Product Folder Sample & Buy Technical Documents Support & Community Tools & Software LM2660 SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 LM2660 Switched Capacitor Voltage Converter 1 Features 3 Description * * * * * * The LM2660 CMOS charge-pump voltage converter is a versatile unregulated switched capacitor inverter or doubler. Operating from a wide 1.5-V to 5.5-V supply voltage, the LM2660 uses two low-cost capacitors to provide 100 mA of output current without the cost, size and EMI related to inductorbased converters. With an operating current of only 120 A and operating efficiency greater than 90% at most loads, the LM2660 provides ideal performance for battery-powered systems. LM2660 devices can be operated directly in parallel to lower output impedance, thus providing more current at a given voltage. 1 Inverts or Doubles Input Supply Voltage Narrow SOIC and VSSOP Packages 6.5- Typical Output Resistance 88% Typical Conversion Efficiency at 100 mA Selectable Oscillator Frequency: 10 kHz/80 kHz Optional External Oscillator Input 2 Applications * * * * * * Laptop Computers Cellular Phones Medical Instruments Operational Amplifier Power Supplies Interface Power Supplies Handheld Instruments space space space space The FC (frequency control) pin selects between a nominal 10-kHz or 80-kHz oscillator frequency. The oscillator frequency can be lowered by adding an external capacitor to the OSC pin. Also, the OSC pin may be used to drive the LM2660 with an external clock up to 150 kHz. Through these methods, output ripple frequency and harmonics may be controlled. Additionally, the LM2660 may be configured to divide a positive input voltage precisely in half. In this mode, input voltages as high as 11 V may be used. Device Information(1) PART NUMBER LM2660 PACKAGE BODY SIZE (NOM) SOIC (8) 4.90 mm x 3.91 mm VSSOP (8) 3.00 mm x 3.00 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Simplified Schematic 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM2660 SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... Handling Ratings....................................................... Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. 7 Parameter Measurement Information .................. 8 8 Detailed Description .............................................. 9 7.1 Test Circuits .............................................................. 8 8.1 Overview ................................................................... 9 8.2 Functional Block Diagram ......................................... 9 8.3 Feature Description................................................... 9 8.4 Device Functional Modes........................................ 10 9 Application and Implementation ........................ 11 9.1 Application Information............................................ 11 9.2 Typical Applications ............................................... 11 10 Power Supply Recommendations ..................... 16 11 Layout................................................................... 17 11.1 Layout Guidelines ................................................. 17 11.2 Layout Example .................................................... 17 12 Device and Documentation Support ................. 18 12.1 12.2 12.3 12.4 Device Support .................................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 18 18 18 18 13 Mechanical, Packaging, and Orderable Information ........................................................... 19 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision D (May 2013) to Revision E * Added Device Information and Handling Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; moved some curves to Application Curves section ............. 1 Changes from Revision C (May 2013) to Revision D * 2 Page Page Changed layout of National Data Sheet to TI format ........................................................................................................... 15 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 LM2660 www.ti.com SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 5 Pin Configuration and Functions SOIC (D) and VSSOP (DGK) 8 Pins Top View Pin Functions PIN NUMBER NAME DESCRIPTION TYPE VOLTAGE INVERTER VOLTAGE DOUBLER Frequency control for internal oscillator: FC = open, fOSC = 10 kHz (typ); 1 FC Input FC = V+, fOSC = 80 kHz (typ); Same as inverter. FC has no effect when OSC pin is driven externally. 2 CAP+ Power Connect this pin to the positive terminal of chargeSame as inverter. pump capacitor. 3 GND Ground Power supply ground input. Power supply positive voltage input. 4 CAP- Power Connect this pin to the negative terminal of charge-pump capacitor. Same as inverter. 5 OUT Power Negative voltage output. Power supply ground input. LV must be tied to OUT. 6 LV Input Low-voltage operation input. Tie LV to GND when input voltage is less than 3.5 V. Above 3.5 V, LV can be connected to GND or left open. When driving OSC with an external clock, LV must be connected to GND. 7 OSC Input Oscillator control input. OSC is connected to an internal 15-pF capacitor. An external capacitor can Same as inverter except that OSC cannot be be connected to slow the oscillator. Also, an driven by an external clock. external clock can be used to drive OSC. 8 V+ Power Power supply positive voltage input. Positive voltage output. