ASMT-Mxx4 Moonstone(R) 1W Power LED Light Source Data Sheet Description Features The Moonstone(R) 1W Power LED Light Source is a high performance energy efficient device which can handle high thermal and high driving current. The exposed pad design has excellent heat transfer from the package to the motherboard. * Available in Cool White color The low profile package design is suitable for a wide variety of applications especially where height is a constraint. * High current operation The package is compatible with reflow soldering. This will give more freedom and flexibility to the light source designer. * Wide viewing angle The 1W Power LED light source can be mounted onto metal core PCB enabling optimum heat dissipation and ease of installation. * Energy efficient * Exposed pad for excellent heat transfer * Suitable for reflow soldering process * Long operation life * Silicone encapsulation * Non-ESD sensitive (threshold > 16KV) * MSL 2a products Specifications Applications * InGaN Technology * Sign backlight, billboard illumination or backlight * 3.5 V (max) at 350 mA * Exit sign or emergency sign lightings * Commercial lightings * Accent and marker lightings * Pathway lighting * Task lighting * Reading lights * Decorative lighting * Garden lighting * Architectural lighting * Portable (flash light, bicycle head light * 110 viewing angle Package Dimension for Moonstone(R) 10.00 1 Anode 2 Cathode 3 Heat Sink 3.30 8.50 1.27 Metal Slug 3 O 5.26 LED 10.60 + ZENER - 8.50 O 8.00 2.00 5.25 1.30 2 1 5.08 0.81 Figure 1. Moonstone(R) package outline drawing. Notes: 1. All dimensions are in millimeters. 2. Tolerance is 0.1 mm unless otherwise specified. 3. Terminal finish: Ag plating. Package Dimension for Moonstone(R) on MCPCB 16.00 1 2.50 Anode 60 2 Cathode 3 Heat Sink 5.00 3.00 20.00 14.00 19.00 R 1.60 4.00 3.00 19.00 1.40 2.30 1.60 1.30 4.60 24.00 Figure 2. MCPCB I package outline drawing. Notes: 1. All dimensions in millimeters. 2. Tolerance is 0.1 mm unless otherwise specified. 2 4.90 3.30 19.90 Figure 3. MCPCB II package outline drawing. Part Numbering System ASMT-M x1 x2 4 - N x 3 x4 x5 x6 Packaging Option Color Bin Selection Max Flux Bin Selection Min Flux Bin Selection Moonstone(R)Type 0 - Non-diffused B - Diffused A - Non-diffused on MCPCB I C - Diffused on MCPCB I K - Non-diffused on MCPCB II L - Diffused on MCPCB II Color W - Cool White Note: 1. Please refer to Page 9 for selection details. Device Selection Guide (Tj = 25C) Luminous Flux, V [1,2] (lm) Part Number [3] Color Min. Typ. Max. Test Current (mA) ASMT-MWx24-NKM00 Cool White 56.0 105.0 124.0 350 ASMT-MWx24-NKM00 Cool White Diffused 56.0 95.0 124.0 350 Notes: 1. V is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flux tolerance is 10 %. 3. Flux performance for respective part number is similar when device on MCPCB I or MCPCB II. 3 Dice Technology Electrically Isolated Metal Slug InGaN Yes Yes Absolute Maximum Ratings (TA = 25C) Parameter ASMT-Mxx4 Units DC Forward Current [1] 350 mA Peak Pulsing Current 1000 mA Power Dissipation 1225 mW LED Junction Temperature 125 C LED Junction Temperature for short term application 145 C Operating Ambient Temperature Range -40 to +110 C Storage Temperature Range -40 to +120 C Soldering Temperature Refer to Figure 14 Reverse Voltage [2] Not recommended Notes: 1. Derate linearly based on Figure 11. 