DATA SHEET THICK FILM CHIP RESISTORS Product Specification - Mar 25, 2008 V.7 Introduction Product specification Chip Resistor Surface Mount Thick film technology INTRODUCTION Data in data sheets is presented - whenever possible -according to a 'format', in which the following chapters are stated: This unique number is an easily-readable code. Global part number is preferred. 15 digits code (PHYCOMP CTC): Phycomp branded products TITLE CTC: SCOPE 14~18 digits code (Global part number): Yageo/Phycomp branded products 12NC: APPLICATION FEATURES ORDERING 2 16 INTRODUCTION INFORMATION MARKING In general,the tolerance,packing and resistance code are integral parts of this number. Phycomp branded product Further informations will be mentioned in the relevant data sheet. CONSTRUCTION DIMENSIONS ELECTRICAL PACKING CHARACTERISTICS STYLE AND PACKAGING QUANTITY FUNCTIONAL TESTS DESCRIPTION AND REQUIREMENTS The chapters listed above are explained in this section "Introduction Thick Film Chip Resistors", with detailed information in the relevant data sheet. Chapters "Mounting", "Packing", and "Marking" are detailed in separate sections. DESCRIPTION All thick film types of chip resistors have a rectangular ceramic body. The resistive element is a metal glaze film. The chips have been trimmed to the required ohmic resistance by cutting one or more grooves in the resistive layer. This process is completely computer controlled and yields a high reliability. The terminations are attached using either a silver dipping method or by applying nickel terminations, which are covered with a protective epoxy coat, finally the two external terminations (matte tin on Ni-barrier) are added. The resistive layer is coated with a colored protective layer. This protective layer provides electrical, mechanical and/or environmental protection - also against soldering flux and cleaning solvents, in accordance with "MIL-STD-202G", method 215 and "IEC 60115-4.29". Yageo thick film chip resistor is flameproof and can meet "UL94V-0". ORDERING INFORMATION - 12NC & GLOBAL CLEAR TEXT CODE FUNCTIONAL DESCRIPTION The functional description includes: nominal resistance range and tolerance, limiting voltage, temperature coefficient, absolute maximum dissipation, climatic category and stability. The limiting voltage (DC or RMS) is the maximum voltage that may be continuously applied to the resistor element, see "IEC publications 60115-8". The laws of heat conduction, convection and radiation determine the temperature rise in a resistor owing to power dissipation. The maximum body temperature usually occurs in the middle of the resistor and is called the hot-spot temperature. In the normal operating temperature range of chip resistors the temperature rise at the hot-spot, .T, is proportional to the power dissipated: T = A x P. The proportionally constant `A' gives the temperature rise per Watt of dissipated power and can be interpreted as a thermal resistance in K/W. This thermal resistance is dependent on the heat conductivity of the materials used (including the PCB), the way of mounting and the dimensions of the resistor. The sum of the temperature rise and the ambient temperature is: T m = T amb + T where: T m = hot-spot temperature T amb = ambient temperature T = temperature rise at hot-spot. The stability of a chip resistor during endurance tests is mainly determined by the hot-spot temperature and the resistive materials used. Resistors are ordered in two ways. Both ways give logistic and packing information. www.yageo.com Mar 25, 2008 V.7 3 Product specification Chip Resistor Surface Mount Thick film technology SUMMARIZING 16 