1#
Product Family Data Sheet Rev. 1.1 2016.04.15
High Power LED Series
Chip on Board
LC006B
Gen.2
High efficacy COB LED package,
well-suited for use in spotlight applications
Featur
es & Benefits
• Chip on Board (COB) solution makes it easy to design in
• Simple assembly reduces manufacturing cost
• Low thermal resistance
• InGaN/GaN MQW LED with long time reliability
• Completed 6,00 0 hours of LM-80 Testing
• ENEC certified: Integral LED Module
Applications
• Spotlight / Downlight
• LED Retrofit Bulbs
• Outdoor Illumination
2
Table of Contents
1. Characteristics ----------------------- 3
2. Product Code Information ----------------------- 5
3. Typical Characteristics Graphs ----------------------- 10
4. Outline Drawing & Dimension ----------------------- 13
5. Reliability Test Items & Conditions ----------------------- 14
6. Label Structure ----------------------- 15
7. Packing Structure ----------------------- 17
8. Precautions in Handling & Use ----------------------- 20
3
1. Characteristics
a) Absolute Maximum Rating
Item Symbol Rating Unit Condition
Ambient / Operating Temperature Ta -40 ~ +105 ºC -
Storage Temperature Tstg -40 ~ +120 ºC -
LED Junction Temperature Tj 140 ºC -
Case Temperature Tc 105 ºC *Note
Forward Current IF 320 mA -
Power Dissipation PD 12.2 W -
ESD (HBM) - ±2 kV -
ESD (MM) - ±0.5 kV -
b) Electro-optical Characteristics (IF = 180 mA, Tc = 25 ºC)
Item Unit Rank Min. Typ. Max.
Forward Voltage (VF) V YH 32.5 35.5 38.5
Color Rendering Index (Ra) -
3 70 - -
5 80 - -
7 90 - -
8 95
Thermal Resistance (junction to chip point) ºC/W - 2.4 -
Beam Angle º
- 115 -
Nominal Power W 6.4
Eye Protection
Risk 1 - -
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = T a = 25 °C)
2) Samsung maintains measurement tolerance of: forward voltage = ±5 %, CRI = ±1
3) Max Tc=105 ℃ (at max current) is for ENEC condition. Refer to the derating curve, ‘3. Typical Characteristics Graph’
designed within the range.
4
c) Luminous Flux Characteristics (IF = 180 mA, Tc = 25 ºC)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux
Bin
Sorting1) @ Tc = 25 °C (lm)
Calculated Flux2) @ Tc = 85 °C (lm)
Min. Max. Min. Max.
70
3000 GE G1 796 905 716 814
G2 905 1013 814 912
4000 GE G1 836 950 752 855
G2 950 1064 855 957
5000 GE G1 844 959 759 863
G2 959 1074 863 967
80
2700 EE E3 833 888 758 808
E4 888 942 808 858
3000 EE E3 887 945 807 860
E4 945 1003 860 912
3500 EE E3 913 973 831 885
E4 973 1033 885 940
4000 EE E2 878 940 799 855
E3 940 1001 855 911
