Remap .............................................. 54
PMD ............................................................................ 56
PORTA for dsPIC33EVXXXGMX02 Devices.............. 65
PORTA for dsPIC33EVXXXGMX04 Devices.............. 64
PORTA for dsPIC33EVXXXGMX06 Devices.............. 64
PORTB for dsPIC33EVXXXGMX02 Devices.............. 66
PORTB for dsPIC33EVXXXGMX04 Devices.............. 66
PORTB for dsPIC33EVXXXGMX06 Devices.............. 65
PORTC for dsPIC33EVXXXGMX04 Devices ............. 67
PORTC for dsPIC33EVXXXGMX06 Devices ............. 67
PORTD for dsPIC33EVXXXGMX06 Devices ............. 68
PORTE for dsPIC33EVXXXGMX06 Devices.............. 68
PORTF for dsPIC33EVXXXGMX06 Devices.............. 69
PORTG for dsPIC33EVXXXGMX06 Devices ............. 69
PPS Output for dsPIC33EVXXXGM002/102
Devices............................................................... 52
PPS Output for dsPIC33EVXXXGM004/104
Devices............................................................... 52
PPS Output for dsPIC33EVXXXGM006/106
Devices............................................................... 53
PWM........................................................................... 62
PWM Generator 1....................................................... 62
PWM Generator 2....................................................... 63
PWM Generator 3....................................................... 63
Reference Clock ......................................................... 55
SENT1 Receiver......................................................... 51
SENT2 Receiver......................................................... 51
SPI1 and SPI2 ............................................................ 47
System Control ........................................................... 55
Timers......................................................................... 45
UART1 and UART2 .................................................... 47
Registers
ADxCHS0 (ADCx Input Channel 0 Select) ............... 298
ADxCHS123 (ADCx Input Channels 1, 2, 3
Select) .............................................................. 297
ADxCON1 (ADCx Control 1)..................................... 291
ADxCON2 (ADCx Control 2)..................................... 293
ADxCON3 (ADCx Control 3)..................................... 295
ADxCON4 (ADCx Control 4)..................................... 296
ADxCSSH (ADCx Input Scan Select High)............... 300
ADxCSSL (ADCx Input Scan Select Low)................ 302
ALTDTRx (PWMx Alternate Dead-Time).................. 213
AUXCONx (PWMx Auxiliary Control) ....................... 221
CHOP (PWMx Chop Clock Generator)..................... 209
CLKDIV (Clock Divisor) ............................................ 130
CM4CON (Comparator 4 Control) ............................ 308
CMSTAT (Op Amp/Comparator Status) ................... 305
CMxCON (Comparator x Control,
x = 1, 2, 3 or 5) ................................................. 306
CMxFLTR (Comparator x Filter Control)................... 314
CMxMSKCON (Comparator x
Mask Gating Control)........................................ 312
CMxMSKSRC (Comparator x Mask Source
Select Control).................................................. 310
CORCON (Core Control).................................... 29, 104
CTMUCON1 (CTMU Control 1) ................................ 283
CTMUCON2 (CTMU Control 2) ................................ 284
CTMUICON (CTMU Current Control)....................... 286
CTXTSTAT (CPU W Register Context Status)........... 31
CVR1CON (Comparator Voltage Reference
Control 1).......................................................... 317
CVR2CON (Comparator Voltage Reference
Control 2).......................................................... 318
CxBUFPNT1 (CANx Filters 0-3
Buffer Pointer 1) ............................................... 266
CxBUFPNT2 (CANx Filters 4-7
Buffer Pointer 2) ............................................... 267
CxBUFPNT3 (CANx Filters 8-11
Buffer Pointer 3) ............................................... 268
CxBUFPNT4 (CANx Filters 12-15
Buffer Pointer 4) ............................................... 269
CxCFG1 (CANx Baud Rate Configuration 1)............ 264
CxCFG2 (CANx Baud Rate Configuration 2)............ 265
CxCTRL1 (CANx Control 1)...................................... 257
CxCTRL2 (CANx Control 2)...................................... 258
CxEC (CANx Transmit/Receive Error Count) ........... 264
CxFCTRL (CANx FIFO Control) ............................... 260
CxFEN1 (CANx Acceptance Filter Enable 1) ........... 266
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CxFIFO (CANx FIFO Status) .................................... 261
CxFMSKSEL1 (CANx Filters 7-0
Mask Selection 1) ............................................. 271
CxFMSKSEL2 (CANx Filters 15-8
Mask Selection 2) ............................................. 272
CxINTE (CANx Interrupt Enable) .............................. 263
CxINTF (CANx Interrupt Flag) .................................. 262