INTRODUCTION is the reciprocal of the heat resistance and is the characteristic for the resistor and its environment. Description Relationship Dimensions, conductance of materials and mounting determine heat resistance Heat resistance x dissipation gives temperature rise Temperature rise + ambient temperature give hot-spot temperature THE TEMPERATURE COEFFICIENT The temperature coefficient of resistance is a ratio which indicates the rate of increase (decrease) of resistance per degree (C) increase (decrease) of temperature within a specified range, and is expressed in parts per million per C (ppm/C). PERFORMANCE EXAMPLE When specifying the performance of a resistor, the dissipation is given as a function of the hot-spot temperature, with the ambient temperature as a parameter. If the temperature coefficient of a resistor of R nom = 1 k X between -55 C and +155 C is 200 ppm/C, its resistance will be: at 25 C: 1,000 X (nominal = rated value) From T = A x P and T m = T amb T it follows that: P at +155 C: 1,000 X (130 x 200 ppm/C) x 1,000 X = 1,026 X or 974 X Tm Tamb A at -55 C: 1,000 X (80 x 200 ppm/C) x 1,000 X = 1,016 X or 984 X If P is plotted against Tm for a constant value of A, parallel straight lines are obtained for different values of the ambient temperature. The slope of these lines, If the temperature coefficient is specified as 200 ppm/C the resistance will be within the shaded area as shown in Fig. 1. dP I dTm A handbook, full pagewidth 26 2.6% 1.6% R nom 1.6% 55 0 T ( oC) 25 155 16 2.6% MGA208 Fig. 1 Temperature coefficient. www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology NOISE Most resistors generate noise due to the passage of current through the resistor. This noise is dependent on the amount of current, the resistive material and the physical construction of the resistor. The physical construction is partly influenced by the laser trimming process, which cuts a groove in the resistive material. Typical current noise levels are shown in Fig. 2. 4 16 INTRODUCTION Size 1206 noise level V V SCR028 36 32 28 FREQUENCY BEHAVIOUR Resistors in general are designed to function according to ohmic laws. This is basically true of rectangular chip resistors for frequencies up to 100 kHz. At higher frequencies, the capacitance of the terminations and the inductance of the resistive path length begin to have an effect. Basically, chip resistors can be represented by an ideal resistor switched in series with a coil and both switched parallel to a capacitor. The values of the capacitance and inductance are mainly determined by the dimensions of the terminations and the conductive path length. The trimming pattern has a negligible influence on the inductance, as the path length is not influenced. Also, its influence on the capacitance is negligible as the total capacitance is largely determined by the terminations. The environment surrounding chips (e.g. landing paths, nearby tracks and the material of the printedcircuit board) has a large influence on the behaviour of the chip on the printed-circuit board. 24 20 16 12 8 4 0 1 10 100 1k 10 k 100 k 1M 10 M R () Fig. 2 Typical noise levels as a function of rated resistance www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology 5 16 INTRODUCTION Size 0402 SCR027 2.0 Z R 1.6 Rn = 1 Rn = 10 1.2 R n = 100 0.8 Rn = 100 k Rn = 1 M Rn = 10 k Rn = 1 k 0.4 0 10 6 10 7 10 8 10 9 f (Hz) 1010 Fig. 4 Impedance as a function of frequency for a chip resistor www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology 6 16 INTRODUCTION Size 0603 MLB716 2.0 handbook, full pagewidth Z R 1.6 Rn = 1 Rn = 10 1.2 Rn = 100 0.8 Rn = 1 M Rn = 10 k