© Semiconductor Components Industries, LLC, 2015
August, 2015 − Rev. 0
1Publication Order Number:
CSPEMI202FC/D
CSPEMI202FCTAG
2 Channel Headset
Microphone EMI Filter with
ESD Protection
Product Description
The CSPEMI202FCTAG is a dual low−pass filter array integrating
two pi−style filters (C−R−C) that reduce EMI/RFI emissions while at
the same time providing ESD protection. This part is custom−designed
to interface with a microphone port on a cellular telephone or similar
device. Each high quality filter provides more than 35 dB attenuation
in the 800−2700 MHz range. These pi−style filters support
bidirectional filtering, controlling EMI both to and from a microphone
element. They also support bipolar signals, enabling audio signals to
pass through without distortion.
In addition, the CSPEMI202AG provides a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The diodes safely dissipate ESD
strikes of ±8 kV, the maximum requirement of the IEC 61000−4−2
international standard. Using the MIL−STD−883 (Method 3015)
specification for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater than ±15 kV.
The CSPEMI202FCTAG is particularly well−suited for portable
electronics (e.g. cellular telephones, PDAs, notebook computers)
because of its small package format and low weight. The
CSPEMI202FCTAG is available in a space−saving, low−profile Chip
Scale Package with RoHS compliant lead−free finishing.
Features
•Two Channels of EMI Filtering
•Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
Network
•Greater than 40 dB Attenuation at 1 GHz
•±8 kV ESD Protection on each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
•±15 kV ESD Protection on each Channel (HBM)
•Supports Bipolar Signals − Ideal for Audio Applications
•Chip Scale Package Features Extremely Low Lead Inductance for
Optimum Filter and ESD Performance
•5−Bump, 0.930 x 1.410 mm Footprint Chip Scale Package (CSP)
•These Devices are Pb−Free and are RoHS Compliant
Applications
•EMI Filtering and ESD Protection for Headset Microphone Ports
•Wireless Handsets
•Handheld PCs / PDAs
•MP3 Players
•Digital Camcorders
•Notebooks
•Desktop PCs
MARKING DIAGRAM
Device Package Shipping†
ORDERING INFORMATION
www.onsemi.com
CSPEMI202FCTAG CSP−5
(Pb−Free)
3500 / Tape &
Reel
WLCSP5
AG SUFFIX
CASE 567LT
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
AE = CSPEMI202FC
A1
MIC
_
OUT2
68 W
47 pF 47 pF
47 pF 47 pF
ELECTRICAL SCHEMATIC
MIC_IN2 MIC_IN1
68 W
A3
B2
GND
C1
C3
MIC
_
OUT1
+
AE
CSPEMI202FCTAG
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2
Table 1. PIN DESCRIPTIONS
5−bump CSP Package
Pin Name Description
A1 MIC_IN1 Microphone Input 1 (from microphone)
A3 MIC_IN2 Microphone Input 2 (from microphone)
B2 GND Device Ground
C1 MIC_OUT1 Microphone Output 1 (to audio circuitry)
C3 MIC_OUT1 Microphone Output 2 (to audio circuitry)
PACKAGE / PINOUT DIAGRAMS
Orientation
Marking
CSPEMI202FC
CSP Package
Top View
(Bumps Down View)
Bottom View
(Pins Up View)
1 2 3
C1 C3
A1 A3
B2
A
B
C
+
A1
Orientation
Marking
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter Rating Units
Storage Temperature Range −65 to +150 °C
DC Power per Resistor 100 mW
DC Package Power Rating 200 mW
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 3. STANDARD OPERATING CONDITIONS
Parameter Rating Units
Operating Temperature Range −40 to +85 °C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol Parameter Conditions Min Typ Max Units
R1Resistance 61 68 75 W
C1Channel Capacitance 76 94 112 pF
ILEAK Diode Leakage Current VIN = 5.0 V 1.0 mA
VSIG Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
5
−15
7
−10
15
−5
V
VESD In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
(Note 2)
±15
±8
kV
VCL Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Notes 2 and 3)
+15
−19
V
fCCut−off frequency
ZSOURCE = 50 W, ZLOAD = 50 W
60 MHz
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping
voltage is measured at Pin C1.
CSPEMI202FCTAG
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4
APPLICATION INFORMATION
Parameter Value
Pad Size on PCB 0.240 mm
Pad Shape Round
Pad Definition Non−Solder Mask defined pads
Solder Mask Opening 0.290 mm Round
Solder Stencil Thickness 0.125 mm − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300 mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball ±50 mm
Solder Ball Side Coplanarity ±20 mm
Maximum Dwell Time Above Liquidous 60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste 260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 3. Recommended Non−Solder Mask Defined Pad Illustration
Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (5C)
CSPEMI202FCTAG
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5
PACKAGE DIMENSIONS
WLCSP5, 1.41x0.94
CASE 567LT
ISSUE O
SEATING
PLANE
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
2X
DIM
A
MIN MAX
0.40
MILLIMETERS
A1
D1.41 BSC
E
b0.29 0.35
eD 0.435 BSC
0.50
ÈÈ
ÈÈ
E
D
AB
PIN A1
REFERENCE
eD
A0.05 BC
0.03 C
0.05 C
5X b
123
C
B
A
0.05 C
A
A1
A2
C
0.21 0.27
0.94 BSC
eE 0.25 BSC
0.50
0.25
5X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.25
0.87
0.44
0.05 C
2X TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 3
eE
A2 0.23 REF
RECOMMENDED
A1
PACKAGE
OUTLINE
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
CSPEMI202FC/D
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