Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 TPS7A4501-SP Low-Dropout Voltage Regulator 1 Features 2 Applications * * * * * 1 * * * * * * * * * * QMLV Qualified SMD 5962-12224 Adjustable Output from 1.21 to 20 V Optimized for Fast-Transient Response High Output Voltage Accuracy: 1.15% at 25C (Typical) Dropout Voltage: 200 mV With ILOAD = 750 mA (Typical) Low Noise: 50 VRMS (10 Hz to 100 kHz) for VOUT =5V High Ripple Rejection: 68 dB at 1 kHz 1-mA Quiescent Current No Protection Diodes Needed Stable With Ceramic Output Capacitor Reverse-Battery Protection Reverse Current Protection 5962-1222402VHA: - Wide Vin 2.3 to 20 V - Output Current: 750 mA 5962R1222403VXC: - Wide Vin 2.9 to 20 V - Output Current: 1.5 A - Thermally-Enhanced HKU Package - Radiation Hardness Assurance (RHA) up to Total Ionizing Dose (TID) 100 krad (Si) - Exhibits Low Dose Rate Sensitivity But Remains Within the Pre-Radiation Electrical Limits at 100 krad Total Dose Level, as Allowed by MIL-STD-883, TM1019 RF Components VCOs, Receivers, ADCs, Amplifiers and Clock Distributions Clean Analog Supply Requirements Available in Military (-55C to 125C) Temperature Range Engineering Evaluation (/EM) Samples are Available * * * (1) These units are intended for engineering evaluation only. They are processed to a non-compliant flow (for example, no burn-in, and so forth) and are tested to a temperature rating of 25C only. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not specified for performance over the full MIL specified temperature range of -55C to 125C or operating life. 3 Description The TPS7A4501-SP is a low-dropout (LDO) regulator optimized for fast-transient response. The 59621222402VHA can supply 750 mA of output current with a dropout voltage of 300 mV. The 5962R1222403VXC can supply 1.5 A of output current with a dropout voltage of 320 mV. Quiescent current is well controlled; it does not rise in dropout, as with many other regulators. In addition to fast transient response, the TPS7A4501-SP regulator has very-low output noise, which makes it ideal for sensitive RF supply applications. Device Information(1) PART NUMBER PACKAGE TPS7A4501-SP BODY SIZE (NOM) CFP [U] (10) 6.35 mm x 6.35 mm CFP [HKU] (10) 7.02 mm x 6.86 mm KGD N/A(2) (1) For all available packages, see the orderable addendum at the end of the data sheet. (2) Bare die in waffle pack SPACE Dropout Voltage vs Temperature VADJ Radiation Drift Curve 1.26 600 Iout = 1 mA Iout = 100 mA Iout = 0.5 A Iout = 0.75 A HDR Bias LDR Bias Iout = 1 A Iout = 1.25 A Iout = 1.5 A VIN = 2.9 V, ILOAD = 1.5 A 1.24 400 VADJ (V) Dropout Voltage (mV) 500 300 1.22 1.2 200 1.18 100 0 -75 1.16 -25 25 75 TA Free Air Temperature (qC) 125 D001 0 25 50 75 Total Ionizing Dose (TID), krad (Si) 100 D021 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description (continued)......................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 5 7.1 7.2 7.3 7.4 7.5 5 5 5 5 Absolute Maximum Ratings ...................................... ESD Ratings ............................................................ Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics (5962-1222402VHA and 5962-1222402V9A) .................................................... 7.6 Electrical Characteristics (5962R1222403VXC and 5962R1222403V9A)................................................... 7.7 Typical Characteristics .............................................. 8 6 7 9 Detailed Description ............................................ 13 8.1 Overview ................................................................. 13 8.2 Functional Block Diagram ....................................... 13 8.3 Feature Description................................................. 13 8.4 Device Functional Modes........................................ 16 9 Application and Implementation ........................ 17 9.1 Application Information............................................ 17 9.2 Typical Application .................................................. 17 10 Power Supply Recommendations ..................... 21 11 Layout................................................................... 21 11.1 Layout Guidelines ................................................. 21 11.2 Layout Example .................................................... 21 11.3 Thermal Considerations ........................................ 22 12 Device and Documentation Support ................. 24 12.1 12.2 12.3 12.4 12.5 Device Support...................................................... Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 24 24 24 24 24 13 Mechanical, Packaging, and Orderable Information ........................................................... 24 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (October 2014) to Revision D Page * Replaced the Dissipation Ratings table with the Thermal Information table .......................................................................... 5 * Added 5962-1222402V9A to Electrical Characteristics (5962-1222402VHA and 5962-1222402V9A).................................. 6 * Added new part 5962R1222403V9A to Electrical Characteristics (5962R1222403VXC and 5962R1222403V9A) ............. 7 Changes from Revision B (October 2014) to Revision C Page * Removed VDO, dropout voltage with test condition VOUT = 2.4 V ........................................................................................... 6 * Added thermal shutdown temperature .................................................................................................................................. 6 * Added thermal shutdown temperature .................................................................................................................................. 