AK8136A
MS1108-E-03 February-10
-
1
-
Low Power
Multiclock Generator with VCXO
AK8136A
Features
27MHz Crystal Input
One 27MHz-Reference Output
2 wire serial register interface
Selectable Clock out Frequencies:
- 148.352, 148.5MHz
- 100.71, 108MHz
- 22.5792, 24.576, 33.8688, 36.864MHz
- 27.0MHz
Built-in VCXO
- Pull Range: ±150ppm (typ.)
Low Jitter Performance
- Period Jitter:
150 psec (Typ.) at CLK2,CLK3,CLK4
- TIE HDMI 1.3a compliant
100 psec (Max) at CLK1p,CLK1n
- Long term jitter
160 psec (Typ.) at REFOUT
Low Current Consumption:
32 mA (Typ.) at 3.3V
Supply Voltage:
3.0 – 3.6V
Operating Temperature Range:
-20 to +85
Package:
20-pin SSOP (Lead free, Halogen free)
Description
The AK8136A is a member of AKM’s low power
multi clock generator family designed for a feature
rich DTV or STB, requiring a range of system
clocks with high performance. The AK8136A
generates different frequency clocks from a 27MHz
crystal oscillator and provides them to up to four
outputs configured by register-setting. The on-chip
VCXO accepts a voltage control input to allow the
output clocks to vary by ±150 ppm for
synchronizing to the external clock system. Both
circuitries of VCXO and PLL in AK8136A are
derived from AKM’s long-term-experienced clock
device technology, and enable clock output to
perform low jitter and to operate with very low
current consumption. The AK8136A is available
in a 20-pin SSOP package.
Applications
Set-Top-Boxes
AK8136A Multi Clock Generator
CLK2
CLK3
CLK4
REFOUT
VREF
GND
SDA
SCL
Voltage
Controlled
Crystal
Oscillator
XI
XO
CLK1p
VDD
PLL1
PLL2
PLL3
VIN
Control
Register
Full PD
AK8136A
February-10 MS1108-E-03
- 2 -
Pin Descriptions
Package: 20-Pin SSOP(Top View)
Pin
No.
Pin
Name Pin
Type Description
1
XI AIN Crystal connection, Connect to 27.000MHz crystal
2
GND3 PWR
Ground 3
3
VIN AIN VCXO Control Voltage Input
4
GND4 PWR
Ground 4
5
CLK2 DO Clock output 2, See register description.
In full power down or disable, this pin is “L”.
6
VDD2 PWR
Power Supply 2
7
GND2 PWR
Ground 2
8
CLK3 DO Clock output 3, See register description
In full power down or disable, this pin is “L”.
9
CLK4 DO Clock output 4, Copy of CLK3 See register description
In full power down or disable, this pin is “L”.
10
VREF AO VREF Pin Connect 1uF capacitor.
Hi-Z in full power down state.
11
GND1 PWR
Ground 1
12
VDD1 PWR
Power Supply 1
13
CLK1p
DO
14
CLK1n
DO
Clock output 1, these are differential pair. See register description
In full power down or disable, these pins are “L”.
15
SDA DI/DO
Serial data input and output pin. Open drain.
16
SCL DI Serial interface clock input.
17
VDDI PWR
Power supply for serial interface.
1.8V or 3.3V can be used.
18
REFOUT
DO Reference Clock Output of VCXO based on 27.000MHz Crystal
In full power down or disable, this pin is “L”.
19
VDD3 PWR
Power Supply 3
20
XO AO Crystal connection, Connect to 27.000MHz crystal
Ordering Information
Part Number Marking Shipping
Packaging Package Temperature
Range
AK8136A 8136A Tape and Reel 20-pin SSOP -20 to 85
20
19
18
17
16
15
14
13
12
11
XI
GND3
VIN
GND4
CLK2
VDD2
GND2
CLK3
CLK4
VREF
XO
VDD3
REFOUT
VDDI
SCL
SDA
CLK1n
CLK1p
VDD1
GND1
1
2
3
4
5
6
7
8
9
10
AK8136A
MS1108-E-03 February-10
- 3 -
Absolute Maximum Rating
Over operating free-air temperature range unless otherwise noted (1)
Items Symbol Ratings Unit
Supply voltage VDD/VDDI
-0.3 to 4.6 V
Input voltage Vin VSS-0.3 to VDD+0.3 V
Input current (any pins except supplies) IIN ±10 mA
Storage temperature Tstg -55 to 130 °C
Note
(1) Stress beyond those listed under Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only. Functional operation of the device at these or any other conditions beyond those
indicated under Recommended Operating Conditions” is not implied. Exposure to absolute-maximum-rating
conditions for extended periods may affect device reliability. Electrical parameters are guaranteed only over the
recommended operating temperature range.
