TA7368PG/FG
2006-04-28
1
TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic
TA7368PG,TA7368FG
Audio Power Amplifier
The TA7368PG and TA7368FG are suitable for the audio power
amplifier of portable cassette tape recorder and radio.
Features
• Very few external parts (only three capacitors)
• Low quiescent current: ICCQ = 6.6mA (typ.) (VCC = 6V)
• Output power
TA7368PG
: Pout = 720mW (typ.) (VCC = 6V, RL = 4Ω, THD = 10%)
TA7368PG / FG
: Pout = 450mW (typ.) (VCC = 6V, RL = 8Ω, THD = 10%)
• Voltage gain: GV = 40dB (typ.)
• Operating supply voltage range: VCC = 2~10V (Ta = 25°C)
Block Diagram
VCC
Pout
PHASE
RIPPLE
Vin
PRE-GND PW-GND
3/6
2/5
1/4
7/10
6/9
5/8
9/2
4/7
RL
RIPPLE
FILTER
+
−
+
+−
+
NF
/ : TA7368PG / TA7368FG
TA7368PG
TA7368FG
Weight
SIP9P2.54A : 0.92g (typ.)
SSOP10P2251.00 : 0.09g (typ.)
TA7368PG/FG
2006-04-28
2
Precaution For Use And A pplication
1. Input stage
The input stage of power amplifier (equivalent circuit) is comprised of a
PNP differential pair (Q2 and Q3) preceded by a PNP emitter follower
(Q1) which allows DC referencing of the source signal to ground. This
eliminated the need for an input coupling capacitor. However, in case the
brush noise of volume becomes a problem, provide serially a coupling
capacitor to the input side.
2. Adjustment of voltage gain
The voltage gain is fixed at GV≒40dB by the resistors (R4 and R5) in IC,
however, its reduction is possible through adding Rf as shown in Figure 2.
In this case, the voltage gain is obtained by the following equation.
f
R
4
R
f
R
4
R
5
R
og20
V
G+
++
=l
It is recommended to use this IC with the voltage gain of GV = 28dB or
over.
3. Ripple rejection ratio
Adding CRIP, to ripple terminal 2 as shown in Figure 3, the ripple
rejection ratio is improved from −25dΒ typ. to −45dΒ typ.
4. Power dissipation
Care should be taken to use this IC below maximum power dissipation.
Because it may over absolute maximum rating depending on operating
condition.
• TA7368PG PD = 900mW (Ta = 25°C)
• TA7368FG PD = 400mW (Ta = 25°C)
5. Phase−compensation
Small temperature coefficient and excellent frequency characteristic is needed by capacitors below.
• Oscillation preventing capacitors for power amplifier output
• Bypass capacitor for ripple filter
• Capacitor between VCC and GND
Fig.2
Vin
+
R
f
90
10
R4
R5
+
1 / 4
3 / 6
IN
NF
RIPPLE
+
CRIP
2 / 5
Fig.3
Fig.1
/
9 / 2
1 / 4
3 / 6
5 / 8
FROM PIN 7 / 10
: TA7368PG / TA7368FG
D1
27k
R4
R1
R5
Q1 Q4
Q2
Q3
TA7368PG/FG
2006-04-28
3
Absolute Maximum Ratings (Ta = 25°C)
Characteristic Symbol Rating Unit
Supply voltage VCC 14 V
TA7368PG 900
Power dissipation
TA7368FG
PD (Note)
400
mW
Operating temperature Topr −25～75 °C
Storage temperature Tstg −55～150 °C
(Note) Derated above Ta = 25°C in the proportion of 7.2mW / °C for TA7368PG and of 3.2mW / °C for TA7368FG.
