PolySwitch(R) Temperature Indicators Surface Mount > setPTM Series setPTM Temperature Indicators for USB Type-C RoHS Description The Littelfuse setPTM temperature indicator helps protect USB Type-C plugs from overheating. It has been designed to the unique specifications of USB Type-C and is capable of helping to protect even the highest levels of USB Power Delivery. Features * Compact footprint: 0805 mils (2.0 x 1.2mm) * Sensitive and reliable temperature indication * SMD compatible with reflow soldering process * Zero IR loss contribution Agency Approvals Agency Agency File Number E74889 * Easy part selection * USB Power Delivery compliant * Protects systems with 100W or higher power * Evaluated to UL 1434 and Annex J of IEC 60730-1 J 50313999 Applications * USB Type-C Plugs * Chargers with captive Type-C Cables * USB-C to USB-C Cable * Fast charging standards and protocols compliant with USB-C and USB-PD Temperature Indication Characteristics Part Number Marking Code Indicating Temperature (C) Min Typical 1 Resistance () Max Max at 25C 2 Rind 3 SETP0805-100-SE T 90 100 110 12 35,000 SETP0805-100-CC V 90 100 110 6 35,000 Notes: 1. Tind = Typical indicating temperature: Typical temperature when device switches to indicating resistance (Rind) 2. Maximum post reflow resistance measured at 25C in still air 3. Rind = Indicating resistance when device reaches the indicating temperature (Tind) (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/19 PolySwitch(R) Temperature Indicators Surface Mount > setPTM Series Electrical Characteristics Ihold 1 (A) Itrip 2 (A) Vmax 3 (Vdc) Imax 4 (A) Pd 5 typ. (W) SETP0805-100-SE 0.06 0.25 6 1 SETP0805-100-CC 0.075 0.30 6 1 Part Number Maximum Time-To-Trip Resistance Current (A) Time (Sec.) Rmin 6 () R1max 7 () 0.6 0.3 1 0.5 12 0.6 0.3 5 0.5 6 Notes: 1. Ihold = Hold current: maximum current device will pass without tripping in 20C still air 2. Itrip = Trip current: minimum current at which the device will trip in 20C still air 3. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) 4. Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) 5. Pd = Power dissipated from device when in the tripped state at 20C still air 6. Rmin = Minimum resistance of device in initial (un-soldered) state 7. R1max = Maximum resistance of device at 20C measured one hour after tripping or reflow Soldering of 260C for 20 seconds (Values specified were determined using PCBs with 0.115in x 1.0in ounce copper traces) Caution: Operation beyond the specified rating may result in damage and possible arcing and flame Environmental Specifications Resistance Vs. Temperature Curve 1.E+09 1.E+08 SETP0805-100-SE -40C to +85C Maximum Device Surface Temperature in Tripped State 110C +70C 1000 hours R1max after test +60C, 90% R.H., 1000 hours R1max after test MIL-STD-202, Method 215 No change -40C to +85C, 10 Cycles MIL-STD-202, Method 215 No change MIL-STD-883, Method 2007, Condition A No change Passive Aging 1.E+07 Resistance, () Operating Temperature Humidity Aging SETP0805-100-CC 1.E+06 Thermal Shock 1.E+05 Solvent Resistance 1.E+04 Vibration 1.E+03 Level 2a, J-STD-020 Moisture Sensitivity Level 1.E+02 Physical Specifications 1.E+01 1.E+00 20 40 60 80 100 120 Temperature, C 140 Terminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002, Category 3. Soldering Parameters Pb-Free Assembly Average Ramp-Up Rate (TS(max) to TP) 3C/second max Pre Heat: Temperature Min (Ts(min)) 150C Temperature Max (Ts(max)) 200C Time (Min to Max) (ts) 60 - 120 secs Time Maintained Temperature (TL) 217C Above: 60 - 150 seconds Temperature (tL) Peak / Classification Temperature (TP) Time within 5C of actual peak Temperature (tp) 260+0/-5 C 30 seconds max Ramp-down Rate 2C/second max Time 25C to peak Temperature (TP) 8 minutes Max. tP TP Critical Zone tL to tP Ramp-up TL TS(max) Temperature Profile Feature tL Ramp-do Ramp-down TS(min) 25 Preheat tS time to peak temperature Time -- All temperature refer to topside of the package, measured on the package body surface -- If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead -- Recommended maximum paste thickness is 0.25mm (0.010 inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/19 PolySwitch(R) Temperature Indicators Surface Mount > setPTM Series Dimensions Product Dimensions A C A B B D Solder Pad Layout E D E F F F G C D G F H H D Marking Code varies by device. Marking Code varies by device. See Temperature Indication See Temperature Indication Characteristics Characteristics Table. Table. Device Dimension Part Number A inch B mm inch Solder Pad C mm inch D mm inch E mm F inch mm Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Max Max G H inch mm inch mm inch mm SETP0805-100-SE 0.079 0.087 2.00 2.20 0.017 0.024 0.43 0.60 0.051 0.059 1.30 1.50 0.010 0.030 0.25 0.75 0.003 0.076 0.039 1.00 0.047 1.20 0.059 1.50 SETP0805-100-CC 0.079 0.087 2.00 2.20 0.014 0.024 0.35 0.60 0.051 0.059 1.30 1.50 0.010 0.030 0.25 0.75 0.003 0.076 0.039 1.00 0.047 1.20 0.059 1.50 Part Ordering Number System SETP Packaging 0805 - 100 - SE - 2 Part Number Ordering Number Minimum Order Quantity Packaging Option Quantity Series SETP0805-100-SE RF4795-000 20,000 Tape & Reel 4,000 Size SETP0805-100-CC RF4819-000 20,000 Tape & Reel 4,000 Indicating Temp SE - Single End Cables CC - Cable with Type-C Plug on each end Tape & Reel Installation and Handling Guidelines * Operation of these devices beyond the stated maximum ratings could result in damage to the devices and lead to electrical arcing and/or fire. * These devices are intended to protect against the effects of temporary over-current or over-temperature conditions and are not intended to perform as protective devices where such conditions are expected to be repetitive or prolonged in duration. * Exposure to silicon-based oils, solvents, electrolytes, acids, and similar materials can adversely affect the performance of these PPTC devices. * These devices undergo thermal expansion under fault conditions, and thus shall be provided with adequate space and be protected against mechanical stresses. * Circuits with inductance may generate a voltage (L di/dt) above the rated voltage of the PPTC device. * Hand-soldering of PTC devices on boards is generally not recommended. Users shall define and verify this process if needed. * Consult Littelfuse when the device is to be applied with thermal processes other than reflow process on the circuit board, such as molding, encapsulation. User should evaluate molding materials used in the charging cable applications to ensure there are no adverse effect on the PTC devices. (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/19 PolySwitch(R) Temperature Indicators Surface Mount > setPTM Series Tape and Reel Specifications SETP0805-100-SE W 8.0 0.30 P0 4.0 0.10 P1 4.0 0.10 P2 2.0 0.05 A0 1.70 0.10 B0 2.45 0.10 B1 max. 4.35 D0 1.55 0.05 F 3.50 0.05 E1 1.75 0.10 E2 min. 6.25 T max. 0.3 T1 max. 0.1 K0 0.86 0.10 A max. 179 N min. 53.5 W1 9.5 0.5 W2 max. 15 Standard Pack Quantity: 4,000 pcs Minimum Order Quantity: 20,000 pcs Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. (c) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 11/04/19