LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R - JUNE 1976 - REVISED JULY 2010 D D D D D 1OUT 1IN- 1IN+ GND 1 8 2 7 3 6 4 5 VCC 2OUT 2IN- 2IN+ LM158, LM158A . . . FK PACKAGE (TOP VIEW) NC 1IN- NC 1IN+ NC 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN- NC NC GND NC 2IN+ NC D - Single Supply . . . 3 V to 32 V (26 V for LM2904) - or Dual Supplies . . . +1.5 V to +16 V (+13 V for LM2904) Low Supply-Current Drain, Independent of Supply Voltage . . . 0.7 mA Typ Common-Mode Input Voltage Range Includes Ground, Allowing Direct Sensing Near Ground Low Input Bias and Offset Parameters: - Input Offset Voltage . . . 3 mV Typ A Versions . . . 2 mV Typ - Input Offset Current . . . 2 nA Typ - Input Bias Current . . . 20 nA Typ A Versions . . . 15 nA Typ Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage . . . 32 V (26 V for LM2904) Open-Loop Differential Voltage Amplification . . . 100 V/mV Typ Internal Frequency Compensation LM158, LM158A . . . JG PACKAGE LM258, LM258A . . . D, DGK, OR P PACKAGE LM358 . . . D, DGK, P, PS, OR PW PACKAGE LM358A . . . D, DGK, P, OR PW PACKAGE LM2904 . . . D, DGK, P, PS, OR PW PACKAGE (TOP VIEW) NC 1OUT NC V CC+ NC D Wide Supply Range: description/ordering information NC - No internal connection These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is 3 V to 32 V (3 V to 26 V for the LM2904), and VCC is at least 1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage. Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required interface electronics without additional 5-V supplies. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2010, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R - JUNE 1976 - REVISED JULY 2010 ORDERING INFORMATION{ TA VIOmax AT 25C MAX TESTED VCC PDIP (P) 30 V LM358P Tube of 75 LM358D Reel of 2500 LM358DR Reel of 2500 LM358DRG3 Reel of 2000 LM358PSR Tube of 150 LM358PW Reel of 2000 LM358PWR Reel of 2000 LM358PWRG3 MSOP/VSSOP (DGK) Reel of 2500 LM358DGKR M5_ PDIP (P) Tube of 50 LM358AP LM358AP Tube of 75 LM358AD Reel of 2500 LM358ADR Tube of 150 LM358APW Reel of 2000 LM358APWR MSOP/VSSOP (DGK) Reel of 2500 LM358ADGKR M6_ PDIP (P) Tube of 50 LM258P LM258P Tube of 75 LM258D Reel of 2500 LM258DR Reel of 2500 LM258DRG3 MSOP/VSSOP (DGK) Reel of 2500 LM258DGKR M2_ PDIP (P) Tube of 50 LM258AP LM258AP Tube of 75 LM258AD Reel of 2500 LM258ADR MSOP/VSSOP (DGK) Reel of 2500 LM258ADGKR M3_ PDIP (P) Tube of 50 LM2904P LM2904P Tube of 75 LM2904D Reel of 2500 LM2904DR Reel of 2500 LM2904DRG3 Reel of 2000 LM2904PSR Tube of 150 LM2904PW Reel of 2000 LM2904PWR Reel of 2000 LM2904PWRG3 MSOP/VSSOP (DGK) Reel of 2500 LM2904DGKR MB_ SOIC (D) Reel of 2500 LM2904VQDR L2904V TSSOP (PW) Reel of 2000 LM2904VQPWR L2904V SOIC (D) Reel of 2500 LM2904AVQDR L2904AV TSSOP (PW) Reel of 2000 LM2904AVQPWR L2904AV CDIP (JG) Tube of 50 LM158JG LM158JG LCCC (FK) Tube of 55 LM158FK LM158FK CDIP (JG) Tube of 50 LM158AJG LM158AJG LCCC (FK) Tube of 55 LM158AFK LM158AFK SOP (PS) TSSOP (PW) 0C 0 C to 70C 70 C SOIC (D) 3 mV 30 V TSSOP (PW) 5 mV 30 V -25C 25 C to 85C 85 C 3 mV 30 V SOIC (D) SOIC (D) SOIC (D) 7 mV 26 V -40C 40 C to 125 125C C SOP (PS) TSSOP (PW) 7 mV 2 mV 32 V 32 V 5 mV 30 V 2 mV 30 V -55C 55C to 125C TOP-SIDE MARKING Tube of 50 SOIC (D) 7 mV ORDERABLE PART NUMBER PACKAGE} LM358P LM358 L358 L358 LM358A L358A LM258 LM258A LM2904 L2904 L2904 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R - JUNE 1976 - REVISED JULY 2010 The actual top-side marking has one additional character that designates the wafer fab/assembly site. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R - JUNE 1976 - REVISED JULY 2010 symbol (each amplifier) IN+ + - IN- OUT schematic (each amplifier) VCC+ 6-A Current Regulator 6-A Current Regulator 100-A Current Regulator OUT IN- 50-A Current Regulator IN+ GND (or VCC-) To Other Amplifier COMPONENT COUNT Epi-FET Diodes Resistors Transistors Capacitors 4 POST OFFICE BOX 655303 1 2 7 51 2 * DALLAS, TEXAS 75265 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R - JUNE 1976 - REVISED JULY 2010 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) LM158, LM158A LM258, LM258A LM358, LM358A LM2904V 16 or 32 Supply voltage, VCC (see Note 1) 32 Differential input voltage, VID (see Note 2) LM2904 13 or 26 V 26 V V Input voltage, VI (either input) -0.3 to 32 -0.3 to 26 Duration of