HLMP-RD11/SD11/RG10/SG10/RL10/SL10 4 mm Super Oval Precision Optical Performance AlInGaP LEDs Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for Full Color/Video and Passenger Information signs. The oval shaped radiation pattern (60 x 120) and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. * Well defined spatial radiation pattern High efficiency LED materials are used in these lamps: Aluminum Indium Gallium Phosphide (AlInGaP) for Red and Amber color. There are two families of red and amber lamps, AlInGaP and the higher performance AlInGaP II. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both uv-a and uv-b inhibitors to reduce the effects of long term exposure to direct sunlight. Designers can select parallel (where the axis of the leads is parallel to the wide axis of the oval radiation pattern) or perpendicular orientation. Both lamps are available in tinted version. * Viewing angle: major axis 120 minor axis 60 * High luminous output * Two red and amber intensity levels: AlInGaP (bright) and AlInGaP II (brightest) * Colors: 626/630 nm red 590/592 nm amber * Superior resistance to moisture * UV resistant epoxy Applications * Full color signs Benefits * Viewing angle designed for wide field of view applications * Superior performance for outdoor environments Package Dimensions 21.0 MIN. (0.827) 9.50 0.50 (0.374 0.007) A 4.0 0.20 (0.157 0.008) 6.30 0.20 (0.248 0.008) 1.0 MIN. (0.039) 1.25 0.20 (0.049 0.008) CATHODE LEAD 0.44 0.20 (0.017 0.008) 2.54 0.30 (0.100 0.012) 0.80 MAX. EPOXY MENISCUS (0.016) +0.10 0.45 -0.04 +0.004 (0.018 -0.002) +0.10 0.40 -0 +0.004 (0.016 -0.000) 21.0 MIN. (0.827) 9.50 0.50 (0.374 0.007) B 4.0 0.20 (0.157 0.008) 6.30 0.20 (0.248 0.008) 1.0 MIN. (0.039) 1.25 0.20 (0.049 0.008) CATHODE LEAD 0.44 0.20 (0.017 0.008) 2.54 0.30 (0.100 0.012) 0.80 MAX. EPOXY MENISCUS (0.016) Dimensions are in millimeters (inches). +0.10 0.45 -0.04 +0.004 (0.018 -0.002) +0.10 0.40 -0 +0.004 (0.016 -0.000) Device Selection Guide for AlInGaP Luminous Intensity Iv (mcd) at 20 mA Part Number Color and Dominant Wavelength d (nm) Typ. Min. Max. Leads with Stand-Off Leadframe Orientation Package Drawing HLMP-SG10-JM0xx Red 626 240 680 Yes Perpendicular A HLMP-RG10-JM000 Red 626 240 680 Yes Parallel B HLMP-SL10-HL0DD Amber 590 180 520 Yes Perpendicular A HLMP-SL10-LM0DD Amber 590 400 680 Yes Perpendicular A HLMP-SL10-LMKDD Amber 590 400 680 Yes Perpendicular A HLMP-SL10-LMLDD Amber 590 400 680 Yes Perpendicular A HLMP-SL10-LP0xx Amber 590 400 1150 Yes Perpendicular A HLMP-SL10-LPKDD Amber 590 400 1150 Yes Perpendicular A HLMP-SL10-MNKxx Amber 590 520 880 Yes Perpendicular A HLMP-SL10-MP0DD Amber 590 520 1150 Yes Perpendicular A HLMP-SL10-MQ0DD Amber 590 520 1500 Yes Perpendicular A HLMP-SL10-MQLDD Amber 590 520 1500 Yes Perpendicular A HLMP-RL10-LMLDD Amber 590 400 680 Yes Parallel B HLMP-RL10-LP0xx Amber 590 400 1150 Yes Parallel B HLMP-RL10-MP0DD Amber 590 520 1150 Yes Parallel B HLMP-RL10-MQLDD Amber 590 520 1500 Yes Parallel B Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. Device Selection Guide for AlInGaP II Part Number Color and Dominant Luminous Intensity Wavelength IV (mcd) at 20 mA Leads with Leadframe Package d (nm) Typ. Min. Max. Stand-Offs Orientation Drawing HLMP-RD11-J0000 Red 630 240 - HLMP-RD11-LP0xx Red 630 40 1150 HLMP-RD11-LPTxx Red 630 400 HLMP-SD11-J0000 Red 630 HLMP-SD11-LP000 Yes Parallel B Yes Parallel B 1150 Yes Parallel B 240 - Yes Perpendicular A Red 630 400 1150 Yes Perpendicular A HLMP-SD11-LPTxx Red 630 400 1150 Yes Perpendicular A HLMP-SD11-MN0xx Red 630 520 880 Yes Perpendicular A HLMP-SD11-MNTxx Red 630 520 880 Yes Perpendicular A Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. Part Numbering System HLMP - x x xx - x x x xx Mechanical Options 00: Bulk Packaging DD: Ammo Pack YY: Flexi-Bin; Bulk Packaging ZZ: Flexi-Bin; Ammo Pack Color Bin & VF Selections 0: No Color Bin Limitation T: Red Color with VF Maximum of 2.6 V K: Amber Color Bins 2 and 4 L: Amber Color BIns 4 and 6 Maximum Intensity Bin 0: No Iv Bin Limitation Minimum Intensity Bin Refer to Device Selection Guide Color D: 630 nm Red G: 626 nm Red L: 590 nm Amber Package R: 4 mm 60 x 120Oval, Parallel S: 4 mm 60 x 120Oval, Perpendicular Absolute Maximum Ratings TA = 25C Parameter Amber and Red DC Forward Current1 50 mA Peak Pulsed Forward Current 100 mA Average Forward Current 30 mA Reverse Voltage (IR = 100 A) 5V Power Dissipation 120 mW LED Junction Temperature 130C Operating Temperature Range -40C to +100C Storage Temperature Range -40C to +100C Note: 1. Derate linearly as shown in Figures 4. Electrical/Optical Characteristics TA = 25C Parameter Symbol Typical Viewing Angle[1] 21/2 Forward Voltage Red (d = 626 nm) Red (d = 630 nm) Amber (d = 590 nm) VF Reverse Voltage Amber and Red VR Peak Wavelength Red (d = 626 nm) Red (d = 630 nm) Amber (d = 590 nm) PEAK Spectral Halfwidth Red (d = 626/630 nm) Amber (d = 590 nm) 1/2 Capacitance All Colors C Thermal Resistance All Colors RJ-PIN Luminous Efficacy[3] Red (d = 626 nm) Red (d = 630 nm) Amber (d = 590 nm) v Major Minor Min. Typ. Max. 5 20 635 639 592 17 17 40 240 150 155 480 Test Conditions deg 120 60 1.9 2.0 2.02 Units 2.4 2.4[2] 2.4 V IF = 20 mA V IR = 100 A nm Peak of Wavelength of Spectral Distribution at IF = 20 mA nm Wavelength Width at Spectral Distribution 1/2 Power Point at IF = 20 mA pF VF = 0, F = 1 MHz C/W LED Junction-to-Cathode Lead lm/W Emitted Luminous Power/ Emitted Radiant Power Notes: 1. 