TDA7073AT/N4,112 - NXP Semiconductors

DATA SH EET

Product specification

Supersedes data of 1994 July 1999 Aug 30

INTEGRATED CIRCUITS

TDA7073A; TDA7073AT

Dual BTL power driver

1999 Aug 30 2

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

FEATURES

•No external components

•Very high slew rate

•Single power supply

•Short-circuit proof

•High output current (0.6 A)

•Wide supply voltage range

•Low output offse t voltage

•Suited for handling PWM signals up to 176 kHz

•ESD protected on all pins.

GENERAL DESCRIPTION

The TDA7073A/AT are dual power driver circuits in a BTL

configuratio n, intended f or use as a power d river for ser vo

systems with a si ngle supply. They ar e specially designed

for compact disc players and are capable of driving focus,

tracking, sled functions and spindle motors.

Missing Current Limiter (MCL)

A MCL protection circuit is built-in. The MCL circuit is

activated when the differ ence in curre nt between the

output terminal of each amplifier exceeds 100 mA (typical

300 mA). This level of 100 mA allows for headphone

applications (single-ended).

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPpositive supply voltage range 3.0 5.0 18 V

Gvvoltage gain 32.5 33.5 34.5 dB

IPtotal quiescent current VP=5V; R

L=∞−816mA

SR slew rate −12 −V/μs

IOoutput current −−0.6 A

Ibias input bias current −100 300 nA

fco cut-off frequency −3dB −1.5 −MHz

TYPE NUMBER PACKAGE

NAME DESCRIPTION VERSION

TDA7073A DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

TDA7073AT SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

1999 Aug 30 3

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

positive input 1

16I + i

13I – i

negative input 1

positive output 1

negative output 1

MCD382 - 1

positive input 2 6

TDA7073A

TDA7073AT

9I + i

I – i

negative input 2

positive output 2

negative output 2

ground 1 n.c.

ground 2

3, 4, 8, 11, 15

ΙΙ

SHORT - CIRCUIT AND

THERMAL PROTECTION

1999 Aug 30 4

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

PINNING

SYMBOL PIN DESCRIPTION

IN1−1 negative input 1

IN1+2 positive input 1

n.c. 3 not connecte d

n.c. 4 not connecte d

VP5 positive supply voltage

IN2+6 positive input 2

IN2−7 negative input 2

n.c. 8 not connecte d

OUT2+9 positive output 2

GND2 10 ground 2

n.c. 11 not connecte d

OUT2−12 negative outpu t 2

OUT1−13 negative outpu t 1

GND1 14 ground 1

n.c. 15 not co nnected

OUT1+16 positive output 1 Fig.2 Pin configuration.

handbook, halfpage 1

TDA7073A

TDA7073AT

OUT1+

GND1

n.c.

IN1–

IN1+

n.c.

OUT1 –

OUT2 –

n.c.

GND2

OUT2 +

n.c.

IN2 –

IN2 +

MCD381

FUNCTIONAL DESCRIPTION

The TDA7073A/AT are du al power driver circu its in a BTL

configuration, intended for use as a power driver for servo

systems with a single supply. They are particular designed

for compact dis c players and are capa ble of drivin g focus,

tracking, sled functions and s pin dle motors.

Because of the BTL configuration, the devices can supply

a bi-directional DC current in the load, with only a single

supply voltage. The voltag e gain is fixed by internal

feedback at 33.5 dB and the devi ces operate in a wide

supply voltage ran ge (3 to 18 V). The devices can suppl y

a maximum output current of 0.6 A. The outputs can be

short-circui te d over the load, to the supply an d to gr ou nd

at all input conditions. The differential inputs can handle

common mode input voltages from ground level up to

(VP−2.2 V with a maximum of 10 V). The devices have a

very high slew rate. Due to the large bandwidth, th ey can

handle PWM signals up to 176 kHz.

1999 Aug 30 5

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

LIMITING VALUES

In accordance with the Absolute Max i mum System (IEC 134).

Note

1. The outputs can be short-circuited over the load, to the supply and to ground at all input conditions.

THERMAL CHARACTE RISTICS

Notes

1. TDA7073A: VP=5V; R

L=8Ω; The typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO= 0.36 A and

Ptot =2×0.76 W = 1.52 W; Tamb (max) =150−1.52 ×50 = 74 °C.

