E
E
SECT. E-E
7.25( )
D
B
0.1
1.75
C( )
A( ) 2.925( )
0.32( )
0.25
0.875( )
3.6
4.1( )
2.42( )
5.75
0.3
回路番号1マーク
CIRCUIT NO.1 MARK
ターミナル
TERMINAL
0.51
F
0.3 G
G
アクチュエータ 開口状態
WHEN ACTUATOR IS OPENED.
TYP.(N)
TYP.(2)
TYP.(2)
(PITCH)
アクチュエータ
ACTUATOR
ハウジング
HOUSING
4
FPC挿入深さ
INSERTION DEPTH OF FPC
接点位置
POSITION OF CONTACT POINT
0.7
0.45
ソルダーテール
SOLDER TAIL
3
TYP.(2)
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER
0.2
10 OVER 30 UNDER
0.25
30 OVER
0.3
36.6
34.85
31.2
29
52610-3034
30
34.6
32.85
29.2
27
52610-2834
28
32.6
30.85
27.2
25
52610-2634
26
31.6
29.85
26.2
24
52610-2534
25
30.6
28.85
25.2
23
52610-2434
24
29.6
27.85
24.2
22
52610-2334
23
28.6
26.85
23.2
21
52610-2234
22
27.6
25.85
22.2
20
52610-2134
21
26.6
24.85
21.2
19
52610-2034
20
25.6
23.85
20.2
18
52610-1934
19
24.6
22.85
19.2
17
52610-1834
18
23.6
21.85
18.2
16
52610-1734
17
22.6
20.85
17.2
15
52610-1634
16
21.6
19.85
16.2
14
52610-1534
15
20.6
18.85
15.2
13
52610-1434
14
19.6
17.85
14.2
12
52610-1334
13
18.6
16.85
13.2
11
52610-1234
12
17.6
15.85
12.2
10
52610-1134
11
16.6
14.85
11.2
9
52610-1034
10
15.6
13.85
10.2
8
52610-0934
9
14.6
12.85
9.2
7
52610-0834
8
13.6
11.85
8.2
6
52610-0734
7
12.6
10.85
7.2
5
52610-0634
6
D
( C )
B
( A )
EMBOSSED PACKAGE
ORDER NO. オーダー番号
極数
CKT
CONNECTOR SERIES NO. : 52610-**23
アクチュエータ ロック状態
WHEN ACTUATOR IS LOCKED.
6
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC: REVISED
EC NO: 600129
DRWN:
YCHEN128
2018/04/11
CHK'D:
KTAKAHASHI
2018/04/12
APPR:
NUKITA
2018/04/13
INITIAL REVISION:
DRWN:
YMIZUNO02
2016/12/16
APPR:
TKUSUHARA01
2016/12/28
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52610
DIMENSION UNITS
SCALE
mm
---
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.03
3 PLACES
±
0.03
2 PLACES
±
0.05
1 PLACE
±
0.1
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1.0 FPC CONN ZIF S/T HOUSING ASSY
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
526101002
PSD
000
B
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL 1 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/04/13 03:51:06
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
3.8
0.7 +0.1
-0.05
1
0.1
1xN-1
0.1
0.6( )
0.9
0.95( )2.9( )1.65( )
TYP.(2)
(PITCH)
(ピッチ)
参考基盤レイアウト
RECOMMENDED P.C.BOARD
PATTERN LAYOUT (REFERENCE)
マスク厚 : 120μm
マスク開口率： 100%
SCREEN THICKNESS : 120 MICROMETER
SCREEN OPEN RATIO : 100%
1
0.15
1
0.05
1xN-1
0.05
2- 0.3C
2.7 MIN.
1
0.15
1xN+1+0.1
-0.05
(PITCH)
(ピッチ)
適合FPC/FFC推奨寸法
APPLICABLE FPC/FFC
RECOMMENDED DIMENSION
(仕上がり厚さ：0.3
0.05)
(THICKNESS : 0.3
0.05)
GENERAL TOLERANCES
(UNLESS SPECIFIED)
10 UNDER
0.2
10 OVER 30 UNDER
0.25
30 OVER
0.3
コネクタ位置
CONNECTOR
LOCATION
注記(NOTES):
1.材質 MATERIAL
ハウジング：ポリアミド(PA)、ナチュラル(白色)、ガラス充填、UL94V-0
アクチュエータ：ポリフェニレンサルファイド(PPS)、ナチュラル(茶色)、ガラス充填、UL94V-0
ターミナル：リン青銅(t=0.32)
HOUSING : POLYAMIDE, NATURAL(WHITE), GLASS FILLED, UL94V-0
ACTUAOR : POLYPHENYLENE SULFID, NATURAL(BROWN), GLASS FILLED, UL94V-0
TERMINAL : PHOSPHOR BRONZE(t=0.32)
2.めっき仕様 PLATING
ターミナル TERMINAL
錫銀ビスマスめっき(1.0μm以上)
下地：ニッケルめっき(1.0μm以上)
TIN SILVER BISMUTH PLATING (1.0 MICROMETER MINIMUM)
UNDER PLATE : NICKEL PLATING (1.0 MICROMETER MINIMUM)
ソルダーテール半田付け面のズレ量は、基準面 F に対し
上方向0.05MAX.、下方向0.15MAX.とする。
MISALIGNMENT OF SOLDER TAILS FROM F UPPER DIREVTION : 0.05 MAX.
