RClamp7524T
Final Datasheet Rev 5
Revision date 10/24/2016
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Features
• ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
• Package design optimized for high speed lines
• Flow-Through design
• Protects four high-speed lines
• Low capacitance: 0.60pF Maximum (I/O to Ground)
• Low ESD clamping voltage
• Low dynamic resistance: 0.50 Ohms (Typ)
• Solid-state silicon-avalanche technology
Mechanical Characteristics
• SLP1308N5T 5-pin package (1.3 x 0.8 x 0.40mm)
• Pb-Free, Halogen Free, RoHS/WEEE Compliant
• Lead Pitch: 0.45mm
• Lead nish: NiPdAu
• Marking: Marking Code
• Packaging: Tape and Reel
Applications
• HDMI 1.3 and HDMI 1.4
• V-By-One
• USB 3.0
• MHL
• eDP
• LVDS Interfaces
• eSATA Interfaces
RClamp7524T
Low Capacitance RClamp®
4-Line ESD Protection
Description
RailClamp® TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed data
interfaces. This series has been specically engineered
to protect sensitive components which are connected
to high-speed data and transmission lines from
overvoltage caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast
transients).
The RClamp®7524T will protect four lines or two
dierential pairs. Each line has a maximum capacitance
of only 0.60pF between any I/O pin and ground.
This allows it to be used on circuits operating in excess
of 5GHz without signal attenuation. They feature high
maximum ESD withstand voltage of +/- 25kV contact,
+/-30kV air discharge per IEC 61000-4-2.
The RClamp7524T is in a 5-pin SLP1308N5T package.
It measures 1.3 x 0.8mm with a nominal height of
0.40mm. The innovative ow through package design
simplies PCB layout and allows matched trace lengths
for consistant impedance between high speed
dierential lines. The combination of small size, low
capacitance, and high level of ESD protection makes this
device a exible solution for applications such as HDMI,
MHL, MDDI, and eDP interfaces.
1.30
0.40
0.80
0.45 BSC
0.50 BSC
12
1 3 4 5
2
Package Dimension Schematic & Pin Conguration
PROTECTION PRODUCTS
RClamp7524T
Final Datasheet Rev 5
Revision Date 10/24/2016
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Absolute Maximum Rating
Rating Symbol Value Units
Peak Pulse Power (tp = 8/20µs) PPK 75 W
Peak Pulse Current (tp = 8/20µs) IPP 5 A
ESD per IEC 61000-4-2 (Air)(1)
ESD per IEC 61000-4-2 (Contact)(1) VESD
±30
±25 kV
Operating Temperature TJ-55 to +125 OC
Storage Temperature TSTG -55 to +150 OC
Electrical Characteristics (T=25OC unless otherwise specied)
Parameter Symbol Conditions Min. Typ. Max. Units
Reverse Stand-O Voltage VRWM Any I/O to GND 5 V
Reverse Breakdown Voltage VBR IBR= 1mA, Any I/O to GND 6.5 9 11 V
Reverse Leakage Current IRVRWM = 5V, Any I/O to GND 5 100 nA
Clamping Voltage VC
tp = 8/20μs
Any I/O to GND
IPP = 1A 12
V
IPP = 5A 15
ESD Clamping Voltage2VC
tp = 0.2/100ns
Any I/O to GND
ITLP = 4A 11
V
ITLP = 16A 17
Dynamic Resistance2,3 RDYN tp = 0.2/100ns 0.5 Ω
Junction Capacitance CJVR = 0V, f = 1MHz
Any I/O to GND 0.5 0.6
pF
Between I/O pins 0.25 0.4
Notes
1) Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD ground plane.
2) Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
RClamp7524T
Final Datasheet Rev 5
Revision Date 10/24/2016
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Typical Characteristics
Non-Repetitive Peak Pulse Power Power Derating Curve
Clamping Voltage vs. Peak Pulse Current
(Between any I/O and Ground)
TLP Characteristic (Positive)
0
2
4
6
8
10
12
14
0 1 2 3 4 5 6
Clamping Voltage (V)
Peak Pulse Current - I
PP
(A)
5164.1 POR
Waveform:
Parameters:
tr = 8µs
td = 20µs
-5
0
5
10
15
20
25
30
0 5 10 15 20 25 30
Current (A)
Voltage (V)
Transmission Line Pulse Test (TLP)
Settings:
t
p
=100ns, t
r
=0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
=70ns to t
2
=90ns
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
0 1 2 3 4 5 6
Capacitacnce (pF)
Reversed Voltage - VR (V)
f = 1 MHz
-30
-25
-20
-15
-10
-5
0
-20 -15 -10 -5 0
Current (A)
Voltage (V)
Transmission Line Pulse Test (TLP)
Settings:
t
p
=100ns, t
r
=0.2ns,
I
TLP
and V
TLP
averaging window:
t
1
=70ns to t
2
=90ns
0.01
0.1
1
10
0.1 1 10 100 1000
Peak Pulse Power - P
PP
(kW)
Pulse Duration - tp (µs)
DR040412-75
T
A
= 25
O
C
0
20
40
60
80
100
120
0 25 50 75 100 125 150
% of Rated Power or I
PP
Ambient Temperature - TA (
O
C)
DR040514-25-125-150
Junction Capacitance vs. Reverse Voltage
(Between any I/O and Ground)
TLP Characteristic (Negative)
RClamp7524T
Final Datasheet Rev 5
Revision Date 10/24/2016
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Semtech
Typical Characteristics (Continued)
ESD Clamping (+8kV Contact per IEC 614000-4-2)
(Between any I/O to Ground)
ESD Clamping (-8kV Contact per IEC 614000-4-2)
(Between any I/O to Ground)
Typical Insetion Loss S21 Analog Crosstalk
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
10 100 1000
Crosstalk (dB)
Frequency (MHz)
-6
-5
-4
-3
-2
-1
0
10 100 1000
Insertion Loss (dB)
Frequency (MHz)
0
10
20
30
40
50
60
70
-10 0 10 20 30 40 50 60 70 80
Voltage (V)
Time (ns)
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane
-70
-60
-50
-40
-30
-20
-10
0
-10 0 10 20 30 40 50 60 70 80
Voltage (V)
Time (ns)
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane
RClamp7524T
Final Datasheet Rev 5
Revision Date 10/24/2016
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Application Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech’s recommended assembly guidelines for
mounting this device. The gure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
aect the assembly process. The exact manufacturing
parameters will require some experimentation to get the
desired solder application.
Assembly Parameter Recommendation
Solder Stencil Design Laser cut, Electro-polished
Aperture shape Rectangular
Solder Stencil Thickness 0.100 mm (0.004”)
Solder Paster Type Type 4 size sphere or smaller
Solder Reow Prole Per JEDEC J-STD-020
PCB Solder Pad Design Non-Solder mask dened
PCB Pad Finish OSP Or NiAu
All Dimensions are in mm.
Component
Land Pad. Stencil opening
0.250
0.025
0.450
0.025
0.020
0.450
0.500
0.180
0.250
0.800
1.300
Recommended Mounting Pattern
RClamp7524T
Final Datasheet Rev 5
Revision Date 10/24/2016
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Application Information
Application Information
HDMI 1.4 Type A Connector
RClamp7528T
RClamp7524T
RClamp7524T
RClamp7524T
VBus
TMDS-
TMDS+
CBUS
GND
HDMI 1.4 Layout with RClamp7524T
MHL Layout with RClamp7524T
RClamp7524T
Final Datasheet Rev 5
Revision Date 10/24/2016
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Semtech
Outline Drawing - SLP1308N5T
Land Pattern - SLP1308N5T
e
bbb C A B
b
bbb
aaa
N
e
D
DIM
A1
A2
A
0.23
0.13 0.18
0.08
0.10
5
1.30
0.45 BSC
MILLIMETERS
MAX
0.05
0.43
DIMENSIONS
MIN
0.00
NOM
0.37
0.02
(0.13)
0.40
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
1.
0.80
E
1.401.20
0.70 0.90
AB
PIN 1
INDICATOR
(LASER MARK)
aaa C
C
SEATING
PLANE
e1 0.50 BSC
L0.20 0.25 0.30
1
N
2
e1/2
e1
D
E
A2 A1
A
D/2
E/2 LxN
bxN
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
DIM
X
Y
P1
G
C
MILLIMETERS
(0.65)
0.18
0.40
0.50
0.25
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
1.05
Z
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
P0.45
X
P
Y
Z
G
(C)
P1/2
P1
RClamp7524T
Final Datasheet Rev 5
Revision Date 10/24/2016
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Semtech
Marking Code
7524T
YYWW
Note: YYWW = Date Code
Tape and Reel Specication
Ordering Information
Part Number Qty per Reel Reel Size
RClamp7524T.TNT 10,000 7”
Pin 1 Location (Towards Sprocket Holes)
User Direction of feed
7524T
YYWW
7524T
YYWW
7524T
YYWW
7524T
YYWW
7524T
YYWW
7524T
YYWW
RClamp7524T
Final Datasheet Rev 5
Revision date 10/24/2016
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Semtech
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
IMPORTANT NOTICE
Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a
guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right
to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders
and should verify that such information is current and complete. Semtech warrants performance of its products to the specications applicable at the time
of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES
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© Semtech 2015