Electrical Characteristics For TA7368PG
(Unless otherwise specified, VCC = 6V, f = 1kHz, Rg = 600, RL = 4, Ta = 25°C)
Characteristic Symbol
Test
Circuit Test Condition Min. Typ. Max. Unit
VCC = 3V, Vin = 0 — 5.5 —
VCC = 6V, Vin = 0 — 6.6 15
Quiescent current ICCQ —
VCC = 9V, Vin = 0 — 7.5 18
mA
VCC = 3V ,RL = 4, THD = 10% — 120 —
VCC = 6V, RL = 4, THD = 10% 500 720 —
VCC = 6V, RL = 8, THD = 10% 300 450 —
VCC = 9V, RL = 8, THD = 10% 800 1100 —
Output power Pout —
VCC = 9V, RL = 16, THD = 10% 450 610 —
mW
Total harmonic distortion THD — Pout = 100mW — 0.3 1.0 %
Voltage gain GV — Vin = 0.5mVrms 37 40 43 dB
Output noise voltage Vno — Rg = 10k, BPF = 20Hz~20kHz — 0.2 0.5 mVrms
Ripple rejection ratio RR — fr = 100Hz, Vr = 0.3Vrms
Without CRIP — 25 — dB
Input resistance RIN — — — 27 — k
Terminal Voltage For TA7368PG
Typical Terminal Voltage at no Signal With Test Circuit. (VCC = 6V, Ta = 25°C) [Unit: V]
Terminal no. 1 2 3 4 5 6 7 8 9
DC voltage (V) 0 2.40 0.62 0.64 0 0 2.61 NC 6.0
TA7368PG/FG
2006-04-28
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Electrical Characteristic For TA7368FG
(unless otherwise specified, VCC = 6V, f = 1kHz, Rg = 600, RL = 8, Ta = 25°C)
Characteristic Symbol
Test
Circuit Test Condition Min. Typ. Max. Unit
VCC = 3V, Vin = 0 — 5.5 —
VCC = 6V, Vin = 0 — 6.6 15
Quiescent current ICCQ —
VCC = 9V, Vin = 0 — 7.5 18
mA
VCC = 3V, RL = 4, THD = 10% — 120 —
VCC = 6V, RL = 8, THD = 10% 300 450 —
Output power Pout —
VCC = 9V, RL = 16, THD = 10% 450 610 —
mW
Total harmonic distortion THD — Pout = 100mW — 0.3 1.0 %
Voltage gain GV — Vin = 0.5mVrms 37 40 43 dB
Output noise voltage Vno — Rg = 10k, BPF = 20Hz~20kHz — 0.2 0.5 mVrms
Ripple rejection ratio RR — fr = 100Hz, Vr = 0.3Vrms,
Without CRIP — 25 — dB
Input resistance RIN — — — 27 — k
Terminal Voltage For TA7368FG
Typical Terminal Voltage at no Signal with Test Circuit. (VCC = 6V, Ta = 25°C) [Unit: V]
Terminal no. 1 2 3 4 5 6 7 8 9 10
DC voltage (V) NC 6.0 NC 0 2.40 0.62 0.64 0 0 2.61
TA7368PG/FG
2006-04-28
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Test Circuit
Vin
VCC
Pout
PHASE
RIPPLE
PRE-GND PW-GND
10k
470µF
100µF
100µF
27k
90
※ Pin(8): Non-connection
TA7368PG
3
2
1
7
6
9
4
RL
RIPPLE
FILTER
+
+
+
+
5
NF
TA7368FG
Vin
VCC
Pout
PHASE
RIPPLE
PRE-GND PW-GND
10k
470µF
100µF
100µF
27k
90
6
5
4
10
9
2
7
RL
RIPPLE
FILTER
+
+
+
+
8
NF
※ Pin(1), (3): Non-connection
TA7368PG/FG
2006-04-28
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f = 1kHz
RL = 4
Ta = 2 5 ° C
THD – POUT(1)
Output Power Pout (W)
Total Harmonic Distortion THD (%)
30
10
5
3
1
0.5
0.1
0.3
0.003 0.01 0.03 0.1 0.3 1 3
6
VCC = 3V
f = 1kHz
RL = 8
Ta = 2 5 ° C
THD – POUT(2)
Output Power Pout (W)
Total Harmonic Distortion THD (%)
30
10
5
3
1
0.5
0.1
0.3
0.003 0.01 0.03 0.1 0.3 1 3
9
6
VCC = 3V
VCC = 6 V
RL = 4
Ta = 2 5 ° C
THD – POUT(4)
Output Power Pout (W)
Total Harmonic Distortion THD (%)
0.05
0.03
20
10
5
3
1
0.5
0.1
0.3
0.003 0.01 0.03 0.1 0.3 1 3
1kHz
10kHz
f = 100Hz
VCC = 6 V
RL = 8
Ta = 2 5 ° C
THD – POUT(5)
Output Power Pout (W)
Total Harmonic Distortion THD (%)
20
10
5
3
1
0.5
0.1
0.3
0.003 0.01 0.03 0.1 0.3 1 3
1kHz
10kHz
f = 100Hz
VCC = 6 V
RL = 4
Vin = 1mVrms
GV – f
Frequency f (kHz)
Voltage Gain GV (dB)
80
70
60
50
40
30
10
20
0.03 0.1 0.3 1 3 10 30 100
0
0.05
0.03
20
10
5
3
1
0.5
0.1
0.3
0.003 0.01 0.03 0.1 0.3 1 3
VCC = 6 V
f = 1kHz
Ta = 2 5 ° C
THD – POUT(3)
Output Power Pout (W)
Total Harmonic Distortion THD (%)
8
16
RL = 32 4
TA7368PG/FG
2006-04-28
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VCC = 6 V
Vr = 0.3 Vrms
RL = 4
Ta = 25 °C
RR – fr
Ripple frequency fr (kHz)
Ripple Rejection Ratio RR (dB)
0
-10
-20
-30
-40
-50
-70
-60
0.05 0.1 0.3 1 3 10 30 100
-80
Rg = 10k
CRIP = 100µF
Rg = 10k
Without CRIP
R
g
= 600, Without C
RIP
Rg = 600, CRIP = 100µF
VCC = 9 V
f = 1kHz
Ta = 25 °C
PD – POUT(2)
Output Power Pout (W)
Power Dissipation PD (W)
1.0
0.8
0.6
0.4
0.2
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
0
RL = 8 THD = 1%
10%
16
VCC = 6 V
f = 1kHz
Ta = 25 °C
PD – POUT(1)
Output Power Pout (W)
Power Dissipation PD (W)
1.0
0.8
0.6
0.4
0.2
00.2 0.4 0.6 0.8 1.0 1.2 1.4
0
8
10%
THD = 1%
RL = 4
VCC = 6 V
PL = 4
Pout : THD = 10 %
THD : Pout = 100mW
Ambient Temperature Ta (°C)