CxRXFnEID (CANx Acceptance Filter n
Extended Identifier)........................................... 270
CxRXFnSID (CANx Acceptance Filter n
Standard Identifier) ........................................... 270
CxRXFUL1 (CANx Receive Buffer Full 1)................. 274
CxRXFUL2 (CANx Receive Buffer Full 2)................. 274
CxRXMnEID (CANx Acceptance Filter Mask n
Extended Identifier)........................................... 273
CxRXMnSID (CANx Acceptance Filter Mask n
Standard Identifier) ........................................... 273
CxRXOVF1 (CANx Receive Buffer Overflow 1)........ 275
CxRXOVF2 (CANx Receive Buffer Overflow 2)........ 275
CxTRmnCON (CANx TX/RX Buffer mn Control) ...... 276
CxVEC (CANx Interrupt Code) ................................. 259
DEVID (Device ID) .................................................... 325
DEVREV (Device Revision) ...................................... 325
DMALCA (DMA Last Channel Active Status) ........... 122
DMAPPS (DMA Ping-Pong Status) .......................... 123
DMAPWC (DMA Peripheral Write
Collision Status)................................................ 120
DMARQC (DMA Request Collision Status) .............. 121
DMAxCNT (DMA Channel x Transfer Count) ........... 118
DMAxCON (DMA Channel x Control) ....................... 114
DMAxPAD (DMA Channel x
Peripheral Address) .......................................... 118
DMAxREQ (DMA Channel x IRQ Select) ................. 115
DMAxSTAH (DMA Channel x
Start Address A, High) ...................................... 116
DMAxSTAL (DMA Channel x
Start Address A, Low)....................................... 116
DMAxSTBH (DMA Channel x
Start Address B, High) ...................................... 117
DMAxSTBL (DMA Channel x
Start Address B, Low)....................................... 117
DMTCLR (Deadman Timer Clear) ............................ 185
DMTCNTH (Deadman Timer Count High) ................ 187
DMTCNTL (Deadman Timer Count Low) ................. 187
DMTCON (Deadman Timer Control) ........................ 184
DMTHOLDREG (DMT Hold)..................................... 190
DMTPRECLR (Deadman Timer Preclear) ................ 184
DMTPSCNTH (DMT Post-Configure
Count Status High) ........................................... 188
DMTPSCNTL (DMT Post-Configure
Count Status Low) ............................................ 188
DMTPSINTVH (DMT Post-Configure Interval
Status High) ...................................................... 189
DMTPSINTVL (DMT Post-Configure Interval
Status Low)....................................................... 189
DMTSTAT (Deadman Timer Status)......................... 186
DSADRH (DMA Most Recent RAM
High Address) ................................................... 119
DSADRL (DMA Most Recent RAM
Low Address).................................................... 119
DTRx (PWMx Dead-Time) ........................................ 213
FCLCONx (PWMx Fault Current-Limit Control) ........ 217
I2CxCON1 (I2Cx Control 1) ...................................... 233
I2CxCON2 (I2Cx Control 2) ...................................... 235
I2CxMSK (I2Cx Slave Mode Address Mask) ............ 237
I2CxSTAT (I2Cx Status) ........................................... 236
ICxCON1 (Input Capture x Control 1)....................... 192
ICxCON2 (Input Capture x Control 2)....................... 193
INTCON1 (Interrupt Control 1) ................................. 105
INTCON2 (Interrupt Control 2) ................................. 107
INTCON3 (Interrupt Control 3) ................................. 108
INTCON4 (Interrupt Control 4) ................................. 109
INTTREG (Interrupt Control and Status) .................. 110
IOCONx (PWMx I/O Control).................................... 215
LEBCONx (PWMx Leading-Edge
Blanking Control).............................................. 219
LEBDLYx (PWMx Leading-Edge
Blanking Delay) ................................................ 220
MDC (PWMx Master Duty Cycle) ............................. 209
NVMADR (NVM Lower Address)................................ 90
NVMADRU (NVM Upper Address) ............................. 90
NVMCON (NVM Control)............................................ 88
NVMKEY (NVM Key).................................................. 91
NVMSRCADRH (NVM Data Memory
Upper Address) .................................................. 92
NVMSRCADRL (NVM Data Memory
Lower Address) .................................................. 92
OCxCON1 (Output Compare x Control 1) ................ 196
OCxCON2 (Output Compare x Control 2) ................ 198
OSCCON (Oscillator Control)................................... 128
OSCTUN (FRC Oscillator Tuning)............................ 133
PDCx (PWMx Generator Duty Cycle)....................... 212
PHASEx (PWMx Primary Phase-Shift)..................... 212
PLLFBD (PLL Feedback Divisor) ............................. 132
PMD1 (Peripheral Module Disable Control 1) .......... 138
PMD2 (Peripheral Module Disable Control 2) .......... 139