output short circuit (one amplifier) to ground at (or below) 25C free-air temperature (VCC 15 V) (see Note 3) Unlimited Unlimited D package 97 97 172 172 P package 85 85 PS package 95 95 PW package 149 149 FK package 5.61 JG package 14.5 DGK package Package thermal impedance, qJA (see Notes 4 and 5) impedance qJC (see Notes 6 and 7) Package thermal impedance, Operating free-air free air temperature range, range TA LM158, LM158A -55 to 125 LM258, LM258A -25 to 85 LM358, LM358A 0 to 70 LM2904 Operating virtual junction temperature, TJ -40 to 125 150 Case temperature for 60 seconds FK package Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds JG package Storage temperature range, Tstg 300 C/W C/W C/W C -40 to 125 150 C C 260 -65 to 150 UNIT 300 C -65 to 150 C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages and VCC specified for measurement of IOS, are with respect to the network ground terminal. 2. Differential voltages are at IN+ with respect to IN-. 3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 4. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/qJA. Operating at the absolute maximum TJ of 150C can affect reliability. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 6. Maximum power dissipation is a function of TJ(max), qJC, and TC. The maximum allowable power dissipation at any allowable case temperature is PD = (TJ(max) - TC)/qJC. Operating at the absolute maximum TJ of 150C can affect reliability. 7. The package thermal impedance is calculated in accordance with MIL-STD-883. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R - JUNE 1976 - REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER LM158 LM258 TA TEST CONDITIONS MIN VIO Input offset voltage aV Average temperature coefficient of input offset voltage IO IIO Input offset current aI Average temperature coefficient of input offset current IO IIB VICR C VOH Input bias current Common mode Common-mode input voltage range High level High-level output p voltage g VCC = 5 V to MAX, VIC = VICR(min), VO = 1.4 V VO = 1.4 14V 2 10 25C -20 3 7 9 30 2 10 -150 -20 0 to VCC - 2 0 to VCC - 2 VCC - 1.5 VCC - 1.5 RL 10 k Full range 27 Full range -250 5 27 20 100 V 28 5 25 nA V 26 28 nA pA/C -500 0 to VCC - 1.5 26 50 150 0 to VCC - 1.5 Full range V/C 7 -300 RL = 2 k Crosstalk attenuation MAX 100 Full range 25C VO1/VO2 Output current 25C 25C Supply-voltage rejection ratio (VDD/VIO) IO 7 RL 2 k kSVR UNIT TYP 7 Full range RL 10 k VCC = 15 V, VO = 1 V to 11 V V, RL 2 k VCC = 5 V to MAX, VIC = VICR(min) MIN mV Full range Large-signal differential voltage amplification Common-mode rejection ratio CMRR 5 Full range VCC = 5 V to MAX RL 10 k AVD 3 Full range Low-level output voltage VOL MAX 25C 25C VCC = MAX TYP Full range VO = 1.4 14V LM358 20 mV 25C 50 100 Full range 25 25C 70 80 65 80 dB VCC = 5 V to MAX 25C 65 100 65 100 dB f = 1 kHz to 20 kHz 25C 120 dB VCC = 15 V, VID = 1 V, V VO = 0 25C -20 Full range -10 V/mV 15 120 -30 -20 -30 Source IO Output current VCC = 15 V, Sink VID = -1 1 V, V VO = 15 V VID = -1 V, VO = 200 mV IOS Short-circuit output current VCC at 5 V, GND at -5 V, VO = 0 ICC Supply current (two amplifiers) -10 mA 25C 10 Full range 5 25C 12 25C 40 60 40 60 VO = 2.5 V, No load Full range 0.7 1.2 0.7 1.2 VCC = MAX, VO = 0.5 V, No load Full range 1 2 1 2 20 10 20 5 30 12 A 30 mA mA All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for the LM2904 and 30 V for others. Full range is -55C to 125C for LM158, -25C to 85C for LM258, 0C to 70C for LM358, and -40C to 125C for LM2904. All typical values are at T = 25C. A 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R - JUNE 1976 - REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA LM2904 MIN 25C VIO aV IO Input offset voltage VCC = 5 V to MAX, VIC = VICR(min), VO = 1.4 V Non A devices Non-A Average temperature coefficient of input offset voltage Non V device Non-V IIO Input offset current VO = 1.4 14V IO Average temperature coefficient of input offset current IIB Input bias current VICR Common mode input voltage Common-mode range 14V VO = 1.4 VOL High-level High level output voltage Low-level output voltage Full range 7 25C 2 Full range 2 10 25C -20 25C 22 Full range 23 VCC = MAX, V-suffix device RL = 2 k Full range 26 RL 10 k Full range 27 28 25C 25 100 Full range 15 Non-V device 25C 50 80 V-suffix