Engineering
Report 502-1166
20Jul04 Rev O
EC 0990-0981-04
Product Veri fi cati on of AMP* Power Seri es 120 Connectors
©2004 Tyco Electronics Corporation
Harrisburg, PA
All International Rights Reserved
* Trademark
| Ind icates cha nge 1 of 7
LOC B
1. INTRODUCTION
1.1. Purpose
Testi ng was performed on AMP* Power Series 120 Double and Singl e Pole Connectors to verif y
perf ormance of product subject ed to a vari ety of electrical, mechani cal and envi ronmental tests
including: crimp tensile, durability, low level contact resistance, contact retention, mating and unmating
for ces, temperature rise, UL 1977 Section 16, and CSA C22.2 No. 182.3- M1987.
1.2. Scope
This r eport covers connectors tested under test report s CTL B034992-003, B034992-004, B034992-
005, B034992- 006, B034992-007 and B034992- 010. Testi ng was performed by t he Engineeri ng
Assurance Pr oduct Test Laboratory.
2. DOUBLE POLE TESTING
2.1. Test Samples
Test samples were r epresentat ive of normal producti on lot s. Samples identifi ed with t he following part
numbers were used for test.
Sample
Group Quantity Part
Number Description
CTL B034992-003 - Crimp Tensil e
1,2 4 each 1604072-2 Reducing bushing crimped with 6 AWG wire
4 each 1445995 2 AWG contact
CTL B034992-004 - Durability, Contact Retention, Temperature Rise
1 4 1445998-2 Housing with 2, 2 AWG contacts
3 10 1445998-2 Housing with 2, 4 AWG contacts
8 2 1445998-2 Housing with 2, 6 AWG contacts with wire
9 2 1445998-2 Housing with 2, 4 AWG contacts with wire
CTL B034992-007 - Temperature Rise at Rated Current
1 6 1445994-2 Housing with 2, 2 AWG contacts
CTL B034992-010 - Mating/Unmating Force
1 2 1445994-1 Housing loaded with 2, 120 ampere contacts
Fi gure 1
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2.2. Test Resul ts
A. CTL B034992-003 - Crimp Tensile
Summary of crimp tensile results are shown in Figure 2. Samples were t ensiled at a maximum rate
of . 5 inch per minute. Maximum force val ues recorded unti l wires pulled fr om contacts.
Sample ID Maximum Load (lbs) Proof Load (lbs)
1 378.29 20.00
2 381.20 20.00
3 387.76 20.00
4 389.51 20.00
Fi gure 2
Crimp Tensile
B. CTL B034992-004 - Durability, Contact Retention and Temperat ure Ri se vs Current.
1. Sample Group 1 - Durability with Temperature Rise vs Current
2. Test Sequence:
a. I nit ial t emperature r ise
b. Durability, 10,000 mating cycles at max imum rate of 500 cycles per hour
c. Final temperat ure rise
3. Temperature r ise f or Sample Group 1 was measured initially, and after 10,000 cycl es of
durability testing was performed. Thermocouples were soldered to the underside of the
contact as close t o the interface area as possible.
Sample ID’s
101, 102
/
C
30 Amperes
/
C
60 Amperes
/
C
90 Amperes
/
C
120 Amperes
/
C
150 Amperes
Initial Final Initial Final Initial Final Initial Final Initial Final
Minimum 2.100 2.400 6.900 7.600 14.600 15.800 25.300 25.300 40.200 38.500
Maximum 2.900 3.500 8.400 10.300 21.000 20.800 34.700 34.600 50.600 53.800
Average 2.550 2.850 7.750 8.738 16.650 17.950 28.300 29.150 43.275 44.700
Fi gure 3
Temperature Rise
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Fi gure 4
Fi nal Temperature Rise vs Current
4. Sample Group 3 - Contact Retention
Contact retent ion was perf ormed at a maximum rate of .5 inch per minute. The force required
to pull the cont act fr om the housing was measured and recorded. See Figure 5.