5000 EE E2 887 949 807 863
E3 949 1011 863 920
5700 EE E2 887 949 807 863
E3 949 1011 863 920
90
2700 CG C2 698 754 636 686
C3 754 810 686 737
3000 CG C3 770 827 700 752
C4 827 907 752 825
3500 CG C3 793 851 721 775
C4 851 931 775 848
4000 CG C3 816 876 742 797
C4 876 956 797 870
95
2700 CC C1 566 629 515 572
C2 629 691 572 629
3000 CC C1 583 648 531 590
C2 648 713 590 649
3500 CC C1 601 667 547 607
C2 667 734 607 668
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = T a = 25 °C)
2) Calculated flux values are for reference only
3) Samsung maintains measurement toleran ce of: luminous flux = ±7 %, CRI = ±1
5
2. Product Code Information
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
S P H C W 1 H D N 8 2 5 Y H R T E D
Digit PKG Information Code Specification
1 2 3 Samsung Package High Power SPH
4 5 Color WW Warm White (T/U/V/W Ranks)
CW Cool White (Q/R Ranks)
6 Product Version 1
7 8 Form Factor HD COB
9 Lens Type N No lens
10 Internal Code 8 LC006
11 Chip Type 2
12 CRI & Sorting Temperature
3 Min. 70
25 °C
5 Min. 80
7 Min. 90
8 Min 95
13 14 Forward Voltage (V) YH 32.5~38.5
15 CCT (K)
W 2700 K
Bin
Code:
WA,WB
(MacAdam
Ellipse)
V 3000 K VA, VB
(MacAdam Ellipse)
VW, VX, VY, VZ (ANSI bin)
U 3500 K UA, UB
(MacAdam Ellipse)
T 4000 K TA, TB
(MacAdam Ellipse)
TW, TX , TY, TZ (ANSI bin)
R 5000 K RA
(MacAdam Ellipse)
RW, RX, RY, RZ
(ANSI bin)
Q 5700 K
QW, QX, QY, QZ (ANSI bin)
16 MacAdam / ANSI
2 MacAdam 2-step
3 MacAdam 3-step
T ANSI bin
17 18 Lum i no us Flu x
GE
Bin
Code:
G1, G2 (70 CRI)
EE E2, E3, E4 (80 CRI)
CG C2, C3, C4 (90 CRI)
CC C1, C2 (95 CRI)
6
a) Binning Structure (IF = 180 mA , Tc = 25 ºC)
CRI (Ra)
Min.
Nominal
CCT (K) Product Code VF
Rank
Color
Rank
Chrom.
Bin
Flux
Rank
Flux
Bin
Flux Range
(Φv, lm)
70
3000 SPHWW1HDN823YHVTGE YH VT VW, VX
VY, VZ GE
G1
G2
4000 SPHWW1HDN823YHTTGE YH TT TW, TX
TY, TZ GE
G1
G2
5000 SPHCW1HDN823YHRTGE YH RT RW, RX
RY, RZ GE
G1
G2
80
2700
SPHWW1HDN825YHW2EE YH W2 WB EE
E3
E4
SPHWW1HDN825YHW3EE YH W3 WA, WB EE
E3
E4
3000
SPHWW1HDN825YHV2EE YH V2 VB EE
E3
E4
SPHWW1HDN825YHV3EE YH V3 VA, VB EE
E3
E4
3500
SPHWW1HDN825YHU2EE YH U2 UB EE
E3
E4
SPHWW1HDN825YHU3EE YH U3 UA, UB EE
E3
E4
4000
SPHWW1HDN825YHT2EE YH T2 TB EE
E2
E3
SPHWW1HDN825YHT3EE YH T3 TA, TB EE
E2
E3
5000
SPHCW1HDN825YHR3EE YH R3 RA EE
E2
E3
SPHCW1HDN825YHRTEE YH RT RW, RX,
RY, RZ EE
E2
E3
5700 SPHCW1HDN825YHQTEE YH QT QW, QX,
QY, QZ EE
E2
E3
7
a) Binning Structure (IF = 180 mA, Tc = 25 ºC)
CRI (Ra)
Min.
Nominal
CCT (K) Product Code VF
Rank
Color
Rank
Chrom.