device 25C 65 80 65 100 Full range CMRR Common mode rejection ratio Common-mode VCC = 5 V to MAX, VIC = VICR(min) kSVR Supply-voltage rejection ratio (VDD/VIO) VCC = 5 V to MAX 25C VO1/VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25C VCC = 15 V, VID = 1 V, VO = 0 25C -20 Full range -10 25C 10 Full range 5 IOS Short-circuit output current ICC Supply current (two amplifiers) -250 24 5 VCC = 15 V, VO = 1 V to 11 V, RL 2 k VID = -1 1 V, VO = 200 mV pA/C nA V Full range Large signal differential Large-signal voltage amplification Output current nA VCC - 1.5 AVD IO 50 0 to VCC - 2 RL 10 k VCC = 15 V, VID = -1 1 V, V VO = 15 V 50 0 to VCC - 1.5 RL = 2 k Source mV V/C -500 VCC = MAX, Non-V device RL 10 k 2 150 Full range Full range 7 300 Full range VCC = 5 V to MAX UNIT 4 Full range RL 10 k VOH 1 Full range 25C MAX 10 25C V suffix device V-suffix aI 3 Full range 25C A suffix devices A-suffix TYP V 20 mV V/mV dB dB 120 dB -30 mA mA 20 mA Sink Non-V device 25C V-suffix device 25C mA 30 12 A A 40 25C 40 60 VO = 2.5 V, No load Full range 0.7 1.2 VCC = MAX, VO = 0.5 V, No load Full range 1 2 VCC at 5 V, GND at -5 V, VO = 0 mA mA All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for the LM2904, 32 V for the LM2904V, and 30 V for others. Full range is -55C to 125C for LM158, -25C to 85C for LM258, 0C to 70C for LM358, and -40C to 125C for LM2904. All typical values are at T = 25C. A POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R - JUNE 1976 - REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER VIO Input offset voltage aV Average temperature coefficient of input offset voltage IO IIO Input offset current aI Average temperature coefficient of input offset current IO IIB Input bias current VICR C Common mode Common-mode input voltage range VOH VOL AVD CMRR High-level High level output voltage VCC = 5 V to 30 V, VIC = VICR(min), VO = 1.4 V VO = 1.4 14V VO = 1.4 14V Crosstalk attenuation Output current IOS Short-circuit output current ICC Supply current (two amplifiers) Full range 4 MIN TYP MAX 2 3 UNIT mV 4 Full range 7 15* 7 15 25C 2 10 2 15 30 30 Full range 10 200 10 200 25C -15 -50 -15 -80 -100 -100 25C 0 to VCC - 1.5 0 to VCC - 1.5 Full range 0 to VCC - 2 0 to VCC - 2 VCC - 1.5 VCC - 1.5 25C RL = 2 k Full range 26 RL 10 k Full range 27 VCC = 15 V, VO = 1 V to 11 V V, RL 2 k LM258A MAX 2 RL 2 k Large-signal differential voltage amplification Common-mode rejection ratio VO1/VO2 TYP 25C VCC = 30 V VCC = 30 V LM158A MIN Full range RL 10 k Supply-voltage rejection ratio (VDD/VIO) TA Full range Low-level output voltage kSVR IO TEST CONDITIONS Full range 5 27 20 100 pA/C nA V 28 5 50 nA V 26 28 V/C 20 mV 25C 50 100 Full range 25 25C 70 80 70 80 dB 25C 65 100 65 100 dB 120 dB V/mV f = 1 kHz to 20 kHz 25C VCC = 15 V, VID = 1 V, V VO = 0 25C -20 Full range -10 25 120 -30 -60 -20 -30 -60 Source -10 mA VCC = 15 V, Sink VID = -1 1 V, V VO = 15 VID = -1 V, VO = 200 mV 25C 10 Full range 5 25C 12 VCC at 5 V, GND at -5 V, VO = 0 25C 40 60 40 60 VO = 2.5 V, No load Full range 0.7 1.2 0.7 1.2 VCC = MAX, VO = 0.5 V, No load Full range 1 2 1 2 20 10 20 5 30 12 A 30 mA mA *On products compliant to MIL-PRF-38535, this parameter is not production tested. All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V CC for testing purposes is 26 V for LM2904 and 30 V for others. Full range is -55C to 125C for LM158A, -25C to 85C for LM258A, and 0C to 70C for LM358A. All typical values are at T = 25C. A 8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R - JUNE 1976 - REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) TEST CONDITIONS PARAMETER VCC = 5 V to 30 V, VIC = VICR(min), VO = 1.4 V VIO Input offset voltage aV Average temperature coefficient of input offset voltage IO IIO Input offset current aI Average temperature coefficient of input offset current IO IIB VO = 1.4 14V Input bias current TA 25C VOL Low-level output voltage 3 5 7 20 25C 2 30 75 Full range 10 300 25C -15 -100 Full range VCC = 30 V RL 2 k High-level High level output voltage 2 Full range Full range VOH MAX Full range VO = 1.4 14V Common mode input voltage range Common-mode TYP Full range 25C VICR LM358A MIN 25C VCC = 30 V -200 0 to VCC - 1.5 V/C nA pA/C nA VCC - 1.5 Full range 26 RL 10 k Full range 27 28 25C 25 100 Full range 15 Full range VCC = 15 V, VO = 1 V to 11 V, RL 