Sample Group 3 Data
Contact Retention (lbs)
Minimum 122.300
Maximum 146.000
Average 134.238
Fi gure 5
Contact Retention
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5. Sample Test Gr oup 8 and 9 - Temperature Rise - 6AWG and 4AWG
Temperature rise (Test Groups 8 and 9) was measured until a 30
/
C temperat ure rise value
was sustai ned. Thermocouples were soldered to the under side of the contact as cl ose to the
i nterf ace area as possibl e. See Figures 6 and 7.
Sample ID
801
)
/
C
20 Amperes
)
/
C
40 Amperes
)
/
C
60 Amperes
)
/
C
80 Amperes
Minimum 4.400 10.100 19.000 32.300
Maximum 4.700 10.900 20.700 34.200
Average 4.525 10.550 19.875 33.275
Fi gure 6
Sample Group 8, Temperat ure Rise, 6AWG
Sample ID
901
)
/
C
20 Amperes
)
/
C
40 Amperes
)
/
C
60 Amperes
)
/
C
80 Amperes
)
/
C
100 Amperes
)
/
C
120 Amperes
Minimum 1.900 5.700 11.000 18.900 27.500 28.400
Maximum 2.200 5.900 11.400 19.500 28.600 41.300
Average 2.000 5.850 11.225 19.225 28.075 37.400
Fi gure 7
Sample Group 9, Temperat ure Rise, 4AWG
C. CTL B034992-007 - T emperature Rise at Rat ed Current
Si x paired samples usi ng 2 AWG wires were subject ed to a temperat ure rise test for 4 hours wit h
100% of the contacts energized wi th a curr ent of 115 amperes. Thermocouples were sol dered to
the under side of the contact as close to the interface area as possible. Ambient temperature was
25
/
C. See Figure 8.
Sample ID’s
101 -106 Actual
(
/
C) Temperature Rise
(
/
C)
Minimum 46.5 21.5
Maximum 52.8 27.8
Average 49.35 24.35
Fi gure 8
Temperature Rise at Rated Current
D. CTL B034992-010 - Mating and Unmating Force
The force required to mate and unmate the samples aft er the initial, 5th and 10th cy cles at a
maximum rate of .5 inch per minute was measured and recor ded. See Figure 9.
Sample ID
A-C Initial (lbs) 5th Cycle (lbs) 10th Cycle (lbs)
Mating Unmating Mating Unmating Mating Unmating
Minimum 16.66 17.7 17.53 16.11 18.73 18.07
Maximum 20.29 19.99 18.62 19.88 19.07 20.44
Average 18.49 18.52 17.98 17.48 18.93 19.13
Fi gure 9
Mating and Unmating Force
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3. SI NGLE POLE TESTING
3.1. Test Samples
Test samples were r epresentat ive of normal producti on lot s. Samples identifi ed with t he following part
numbers were used for test.
Sample
Group Quantity Part
Number Description
CTL B034992-005 - Durability, Contact Retention, Mating/Unmating Force, Temperature Rise
1 4 1604002-2 Housing with 2 AWG contacts
3 10 1604002-2 Housing with 2 AWG contacts
4 20 1604002-2 Housing with 2 AWG contacts with wire
6 2 1604001-2 Housing with 6 AWG contacts with wire
7 2 1604001-2 Housing with 4 AWG contacts with wire
CTL B034992-006 - Temperature Test
16 1604002-2 Housing with 2 AWG contacts in 1X2 configuration
6 1604002-2 Housing with 2 AWG contacts in 2X2 configuration
Fi gure 10
3.2. Test Resul ts
A. CTL B034992-005 - Durability, Contact Retention, Mating/Unmating Force, and Temperature Rise
vs Current
1. Sample Group 3 -Contact Retention
Contact retent ion was performed at a maximum rate of 1 inch per minute. The force required
to pull the contact from the housing was measured and recorded. See Figure 11.
