74F00
Quad 2-input NAND gate
Product specification
IC15 Data Handbook
1990 Oct 04
INTEGRATED CIRCUITS
Philips Semiconductors Product specification
74F00Quad 2-input NAND gate
2
October 4, 1990 853-0325 00623
FEATURE
•Industrial temperature range available (–40°C to +85°C)
TYPE TYPICAL
PROPAGATION
DELAY
TYPICAL
SUPPLY CURRENT
(TOTAL)
74F00 3.4ns 4.4mA
PIN CONFIGURATION
14
13
12
11
10
9
87
6
5
4
3
2
1
GND
VCC
D2b
D2a
Q2
Q3
D3b
D3a
D0a
D0b
Q1
Q0
D1a
D1b
SF00001
ORDERING INFORMATION
ORDER CODE
DESCRIPTION COMMERCIAL RANGE
VCC = 5V ±10%, Tamb = 0°C to +70°CINDUSTRIAL RANGE
VCC = 5V ±10%, Tamb = –40°C to +85°CPKG DWG #
14-pin plastic DIP N74F00N I74F00N SOT27-1
14-pin plastic SO N74F00D I74F00D SOT108-1
INPUT AND OUTPUT LOADING AND FAN OUT TABLE
PINS DESCRIPTION 74F (U.L.) HIGH/LOW LOAD VALUE HIGH/LOW
Dna, Dnb Data inputs 1.0/1.0 20µA/0.6mA
Qn Data output 50/33 1.0mA/20mA
NOTE: One (1.0) FAST unit load is defined as: 20µA in the high state and 0.6mA in the low state.
LOGIC DIAGRAM
D0a
D0b
D1a
D1b
D2a
Q0
D2b
D3a
D3b
Q1
Q2
Q3
VCC = Pin 14
GND = Pin 7
3
6
8
11
1
2
4
5
9
10
12
13
SF00002
FUNCTION TABLE
INPUTS OUTPUT
Dna Dnb Qn
L L H
L H H
H L H
H H L
NOTES:
H = High voltage level
L = Low voltage level
LOGIC SYMBOL
D0a D0bD1a D2a D2b D3a D3bD1b
Q0 Q1 Q2 Q3
36811
12459101213
VCC = Pin 14
GND = Pin 7
SF00003
IEC/IEEE SYMBOL
1
2
4
5
9
10
12
13
&3
6
8
11
SF00004
Philips Semiconductors Product specification
74F00Quad 2-input NAND gate
October 4, 1990 3
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device.
Unless otherwise noted these limits are over the operating free air temperature range.)
SYMBOL PARAMETER RATING UNIT
VCC Supply voltage –0.5 to +7.0 V
VIN Input voltage –0.5 to +7.0 V
IIN Input current –30 to +5 mA
VOUT Voltage applied to output in high output state –0.5 to VCC V
IOUT Current applied to output in low output state 40 mA
Tamb Operating free air temperature range Commercial range 0 to +70 °C
Industrial range –40 to +85 °C
Tstg Storage temperature range –65 to +150 °C
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER LIMITS UNIT
MIN NOM MAX
VCC Supply voltage 4.5 5.0 5.5 V
VIH High-level input voltage 2.0 V
VIL Low-level input voltage 0.8 V
IIk Input clamp current –18 mA
IOH High-level output current –1 mA
IOL Low-level output current 20 mA
Tamb Operating free air temperature range Commercial range 0 +70 °C
Industrial range –40 +85 °C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL PARAMETER TEST CONDITIONS1LIMITS UNIT
MIN TYP2MAX
VOH High-level output voltage VCC = MIN, VIL = MAX ±10%VCC 2.5 V
VIH = MIN, IOH = MAX ±5%VCC 2.7 3.4 V
VOL Low-level output voltage VCC = MIN, VIL = MAX ±10%VCC 0.30 0.50 V
VIH = MIN, IOl = MAX ±5%VCC 0.30 0.50 V
VIK Input clamp voltage VCC = MIN, II = IIK -0.73 -1.2 V
IIInput current at maximum input
voltage VCC = MAX, VI = 7.0V 100 µA
IIH High-level input current VCC = MAX, VI = 2.7V 20 µA
IIL Low-level input current VCC = MAX, VI = 0.5V -0.6 mA
IOS Short-circuit output current3VCC = MAX -60 -150 mA
ICC Supply current (total) ICCH VCC = MAX VIN = GND 1.9 2.8 mA
ICCL VCC = MAX VIN = 4.5V 6.8 10.2 mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
Philips Semiconductors Product specification
74F00Quad 2-input NAND gate
October 4, 1990 4
AC ELECTRICAL CHARACTERISTICS
LIMITS
TEST
VCC = +5.0V VCC = +5.0V ± 10% VCC = +5.0V ± 10%
SYMBOL PARAMETER
TEST
CONDITION
Tamb = +25°C Tamb = 0°C to +70°C Tamb = –40°C to +85°C UNIT
CONDITION
CL = 50pF, RL = 500ΩCL = 50pF, RL = 500ΩCL = 50pF, RL = 500Ω
MIN TYP MAX MIN MAX MIN MAX
tPLH
tPHL Propagation delay
Dna, Dnb to Qn Waveform 1 2.4
2.0 3.7
3.2 5.0
4.3 2.4
2.0 6.0
5.3 2.0
1.5 6.5
6.0 ns
AC WAVEFORMS
For all waveforms, VM = 1.5V.
VM
VM
VM
VM
Qn
Dna, Dnb
tPHL tPLH
SF00005
W aveform 1. Propagation delay for inverting outputs
TEST CIRCUIT AND WAVEFORM
tw90%
VM
10%
90%
VM10%
90%
VM10%
90%
VM
10%
NEGATIVE
PULSE
POSITIVE
PULSE
tw
AMP (V)
0V
0V
tTHL (tf )
INPUT PULSE REQUIREMENTS
rep. rate twtTLH tTHL
1MHz 500ns 2.5ns 2.5ns
Input Pulse Definition
VCC
family
74F
D.U.T.
PULSE
GENERATOR
RL
CL
RT
VIN VOUT
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
RL= Load resistor;
see AC ELECTRICAL CHARACTERISTICS for value.
CL= Load capacitance includes jig and probe capacitance;
see AC ELECTRICAL CHARACTERISTICS for value.
RT= Termination resistance should be equal to ZOUT of
pulse generators.
tTHL (tf )
tTLH (tr )
tTLH (tr )AMP (V)
amplitude
3.0V 1.5V
VM
SF00006
Philips Semiconductors Product specification
74F00Quad 2-input NAND gate
1990 Oct 04 5
DIP14: plastic dual in-line package; 14 leads (300 mil) SOT27-1
Philips Semiconductors Product specification
74F00Quad 2-input NAND gate
1990 Oct 04 6
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
Philips Semiconductors Product specification
74F00Quad 2-input NAND gate
1990 Oct 04 7
NOTES
Philips Semiconductors Product specification
74F00Quad 2-input NAND gate
yyyy mmm dd 8
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may af fect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 10-98
Document order number: 9397-750-05051
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition [1]
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
Data sheet status
[1] Please consult the most recently issued datasheet before initiating or completing a design.