2. Not recommended for reverse bias operation. Optical Characteristics at 350 mA (TJ = 25C) Correlated Color Temperature, CCT (Kelvin) Viewing Angle, 21/2 [2] () Luminous Efficiency (lm/W) Part Number Color Min. Max. Typ Typ ASMT-MWx24-NKM00 Cool White 4000 10000 110 94 ASMT-MWx24-NKM00 Cool White Diffused 4000 10000 110 85 Notes: 1. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristic at 350 mA (TJ = 25C) Forward Voltage VF (Volts) at IF = 350mA Thermal Resistance R j-ms ( C/W) [1] Dice type Min. Typ. Max. Typ. InGaN 2.8 3.2 3.5 10 Note: 1. Rj-ms is the Thermal Resistance from LED junction to metal slug. 4 1.2 1.0 RELATIVE LUMINOUS FLUX (NORMALIZED AT 350mA) RELATIVE INTENSITY 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 480 580 WAVELENGTH - nm 680 NORMALIZED INTENSITY FORWARD CURRENT - mA 300 250 200 150 100 50 0 0.5 1 1.5 2 2.5 FORWARD VOLTAGE - V 3 3.5 4 Figure 6. Forward Current vs. Forward Voltage. PULSE CURRENT, IP - A 1.2 1.0 t D= p T 0 50 -60 1.4 tp T D= 0.05 0.10 0.25 0.50 1.00 IF 0.8 1.2 0.6 0.4 0.0 0.00001 0.0001 0.001 0.01 0.1 1 PULSE DURATION, tp - sec 100 150 200 250 DC FORWARD CURRENT - mA 300 350 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 7. Radiation Pattern. 0.2 1.0 D= tp T tp T IF 0.8 0.6 D= 0.05 0.10 0.25 0.50 1.00 0.4 0.2 10 100 Figure 8. Maximum pulse current vs. ambient temperature. Derated based on TA = 25C, RJ-A = 50C/W. 5 0.2 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 PULSE CURRENT, IP - A 1.4 0.4 Figure 5. Relative Luminous Flux vs. Mono Pulse Current. 350 0 0.6 0 780 Figure 4. Relative Intensity vs. Wavelength. 0.8 0.0 0.00001 0.0001 0.001 0.01 0.1 1 PULSE DURATION, tp - sec 10 100 Figure 9. Maximum pulse current vs. ambient temperature. Derated based on TA = 85C, RJ-A = 50C/W. 0.10 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25C) RELATIVE LIGHT OUTPUT (NORMALIZED AT 25C) 120.0 110.0 100.0 90.0 80.0 70.0 60.0 50.0 40.0 30.0 20.0 10.0 0.0 25 50 75 100 JUNCTION TEMPERATURE, TJ - C -0.05 -0.10 -0.15 -0.20 -0.25 400 400 350 350 300 250 200 RJ-A = 30C/W RJ-A = 40C/W RJ-A = 50C/W 150 100 50 0 0 20 40 60 80 100 AMBIENT TEMPERATURE, TA - C 25 50 75 100 JUNCTION TEMPERATURE, TJ - C 125 Figure 11. Forward Voltage Shift vs. Junction Temperature. MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA 0.00 -0.30 125 Figure 10. Relative Light Output vs. Junction Temperature. 0.05 120 140 Figure 12. Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 125C, RJ-A = 30C/W, 40C/W and 50C/W. 300 250 200 RJ-MS = 10C/W 150 100 50 0 0 20 40 60 80 100 120 METAL SLUG TEMPERATURE, TMS - C 140 Figure 13. Maximum Forward Current vs. Metal Slug Temperature. Derated based on TJMAX = 125C, RJ-MS = 10C/W. 10.700.10 TEMPERATURE 10 - 30 SEC. 217C 200C 255 - 260C 3C/SEC. MAX. 6C/SEC. MAX. 150C 8.400.10 17.000.20 1.000.10 3C/SEC. MAX. 3.10.10 100 SEC. MAX. 60 - 120 SEC. TIME Figure 14. Recommended Reflow Soldering. 5.080.10 (Acc. to J-STD-020C) Figure 15. Recommended soldering land pattern. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 6 Option Selection Details Packaging Option [x6] ASMT-Mx1 x2 4 - N x3 x4 x5 x6 Selection Option x3 - Minimum Flux Bin x4 - Maximum Flux Bin x5 - Color Bin Selection x6 - Packaging Option 0 Tube (for Moonstone(R) only) Tray (for Moonstone(R) on MCPCB only) 1 Tape and Reel Example Flux Bin Limit [x3, x4] Luminous Flux (lm) at IF = 350mA Bin Min. Max. K 56.0 73.0 L 73.0 95.0 M 95.0 124.0 Tolerance for each bin limits is 10%. ASMT-MW04-NKLZ1 ASMT-MW04-Nxxxx X3 = K X4 = L X5 = Z X6 = 1 - - - - - Cool White, Non-diffused Minimum Flux Bin K Maximum Flux Bin L Color Bin A and B only Tape and Reel Option Color Bin Selections [x5] Color Bin Limit Individual reel will contain parts from one full bin only. Cool White Color Limits (Chromaticity Coordinates) Bin A X Y 0.367 0.400 0.362 0.372 0.329 0.345 0.329 0.369 Bin B X Y 0.362 0.372 0.356 0.330 0.329 0.302 0.329 0.345 Bin C X Y 0.329 0.369 0.329 0.345 0.305 0.322 0.301 0.342 Bin D X Y 0.329 0.345 0.329 0.302 0.311 0.285 0.305 0.322 Bin E X Y 0.303 0.333 0.307 0.311 0.283 0.284 0.274 0.301 Bin F X Y 0.307 0.311 0.311 0.285 0.290 0.265 0.283 0.284 Bin G X Y 0.388 0.417 0.379 0.383 0.362 0.372 0.367 0.400 Bin H X Y 0.379 0.383 0.369 0.343 0.356 0.330 0.362 0.372 O Full Distribution A A only B B only C C only D D only E E only F F only G G only H H only L A and G only M B and H only N A and C only P B and D only Q E and C only R F and D only S G and H only U E and F only W C and D only Z A and B only 1 A, B, C and D only 2 G, H, A and B only 4 C, D, E and F only Tolerance: 0.01 Y - COORDINATE Cool White 0.44 0.42 0.40 G 0.38 A 4.0k 0.36 4.5k H C B 0.34 5.6k Black Body Curve 0.32 7k D E 0.30 10k F 0.28 0.26 0.24 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 X - COORDINATE Figure 16. Color bins (Cool White) 7 Packing Tube - Option 0 5.39 10.3 37.00 6.5 20.85 11.00 10.95 6.3 8.3 535.00 SIDE VIEW TOP VIEW Figure 17. Tube dimensions. Tape and Reel - Option 1 B Bo W F E A 2.5 B A Ko P SECTION A Dim Value AO 8.80 0.10 BO 16.45 0.10 KO 3.60 0.10 E 1.75 0.10 F 11.50 0.10 W 24.0 0.10 P 16.0 0.10 Quantity/ Reel 250 units All dimensions in millimeters. Ao SECTION B Figure 18. Carrier tape dimensions. END MINIMUM OF 160 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS MINIMUM OF 390 mm OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 19. Carrier tape leader and trailer dimensions. *Note: Tape & Reel Packaging only applicable as per this datasheet only. 8 +1.00 24.0 -0.00 2.30 2.30 0 0 60. 99.50 1.00 R10.0 2.50 0.50 .50 268.00 R10 13.50 330.00 1.00 120.0 Figure 20. Reel dimensions. Packing Tray - Option 0 (for Moonstone(R) on MCPCB only) Figure 21. Tray dimensions. 9 0 0.5 0.50 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unused LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembly boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if - HIC "10%" indicator is not blue and "5%" indicator is pink. - The LEDs are exposed to condition of >30C / 60% RH at any time. - The LED floor life exceeded 672hrs. Recommended baking condition: 605C for 20hrs. DISCLAIMER: Avago's products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2012 Avago Technologies. All rights reserved. AV02-1673EN - December 10, 2012