PMD3 (Peripheral Module Disable Control 3) .......... 140
PMD4 (Peripheral Module Disable Control 4) .......... 140
PMD6 (Peripheral Module Disable Control 6) .......... 141
PMD7 (Peripheral Module Disable Control 7) .......... 142
PMD8 (Peripheral Module Disable Control 8) .......... 143
PTCON (PWMx Time Base Control) ........................ 206
PTCON2 (PWMx Primary Master Clock
Divider Select) .................................................. 207
PTPER (PWMx Primary Master
Time Base Period)............................................ 208
PWMCONx (PWMx Control) .................................... 210
RCON (Reset Control)................................................ 95
REFOCON (Reference Oscillator Control) ............... 134
RPINR0 (Peripheral Pin Select Input 0) ................... 155
RPINR1 (Peripheral Pin Select Input 1) ................... 155
RPINR11 (Peripheral Pin Select Input 11) ............... 159
RPINR12 (Peripheral Pin Select Input 12) ............... 160
RPINR18 (Peripheral Pin Select Input 18) ............... 161
RPINR19 (Peripheral Pin Select Input 19) ............... 161
RPINR22 (Peripheral Pin Select Input 22) ............... 162
RPINR23 (Peripheral Pin Select Input 23) ............... 163
RPINR26 (Peripheral Pin Select Input 26) ............... 163
RPINR3 (Peripheral Pin Select Input 3) ................... 156
RPINR37 (Peripheral Pin Select Input 37) ............... 164
RPINR38 (Peripheral Pin Select Input 38) ............... 164
RPINR39 (Peripheral Pin Select Input 39) ............... 165
RPINR44 (Peripheral Pin Select Input 44) ............... 166
RPINR45 (Peripheral Pin Select Input 45) ............... 166
RPINR7 (Peripheral Pin Select Input 7) ................... 157
RPINR8 (Peripheral Pin Select Input 8) ................... 158
RPOR0 (Peripheral Pin Select Output 0) ................. 167
RPOR1 (Peripheral Pin Select Output 1) ................. 167
RPOR10 (Peripheral Pin Select Output 10) ............. 172
RPOR11 (Peripheral Pin Select Output 11) ............. 172
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 496 2013-2018 Microchip Technology Inc.
RPOR12 (Peripheral Pin Select Output 12).............. 173
RPOR13 (Peripheral Pin Select Output 13).............. 173
RPOR2 (Peripheral Pin Select Output 2) .................. 168
RPOR3 (Peripheral Pin Select Output 3) .................. 168
RPOR4 (Peripheral Pin Select Output 4) .................. 169
RPOR5 (Peripheral Pin Select Output 5) .................. 169
RPOR6 (Peripheral Pin Select Output 6) .................. 170
RPOR7 (Peripheral Pin Select Output 7) .................. 170
RPOR8 (Peripheral Pin Select Output 8) .................. 171
RPOR9 (Peripheral Pin Select Output 9) .................. 171
SENTxCON1 (SENTx Control 1) ..............................243
SENTxDATH (SENTx Receive Data High) ............... 247
SENTxDATL (SENTx Receive Data Low) ................ 247
SENTxSTAT (SENTx Status) ................................... 245
SEVTCMP (PWMx Primary
Special Event Compare)...................................208
SPIxCON1 (SPIx Control 1)...................................... 228
SPIxCON2 (SPIx Control 2)...................................... 230
SPIxSTAT (SPIx Status and Control) ....................... 226
SR (CPU STATUS).............................................27, 103
T1CON (Timer1 Control)........................................... 176
TRGCONx (PWMx Trigger Control)..........................214
TRIGx (PWMx Primary Trigger
Compare Value)................................................ 216
TxCON (Timer2 and Timer4 Control)........................ 180
TyCON (Timer3 and Timer5 Control)........................ 181
UxMODE (UARTx Mode).......................................... 251
UxSTA (UARTx Status and Control)......................... 253
Resets ................................................................................. 93
Brown-out Reset (BOR) ..............................................93
Configuration Mismatch Reset (CM)........................... 93
Illegal Condition Reset (IOPUWR) ..............................93
Illegal Address Mode .......................................... 93
Illegal Opcode ..................................................... 93
Security ............................................................... 93
Uninitialized W Register......................................93
Master Clear Pin Reset (MCLR) ................................. 93
Master Reset Signal (SYSRST).................................. 93
Power-on Reset (POR) ...............................................93
RESET
Instruction (SWR)............................................93
Trap Conflict Reset (TRAPR)......................................93
Watchdog Timer Time-out Reset (WDTO).................. 93
Revision History ................................................................ 489
S
SENTx Protocol Data Frames........................................... 240
Serial Peripheral Interface (SPI) ....................................... 223
Serial Peripheral Interface. See SPI.