This device is manufactured on a CMOS process, therefore, generically susceptible to
damage by excessive static voltage. Failure to observe proper handling and
installation procedures can cause damage. AKM recommends that this device is handled with
appropriate precautions.
Recommended Operation Conditions
Parameter Symbol
Conditions Min Typ Max Unit
Operating temperature Ta -20 85 °C
Supply voltage 1(1) VDDI Pin: VDDI 1.7 3.6 V
Supply voltage 2(2) VDD Pin: VDD1,VDD2,VDD3 3.0 3.3 3.6 V
Output Load Condition CL1 Pin: CLK1p,CLK1n
See Figure 1
Cp1 Pin: CLK2,CLK3,CLK4 15 pF
Output Load Capacitance Cp2 Pin: REFOUT 25 pF
Note:
(1) A decoupling capacitor for power supply line should be installed close to VDDI pin.
(2)Power to VDD1, VDD2, VDD3 requires to be supplied from a single source. A decoupling capacitor for power
supply line should be installed close to each VDD pin.
ESD Sensitive Device
AK8136A
February-10 MS1108-E-03
- 4 -
DC Characteristics
VDD: over 3.0 to 3.6V,VDDI:over 1.7 to 3.6V, Ta: -20 to +85, 27MHz Crystal, unless otherwise noted
Parameter Symbol
Conditions MIN TYP MAX Unit
High Level Input Voltage VIH Pin: SDA,SCL 0.7VDDI
V
Low Level Input Voltage VIL Pin: SDA,SCL 0.3VDDI
V
Input Current 1 IL1 Pin: SDA,SCL -10 +10 μA
Input Current 2 IL2 Pin: VIN -3 +3 μA
High Level Output
Voltage VOH Pin: CLK2-4, REFOUT
IOH=-4mA 0.8VDD
V
Low level Output
Voltage VOL Pin: CLK2-4, REFOUT
IOL=+4mA 0.2VDD
V
Output impedance Pin:CLK1p,CLK1n
Ta=25,3.3V 14 20 26 Ω
VREF Voltage VREF Pin:VREF
Cvref=1μF 0.72 0.8 0.88 V
Current Consumption 1 IDD1 No load
Clock out selection by note(1)
VDD/VDDI=3.3V, Ta=25 32 mA
Current Consumption 2 IDD2 On load(2)
Clock out selection by note(1)
VDD/VDDI=3.3V, Ta=25 46 mA
Current Consumption 3 IDDPD FULL_PD=”H”
VDD/VDDI=3.3V, Ta=25 0 150 μA
(1) CLK1p/1n:148.5MHz, CLK2=108MHz,CLK3/4=36.864MHz,REFOUT=27.0MHz
(2) CLK1p/1n: Figure1, CLK2-4: Cp1=15pF, REFOUT:Cp2=25pF
AK8136A
MS1108-E-03 February-10
- 5 -
AC Characteristics (Clock signals)
VDD: over 3.0 to 3.6V, VDDI over 1.7 to 3.6V,Ta: over -20 to +85, 27MHz Crystal, unless otherwise noted
(1) Pullable range depends on crystal characteristics, on-chip load capacitance, and stray capacity of PCB.
Typ. ±150ppm is applied to AKMs authorized test condition.
Please contact us when you plan the use of other crystal unit.
(2) Measured with load capacitance of 25pF
(3) Measured with load capacitance of 15pF
(4) Measured with load condition shown in Figure.1
(5) ±3σ in 10000 sampling or more
(6) 16ms accumulate with higher than 10GSa/s, under HDMI Compliant test Ver1.3a condition.