2 k mV V 0 to VCC - 2 RL = 2 k RL 10 k UNIT V 5 20 mV AVD Large signal differential Large-signal voltage amplification CMRR Common-mode rejection ratio 25C 65 80 dB kSVR Supply-voltage rejection ratio (VDD/VIO) 25C 65 100 dB VO1/VO2 Crosstalk attenuation 120 dB f = 1 kHz to 20 kHz VCC = 15 V, VID = 1 V, V VO = 0 IO Output current IOS Short-circuit output current ICC Supply current (two amplifiers) 25C 25C -20 Full range -10 25C 10 Full range 5 V/mV -30 -60 Source mA VCC = 15 V, VID = -1 1 V, V VO = 15 V 20 Sink A VID = -1 V, VO = 200 mV 25C 30 VCC at 5 V, GND at -5 V, VO = 0 25C 40 60 VO = 2.5 V, No load Full range 0.7 1.2 VCC = MAX, VO = 0.5 V, No load Full range 1 2 mA mA All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for LM2904 and 30 V for others. Full range is -55C to 125C for LM158A, -25C to 85C for LM258A, and 0C to 70C for LM358A. All typical values are at T = 25C. A POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 9 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R - JUNE 1976 - REVISED JULY 2010 operating conditions, VCC = 15 V, TA = 25C PARAMETER TEST CONDITIONS TYP UNIT 0.3 V/s SR Slew rate at unity gain RL = 1 M, CL = 30 pF, VI = 10 V (see Figure 1) B1 Unity-gain bandwidth RL = 1 M, CL = 20 pF (see Figure 1) 0.7 MHz Vn Equivalent input noise voltage RS = 100 , VI = 0 V, f = 1 kHz (see Figure 2) 40 nV/Hz VCC+ - VI VO + CL VCC- RL Figure 1. Unity-Gain Amplifier 900 VCC+ 100 - VI = 0 V RS VO + VCC- Figure 2. Noise-Test Circuit 10 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp Samples (Requires Login) 5962-87710012A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-8771001PA ACTIVE CDIP JG 8 1 TBD Call TI Call TI 5962-87710022A ACTIVE LCCC FK 20 1 TBD Call TI Call TI 5962-8771002PA ACTIVE CDIP JG 8 1 TBD Call TI Call TI LM158AFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type LM158AJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type LM158AJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type LM158FKB ACTIVE LCCC FK 20 1 TBD LM158JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type LM158JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type LM258AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258ADE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM POST-PLATE N / A for Pkg Type LM258AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LM258APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LM258D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258DRE4 ACTIVE SOIC D 8 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM258DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) LM258DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM LM258P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LM258PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LM2904AVQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904AVQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904AVQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904AVQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 Samples (Requires Login) LM258DG4 CU SN (3) PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) LM2904DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) LM2904DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) LM2904DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM LM2904P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LM2904PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LM2904PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904PSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904PSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904PWLE OBSOLETE TSSOP PW 8 LM2904PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) LM2904PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LM2904QD OBSOLETE SOIC D 8 TBD Call TI Call TI LM2904QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904QP OBSOLETE PDIP P 8 LM2904VQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904VQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TBD TBD Addendum-Page 3 Call TI Call TI CU NIPDAU Level-1-260C-UNLIM Call TI Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM CU SN (3) Call TI PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp LM2904VQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM2904VQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358ADE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LM358APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LM358APW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358APWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358APWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358APWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358APWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358APWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 4 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) LM358DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) LM358P ACTIVE PDIP P 8 50 Pb-Free (RoHS) LM358PE3 ACTIVE PDIP P 8 50 Pb-Free (RoHS) LM358PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) LM358PSLE OBSOLETE SO PS 8 LM358PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358PSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358PSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LM358PWLE OBSOLETE TSSOP PW 8 LM358PWR ACTIVE TSSOP PW 8 TBD TBD 2000 Green (RoHS & no Sb/Br) Addendum-Page 5 Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU SN N / A for Pkg Type CU NIPDAU N / A for Pkg Type Call TI Call TI Samples (Requires Login) LM358DE4 CU SN (3) Call TI Call TI CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 16-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) LM358PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) LM358PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) LM358PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-1-260C-UNLIM CU SN Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM258A, LM2904 : * Automotive: LM2904-Q1 * Enhanced Product: LM258A-EP Addendum-Page 6 PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 NOTE: Qualified Version Definitions: * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects * Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 7 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904AVQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904VQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358APWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM258ADGKR VSSOP DGK 8 2500 332.0 358.0 35.0 LM258ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM258ADR SOIC D 8 2500 340.5 338.1 20.6 LM258ADR SOIC D 8 2500 367.0 367.0 35.0 LM258DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM258DGKR VSSOP DGK 8 2500 332.0 358.0 35.0 LM258DR SOIC D 8 2500 340.5 338.1 20.6 LM258DR SOIC D 8 2500 367.0 367.0 35.0 LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM258DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM2904AVQPWR TSSOP PW 8 2000 367.0 367.0 35.0 LM2904DGKR VSSOP DGK 8 2500 332.0 358.0 35.0 LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM2904DR SOIC D 8 2500 367.0 367.0 35.0 LM2904DR SOIC D 8 2500 340.5 338.1 20.6 LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM2904DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM2904PSR SO PS 8 2000 367.0 367.0 38.0 LM2904PWR TSSOP PW 8 2000 367.0 367.0 35.0 LM2904PWR TSSOP PW 8 2000 364.0 364.0 27.0 Pack Materials-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2904PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 LM2904QDR SOIC D 8 2500 367.0 367.0 35.0 LM2904VQPWR TSSOP PW 8 2000 367.0 367.0 35.0 LM358ADGKR VSSOP DGK 8 2500 332.0 358.0 35.0 LM358ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM358ADR SOIC D 8 2500 367.0 367.0 35.0 LM358ADR SOIC D 8 2500 340.5 338.1 20.6 LM358APWR TSSOP PW 8 2000 367.0 367.0 35.0 LM358APWR TSSOP PW 8 2000 364.0 364.0 27.0 LM358APWRG4 TSSOP PW 8 2000 367.0 367.0 35.0 LM358DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM358DGKR VSSOP DGK 8 2500 332.0 358.0 35.0 LM358DR SOIC D 8 2500 340.5 338.1 20.6 LM358DR SOIC D 8 2500 367.0 367.0 35.0 LM358DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM358DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM358PSR SO PS 8 2000 367.0 367.0 38.0 LM358PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM358PWR TSSOP PW 8 2000 367.0 367.0 35.0 LM358PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 LM358PWRG4 TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 4 MECHANICAL DATA MCER001A - JANUARY 1995 - REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0-15 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated