Features

• Dual marked with device part number and DSCC

drawing number

• Manufactured and tested on a MIL-PRF-38534

Certied Line

• QML-38534, Class H and K

• Five hermetically sealed package congurations

• Performance guaranteed over full military

temperature range: -55°C to +125°C

compatibility

• Reliability data

• TTL circuit compatibility

Applications

• Military and aerospace

• High reliability systems

• Transportation, medical, and life critical systems

• Line receiver

• Voltage level shifting

• Isolated input line receiver

of this component to prevent damage and/or degradation which may be induced by ESD.

The connection of a 0.1 µF bypass capacitor between VCC and GND is recommended.

6N134,* 81028, HCPL-563X, HCPL-663X,

HCPL-565X, 5962-98001, HCPL-268K,

HCPL-665X, 5962-90855, HCPL-560X

Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers

Data Sheet

*See matrix for available extensions.

These units are single, dual and quad channel, hermeti-

line and are included in the DSCC Qualied Manufactur-

ers List QML-38534 for Hybrid Microcircuits. Quad chan-

nel devices are available by special order in the 16 pin

DIP through hole packages.

Truth Table (Positive Logic)

Multichannel Devices

Single Channel DIP

Multiple channel devices available

cations requiring up to 2500 Vdc, the HCPL-5650 family is

also available. Package styles for these parts are 8 and 16

pin DIP through hole (case outlines P and E respectively),

and 16 pin surface mount DIP at pack (case outline F),

leadless ceramic chip carrier (case outline 2). Devices

may be purchased with a variety of lead bend and plat-

ing options. See Selection Guide Table for details. Stan-

dard Microcircuit Drawing (SMD) parts are available for

each package and lead style.

package variations and limitations, and are as noted.

Additionally, the same package assembly processes and

materials are used in all devices. These similarities give

justication for the use of data obtained from one part

to represent other parts’ performance for reliability and

certain limited radiation test results.

Selection Guide–Package Styles and Lead Conguration Options

package has isolated channels with separate VCC and ground connections. All diagrams are “top view.”

Leaded Device Marking

Leadless Device Marking

Absolute Maximum Ratings

No derating required up to +125°C.

Recommended Operating Conditions (cont’d.)

Electrical Characteristics, (cont’d) TA = -55°C to +125°C unless otherwise specied

1. Each channel.

2. All devices are considered two-terminal devices; II-O is measured between all input leads or terminals shorted together and all output

3. Measured between each input pair shorted together and all output connections for that channel shorted together.

4. Measured between adjacent input pairs shorted together for each multichannel device.

5. tPHL propagation delay is measured from the 50% point on the leading edge of the input pulse to the 1.5 V point on the leading edge of

6. The HCPL-6630, HCPL-6631, and HCPL-663K dual channel parts function as two independent single channel units. Use the single channel

9. It is essential that a bypass capacitor (0.01 to 0.1 µF, ceramic) be connected from VCC to ground. Total lead length between both ends of

10. No external pull up is required for a high logic state on the enable input.

11. The tELH enable propagation delay is measured from the 1.5 V point on the trailing edge of the enable input pulse to the 1.5 V point on

12. The tEHL enable propagation delay is measured from the 1.5 V point on the leading edge of the enable input pulse to the 1.5 V point on

13. Standard parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD and 883B parts receive 100% testing at 25, 125, and -55°C (Sub-

14. Parameters are tested as part of device initial characterization and after design and process changes. Parameters are guaranteed to limits

15. Not required for 6N134, 6N134/883B, 8102801, HCPL-268K and 5962-9800101 types.