RClamp7524T Low Capacitance RClamp(R) 4-Line ESD Protection PROTECTION PRODUCTS Description Features RailClamp(R) TVS arrays are ultra low capacitance ESD protection devices designed to protect high speed data interfaces. This series has been specifically engineered to protect sensitive components which are connected to high-speed data and transmission lines from overvoltage caused by ESD (electrostatic discharge), CDE (Cable Discharge Events), and EFT (electrical fast transients). * ESD protection for high-speed data lines to IEC 61000-4-2 (ESD) 30kV (air), 25kV (contact) IEC 61000-4-5 (Lightning) 5A (8/20s) IEC 61000-4-4 (EFT) 40A (5/50ns) * Package design optimized for high speed lines * Flow-Through design * Protects four high-speed lines * Low capacitance: 0.60pF Maximum (I/O to Ground) * Low ESD clamping voltage * Low dynamic resistance: 0.50 Ohms (Typ) * Solid-state silicon-avalanche technology The RClamp(R)7524T will protect four lines or two differential pairs. Each line has a maximum capacitance of only 0.60pF between any I/O pin and ground. This allows it to be used on circuits operating in excess of 5GHz without signal attenuation. They feature high maximum ESD withstand voltage of +/- 25kV contact, +/-30kV air discharge per IEC 61000-4-2. The RClamp7524T is in a 5-pin SLP1308N5T package. It measures 1.3 x 0.8mm with a nominal height of 0.40mm. The innovative flow through package design simplifies PCB layout and allows matched trace lengths for consistant impedance between high speed differential lines. The combination of small size, low capacitance, and high level of ESD protection makes this device a flexible solution for applications such as HDMI, MHL, MDDI, and eDP interfaces. Package Dimension Mechanical Characteristics * * * * * * SLP1308N5T 5-pin package (1.3 x 0.8 x 0.40mm) Pb-Free, Halogen Free, RoHS/WEEE Compliant Lead Pitch: 0.45mm Lead finish: NiPdAu Marking: Marking Code Packaging: Tape and Reel Applications * * * * * * * HDMI 1.3 and HDMI 1.4 V-By-One USB 3.0 MHL eDP LVDS Interfaces eSATA Interfaces Schematic & Pin Configuration 1.30 0.45 BSC 1 2 0.80 1 0.50 BSC 3 4 5 0.40 2 RClamp7524T Final Datasheet Revision date Rev 5 10/24/2016 www.semtech.com 1 of 9 Semtech Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20s) PPK 75 W Peak Pulse Current (tp = 8/20s) IPP 5 A ESD per IEC 61000-4-2 (Air)(1) ESD per IEC 61000-4-2 (Contact)(1) VESD 30 25 kV Operating Temperature TJ -55 to +125 O Storage Temperature TSTG -55 to +150 O C C Electrical Characteristics (T=25OC unless otherwise specified) Parameter Symbol Conditions Min. Reverse Stand-Off Voltage VRWM Any I/O to GND Reverse Breakdown Voltage VBR IBR= 1mA, Any I/O to GND Reverse Leakage Current IR VRWM = 5V, Any I/O to GND Clamping Voltage VC tp = 8/20s Any I/O to GND IPP = 1A 12 IPP = 5A 15 ESD Clamping Voltage2 VC tp = 0.2/100ns Any I/O to GND ITLP = 4A 11 ITLP = 16A 17 Dynamic Resistance2,3 RDYN tp = 0.2/100ns Junction Capacitance CJ VR = 0V, f = 1MHz 6.5 Typ. Max. Units 5 V 9 11 V 5 100 nA V V 0.5 Any I/O to GND 0.5 0.6 Between I/O pins 0.25 0.4 pF Notes 1) Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane. 2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and V TLP averaging window: t1 = 70ns to t2 = 90ns. 3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A RClamp7524T Final Datasheet Revision Date Rev 5 10/24/2016 www.semtech.com 2 of 9 Semtech Typical Characteristics Non-Repetitive Peak Pulse Power 10 Power Derating Curve 120 DR040412-75 TA = 25OC Peak Pulse Power - PPP (kW) 100 % of Rated Power or IPP 1 0.1 80 60 40 20 0.01 0.1 1 10 100 DR040514-25-125-150 0 1000 0 Pulse Duration - tp (s) Clamping Voltage vs. Peak Pulse Current (Between any I/O and Ground) 150 0.9 0.8 10 0.7 Capacitacnce (pF) Clamping Voltage (V) 125 1 12 8 6 4 0.6 0.5 0.4 0.3 0.2 Waveform: Parameters: 5164.1 POR tr = 8s td = 20s 2 f = 1 MHz 0.1 0 0 0 1 2 3 4 Peak Pulse Current - IPP (A) 5 6 0 TLP Characteristic (Positive) 30 0 25 -5 Current (A) 15 10 5 Transmission Line Pulse Test (TLP) Settings: tp=100ns, tr=0.2ns, ITLP and VTLP averaging window: t1=70ns to t2=90ns 0 0 5 10 15 20 Rev 5 10/24/2016 2 3 4 Reversed Voltage - VR (V) 5 6 25 -10 -15 -20 Transmission Line Pulse