Bin
Flux
Rank
Flux
Bin
Flux Range
(Φv, lm)
90
2700
SPHWW1HDN827YHW2CG YH W2 WB CG
C2
C3
SPHWW1HDN827YHW3CG YH W3 WA, WB CG
C2
C3
3000
SPHWW1HDN827YHV2CG YH V2 VB CG
C3
C4
SPHWW1HDN827YHV3CG YH V3 VA, VB CG
C3
C4
3500
SPHWW1HDN827YHU2CG YH U2 UB CG
C3
C4
SPHWW1HDN827YHU3CG YH U3 UA, UB CG
C3
C4
4000
SPHWW1HDN827YHT2CG YH T2 TB CG
C3
C4
SPHWW1HDN827YHT3CG YH T3 TA, TB CG
C3
C4
95
2700
SPHWW1HDN828YHW2CC YH W2 WB CC
C1
C2
SPHWW1HDN828YHW3CC YH W3 WA,WB CC
C1
C2
3000
SPHWW1HDN828YHV2CC YH V2 VB CC
C1
C2
SPHWW1HDN828YHV3CC YH V3 VA,VB CC
C1
C2
3500
SPHWW1HDN828YHU2CC YH U2 UB CC
C1
C2
SPHWW1HDN828YHU3CC YH U3 UA,UB CC
C1
C2
8
b) Chromaticity Region & Coordinates (IF = 180 mA, Ta = 25 ºC)
Region CIE x CIE y Region CIE x CIE y
Region CIE x CIE y Region CIE x CIE y
V rank (3000 K)
T rank (4000 K)
VW
0.4223 0.399
VY
0.4345 0.4033
TW
0.3736 0.3874
TY
0.3871 0.3959
0.4345 0.4033 0.4468 0.4077
0.3871 0.3959 0.4006 0.4044
0.4431 0.4213 0.4562 0.4260
0.3828 0.3803 0.3952 0.388
0.4299 0.4165 0.4431 0.4213
0.3703 0.3726 0.3828 0.3803
VX
0.4223 0.399
VZ
0.4260 0.3854
TX
0.3703 0.3726
TZ
0.3828 0.3803
0.4147 0.3814 0.4373 0.3893
0.3828 0.3803 0.3952 0.388
0.4260 0.3854 0.4468 0.4077
0.3784 0.3647 0.3898 0.3716
0.4345 0.4033 0.4345 0.4033
0.367 0.3578 0.3784 0.3647
R rank (5000 K)
Q rank (5700 K)
RW
0.3376 0.3616
RY
0.3463 0.3687
QW
0.3207 0.3462
QY
0.3290 0.3538
0.3463 0.3687 0.3551 0.3760
0.3290 0.3538 0.3376 0.3616
0.3451 0.3554 0.3533 0.3620
0.3290 0.3417 0.3371 0.3490
0.3371 0.3490 0.3451 0.3554
0.3215 0.3350 0.3290 0.3417
RX
0.3371 0.3490
RZ
0.3451 0.3554
QX
0.3215 0.3350
QZ
0.3290 0.3417
0.3451 0.3554 0.3533 0.3620
0.3290 0.3417 0.3371 0.3490
0.3440 0.3428 0.3515 0.3487
0.3290 0.3300 0.3366 0.3369
0.3366 0.3369 0.3440 0.3428
0.3222 0.3243 0.3290 0.3300
9
b) Chromaticity Region & Coordinates (IF = 180 mA, Ta = 25 ºC)
MacAdam Ellipse (WA, WB) MacAdam Ellipse (VA, VB)
Step C IE x C IE y θ a b Step CIE x CIE y θ a b
2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027
3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041
MacAdam Ellipse (UA, UB) MacAdam Ellipse (TA, TB)
Step C IE x C IE y θ a b Step CIE x CIE y θ a b
2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027
3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040
MacAdam Ellipse (RA)
Step C IE x C IE y θ a b
3-step 0.3447 0.3553 59.62 0.0082 0.0035
Note:
Samsung maintai ns me asur e ment t ole ran ce of: Cx, Cy = ±0.005
θ
CIE x,y
10
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 180 mA, Tc = 25 ºC)
CCT: 2700 K CCT: 3000 K
CCT: 3500 K CCT: 4000 K
CCT: 5000 K CCT: 5700 K
11
b) Forward Cu rrent Characteristics (Tc = 25 ºC)
c) Temperature Characteristics (IF = 180 mA)
d) Color Shift Characteristics Tc = 25 ºC IF = 180 mA
12
e) Derating Curve
f) Beam Angle Characteristics (IF = 180 mA, Tc = 25 ºC)
13
4. Outline Drawing & Dimension
Item Dimension Tolerance Unit
Length 13.50 ±0.15 mm
Width 13.50 ±0.15 mm
Height 1.50 ±0.20 mm
Light Emitting Surface (LES) Diameter 8 ±0.15 mm
Screw Hole Size 2.2 ±0.15 mm
Note: Denoted produ ct information above is only an example
( 06W8027 : 6.4W, CRI80+, 2700K )
1. Unit: mm
2. Tolerance: ± 0.15 mm
Tc point
1. Unit: mm
2. Tolerance: ± 0.2 mm
Note
14
5. Reliability Test Items & Conditions
a) Test Items
Test Item Test Condition Test Hour / Cycle
Room Temperature
Life Test 25 ºC, IF = max 1000 h