(7) ±3σ in 10000 sampling or more
(8) Refer to Figure.7 on Clock enable and disable sequence.
(9) Time to settle output into 0.1% of specified frequency from FULL_PD is “L”. Refer to Figure.6 on “Full
Power Down sequence”.
(10) Refer to Figure.5 on “Power on Reset sequence”.
Parameter Symbol Conditions MIN
TYP MAX
Unit
Crystal Clock Frequency Fosc Pin:XI,XO 27.0000
MHz
Output Clock Accuracy Faccuracy Pin:CLK2 100.71MHz
Relative to 27.0MHz 106.25 ppm
VCXO Pullable Range (1) PRvcxo VIN at over 0 to VDD V ±150 ppm
VCXO Gain GVCXO VIN range at 1.5V±1.0V 150 ppm/V
Period Jitter (5) Jit_period Pin:REFOUT(2),CLK2-4(3)
150
(6σ) ps
Time Interval Error (6) Jit_tie Pin:CLK1(4) 100
ps
Long Term Jitter (7)
Jit_long Pin:REFOUT
1000 cycle delay 160 ps
Pin: CLK1p,n(4) Figure.3
CLK2-4 (3) 45
50 55
%
Output Clock Duty
Cycle DtyCyc Pin: REFOUT (2) 40
50 60
%
Output Clock Slew Rate Slew_rise_fall
Pin:CLK1p,n (4) Figure.3 2.5
8.0
V/ns
Slew rate matching Slew_ver Pin:CLK1p,n (4) Figure.2 20
%
Differential output swing V_swing Pin:CLK1p,n (4) Figure.3 300
mV
Crossing point voltage V_cross Pin:CLK1p,n (4) Figure.2 300
550
mV
Variation of Vcrs V_cross_delta Pin:CLK1p,n (4) Figure.2 140
mV
Maximum output voltage V_max Pin:CLK1p,n (4) Figure.2 1.15
V
Minimum output voltage V_min Pin:CLK1p,n (4) Figure.2 -0.3
V
Pin: CLK2-4 (3) 1.0 3.0
ns
Output Clock Rise Time T_rise Pin: REFOUT (2 ) 2.5 5.0
ns
Pin: CLK2-4 (3) 1.0 3.0
ns
Output Clock Fall Time T_fall Pin: REFOUT (2 ) 2.5 5.0
ns
Output enable/disable Time(8)
T_en_dis Pin: REFOUT,CLK1p,n
CLK2-4 500
ns
Power-up Time 1(9) T_put1 Pin: REFOUT,CLK1p,n
CLK2-4 4 ms
Power-up Time 2(10) T_put2 Pin: REFOUT,CLK1p,n
CLK2-4 150
ms
AK8136A
February-10 MS1108-E-03
- 6 -
Figure.1 CLK1 Load condition
Figure.2 Single ended (SE) measurement waveforms
<5inch
2pF
30+/-5%
Rs T-Line
Z=5
0
T-Line
Z=5
0
2pF
PLL
Core
Vref
3.3V
Measure point
V_cross_min=300mV
V_cross_max=550mV
V_max=1.15V
V_min=-0.3V
V_cross
CLK1p
CLK1n
CLK1p
CLK1n
V_cross_delta_max=140mV
V_cross_delta
CLK1p
CLK1n
+75mV
-75mV
V_cross(Avg)
Slew_rise SE(Avg) +75mV
-75mV
Slew_fall SE(Avg)
AK8136A
MS1108-E-03 February-10
- 7 -
Period
CLK1_diff
CLK1_diff
0.0V
0.0V 0.0V
+DtyCyc
-DtyCyc
+150mV
-150mV
V_swing
Slew_rise Slew_fall
Figure.3 Differential (DIFF) measurement waveforms
AK8136A
February-10 MS1108-E-03
- 8 -
AC Characteristics (Serial interface
VDD: over 3.0 to 3.6V, VDDI over 1.7 to 3.6V,Ta: over -20 to +85 , 27MHz Crystal, unless otherwise noted
SCL (IN)
SDA (IN)
SDA (OUT)
tF tR
tSU.STA
tHD.STA
tSU.STO
tSU.DAT
tHD.DAT
tAA tDH tBUF
tLOW tHIGH
Figure.4 Serial Interface Timing
Parameter Symbol
Conditions MIN MAX Unit
SCL clock frequency fSCL 400 kHz
SCL Clock Low Period tLOW 1.3 μs
SCL Clock High Period tHIGH 0.6 μs
Pulse width of spikes which must
be suppressed tI 50 ns
SLC Low to SDA Data Out tAA 0.3 μs
Bus free time between a STOP
and START condition tBUF 1.3 μs
Start Condition Hold Time tHD.STA
0.6 μs
Start Condition Setup Time
(for a Repeated Start condition) tSU.STA