Test (TLP) Settings: tp=100ns, tr=0.2ns, ITLP and VTLP averaging window: t1=70ns to t2=90ns -25 -30 30 -20 -15 -10 -5 0 Voltage (V) Voltage (V) RClamp7524T Final Datasheet Revision Date 1 TLP Characteristic (Negative) 20 Current (A) 50 75 100 Ambient Temperature - TA (OC) Junction Capacitance vs. Reverse Voltage (Between any I/O and Ground) 14 -5 25 www.semtech.com 3 of 9 Semtech Typical Characteristics (Continued) ESD Clamping (+8kV Contact per IEC 614000-4-2) (Between any I/O to Ground) 70 0 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane 60 -10 -20 Voltage (V) 50 Voltage (V) ESD Clamping (-8kV Contact per IEC 614000-4-2) (Between any I/O to Ground) 40 30 -30 -40 20 -50 10 -60 0 -10 0 10 20 30 40 50 60 70 80 -70 Measured with 50 Ohm scope input impedance, 2GHz bandwidth. Corrected for 50 Ohm, 20dB attenuator. ESD gun return path connected to ESD ground plane -10 0 10 20 30 Time (ns) 40 50 60 70 80 Time (ns) Typical Insetion Loss S21 Analog Crosstalk 0 -20 -30 -40 -50 -2 -60 Crosstalk (dB) Insertion Loss (dB) -1 -3 -4 -70 -80 -90 -100 -5 -110 -6 -120 10 100 1000 10 Frequency (MHz) RClamp7524T Final Datasheet Revision Date Rev 5 10/24/2016 100 1000 Frequency (MHz) www.semtech.com 4 of 9 Semtech Application Information Assembly Guidelines The small size of this device means that some care must be taken during the mounting process to insure reliable solder joint. The table below provides Semtech's recommended assembly guidelines for mounting this device. The figure at the right details Semtech's recommended aperture based on the below recommendations. Note that these are only recommendations and should serve only as a starting point for design since there are many factors that affect the assembly process. The exact manufacturing parameters will require some experimentation to get the desired solder application. 0.500 0.025 0.250 0.450 0.800 0.025 0.250 0.020 0.180 0.450 1.300 All Dimensions are in mm. Assembly Parameter Solder Stencil Design Aperture shape Solder Stencil Thickness Solder Paster Type Solder Reflow Profile PCB Solder Pad Design PCB Pad Finish RClamp7524T Final Datasheet Revision Date Rev 5 10/24/2016 Recommendation Laser cut, Electro-polished Rectangular 0.100 mm (0.004") Type 4 size sphere or smaller Per JEDEC J-STD-020 Non-Solder mask defined OSP Or NiAu www.semtech.com Land Pad. Stencil opening Component Recommended Mounting Pattern 5 of 9 Semtech Application Information Application Information HDMI 1.4 Type A Connector RClamp7528T RClamp7524T RClamp7524T HDMI 1.4 Layout with RClamp7524T RClamp7524T VBus TMDSTMDS+ CBUS GND MHL Layout with RClamp7524T RClamp7524T Final Datasheet Revision Date Rev 5 10/24/2016 www.semtech.com 6 of 9 Semtech Outline Drawing - SLP1308N5T D A B DIMENSIONS MILLIMETERS MIN NOM MAX DIM PIN 1 INDICATOR (LASER MARK) E A SEATING PLANE aaa C A2 A A1 A2 b D E e e1 L N aaa bbb 0.37 0.40 0.43 0.00 0.02 0.05 (0.13) 0.13 0.18 0.23 1.20 1.30 1.40 0.70 0.80 0.90 0.45 BSC 0.50 BSC 0.20 0.25 0.30 5 0.08 0.10 C A1 D/2 e 1 2 LxN E/2 N bxN e1/2 bbb C A B e1 NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP1308N5T P1 DIMENSIONS P1/2 Z (C) G Y X DIM C G P P1 X Y Z MILLIMETERS (0.65) 0.25 0.45 0.50 0.18 0.40 1.05 P NOTES: 1. 2. RClamp7524T Final Datasheet Revision Date Rev 5 10/24/2016 CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. www.semtech.com 7 of 9 Semtech Marking Code 7524T YYWW Note: YYWW = Date Code Tape and Reel Specification 7524T YYWW 7524T YYWW 7524T YYWW 7524T YYWW 7524T YYWW 7524T YYWW Pin 1 Location (Towards Sprocket Holes) User Direction of feed Ordering Information Part Number Qty per Reel Reel Size RClamp7524T.TNT 10,000 7" RClamp7524T Final Datasheet Revision Date Rev 5 10/24/2016 www.semtech.com 8 of 9 Semtech IMPORTANT NOTICE Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. 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Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise. The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved. (c) Semtech 2015 Contact Information Semtech Corporation 200 Flynn Road, Camarillo, CA 93012 Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com RClamp7524T Final Datasheet Revision date Rev 5 10/24/2016 9 of 9 Semtech