21/2 is the off-axis angle where the luminous intensity is the on-axis intensity. 2. For options -xxRxx, -xxTxx, and -xxVxx, maximum forward voltage, VF, is 2.6 V. Please refer to VF Bin Table below. 3. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/v, where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. AMBER 50 RED 600 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. 550 650 20 AMBER 10 0 1.0 1.5 2.0 2.5 VF - FORWARD VOLTAGE - V 3.0 60 2.0 IF - FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.5 1.0 0.5 0 10 30 20 40 IF - FORWARD CURRENT - mA 50 40 Rj-a = 780 C/W 20 10 0 0 20 40 60 80 TA - AMBIENT TEMPERATURE - C 100 120 Figure 4. Amber, Red maximum forward current vs. ambient temperature. 1.0 1.0 0.8 0.8 0.6 0.4 0.2 0 -90 -75 -60 -45 -30 -15 0 15 30 45 ANGULAR DISPLACEMENT - DEGREES Rj-a = 585 C/W 30 50 RELATIVE INTENSITY RELATIVE INTENSITY 30 Figure 2. Amber, Red forward current vs. forward voltage. Figure 3. Amber, Red relative luminous intensity vs. forward current. 0.6 0.4 0.2 60 Figure 5a. Representative spatial radiation pattern for major axis. RED 700 2.5 0 40 IF - FORWARD CURRENT - mA RELATIVE INTENSITY 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 500 75 90 0 -90 -75 -60 -45 -30 -15 0 15 30 45 ANGULAR DISPLACEMENT - DEGREES 60 Figure 5b. Representative spatial radiation pattern for minor axis. 75 90 Intensity Bin Limits Color Bin Limits (mcd at 20 mA) (nm at 20 mA) Bin Name Min. Max. H 180 240 Bin ID Min. Max. J 240 310 1 584.5 587.0 K 310 400 2 587.0 589.5 L 400 520 4 589.5 592.0 M 520 680 6 592.0 594.5 N 680 880 P 880 1150 Tolerance for each bin limit is 15%. VF Bin Table2 Bin Name Min. Max. VA 2.0 2.2 VB 2.2 2.4 VC 2.4 2.6 Tolerance for each bin is 0.05 V. Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. 2. VF binning is applicable for part numbers with option -xxTxx. Amber Colour Range (nm) Tolerance for each bin limit is 0.5 nm. Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representatives for further information. Precautions: Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. * For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. * If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: * Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. * LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED. 1.59mm * ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. * Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105 C Max. - Preheat time 60 sec Max - Peak temperature 250 C Max. 260 C Max. Dwell time 3 sec Max. 5 sec Max Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. * Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. CATHODE Note: Electrical connection AllnGaP Devicebetween bottom surface of LED die and the lead frame is achieved through conductive paste. * Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. * At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. * If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. * Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) * Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) LAMINAR WAVE TURBULENT WAVE HOT AIR KNIFE 250 Flux: Rosin flux Solder bath temperature: 245C 5C (maximum peak temperature = 250C) 200 150 Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) 100 Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 50 PREHEAT 0 10 20 30 40 50 60 TIME (MINUTES) 70 80 90 100 Ammo Packs Drawing 6.351.30 0.250.0512 12.701.00 0.500.0394 CATHODE 20.51.00 0.80710.0394 9.1250.625 0.35930.025 18.000.50 0.70870.0197 12.700.30 0.500.0118 O 0.700.20 0.2760.0079 VIEW A - A 4.000.20 TYP. 0.15750.0079 Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless standoff or non-standoff Packaging Box for Ammo Packs Note: For InGaN device, the ammo pack packaging box contain ESD logo Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 250C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin 10 RoHS Compliant DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 250C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin "VB" only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin "VB" 2: Color bin 2 only DISCLAIMER AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4174EN AV02-1544EN - September 18, 2008