Rn = 100 k Rn = 1 k 0.4 0 10 6 10 7 10 8 10 9 1010 f (Hz) Fig. 5 Impedance as a function of frequency for a chip resistor Size 0603 MLB717 100 handbook, full pagewidth (deg) 60 Rn = 1 Rn = 10 20 Rn = 100 20 Rn = 1 M Rn = 10 k Rn = 100 k Rn = 1 k 60 100 10 6 10 7 10 8 10 9 f (Hz) 1010 Fig. 6 Phase shift as a function of frequency for a chip resistor www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology 7 16 INTRODUCTION Size 0805 MLB718 2.0 handbook, full pagewidth Z R 1.6 Rn = 1 Rn = 100 Rn = 10 1.2 0.8 Rn = 1 M Rn = 10 k Rn = 100 k Rn = 1 k 0.4 0 10 6 10 7 10 8 10 9 1010 f (Hz) Fig. 7 Impedance as a function of frequency for a chip resistor Size 0805 MLB719 100 handbook, full pagewidth (deg) 60 Rn = 1 Rn = 10 20 Rn = 100 20 Rn = 1 M Rn = 10 k Rn = 100 k Rn = 1 k 60 100 10 6 10 7 10 8 10 9 f (Hz) 1010 Fig. 8 Phase shift as a function of frequency for a chip resistor www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology 8 16 INTRODUCTION Size 1206 MLB720 2.0 handbook, full pagewidth Z R 1.6 Rn = 1 Rn = 100 Rn = 10 1.2 0.8 Rn = 1 M Rn = 100 k Rn = 10 k Rn = 1 k 0.4 0 10 6 10 7 10 8 10 9 1010 f (Hz) Fig. 9 Impedance as a function of frequency for a chip resistor Size 1206 MLB721 100 handbook, full pagewidth (deg) 60 Rn = 1 Rn = 10 20 Rn = 100 20 Rn = 1 M Rn = 10 k Rn = 100 k Rn = 1 k 60 100 10 6 10 7 10 8 10 9 f (Hz) 1010 Fig. 10 Phase shift as a function of frequency for a chip resistor www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology 9 16 INTRODUCTION PULSE-LOAD BEHAVIOUR The load, due to a single pulse at which chip resistors fail by going open circuit, is determined by shape and time. A standard way to establish pulse load limits is shown in Table 1. With this test, it can be determined at which applied voltage the resistive value changes about 0.5% of its nominal value under the above mentioned pulse conditions. Fig. 11 shows test results for the size 1206 chip resistors. If applied regularly the load is destructive, therefore the load must not be applied regularly during the load life of the resistors. However, the magnitude of a pulse at which failure occurs is of little practical value. Table 1 Pulse load limits PARAMETER VALUE Exponential time constant 50 to 700 s Repetition time 12 to 25 s Amount of pulses 5 to 10 that may be applied in a regular way can be determined in a similar manner. The maximum `single-pulse' load Size 1206 10 MBD641 4 Vmax (V) 1.2/50 s 10 3 10/700 s 10 2 10 10 10 2 10 3 10 4 10 5 10 6 R n () 10 7 Fig. 11 Maximum permissible peak pulse voltage ( Vmax ) without failing to `open circuit' in accordance with DIN IEC 60040 (CO) 533 www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology 10 16 INTRODUCTION Size 1206 MBC188 10 3 handbook, full pagewidth Pmax (W) 10 2 single pulse 10 t p / t i = 1000 1 repetitive pulse 10 1 10 6 10 5 10 4 10 3 10 2 10 1 1 t i (s) Fig. 12 Pulse on a regular basis; maximum permissible peak pulse power ( Pmax ) as a function of pulse duration for R 10 k, single pulse and repetitive pulse tp/ti = 1,000 Size 1206 MBD586 600 Vmax (V) 400 200 0 10 6 10 5 10 4 10 3 10 2 10 1 t i (s) 1 Fig. 13 Pulse on a regular basis; maximum permissible peak pulse voltage ( Vmax ) as a function of pulse duration (ti). www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology DEFINITIONS OF PULSES DETERMINATION OF PULSE-LOAD S INGLE PULSE The graphs in Figs 12 and 13 may be used to determine the maximum pulse-load for a resistor. The resistor is considered to be operating under single pulse conditions if, during its life, it is loaded with a limited number (approximately 1,500) of pulses over long time intervals (greater