Product Family Data Sheet Rev. 1.1 2016.04.15 High Power LED Series Chip on Board LC006B Gen.2 High efficacy COB LED package, well-suited for use in spotlight applications Features & Benefits * Chip on Board (COB) solution makes it easy to design in * Simple assembly reduces manufacturing cost * Low thermal resistance * InGaN/GaN MQW LED with long time reliability * Completed 6,000 hours of LM-80 Testing * ENEC certified: Integral LED Module Applications * Spotlight / Downlight * LED Retrofit Bulbs * Outdoor Illumination 1# 2 Table of Contents 1. Characteristics ----------------------- 3 2. Product Code Information ----------------------- 5 3. Typical Characteristics Graphs ----------------------- 10 4. Outline Drawing & Dimension ----------------------- 13 5. Reliability Test Items & Conditions ----------------------- 14 6. Label Structure ----------------------- 15 7. Packing Structure ----------------------- 17 8. Precautions in Handling & Use ----------------------- 20 3 1. Characteristics a) Absolute Maximum Rating Item Symbol Rating Unit Condition Ambient / Operating Temperature Ta -40 ~ +105 C - Storage Temperature Tstg -40 ~ +120 C - LED Junction Temperature Tj 140 C - Case Temperature Tc 105 C *Note Forward Current IF 320 mA - Power Dissipation PD 12.2 W - ESD (HBM) - 2 kV - ESD (MM) - 0.5 kV - b) Electro-optical Characteristics (IF = 180 mA, Tc = 25 C) Item Unit Rank Min. Typ. Max. Forward Voltage (VF) V YH 32.5 35.5 38.5 3 70 - - 5 80 - - 7 90 - - 8 95 Color Rendering Index (Ra) - Thermal Resistance (junction to chip point) C/W - 2.4 - Beam Angle - 115 - Nominal Power W Eye Protection 6.4 Risk 1 - - Notes: 1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = Ta = 25 C) 2) Samsung maintains measurement tolerance of: 3) Max Tc=105 designed within the range. forward voltage = 5 %, CRI = 1 (atismfor rent) ax ENEC cur condition. Refer to the derating curve, `3. Typical Characteristics Graph' 4 c) Luminous Flux Characteristics CRI (Ra) Min. Nominal CCT (K) 3000 70 4000 5000 (IF = 180 mA, Tc = 25 C) Flux Rank GE GE GE 2700 EE 3000 EE 3500 EE 4000 EE 80 5000 5700 2700 3000 EE EE CG CG 90 3500 4000 2700 95 CG CG CC 3000 CC 3500 CC Flux Bin 1) Sorting @ Tc = 25 C (lm) 2) Calculated Flux @ Tc = 85 C (lm) Min. Max. Min. G1 796 905 716 Max. 814 G2 905 1013 814 912 G1 836 950 752 855 G2 950 1064 855 957 G1 844 959 759 863 G2 959 1074 863 967 E3 833 888 758 808 E4 888 942 808 858 E3 887 945 807 860 E4 945 1003 860 912 E3 913 973 831 885 E4 973 1033 885 940 E2 878 940 799 855 E3 940 1001 855 911 E2 887 949 807 863 E3 949 1011 863 920 E2 887 949 807 863 E3 949 1011 863 920 C2 698 754 636 686 C3 754 810 686 737 C3 770 827 700 752 C4 827 907 752 825 C3 793 851 721 775 C4 851 931 775 848 C3 816 876 742 797 C4 876 956 797 870 C1 566 629 515 572 C2 629 691 572 629 C1 583 648 531 590 C2 648 713 590 649 C1 601 667 547 607 C2 667 734 607 668 Notes: 1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = Ta = 25 C) 2) Calculated flux values are for reference only 3) Samsung maintains measurement tolerance of: luminous flux = 7 %, CRI = 1 5 2. Product Code Information 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 S P H C W 1 H D N 8 2 5 Y H R T E D Digit 1 2 3 4 5 PKG Information Code Samsung Package High Power SPH Specification WW Warm White (T/U/V/W Ranks) CW Cool White Color 6 Product Version 1 Form Factor HD 9 Lens Type N No lens 10 Internal Code 8 LC006 11 Chip Type 