RoHS Compliant
16GB DDR4 SDRAM SO-DIMM Industrial
Halogen free
Product Specifications
August 30, 2016
Version 0.2
Apacer Technology Inc.
1F., No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City 236, Taiwan
Tel: +886-2-2267-8000 Fax: +886-2-2267-2261
www.apacer.com
©Apacer Technology Inc. 1
Table of Contents
General Description ....................................................................................................... 2
Ordering Information ..................................................................................................... 2
Key Parameters .............................................................................................................. 2
Specifications: ................................................................................................................ 3
Features: ......................................................................................................................... 4
Pin Assignments ............................................................................................................. 5
Pin Descriptions ............................................................................................................. 7
Functional Block Diagram ............................................................................................. 8
Absolute Maximum Ratings ........................................................................................ 10
DRAM Component Operating Temperature Range..................................................... 11
Operating Conditions ................................................................................................... 12
IDD Specifications ....................................................................................................... 13
Mechanical Drawing .................................................................................................... 16
©Apacer Technology Inc. 2
General Description
Apacer 75.DA4GJ.G010B is a 2048M x 64 DDR4 SDRAM (Synchronous
DRAM) SO-DIMM. This high-density memory module consists of 16 pieces
1024M x 8 bits with 4 banks DDR4 synchronous DRAMs in FBGA packages
and a 4K Bits EEPROM. The module is a 260-pins dual in-line memory module
and is intended for mounting into a connector socket. The following provides
general specifications of this module.
Ordering Information
Part Number Bandwidth Speed Grade Max Frequency
CAS Latency
75.DA4GJ.G010B 19.2 GB/sec 2400 Mbps 1200 MHz CL17
Density Organization Component Rank
16GB 2048M x 64 1024M x8*16 2
Key Parameters
MT/s DDR4-1866 DDR4-2133 DDR4-2400
Unit
Grade -CL13 -CL15 -CL17
tCK (min)
1.07 0.93 0.83
ns
CAS latency
13 15 17
tCK
tRCD (min)
13.92 14.06 14.16
ns
tRP (min)
13.92 14.06 14.16
ns
tRAS (min)
34 33 32
ns
tRC (min)
47.92 47.05 46.16
ns
CL-tRCD-tRP
13-13-13 15-15-15 17-17-17
tCK
©Apacer Technology Inc. 3
Specifications:
♦ On-DIMM thermal sensor : No
♦ Organization: 2048 words x 64 bits, 2 ranks
♦ Integrating 16 pieces of 8G bits DDR4 SDRAM sealed FBGA
♦ Package: 260-pin socket type small outline dual in-line memory module
(SO-DIMM)
♦ PCB: height 30.00 mm, lead pitch 0.50 mm (pin),
♦ Serial Presence Detect (SPD)
♦ Power Supply: VDD=1.2V (1.14V to 1.26V)
♦ VDDQ = 1.2V (1.14V to 1.26V)
♦ VPP = 2.5V (2.375V to 2.75V)
♦ VDDSPD = 2.2V to 3.6V
♦ 16 internal banks (4 Bank Groups)
♦ CAS Latency (CL): 13, 14, 15, 16, 17
♦ CAS Write Latency (CWL): 12,16
♦ Support Industrial Temp ( -40°C~95°C )
- tREFI 7.8us at -40 °C ≤ TCASE ≤ 85°C
- tREFI 3.9us at 85 °C < TCASE ≤ 95°C
♦ Lead-free (RoHS compliant)
♦ Halogen free
♦ PCB: 30µ gold finger
©Apacer Technology Inc.
4
Features:
♦ Functionality and operations comply with the DDR4 SDRAM datasheet
♦ Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for
the banks in the same or different bank group accesses are available
♦ Bi-Directional Differential Data Strobe
♦ 8 bit pre-fetch
♦ Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
♦ Per DRAM Addressability is supported
♦ Internal Vref DQ level generation is available
♦ Write CRC is supported at all speed grades
♦ DBI (Data Bus Inversion) is supported(x8)
♦ CA parity (Command/Address Parity) mode is supported
©Apacer Technology Inc. 5
Pin Assignments
Pin
No.
Pin name-Front
Pin
No.
Pin name-Back
Pin
No.
Pin name-Front
Pin
No.