than one hour). For REPETITIVE PULSE The resistor is operating under repetitive pulse conditions if it is loaded by a continuous train of pulses of similar power. The dashed line in Fig. 12 shows the observed maximum load for the Size 1206 chip resistors under single-pulse loading. More usually, the resistor must withstand a continuous train of pulses of repetition time `t p ' during which only a small resistance change is acceptable. This resistance change (R/R) is equal to the change permissible under continuous load conditions. The continuous pulse train and small permissible resistance change reduces the maximum handling capability. Vi must be lower than the value of Vmax given in Fig. 13 for the applicable value of t i . repetitive exponential pulses: As for rectangular pulses, except that t i = 0.5 . For repetitive rectangular pulses: Vi2 must be lower than the value of Pmax given R by the solid lines of Fig. 12 for the applicable value of t i and duty cycle t p /t i . For 11 16 INTRODUCTION single rectangular pulses: Vi2 must be lower than the Pmax given by the R dashed line of Fig. 12 for the applicable value of ti. Vi must be lower than the value of Vmax given in Fig. 13 for the applicable value of t i . The continuous pulse train maximum handling capacity of chip resistors has been determined experimentally. Measurements have shown that the handling capacity varies with the resistive value applied. However, maximum peak pulse voltages as indicated in Fig. 13, should not be exceeded. www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology 12 16 INTRODUCTION DEFINITION OF SYMBOLS (SEE FIGURES 11, 12, 13, 14 AND 15) EXAMPLES Symbol Description Determine the stability of a typical resistor for operation under the following pulse-load conditions. P applied peak pulse power Pmax maximum permissible peak pulse power (Fig.12) Vi applied peak pulse voltage (Fig. 14) Vmax maximum permissible peak pulse voltage (Figs. 11, 13 and 15) Rnom nominal resistance value ti pulse duration (rectangular pulses) tP pulse repetition time Tamb time constant (exponential pulses) A 100 X resistor is required to operate under the following conditions: V i = 10 V; t i = 10 -5 s; t p = 10 -2 s Therefore: t p 10 2 10 2 1W and 1,000 100 t i 10 5 tp 1,000 , Fig. 12 gives For t i = 10 -5 s and ti P ambient temperature Tm (max.) maximum hot-spot temperature of the resistor MGA206 V C ONTINUOUS PLUS TRAIN tp Pmax = 2 W and Fig. 13 gives Vmax = 400 V As the operating conditions P = 1 W and Vi = 10 V are lower than these limiting values, this resistor may be safely used. S INGLE PLUSE ti A 10 k X resistor is required to operate under the following conditions: ^ Vi Vi = 250 V; t i = 10 -5 s t Therefore: Pmax Fig. 14 Rectangular pulses 250 2 6.25 W 10,000 The dashed curve of Fig. 12 shows that at t i = 10 -5 s, the permissible Pmax = 10 W and Fig. 13 shows a V YNSC059 ^ permissible Vmax of 400 V, so this resistor may be used. Vmax ^ 0.37 Vmax t tp Fig. 15 Exponential pulses www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology 13 16 INTRODUCTION MECHANICAL DATA MASS PER 100 UNITS Table 2 Single resistor chips type PRODUCT SIZE CODE Table 3 Resistor arrays, network and RF attenuators MASS (g) PRODUCT SIZE CODE TYPE ATV321 0.100 0201 0.016 0404 0402 MASS (g) 0.058 2 x 0201 (4P2R) YC102 0.052 0603 0.192 2 x 0402 (4P2R) YC122 0.100 0805 0.450 2 x 0402 (4P2R) TC122 0.112 1206 0.862 4 x 0402 (8P4R) YC124 0.281 1210 1.471 4 x 0402 (8P4R) TC124 0.311 1218 2.703 2 x 0603 (4P2R) YC162 0.376 2010 2.273 4 x 0603 (8P4R) YC/TC164 1.031 2512 3.704 1220 (8P4R) YC324 2.703 0616 (16P8R) YC248 0.885 0612 (10P8R) YC158 