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 3 LM2660 SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN Supply voltage (V+ to GND, or GND to OUT) MAX UNIT 6 V LV (OUT - 0.3 V) to (GND + 3 V) V FC, OSC The least negative of (OUT - 0.3 V) or (V+ - 6 V) to (V+ + 0.3 V) V V+ and OUT continuous output current Output short-circuit duration to GND (2) 120 mA 1 second Power dissipation SOIC (D) (3) 735 mW Power dissipation VSSOP (DGK) (3) 500 mW 300 C 85 C Lead temperature (soldering, 10 seconds) Operating junction temperature (1) (2) (3) -40 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and should be avoided. Also, for temperatures above 85C, OUT must not be shorted to GND or V+, or device may be damaged. The maximum allowable power dissipation is calculated by using PDMax = (TJMax - TA)/RJA, where TJMax is the maximum junction temperature, TA is the ambient temperature, and RJA is the junction-to-ambient thermal resistance of the specified package. 6.2 Handling Ratings Tstg Storage temperature range V(ESD) Electrostatic discharge (1) MIN MAX UNIT -65 150 C Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) 2000 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN V+ (supply voltage) NOM MAX Inverter, LV = Open 3.5 5.5 Inverter, LV = GND 1.5 5.5 Doubler, LV = OUT 2.5 5.5 -40 85 Junction temperature (TJ) UNIT C 6.4 Thermal Information LM2660 THERMAL METRIC RJA (1) 4 (1) Junction-to-ambient thermal resistance SOIC (D) VSSOP (DGK) 8 PINS 8 PINS 170 250 UNIT C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 LM2660 www.ti.com SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 6.5 Electrical Characteristics Limits in for typical (TYP) values are for TJ = 25C, and limits in for minimum (MIN) and maximum (MAX) values apply over the full operating temperature range; V+ = 5V, FC = Open, C1 = C2 = 150 F, unless otherwise specified in the Test Conditions. (1) PARAMETER V+ Supply voltage TEST CONDITIONS RL = 1k ROUT Output resistance (2) IL = 100 mA fOSC Oscillator frequency OSC = Open fSW Switching frequency (3) OSC = Open IOSC OSC input current Power efficiency 1.5 5.5 Doubler, LV = OUT 2.5 FC = V+ Output current PEFF Inverter, LV = GND LV = Open IL TA 85C, OUT -4 V 100 TA > 85C, OUT -3.8 V 100 TA 85C FC = Open (1) (2) (3) 0.5 1 3 10 12 5 10 FC = V+ 40 80 FC = Open 2.5 5 FC = V+ 20 40 2 FC = V+ 16 RL (1k) between V+ and OUT 96% 98% RL (500) between GND and OUT 92% 96% 99% 99.96% Voltage conversion efficiency No Load V mA mA 6.5 FC = Open UNIT 5.5 0.12 TA > 85C IL = 100 mA to GND VOEFF MAX 5.5 FC = Open Supply current TYP 3.5 No Load IQ MIN Inverter, LV = Open kHz kHz A 88% In the test circuit, capacitors C1 and C2 are 0.2- maximum ESR capacitors. Capacitors with higher ESR will increase output resistance, reduce output voltage and efficiency. Specified output resistance includes internal switch resistance and capacitor ESR. The output switches operate at one half of the oscillator frequency, fOSC = 2fSW. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 5 LM2660 SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 www.ti.com 6.6 Typical Characteristics (Circuit of Figure 12) 6 Figure 1. Supply Current vs Supply Voltage Figure 2. Supply Current vs Oscillator Frequency Figure 3. Output Source Resistance vs Supply Voltage Figure 4. Output Source Resistance vs Temperature Figure 5. Output Voltage Drop vs Load Current Figure 6. Output Voltage vs Oscillator Frequency Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 LM2660 www.ti.com SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 Typical Characteristics (continued) (Circuit of Figure 12) Figure 7. Oscillator Frequency vs External Capacitance Figure 8. Oscillator Frequency vs Supply Voltage (Fc = V+) Figure 9. Oscillator Frequency vs Supply Voltage (Fc = Open) Figure 10. Oscillator Frequency vs Temperature (Fc = V+) Figure 11. Oscillator Frequency vs Temperature (Fc = Open) Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 7 LM2660 SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 www.ti.com 7 Parameter Measurement Information 7.1 Test Circuits Figure 12. LM2660 Test Circuit 8 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 LM2660 www.ti.com SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 8 Detailed Description 8.1 Overview The LM2660 contains four large CMOS switches which are switched in a sequence to invert the input supply voltage. Energy transfer and storage are provided by external capacitors. Figure 13 illustrates the voltage conversion scheme. When S1 and S3 are closed, C1 charges to the supply voltage V+. During this time interval switches S2 and S4 are open. In the second time interval, S1 and S3 are open and S2 and S4 are closed, C1 is charging C2. After a number of cycles, the voltage across C2 will be pumped to V+. Since the anode of C2 is connected to ground, the output at the cathode of C2 equals -(V+) assuming no load on C2, no loss in the switches, and no ESR in the capacitors. In reality, the charge transfer efficiency