2. TDA7073AT: VP=5V; R

L=16Ω; typical voltage swing = 5.8 V and Vloss is 2.1 V therefore IO= 0.18 A and

Ptot =2×0.38 W = 0.76 W; Tamb (max) =150−0.76 ×95 = 77 °C.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VPpositive supply voltage range −18 V

IORM repetitive peak output current −1A

IOSM non repetitiv e peak output curre nt −1.5 A

Ptot total power dissipation

TDA7073A Tamb <25°C−2.5 W

TDA7073AT Tamb <25°C−1.32 W

Tstg storage temperature range −55 +150 °C

Tvj virtual junction temperature −150 °C

Tsc short-circuit time see note 1 −1hr

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth (j-a) from junction to ambient

TDA7073A in free air; note 1 50 K/W

TDA7073AT in free air; note 2 95 K/W

1999 Aug 30 6

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

CHARACTERISTICS

VP=5V; f=1kHz; T

amb =25°C; unless otherwise specified (see Fig.3). TDA7073A: RL=8Ω; TDA7073AT: RL=16Ω.

Notes

1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being

equal to the DC output offset v oltage divided by RL.

2. The output voltage swing is typically limited to 2 ×(VP−2.1 V) (se e Fig.4).

3. The noise output voltage (RMS value), unweighted (20 Hz to 20 kHz) is measured with RS=500Ω.

4. The ripple rejection is measured with RS=0Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)

is applied to the positive su pply rail.

5. The DC common mode voltage range is limited to (VP−2.2 V with a maximum of 10 V).

6. The common mode rejection ratio is measured at V ref = 1.4 V, VI(CM) = 200 mV and f = 1 kHz.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

VPpositive supply vo ltage rang e 3.0 5.0 18 V

IORM repetitive peak output current −−0.6 A

IPtotal quiescent current VP=5V; R

L=∞;

note 1 −816mA

ΔVOUT output voltage swing note 2 5.2 5.8 −V

THD tot al ha rmo n i c distortion

TDA7073A VOUT =1V(RMS) −0.3 −%

TDA7073AT VOUT =1V(RMS) −0.1 −%

Gvvoltage gain 32.5 33.5 34.5 dB

Vno(rms) noise output voltage (RMS value) note 3 −75 150 μV

B bandwidth −−1.5 MHz

SVRR supply voltage ripple rejection note 4 38 55 −dB

⎪ΔV16-13,12-9⎪DC output off set voltage RS=500Ω−−100 mV

VI(CM) DC common mode voltage range note 5 0 −2.8 V

CMRR DC common mode rejection ratio note 6 −100 −dB

ZIinput impedance −100 −kΩ

Ibias input bias current −100 300 nA

αchannel separation 40 50 −dB

⎪ΔGV⎪channel unbalance −−1dB

SR slew rate −12 −V/μs

1999 Aug 30 7

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

APPLICATION INFORMATION

(1) This capacitor can be omitted if the 22 0 μF electrolytic capacitor is connected close to pin 5.

(2) RL can be: focus, tracking, sled function or spindle motor.

handbook, full pagewidth

500 Ω

driver signal 1

500 Ω

Vref

driver signal 2

SERVO SYSTEM

ground

MCD383

100 nF 220 μF

V = 5 V

(1)

(2)

I + i

I – i

TDA7073A

TDA7073AT

I + i

I – i

10 14

n.c.

3, 4, 8, 11, 15

ΙΙ

Fig.3 Test and application diagram.

1999 Aug 30 8

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

Fig.4 Typical output voltage swing over RL.

handbook, full pagewidth + (V – 2.1) V

– (V – 2.1) V

0 V

MCD380

1999 Aug 30 9

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

PACKAGE OUTLINES

UNIT A

max. 1 2 b1cEe M

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT38-1 99-12-27

03-02-13

min. A

max. bmax.