0.855 1225 (10P8R) YC358 3.333 FAILURE IN TIME (FIT) CALCULATION METHOD: According to Yageo calculation, assuming components life time is following exponential distribution and using 60% confidence interval (60% C.I.) in Homogeneous Poisson Process; therefore the FIT is calculated by number of tested Failure in Endurance Test (rated power at 70C for 1,000 hours, "IEC 60115-1 4.25.1") as following: FIT ( ) 60% C.I. number of estimated failure 10 9 Accumulated test time Table 4 FIT of single resistor chips TYPE Table 5 FIT of resistor arrays and network FIT in 1999-2007 ACCUMULATION TEST in 1999-2007 (hours) FIT in 1999-2007 ACCUMULATION TEST in 1999-2007 (hours) RC0201 146 6,280,000 YC122 RC0402 65 590 1,560,000 14,150,000 TC164 548 1,560,000 RC0603 63 14,650,000 YC124 390 1,560,000 RC0805 63 14,720,000 YC158 390 1,560,000 TYPE RC1206 69 13,380,000 YC164 339 1,710,000 RC1210 78 11,750,000 YC248 390 1,560,000 RC2010 65 14,190,000 YC324 390 1,560,000 RC2512 81 11,310,000 YC358 390 1,560,000 www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology 14 16 INTRODUCTION TESTS AND PROCEDURES To guarantee zero defect production standard, Statistical Process Control is an essential part of our production processes. Furthermore, our production process is operating in accordance with "ISO 9000". Essentially all tests on resistors are carried out in accordance with the schedule of "IEC publication 60115-1" in the specified climatic category and in accordance with "IEC publication 60068", "MIL-STD", "JIS C 5202", and "EIA/IS", etc. In some instances deviations from the IEC recommendations are made. Tests and their requirements are described in detail in the data sheets. Size 1206 Size 1206 MGA210 300 TC halfpage handbook, 6 (10 spec. level /K) 200 R (%) 0.4 0 0 100 0.4 spec. level 200 1 10 100 1k 10 k 0.8 100 k 1.2 10 M 1M R () Fig. 16 Typical temperature coefficients between the lower and upper category temperatures Size 1206 spec. level 1 10 100 1k 10 k 100 k 10 M 1M R () Fig. 17 Typical percentage change in resistance after soldering for 10 seconds at 270 C, completely immersed Size 1206 MGA213 12 MGA216 handbook, Rhalfpage handbook, halfpage noise level V V spec. level 0.8 100 300 MGA214 1.2 handbook, R halfpage R (%) 2 spec. level 1 8 spec. level 0 4 1 spec. level 2 0 100 1k 10 k 100 k 1M R () Fig. 18 Typical noise level as a function of rated resistance measured using Quantech - equipment 1 10 100 1k 10 k 100 k 1M 10 M R () Fig. 19 Typical percentage change in resistance after 56 days at 40 C and 90 to 95% relative humidity loaded with Pnom www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology INTRODUCTION 15 16 Size 1206 MGA218 1.2 handbook, R halfpage R (%) spec. level 0.8 0.4 0 0.4 0.8 1.2 spec. level 1 10 100 1k 10 k 100 k 10 M 1M R () Fig. 20 Typical percentage change in resistance after 1,000 hours loaded with Pnom at 70 C ambient temperature www.yageo.com Mar 25, 2008 V.7 Product specification Chip Resistor Surface Mount Thick film technology INTRODUCTION 16 16 REVISION HISTORY REVISION DATE Version 7 CHANGE NOTIFICATION Mar 25, 2008 - DESCRIPTION - Headline changes to Introduction Thick Film Chip Resistor - Add international standard and failures in time Version 6 Dec 15, 2004 - - Converted to Yageo / Phycomp brand - Separated "Marking" into an individual data sheet - Mechanical data extended from sizes 0201 to 2512, resistor arrays/network and attenuators as well - Impedance chart for size 0402 added - - Size extended to 0201 Version 5 Jul 23, 2004 Version 4 Aug 19, 2004 - - Updated company logo Version 3 May 30, 2001 - - Converted to Phycomp brand www.yageo.com Mar 25, 2008 V.7