depends on the switching frequency, the on-resistance of the switches, and the ESR of the capacitors. Figure 13. Voltage Inverting Principle 8.2 Functional Block Diagram LM2660 V+ OUT FC OSCILLATOR OSC Switch Array Switch Drivers LV CAP+ CAPGND 8.3 Feature Description 8.3.1 Changing Oscillator Frequency The internal oscillator frequency can be selected using the Frequency Control (FC) pin. When FC is open, the oscillator frequency is 10 kHz; when FC is connected to V+, the frequency increases to 80 kHz. A higher oscillator frequency allows smaller capacitors to be used for equivalent output resistance and ripple, but increases the typical supply current from 0.12 mA to 1 mA. The oscillator frequency can be lowered by adding an external capacitor between OSC and GND. (See Typical Characteristics.) Also, in the inverter mode, an external clock that swings within 100 mV of V+ and GND can be used to drive OSC. Any CMOS logic gate is suitable for driving OSC. LV must be grounded when driving OSC. The maximum external clock frequency is limited to 150 kHz. The switching frequency of the converter (also called the charge pump frequency) is half of the oscillator frequency. NOTE OSC cannot be driven by an external clock in the voltage-doubling mode. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 9 LM2660 SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 www.ti.com Feature Description (continued) Table 1. LM2660 Oscillator Frequency Selection FC OSC OSCILLATOR Open Open 10 kHz V+ Open 80 kHz Open or V+ External Capacitor See Typical Characteristics N/A External Clock External Clock (inverter mode only) Frequency 8.4 Device Functional Modes When V+ is applied to the LM2660, the device becomes enabled and will operate in which ever configuration the device is placed (inverter, doubler, etc.). 10 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 LM2660 www.ti.com SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The LM2660 CMOS charge-pump voltage converter is a versatile unregulated switched capacitor inverter or doubler. Operating from a wide 1.5 V to 5.5 V supply voltage, the LM2660 uses two low-cost capacitors to provide 100 mA of output current without the cost, size and EMI related to inductor-based converters. With an operating current of only 120 A and operating efficiency greater than 90% at most loads, the LM2660 provides ideal performance for battery-powered systems. LM2660 devices can be operated directly in parallel to lower output impedance, thus providing more current at a given voltage. 9.2 Typical Applications 9.2.1 Voltage Inverter Figure 14. LM2660 Voltage Inverter 9.2.1.1 Design Requirements The main application of LM2660 is to generate a negative supply voltage. The voltage inverter circuit uses only two external capacitors as shown in the Figure 14. The range of the input supply voltage is 1.5 V to 5.5 V. For a supply voltage less than 3.5V, the LV pin must be connected to ground to bypass the internal regulator circuitry. This gives the best performance in low voltage applications. If the supply voltage is greater than 3.5 V, LV may be connected to ground or left open. The choice of leaving LV open simplifies the direct substitution of the LM2660 for the LMC7660 Switched Capacitor Voltage Converter. 9.2.1.2 Detailed Design Procedure The output characteristics of this circuit can be approximated by an ideal voltage source in series with a resistor. The voltage source equals -(V+). The output resistance Rout is a function of the ON resistance of the internal MOS switches, the oscillator frequency, and the capacitance and ESR of C1 and C2. A good approximation is: where * RSW is the sum of the ON resistance of the internal MOS switches shown in Figure 13. (1) High value, low ESR capacitors will reduce the output resistance. Instead of increasing the capacitance, the oscillator frequency can be increased to reduce the 2/(fosc x C1) term. Once this term is trivial compared with RSW and ESRs, further increasing in oscillator frequency and capacitance will become ineffective. The peak-to-peak output voltage ripple is determined by the oscillator frequency, and the capacitance and ESR of the output capacitor C2: (2) Again, using a low ESR capacitor will result in lower ripple. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 11 LM2660 SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 www.ti.com Typical Applications (continued) 9.2.1.2.1 Capacitor Selection The output resistance and ripple voltage are dependent on the capacitance and ESR values of the external capacitors. The output voltage drop is the load current times the output resistance, and the power efficiency is where * * IQ(V+) is the quiescent power loss of the IC device, and IL2ROUT is the conversion loss associated with the switch on-resistance, the two external capacitors and their ESRs. (3) Since the switching current charging and discharging C1 is approximately twice as the output current, the effect of the ESR of the pumping capacitor C1 is multiplied by four in the output resistance. The output capacitor C2 is charging and discharging at a current approximately equal to the output current, therefore, its ESR