Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1Publication Order Number:
MC10H332/D
MC10H332
Dual Bus Driver/Receiver
with 4−to−1 Output
Multiplexers
Description
The MC10H332 is a Dual Bus Driver/Receiver with four−to−one
output multiplexers. These multiplexers have common selects and
output enable. When disabled, (OE = high) the bus outputs go to
−2.0 V. The parameters specified are with 25 W loading on the bus
drivers and 50 W loads on the receivers.
Features
•Propagation Delay, 1.5 ns Typical Data−to−Output
•Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•Voltage Compensated
•MECL 10K Compatible
•Pb−Free Packages are Available*
DIP & PLLC
PIN ASSIGNMENT
VCC
XBUS
X0
X1
X2
X3
S0
S1
VCC02
YBUS
OE
Y0
Y1
Y2
Y3
RE
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
XIN
VEE
YIN
VCC01
12
11
9
10
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications
shown in the test table, after thermal equilibrium has been established. The circuit
is in a test socket or mounted on a printed circuit board and transverse air flow
greater than 500 lfpm is maintained. Receiver outputs are terminated through a
50 W resistor to −2.0 Vdc. Bus outputs are terminated through a 25 W resistor to
−2.0 Vdc.
Pin assignment is for Dual−in−Line Package..
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
MARKING DIAGRAMS*
PDIP−20
P SUFFIX
CASE 738
http://onsemi.com
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
ORDERING INFORMATION
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G= Pb−Free Package
PLLC−20
FN SUFFIX
CASE 775
20 110H332G
AWLYYWW
120
MC10H352P
AWLYYWWG
MC10H332
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2
Table 1. MAXIMUM RATINGS
Symbol Characteristic Rating Unit
VEE Power Supply (VCC = 0) −8.0 to 0 Vdc
VIInput Voltage (VCC = 0) 0 to VEE Vdc
Iout Output Current − Continuous
− Surge
50
100
mA
TAOperating Temperature Range 0 to +75 °C
Tstg Storage Temperature Range − Plastic
− Ceramic
−55 to +150
−55 to +165
°C
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS (VEE = −5.2 V ±5%) (Note 1)
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
IEPower Supply Current −115 −110 −115 mA
IinH Input Current High
Pins 3,4,5,6,14,
15,16,17
Pins 7,8
Pins 13, 18
−
−
−
667
437
456
−
−
−
417
273
285
−
−
−
417
273
285
mA
IinL Input Current Low 0.5 −0.5 −0.3 −mA
VOH High Output Voltage −1.02 −0.84 −0.98 −0.81 −0.92 −0.735 Vdc
VOL Low Output Voltage −1.95 −1.63 −1.95 −1.63 −1.95 −1.60 Vdc
VIH High Input Voltage −1.17 −0.84 −1.13 −0.81 −1.07 −0.735 Vdc
VIL Low Input Voltage −1.95 −1.48 −1.95 −1.48 −1.95 −1.45 Vdc
1. Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50 W resistor to −2.0 V.
Table 3. AC PARAMETERS
0°25°75°
Symbol Characteristic Min Max Min Max Min Max Unit
tpd Propagation Delay
Data−to−Bus Output
Select−to−Bus
Output
OE−to−Bus Output
Bus−to−Receiver
Select−to−Receiver
RE−to−Receiver
Data−to−Receiver
0.8
0.8
0.8
0.8
1.8
0.8
1.3
3.0
3.4
2.4
2.1
4.5
2.2
4.0
0.8
0.8
0.8
0.8
1.8
0.8
1.3
3.0
3.4
2.4
2.1
4.5
2.2
4.0
0.8
0.8
0.8
0.8
1.8
0.8
1.3
3.2
3.8
2.6
2.4
5.0
2.5
4.5
ns
trRise Time 0.5 2.0 0.5 2.0 0.5 2.1 ns
tfFall Time 0.5 2.0 0.5 2.0 0.5 2.1 ns
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
MC10H332
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3
Table 4. MULTIPLEXER TRUTH TABLE
Table 5. RECEIVER TRUTH TABLE
VCC = PIN 1
VCC01 = PIN 11
VCC02 = PIN 20
VEE = PIN 10
OE S1 S0 XBus YBus
RE Xin Yin
H
L
L
L
L
X
L
L
H
H
X
L
H
L
H
−2.0V
X0
X1
X2
X3
−2.0V
Y0
Y1
Y2
Y3
H
L
L
XBus
L
YBus
OE
X0
X1
X2
X3
S0
S1
Y0
Y1
Y2
Y3
XIN
RE
YIN
XBUS
YBUS
7
6
5
16
15
8
9
13
4
3
2
19
18
17
14
12
LOGIC DIAGRAM
ORDERING INFORMATION
Device Package Shipping†
MC10H332FN PLLC−20 46 Units / Rail
MC10H332FNG PLLC−20
(Pb−Free)
46 Units / Rail
MC10H332FNR2 PLLC−20 500 / Tape & Reel
MC10H332FNR2G PLLC−20
(Pb−Free)
500 / Tape & Reel
MC10H332P PDIP−20 18 Unit / Rail
MC10H332PG PDIP−20
(Pb−Free)
18 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MC10H332
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4
PACKAGE DIMENSIONS
−M−
−N−
−L−
Y BRK
W
V
D
D
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
S
L−M
S
0.010 (0.250) N S
T
XG1
B
U
Z
VIEW D−D
20 1
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
S
L−M
S
0.010 (0.250) N S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
−T−SEATING
PLANE
S
L−M
M
0.007 (0.180) N S
T
S
L−M
M
0.007 (0.180) N S
T
H
VIEW S
K
K1
F
G1
20 LEAD PLLC
CASE 775−02
ISSUE E
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.385 0.395 9.78 10.03
B0.385 0.395 9.78 10.03
C0.165 0.180 4.20 4.57
E0.090 0.110 2.29 2.79
F0.013 0.019 0.33 0.48
G0.050 BSC 1.27 BSC
H0.026 0.032 0.66 0.81
J0.020 −−− 0.51 −−−
K0.025 −−− 0.64 −−−
R0.350 0.356 8.89 9.04
U0.350 0.356 8.89 9.04
V0.042 0.048 1.07 1.21
W0.042 0.048 1.07 1.21
X0.042 0.056 1.07 1.42
Y−−− 0.020 −−− 0.50
Z2 10 2 10
G1 0.310 0.330 7.88 8.38
K1 0.040 −−− 1.02 −−−
____
MC10H332
http://onsemi.com
5
PACKAGE DIMENSIONS
PDIP−20
P SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
L
J20 PL
M
B
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A25.66 27.171.010 1.070
B6.10 6.600.240 0.260
C3.81 4.570.150 0.180
D0.39 0.550.015 0.022
G2.54 BSC0.100 BSC
J0.21 0.380.008 0.015
K2.80 3.550.110 0.140
L7.62 BSC0.300 BSC
M0 15 0 15
N0.51 1.010.020 0.040
____
E
1.27 1.770.050 0.070
1
11
10
20
−A−
SEATING
PLANE
K
N
FG
D20 PL
−T−
M
A
M
0.25 (0.010) T
E
B
C
F
1.27 BSC0.050 BSC
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
MC10H332/D
MECL 10H and MECL 10K are trademarks of Motorola, Inc.
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