Sample Group 3 Data
Contact Retention (lbs)
Minimum 109.0
Maximum 139.3
Average 127.3
Fi gure 11
Contact Retention
2. Samples f rom Sample Group 4 were subjected to 5 mating/unmating cycl es. The force
required to mate and unmate the samples at a maximum rat e of 1 i nch per minute was
measured and recor ded. See Figure 12.
Sample Group 4
Mating Force (lbs) Sample Group 4
Unmating Force (lbs)
Minimum 7.25 Minimum 5.50
Maximum 9.82 Maximum 11.25
Average 8.18 Average 7.95
Fi gure 12
Mating/Unmating Force
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3. Sample Group 1 - Durability with Temperature Rise vs Current
a. Test Sequence:
(1) Initial temperature rRise
(2) Durability 10,000 mating cycles at maximum rate of 500 cycles per hour
(3) Final temperatur e ri se
b. Temperature r ise for Sampl e Group 1 was measured init ially, and af ter 10, 000 cycles of
durability testing was performed. Thermocouples were soldered to t he underside of the
contact as close to the interface ar ea as possible.
Sample ID’s
101, 102
/
C
30 Amperes
/
C
60 Amperes
/
C
90 Amperes
/
C
120 Amperes
/
C
140 Amperes
Initial Final Initial Final Initial Final Initial Final Initial Final
Minimum 3.200 2.400 8.600 6.900 16.700 13.800 29.200 23.300 32.700 31.300
Maximum 3.600 3.000 9.300 9.300 18.500 18.900 30.300 32.200 34.000 44.400
Average 3.375 2.725 8.925 8.075 17.575 16.325 29.750 27.700 33.350 37.850
Fi gure 13
Sample Group 1, Final Temperature Rise
Fi gure 14
Sample Group 1, Final Temperature Rise
TEMPERATURE RI S E vs. CURRENT - FI NAL
2.7
8.1
16.3
27.7
37.9
0
10
20
30
40
30 60 90 120 150
CURRENT (AMPERES)
T - RIS E (Deg. C)
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4. Sample Test Gr oups 6 and 7 - Temperature Rise, 6AWG and 4AWG
Temperature rise (Test Groups 6 and 7) was measured until a 30
/
C temperat ure rise value
was sustai ned. Thermocouples were soldered to the undersi de of the cont act as cl ose to the
i nterf ace area as possibl e. See Figures 15 and 16.
Sample Group 6
)
/
C
30 Amperes
)
/
C
50 Amperes
)
/
C
70 Amperes
)
/
C
80 Amperes
)
/
C
90 Amperes
Minimum 4.300 9.900 19.600 24.300 32.200
Maximum 4.300 10.000 19.600 24.400 32.200
Average 4.300 9.950 19.600 24.350 32.200
Fi gure 15
Sample Group 6, Temperat ure Rise, 6AWG
Sample Group 7
)
/
C
30 Amperes
)
/
C
50 Amperes
)
/
C
70 Amperes
)
/
C
90 Amperes
)
/
C
110 Amperes
Minimum 3.100 7.100 13.600 22.600 32.500
Maximum 3.400 7.100 13.800 22.800 32.700
Average 3.250 7.100 13.700 22.700 32.600
Fi gure 16
Sample Group 7, Temperat ure Rise, 4AWG
B. CTL B034992-006 - T emperature Rise at Rat ed Current
Si x paired samples using 2 AWG wires, in connector configurations of 1x2 and 2x2, were subjected
to a t emperature r ise test for 4 hours with 100% of the contact s energized wi th a curr ent of 115
amperes. Thermocoupl es were soldered to t he undersi de of the cont act as close to the interf ace
area as possible. Ambient t emperature was 25
/
C. See Figure 17.
Data Actual
(
/
C) Temperature Rise
(
/
C) Actual
(
/
C) Temperature Rise
(
/
C)
1X2 Configuration 2X2 Configuration
Minimum 46.9 22.5 48.8 22.8
Maximum 53.1 28.7 55.8 29.8
Average 48.7 24.3 52.3 26.3
Fi gure 17
Temperat ure Ri se at Rated Cur rent, Single- Pole