2 7 8 12 13 COB 3 Min. 70 5 Min. 80 7 Min. 90 8 Min 95 CRI & Sorting Temperature 14 15 Forward Voltage (V) 25 C YH 32.5~38.5 W 2700 K WA,WB (MacAdam Ellipse) V 3000 K VA, VB (MacAdam Ellipse) U 3500 K UA, UB (MacAdam Ellipse) T 4000 K TA, TB R 5000 K RA Q 5700 K 2 MacAdam 2-step 3 MacAdam 3-step T ANSI bin CCT (K) 16 MacAdam / ANSI (Q/R Ranks) Bin Code: GE EE 17 18 Luminous Flux CG CC G1, G2 Bin Code: VW, VX, VY, VZ (ANSI bin) (MacAdam Ellipse) TW, TX, TY, TZ (ANSI bin) (MacAdam Ellipse) RW, RX, RY, RZ (ANSI bin) QW, QX, QY, QZ (ANSI bin) (70 CRI) E2, E3, E4 (80 CRI) C2, C3, C4 (90 CRI) C1, C2 (95 CRI) 6 a) Binning Structure CRI (Ra) Min. 70 (IF = 180 mA, Tc = 25 C) Nominal CCT (K) Product Code VF Rank Color Rank Chrom. Bin Flux Rank 3000 SPHWW1HDN823YHVTGE YH VT VW, VX VY, VZ GE TW, TX TY, TZ GE 4000 5000 SPHWW1HDN823YHTTGE SPHCW1HDN823YHRTGE SPHWW1HDN825YHW2EE YH YH YH TT RT W2 RW, RX RY, RZ WB Flux Bin Flux Range (v, lm) G1 796 ~ 905 G2 905 ~ 1013 G1 836 ~ 950 G2 950 ~ 1064 G1 844 ~ 959 G2 959 ~ 1074 E3 833 ~ 888 E4 888 ~ 942 E3 833 ~ 888 E4 888 ~ 942 GE EE 2700 SPHWW1HDN825YHW3EE SPHWW1HDN825YHV2EE YH YH W3 V2 WA, WB VB EE E3 887 ~ 945 E4 945 ~ 1003 EE 3000 SPHWW1HDN825YHV3EE SPHWW1HDN825YHU2EE YH YH V3 U2 VA, VB UB E3 887 ~ 945 E4 945 ~ 1003 E3 913 ~ 973 E4 973 ~ 1033 E3 913 ~ 973 E4 973 ~ 1033 E2 878 ~ 940 E3 940 ~ 1001 EE EE 3500 80 SPHWW1HDN825YHU3EE SPHWW1HDN825YHT2EE YH YH U3 T2 UA, UB TB EE EE 4000 SPHWW1HDN825YHT3EE SPHCW1HDN825YHR3EE YH YH T3 R3 TA, TB RA E2 878 ~ 940 E3 940 ~ 1001 EE E2 887 ~ 949 E3 949 ~ 1011 EE 5000 SPHCW1HDN825YHRTEE 5700 SPHCW1HDN825YHQTEE YH YH RT QT RW, RX, RY, RZ EE QW, QX, QY, QZ EE E2 887 ~ 949 E3 949 ~ 1011 E2 887 ~ 949 E3 949 ~ 1011 7 a) Binning Structure CRI (Ra) Min. Nominal CCT (K) (IF = 180 mA, Tc = 25 C) Product Code VF Rank Color Rank Chrom. Bin Flux Rank SPHWW1HDN827YHW2CG YH W2 WB CG Flux Bin Flux Range (v, lm) C2 698 ~ 754 C3 754 ~ 810 C2 698 ~ 754 C3 754 ~ 810 C3 770 ~ 827 C4 827 ~ 907 C3 770 ~ 827 C4 827 ~ 907 C3 793 ~ 851 C4 851 ~ 931 C3 793 ~ 851 C4 851 ~ 931 C3 816 ~ 876 C4 876 ~ 956 C3 816 ~ 876 C4 876 ~ 956 C1 566 ~ 629 C2 629 ~ 691 C1 566 ~ 629 C2 629 ~ 691 C1 583 ~ 648 C2 648 ~ 713 C1 583 ~ 648 C2 648 ~ 713 C1 601 ~ 667 C2 667 ~ 734 C1 601 ~ 667 C2 667 ~ 734 2700 SPHWW1HDN827YHW3CG SPHWW1HDN827YHV2CG YH YH W3 V2 WA, WB VB CG CG 3000 SPHWW1HDN827YHV3CG YH V3 VA, VB CG 90 SPHWW1HDN827YHU2CG YH U2 UB CG 3500 SPHWW1HDN827YHU3CG SPHWW1HDN827YHT2CG YH YH U3 T2 UA, UB TB CG CG 4000 SPHWW1HDN827YHT3CG SPHWW1HDN828YHW2CC YH YH T3 W2 TA, TB WB CG CC 2700 SPHWW1HDN828YHW3CC SPHWW1HDN828YHV2CC 95 YH YH W3 V2 WA,WB VB CC CC 3000 SPHWW1HDN828YHV3CC SPHWW1HDN828YHU2CC YH YH V3 U2 VA,VB UB CC CC 3500 SPHWW1HDN828YHU3CC YH U3 UA,UB CC 8 b) Chromaticity Region & Coordinates Region CIE x CIE y Region (IF = 180 mA, Ta = 25 C) CIE x CIE y Region CIE x V rank (3000 K) 0.4223 0.399 0.4345 0.4033 0.4431 0.4213 VW CIE y Region CIE x CIE y 0.3871 0.3959 0.4006 0.4044 0.3952 0.388 T rank (4000 K) 0.4345 0.4033 0.4468 0.4077 0.4562 0.4260 VY 0.3736 0.3874 0.3871 0.3959 0.3828 0.3803 TW TY 0.4299 0.4165 0.4431 0.4213 0.3703 0.3726 0.3828 0.3803 0.4223 0.399 0.4260 0.3854 0.3703 0.3726 0.3828 0.3803 0.4147 0.3814 0.4373 0.3893 0.3828 0.3803 0.3952 0.388 VX VZ TX TZ 0.4260 0.3854 0.4468 0.4077 0.3784 0.3647 0.3898 0.3716 0.4345 0.4033 0.4345 0.4033 0.367 0.3578 0.3784 0.3647 0.3290 0.3538 0.3376 0.3616 0.3371 0.3490 R rank (5000 K) 