Thick Film Chip Resistors Thick Film Chip Resistors 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2012, 2512 Type: ERJ 1G, 2G, 3G, 6G, 8G, 14, 12, 12Z, 1T Features Small size and lightweight For PCB size reduction and lightweight products High reliability Metal glaze thick film resistive element and three layers of electrodes result in high reliability Matching with placement machine Taping and bulk case packagings for automatic placement machine Solderability Suitable for both reflow soldering and flow soldering Approved under the ISO 9001 system Approved under the QS-9000 system Reference Standards IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A Explanation of Part Numbers E R J 3 G E When omitted, all the rest P/N factors shall be moved up respectively. Y J 1 0 2 V Thick Film Chip Resistors Dimensions in mm (not to scale) Construction Type (inches) ERJ1G (0201) ERJ2G (0402) ERJ3G (0603) ERJ6G (0805) ERJ8G (1206) ERJ14 (1210) ERJ12 (1812) ERJ12Z (2010) ERJ1T (2512) Dimensions (mm) L W a b Weight (1000 pcs.) t 0.600.03 0.300.03 0.150.05 0.150.05 0.250.05 0.15 g 1.000.05 0.500.05 0.200.10 0.250.05 0.350.05 0.8 g 0.20 0.300.15 1.600.15 0.80+0.15 0.450.10 0.05 0.30 2g 2.00 1.25 0.40 0.40 0.60 0.10 4g 3.20 1.60 0.50 0.50 0.60 0.10 10 g 3.200.20 2.500.20 0.500.20 0.500.20 0.600.10 16 g 4.500.20 3.200.20 0.500.20 0.500.20 0.600.10 27 g 5.000.20 2.500.20 0.600.20 0.600.20 0.600.10 27 g 6.40 45 g 0.20 +0.05 0.20 0.20 0.10 +0.05 0.15 3.20 0.20 0.20 0.20 0.65 0.20 0.20 0.20 0.60 0.20 0.60 0.10 Ratings Type (inches) ERJ1G (0201) ERJ2G (0402) ERJ3G (0603) ERJ6G (0805) ERJ8G (1206) ERJ14 (1210) ERJ12, 12Z (1812, 2010) ERJ1T (2512) Power Rating Limiting Element Maximum Overload Resistance Voltage (Maximum Voltage(2) at 70 C Tolerance(%) RCWV)(1) (V) (W) (V) Resistance Range () min. max. 0.05 15 30 5 10 1 M 0.063 50 100 5 1 2.2 M 0.1 50 100 5 1 10 M 0.125 150 200 5 1 10 M 0.25 200 400 5 1 10 M 0.25 200 400 5 1 10 M 0.5 200 400 5 1 10 M 1 200 400 5 1 1 M T.C.R. Standard x10-6 /C Resistance Values (ppm/C) <10 : 100 to +600 E24 E24 E24 10 to 1 M: 200 E24 E24 E24 1 M<: 400 to +150 E24 E24 Rated Current Maximum Overload Current Jumper 1G 2G a 3G 6Ga8Ga14a12a12Za1T 0.5 A 1 A 2 A 1A 2A 4A (1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating x Resistance Values, or Limiting Element Voltage (max. RCWV) listed above, whichever less. (2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 x Power Rating or max. Overload Voltage listed above whichever less. Thick Film Chip Resistors Power Derating Curve For resistors operated in ambient temperatures above 70 C, power rating shall be derated in accordance with the right figure. Packaging Methods Standard Quantity Type (inches) Thickness (mm) Punched (Paper) Taping (4 mm pitch) ERJ1G (0201) ERJ2G (0402) ERJ3G (0603) ERJ6G (0805) 0.25 10000 pcs./reel (2 mm pitch) 0.35 10000 pcs./reel (2 mm pitch) 50000 pcs./case 0.45 10000 pcs./reel (2 mm pitch) 5000,10000 pcs./reel 25000 pcs./case 0.6 5000,10000 pcs./reel 10000 pcs./case ERJ8G (1206) ERJ14 (1210) ERJ12,12Z (1812, 2010) ERJ1T (2512) 0.6 5000,10000 pcs./reel 0.6 5000 pcs./reel 0.6 5000 pcs./reel 0.6 4000 pcs./reel Taping Reel Type Embossed Taping (4 mm pitch) Bulk Case BA BB BC W T Dimensions 1G,2G,3G 9.01.0 11.4 2.0 0 (mm) 6G,8G,14 180.03.0 60 min. 13.0 1.0 12,12Z,1T 13.01.0 15.4 2.0 Note BA: 10000 pcs./reel=255 20000 pcs./reel=330 Bulk Case (mm) Thick Film Chip Resistors Punched (Paper) Taping Type 1G Dimensions 2G 3G (mm) 6G 8G A 0.400.05 0.700.05 1.100.10 1.650.15 2.000.15 B 0.70 0.05 1.20 0.05 1.90 0.10 2.50 0.20 3.60 0.20 Type P1 1G 2.00 0.10 Dimensions 2G 3G (mm) 6G 4.00 0.10 8G Embossed Taping W F E 8.00 0.20 3.50 0.05 1.75 0.10 P2 P0 BD0 2.000.05 4.000.10 1.50+0.10 0 T 0.30 0.05 0.45 0.05 0.64 0.05 0.84 0.05 Type 14 Dimensions 12 (mm) 12Z 1T A B 2.80 0.20 3.50 0.20 2.80 0.20 3.60 0.20 W F E P1 3.500.20 8.000.30 3.50 0.05 4.800.20 1.75 0.10 4.000.10 5.300.20 12.000.30 5.50 0.05 6.900.20 Type P2 14 Dimensions 12 2.000.05 (mm) 12Z 1T P0 BD0 t BD1 1 min. 4.00 0.10 1.50 +0.10 0 1.00 0.10 1.5 min. Cautions for Safety In the case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount properly. Generally, the land width should be chip resistor width (W) 0.7 to 0.8 times of the width of chip resistor. In the case of reflow soldering, solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3 times chip resistor width (W). Type (inches) ERJ1G (0201) ERJ2G (0402) ERJ3G (0603) ERJ6G (0805) ERJ8G (1206) ERJ14 (1210) ERJ12 (1812) ERJ12Z (2010) ERJ1T (2512) Dimensions (mm) a b c 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6 0.7 to 0.9 2 to 2.2 0.8 to 1 1 to 1.4 3.2 to 3.8 0.9 to 1.4 2 to 2.4 4.4 to 5 1.2 to 1.8 2 to 2.4 4.4 to 5 1.8 to 2.8 3.3 to 3.7 5.7 to 6.5 2.3 to 3.5 3.6 to 4 6.2 to 7 1.8 to 2.8 5 to 5.4 7.6 to 8.6 2.3 to 3.5 1. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and confirmation test with the resistors actually mounted on your own board. When the load of more than rated power is applied under the load condition at steady state, it may impair performance and/or reliability of resistor. Never exceed the rated power. 2. Chlorine type or other high-activity flux is not recommended as the residue may affect performance or reliability of resistors. 3. When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When using a soldering iron with a tip at high temperature, solder for a time as short as possible (three seconds or less up to 350 C). 4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may damage protective film or the body of resistor and may affect resistorOs performance.