Pb
RoHS
EC2600ETTS-102.000M
EC26 00 ET TS -102.000M
Series
RoHS Compliant (Pb-free) 3.3V 4 Pad 5mm x 7mm
Ceramic SMD LVCMOS Oscillator
Frequency Tolerance/Stability
±100ppm Maximum
Operating Temperature Range
-40°C to +85°C
Nominal Frequency
102.000MHz
Pin 1 Connection
Tri-State (High Impedance)
Duty Cycle
50 ±10(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency 102.000MHz
Frequency Tolerance/Stability ±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at 25°C,
Shock, and Vibration)
Operating Temperature Range -40°C to +85°C
Supply Voltage 3.3Vdc ±10%
Input Current 40mA Maximum
Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH=-8mA)
Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL=+8mA)
Rise/Fall Time 3nSec Maximum (Measured at 20% to 80% of waveform)
Duty Cycle 50 ±10(%) (Measured at 50% of waveform)
Load Drive Capability 15pF Maximum
Output Logic Type CMOS
Pin 1 Connection Tri-State (High Impedance)
Tri-State Input Voltage (Vih and Vil) +0.7Vdd Minimum or No Connect to Enable Output, +0.3Vdd Maximum to Disable Output (High
Impedance)
Standby Current 10µA Maximum (Disabled Output: High Impedance)
RMS Phase Jitter 1pSec Maximum (12kHz to 20MHz offset frequency)
Start Up Time 10mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Flammability UL94-V0
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev U 8/12/2010 | Page 1 of 5
EC2600ETTS-102.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
1.6 +0.2/-0.5
5.00
±0.15
7.00
±0.15
MARKING
ORIENTATION
3.68
±0.15
1.4 ±01 1.2 ±0.2
2.60
±0.15
5.08
±0.15
12
34
PIN CONNECTION
1 Tri-State
2 Ground/Case Ground
3 Output
4 Supply Voltage
LINE MARKING
1ECLIPTEK
2102.00M
3XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
2.88
1.81
2.0 (X4)
2.2 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev U 8/12/2010 | Page 2 of 5
EC2600ETTS-102.000M
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
OUTPUT WAVEFORM & TIMING DIAGRAM
VOH
VOL
80% of Waveform
50% of Waveform
20% of Waveform
Fall
Time
Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
VIH
VIL
tPLZ tPZL
CLOCK OUTPUT TRI-STATE INPUT
Supply
Voltage
(VDD)
Test Circuit for CMOS Output
Output
No Connect
or Tri-State
Ground
+ +
+_
__
Power
Supply 0.01µF
(Note 1) 0.1µF
(Note 1) CL
(Note 3)
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Voltage
Meter
Current
Meter
Oscilloscope Frequency
Counter
Probe
(Note 2)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev U 8/12/2010 | Page 3 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EC2600ETTS-102.000M
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev U 8/12/2010 | Page 4 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EC2600ETTS-102.000M
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Additional Notes Temperatures shown are applied to body of device.
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev U 8/12/2010 | Page 5 of 5
