INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-LBB127-R06 1
LBB127
Dual Single-Pole,
Normally Closed OptoMOS® Relay
Parameter Ratings Units
Blocking Voltage 250 VP
Load Current 200 mArms / mADC
On-Resistance (max) 10
Description
Pin Configuration
Switching Characteristics of
Normally Closed (Form B) Devices
Form-B
I
F
10% 90%
I
LOAD
t
off
t
on
Applications
Features
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Flammability Rating UL 94 V-0
• Surface Mount Tape & Reel Versions Available
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Part # Description
LBB127 8-Pin DIP (50/Tube)
LBB127S 8-Pin Surface Mount (50/Tube)
LBB127STR 8-Pin Surface Mount (1,000/Reel)
LBB127P 8-Pin Flatpack (50/Tube)
LBB127PTR 8-Pin Flatpack (1,000/Reel)
Approvals
Ordering Information
1
2
3
4
8
7
6
5
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
Certificate available on our website
LBB127 is a 250V, 200mA, 10 dual normally closed
(1-Form-B) Solid State Relay that comprises two
independently controlled, optically coupled MOSFET
switches. It is provided in an 8-pin package, and
employs optically coupled MOSFET technology to
provide 3750Vrms of input to output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED.
This dual single-pole OptoMOS relay provides a more
compact design solution than discrete single-pole
relays in a variety of applications, and saves board
space by incorporating both switches in a single 8-pin
package.
INTEGRATED CIRCUITS DIVISION
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2R06
LBB127
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 200 mArms / mADC
Peak t =10ms ILPK - - ±400 mAP
On-Resistance IL=200mA RON -810
Off-State Leakage Current VL=250VPILEAK --1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton --5 ms
Turn-Off toff --5
Output Capacitance IF=5mA, VL=50V, f=1MHz COUT -50- pF
Input Characteristics
Input Control Current to Activate IL=200mA IF--5mA
Input Control Current to Deactivate - IF0.4 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR--10A
Common Characteristics
Input to Output Capacitance VIO=0V, f=1MHz CIO -3- pF
1 If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value.
Parameter Ratings Units
Blocking Voltage 250 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / °C
2 Derate linearly 6.67 mW / °C
Absolute Maximum Ratings @ 25°C
Electrical Characteristics @ 25°C
INTEGRATED CIRCUITS DIVISION
LBB127
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R06
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical Turn-On Time
(N=50, IF=5mA, IL=200mA)
0.05 0.09 0.130.03 0.07 0.11
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=200mA)
0.75 1.35 1.950.45 1.05 1.60
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=200mA)
1.4 1.8 2.6 3.42.2 3.0
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Dropout
(N=50, IL=200mA)
25
20
15
10
5
0
1.4 2.2 3.01.0 1.8 2.6
LED Current (mA)
Device Count (N)
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=200mA)
25
20
15
10
5
0
5.325 5.495 5.665 6.0055.835 6.175
On-Resistance (:)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, IF=5mA)
25
20
15
10
5
0
310 314 318 322 326 330
Blocking Voltage (VP)
Device Count (N)
Typical Turn-Off Time
vs. LED Forward Current
(IL=200mA)
LED Forward Current (mA)
Turn-Off Time (ms)
05 1015202530354045
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Typical Turn-On Time
vs. LED Forward Current
(IL=200mA)
LED Forward Current (mA)
Turn-On Time (ms)
05 1015202530354045
0.06
0.05
0.04
0.03
0.02
0.01
0
50
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
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4R06
LBB127
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=200mA)
Temperature (ºC)
Turn-On Time (ms)
-40
0.12
0.10
0.08
0.06
0.04
0.02
0
-20 0 20 40 60 80 100
Typical Turn-Off Time
vs. Temperature
(IL=200mA)
Temperature (ºC)
Turn-Off Time (ms)
-40
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
IF=5mA
IF=10mA
IF=20mA
Maximum Load Current
vs. Temperature
Temperature (ºC)
Load Current (mA)
250
200
150
100
50
0
-40 -20 0 20 40 60 80 120100
Typical IF for Switch Operation
vs. Temperature
(IL=200mA)
Temperature (ºC)
LED Current (mA)
-40
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical IF for Switch Dropout
vs. Temperature
(IL=200mA)
Temperature (ºC)
LED Current (mA)
-40
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=200mA)
Temperature (ºC)
On-Resistance (:)
-40
8
7
6
5
4
3
2
1
0
-20 0 20 40 60 80 100
Typical Load Current
vs. Load Voltage
Load Voltage (V)
Load Current (mA)
200
150
100
50
0
-50
-100
-150
-200
-1.2 -0.8 -0.4 0 0.4 0.8 1.2
Typical Blocking Voltage
vs. Temperature
(IF=5mA)
Temperature (ºC)
Blocking Voltage (VP)
-40
400
350
300
250
200
150
100
50
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured across Pins 5&6 or 7&8
Temperature (ºC)
Leakage (A)
-40
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-20 0 20 40 60 80 100
Energy Rating Curve
Time
Load Current (A)
1.2
1.0
0.8
0.6
0.4
0.2
0
10Ps 1ms 100ms 10s100Ps 10ms 1s 100s
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
INTEGRATED CIRCUITS DIVISION
LBB127
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R06
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of
the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of
our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices
when handled according to the limitations and information in that standard as well as to any limitations set forth in the
information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
LBB127 / LBB127S / LBB127P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
LBB127 250ºC 30 seconds 1
LBB127S 250ºC 30 seconds 3
LBB127P 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux
residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage
to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow
up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the
variability of the wash parameters used to clean the board, determination of the bake temperature and duration
necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning
or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the
device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
INTEGRATED CIRCUITS DIVISION
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6R06
LBB127
MECHANICAL DIMENSIONS
LBB127
LBB127S
LBB127P
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
INTEGRATED CIRCUITS DIVISION
Specification: DS-LBB127-R06
©Copyright 2018, IXYS Integrated Circuits
OptoMOS® is a registered trademark of IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/25/2018
For additional information please visit our website at: www.ixysic.com
7
LBB127
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes
to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits'
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but
not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property
or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
MECHANICAL DIMENSIONS
LBB127STR Tape & Reel
LBB127PTR Tape & Reel
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P1=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P1 = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