8 * Added thermal shutdown information to Protection Features ............................................................................................. 15 Changes from Revision A (January 2014) to Revision B Page * Added limits for the new device type, 5962R1222 ................................................................................................................. 1 * Added Handling Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1 * Added thermal information for the HKU package .................................................................................................................. 5 Changes from Original (December 2013) to Revision A * 2 Page Changed Product Status from Product Preview to Production Data...................................................................................... 1 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 5 Description (continued) Output voltage range is from 1.21 to 20 V. The TPS7A4501-SP is stable with output capacitance as low as 10 F. Small ceramic capacitors can be used without the necessary addition of ESR, as is common with other regulators. Internal protection circuitry includes reverse-battery protection, current limiting, thermal limiting, and reverse-current protection. The device is available as an adjustable device with a 1.21-V reference voltage. The 5962-1222402VHA is available in 10-pin CFP (U) package and 5962R1222403VXC is available in thermallyenhanced 10-pin CFP (HKU) package. Known good die (KGD) option is available for both 5962-1222402V9A for non-RHA version and 5962R1222403V9A for RHA. 6 Pin Configuration and Functions U Package 10-Pin CFP Top View HKU Package 10-Pin CFP Top View GND SHDN 1 10 IN 2 9 SENSE/ADJ IN 3 8 OUT IN 4 7 OUT NC 5 6 OUT GND SHDN 1 10 IN 2 9 SENSE/ADJ IN 3 8 OUT IN 4 7 OUT NC 5 6 OUT Thermal Vias Pin Functions PIN NAME SHDN NO. I/O 1 I Shutdown. SHDN is used to put the TPS7A4501 regulator into a low-power shutdown state. The output is off when SHDN is pulled low. SHDN can be driven by 5-V logic, 3-V logic, or open-collector logic with a pullup resistor. The pullup resistor is required to supply the pullup current of the open-collector gate, normally several microamperes, and SHDN current, typically 3 A. If unused, the user must connect SHDN to VIN. The device is in the low-power shutdown state if SHDN is not connected. I Input. Power is supplied to the device through IN. A bypass capacitor is required on this pin if the device is more than six inches away from the main input filter capacitor. In general, the output impedance of a battery rises with frequency, so it is advisable to include a bypass capacitor in battery-powered circuits. A bypass capacitor (ceramic) in the range of 1 to 10 F is sufficient. The TPS7A4501 regulator is designed to withstand reverse voltages on IN with respect to ground and on OUT. In the case of a reverse input, which can happen if a battery is plugged in backwards, the device functions as if there is a diode in series with its input. No reverse current flows into the regulator, and no reverse voltage appears at the load. The device protects both itself and the load. 2 3 IN 4 NC 5 DESCRIPTION NC This pin is not connected to any internal circuitry. It can be left floating or tied to VIN or GND. 6 OUT 7 O Output. The output supplies power to the load. To prevent oscillations, use a minimum output capacitor (ceramic) of 10 F. Applications with large transient loads to limit peak voltage transients require larger output capacitors. Adjust. This is the input to the error amplifier. ADJ is internally clamped to 7 V. It has a bias current of 3 A that flows into the pin. ADJ voltage is 1.21 V referenced to ground, and the output voltage range is 1.21 to 20 V. 8 ADJ 9 I GND 10 -- Ground Thermal Vias (1) -- -- The exposed thermal vias of the HKU package should be connected to a wide ground plane for effective heat dissipation. Refer to Figure 30 and Figure 31 for the typical footprint of the HKU package. (1) For HKU package Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback 3 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com Bare Die Information DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL 15 mils Silicon with backgrind Floating BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS TiW/AlCu2 1627 nm Bond Pad Coordinates in Microns (1) (1) 4 DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX SHDN 1 1729.25 55.5 1879.25 205.5 IN 2 1037.25 875 1187.25 1025 IN 3 1460.75 1255.5 1610.75 1405.5 IN 4 1037.75 1384.5 1187.75 1534.5 OUT 5 774.25 1634.75 924.25 1784.75 OUT 6 675.25 1166 825.25 1316 OUT 7 345.5 1299.25 495.5 1449.25 SENSE/ADJ 8 55.5 213 205.5 363 GND 9 244 17.5 394 167.5 Substrate is not to be connected. Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) VIN Input voltage (1) MIN MAX IN -22 22 OUT -22 22 Input-to-output differential (2) -22 22 ADJ -7 7 SHDN -22 UNIT V 22 Tlead Maximum lead temperature (10-s soldering time) 260 C TJ Maximum operating junction temperature 150 C Tstg Storage temperature 150 C (1) (2) -65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Absolute maximum input-to-output differential voltage cannot be achieved with all combinations of rated IN pin and OUT pin voltages. With the IN pin at 22 V, the OUT pin may not be pulled below 0 V. The total measured voltage from IN to OUT can not exceed 22 V. 7.2 ESD Ratings V(ESD) (1) Electrostatic discharge VALUE UNIT 4000 V Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN TJ Operating junction temperature NOM MAX UNIT 125 C -55 7.4 Thermal Information TPS7A4501-SP THERMAL METRIC (1) U (CFP) HKU (CFP) 10 PINS 10 PINS UNIT RJA Junction-to-ambient thermal resistance 86.6 51.9 C/W RJC(bot) Junction-to-case (bottom) thermal resistance (2) 10.3 6.6 C/W RJB Junction-to-board thermal resistance 35.6 31.5 C/W JT Junction-to-top characterization parameter 31.7 5.42 C/W JB Junction-to-board characterization parameter 53.5 31 C/W (1) (2) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback 5 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com 7.5 Electrical Characteristics (5962-1222402VHA and 5962-1222402V9A) over operating junction temperature range TJ = -55C to 125C (unless otherwise noted) PARAMETER TEST CONDITIONS 2.3 ILOAD = 750 mA Full range 2.1 2.5 VIN = 2.21 V, ILOAD = 1 mA 25C 1.196 1.21 1.224 VIN = 2.5 to 20 V, ILOAD = 1 to 750 mA Full range 1.174 1.21 1.246 Line regulation (2) VIN = 2.21 to 20 V, ILOAD = 1 mA Full range 1.5 4.5 Load regulation (2) VIN = 2.5 V, ILOAD = 1 to 750 mA ADJ pin voltage (2) (3) (4) ILOAD = 1 mA Dropout voltage (VOUT = 2.4 V) (5) ILOAD = 100 mA (6) ILOAD = 500 mA ILOAD = 750 mA (8) IADJ GND pin current (6) VIN = 2.5 V (7) Output voltage noise ADJ pin bias current (2) 25C 2 Full range 8 18 25C 0.02 Full range 0.085 Full range 0.17 Full range 0.20 Full range 0.21 1.5 ILOAD = 1 mA Full range 1.1 1.6 ILOAD = 100 mA Full range 3.3 7 ILOAD = 500 mA Full range 15 30 ILOAD = 750 mA Full range 28 45 COUT = 22 F, ILOAD = 750 mA, VIN = 7 V, VOUT= 5V BW = 10 Hz to 100 kHz 25C 50 25C 3 7 0.9 2 VOUT = ON to OFF Full range V SHDN = 0 V 25C 0.01 1 V SHDN = 20 V 25C 3 20 Quiescent current in shutdown VIN = 6 V, V SHDN = 0 V 25C 0.01 1 Ripple rejection (10) VIN - VOUT = 1.5 V (avg), VRIPPLE = 0.5 VP-P, RIPPLE = 120 Hz, ILOAD = 0.75 A 25C 60 68 VIN = 7 V, VOUT = 0 V 25C 1.7 1.9 VIN = 2.5 V Full range 1.6 1.9 VIN = -20 V, VOUT = 0 V Full range Reverse output current (11) VOUT = 1.21 V, VIN < 1.21 V 25C TSD Thermal shutdown temperature 0.15 0.75 300 175 mA VRMS Full range Input reverse leakage current V 0.33 1 IRO mV 0.27 Full range IIL mV 0.27 25C Current limit (10) V 0.10 0.13 25C ILIMIT V 0.07 25C VOUT = OFF to ON SHDN pin current UNIT 0.05 ILOAD = 0 mA, (9) Shutdown threshold I SHDN MAX 1.9 VADJ eN TYP (1) 25C Minimum input voltage (2) IGND MIN ILOAD = 500 mA VIN VDO TJ A V A A dB A 300 A 500 A C (1) Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the application and configuration and may vary over time. Typical values are not ensured on production material. (2) The TPS7A4501 is tested and specified for these conditions with the ADJ pin connected to the OUT pin. (3) Dropout voltages are limited by the minimum input voltage specification under some output voltage/load conditions. (4) Operating conditions are limited by maximum junction temperature. The regulated output voltage specification does not apply for all possible combinations of input voltage and output current. When operating at maximum input voltage, limit the output current range. When operating at maximum output current, limit the input voltage range. (5) Dropout voltage is the minimum input-to-output voltage differential needed to maintain regulation at a specified output current. In dropout, the output voltage is equal to: VIN - VDROPOUT. (6) To satisfy requirements for minimum input voltage, the TPS7A4501 is tested and specified for these conditions with an external resistor divider (two 4.12-k resistors) for an output voltage of 2.4 V. The external resistor divider adds a 300-A DC load on the output. (7) GND pin current is tested with VIN = 2.5 V and a current source load. The GND pin current decreases at higher input voltages. (8) Parameter is specified by bench characterization and is not tested in production. (9) ADJ pin bias current flows into the ADJ pin. (10) Parameter is specified by characterization for KGD and is not tested in production. (11) Reverse output current is tested with the IN pin grounded and the OUT pin forced to the rated output voltage. This current flows into the OUT pin and out the GND pin. 6 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 7.6 Electrical Characteristics (5962R1222403VXC and 5962R1222403V9A) Over operating junction temperature range TJ = -55C to 125C (unless otherwise noted) PARAMETER VIN Minimum input voltage VADJ ADJ pin voltage (2) TEST CONDITIONS (2) (3) ILOAD = 1.5 A Full range VIN = 2.9 to 20 V, ILOAD = 1 mA to 1.5 A Full range Line regulation (2) VIN = 2.9 to 20 V, ILOAD = 1 mA Full range Load regulation (2) VIN = 2.9 V, ILOAD = 1 mA to 1.5 A (4) ILOAD = 1 mA ILOAD = 100 mA ILOAD = 500 mA VDO Dropout voltage (VOUT = 19.3 V ) (5) (6) ILOAD = 750 mA ILOAD = 1 A ILOAD = 1.25 A ILOAD = 1.5 A (1) (2) (3) (4) (5) (6) TJ 25C MIN 1.174 TYP (1) MAX 2.1 2.9 1.21 1.246 2.5 6.5 2 10 Full range 25C 18 0.08 Full range 25C 0.34 Full range 0.40 0.40 0.40 V 0.45 0.65 0.40 Full range 25C 0.32 0.62 Full range 25C mV 0.60 0.30 Full range 25C V mV 0.58 0.25 Full range 25C V 0.40 0.14 Full range 25C UNIT 0.50 0.68 0.45 0.60 0.75 Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the application and configuration and may vary over time. Typical values are not ensured on production material. The TPS7A4501 is tested and specified for these conditions with the ADJ pin connected to the OUT pin. Dropout voltages are limited by the minimum input voltage specification under some output voltage/load conditions. Operating conditions are limited by maximum junction temperature. The regulated output voltage specification does not apply for all possible combinations of input voltage and output current. When operating at maximum input voltage, limit the output current range. When operating at maximum output current, limit the input voltage range. Dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specified output current. In dropout, the output voltage is equal to: VIN - VDROPOUT. To satisfy requirements for minimum input voltage, the TPS7A4501 is tested and specified for these conditions with an external resistor divider (one 4.12-k resistor and one 61.9-k) for an output voltage of 19.3 V. The external resistor divider adds a 300-A DC load on the output. Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback 7 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com Electrical Characteristics (5962R1222403VXC and 5962R1222403V9A) (continued) Over operating junction temperature range TJ = -55C to 125C (unless otherwise noted) PARAMETER GND pin current VIN = 2.9 V IGND eN (9) (7) (8) Output voltage noise ADJ pin bias current (2) IADJ TEST CONDITIONS I SHDN SHDN pin current Quiescent current in shutdown Ripple rejection (12) 1.5 ILOAD = 1 mA Full range 1.1 1.6 ILOAD = 100 mA Full range 3.3 7 ILOAD = 500 mA Full range 8.5 30 ILOAD = 750 mA Full range 15 45 ILOAD = 1 A Full range 25 50 ILOAD = 1.25 A Full range 36 80 ILOAD = 1.5 A Full range 53 105 COUT = 22 F, ILOAD = 1.5 A, VIN = 5.5 V, VOUT = 5V BW = 10 Hz to 100 kHz 25C 50 25C Full range 3 7 5.5 15 0.9 2 Full range VOUT = ON to OFF Full range V SHDN = 0 V Full range 0.01 1 V SHDN = 20 V Full range 3 20 VIN = 6 V, V SHDN = 0 V Full range 0.01 10 15 50 0.15 VIN = 6 V, V SHDN = 0 V, Post 100kRads (si), TJ = 25C 25C (11) 0.75 VIN - VOUT = 1.5 V (avg), VRIPPLE = 0.5 VP-P, RIPPLE = 120 Hz, ILOAD = 0.75 A 25C 60 68 Full range 58 63 VIN - VOUT = 1.5 V (avg), VRIPPLE = 0.5 VP-P, fRIPPLE = 120 Hz, ILOAD = 1.5 A 25C 50 60 Full range 44 52 VIN = 7 V, VOUT = 0 V Full range 1.7 1.9 VIN = 2.9 V Full range 1.6 1.9 Input reverse leakage current VIN = -20 V, VOUT = 0 V Full range IRO Reverse output current (13) VOUT = 1.21 V, VIN < 1.21 V Full range TSD Thermal shutdown temperature 300 175 UNIT mA VRMS VOUT = OFF to ON IIL 8 MAX 1 Current limit (12) (8) (9) (10) (11) (12) (13) TYP (1) Full range ILIMIT (7) MIN ILOAD = 0 mA (10) Shutdown threshold TJ A V A A dB A 300 A 500 A C To satisfy requirements for minimum input voltage, the TPS7A4501 is tested and specified for these conditions with an external resistor divider (two 4.12-k resistors) for an output voltage of 2.4 V. The external resistor divider adds a 300-A DC load on the output. GND pin current is tested with VIN = 2.9 V and a current source load. The GND pin current decreases at higher input voltages. Parameter is specified by bench characterization and is not tested in production. ADJ pin bias current flows into the ADJ pin. This maximum limit applies to SMD 5962R1222403VXC post 100kRads (Si) test at 25C. Parameter is specified by characterization for KGD and is not tested in production. Reverse output current is tested with the IN pin grounded and the OUT pin forced to the rated output voltage. This current flows into the OUT pin and out the GND pin. Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 7.7 Typical Characteristics 480 600 500 360 Dropout Voltage (mV) Dropout Voltage (mV) TA = 25qC TA = 125qC TA qC 240 120 Iout = 1 mA Iout = 100 mA Iout = 0.5 A Iout = 0.75 A Iout = 1 A Iout = 1.25 A Iout = 1.5 A 400 300 200 100 0 0 0.25 0.5 0.75 1 Output Current (A) 1.25 0 -75 1.5 -25 25 75 TA Free Air Temperature (qC) D005 125 D001 VOUT = 2.4 V Figure 1. Dropout Voltage vs Output Current Figure 2. Dropout Voltage vs Temperature 1.5 1.23 1.4 1.225 1.22 1.2 Output Voltage (V) Quiescent Current (mA) 1.3 1.1 1 0.9 0.8 1.215 1.21 1.205 1.2 0.7 1.195 0.6 0.5 -50 -25 0 25 50 75 Free-Air Temperature (qC) VIN = 6 V 100 1.19 -75 125 -50 -25 0 25 50 75 TA Free Air Temperature (qC) D006 IOUT = 0 A VSHDN = VIN IOUT = 1 mA Figure 3. Quiescent Current vs Temperature 125 D020 VIN = 2.9 V Figure 4. Output Voltage vs Temperature 1.2 80 Iout = 0.5 A Iout = 750 mA Iout = 1.5 A Ground Current (mA) 1 Quiescent Current (mA) 100 0.8 0.6 0.4 Iout = 1 A Iout = 1.25 A 60 40 20 0.2 0 0 0 2 4 TJ = 25C 6 8 10 12 Input Voltage (V) 14 ROUT = 4.3 k 16 18 0 2 D021 VSHDN = VIN Figure 5. Quiescent Current vs Input Voltage Copyright (c) 2013-2015, Texas Instruments Incorporated 20 TJ = 25C VOUT = 1.21 V 4 6 Input Voltage (V) 8 10 D002 VSHDN = VIN Figure 6. Ground Current vs Input Voltage Submit Documentation Feedback 9 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com Typical Characteristics (continued) 10 55 IOUT = 10 mA IOUT = 100 mA IOUT = 300 mA 9 45 Ground Current (mA) Ground Current (mA) 8 50 7 6 5 4 3 2 40 35 30 25 20 15 10 1 5 0 0 0 1 2 TJ = 25C 3 4 5 6 Input Voltage (V) 7 VSHDN = VIN 8 9 10 0 0.2 0.4 D022 VOUT = 1.21 V 0.6 0.8 1 Output Current (A) 1.2 1.4 1.6 D003 VIN = VOUT(nom) + 1 Figure 7. Ground Current vs Input Voltage Figure 8. Ground Current vs Output Current 0.2 2.5 SHDN Input Current (PA) SHDN Input Current (PA) 2.25 0.15 0.1 0.05 2 1.75 1.5 1.25 1 0.75 0.5 0.25 0 -75 0 -50 -25 0 25 50 75 TA Free Air Temperature (qC) 100 125 0 2 4 D011 6 8 10 12 14 SHDN Input Voltage (V) 16 18 20 D012 VSHDN = 0 V Figure 10. SHDN Input Current vs SHDN Input Voltage 1 0.8 0.8 SHDN Input Current (A) SHDN Input Current (A) Figure 9. SHDN Input Current vs Temperature 1 0.6 0.4 0.2 0 -75 -50 -25 0 25 50 75 TA Free Air Temperature (C) 100 125 Figure 11. SHDN Threshold (Off To On) vs Temperature Submit Documentation Feedback 0.4 0.2 0 -75 -50 -25 0 25 50 75 TA Free Air Temperature (C) D013 IOUT = 1 mA 10 0.6 100 125 D014 IOUT = 1 mA Figure 12. SHDN Threshold (On to Off) vs Temperature Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 Typical Characteristics (continued) 3.5 5 TA = -40qC TA = 25qC TA = 125qC 3 2.5 Current Limit (A) ADJ Bias Current (A) 4 3 2 2 1.5 1 1 0.5 0 0 -75 -50 -25 0 25 50 75 TA Free Air Temperature (C) 100 0 125 D015 2 4 6 8 10 12 14 16 Input/Output Differential Voltage (V) 18 20 D016 VOUT = 100 mV Figure 13. ADJ Bias Current vs Temperature Figure 14. Current Limit