BIPOLAR ANALOG INTEGRATED CIRCUITS PC2747TB,PC2748TB D 3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUNICATIONS UE DESCRIPTION The PC2747TB, PC2748TB are silicon monolithic integrated circuits designed as amplifier for mobile communications. These ICs are packaged in super minimold package which is smaller than conventional minimold. These ICs are manufactured using our 20 GHz fT NESAT lll silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, these ICs have excellent performance, uniformity and reliability. FEATURES * Supply voltage : VCC = 2.7 to 3.3 V O NT IN * Noise figure : PC2747TB ; NF = 3.3 dB TYP. @ f = 900 MHz PC2748TB ; NF = 2.8 dB TYP. @ f = 900 MHz * Power gain : PC2747TB ; GP = 12 dB TYP. @ f = 900 MHz PC2748TB ; GP = 19 dB TYP. @ f = 900 MHz * Operating frequency : PC2747TB ; DC to 1.8 GHz * Isolation : PC2747TB ; ISL = 40 dB TYP. @ f = 900 MHz PC2748TB ; 0.2 to 1.5 GHz PC2748TB ; ISL = 40 dB TYP. @ f = 900 MHz * High-density surface mounting : 6-pin super minimold package (2.0 1.25 0.9 mm) APPLICATION * Buffer amplifiers for mobile telephones, etc. (PDC800M, GSM) ORDERING INFORMATION Package Marking SC Part Number PC2747TB-E3 6-pin super minimold PC2748TB-E3 C1S Supplying Form Embossed tape 8 mm wide 1, 2, 3 pins face the perforation side of the tape C1T Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. DI Part number for sample order: PC2747TB-A, PC2748TB-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PU10201EJ01V0DS (1st edition) (Previous No. P13444EJ3V0DS00) Date Published December 2002 CP(K) The mark shows major revised points. PC2747TB,PC2748TB PIN CONNECTIONS Pin Name 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC D Pin No. UE Marking is an example of PC2747TB PRODUCT LINE-UP (T A = +25C, VCC = 3.0 V, ZS = ZL =50 ) Part No. PC2745T fu (GHz) PO (sat) (dBm) GP (dB) NF (dB) 2.7 1.0 12 6.0 PC2745TB PC2746TB PC2747T PC2747TB PC2748T PC2748TB PC2749T PC2749TB 7.5 Package 6-pin minimold 1.5 0 19 4.0 7.5 6-pin minimold C1Q C1R 6-pin super minimold 1.8 7.0 12 3.3 5.0 6-pin minimold C1S 6-pin super minimold 1.5 3.5 19 2.8 6.0 6-pin minimold C1T 6-pin super minimold 2.9 6.0 16 4.0 6.0 6-pin minimold 6-pin super minimold Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Caution The package size distinguishes between minimold and super minimold. SYSTEM APPLICATION EXAMPLE DI SC EXAMPLE OF DIGITAL CELLULER TELEPHONE 2 Marking 6-pin super minimold O NT IN PC2746T ICC (mA) Data Sheet PU10201EJ01V0DS C1U PC2747TB,PC2748TB PIN EXPLANATION Pin Name Applied Pin Voltage Voltage (V) 1 INPUT (V) Function and Applications Note 0.80 Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a 0.80 wide band. This pin must be coupled to signal source GND 0 Ground pin. UE with capacitor for DC cut. 2 Internal Equivalent Circuit D Pin No. 3 This pin should be connected to system 5 ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. OUTPUT 2.79 Signal output pin. O NT IN 4 A internal matching circuit, configured with resistors, enables 50 connection over a 2.72 6 VCC 2.7 to 3.3 wide band. The above diagram is for the This pin must be coupled to next stage with PC2747TB. capacitor for DC cut. The resistor marked with an asterisk Power supply pin. does not exist in the PC2748TB. This pin should be externally equipped with bypass capacity to minimize ground impedance. DI SC Note Pin voltage is measured at VCC = 3.0 V. Above: PC2747TB, Below: PC2748TB Data Sheet PU10201EJ01V0DS 3 PC2747TB,PC2748TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25C 4.0 V Circuit Current ICC TA = +25C 15 mA Power Dissipation PD TA = +85C 270 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin 0 dBm D Note UE TA = +25C Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RENGE Parameter MIN. VCC 2.7 TYP. MAX. Unit 3.0 3.3 V O NT IN Supply Voltage Symbol ELECTRICAL CHARACTERISTICS (T A = +25C, VCC = 3.0 V, ZS = ZL = 50 , unless otherwise specified) Parameter Symbol PC2747TB Test Conditions PC2748TB Unit MIN. TYP. MAX. MIN. TYP. MAX. Circuit Current Power Gain Noise Figure Upper Limit Operating Frequency ICC No Signal GP NF fu 3.8 5.0 7.0 4.5 6.0 8.0 mA f = 900 MHz 