Single-Edge Nibble Transmission (SENT) ........................ 239
Receive Mode ...........................................................242
Transmit Mode .......................................................... 241
Single-Edge Nibble Transmission for
Automotive Applications............................................ 239
Single-Edge Nibble Transmission. See SENT.
Software Simulator
MPLAB X SIM ...........................................................341
Software Stack Pointer (SSP).............................................76
Special Features of the CPU.............................................319
SPI
Control Registers ...................................................... 226
Helpful Tips ............................................................... 225
T
Temperature and Voltage Specifications
AC............................................................................. 353
High Temperature
AC..................................................................... 410
Thermal Packaging Characteristics.................................. 344
Third-Party Development Tools........................................ 342
Timer1............................................................................... 175
Control Register........................................................ 176
Timer2/3 and Timer4/5 ..................................................... 177
Control Registers...................................................... 180
Timing Diagrams
10-Bit ADC Conversion (CHPS<1:0> = 01,
SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000,
SSRCG = 0) ..................................................... 402
10-Bit ADC Conversion (CHPS<1:0> = 01,
SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111,
SSRCG = 0, SAMC<4:0> = 00010).................. 402
12-Bit ADC Conversion (ASAM = 0,
SSRC<2:0> = 000, SSRCG = 0) ...................... 400
BOR and Master Clear Reset ................................... 356
CANx I/O .................................................................. 393
External Clock........................................................... 354
High-Speed PWMx Characteristics .......................... 363
High-Speed PWMx Fault .......................................... 363
I/O Characteristics .................................................... 356
I2Cx Bus Data (Master Mode) .................................. 389
I2Cx Bus Data (Slave Mode) .................................... 391
I2Cx Bus Start/Stop Bits (Master Mode)................... 389
I2Cx Bus Start/Stop Bits (Slave Mode)..................... 391
Input Capture x (ICx) ................................................ 361
OCx/PWMx Characteristics ...................................... 362
Output Compare x (OCx) Characteristics ................. 362
Power-on Reset Characteristics ............................... 357
SPI1 Master Mode (Full-Duplex, CKE = 0,
CKP = x, SMP = 1) ........................................... 379
SPI1 Master Mode (Full-Duplex, CKE = 1,
CKP = x, SMP = 1) ........................................... 378
SPI1 Master Mode (Half-Duplex,
Transmit Only, CKE = 0)................................... 376
SPI1 Master Mode (Half-Duplex,
Transmit Only, CKE = 1)................................... 377
SPI1 Slave Mode (Full-Duplex, CKE = 0,
CKP = 0, SMP = 0)........................................... 387
SPI1 Slave Mode (Full-Duplex, CKE = 0,
CKP = 1, SMP = 0)........................................... 385
SPI1 Slave Mode (Full-Duplex, CKE = 1,
CKP = 0, SMP = 0)........................................... 381
SPI1 Slave Mode (Full-Duplex, CKE = 1,
CKP = 1, SMP = 0)........................................... 383
SPI2 Master Mode (Full-Duplex, CKE = 0,
CKP = x, SMP = 1) ........................................... 367
SPI2 Master Mode (Full-Duplex, CKE = 1,
CKP = x, SMP = 1) ........................................... 366
SPI2 Master Mode (Half-Duplex,
Transmit Only, CKE = 0)................................... 364
SPI2 Master Mode (Half-Duplex,
Transmit Only, CKE = 1)................................... 365
SPI2 Slave Mode (Full-Duplex, CKE = 0,
CKP = 0, SMP = 0)........................................... 374
2013-2018 Microchip Technology Inc. DS70005144G-page 497
dsPIC33EVXXXGM00X/10X FAMILY
SPI2 Slave Mode (Full-Duplex, CKE = 0,
CKP = 1, SMP = 0) ........................................... 372
SPI2 Slave Mode (Full-Duplex, CKE = 1,
CKP = 0, SMP = 0) ........................................... 368
SPI2 Slave Mode (Full-Duplex, CKE = 1,
CKP = 1, SMP = 0) ........................................... 370
Timer1-Timer5 External Clock .................................. 359
UARTx I/O................................................................. 393
U
UART
Control Registers ...................................................... 251
Helpful Tips............................................................... 250
Universal Asynchronous Receiver
Transmitter (UART)................................................... 249
Universal Asynchronous Receiver Transmitter. See UART.