vs Input/Output Differential Voltage 5 Reverse Output Current (mA) 12 Current Limit (A) 4 3 2 1 0 -50 10 8 6 4 2 0 -2 -25 VIN = 7 V 0 25 50 75 Free-Air Temperature (qC) 100 125 0 2 D017 VOUT = 0 V 4 6 Output Voltage (V) 8 D007 TJ = 25C VIN = 0 V Current flows into OUT pin Figure 15. Current Limit vs Temperature 10 VOUT = VADJ Figure 16. Reverse Output Current vs Output Voltage 1000 80 70 Ripple Rejection (dB) Current Limit (A) 800 600 400 60 50 40 30 20 200 10 0 -75 -50 VIN = 0 V -25 0 25 50 75 TA Free Air Temperature (C) 100 125 100 D008 VOUT = 1.21 V Figure 17. Reverse Output Current vs Temperature Copyright (c) 2013-2015, Texas Instruments Incorporated 0 10 1k 10k Frequency (Hz) VIN = 2.7 V CIN = 0 IOUT = 750 mA VRipple = 0.05 VPP 100k 1M D010 COUT = 10 F (ceramic) TA = 25C Figure 18. Ripple Rejection vs Frequency Submit Documentation Feedback 11 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com Typical Characteristics (continued) 10 750 mA 1.5 A Load Regulation (mV) 8 6 4 2 0 -2 -75 -50 -25 0 25 50 75 TA)UHH$LU7HPSHUDWXUH & 100 125 D004 IOUT = 750 mA Figure 19. Load Regulation vs Temperature 12 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 8 Detailed Description 8.1 Overview The TPS7A4501-SP is a 1.5-A LDO regulator optimized for fast-transient response. The devices are capable of supplying 1.5 A at a dropout voltage of 320 mV. The low operating quiescent current (1 mA) drops to less than 50 A in shutdown. In addition to the low quiescent current, the TPS7A4501-SP regulators incorporate several protection features that make them ideal for use in battery-powered systems. The devices are protected against both reverse input and reverse output voltages. In battery-backup applications where the output can be held up by a backup battery when the input is pulled to ground, the TPS7A4501-SP functions as if it has a diode in series with its output and prevents reverse current flow. Additionally, in dual-supply applications where the regulator load is returned to a negative supply, the output can be pulled below ground by as much as (20 V - VIN) and still allow the device to start and operate. 8.2 Functional Block Diagram IN Reverse Current Protection Pass Element SHDN Current Limit OUT Error Amplifier + Thermal Overload SENSE/ADJ + Voltage Reference Reverse Voltage Protection GND 8.3 Feature Description 8.3.1 Adjustable Operation The adjustable TPS7A4501-SP has an output voltage range of 1.21 to 20 V. The output voltage is set by the ratio of two external resistors as shown in Figure 20. The device maintains the voltage at the ADJ pin at 1.21 V referenced to ground. The current in R1 is then equal to (1.21 V/R1), and the current in R2 is the current in R1 plus the ADJ pin bias current. The ADJ pin bias current, 3 A at 25C, flows through R2 into the ADJ pin. Calculate the output voltage using the formula shown in Figure 20. The value of R1 should be less than 4.17 k to minimize errors in the output voltage caused by the ADJ pin bias current. Note that in shutdown, the output is turned off, and the divider current is zero. Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback 13 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com Feature Description (continued) IN VIN VOUT OUT R2 TPS7A4501 ADJ GND R1 Figure 20. Adjustable Operation Schematic The adjustable device is tested and specified with the ADJ pin tied to the OUT pin for an output voltage of 1.21 V. Specifications for output voltages greater than 1.21 V are proportional to the ratio of the desired output voltage to 1.21 V: VOUT / 1.21 V. For example, load regulation for an output current change of 1 mA to 1.5 A is -3 mV (typical) at VOUT = 1.21 V. At VOUT = 5 V, load regulation is: (5 V / 1.21 V)(-3 mV) = -12.4 mV (1) 8.3.2 Fixed Operation The TPS7A4501-SP can be used in a fixed-voltage configuration. Connect the SENSE/ADJ pin to OUT for proper operation. Figure 21 shows an example of this for a fixed output voltage of 1.21 V. During fixed voltage operation, the SENSE/ADJ pin can be used for a Kelvin connection if routed separately to the load. This allows the regulator to compensate for voltage drop across parasitic resistances (RP) between the output and the load. This compensation becomes more crucial with higher-load currents. RP IN OUT TPS7A4501 VIN SHDN SENSE Load GND RP Figure 21. Kelvin Sense Connection 8.3.3 Overload Recovery Like many IC power regulators, the TPS7A4501-SP has safe operating area protection. The safe area protection decreases the current limit as input-to-output voltage increases and keeps the power transistor inside a safe operating region for all values of input-to-output voltage. The protection is designed to provide some output current at all values of input-to-output voltage up to the device breakdown. When power is first turned on, as the input voltage rises, the output follows the input, allowing the regulator to start up into very-heavy loads. During start up, as the input voltage is rising, the input-to-output voltage differential is small, allowing the regulator to supply large output currents. With a high input voltage, a problem can occur wherein removal of an output short does not allow the output voltage to recover. Other regulators also exhibit this phenomenon, so it is not unique to the TPS7A4501-SP. 14 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 Feature Description (continued) The problem occurs with a heavy output load when the input voltage is high and the output voltage is low. Common situations occur immediately after the removal of a short circuit or when the shutdown pin is pulled high after the input voltage has already been turned on. The load line for such a load may intersect the output current curve at two points. If this happens, there are two stable output operating points for the regulator. With this double intersection, the input power supply may need to be cycled down to 0 and brought up again to make the output recover. 