Output Power Pout (W)
Total Harmonic Distortion THD (%)
POUT, THD, ICCQ – Ta
QUIESCENT CURRENT ICCQ (mA)
1
3
5
10
-20 0 20 40 60 80
0.01
1
0.5
0.3
0.1
0.03
0.05
POUT
THD
ICCQ
Supply Voltage VCC (V)
Quiescent Current ICCQ (mA)
Quiescent Output Voltage V7 (DC) (V)
ICCQ, V7 – VCC
10
8
6
4
2
0 2 4 6 8 10 12 14
0
ICCQ
V7
1.0
0.8
0.6
0.4
0.2
02 4 6 8 10 12 14
0
f = 1kHz
Ta = 2 5 ° C
PD MAX – VCC
Supply Volatage VCC (V)
Maximum Power Dissipation PD MAX (W)
8 16
32
RL = 4
TA7368PG/FG
2006-04-28
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※ F+PCB
By being mounted on certain PCB's, flat packages increase
the heat dissipating efficiency.
Data shown on the left is resulted from the measurement
on the PCB recommended by TOSHIBA.
(θj−Τ : Thermal resistance)
Printed Circuit Board
Material: Phenol resin
Thickness of copper leaf: 35µm
Plate thickness: 1.6mm
※ F + PCB
j T = 210°C / W
1.2
1.0
0.8
0.6
0.4
0.2
0 20 40 60 80 100 120 160
0
140
PD – Ta
Ambient Temperature Ta (°C)
Power Dissipation PD (W)
TA7368PG
※ F + PCB
TA7368FG
TA7368PG/FG
2006-04-28
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Package Dimensions
Weight: 0.92g (typ.)
TA7368PG/FG
2006-04-28
10
Package Dimensions
Weight: 0.09g (typ.)
TA7368PG/FG
2006-04-28
11
• Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or
load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the
effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time
and insertion circuit location, are required.
• If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or
the negative current resulting from the back electromotive force at power OFF. For details on how to connect a
protection circuit such as a current limiting resistor or back electromotive force adsorption diode, refer to individual
IC datasheets or the IC databook. IC breakdown may cause injury, smoke or ignition.
• Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
• Carefully select external components (such as inputs and negative feedback capacitors) and load components
(such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as
input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to
a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over
current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
• Over current Protection Circuit
Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all
circumstances. If the Over current protection circuits operate against the over current, clear the over current status
immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum
ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In
addition, depending on the method of use and usage conditions, if over current continues to flow for a long time
after operation, the IC may generate heat resulting in breakdown.
• Thermal Shutdown Circuit
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the Thermal shutdown circuits
operate against the over temperature, clear the heat generation status immediately. Depending on the method of
use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit
to not operate properly or IC breakdown before operation.
• Heat Radiation Design
When using an IC with large current flow such as power amp, regulator or driver, please design the device so that
heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition.
These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in
IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into
considerate the effect of IC heat radiation with peripheral components.
• Installation to Heat Sink
Please install the power IC to the heat sink not to apply excessive mechanical stress to the IC. Excessive
mechanical stress can lead to package cracks, resulting in a reduction in reliability or breakdown of internal IC
chip. In addition, depending on the IC, the use of silicon rubber may be prohibited. Check whether the use of
silicon rubber is prohibited for the IC you intend to use, or not. For details of power IC heat radiation design and
heat sink installation, refer to individual technical datasheets or IC databooks.
TA7368PG/FG
2006-04-28
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RESTRICTION S ON PRODUCT USE 060116EB
A
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