0.3376 0.3616 0.3463 0.3687 0.3451 0.3554 0.3371 0.3371 0.3451 0.3554 0.3440 0.3428 0.3366 0.3369 Q rank (5700 K) 0.3463 0.3687 0.3551 0.3760 0.3533 0.3620 0.3490 0.3451 0.3554 0.3215 0.3350 0.3290 0.3417 0.3490 0.3451 0.3554 0.3215 0.3350 0.3290 0.3417 0.3533 0.3620 0.3290 0.3417 0.3371 0.3490 0.3515 0.3487 0.3290 0.3300 0.3366 0.3369 0.3440 0.3428 0.3222 0.3243 0.3290 0.3300 RW RY RX 0.3207 0.3462 0.3290 0.3538 0.3290 0.3417 QW RZ QY QX QZ 9 b) Chromaticity Region & Coordinates (IF = 180 mA, Ta = 25 C) CIE x,y MacAdam Ellipse (WA, WB) MacAdam Ellipse (VA, VB) a b Step CIE x CIE y a b 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041 Step CIE x CIE y 2-step 0.4578 3-step 0.4578 MacAdam Ellipse (UA, UB) MacAdam Ellipse (TA, TB) Step CIE x CIE y a b Step CIE x CIE y a b 2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027 3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040 MacAdam Ellipse (RA) Step CIE x CIE y a b 3-step 0.3447 0.3553 59.62 0.0082 0.0035 Note: Samsung maintains measurement tolerance of: Cx, Cy = 0.005 10 3. Typical Characteristics Graphs a) Spectrum Distribution (IF = 180 mA, Tc = 25 C) CCT: 2700 K CCT: 3000 K CCT: 3500 K CCT: 4000 K CCT: 5000 K CCT: 5700 K 11 b) Forward Current Characteristics c) Temperature Characteristics d) Color Shift Characteristics (Tc = 25 C) (IF = 180 mA) Tc = 25 C IF = 180 mA 12 e) Derating Curve f) Beam Angle Characteristics (IF = 180 mA, Tc = 25 C) 13 4. Outline Drawing & Dimension 1. Unit: mm 2. Tolerance: 0.15 mm Tc point Note 1. Unit: mm 2. Tolerance: 0.2 mm Note: Item Dimension Tolerance Unit Length 13.50 0.15 mm Width 13.50 0.15 mm Height 1.50 0.20 mm Light Emitting Surface (LES) Diameter 8 0.15 mm Screw Hole Size 2.2 0.15 mm Denoted product information above is only an example ( 06W8027 : 6.4W, CRI80+, 2700K ) 14 5. Reliability Test Items & Conditions a) Test Items Test Item Test Condition Test Hour / Cycle Room Temperature Life Test 25 C, IF = max 1000 h High Temperature Humidity Life Test 60 C, 90 % RH, DC Derating, IF = max 1000 h High Temperature Life Test 105 C, DC Derating, IF = max 1000 h Low Temperature Life Test -40 C, DC 320 mA 1000 h High Temperature Storage 120 C 1000 h Low Temperature Storage -40 C 1000 h Thermal Shock -45 C / 15 min 125 C / 15 min temperature change in 5 min 200 cycles Temperature Cycle On/Off Test -40 C / 85 C each 20 min, 100 min transfer power on/off each 5 min, DC 180 mA 100 cycles Temperature Humidity Storage Test -10 C 25 C, 95 % RH 85 C, 95 % RH (24 h / cycle) 100 cycles R1: 10 M R2: 1.5 k C: 100 pF V: 2 kV ESD (HBM) 5 times R1: 10 M R2: 0 k ESD (MM) 5 times C: 200 pF V: 0.5 kV Vibration Test 20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g) 80 ~ 2 kHz (max. 20 g) min. frequency max. frequency 4 min transfer 4 times Mechanical Shock Test 1500 g, 0.5 ms each of the 6 surfaces (3 axis x 2 sides) 5 times Salt Spray Test 35 C, 5 % salt water 8 h spray, 16 h dwell 2 cycles b) Criteria for Judging the Damage Item Symbol Test Condition (Tc = 25 C) Forward Voltage VF Luminous Flux v Limit Min. Max. IF = 180 mA L.S.L. * 0.9 U.S.L. * 1.1 IF = 180 mA L.S.L * 0.7 U.S.L * 1.3 15 6. Label Structure a) Label Structure Aluminum Bag & Inner Box Note: Outer Box Denoted rank code and product code above is only an example (see description on page 5) Rank Code: : Forward Voltage rank (refer to page 6-7) : Chromaticity bin : Luminous Flux bin (refer to page 8-9) (refer to page 