8.3.4 Output Voltage Noise The TPS7A4501-SP regulator is designed to provide low output voltage noise over the 10-Hz to 100-kHz bandwidth while operating at full load. Output voltage noise is typically 50 V/Hz over this frequency bandwidth for the TPS7A4501-SP. For higher output voltages (generated by using a resistor divider), the output voltage noise is gained up accordingly. Higher values of output voltage noise may be measured when care is not exercised with regard to circuit layout and testing. Crosstalk from nearby traces can induce unwanted noise onto the output of the TPS7A4501-SP. The user must also consider power-supply ripple rejection; the TPS7A4501-SP regulator does not have unlimited power-supply rejection and passes a small portion of the input noise through to the output. RMS Noise 100 Hz to 100 kHz RMS Noise 10 Hz to 100 kHz 50.6340143 50.0721519 Noise (V/Hz) vs Frequency Noise 1.0000E+01 1.0000E+00 Noise (V/Hz) 1.0000E-01 1.0000E-02 1.00E+01 1.00E+02 1.00E+03 1.00E+04 1.00E+05 Figure 22. Output Noise Plot, VIN = 7 V, VOUT = 5 V At 750 mA , COUT = 22 F Tantalum Capacitor 8.3.5 Protection Features The TPS7A4501-SP regulator incorporates several protection features, which makes the regulator ideal for use in battery-powered circuits. In addition to the normal protection features associated with monolithic regulators, such as current limiting and thermal limiting, the device is protected against reverse input voltages, reverse output voltages, and reverse voltages from output to input. Current limit protection and thermal overload protection are intended to protect the device against current overload conditions at the output of the device. For normal operation, the junction temperature should not exceed 125C. TPS7A4501-SP incorporates thermal protection which disables the output when the junction temperature rises approximately 175C, allowing the device to cool. The input of the device withstands reverse voltages of 20 V. Current flow into the device is limited to less than 1 mA (typically less than 100 A), and no negative voltage appears at the output. The device protects both itself and the load. This provides protection against batteries that can be plugged in backward. Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback 15 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com Feature Description (continued) The output of the TPS7A4501-SP can be pulled below ground without damaging the device. If the input is left open circuit or grounded, the output can be pulled below ground by 20 V. The output acts like an open circuit; no current flows out of the pin. If the input is powered by a voltage source, the output sources the short-circuit current of the device and protects itself by thermal limiting. In this case, grounding the SHDN pin turns off the device and stops the output from sourcing the short-circuit current. The ADJ pin of the adjustable device can be pulled above or below ground by as much as 7 V without damaging the device. If the input is left open circuit or grounded, the ADJ pin acts like an open circuit when pulled below ground and like a large resistor (typically 5 k) in series with a diode when pulled above ground. In situations where the ADJ pin is connected to a resistor divider that would pull the ADJ pin above its 7-V clamp voltage if the output is pulled high, the ADJ pin input current must be limited to less than 5 mA. For example, a resistor divider is used to provide a regulated 1.5-V output from the 1.21-V reference when the output is forced to 20 V. Choose the top resistor of the resistor divider so as to limit the current into the ADJ pin to <5 mA when the ADJ pin is at 7 V. The 13-V difference between OUT and ADJ divided by the 5-mA maximum current into the ADJ pin yields a minimum top resistor value of 2.6 k. In circuits where a backup battery is required, several different input/output conditions can occur. The output voltage may be held up while the input is either pulled to ground, pulled to some intermediate voltage, or is left open circuit. When the IN pin of the TPS7A4501-SP is forced below the OUT pin or the OUT pin is pulled above the IN pin, input current typically drops to less than 2 A. This can happen if the input of the device is connected to a discharged (low-voltage) battery and the output is held up by either a backup battery or a second regulator circuit. The state of the SHDN pin has no effect on the reverse output current when the output is pulled above the input. 8.4 Device Functional Modes Table 1 shows the device modes. Table 1. Device Modes SHDN 16 Submit Documentation Feedback DEVICE STATE H Regulated voltage L Shutdown Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The TPS7A4501-SP regulator has very-low output noise, which makes it ideal for sensitive RF supply applications. 