9 12 14 16 19 21 dB f = 900 MHz - 3.3 4.5 - 2.8 4.0 dB 1.5 1.8 - 1.2 1.5 - GHz - - - - 0.2 0.4 GHz 3 dB down below from gain at f = 0.9 GHz Lower Limit Operating Frequency fL 3 dB down below from gain at f = 0.9 GHz Isolation f = 900 MHz 35 40 - 35 40 - dB RLin f = 900 MHz 11 14 - 8.5 11.5 - dB 7 10 - 5.5 8.5 - dB -9.5 -7.0 - -6.0 -3.5 - dBm SC Input Return Loss ISL RLout f = 900 MHz Saturated Output Power PO (sat) f = 900 MHz, Pin = -8 dBm DI Output Return Loss 4 Data Sheet PU10201EJ01V0DS PC2747TB,PC2748TB STANDARD CHARACTERISTICS FOR REFERENCE (T A = +25C, ZS = ZL =50 ) Parameter Symbol Test Conditions Reference Unit PC2747TB PC2748TB ICC VCC = 1.8 V, No signal 3.0 3.5 mA Power Gain GP VCC = 1.8 V, f = 900 MHz 5.5 11.5 dB Noise Figure NF VCC = 1.8 V, f = 900 MHz 5.2 4.5 dB VCC = 1.8 V, 1.8 1.5 GHz Upper Limit Operating Frequency fu Lower Limit Operating Frequency fL VCC = 1.8 V, UE 3 dB down below from gain at f = 0.9 GHz D Circuit Current 0.2 GHz 34 34 dB 11 10 dB 13 12 dB 13.7 10.0 dBm 34 38 dBc 20 28 3 dB down below from gain at f = 0.9 GHz Isolation ISL VCC = 1.8 V, f = 900 MHz Input Return Loss RLin VCC = 1.8 V, f = 900 MHz Output Return Loss RLout VCC = 1.8 V, f = 900 MHz Saturated Output Power PO (sat) VCC = 1.8 V, f = 900 MHz, Pin = 8 dBm Distortion IM3 VCC = 3.0 V, Pout = 20 dBm, O NT IN 3rd Order Intermodulation f1 = 900 MHz, f2 = 902 MHz VCC = 1.8 V, Pout = 20 dBm, DI SC f1 = 900 MHz, f2 = 902 MHz Data Sheet PU10201EJ01V0DS 5 PC2747TB,PC2748TB O NT IN EXAMPLE OF APPLICATION CIRCUIT UE D TEST CIRCUIT SC The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. CAPACITORS FOR VCC, INPUT AND OUTPUT PINS 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pin's ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. DI To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of f C = 1/(2 RC).] 6 Data Sheet PU10201EJ01V0DS PC2747TB,PC2748TB O NT IN UE D ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD COMPONENT LIST Value C 1 000 pF For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC DI SC (P11976E). Data Sheet PU10201EJ01V0DS 7 PC2747TB,PC2748TB TYPICAL CHARACTERISTICS (T A = +25C, unless otherwise specified) DI SC O NT IN UE D PC2747TB 8 Data Sheet PU10201EJ01V0DS PC2747TB,PC2748TB DI SC O NT IN UE D PC2747TB Remark The graphs indicate nominal characteristics. Data Sheet PU10201EJ01V0DS 9 PC2747TB,PC2748TB SMITH CHART (T A = +25C, VCC = 3.0 V) PC2747TB DI SC S22-FREQUENCY O NT IN UE D S11-FREQUENCY 10 Data Sheet PU10201EJ01V0DS PC2747TB,PC2748TB S-PARAMETERS DI SC O NT IN UE D PC2747TB Data Sheet PU10201EJ01V0DS 11 PC2747TB,PC2748TB TYPICAL CHARACTERISTICS (T A = +25C, unless otherwise specified) DI SC O NT IN UE D PC2748TB 12 Data Sheet PU10201EJ01V0DS PC2747TB,PC2748TB DI SC O NT IN UE D PC2748TB Remark The graphs indicate nominal characteristics. Data Sheet PU10201EJ01V0DS 13 PC2747TB,PC2748TB SMITH CHART (T A = +25C, VCC = 3.0 V) PC2748TB DI SC S22-FREQUENCY O NT IN UE D S11-FREQUENCY 14 Data Sheet PU10201EJ01V0DS PC2747TB,PC2748TB S-PARAMETERS DI SC O NT IN UE D PC2748TB Data Sheet PU10201EJ01V0DS 15 PC2747TB,PC2748TB PACKAGE DIMENSIONS DI SC O NT IN UE D 6-PIN SUPER MINIMOLD (UNIT: mm) 16 Data Sheet PU10201EJ01V0DS PC2747TB,PC2748TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. D (3) The bypass capacitor should be attached to VCC line. (4) The DC cut capacitor must be attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS For soldering UE This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher Preheating time at 120 to 180C Wave Soldering Partial Heating IR260 : 60 seconds or less : 12030 seconds : 3 times O NT IN Maximum number of reflow processes VPS Condition Symbol Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (package surface temperature) : 215C or below Time at temperature of 200C or higher : 25 to 40 seconds Preheating time at 120 to 150C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (pin temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below VP215 WS260 HS350 DI SC Caution Do not use different soldering methods together (except for partial heating). 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