0.6 ms
Data in Hold Time tHD.DAT
0 s
Data in Setup Time tSU.DAT
100 ns
SDA and SCL Rise Time tR 0.3 μs
SDA and SCL Fall Time tF 0.3 μs
Stop Condition Setup Time tSU.STO
0.6 μs
Bus Line Load Cb 200 pF
AK8136A
MS1108-E-03 February-10
- 9 -
VDD1/2/3
POR
(Internal signal)
Register setting available
SCL/SDA
VDD*0.9
Max:20ms
Min:150ms
CLK1p/CLK2-4/REFOUT
CLK1n
Function Description
Power On Reset sequence
AK8136A has the POR(Power On Reset) circuit. In power up, the POR works and the register is set to the
initial value and all clock output becomes enable without glitch.
Note1) The assumption power start time to reach 90 % of VDD is within 20 ms.
Note2) The first register setting should be done after the 150 ms elapse after the power on.
Figure.5 Recommend Power Up Sequence
AK8136A
February-10 MS1108-E-03
- 10 -
Serial interface
Read/Write performance of serial interface is expressed below. The device address #1 of
AK8136A is fixed as 1010”. The device address #2 is “110”.
Device address of AK8136A
Byte wtire operation
Byte write operation is described below. Data must be sent after sending 8 bits address and receiving
ACK.
Byte write
1 0 1 0
Device
Address Device
Address
0
R
W
Address
(MSB First) Data
(MSB First)
S
T
A
R
T
SDA
-1 -2 /A
C
K
A
C
K
A
C
K
S
T
O
P
1 1 0
Page write operation
Page write operation is described below. Only lower 4 bits of address are valid. Upper 4 bits are fixed
as “1111”. Therefore the address which is written after “1111 1111” becomes “1111 1110”.
Page write
Device
Address Device
Address R
W
Address
(MSB First) Data
(Address)
S
T
A
R
T
SDA
-1 -2 /A
C
K
A
C
K
A
C
K
Data A
C
K
(Address+1)
1010 0
A
C
K
S
T
O
P
Data A
C
K
(Address+n)
・・
1 1 0
Current address read
Current address read operation is described below. The data that is read by this operation is obtained
as “last accessed address + 1”. Therefore, It is consequent to return “1111 1110” after accessing the
address “1111 1111”.
Current address read
1 0 1 0
Device
Address Device
Address
1
R
W
Data
(MSB First)
S
T
A
R
T
SDA
-1 -2 /A
C
K
N
O
A
S
T
O
P
C
K
1 01
1 0 1 0 1 1 0 R/W
Device Adress#2
Device Adress#1
R:1
W:0
AK8136A
MS1108-E-03 February-10
- 11 -
Random read
Random read operation is described below. It is necessary to operate “dummy write” before sending
read command. Dummy write is to send the address to read.
Random read
1 0 1 0
Device
Address Device
Address
0
R
W
Address
(MSB First)
S
T
A
R
T
SDA
-1 -2 /A
C
K
A
C
K
S
T
A
R
T
1 0 1 0
Device
Address
-1
N
O
A
S
T
O
P
C
K
Dummy Write
Device
Address
1
R
W
-2 /A
C
K
Data
(MSB First)
1 01 1 01
Sequential read
Sequential read operation is described below. It is possible to read next address sequentially by
sending ACK instead of stop condition.
Sequential read
SDA
Device
Address
1
R
W
-2 /A
C
K
Data (MSB First)
(Address) N
O
A
S
T
O
P
C
K
A
C
K
Data (MSB First)
(Address+1) A
C
K
・・・・
A
C
K
Data (MSB First)
(Address+n)
・・ 1 01
Change data
Change data operation is described below. It is available when SCL is Low.