6-7) 16 b) Lot Number The lot number is composed of the following characters: / 1 / xxx PCS : Production site : L (LED) : Product state : Year : Month : Day (1~9, A, B~V) : Product serial number : Tray number (S: Giheung, Korea, G: Tianjin, China) (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample) (Y: 2014, Z: 2015, A: 2016, ...) (1~9, A, B, C) (001 ~ 009) (001 ~ 999) 17 7. Packing Structure Packing material Max. quantity in pcs of COB Tray Dimension (mm) Length Width Height Tolerance 84 322.6 135.9 10.8 1.0 Aluminum Bag 672 (8 trays) 450 230 - 10 PE Foam Pad - 280 130 10 2 Inner Box 672 (1 aluminum bag) 338 143 55 2 Outer Box 2,688 (4 inner boxes) 351 303 125 5 Pallet 150,528 (56 outer boxes) 1000 1000 130 10 a) Packing Structure Cover Tray(1pcs) Body Tray(8pcs) HUMIDITY INDICATOR SILICA GEL(5g) (Do not use Cobalt Dichloride.) (Do not use Cobalt Dichloride.) MBB bag Heat Sealing Taping (Taping Strength : feebly) Material is PET(Antistatic) 10(5) ~ 10(9) ohm/sq 8body + 1cover tray / MBB bag (MBB-BAG : Heat Sealing) 4 inner-box / Out-box BODY TRAY 8ea 6ea 4ea 2ea PEFOAM 0ea 1ea 2ea 3ea 18 b) Tray COVER BODY 19 c) Aluminum Vinyl Packing Bag d) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Packing Bag 20 8. Precautions in Handling & Use 1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the device. 2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at temperature 0~40 C, 0~90 % RH). 3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be: a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 C / 60 % RH, or b. Stored at <10 % RH 4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. 5) Devices require baking before mounting, if humidity card reading is >60 % at 23 5 C. 6) Devices must be baked for 1 hour at 60 5 C, if baking is required. 7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or antielectrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 8) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical properties of materials used in luminaires and they must be carefully selected. 9) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead, please pick at the handling area as indicated below. Legal and additional information. About Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd. inspires the world and shapes the future with transformative ideas and technologies, redefining the worlds of TVs, smartphones, wearable devices, tablets, cameras, digital appliances, printers, medical equipment, network systems and semiconductors. We are also leading in the Internet of Things space through, among others, our Digital Health and Smart Home initiatives. We employ 307,000 people across 84 countries. To discover more, please visit our official website at www.samsung.com and our official blog at global.samsungtomorrow.com. Copyright (c) 2015 Samsung Electronics Co., Ltd. All rights reserved. Samsung is a registered trademark of Samsung Electronics Co., Ltd. Specifications and designs are subject to change without notice. Non-metric weights and measurements are approximate. All data were deemed correct at time of creation. Samsung is not liable for errors or omissions. All brand, product, service names and logos are trademarks and/or registered trademarks of their respective owners and are hereby recognized and acknowledged. Samsung Electronics Co., Ltd. 95, Samsung 2-ro Giheung-gu Yongin-si, Gyeonggi-do, 446-711 KOREA www.samsungled.com