User OTP Memory ............................................................ 326
V
Voltage Regulator (On-Chip) ............................................ 326
W
Watchdog Timer (WDT)............................................ 319, 327
Programming Considerations ................................... 327
WWW Address ................................................................. 497
WWW, On-Line Support ..................................................... 13
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 498 2013-2018 Microchip Technology Inc.
NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 499
ds
PIC33EVXXXGM00X/10X FAMILY
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•
Product Support
– Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•
General Technical Support
– Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•
Business of Microchip
– Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is a vailable through the web si te
at: http://microchip.com/support
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 500 2013-2018 Microchip Technology Inc.
NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 501
dsPIC33EVXXXGM00X/10X FAMILY
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
.
Architecture:
33 = 16-Bit Digital Signal Controller
Family:
EV = Enhanced Voltage
Prod u ct Gr oup:
GM = General Purpose plus Motor Control Family
Pin Count:
02 = 28-Pin
03 = 36-Pin
04 = 44-Pin
06 = 64-Pin
Temperatur e Range
I = -40°C to +85°C (Industrial)
E = -40°C to +125°C (Extended)
H = -40°C to +150°C (High)
Package:
MM = Plastic Quad Flat, No Lead Package – (28-pin) 6x6x0.9 mm body (QFN-S)
SO = Plastic Small Outline – (28-pin) 7.50 mm body (SOIC)
SS = Plastic Shrink Small Outline – (28-pin) 5.30 mm body (SSOP)
SP = Skinny Plastic Dual In-Line – (28-pin) 300 mil body (SPDIP)
M5 = Ultra Thin Plastic Quad Flat, No Lead Package - (36-pin) 5X5 mm body
(UQFN)
ML = Plastic Quad Flat, No Lead Package – (44-pin) 8x8 mm body (QFN)
MR = Plastic Quad Flat, No Lead Package – (64-pin) 9x9x0.9 mm body (QFN)
PT = Plastic Thin Quad Flatpack – (44-pin) 10x10x1 mm body (TQFP)
PT = Plastic Thin Quad Flatpack – (64-pin) 10x10x1 mm body (TQFP)
Example:
dsPIC33EV256GM006-I/PT:
dsPIC33, Enhanced Voltage,
256-Kbyte Program Memory, 64-Pin,
Industrial Temperature, TQFP Package.
Microchip Trademark
Architecture
Core Family
Program Memory Size (Kbytes)
Product Grou p
Pin Count
Package
Pattern
dsPIC 33 EV XXX GM0 0X T PT - XXX
Tape and Reel Flag (if applicable)
dsPIC33EVXXXGM00X/10X FAMILY
DS70005144G-page 502 2013-2018 Microchip Technology Inc.
NOTES:
2013-2018 Microchip Technology Inc. DS70005144G-page 503
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE
.
Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, K
EE
L
OQ
,
K
EE
L
OQ
logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2013-2018, Microchip Technology Incorporated, All Rights
Reserved.
ISBN: 978-1-5224-3132-9
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microch ip rece iv ed ISO/T S -16 94 9:20 09 certifi cat i on for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
®
MCUs and dsPI C
®
DSCs, KEELOQ
®
code hoppi ng
devices, Serial EEPROMs, microperiph erals, nonvolat ile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS70005144G-page 504 2013-2018 Microchip Technology Inc.
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