Pin name-Back
1 VSS 2 VSS 133
A1 134
EVENT_n
3 DQ5 4 DQ4 135
VDD 136
VDD
5 VSS 6 VSS 137
CK0_t 138
CK1_t
7 DQ1 8 DQ0 139
CK0_c 140
CK1_c
9 VSS 10
VSS 141
VDD 142
VDD
11
DQS0_c 12
DM0_n, DBI0_n 143
PARITY 144
A0
13
DQS0_t 14
VSS 145
BA1 146
A10/AP
15
VSS 16
DQ6 147
VDD 148
VDD
17
DQ7 18
VSS 149
CS0_n 150
BA0
19
VSS 20
DQ2 151
A14/WE_n 152
A16/RAS_n
21
DQ3 22
VSS 153
VDD 154
VDD
23
VSS 24
DQ12 155
ODT0 156
A15/CAS_n
25
DQ13 26
VSS 157
CS1_n 158
A13
27
VSS 28
DQ8 159
VDD 160
VDD
29
DQ9 30
VSS 161
ODT1 162
C0, CS2_n, NC
31
VSS 32
DQS1_c 163
VDD 164
VREFCA
33
DM1_n, DBI1_n
34
DQS1_t 165
C1, CS3_n, NC 166
SA2
35
VSS 36
VSS 167
VSS 168
VSS
37
DQ15 38
DQ14 169
DQ37 170
DQ36
39
VSS 40
VSS 171
VSS 172
VSS
41
DQ10 42
DQ11 173
DQ33 174
DQ32
43
VSS 44
VSS 175
VSS 176
VSS
45
DQ21 46
DQ20 177
DQS4_c 178
DM4_n, DBI4_n
47
VSS 48
VSS 179
DQS4_t 180
VSS
49
DQ17 50
DQ16 181
VSS 182
DQ39
51
VSS 52
VSS 183
DQ38 184
VSS
53
DQS2_c 54
DM2_n, DBI2_n 185
VSS 186
DQ35
55
DQS2_t 56
VSS 187
DQ34 188
VSS
57
VSS 58
DQ22 189
VSS 190
DQ45
59
DQ23 60
VSS 191
DQ44 192
VSS
61
VSS 62
DQ18 193
VSS 194
DQ41
63
DQ19 64
VSS 195
DQ40 196
VSS
65
VSS 66
DQ28 197
VSS 198
DQS5_c
67
DQ29 68
VSS 199
DM5_n, DBI5_n 200
DQS5_t
69
VSS 70
DQ24 201
VSS 202
VSS
©Apacer Technology Inc. 6
Pin
No.
Pin name-Front
Pin
No.
Pin name-Back
Pin
No.
Pin name-Front
Pin
No.
Pin name-Back
71
DQ25 72
VSS 203
DQ46 204
DQ47
73
VSS 74
DQS3_c 205
VSS 206
VSS
75
DM3_n, DBI3_n
76
DQS3_t 207
DQ42 208
DQ43
77
VSS 78
VSS 209
VSS 210
VSS
79
DQ30 80
DQ31 211
DQ52 212
DQ53
81
VSS 82
VSS 213
VSS 214
VSS
83
DQ26 84
DQ27 215
DQ49 216
DQ48
85
VSS 86
VSS 217
VSS 218
VSS
87
CB5, NC 88
CB4, NC 219
DQS6_c 220
DM6_n, DBI6_n
89
VSS 90
VSS 221
DQS6_t 222
VSS
91
CB1, NC 92
CB0, NC 223
VSS 224
DQ54
93
VSS 94
VSS 225
DQ55 226
VSS
95
DQS8_c 96
DM8_n, DBI8_n 227
VSS 228
DQ50
97
DQS8_t 98
VSS 229
DQ51 230
VSS
99
VSS 100
CB6, NC 231
VSS 232
DQ60
101
CB2, NC 102
VSS 233
DQ61 234
VSS
103
VSS 104
CB7, NC 235
VSS 236
DQ57
105
CB3, NC 106
VSS 237
DQ56 238
VSS
107
VSS 108
RESET_n 239
VSS 240
DQS7_c
109
CKE0 110
CKE1 241
DM7_n, DBI7_n 242
DQS7_t
111
VDD 112
VDD 243
VSS 244
VSS
113
BG1 114
ACT_n 245
DQ62 246
DQ63
115
BG0 116
ALERT_n 247
VSS 248
VSS
117
VDD 118
VDD 249
DQ58 250
DQ59
119
A12 120
A11 251
VSS 252
VSS
121
A9 122
A7 253
SCL 254
SDA
123
VDD 124
VDD 255
VDDSPD 256
SA0
125
A8 126
A5 257
VPP 258
VTT
127
A6 128
A4 259
VPP 260
SA1
129
VDD 130
VDD – – –
–
131
A3 132
A2 – – –
–
*IC Component Composition : 256Mx8 A0~A13
512Mx8 A0~A14, 512Mx4 A0~A14
1024Mx8 A0~A15, 1024Mx4 A0~A15
2048Mx8 A0~A16, 2048Mx4 A0~A16