9.2 Typical Application This section highlights some of the design considerations when implementing this device in various applications. IN VIN = 5 V + C1 10 PF 2.5 V at 1 A OUT R2 4.22 k TPS7A4501-SP C2 10 PF ADJ SHDN R1 4k GND Figure 23. Adjustable Output Voltage Operation 9.2.1 Design Requirements Table 2 shows the design requirements. Table 2. Design Parameters DESIGN PARAMETER Input voltage (VIN) EXAMPLE VALUE 5V Output voltage (VOUT) 2.5 V Output current (IOUT) 0 to 1 A Load regulation 1% 9.2.2 Detailed Design Procedure The TPS7A4501-SP has an adjustable output voltage range of 1.21 to 20 V. The output voltage is set by the ratio of two external resistors, R1 and R2, as shown in Figure 23. The device maintains the voltage at the ADJ pin at 1.21 V referenced to ground. The current in R1 is then equal to (1.21 V/R1), and the current in R2 is the current in R1 plus the ADJ pin bias current. The ADJ pin bias current, 3 A at 25C, flows through R2 into the ADJ pin. Calculate the output voltage using Equation 2. R2 VOUT = 1.21V(1 + ) + IADJ R2 (2) R1 The value of R1 should be less than 4.17 k to minimize errors in the output voltage caused by the ADJ pin bias current. Note that in shutdown the output is turned off, and the divider current is zero. For an output voltage of 2.50 V, R1 is set to 4 k. R2 is then found to be 4.22 k using Equation 2. 4.22kW VOUT = 1.21V(1 + ) + 3A 4.22kW 4.0kW (3) Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback 17 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 VOUT = 2.50 V www.ti.com (4) The adjustable device is tested and specified with the ADJ pin tied to the OUT pin for an output voltage of 1.21 V. Specifications for output voltages greater than 1.21 V are proportional to the ratio of the desired output voltage to 1.21 V: VOUT / 1.21 V. For example, load regulation for an output current change of 1 mA to 1.5 A is -2 mV (typical) at VOUT = 1.21 V. At VOUT = 2.50 V, the typical load regulation is: (2.50 V / 1.21 V)(-2 mV) = -4.13 mV (5) shows the actual change in output is about 3 mV for a 1-A load step. The maximum load regulation at 25C is -8 mV. At VOUT = 2.50 V, the maximum load regulation is: (2.50 V / 1.21 V)(-8 mV) = -16.53 mV (6) Because 16.53 mV is only 0.7% of the 2.5-V output voltage, the load regulation meets the design requirements. 9.2.2.1 Output Capacitance and Transient Response The TPS7A4501-SP regulator is designed to be stable with a wide range of output capacitors. The ESR of the output capacitor affects stability, most notably with small capacitors. TI recommends a minimum output capacitor of 10 F with an ESR of 3 or less to prevent oscillations. Larger values of output capacitance can decrease the peak deviations and provide improved transient response for larger load current changes. Bypass capacitors, used to decouple individual components powered by the TPS7A4501-SP, increase the effective output capacitor value. Give extra consideration to the use of ceramic capacitors. Ceramic capacitors are manufactured with a variety of dielectrics, each with different behavior over temperature and applied voltage. The most common dielectric used for a harsh environment is X7R. Ceramic capacitors lose capacitance when DC bias is applied across the capacitor. This capacitance loss is due to the polarization of the ceramic material. The capacitance loss is not permanent: after a large DC bias is applied, reducing the DC bias reduces the degree of polarization and capacitance increases. DC bias effects vary dramatically with voltage rating, case size, capacitor value, and capacitor manufacturer. Because a capacitor could lose more than 50% of its capacitance with DC bias voltages near the voltage rating of the capacitor, it is important to consider DC bias when selecting a ceramic capacitor for an application. Ceramic capacitors' dielectric also changes over the temperature range. For example X7R, the first letter X denotes lower temperature range -55C whereas 7 denotes a higher temperature range 125C and R denotes capacitance variation over the temperature range (15%). For harsh environment applications, minimum dielectric thickness must be 1 mil for 100-V DC-rated capacitor and 0.8 mil for 50-V DC-rated capacitors. Voltage and temperature coefficients are not the only sources of problems. Some ceramic capacitors have a piezoelectric response. A piezoelectric device generates voltage across its terminals due to mechanical stress, similar to the way a piezoelectric accelerometer or microphone works. For a ceramic capacitor, the stress can be induced by vibrations in the system or thermal transients. Tantalum capacitors can provide higher capacitance per unit volume. Tantalum capacitors can be either manganese dioxide (MNO2)-based capacitors where the cathode is MN02 or polymer. MN02-based tantalum capacitors exhibit high ESR as compared to polymer-based tantalum capacitors. MN02-based tantalum capacitors require in excess of 60% voltage derating. Thus, a 10-V rated capacitor can only be used for 3.3-V application. Whereas polymer-based capacitors only require 10% voltage derating. Paralleling ceramic and tantalum capacitors provide optimum balance between capacitance and ESR. Table 3 highlights some of the capacitors used in the device. 18 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 Table 3. TPS7A4501-SP Capacitors CAPACITOR PART NUMBER CAPACITOR DETAILS TYPE VENDOR (CAPACITOR, VOLTAGE, ESR) TYPE VENDOR T493X226M025AH6x20 22 F, 25 V, 35 m Tantalum - MnO2 Kemet T525D476M016ATE035 47 F, 10 V, 35 m Tantalum - Polymer Kemet T525D107M010ATE025 100 F, 10 V, 25 m Tantalum - Polymer Kemet T541X337M010AH6720 330 F, 10 V, 6 m Tantalum - Polymer Kemet T525D227M010ATE025 220 F, 10 V, 25 m Tantalum - Polymer Kemet T495X107K016ATE100 100 F, 16 V, 100 m Tantalum - MnO2 Kemet CWR29FK227JTHC 220 F, 10 V, 180 m Tantalum - MnO2 AVX THJE107K016AJH 100 F, 16 V, 58 m Tantalum AVX THJE227K010AJH 220 F, 10 V, 40 m Tantalum AVX SR2225X7R335K1P5#M123 3.3 F, 25 V, 10 m Ceramic Presidio Components Inc 9.2.2.2 Compensation TPS7A4501-SP is internally compensated. However, the user can implement a lead network using C3 to boost the phase margin as well as reduce output noise. IN VOUT OUT TPS7A4501 R2 C3 COUT VIN ADJ GND R1 Figure 24. Compensation Schematic R1, the bottom resistor, and R2, the top resistor, form the output voltage divider network. C3 across R2 adds a lead network. For R1 = 3.2 k and R2 = 10 k, VOUT is set at 5 V and C3 = 470 pF. Zero and pole can be calculated as shown in the following equations. 