Change data
SDA
SCL
DATA STABLE DATA
CHANGE
Start / Stop timing
Start / Stop timing is described below. The sequence is started when SDA goes from high to low
during SCL is high. The sequence is stopped when SDA goes from low to high during SCL is high.
Start / Stop timing
SDA
SCL
START STOP
AK8136A
February-10 MS1108-E-03
- 12 -
Register description
The AK8136A generates a range of low-jitter and hi-accuracy clock frequencies with three built-in PLLs and
provides to up to five assigned outputs. A frequency selection at assigned output pin and power down
control is configured by register-setting.
Register Map
Address
D7 D6 D5 D4 D3 D2 D1 D0 Note
FULL_PD - - - CLK3S[1] CLK3S[0] CLK2S CLK1S
FF 0 - - - 1 1 0 0 Default
CLK4_DIS CLK3_DIS CLK2_DIS CLK1_DIS REF_DIS
FE 0 0 0 0 0 Default
Register definition
FULL_PD (Address FF:D7)
Power Down Control
0
Device Active (PLL ON)
Enable VCXO, VREF and PLLs (default)
1 Full Power Down
Disable VCXO, VREF and PLLs
Full Power Down sequence
The full power down setting is done by following sequence.
1) Change CLKn_DIS(n=1,2,3,4) and REF_DIS to "1" .
2) Change FULL_PD to "1" from "0".
The output transfers to the disabled state without glitch.
The full power down state is released by following sequence.
1) Changing FULL_PD to "0" from "1" .
2) After more than 4 ms elapse, change CLKn_DIS and REF_DIS "0" to "1".
The output transfers to the enable state without glitch.
Figure.6 Full Down sequence
CLKn_DIS,
REF_DIS
FULL_PD
CLK1p/CLK2-4/REFOUT
CLK1n
>4ms
AK8136A
MS1108-E-03 February-10
- 13 -
CLK3S[1:0] (Address FF:D3,D2)
CLK3&4 Output frequency selection
00 22.5792MHz
01 24.576MHz
10 33.8688MHz
11 36.864MHz (default)
CLK2S (Address FF:D1)
CLK2 Output frequency selection
0
108MHz. (default)
1 100.71MHz
CLK1S (Address FF:D0)
CLK1 Output frequency selection
0 148.5MHz/1.001 (default)
1 148.5MHz
CLK4_DIS (Address FE:D7)
CLK4 Output Disable
0
Enable (CLK4 Active) (default)
1 Disable(CLK4=”L”)
CLK3_DIS (Address FE:D6)
CLK3 Output Disable
0
Enable (CLK3 Active) (default)
1 Disable(CLK3=”L”)
CLK2_DIS (Address FE:D5)
CLK2 Output Disable
0
Enable (CLK2 Active) (default)
1 Disable(CLK2=”L”)
CLK1_DIS (Address FE:D4)
CLK1 Output Disable
0
Enable (CLK1 Active) (default)
1 Disable(CLK1p,CLK1n=”L” )
AK8136A
February-10 MS1108-E-03
- 14 -
REF_DIS (Address FE:D3)
REFOUT Output Disable
0
Enable (REFOUT Active) (default)
1 Disable(REFOUT=”L”)
Clock Enable and Disable sequence
The enabling and disabling of the clock output are executed without glitch within 500 ns from
the rising edge of SCL during the acknowledge operation after the corresponding byte date
reception.
Figure.7 Output Enable and Disable sequence
SCL
Disable
SDA
CLKn
REFOUT
SCL
SDA
CLKn
REFOUT
ACK
Enable
ACK
< 500ns
< 500ns
AK8136A
MS1108-E-03 February-10
- 15 -
Voltage Controlled Crystal Oscillator (VCXO)
The AK8136A has a voltage controlled crystal oscillator (VCXO), featuring fine frequency tuning for 27MHz
of primary clock frequency by external DC voltage control. This tuning enables output clock frequency to
synchronize the external clock system. VIN (Pin3) accepts DC voltage control from a processor or a
system controller, and pulls the primary frequency of crystal to higher or lower. This pulling range is
determined by crystal characteristic, on-chip load capacitor, and stray capacitance of PCB. The AK8136A
is designed to range ±150ppm of primary frequency in AKM’s authorized condition, and the typical pulling
profile is shown in Figure 8. For details about the condition and other specific crystal application case,
refer the AK8136A application note.