only counts once in the output resistance. However, the ESR of C2 directly affects the output voltage ripple. Therefore, low ESR capacitors (Table 2) are recommended for both capacitors to maximize efficiency, reduce the output voltage drop and voltage ripple. For convenience, C1 and C2 are usually chosen to be the same. The output resistance varies with the oscillator frequency and the capacitors. In Figure 15, the output resistance vs. oscillator frequency curves are drawn for three different tantalum capacitors. At very low frequency range, capacitance plays the most important role in determining the output resistance. Once the frequency is increased to some point (such as 20 kHz for the 150 F capacitors), the output resistance is dominated by the ON resistance of the internal switches and the ESRs of the external capacitors. A low value, smaller size capacitor usually has a higher ESR compared with a bigger size capacitor of the same type. For lower ESR, use ceramic capacitors. Figure 15. Output Source Resistance vs Oscillator Frequency Table 2. Low ESR Capacitor Manufacturers MANUFACTURER CAPACITOR TYPE Nichicon Corp. PL, PF series, through-hole aluminum electrolytic AVX Corp. TPS series, surface-mount tantalum Sprague 593D, 594D, 595D series, surface-mount tantalum Sanyo OS-CON series, through-hole aluminum electrolytic 12 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 LM2660 www.ti.com SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 9.2.1.2.2 Paralleling Devices Any number of LM2660s can be paralleled to reduce the output resistance. Each device must have its own pumping capacitor C1, while only one output capacitor Cout is needed as shown in Figure 16. The composite output resistance is: Rout = Rout of each LM2660 Number of Devices (4) Figure 16. Lowering Output Resistance By Paralleling Devices 9.2.1.2.3 Cascading Devices Cascading the LM2660s is an easy way to produce a greater negative voltage (as shown in Figure 17). If n is the integer representing the number of devices cascaded, the unloaded output voltage Vout is (-nVin). The effective output resistance is equal to the weighted sum of each individual device: (5) A three-stage cascade circuit shown in Figure 18 generates -3 Vin, from Vin. Cascading is also possible when devices are operating in doubling mode. In Figure 19, two devices are cascaded to generate 3 Vin. An example of using the circuit in Figure 18 or Figure 19 is generating +15 V or -15 V from a +5 V input. Note that, the number of n is practically limited since the increasing of n significantly reduces the efficiency and increases the output resistance and output voltage ripple. Figure 17. Increasing Output Voltage by Cascading Devices Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 13 LM2660 SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 www.ti.com Figure 18. Generating -3VIN from +VIN Figure 19. Generating +3VIN from +VIN 9.2.1.2.4 Regulating VOUT It is possible to regulate the output of the LM2660 by use of a low dropout regulator (such as LP2951). The whole converter is depicted in Figure 20. This converter can give a regulated output from -1.5 V to -5.5 V by choosing the proper resistor ratio: where * Vref = 1.235 V (6) The error flag on pin 5 of the LP2951 goes low when the regulated output at pin 4 drops by about 5%. The LP2951 can be shutdown by taking pin 3 high. Figure 20. Combining LM2660 With LP2951 to Make a Negative Adjustable Regulator 14 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 LM2660 www.ti.com SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 Also, as shown in Figure 21 by operating LM2660 in voltage doubling mode and adding a linear regulator (such as LP2981) at the output, we can get +5 V output from an input as low as +3 V. Figure 21. Generating +5 V from +3 V Input Voltage 9.2.1.3 Application Curves Figure 22. Efficiency vs Load Current Figure 23. Efficiency vs Oscillator Frequency 9.2.2 Positive Voltage Doubler Figure 24. LM2660 Voltage Doubler 9.2.2.1 Design Requirements The LM2660 can operate as a positive voltage doubler (as shown in the Figure 24). The doubling function is achieved by reversing some of the connections to the device. The input voltage is applied to the GND pin with an allowable voltage from 2.5 V to 5.5 V. The V+ pin is used as the output. The LV pin and OUT pin must be connected to ground. The OSC pin can not be driven by an external clock in this operation mode. The unloaded output voltage is twice of the input voltage and is not reduced by the diode D1's forward drop. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 15 LM2660 SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 www.ti.com 9.2.2.2 Detailed Design Procedure The Schottky diode D1 is only needed for start-up. The internal oscillator circuit uses the V+ pin and the LV pin (connected to ground in the voltage doubler circuit) as its power rails. Voltage across V+ and LV must be larger than 1.5 V to insure the operation of the oscillator. During start-up, D1 is used to charge up the voltage at V+ pin to start the oscillator; also, it protects the device from turning-on its own parasitic diode and potentially latching-up. Therefore, the Schottky diode D1 should have enough current carrying capability to charge the output capacitor at start-up, as well as a low forward voltage to prevent the internal parasitic diode from turning-on. A Schottky diode like 1N5817 can be used for most applications. If the input voltage ramp is less than 10V/ms, a smaller Schottky diode like MBR0520LT1 can be used to reduce the circuit size. 9.2.2.3 Application Curves See Application Curves in the Voltage Inverter section. 