1.40

1.14

0.055

0.045

0.53

0.38 0.32

0.23 21.8

21.4

0.86

0.84

6.48

6.20

0.26

0.24

3.9

3.4

0.15

0.13

0.2542.54 7.62

0.3

8.25

7.80

0.32

0.31

9.5

8.3

0.37

0.33

2.2

0.087

4.7 0.51 3.7

0.15 0.021

0.015 0.013

0.009 0.010.10.020.19

050G09 MO-001 SC-503-16

(e )

seating plane

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

(1) (1)

D(1)

IP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38

-1

1999 Aug 30 10

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZ

ywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

2.65 0.3

0.1 2.45

2.25 0.49

0.36 0.32

0.23 10.5

10.1 7.6

7.4 1.27 10.65

10.00 1.1

1.0 0.9

0.4 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT162-1

detail X

0.25

075E03 MS-013

pin 1 index

0.1 0.012

0.004 0.096

0.089 0.019

0.014 0.013

0.009 0.41

0.40 0.30

0.29 0.05

1.4

0.055

0.419

0.394 0.043

0.039 0.035

0.016

0.01

0.25

0.01 0.004

0.043

0.016

0.01

vMA

(A )

0 5 10 mm

scale

O16: plastic small outline package; 16 leads; body width 7.5 mm SOT162

-1

99-12-27

03-02-19

1999 Aug 30 11

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

SOLDERING

Introduction

This text gives a very brief insight to a complex technology.

A more in-depth acco un t of sold er ing ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packag es ”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mount components are mixed on

one printed-circuit board. However, wave soldering is not

always suitable for surface mount ICs, or for printed-circuit

boards with high population densities. In these situations

reflow soldering is often used.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperatur e of the s old er is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic bod y mus t not ex ceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature with in the permissible limit.

MANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the solde rin g iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-s yringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyo r type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 an d 2 00 seconds depen ding on heating

method.

Typical reflow peak temperatures range from

215to250°C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

WAVE SOLDERING

Conventional single wave solderin g is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging an d

non-wetting can pres ent major problems.

To overcome these problems the double-w av e s oldering

method was sp ecifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wa ve soldering me thod comprising a

turbulent wave with high up ward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitc h (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axi s is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board .

The footprint must incorporate solder thieves at the

downstream end.

•For packages with leads on four sides, the footprint must

be plac ed at a 45° angle to the transp ort direction of the

printed-circuit board. The footprint must incor porate

solder thieves downstream and at th e side corners.

During placement and before soldering, the package must

be fixed with a droplet of adh esive. The adhesive c an be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

MANUAL SOLDERING

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one ope ration within 2 to 5 seconds betw een

270 and 320 °C.

1999 Aug 30 12

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

Suitability of IC packages for wave, reflow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with res pect to time) and body size of the package, there is a risk that internal or extern al package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integ rate d Circuit Packages; Section: Pac kin g Methods”.

2. For SDIP packages, the long itudinal axis must be para llel to the transport dir ection of the printed-ci rcuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top ve rsion).

4. If wave soldering is considered, then the package must be p lace d a t a 4 5° angle to the s old er w av e dir ec tion.

The package footprin t must incorporate so lder thieves down stream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or sma ller than 0.5 mm.

MOUNTING PACKAGE SOLDERING METHOD

WAVE REFLOW(1) DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) −suitable

Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −

HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,

SMS not suitable(3) suitable −

PLCC(4), SO, SOJ suitable suitable −

LQFP, QFP, TQFP not recommended(4)(5) suitable −

SSOP, TSSOP, VSO not recommended(6) suitable −

1999 Aug 30 13

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

DATA SHEET STATUS

Notes

1. Please consult the most rec en tly issued document before initiating or co mpleting a design.

2. The product s tatus of device(s) described in this document may ha ve changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This doc ument contains data from the objective specificatio n for product

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production This document contains the prod uct specification.

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1999 Aug 30 14

NXP Semiconductors Product specification

Dual BTL power driver TDA7073A; TDA7073AT

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratings only and

(proper) operation of the device at these or any other

conditions abo ve those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the quality and

reliability of the device.

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Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values an d

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This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the technical content, except for packag e outline

drawings which were updated to the latest version.

Printed in The Netherlands 545002/03/pp15 Date of release: 1999 Aug 30 Document orde r number: 9397 750 06375