High Temperature
Humidity Life Test 60 ºC, 90 % RH, DC Derating, IF = max 1000 h
High Temperature
Life Test
105 ºC, DC Derating, IF = max 1000 h
Low Temperature
Life Test -40 ºC, DC 320 mA 1000 h
High Temperature
Storage 120 ºC 1000 h
Low Temperature
Storage -40 ºC 1000 h
Thermal Shock -45 ºC / 15 min ↔ 125 ºC / 15 min
temperature change in 5 min 200 cycles
Temperature Cycle
On/Off Test -40 ºC / 85 ºC each 20 min, 100 min transfer
power on/ off each 5 min, DC 18 0 mA 100 cycles
Temperature Humidity
Storage Test -10 ºC ↔ 25 ºC, 95 % RH ↔ 85 ºC, 95 % RH
(24 h / cycle) 100 cycles
ESD (HBM)
R
1
: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
5 times
ESD (MM)
R
1
: 10 MΩ
R2: 0 kΩ
C: 200 pF
V: ±0.5 kV
5 times
Vibration Test 20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer 4 times
Mechanical Shock Test 1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides) 5 times
Salt Spray Test 35 ºC, 5 % salt water
8 h spray, 16 h dwell 2 cycles
b) Criteria for Judging the Damage
Item Symbol Test Condition
(Tc = 25 ºC)
Limit
Min. Max.
Forward Voltage VF IF = 180 mA L.S.L. * 0.9 U.S.L. * 1.1
Lumino us Flu x Φv IF = 180 mA L.S.L * 0.7 U.S.L * 1.3
15
6. Label Structure
a) Label Structure
Note: Denoted rank code and product code above is only an example (see description on page 5)
Rank Code:
ⓐⓑ: Forward Voltage rank (refer to page 6-7)
ⓒⓓ: Chromaticity bin (refer to page 8-9)
ⓔⓕ: Luminous Flux bin (refer to page 6-7)
Aluminum Bag & Inner Box Outer Box
16
b) Lot Number
The lot number is composed of the following characters:
●◎◇◆□■△△△ / 1▲▲▲ / xxx PCS
● : Production site (S: Giheung, Korea, G: Tianjin, C hina)
◎ : L (LED)
◇
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
◆ : Year (Y: 2014, Z: 2015, A: 2016, …)
□ : Month (1~9, A, B, C)
■ : Day (1~9, A, B~V)
△△△ : Product serial number (001 ~ 009)
▲▲▲
: Tray number (001 ~ 999)
17
7. Packing Structure
Packing material Max. quantity
in pcs of COB
Dimension (mm)
Length
Width
Height
Tolerance
Tray 84 322.6 135.9 10.8 1.0
Aluminum Bag 672 (8 trays) 450 230 - 10
PE Foam Pad - 280 130 10 2
Inner Box 672 (1 aluminum bag) 338 143 55 2
Outer Box 2,688 (4 inner boxes) 351 303 125 5
Pallet 150,528 (56 outer boxes) 1000 1000 130 10
a) Packing Structure
BODY
TRAY
PE-
FOAM
8ea
0ea
6ea
1ea
4ea
2ea
2ea
3ea
Cover Tray(1pcs)
HUMIDITY IN DICATOR
(Do not use Cobalt Dichloride.)
Body Tray(8pcs)
Taping (Taping Strength : feebly)
Material is PET(Antistatic) 10(5) ~ 10(9) ohm/sq
SILICA GEL(5g)
(Do not use Cobalt Dichloride.)
MBB bag
Heat Sealing
8body + 1cover tray / MBB bag
(MBB-BAG : Heat Sealing)
4 inner-box / Out-box
18
b) Tray
①
COVER
②
BODY
19
c) Aluminum Vinyl Packing Bag
d) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Packing Bag
20
8. Precautions in Handling & Use
1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8) VOCs (Vol atile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
9) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
Legal and additional information.
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Specifications and designs are subject to change without notice. Non-metric
weights and measurements are approximate. All data were deemed correct
at time of creation. Samsung is not liable for errors or omissions. All brand,
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KOREA
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