10 Power Supply Recommendations The LM2660 is designed to operate from as an inverter over an input voltage supply range between 1.5 V and 5.5 V when the LV pin is grounded. This input supply must be well regulated and capable to supply the required input current. If the input supply is located far from the LM2660 additional bulk capacitance may be required in addition to the ceramic bypass capacitors. 16 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 LM2660 www.ti.com SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 11 Layout 11.1 Layout Guidelines The high switching frequency and large switching currents of the LM2660 make the choice of layout important. The following steps should be used as a reference to ensure the device is stable and maintains proper LED current regulation across its intended operating voltage and current range: * Place CIN on the top layer (same layer as the LM2660) and as close to the device as possible. Connecting the input capacitor through short, wide traces to both the V+ and GND pins reduces the inductive voltage spikes that occur during switching which can corrupt the V+ line. * Place COUT on the top layer (same layer as the LM2660) and as close as possible to the OUT and GND pin. The returns for both CIN and COUT should come together at one point, as close to the GND pin as possible. Connecting COUT through short, wide traces reduce the series inductance on the OUT and GND pins that can corrupt the VOUT and GND lines and cause excessive noise in the device and surrounding circuitry. * Place C1 on the top layer (same layer as the LM2660) and as close to the device as possible. Connect the flying capacitor through short, wide traces to both the CAP+ and CAP- pins. 11.2 Layout Example LM2660 FC CAP+ V+ OSC GND LV CAP- OUT Figure 25. LM2660 Layout Example Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 17 LM2660 SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 www.ti.com 12 Device and Documentation Support 12.1 Device Support 12.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 12.2 Trademarks All trademarks are the property of their respective owners. 12.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.4 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 18 Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 LM2660 www.ti.com SNVS135E - SEPTEMBER 1999 - REVISED DECEMBER 2014 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 1999-2014, Texas Instruments Incorporated Product Folder Links: LM2660 19 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) LM2660-MWC ACTIVE WAFERSALE YS 0 1 RoHS & Green Call TI Level-1-NA-UNLIM -40 to 85 LM2660M NRND SOIC D 8 95 Non-RoHS & Non-Green Call TI Call TI -40 to 85 LM26 60M LM2660M/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM26 60M LM2660MM/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 S01A LM2660MX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LM26 60M (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2660MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2660MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Aug-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2660MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM2660MX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE D0008A SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT C SEATING PLANE .228-.244 TYP [5.80-6.19] A .004 [0.1] C PIN 1 ID AREA 6X .050 [1.27] 8 1 2X .150 [3.81] .189-.197 [4.81-5.00] NOTE 3 4X (0 -15 ) 4 5 B 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .150-.157 [3.81-3.98] NOTE 4 .069 MAX [1.75] .005-.010 TYP [0.13-0.25] 4X (0 -15 ) SEE DETAIL A .010 [0.25] .004-.010 [0.11-0.25] 0 -8 .016-.050 [0.41-1.27] DETAIL A (.041) [1.04] TYPICAL 4214825/C 02/2019 NOTES: 1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side. 4. This dimension does not include interlead flash. 5. Reference JEDEC registration MS-012, variation AA. www.ti.com EXAMPLE BOARD LAYOUT D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM SEE DETAILS 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X METAL SOLDER MASK OPENING EXPOSED METAL .0028 MAX [0.07] ALL AROUND SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL .0028 MIN [0.07] ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4214825/C 02/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN D0008A SOIC - 1.75 mm max height SMALL OUTLINE INTEGRATED CIRCUIT 8X (.061 ) [1.55] SYMM 1 8 8X (.024) [0.6] 6X (.050 ) [1.27] SYMM 5 4 (R.002 ) TYP [0.05] (.213) [5.4] SOLDER PASTE EXAMPLE BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X 4214825/C 02/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. 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