TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 NPN SILICON LOW POWER TRANSISTOR Qualified per MIL-PRF-19500/376 DEVICES LEVELS 2N2484 2N2484UA 2N2484UB 2N2484UBC * JAN JANTX JANTXV JANS * Available to JANS quality level only. ABSOLUTE MAXIMUM RATINGS (TC = +25C unless otherwise noted) Parameters / Test Conditions Symbol Value Unit Collector-Emitter Voltage VCEO 60 Vdc Collector-Base Voltage VCBO 60 Vdc Emitter-Base Voltage VEBO 6.0 Vdc IC 50 mAdc PT 360 mW TJ, Tstg -65 to +200 C Symbol Value Unit RJA 325 275 350 C/W Collector Current Total Power Dissipation @ TA = +25C (1) Operating & Storage Junction Temperature Range TO-18 (TO-206AA) 2N2484 THERMAL CHARACTERISTICS Parameters / Test Conditions Thermal Resistance, Ambient-to-Case 2N2484 2N2484UA 2N2484UB, UBC 1. See 19500/376 for Thermal Performance Curves. 2N2484UA ELECTRICAL CHARACTERISTICS (TA = +25C, unless otherwise noted) Parameters / Test Conditions Symbol Min. V(BR)CEO 60 Max. Unit OFF CHARACTERTICS Collector-Emitter Breakdown Voltage IC = 10mAdc Collector-Emitter Cutoff Current VCE = 45Vdc Collector-Base Cutoff Current VCB = 45Vdc VCB = 60Vdc Collector-Emitter Cutoff Current VCE = 5.0Vdc T4-LDS-0058 Rev. 2 (110016) Vdc ICES 5.0 Adc ICBO 5.0 10 Adc Adc ICEO 2.0 Adc 2N2484UB, UBC (UBC = Ceramic Lid Version) Page 1 of 6 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 ELECTRICAL CHARACTERISTICS (TA = +25C, unless otherwise noted) Parameters / Test Conditions OFF CHARACTERISTICS Emitter-Base Cutoff Current VEB = 5.0Vdc VEB = 6.0Vdc Symbol Min. IEBO Max. Unit 2.0 10 Adc Adc ON CHARACTERISTICS (2) Forward-Current Transfer Ratio IC = 1.0Adc, VCE = 5.0Vdc IC = 10Adc, VCE = 5.0Vdc IC = 100Adc, VCE = 5.0Vdc IC = 500Adc, VCE = 5.0Vdc IC = 1.0mAdc, VCE = 5.0Vdc IC = 10mAdc, VCE = 5.0Vdc hFE Collector-Emitter Saturation Voltage IC = 1.0mAdc, IB = 100Adc VCE(sat) Base-Emitter Voltage VCE = 5.0Vdc, IC = 100Adc VBE(ON) 45 200 225 250 250 225 500 675 800 800 800 0.3 Vdc 0.5 0.7 Vdc Symbol Min. Max. Unit |hfe| 3.0 2.0 0.7 DYNAMIC CHARACTERISTICS Parameters / Test Conditions Forward Current Transfer Ratio IC = 50Adc, VCE = 5.0Vdc, f = 5.0MHz IC = 500Adc, VCE = 5.0Vdc, f = 30MHz Open Circuit Output Admittance IC = 1.0mAdc, VCE = 5.0Vdc, f = 1.0kHz hoe 40 Open Circuit Reverse-Voltage Transfer Ratio IC = 1.0mAdc, VCE = 5.0Vdc, f = 1.0kHz hre 8.0 x 10-4 Input Impedance IC = 1.0mAdc, VCE = 5.0Vdc, f = 1.0kHz hje 3.5 24 Small-Signal Short-Circuit Forward Current Transfer Ratio IC = 1.0mAdc, VCE = 5.0Vdc, f = 1.0kHz hfe 250 900 mhos k Output Capacitance VCB = 5.0Vdc, IE = 0, 100kHz f 1.0MHz Cobo 5.0 pF Input Capacitance VEB = 0.5Vdc, IC = 0, 100kHz f 1.0MHz Cibo 6.0 pF (2) Pulse Test: Pulse Width = 300s, Duty Cycle 2.0%. T4-LDS-0058 Rev. 2 (110016) Page 2 of 6 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 PACKAGE DIMENSIONS Symbol CD CH HD LC LD LL LU L1 L2 P Q TL TW r Dimensions Inches Millimeters Min Max Min Max .178 .195 4.52 4.95 .170 .210 4.32 5.33 .209 .230 5.31 5.84 .100 TP 2.54 TP .016 .021 0.41 0.53 .500 .750 12.70 19.05 .016 .019 0.41 0.48 .050 1.27 .250 6.35 .100 2.54 .040 1.02 .028 .048 0.71 1.22 .036 .046 0.91 1.17 .010 0.25 45 TP 45 TP Notes 6 7,8 7,8 7,8 7,8 7,8 5 3,4 3 10 6 NOTE: 1. 2. 3. 4. 5. 6. Dimension are in inches. Millimeters are given for general information only. Beyond r (radius) maximum, TW shall be held for a minimum length of .011 inch (0.28 mm). Dimension TL measured from maximum HD. Body contour optional within zone defined by HD, CD, and Q. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. 7. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled in L1 and beyond LL minimum. 8. All three leads. 9. The collector shall be internally connected to the case. 10. Dimension r (radius) applies to both inside corners of tab. 11. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. 12. Lead 1 = emitter, lead 2 = base, lead 3 = collector. FIGURE 1. Physical dimensions (similar to TO-18). T4-LDS-0058 Rev. 2 (110016) Page 3 of 6 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com NOTE: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Dimension CH controls the overall package thickness. 4. 5. 6. 7. When a window lid is used, dimension CH must increase by a minimum of .010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm). The corner shape (square, notch, radius) may vary at the manufacturer's option, from that shown on the drawing. Dimensions LW2 minimum and L3 minimum and the appropriate castellation length define an unobstructed three-dimensional space traversing all of the ceramic layers in which a castellation was designed. (Castellations are required on the bottom two layers, optional on the top ceramic layer.) Dimension LW2 maximum and L3 maximum define the maximum width and depth of the castellation at any point on its surface. Measurement of these dimensions may be made prior to solder dipping. The co-planarity deviation of all terminal contact points, as defined by the device seating plane, shall not exceed .006 inch (0.15mm) for solder dipped leadless chip carriers. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Symbol BL BL2 BW BW2 CH L3 LH LL1 LL2 LS LW LW2 Pin no. Transistor Dimensions Inches Millimeters Min Max Min Max .215 .225 5.46 5.71 .225 5.71 .145 .155 3.68 3.94 .155 3.94 .061 .075 1.55 1.91 .003 .007 0.08 0.18 .029 .042 0.74 1.07 .032 .048 0.81 1.22 .072 .088 1.83 2.24 .045 .055 1.14 1.39 .022 .028 0.56 0.71 .006 .022 0.15 0.56 1 Collector 2 Emitter 3 Base Notes 3 5 5 4 N/C FIGURE 2. Physical dimensions, surface mount (2N2484UA). T4-LDS-0058 Rev. 2 (110016) Page 4 of 6 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Symbol BH BL BW CL CW LL1 LL2 Dimensions Inches Millimeters Min Max Min Max .046 .056 1.17 1.42 .115 .128 2.92 3.25 .085 .108 2.16 2.74 .128 3.25 .108 2.74 .022 .038 0.56 0.97 .017 .035 0.43 0.89 Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Note Symbol LS1 LS2 LW r r1 r2 Dimensions Inches Millimeters Min Max Min Max .036 .040 0.91 1.02 .071 .079 1.80 2.01 .016 .024 0.41 0.61 .008 .203 .012 .305 .022 .559 Note NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Hatched areas on package denote metallized areas 4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 3. Physical dimensions, surface mount (2N2484UB). T4-LDS-0058 Rev. 2 (110016) Page 5 of 6 TECHNICAL DATA SHEET 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http://www.microsemi.com Symbol BH BL BW CL CW LL1 LL2 Dimensions Inches Millimeters Min Max Min Max .046 .071 1.17 1.80 .115 .128 2.92 3.25 .085 .108 2.16 2.74 .128 3.25 .108 2.74 .022 .038 0.56 0.97 .017 .035 0.43 0.89 Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Note Symbol LS1 LS2 LW r r1 r2 Dimensions Inches Millimeters Min Max Min Max .036 .040 0.91 1.02 .071 .079 1.80 2.01 .016 .024 0.41 0.61 .008 .203 .012 .305 .022 .559 Note NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = connected to the lid braze ring. 4. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 4. Physical dimensions, surface mount (2N2484UBC). 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