LOWER DIRECTION :0.15 MAX.
偶数極に適用。
APPLY FOR EVEN CIRCUIT.
R0.3はFPCの導体部にかからないこと.
R0.3 MUST NOT BE OVERLAPED TO PATTERN OF FPC.
6.エンボステープ梱包時は、アクチュエータがロックした状態とする。
IN THE PACKAGE, ACTUATOR SHOULD BE LOCKED.
ソルダーテールの平坦度は0.1 mm以下とする.
SOLDERTAIL COPLANARITY IS 0.1MM MAXIMUM.
8.ELV及びRoHS適合品.
ELV AND RoHS COMPLIANT.
3
4
5
7
THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
CURRENT REV DESC: REVISED
EC NO: 600129
DRWN:
YCHEN128
2018/04/11
CHK'D:
KTAKAHASHI
2018/04/12
APPR:
NUKITA
2018/04/13
INITIAL REVISION:
DRWN:
YMIZUNO02
2016/12/16
APPR:
TKUSUHARA01
2016/12/28
THIRD ANGLE PROJECTION
DRAWING SERIES
A3-SIZE
52610
DIMENSION UNITS
SCALE
mm
---
GENERAL TOLERANCES
(UNLESS SPECIFIED)
ANGULAR TOL
±
3.0 °
4 PLACES
±
0.03
3 PLACES
±
0.03
2 PLACES
±
0.05
1 PLACE
±
0.1
0 PLACES
±
0.2
DRAFT WHERE APPLICABLE
MUST REMAIN
WITHIN DIMENSIONS
1.0 FPC CONN ZIF S/T HOUSING ASSY
PRODUCT CUSTOMER DRAWING
DOCUMENT NUMBER
DOC TYPE
DOC PART
REVISION
526101002
PSD
000
B
MATERIAL NUMBER CUSTOMER SHEET NUMBER
SEE TABLE GENERAL 2 OF 2
FORMAT: master-tb-prod-A3
REVISION: H
DATE: 2018/01/18
DOCUMENT STATUS P1 RELEASE DATE 2018/04/13 03:51:06
0.3
0.05
補強板：ポリイミド
REINFORCE BOARD: POLYMIDE
仕上がり厚さ
THICKNESS
めっき：錫めっき(0.5-1.2μm)
下地ニッケル(1-5μm)
PLATING: TIN(0.5-1.2μm)
NICKEL UNDER(1-5μm)
導体部： 銅箔(35 or 50μm)
COPPER FOIL (35 or 50μm)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
絶縁テープ：ポリエステル系(25μm)
INSULATING FILM: PET(25μm)
0.3
0.05
仕上がり厚さ
THICKNESS
接着剤(難燃ポリエステル系)
ADHESIVE（FLAME-RETARDANT
POLYESTER ADHESIVE)
補強板：ポリエステル系
REINFORCE BOARD: PET
カバーレイ : ポリイミド(25μm)
COVER FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
ベースフィルム：ポリイミド(25μm)
BASE FILM: POLYIMIDE(25μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
めっき：錫めっき(0.5-1.2μm)
下地ニッケル(1-5μm)
PLATING: TIN(0.5-1.2μm)
NICKEL UNDER(1-5μm)
導体部： 銅箔(35 or 50μm)
COPPER FOIL (35 or 50μm)
熱硬化接着剤
THERMOSETTING ADHESIVE
FFC構成推奨仕様
RECOMMENDED STRUCTURE OF FFC
FPC構成推奨仕様
RECOMMENDED STRUCTURE OF FPC
FPC/FFCについて：
抜き方向は、導体側から補強板側を推奨致します。
尚、接着剤の接点部への付着は導通不良の原因になりますので、
染み出しが無い様お願い致します。
ABOUT FPC/FFC:
RECOMMENDED PUNCHER DIRECTION:
FROM CONDUCTOR SIDE TO STIFFNER SIDE
PLEASE PUT APPROPRIATE AMOUNT OF ADHESIVE ON ADHEREND
BECAUSE THERE IS A POSSIBILITY THAT THE EXTRA ADHESIVE
CAUSES THE DEFECT IN ELECTRICAL CONTINUITY.
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
A A
B B
C C
D D
E E
