PolySwitch® Temperature Indicators
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/19
Surface Mount > setP™ Series
setP™ Temperature Indicators for USB Type-C RoHS
The Littelfuse setP™ temperature indicator helps
protect USB Type-C plugs from overheating. It has been
designed to the unique specifications of USB Type-C and
is capable of helping to protect even the highest levels
of USB Power Delivery.
Description
Features
Temperature Indication Characteristics
Applications
• Compact footprint:
0805 mils (2.0 x 1.2mm)
• Sensitive and reliable
temperature indication
• SMD compatible with
reflow soldering process
• Zero IR loss contribution
• Easy part selection
• USB Power Delivery
compliant
• Protects systems with
100W or higher power
• Evaluated to UL 1434 and
Annex J of IEC 60730-1
Agency Approvals
• USB Type-C Plugs
• Chargers with captive
Type-C Cables
• USB-C to USB-C Cable
• Fast charging standards
and protocols compliant
with USB-C and USB-PD
Agency Agency File Number
E74889
J 50313999
Notes:
1. T ind = Typical indicating temperature: Typical temperature when device switches to indicating resistance (Rind)
2. Maximum post reflow resistance measured at 25°C in still air
3. Rind = Indicating resistance when device reaches the indicating temperature (Tind)
Part Number Marking Code Indicating Temperature (°C) Resistance (Ω)
Min Typical 1Max Max at 25°C 2Rind 3
SETP0805-100-SE T 90 100 110 12 35,000
SETP0805-100-CC V 90 100 110 6 35,000
PolySwitch® Temperature Indicators
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/19
Surface Mount > setP™ Series
Resistance Vs. Temperature Curve Environmental Specifications
Operating Temperature -40°C to +85°C
Maximum Device Surface
Temperature in Tripped State 110°C
Passive Aging +70°C 1000 hours
≤ R1max after test
Humidity Aging +60°C, 90% R.H., 1000 hours
≤ R1max after test
Thermal Shock MIL–STD–202, Method 215
No change -40°C to +85°C, 10 Cycles
Solvent Resistance MIL–STD–202, Method 215
No change
Vibration MIL–STD–883, Method 2007,
Condition A No change
Moisture Sensitivity Level Level 2a, J–STD–020
Physical Specifications
Terminal Material Solder-Plated Copper
(Solder Material: Matte Tin (Sn))
Lead Solderability Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3.
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
1.E+06
1.E+07
1.E+08
1.E+09
20 40 60 80 100120140
Resistance, (Ω)
Temperature, ºC
SETP0805-100-SE
SETP0805-100-CC
Soldering Parameters
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
PreheatPrehea
t
Ramp-up
R
amp-up
Ramp-downRamp-d
o
Critical Zone
tL to tP
Profile Feature Pb-Free Assembly
Average Ramp-Up Rate (TS(max) to TP)3°C/second max
Pre Heat:
Temperature Min (Ts(min))150°C
Temperature Max (Ts(max))200°C
Time (Min to Max) (ts)60 – 120 secs
Time Maintained
Above:
Temperature (TL)217°C
Temperature (tL)60 – 150 seconds
Peak / Classification Temperature (TP)260+0/-5 °C
Time within 5°C of actual peak Temperature
(tp)30 seconds max
Ramp-down Rate 2°C/second max
Time 25°C to peak Temperature (TP)8 minutes Max.
-- All temperature refer to topside of the package, measured on the package body surface
-- If reflow temperature exceeds the recommended profile, devices may not meet the
performance requirements
-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead
-- Recommended maximum paste thickness is 0.25mm (0.010 inch)
-- Devices can be cleaned using standard industry methods and solvents
-- Devices can be reworked using the standard industry practices
Notes:
1. Ihold = Hold current: maximum current device will pass without tripping in 20°C still air
2. Itrip = Trip current: minimum current at which the device will trip in 20°C still air
3. Vmax = Maximum voltage device can withstand without damage at rated current (Imax)
4. Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax)
5. Pd = Power dissipated from device when in the tripped state at 20°C still air
6. Rmin = Minimum resistance of device in initial (un-soldered) state
7. R 1max = Maximum resistance of device at 20°C measured one hour after tripping or reflow Soldering of 260°C for 20 seconds
(Values specified were determined using PCBs with 0.115in x 1.0in ounce copper traces)
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame
Electrical Characteristics
Part Number Ihold 1
(A)
Itrip 2
(A)
Vmax 3
(Vdc)
Imax 4
(A) Pd 5 typ. (W) Maximum Time-To-Trip Resistance
Current (A) Time (Sec.) Rmin 6 (Ω) R1max 7 (Ω)
SETP0805-100-SE 0.06 0.25 6 1 0.6 0.3 1 0.5 12
SETP0805-100-CC 0.075 0.30 6 1 0.6 0.3 5 0.5 6
PolySwitch® Temperature Indicators
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/19
Surface Mount > setP™ Series
Dimensions
Part Number
Device Dimension Solder Pad
A B C D E F G H
inch mm inch mm inch mm inch mm inch mm inch mm inch mm inch mm
Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Max Max
SETP0805-100-SE 0.079 0.087 2.00 2.20 0.017 0.024 0.43 0.60 0.051 0.059 1.30 1.50 0.010 0.030 0.25 0.75 0.003 0.076 0.039 1.00 0.047 1.20 0.059 1.50
SETP0805-100-CC 0.079 0.087 2.00 2.20 0.014 0.024 0.35 0.60 0.051 0.059 1.30 1.50 0.010 0.030 0.25 0.75 0.003 0.076 0.039 1.00 0.047 1.20 0.059 1.50
A
Marking Code varies by device.
See Temperature Indication
Characteristics Table.
C
D
B F F
G
DE
H
Solder Pad LayoutProduct Dimensions
Part Ordering Number System Packaging
Part Number Ordering
Number
Minimum
Order
Quantity
Packaging
Option Quantity
SETP0805-100-SE RF4795-000 20,000 Tape & Reel 4,000
SETP0805-100-CC RF4819-000 20,000 Tape & Reel 4,000
Installation and Handling Guidelines
• Operation of these devices beyond the stated maximum
ratings could result in damage to the devices and lead to
electrical arcing and/or fire.
• These devices are intended to protect against the effects
of temporary over-current or over-temperature conditions
and are not intended to perform as protective devices
where such conditions are expected to be repetitive or
prolonged in duration.
• Exposure to silicon-based oils, solvents, electrolytes, acids,
and similar materials can adversely affect the performance
of these PPTC devices.
• These devices undergo thermal expansion under fault
conditions, and thus shall be provided with adequate space
and be protected against mechanical stresses.
• Circuits with inductance may generate a voltage (L di/dt)
above the rated voltage of the PPTC device.
• Hand-soldering of PTC devices on boards is generally not
recommended. Users shall define and verify this process if
needed.
• Consult Littelfuse when the device is to be applied with
thermal processes other than reflow process on the
circuit board, such as molding, encapsulation. User should
evaluate molding materials used in the charging cable
applications to ensure there are no adverse effect on the
PTC devices.
A
Marking Code varies by device.
See Temperature Indication
Characteristics Table.
C
D
B F F
G
DE
H
SETP 0805 - 100 - SE
Series
Size
Indicating Temp
SE - Single End Cables
CC - Cable with Type-C
Plug on each end
Tape & Reel
- 2
PolySwitch® Temperature Indicators
© 2019 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/04/19
Surface Mount > setP™ Series
Tape and Reel Specifications
Standard Pack Quantity: 4,000 pcs
Minimum Order Quantity: 20,000 pcs
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the
suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used
in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
SETP0805-100-SE
W8.0 ± 0.30
P04.0 ± 0.10
P14.0 ± 0.10
P22.0 ± 0.05
A01.70 ± 0.10
B02.45 ± 0.10
B1 max. 4.35
D01.55 ± 0.05
F 3.50 ± 0.05
E11.75 ± 0.10
E2 min. 6.25
T max. 0.3
T1 max. 0.1
K00.86 ± 0.10
A max. 179
N min. 53.5
W19.5 ± 0.5
W2 max. 15