27MHz VCXO Characteristics
KDS DSX530GA
-200
-150
-100
-50
0
50
100
150
200
00.5 1 1.5 2 2.5 3 3.5
Figure 8: Typical VCXO Pulling Profile
AK8136A
February-10 MS1108-E-03
- 16 -
KDS DSX530GA
Item MIN TYP MAX
Unit
Remark
Nominal frequency f0 27.000
MHz
CL=10.0pF
Equivalent resistance R1 50 Ω
Shunt capacitance C0 3.0 pF
Motional capacitance C1 11.4 fF
Motional inductance L1 3.0 mH
Drive Level 10 300 uW
Spurious No spurious within 3fo±13kHz
With in f0±500kHz the attenuation of the spurious response should be more
than 3dB.
Crystal unit
Load capacitance CL
L1 R1 C1
C0
CL
Figure
.
9
Equivalent parameter and load
AK8136A
MS1108-E-03 February-10
- 17 -
Package Information
110
1120
6.5 +0.30
-0.10
4.40±0.20
0.10±0.10
0.10
1.15±0.10
S
S
0.10 M
0.22±0.10 0゜~10
0.15 +0.10
-0.05
0.50±0.20
6.40±0.30
0.65
0.45MAX
Marking
a: #1 Pin Index
b: Part number
c: Date code (5 digits)
d Product Family Logo (1)
RoHS Compliance
All integrated circuits form Asahi Kasei Microdevices Corporation (AKM)
assembled in “lead-free” packages* are fully compliant with RoHS.
(*) RoHS compliant products from AKM are identified with “Pb free” letter indication on
product label posted on the anti-shield bag and boxes.
1
20
10
11
8136A
XXXXX
AKM
a
b
c
d
AK8136A
February-10 MS1108-E-03
- 18 -
IMPORTANT NOTICE
l These products and their specifications are subject to change without notice.
When you consider any use or application of these products, please make inquiries the sales office of Asahi
Kasei Microdevices Corporation (AKM) or authorized distributors as to current status of the products.
l AKM assumes no liability for infringement of any patent, intellectual property, or other rights in the
application or use of any information contained herein.
l Any export of these products, or devices or systems containing them, may require an export license or other
official approval under the law and regulations of the country of export pertaining to customs and tariffs,
currency exchange, or strategic materials.
l AKM products are neither intended nor authorized for use as critical componentsNote1) in any safety, life
support, or other hazard related device or systemNote2), and AKM assumes no responsibility for such use,
except for the use approved with the express written consent by Representative Director of AKM. As used
here: Note1) A critical component is one whose failure to function or perform may reasonably be expected to
result, whether directly or indirectly, in the loss of the safety or effectiveness of the device or system
containing it, and which must therefore meet very high standards of performance and reliability.
Note2) A hazard related device or system is one designed or intended for life support or maintenance of
safety or for applications in medicine, aerospace, nuclear energy, or other fields, in which its failure to
function or perform may reasonably be expected to result in loss of life or in significant injury or damage
to person or property.
l It is the responsibility of the buyer or distributor of AKM products, who distributes, disposes of, or otherwise
places the product with a third party, to notify such third party in advance of the above content and conditions,
and the buyer or distributor agrees to assume any and all responsibility and liability for and hold AKM harmless
from any and all claims arising from the use of said product in the absence of such notification.
Asahi Kasei EMD Corporation has changed its company name to Asahi Kasei
Microdevices Corporation (AKM) effective 1st April 2009.
It is noted the documents according to this product, which was released before the date
of 1st April 2009, shall include the old company name as Asahi Kasei EMD Corporation
(AKEMD). These documents will be continuously valid by interpreting the old company
name to the new one as Asahi Kasei Microdevices Corporation (AKM).
Further information of this company name change, contact AKM’s sales person or
AKM’s authorized distributor.