1 | z2 2 u S u R2 u C3 (7) (8) z2 = 33.863 kHz R1p R1 u R2 R1 R2 (9) (10) R1p = 2.424 k |p2 1 2 u S u R1p u C3 (11) (12) p2 = 139.684 kHz Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback 19 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com 9.2.3 Application Curves The following waveforms indicate the transient behavior of the TPS7A4501-SP. Figure 25. 1-A Load Transient Response, Step Load is from 0.1 to 1.1 A, Vin = 5 V, Vout = 2.5 V Figure 26. 1-A Load, Expanded View (High to Low), Slew Rate = 7.3 A/S Figure 27. 1-A Load, Expanded View (Low to High), Slew Rate = 5.8 A/S 20 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 10 Power Supply Recommendations The device is designed to operate with an input voltage supply up to 20 V. The minimum input voltage should provide adequate headroom greater than the dropout voltage for the device to have a regulated output. If the input supply is noisy, additional input capacitors with low ESR can help improve the output noise performance. 11 Layout 11.1 Layout Guidelines * * * * * * For best performance, all traces should be as short as possible. Use wide traces for IN, OUT, and GND to minimize the parasitic electrical effects. TI recommends a minimum output capacitor of 10 F with an ESR of 3 or less to prevent oscillations. X7R dielectrics are preferred. Place the output capacitor (COUT) as close as possible to the OUT pin of the device. SHDN can be driven by 5-V logic, 3-V logic, or open-collector logic with a pullup resistor.The device is in the low-power shutdown state if SHDN is not connected. The exposed thermal vias of the HKU package should be connected to a wide ground plane for effective heat dissipation. Refer to Figure 29, Figure 30, and Figure 31 for the typical footprint of the HKU package. 11.2 Layout Example SHDN GND IN IN SENSE/ADJ Thermal Vias OUT IN OUT NC OUT CIN COUT Ground Plane Figure 28. Example of Layout Figure 29. Typical HKU Package With Leads Form Copyright (c) 2013-2015, Texas Instruments Incorporated Submit Documentation Feedback 21 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com Layout Example (continued) Figure 30. Typical Thermal Vias Footprint Figure 31. Typical Thermal Vias Details 11.3 Thermal Considerations * * The power-handling capability of the device is limited by the maximum-rated junction temperature (125C). The power dissipated by the device is made up of two components: Output current multiplied by the input/output voltage differential: IOUT(VIN - VOUT) GND pin current multiplied by the input voltage: IGNDVIN. Find the GND pin current by using the GND pin current graphs in Typical Characteristics. Power dissipation is equal to the sum of the two components listed previously. The TPS7A4501-SP regulators have internal thermal limiting designed to protect the device during overload conditions. For continuous normal conditions, do not exceed the maximum junction temperature rating of 125C. It is important to give careful consideration to all sources of thermal resistance from junction to ambient. Also consider additional heat sources mounted nearby. For surface-mount devices, heat sinking is accomplished by using the heat-spreading capabilities of the PCB and its copper traces. Copper board stiffeners and plated through-holes can also be used to spread the heat generated by power devices. 11.3.1 Calculating Junction Temperature Example: Given an output voltage of 3.3 V, an input voltage range of 4 to 6 V, an output current range of 0 to 500 mA, and a maximum case temperature of 50C, what is the maximum junction temperature? The power dissipated by the device is equal to: IOUT(MAX)(VIN(MAX) - VOUT) + IGND(VIN(MAX)) where * * 22 IOUT(MAX) = 500 mA VIN(MAX) = 6 V Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated TPS7A4501-SP www.ti.com SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 Thermal Considerations (continued) * IGND at (IOUT = 500 mA, VIN = 6 V) = 10 mA (13) So, P = 500 mA x (6 V - 3.3 V) + 10 mA x 6 V = 1.41 W (14) Using a U package, the thermal resistance is about 10.3C/W. So the junction temperature rise above case is approximately equal to: 1.41 W x 10.3C/W = 14.5C (15) The maximum junction temperature is then equal to the maximum junction-temperature rise above case plus the maximum case temperature or: TJMAX = 50C + 14.5C = 64.5C Copyright (c) 2013-2015, Texas Instruments Incorporated (16) Submit Documentation Feedback 23 TPS7A4501-SP SLVSC31D - DECEMBER 2013 - REVISED AUGUST 2015 www.ti.com 12 Device and Documentation Support 12.1 Device Support 12.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 24 Submit Documentation Feedback Copyright (c) 2013-2015, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 8-Feb-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) 5962-1222402V9A ACTIVE XCEPT KGD 0 100 TBD Call TI N / A for Pkg Type -55 to 125 5962-1222402VHA ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type -55 to 125 5962R1222403V9A ACTIVE XCEPT KGD 0 50 TBD Call TI Call TI -25 to 125 5962R1222403VXC ACTIVE CFP HKU 10 1 TBD Call TI Call TI -55 to 125 TPS7A4501HKU/EM ACTIVE CFP HKU 10 1 TBD AU N / A for Pkg Type 25 to 25 7A4501HKU/EM EVAL ONLY TPS7A4501U/EM ACTIVE CFP U 10 1 TBD A42 N / A for Pkg Type 25 to 25 7A4501U/EM EVAL ONLY 1222402VHA 7A4501-SP R1222403VXC 7A4501-RHA (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 8-Feb-2018 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2018, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: 5962-1222402VHA 5962-1222402V9A TPS7A4501U/EM TPS7A4501HKU/EM 5962R1222403VXC 5962R1222403V9A